Deformed suction nozzle for die bonding and die bonding method using deformed suction nozzle

Abstract

A deformable nozzle for die bonding includes a body, a washer, and a die bonding device. The neck of the body connects to the top and bottom of the body. A cavity is formed between the bottom surface of the top of the body, the outer side of the neck, and the top surface of the bottom of the body. A first channel is formed in the top, neck, and bottom of the body. A through hole is formed in the top of the body, communicating with the cavity. The washer is disposed outside the cavity, with its top abutting against the bottom surface of the top of the body and its bottom abutting against the top surface of the bottom of the body. The die bonding device is disposed on the bottom surface of the bottom of the body and has a through hole, with the first channel communicating with the through hole. This invention allows the negative pressure provided by the through hole to control the simultaneous upward bending of the outer side of the bottom of the body, the outer side of the die bonding device, and the outer side of the die, ensuring centered contact between the die and the die placement area.

Claims

1. A deformable nozzle for die bonding, comprising: A body comprising a top, a neck, and a bottom, the neck being connected to the top and bottom of the body, the bottom surface of the top, the outer side of the neck, and the top surface of the bottom forming a cavity, the top, neck, and bottom of the body sharing a first channel, and the top of the body having a through hole communicating with the cavity; a gasket disposed on the outside of the cavity, the top of which abuts against the bottom surface of the top of the body, and the bottom of which abuts against the top surface of the bottom of the body; and a die bonding device disposed on the bottom surface of the bottom of the body, having a through hole, the first channel communicating with the through hole.

2. The modified suction nozzle as described in claim 1, wherein, The top, neck, and bottom of the body are connected to a second channel, and the bottom of the body is connected to a plurality of through holes. The through holes communicate with the first channel and the second channel. The first channel, the second channel, and the through holes provide a negative pressure. The bottom of the body is used to adsorb the crystal bonding device by the negative pressure of the second channel and the through holes.

3. The modified suction nozzle as described in claim 2, wherein, The first channel and the through hole together provide a negative pressure, and the crystal bonding device adsorbs a crystal by means of the negative pressure of the first channel and the through hole.

4. The modified suction nozzle as described in claim 3, wherein, The perforation provides a negative pressure, and the chamber is vacuumed by the negative pressure of the perforation in conjunction with the gasket, causing the outer side of the bottom of the body, the outer side of the die bonding device and the outer side of the grain to bend upwards simultaneously, and the gasket is compressed by the top and bottom of the body.

5. The modified suction nozzle as described in claim 4, wherein, The deformable nozzle for die bonding moves downward until the center of the die contacts the center of a die placement area on a substrate. After contacting the center of the die placement area, the center of the die forms a bonding wave. The negative pressure of the first channel, the second channel, the through holes, the vias, and the perforations gradually decreases synchronously. At the same time, the bonding wave gradually expands from the center of the die to the periphery of the die, causing the bottom of the body, the gasket, the die bonding device, and the die to gradually regain their shape, and the die gradually becomes fixed on the die placement area. The die is completely fixed on the die placement area, and the first channel, the second channel, the through holes, the vias, and the perforations stop providing negative pressure. The deformable nozzle for die bonding moves upward and away from the die and the substrate.

6. The modified suction nozzle as described in claim 4, wherein, The deformable suction nozzle for die bonding moves downward until the center of the die contacts the center of a die placement area on a substrate. After contacting the center of the die placement area, the center of the die forms a bonding wave. The negative pressure of the first channel and the through-hole gradually decreases, while the negative pressure of the second channel, the through-hole, and the perforation remains unchanged. Simultaneously, the bonding wave gradually expands from the center of the die towards the periphery, causing the die to gradually regain its shape and become fixed to the die placement area. The outer side of the bottom of the body and the outer side of the die bonding device remain bent upward, and the gasket is continuously bent by the top and bottom of the body. Compression; wherein the grain is completely fixed on the grain placement area, and the first channel and the through hole stop providing negative pressure, while the second channel, the through holes and the perforation continue to provide negative pressure, such that the outer side of the bottom of the body and the outer side of the die bonding device remain bent upwards, and the gasket is continuously compressed by the top and bottom of the body; wherein the deformable suction nozzle for die bonding moves upwards and away from the grain and the substrate, and the second channel, the through holes and the perforation continue to provide negative pressure, such that the outer side of the bottom of the body and the outer side of the die bonding device remain bent upwards, and the gasket is continuously compressed by the top and bottom of the body.

7. The modified suction nozzle as described in claim 4, wherein, The deformable suction nozzle for die bonding moves downward until the center of the die contacts the center of a die placement area on a substrate. Upon contact with the center of the die placement area, the center of the die forms a bonding wave. Simultaneously, the negative pressure of the first channel, the second channel, the through-holes, and the via gradually decreases, while the negative pressure of the through-hole remains constant. The bonding wave gradually expands from the center of the die towards the periphery, causing the die bonding device and the die to gradually regain their shape, and the die gradually becomes fixed to the die placement area. The outer side of the bottom of the body remains bent upwards, and the gasket... The die is continuously compressed by the top and bottom of the body; wherein the die is completely fixed on the die placement area, and the first channel, the second channel, the through hole and the through hole stop providing negative pressure, and the perforation continues to provide negative pressure, so that the outer side of the bottom of the body remains bent upward, and the gasket is continuously compressed by the top and bottom of the body; wherein the deformable suction nozzle for die bonding moves upward and away from the die and the substrate, and the perforation continues to provide negative pressure, so that the outer side of the bottom of the body remains bent upward, and the gasket is continuously compressed by the top and bottom of the body.

8. A die bonding method using a deformable suction nozzle, comprising the following steps: a second channel at a top, a neck, and a bottom of a body of a deformable suction nozzle for die bonding, and a plurality of through holes at the bottom of the body, jointly provide a negative pressure, such that the bottom of the body adsorbs a die bonding device of the deformable suction nozzle for die bonding by the negative pressure of the second channel and the through holes; a first channel at the top, the neck, and the bottom of the body, and a through hole of the die bonding device, jointly provide a negative pressure, and the die bonding device adsorbs a grain by the negative pressure of the first channel and the through hole; A perforation at the top of the body provides a negative pressure. A chamber between the bottom surface of the top of the body, the outer side of the neck of the body, and the top surface of the bottom of the body is vacuumed by the negative pressure of the perforation in conjunction with a gasket of the die-bonding nozzle disposed outside the chamber. This causes the outer side of the bottom of the body, the outer side of the die-bonding device, and the outer side of the die to bend upwards simultaneously. The gasket of the die-bonding nozzle is compressed by the top and bottom of the body. The die-bonding nozzle moves downwards until the center of the die contacts the center of a die placement area on a substrate. After the center of the die contacts the center of the die placement area, a bonding wave is formed. The negative pressure of the first channel, the second channel, the through holes, the through holes, and the perforation gradually decreases synchronously, while the bonding wave gradually expands from the center of the grain to the periphery of the grain, causing the bottom of the body, the gasket, the die bonding device, and the grain to gradually regain their shape, and the grain to gradually fix itself on the grain placement area; the grain is completely fixed on the grain placement area, and the first channel, the second channel, the through holes, the through holes, and the perforation stop providing negative pressure; and the deformable suction nozzle for die bonding moves upward and away from the grain and the substrate.

9. A die bonding method using a deformable suction nozzle, comprising the following steps: a second channel at a top, a neck, and a bottom of a body of a deformable suction nozzle for die bonding, and a plurality of through holes at the bottom of the body, jointly provide a negative pressure, such that the bottom of the body adsorbs a die bonding device of the deformable suction nozzle for die bonding by the negative pressure of the second channel and the through holes; a first channel at the top, the neck, and the bottom of the body, and a through hole of the die bonding device, jointly provide a negative pressure, and the die bonding device adsorbs a grain by the negative pressure of the first channel and the through hole; A perforation at the top of the body provides a negative pressure. A chamber between the bottom surface of the top of the body, the outer side of the neck of the body, and the top surface of the bottom of the body is vacuumed by the negative pressure of the perforation in conjunction with a gasket of the die-bonding nozzle disposed outside the chamber. This causes the outer side of the bottom of the body, the outer side of the die-bonding device, and the outer side of the die to bend upwards simultaneously. The gasket of the die-bonding nozzle is compressed by the top and bottom of the body. The die-bonding nozzle moves downwards until the center of the die contacts the center of a die placement area on a substrate. After the center of the die contacts the center of the die placement area, a bonding wave is formed. The negative pressure of the first channel and the through hole gradually decreases, while the negative pressure of the second channel, the through hole and the perforation remains unchanged. At the same time, the bonding wave gradually expands from the center of the grain to the periphery of the grain, causing the grain to gradually recover its shape and gradually fix itself on the grain placement area. The outer side of the bottom of the body and the outer side of the die bonding device remain bent upward, and the gasket is continuously compressed by the top and bottom of the body. The die is completely fixed on the die placement area, and the first channel and the through hole stop providing negative pressure, while the second channel, the through holes, and the perforation continue to provide negative pressure, causing the outer side of the bottom of the body and the outer side of the die bonding device to remain bent upwards, and the gasket to be continuously compressed by the top and bottom of the body; and the deformable suction nozzle for die bonding moves upwards and away from the die and the substrate, while the second channel, the through holes, and the perforation continue to provide negative pressure, causing the outer side of the bottom of the body and the outer side of the die bonding device to remain bent upwards, and the gasket to be continuously compressed by the top and bottom of the body.

10. A die bonding method using a deformable nozzle, comprising the following steps: a second channel at a top, a neck, and a bottom of a body of a deformable nozzle for die bonding, and a plurality of through holes at the bottom of the body, jointly provide a negative pressure, such that the bottom of the body adsorbs a die bonding device of the deformable nozzle for die bonding by the negative pressure of the second channel and the through holes; a first channel at the top, the neck, and the bottom of the body, and a through hole of the die bonding device, jointly provide a negative pressure, and the die bonding device adsorbs a grain by the negative pressure of the first channel and the through hole; A perforation at the top of the body provides a negative pressure. A chamber between the bottom surface of the top of the body, the outer side of the neck of the body, and the top surface of the bottom of the body is vacuumed by the negative pressure of the perforation in conjunction with a gasket of the die-bonding nozzle disposed outside the chamber. This causes the outer side of the bottom of the body, the outer side of the die-bonding device, and the outer side of the die to bend upwards simultaneously. The gasket of the die-bonding nozzle is compressed by the top and bottom of the body. The die-bonding nozzle moves downwards until the center of the die contacts the center of a die placement area on a substrate. After the center of the die contacts the center of the die placement area, a bonding wave is formed. The negative pressure of the first channel, the second channel, the through holes, and the through holes gradually decreases synchronously, while the negative pressure of the perforation remains unchanged. Simultaneously, the bonding wave gradually expands from the center of the grain towards the periphery, causing the die bonding device and the grain to gradually regain their shape. The grain gradually becomes fixed to the grain placement area, and the outer side of the bottom of the body remains bent upwards. The gasket is continuously compressed by the top and bottom of the body. The grain is completely fixed to the grain placement area, and the first channel, the second channel, the through holes, and the through holes stop providing negative pressure, while the perforation continues to provide negative pressure, causing the outer side of the bottom of the body to remain bent upwards. The gasket is continuously compressed by the top and bottom of the body. The deformable suction nozzle for die bonding moves upwards and away from the grain and the substrate, and the perforation continues to provide negative pressure, causing the outer side of the bottom of the body to remain bent upwards. The gasket is continuously compressed by the top and bottom of the body.

Images