Substrate processing device and substrate processing method

Abstract

This invention provides a substrate processing apparatus and a substrate processing method, which increases the throughput of the substrate processing apparatus and reduces the area of ​​dedicated floor space. The invention comprises an apparatus having the following elements: a carrier block having a plurality of carrier placement sections including a carrier placement section for loading and unloading substrates; a processing block disposed to the left or right of the carrier block; a first carrier placement section and a second carrier placement section, each being a carrier placement section and arranged side-by-side in a front-back direction when viewed from above, at least one being a carrier placement section for loading and unloading substrates; a plurality of substrate placement sections arranged longitudinally to the left or right of a substrate transport area formed between the first and second carrier placement sections when viewed from above; a first substrate transport mechanism disposed in the transport area; and a second substrate transport mechanism transporting substrates between the first substrate placement section and the second substrate placement section included in the plurality of substrate placement sections and used for transporting substrates to the processing block.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Prior Technology

[0002] In the manufacturing process of semiconductor devices, liquid processing, heat processing, and other processes are performed by transporting semiconductor wafers (hereinafter referred to as wafers) between various processing modules within a substrate processing apparatus. Wafers are transported to the substrate processing apparatus via carriers. Patent Document 1 discloses a substrate processing apparatus comprising a carrier block for transferring wafers to the carrier. Within this carrier block, two transport mechanisms are provided in a manner that encloses a stack composed of multiple substrate mounting sections; each transport mechanism includes a holding portion for transferring wafers between mounting sections and a holding portion for transferring wafers to the carrier. [Known Technical Documents] [Patent Literature]

[0003] Patent Document 1: Japanese Patent Application Publication No. 2013-69916 Summary of the Invention

[0004] [Problem to be solved by the present invention] The present invention provides a technique that can increase the processing capacity of a substrate processing device and reduce the area of ​​a dedicated floor. [Technical means to solve the problem]

[0005] The substrate processing apparatus of the present invention comprises: The carrier block has a plurality of carrier placement sections, which include carrier placement sections for placing the carrier for moving the substrate in and out of the carrier for storing the substrate; A processing block is disposed on one side of the carrier block for processing the substrate; The first carrier placement section and the second carrier placement section are each carrier placement sections, and are arranged side by side along the front-to-back direction when viewed from above, with at least one of them being a carrier placement section for moving the substrate in and out; A plurality of substrate mounting portions are arranged longitudinally on one side relative to the transport area of ​​the substrate formed between the first carrier mounting portion and the second carrier mounting portion in a top view, and each substrate is mounted thereon. A first substrate transport mechanism, disposed in the transport area and rotating about a longitudinal axis, is used to transport the substrate between the carrier of the first carrier placement portion and the first substrate placement portions included in the plurality of substrate placement portions; and The second substrate transport mechanism moves up and down to transfer the substrate between the first substrate placement section and the second substrate placement section, which is included in the plurality of substrate placement sections and places the substrate for transferring the substrate to the processing block. [Effects of the Invention]

[0006] This invention can increase the throughput of the substrate processing device and reduce the area of ​​the dedicated floor. Simple Explanation of the Diagram

[0007] Figure 1 is a cross-sectional top view of a coating and developing apparatus according to an embodiment of the substrate processing apparatus of the present invention. Figure 2 is a longitudinal front view of the coating and developing apparatus. Figure 3 is a schematic perspective view of the carrier area set in the coating and developing apparatus. Figure 4 is a side view of the vehicle block. Figure 5 is an explanatory diagram showing the transfer of vehicles within the vehicle block. Figure 6 is an explanatory diagram showing the transfer of vehicles within the vehicle block. Figure 7 is an explanatory diagram showing the transfer of vehicles within the vehicle block. Figure 8 is a top view of the vehicle block. Figure 9 is an explanatory diagram showing the operation of the transport mechanism set up in the vehicle block. Figure 10 is a longitudinal sectional side view of the processing area set up in the coating and developing apparatus. Figure 11 is a schematic front view of the vehicle block and the processing block. Figure 12 is a top view of the transport shuttle set up in this processing block. Figure 13 is an explanatory diagram showing the wafer transport path in the coating and developing apparatus. Figure 14 is an explanatory diagram showing the wafer transport path in the coating and developing apparatus. Figure 15 is a top view showing a modified example of the vehicle block. Figure 16 is a side view of this modified example. Figure 17 is a top view showing another variant of the vehicle block. Figure 18 is a schematic front view of another configuration example of a display substrate processing apparatus. Implementation

[0008] A coating and developing apparatus 1, an embodiment of the substrate processing apparatus of the present invention, will be described with reference to the cross-sectional top view of FIG1 and the longitudinal front view of FIG2. The coating and developing apparatus 1 comprises a carrier block D1, a first stack processing block D2, a second stack processing block D3, and an interface block D4 arranged side-by-side in a straight line in the transverse direction in the aforementioned order. Furthermore, adjacent blocks (carrier block, first and second stack processing blocks, and interface block) D1 to D4 are interconnected. Each of these blocks D1 to D4 has a housing that separates them from each other; within each housing, a transport area for a circular substrate wafer W is formed.

[0009] The left-right direction is defined by the arrangement of blocks D1 to D4. For ease of explanation, the side of carrier block D1 is designated as the left, and the side of interface block D4 as the right. Furthermore, regarding the front-back direction of the device, the side closer to carrier block D1 when viewed from the left is considered the front, and the side farther away is considered the rear. Exposure machine 20 is connected to interface block D4 from the right. Additionally, the left-right direction of the arrangement of blocks D1 to D4 is shown as the X direction in each figure; the front-back direction is shown as the Y direction in each figure. The X and Y directions are mutually orthogonal straight lines.

[0010] Before describing the sections D1 to D4 in detail, the general configuration of the coating and developing apparatus 1 is described. For example, a wafer W is transported to the coating and developing apparatus 1 while stored in a carrier C called a FOUP (Front Opening Unify Pod). The first stack processing section D2 and the second stack processing section D3 are each divided into two parts in the longitudinal direction; each of the divisions becomes a processing section having a processing module (first processing module) and a main transport mechanism for transferring to the processing module. As described above, the lower side of the first stack processing section D2, which is divided into two sections, is processing section 2A, and the upper side is processing section 2B; the lower side of the second stack processing section D3, which is divided into two sections, is processing section 2C, and the upper side is processing section 2D.

[0011] Processing blocks 2A and 2C are adjacent to each other, and are sometimes referred to together as the lower processing blocks. Similarly, processing blocks 2B and 2D are adjacent to each other, and are sometimes referred to together as the upper processing blocks, as shown in Figure 1. These upper processing blocks, i.e., processing blocks 2B and 2D, are each equipped with a different transport mechanism (bypass transport mechanism). This different transport mechanism will be referred to as a transport shuttle in the following description. This transport shuttle transports the wafer W to the downstream block of the transport path without passing through the processing module.

[0012] The lower processing block forms the outgoing path for transporting wafer W from carrier block D1 to interface block D4; in this outgoing path, a coating film such as a photoresist film is formed on wafer W. The upper processing block forms the return path for transporting wafer W, which has been exposed by exposure machine 20, from interface block D4 to carrier block D1. In this return path, wafer W is transported to a processing module by the main transport mechanism of one of the processing blocks 2B and 2D for processing, while in the other processing block it is transported by a transport shuttle. That is, as a return path, there are two transport paths, and wafer W is transported along either of these two paths. Furthermore, a module is a place where wafer W is placed, other than the transport mechanism (including the transport shuttle). The module that performs processing on wafer W is, as described above, a processing module, and this processing also includes image acquisition for inspection.

[0013] The following description, with reference to the schematic perspective view in FIG3 and the side view in FIG4, describes carrier block D1. In a cleanroom housing the coating and developing apparatus 1, a transport mechanism for carrier C, for example called an Overhead Hoist Transport (OHT) system, is installed. This transport mechanism (hereinafter referred to as the external transport mechanism) is used to move carrier C in and out of carrier block D1. Carrier block D1 performs the movement of wafer W from carrier C, which is transported by the external transport mechanism, between the lower processing block and the upper processing block.

[0014] The carrier C has a rectangular container body and a lid C1. The lid C1 can be arbitrarily attached to and detached from the container body, closing the opening for loading and unloading the wafer W formed on the side of the container body. Viewed from the opening direction of this opening, the left-right width L1 of the carrier C is greater than the front-back width L2. Furthermore, the front-back and left-back dimensions described in this description of the carrier C do not necessarily have to be consistent with the front-back and left-back dimensions described in the device description. Additionally, a handle C2 is provided on the upper part of the container body of the carrier C. To avoid complexity, the handle C2 and lid C1 are omitted from some of the drawings; in Figure 4, only a portion of the carrier C is shown with the lid C1. Since the lid C1 is provided as described above, the lid C1 indicates the opening direction of the opening of the carrier C.

[0015] Regarding vehicle block D1, in addition to "arranging the components constituting vehicle block D1 in a way that prevents vehicle block D1 from becoming too large", it is configured to prevent large-scale loading when multiple vehicles C with the aforementioned widths L1 and L2 are loaded. In vehicle block D1, three platforms 11 to 13 with different functions are provided as vehicle loading sections.

[0016] Platform 11, constituting the third carrier placement section, is a platform for the external handling mechanism to transfer carrier C, and will be referred to as external transfer platform 11 in the following description. Platform 12 is a platform for placing carrier C for loading (moving in) and unloading (moving out) wafer W on carrier block D1, and is a carrier placement section for substrate loading and unloading. As will be described later, platform 12 moves for loading and unloading, and will be referred to as moving platform 12 in the following description. Platform 13 is a standby carrier placement section used to temporarily retract and place carrier C when it is impossible to move carrier C to platforms 11 and 12, which are the objects to be transferred, and will be referred to as retraction platform 13 in the following description. Carrier block D1 has a quadrangular housing 14, and platforms 11 to 13 are symmetrically arranged with respect to the center in the front-rear direction on the left side of housing 14.

[0017] The configuration of platforms 11-13 is described in detail below: A loading / unloading rack 15 is provided on the upper part of the vertical side of the left side of the housing 14; this loading / unloading rack 15 extends from the front end to the rear end of this side. Furthermore, four external transfer platforms 11 are arranged side-by-side along the front-rear direction on the loading / unloading rack 15. Each external transfer platform 11 is configured to accommodate the orientation of the external handling mechanism's transport vehicle C, such that the opening of the vehicle C faces to the right (i.e., the cover C1 is located on the right side), thus placing the vehicle C. For example, the two rear external transfer platforms 11 are used as platforms for loading the vehicle C into the vehicle block D1, and the two front external transfer platforms 11 are used as platforms for unloading the vehicle C from the vehicle block D1.

[0018] Furthermore, on the left side wall of the housing 14, below the loading / unloading rack 15, the central portion in the front-to-back direction is formed to protrude to the left, creating a quadrangular, longitudinally long protruding wall portion 16. The area enclosed by this protruding wall portion 16 constitutes the transport area 17. Two loading / unloading openings 21 for the wafer W are respectively provided on the front and rear sides of the protruding wall portion 16; the two openings 21 formed on the same side are separated from each other in the vertical direction. Thus, when viewed from the left and right direction, a total of four openings 21 are arranged in a 2×2 matrix. The left and right positions of each opening 21 are the same; each opening 21 is closed from the inside of the housing 14 by a door panel 22.

[0019] By protruding the lower portions of the openings 21 on the rear side of the protruding wall 16 rearward and the lower portions of the openings 21 on the front side of the protruding wall 16 forward, a support portion 23 is formed. Therefore, this support portion 23 is positioned in a 2×2 matrix when viewed from the left-right direction, corresponding to the openings 21 and the door panels 22 respectively. A moving platform 12 is mounted on the support portion 23; the carrier C is placed on each moving platform 12 with its opening facing the openings 21 of the protruding wall 16 in a second orientation. The moving platform 12 positioned relative to the protruding wall 16 in the front-rear direction constitutes the first carrier placement portion, and the moving platform 12 positioned relative to the other in the front-rear direction constitutes the second carrier placement portion. The left-right position of each moving platform 12 is aligned with the left-right position of the aforementioned external transfer platform 11. For example, a moving mechanism is provided in the support section 23 to move the moving platform 12 and the door panel 22 corresponding to the support section 23.

[0020] Each of the aforementioned mobile platforms 12 can move in the front-to-back direction between a loading position closer to the opening 21 and an unloading position farther from the opening 21. The loading position is where wafer W is moved in and out of the carrier C, and the unloading position is where the carrier C is transferred between the carrier C and the carrier transfer mechanism 26 described later. The aforementioned door 22 can hold / unhold the cover C1 of the carrier C at the loading position, and can move to the height of the support 23 below the opening 21 while holding the cover C1. Therefore, the door 22 is used for loading and unloading the cover C1 of the carrier C and for opening and closing the door 22.

[0021] Three layers of shelves 24 are provided on the front and rear sides of the protruding wall portion 16. The front shelf 24 is positioned further forward than the front support portion 23, and the rear shelf 24 is positioned further rear than the rear support portion 23. A retreat platform 13 is mounted on each shelf 24. Thus, when viewed from the left and right, the retreat platforms 13 are positioned in a 2×3 matrix. The vehicle C is mounted on the retreat platforms 13 on the shelf 24 with its opening facing forward and backward; more specifically, it is mounted with its opening facing the protruding wall portion 16. Furthermore, the left and right positions of each retreat platform 13 on the shelf 24 are the same as those of the moving platform 12.

[0022] Furthermore, on the uppermost retreat platform 13, vehicles C are placed at the same height as vehicles C on the uppermost mobile platform 12, with the vehicles C on these platforms 12 and 13 arranged in a front-to-back arrangement. On the lowermost retreat platform 13, vehicles C are placed at the same height as vehicles C on the lowermost mobile platform 12, with the vehicles C on these platforms 12 and 13 arranged in a front-to-back arrangement. On the middle retreat platform 13, vehicles C are placed at the same height as the uppermost support section 23.

[0023] Furthermore, the bottom of the left side of the housing 14 extends to the left to form a base platform 25. A retreat platform 13 is also provided on this base platform 25; the retreat platform 13 of the base platform 25 is located further to the left than the retreat platform 13 of the canopy 24. Four retreat platforms 13 are arranged side-by-side in the front-rear direction on the base platform 25, so that the opening of the vehicle C faces left, thus accommodating the vehicle C.

[0024] Next, the vehicle transfer mechanism 26, which serves as a transport mechanism for a vehicle, will be described. The vehicle transfer mechanism 26 includes: a multi-joint robotic arm 27 capable of holding the handle C2 of the vehicle C; and a moving mechanism 28 capable of moving the multi-joint robotic arm 27 vertically and horizontally. Each wrist of the multi-joint robotic arm 27 can rotate about a vertical axis. Furthermore, the front end of the multi-joint robotic arm 27 is configured as an openable claw 29 to grip the handle C2 of the vehicle C, and this claw 29 can also rotate arbitrarily about a vertical axis.

[0025] Then, using the carrier transfer mechanism 26, the carrier C is transferred (handled) in the following order: external transfer platform 11 → mobile platform 12 for removing wafer W → mobile platform 12 for recovering wafer W → external transfer platform 11. When transferring the carrier C between platforms in this way, if the platform to be transferred is not an empty platform (other carriers C exist), the carrier C is placed on the retreat platform 13 until the platform to be transferred is empty.

[0026] On each platform 11-13, the vehicle C is placed in the aforementioned orientation. However, if the orientation of the vehicle C differs between the platform at the transfer starting point and the platform of the transfer object, the orientation of the vehicle C is changed during the transfer. As an example, Figures 5-7 show an example of transferring the vehicle C from the external transfer platform 11 to the rearward moving platform 12.

[0027] The claw 29 of the vehicle transfer mechanism 26 grips the handle C2 of the vehicle C on the external transfer platform 11, causing the vehicle C to leave the external transfer platform 11 (Fig. 5). Then, while the vehicle C is moving to the mobile platform 12, the claw 29 of the vehicle transfer mechanism 26 is rotated 90°, changing the orientation of the vehicle C so that its opening changes from a right-facing state to a rear-facing state (Fig. 6), and placing it on the mobile platform 12 (Fig. 7). When transferring the vehicle C between other platforms, if the placement direction of the vehicle C differs between the platform at the transfer starting point and the platform of the transfer target, similarly to the examples shown in Figs. 5 to 7, the orientation of the vehicle C is changed during the transfer along the transfer path.

[0028] Returning to the description of the vehicle block D1, two inspection modules 39 are provided below the loading / unloading rack 15 and above the area where the vehicle C is placed on the upper retraction platform 13 and the moving platform 12. They are positioned at the rear and front of the protrusion 16, respectively. Therefore, as shown in Figure 8, the configuration is such that, in top view, the rear inspection module 39 overlaps with the rear moving platform 12 and the retraction platform 13 on the rack 24, while the front inspection module 39 overlaps with the front moving platform 12 and the retraction platform 13 on the rack 24.

[0029] The inspection module 39 has a housing extending in, for example, a front-to-back direction. Within this housing, for example, a platform movable in the front-to-back direction and an imaging unit containing a camera are provided; the imaging unit continuously captures images of the wafer W, which is mounted on the platform and moving, to obtain overall image data of the surface of the wafer W. The control unit 10, described later, determines whether the wafer W has any abnormalities based on the image data transmitted from the imaging unit. In this example, the inspection module 39 captures images of the wafer W before it is processed by the coating and developing apparatus 1.

[0030] Next, the internal structure of the housing 14 will be described. Within the housing 14, a space 19 extends linearly forward and backward when viewed from above. That is, the space 19 is formed to extend along the Y direction; and the transport area 17 formed by the aforementioned protruding wall 16 is a space that protrudes from the center of the space 19 in the Y direction towards the X direction. A transport mechanism 31, serving as a first substrate transport mechanism, is provided in the transport area 17. The transport mechanism 31 includes: a base 32, which can be raised and lowered arbitrarily and rotates about a vertical axis, i.e., about a longitudinal axis; and a wafer W holding portion 33, which can move forward and backward relative to the base 32. With this configuration, the transport mechanism 31 can transfer the wafer W to the carrier C and inspection module 39 placed on the aforementioned moving platforms 12. That is, the transport mechanism 31 is shared by these moving platforms 12 and inspection module 39.

[0031] In Figure 9, one side of the Y direction is shown as the -Y side, and the other side as the +Y side. The operation of the control transport mechanism 31 is such that when transferring wafer W to the carrier C of the rear-side moving platform 12, the forward direction of the holding part 33 becomes the -Y direction (rear), and when transferring wafer W to the carrier C of the front-side moving platform 12, the forward direction of the holding part 33 becomes the +Y direction (front). That is, the orientation of the holding part 33 is changed to one orientation and another orientation opposite to one. Similarly, when transferring wafer W to the rear-side inspection module 39 and the front-side inspection module 39 respectively, the base 32 rotates, causing the orientation of the holding part 33 to change to one orientation and another orientation.

[0032] Next, space 19 will be described: the central portion to the rear end in the elongated direction, viewed from above, constitutes the transport area for wafer W, and a transport mechanism and modules are arranged there. Further details are provided: in the central portion of space 19 in the rear-rear direction, to the right of the transport mechanism 31 (i.e., on the left-right side), a module stack T1 is provided. The module stack T1 is formed by overlapping the transfer module TRS for temporarily placing (temporarily mounting) wafer W, the temperature adjustment module SCPL for adjusting the temperature of the temporarily placed wafer W, etc., in the vertical direction, i.e., longitudinally. Other module stacks described later also have the same configuration.

[0033] The aforementioned transport mechanism 31 transfers wafers W to the modules constituting the module stack T1. At this time, the orientation of the base station 32 is controlled so that the forward direction of the holding portion 33 faces the module stack T1 (i.e., facing the Y direction). Furthermore, a transport mechanism 34 is provided on the rear side of the module stack T1. As a second substrate transport mechanism, the transport mechanism 34 has the same configuration as the transport mechanism 31, except for the shape of the holding portion 33.

[0034] Furthermore, behind the transport mechanism 34, at the rear end of the space 19, a plurality of hydrophobic treatment modules 35 are arranged, for example, stacked on top of each other. The hydrophobic treatment module 35, as the second processing module, is a module that supplies processing gas to the wafer W to perform hydrophobic treatment before the formation of the coating film, and the wafer W is transferred by the transport mechanism 34. The hydrophobic treatment module 35 includes a hot plate that holds and heats the wafer W, and a cover that can be raised and lowered arbitrarily covering the hot plate. Hydrophobic treatment of the wafer W is performed by supplying processing gas to the enclosed space on the hot plate formed by the cover.

[0035] Furthermore, regarding the aforementioned temperature adjustment module SCPL, the temperature of the mounted wafer W can be adjusted, and the wafer W is transferred via the lifting and lowering action of the transport mechanism. Regarding the transfer module TRS, for example, it has a plurality of horizontally arranged pins, and the wafer W is transferred to these pins via the lifting and lowering action of the transport mechanism. The transfer module TRS and the temperature adjustment module SCPL, which are part of the substrate mounting section, are also configured to form a module stack in blocks other than the carrier block D1; among the modules constituting each module stack, there is one that has the function of transferring the wafer W between blocks.

[0036] Additionally, the transfer module TRS used by the transfer shuttle to transfer wafer W between the transfer shuttle and the transfer shuttle has a different configuration than described above and can be raised and lowered; details will be described along with the transfer shuttle. Furthermore, in the following description, to distinguish the temperature adjustment module SCPL and the transfer module TRS from each other, numbers will be assigned after SCPL and TRS. The modules of the module stack T1 constituting the carrier block D1 are shown from bottom to top as TRS1, TRS2, SCPL1, TRS3, and SCPL2. Also, in this specification, the module stack refers to modules stacked on top of each other when viewed from above; the modules can be separated from each other or in contact.

[0037] To form the outgoing path, the temperature adjustment module SCPL1 is positioned at the height of the lower processing block, and to form the return path, the transfer modules TRS1 and TRS2 are positioned at the height of the upper processing block, respectively. The transfer modules TRS1 and TRS2 are used for transferring the wafer W between the transport mechanisms 31 and 34. The transport mechanism 31 is made accessible to the transfer modules TRS1 and TRS2, and the transport mechanism 34 is made accessible to the transfer modules TRS1~TRS3, the temperature adjustment module SCPL1, and the TRS12B used for the transport shuttle, so that the wafer W can be transported along the transport path described later in Figures 13 and 14.

[0038] In the space 19, on the front side relative to the module stack T1, a region extending to the height of the lower processing block is configured as a chemical liquid storage area 36. In this chemical liquid storage area 36, ​​for example, multiple bottles are arranged in a longitudinal and transverse arrangement. Therefore, the bottles, serving as storage units for the chemical liquid, are positioned on the side opposite to the side where the conveying mechanism 34 is located in the front-rear direction relative to the module stack T1. Furthermore, each bottle stores the processing liquid used in the processing block 2A described later. Details regarding this processing liquid are described in the description of the processing block 2A.

[0039] Next, the first stacked processing block D2 (processing blocks 2A and 2B) will also be described with reference to Figure 10, a longitudinal sectional side view. The front side of the first stacked processing block D2 is divided into eight layers longitudinally; each layer, from bottom to top, is E1 to E8. Layers E1 to E4 on the lower side are included in processing block 2A, and layers E5 to E8 on the upper side are included in processing block 2B. Each layer is an area where liquid processing modules can be installed.

[0040] First, the upper processing block 2B will be described. In this example, at layers E6 to E8, as liquid processing modules, developing modules 41 that supply developing solution to wafer W are respectively provided. In addition, behind layers E5 to E8, a transport area 42 for wafer W is provided. This transport area 42 extends from the left end to the right end of processing block 2B in a straight line when viewed from above, and is provided from the height of layer E5 to the height of layer E8. Behind the transport area 42, processing modules are provided, for example, in a vertical stack of 7 layers as processing module stacks 43; two processing module stacks 43 are provided at intervals on the left and right sides. These two processing module stacks 43 include a heating module 44 for performing PEB (Post Exposure Bake) and an inspection module 45. This inspection module 45 is the same as the inspection module 39 of carrier block D1, except that "the object of image acquisition is the wafer W after processing by the device".

[0041] A main transport mechanism 3B is provided in the transport area 42. The main transport mechanism 3B has the same configuration as the transport mechanism 31, except that it is connected to the moving mechanism 46 so that the base 32 can also move in the left and right directions. Furthermore, the holding parts 33 of each transport mechanism other than the transport shuttle in the coating and developing apparatus 1, including this main transport mechanism 3B, are provided in pairs, and can move independently on the base 32. In addition, the aforementioned moving mechanism 46 is provided below the processing module stack 43.

[0042] The main transport mechanism 3B transfers wafers W to each processing module within processing block 2B, and to modules at the same height as processing block 2B in the module stack (T1 and T2) located in blocks adjacent to processing block 2B. Additionally, the main transport mechanism 3B can also transfer wafers W to the transport module TRS installed in the transport shuttle of processing block 2B.

[0043] Furthermore, a flat space 5B is provided below the processing module stack 43; this space 5B extends from the left end to the right end of the processing block 2B. The transport shuttle 4B and the transfer modules TRS12B and TRS12D for the transport shuttle are disposed in this space 5B. The configuration of these transport shuttles and the transfer modules TRS for the transport shuttle will be described in detail later.

[0044] Furthermore, for each processing block other than processing block 2B described later, except for the differences explained later, they have a substantially the same configuration as processing block 2B. Each processing block has a main transport mechanism equivalent to the main transport mechanism 3B, but the symbol for the main transport mechanism is replaced by the same English letter as that assigned to the processing block. Specifically, if it is processing block "2A", its main transport mechanism is displayed as "3A". In addition, other main transport mechanisms equivalent to the main transport mechanism 3B can also be configured to transport wafers W to "the transfer module TRS for the processing module and transport shuttle within the processing block where the main transport mechanism is installed, and the module stack of blocks within the processing block or adjacent to the processing block in the left and right directions".

[0045] Furthermore, regarding the symbol for the space where the transport shuttle can be installed, corresponding to space 5B mentioned above, the same letter as the letter assigned to the processing block can be used instead of "B". Further, when a transport shuttle is installed in a processing block, the symbol for that transport shuttle is also given the same letter as the letter assigned to the processing block. Additionally, regarding the transfer module TRS used for the transport shuttle, the same letter as the processing block where the transport shuttle is installed is used, and the transfer module TRS that becomes the starting point of transport is given "11" before the letter, while the transfer module TRS that becomes the object of transport is given "12". Furthermore, regarding the transport path of the wafer W of the transport shuttle, the same letter as the letter assigned to the transport shuttle is used after the number 40. If we take a specific example based on the above symbol rules, the transport shuttle set in the processing block 2D described later will be displayed as 4D, the transport starting point and the transport object transfer module TRS of the transport shuttle 4D will be displayed as TRS11D and TRS12D respectively, and the transport path of the wafer W of the transport shuttle 4D will be displayed as 40D.

[0046] Returning to the explanation of the structure of the processing blocks, let's focus on processing block 2A, which is located below processing block 2B. As a difference from processing block 2B, anti-reflection film forming modules 47 are provided as liquid processing modules in each layer E2-E4. The anti-reflection film forming module 47 supplies and coats the chemical liquid for forming the anti-reflection film onto the wafer W surface through nozzles, forming a coating film, i.e., the anti-reflection film. A heating module 48 is provided in the processing module stack 43 of processing block 2A. This heating module 48 functions differently from the heating module 44 in processing block 2B; it is used to remove solvent from the coating film. Furthermore, in processing block 2A, the transport area 42 covers the height of layers E1-E4. Also, processing block 2A does not have a transport shuttle or a transfer module TRS for the transport shuttle.

[0047] Referring to Figure 11, the anti-reflective film forming module 47 will be further explained. A bottle located in the chemical liquid storage area 36 of the aforementioned carrier block D1 stores the chemical liquid (treatment liquid) used for forming the anti-reflective film. This bottle is connected to the nozzles of each anti-reflective film forming module 47 via a pipe 52. A filter 53 for purifying the chemical liquid directed towards the nozzle is clamped in the pipe 52; this filter 53 is located in layer E1 of the treatment block 2B. Thus, a bottle serving as the supply source of the chemical liquid is positioned in front of the carrier block D1 adjacent to the treatment block 2A, positioning the anti-reflective film forming module 47 in front of the transport area 42, and positioning the chemical liquid storage area 36 in front of the space 19 of the carrier block D1. Therefore, the length of the pipe 52 can be shortened, and the risk of contamination of the anti-reflective film caused by particles generated by the pipe 52 can be more reliably suppressed, which is highly advantageous.

[0048] Next, returning to Figures 1 and 2, we will describe the second stacked processing block D3 (processing blocks 2C and 2D) on the right side of the device, which serves as the processing area for each processing block. The second stacked processing block D3 has a similar configuration to the first stacked processing block D2, and we will focus on the differences between them. First, we will describe the upper processing block 2D (another processing block): the positional relationship between the transport area 42, the processing module stack 43, the main transport mechanism, and the space for the stacked module's transport shuttle is the same as that of processing block 2B (one processing block). The processing module mounted in processing block 2D is the same as that in processing block 2B. The space 5D for the transport shuttle in processing block 2D is at the same height as space 5B and is connected to space 5B. In this space 5D, the transport shuttle 4D and the transport shuttle's transfer modules TRS11B and TRS11D are installed.

[0049] Regarding the lower processing block 2C, a photoresist film forming module 49 is provided in layers E2 to E4. This photoresist film forming module 49 has the same configuration as the developing module 41, except that "a photoresist is used instead of the developer as the processing solution supplied to the wafer W". In addition, the processing module stack 43, like the processing block 2A, includes a heating module 48.

[0050] Additionally, a module stack T2 is provided at the left end of the transport area 42 of the second stacked processing block D3; the module stack T2 is located at a position where, when viewed from above, a portion of it reaches the right end of the transport area 42 of the first stacked processing block D2. The module stack T2 includes a temperature adjustment module SCPL4 located at the height of the lower processing block and a temperature adjustment module SCPL3 located at the height of the upper processing block.

[0051] Next, the interface block D4 will be described. Interface block D4 has a module stack T3 at its central portion in the front-to-back direction. This module stack T3 consists of stacked transfer modules TRS5-TRS7 and a temperature adjustment module ICPL. The temperature adjustment module ICPL is used to transport the wafer W immediately before exposure and is located on the lower side of the module stack T3. It adjusts the temperature of the mounted wafer W in the same way as the temperature adjustment module ICPL. To transport the wafer W in the transport path described later, transfer modules TRS5 and TRS6 are positioned at the height of the lower processing block, and transfer module TRS7 is positioned at the height of the upper processing block. Transport mechanisms 61, 62, and 63 are provided in front of, behind, and to the right of the module stack T3, respectively; these transport mechanisms 61-63 have the same configuration as the transport mechanism 31 of the carrier block D1.

[0052] In front of the transport mechanism 61, a plurality of back-side cleaning modules 65 are stacked to supply cleaning solution to the back side of the wafer W for cleaning. Behind the transport mechanism 62, a plurality of post-exposure cleaning modules 66 are stacked to supply cleaning solution to the surface of the exposed wafer W. The transport mechanisms 61 and 62 can transport the wafer W between the modules constituting the module stack T3; the transport mechanism 61 can transfer the wafer W to the back-side cleaning module 65, and the transport mechanism 62 can transfer the wafer W to the post-exposure cleaning module 66, respectively. The transport mechanism 63 transports the wafer W between the temperature adjustment module ICPL, the transfer module TRS6, and the exposure machine 20.

[0053] Next, the transfer shuttles 4B and 4D and the transfer modules TRS used by each shuttle will be described. The transfer shuttle 4B transfers wafers W from processing block 2D to carrier block D1. As shown in Figure 1, the transfer module TRS12B, which is the transfer module for the object being transported in the transfer modules TRS11B and TRS12B used by the transfer shuttle 4B, is located at the left end of space 5B so that wafers W can be transferred between it and the transfer mechanism 34 of carrier block D1. The transfer module TRS11B, which is the starting point of the transport, is located at the left end of space 5D and is further to the right than the module stack T2 so that wafers W can be transferred between it and the main transfer mechanism 3D of processing block 2D.

[0054] The transport shuttle 4D transports wafer W from interface block D4 to processing block 2B. Regarding the transport modules TRS11D and TRS12D used by the transport shuttle 4D, the transport module TRS11D, which serves as the transport starting point, is located at the right end of space 5D, enabling the transfer of wafer W between itself and the transport mechanism 62 of interface block D4. Regarding the transport object transport module TRS12D, which enables the transfer of wafer W between itself and the main transport mechanism 3B of processing block 2B, it is located at the right end of space 5B, further to the left than module stack T2.

[0055] Referring also to Figure 12, the following description focuses on the transport shuttle 4B, the transfer module TRS11B, and the transfer module TRS12B. The transport shuttle 4B comprises a base 71, an intermediate moving body 72, and a support 73. The base 71 is configured as a long strip extending laterally and is housed within the space 5B of the processing block 2B. The intermediate moving body 72 is also a long strip extending laterally and is connected to the front side relative to the base 71. The support 73, connected to the front side relative to the intermediate moving body 72, is formed as a long, narrow cuboid. The wafer W is supported on the support 73 and transported horizontally and linearly to the left and right.

[0056] The intermediate moving body 72 can move freely to the left or right relative to the base 71 via the base 71. Corresponding to the movement of the intermediate moving body 72 relative to the base 71, the support body 73 can move to the left or right relative to the intermediate moving body 72. In more detail, the support body 73 moves to the left as the intermediate moving body 72 moves to the left (towards the vehicle block D1), and the support body 73 moves to the right as the intermediate moving body 72 moves to the right (towards the interface block D4).

[0057] The support body 73, when transferring wafer W to the transfer module TRS11B (right-side transport position), is positioned such that, for example, the right end of the support body 73 is further to the right than the right end of the intermediate moving body 72, and the right end of the intermediate moving body 72 is further to the right than the right end of the base 71 (refer to the upper side of Figure 12). Furthermore, the support body 73, when transferring wafer W to the transfer module TRS12B (left-side transport position), is positioned such that, for example, the left end of the support body 73 is further to the left than the left end of the intermediate moving body 72, and the left end of the intermediate moving body 72 is further to the left than the left end of the base 71 (refer to the lower side of Figure 12).

[0058] The transfer module TRS11B includes: a support plate 75, which is formed as a recess open on the left side when viewed from above; three pins 76 protruding upwards from the support plate 75; and a lifting mechanism (not shown) for raising and lowering the support plate 75. This lifting mechanism is connected to the lower side of the support plate 75 in a manner that does not interfere with the intermediate moving body 72 of the transport shuttle 4B, the support body 73, or the support plate 75. As shown in the upper part of Figure 12, the right end of the support body 73 in the right transport position is housed within the recess formed by the support plate 75 when viewed from above, and the wafer W can be transferred between the support body 73 and the transfer module TRS11B by raising and lowering the pins 76. Furthermore, the transfer module TRS12B has the same configuration as the transfer module TRS11B, except that the support plate 75 is formed as a recess open on the right side when viewed from above. As shown in the lower part of Figure 12, the left end of the support 73 in the left transport position is housed in the recess formed by the support plate 75 when viewed from above. The wafer W can be transferred between the support 73 and the transfer module TRS12B by the lifting and lowering of the pin 76.

[0059] The main transport mechanism 3D of processing block 2D transfers the wafer W processed in processing block 2D onto pin 76 in the rising position of transport module TRS11B. If pin 76 moves to the falling position, allowing the wafer W to be supported by support body 73 in the aforementioned right-side transport position, then the intermediate moving body 72 and support body 73 move to the left respectively, and pin 76 of transport module TRS11B returns to the rising position. If support body 73 moves to the aforementioned left-side transport position, pin 76 in the falling position of transport module TRS12B moves to the rising position to support wafer W. If support body 73 moves to the right-side transport position, pin 76 returns to the falling position. Later, the transport mechanism 34 of carrier block D1 receives the wafer W.

[0060] The transport shuttle 4D, transfer module TRS11D, and transfer module TRS12D have the same configuration as the transport shuttle 4B, transfer module TRS11B, and transfer module TRS12B, respectively. Therefore, simply put, the base 71 of the transport shuttle 4D is housed within the space 5D of the processing block 2D. Furthermore, the group of transport shuttles 4D, TRS11D, and TRS12D is positioned at a different height from the group of transport shuttles 4B, TRS11B, and TRS12B, for example, below this group. The transport path 40B of the wafer W of the transport shuttle 4B is positioned sequentially with the transport path 40D of the wafer W of the transport shuttle 4D. Furthermore, corresponding to the positions of the aforementioned transfer modules TRS11B, TRS12B, TRS11D, and TRS12D, transport path 40B protrudes towards processing block 2D, and transport path 40D protrudes towards processing block 2B. Due to this protrusion, the right side of transport path 40B and the left side of transport path 40D overlap when viewed from above.

[0061] Furthermore, the coating and developing apparatus 1 includes a control unit 10 (refer to Figure 1). The control unit 10 is a computer, comprising a program, memory, and a CPU (central processing unit). The program includes a series of steps to perform a series of actions of the coating and developing apparatus 1 described later. The control unit 10 then outputs control signals to each part of the coating and developing apparatus 1 via the program, controlling the operation of each part. Specifically, it controls the operations of transport mechanisms 31, 34, 61-63, main transport mechanisms 3A-3D, transport shuttles 4B and 4D, and each processing module. This enables the transport and processing of the wafer W described later. Furthermore, the control of the processing module's operation also includes the determination of wafer W anomalies based on the aforementioned image data. The aforementioned program is stored, for example, on a recording medium such as an optical disc, hard disk, or DVD, and installed in the control unit 10.

[0062] Next, an example of the processing and transport path of the wafer W in the coating and developing apparatus 1 will be described with reference to Figures 13 and 14, which respectively show the aforementioned outbound and return journeys. In Figures 13 and 14, the transport mechanism used for this transport is shown above or beside the arrows indicating a portion of the transport of the wafer W between modules. In this example, the lower two moving platforms 12 of the four moving platforms 12 are platforms (loading sections) for removing the wafer W, and the upper two moving platforms 12 are platforms (unloading sections) for recovering the wafer W.

[0063] First, wafer W is moved from carrier C on the lower mobile platform 12 by transport mechanism 31 and transported to inspection module 39 to obtain image data and determine if there are any abnormalities. Next, wafer W is transported in the following sequence: transport mechanism 31 → transfer module TRS1 → transport mechanism 34 → hydrophobic treatment module 35 → transport mechanism 34 → temperature adjustment module SCPL1. After hydrophobic treatment, it is introduced into processing block 2A by main transport mechanism 3A and transported in the following sequence: anti-reflection film forming module 47 → heating module 48 to form an anti-reflection film. Subsequently, wafer W is transported to temperature adjustment module SCPL4 of module stack T2 by main transport mechanism 3C of processing block 2C and transported in the following sequence: photoresist film forming module 49 → heating module 48 to form a photoresist film. Subsequently, the wafer W is transferred to the transfer module TRS5 of the module stack T3 in the interface block D4.

[0064] Then, the wafer W is transported sequentially through the back cleaning module 65 and the temperature adjustment module ICPL via the transport mechanism 61 on the front side of the block, and further transported to the exposure machine 20 via the transport mechanism 63, exposing the photoresist film on the surface of the wafer W along a predetermined pattern. The exposed wafer W is then transported in the following order: transport mechanism 63 → transfer module TRS6 → transport mechanism 62 on the rear side of the block → post-exposure cleaning module 66 → transport mechanism 62.

[0065] The subsequent transport path of wafer W is divided into a path where processing is performed in processing block 2D (making it the first transport path) and a path where processing is performed in processing block 2B (making it the second transport path). The first transport path is explained as follows: Transport mechanism 62 transports wafer W to the transfer module TRS7 of the module stack T3, and the main transport mechanism 3D guides wafer W into processing block 2D. Then, wafer W is transported in the following sequence: heating module 44 → temperature adjustment module SCPL3 → development module 41 → inspection module 45, so that image data can be obtained after the photoresist pattern is formed to determine if there are any abnormalities. Subsequently, as illustrated in Figure 12, the wafer W is transported in the order of main transport mechanism 3D → transfer module TRS11B → transport shuttle 4B → transfer module TRS12B. Then, the transport mechanism 34 of carrier block D1 receives the wafer W and transports it in the order of transfer module TRS2 → transport mechanism 31, storing it in carrier C.

[0066] Next, the second transport path will be described: Wafer W is transported in the following sequence: transport mechanism 62 → transfer module TRS11D → transport shuttle 4D → transfer module TRS12D → main transport mechanism 3B, and introduced into processing block 2B. Then, wafer W is transported by the main transport mechanism 3B in the following sequence: heating module 44 → temperature adjustment module SCPL2 → developing module 41 → inspection module 45. After being processed in the same way as wafer W in the first transport path, it is transported to the transfer module TRS3 in carrier block D1. Next, wafer W is transported in the following sequence: transport mechanism 34 → transfer module TRS2. In the following description, in the same way as wafer W in the first transport path, it is stored in carrier C by transport mechanism 31.

[0067] Furthermore, as described above, the transfer module TRS1 in the module stack T1 is the first substrate mounting unit, which transfers the wafer W via the transfer mechanism 31. Additionally, the temperature adjustment module SCPL1, transfer module TRS2, and transfer module TRS3 are the second substrate mounting units, which mount the wafer W by transferring it between the carrier block D1 and the lower and upper processing blocks. The temperature adjustment module SCPL1 is the lower substrate mounting unit corresponding to the lower processing block, and the transfer modules TRS2 and TRS3 are the upper substrate mounting units corresponding to the upper processing blocks.

[0068] As described above, in the carrier block D1 of the coating and developing apparatus 1, transport mechanisms 31 and 34 are respectively arranged on the left and rear sides of the module stack T1 (transfer module TRS, temperature adjustment module SCPL) used to transfer wafers W between the carrier C and the lower and upper processing blocks. Regarding transport mechanism 31, it is arranged in the transport area 17 formed by the protrusions 16, and is aligned in the front-rear direction with the moving platform 12 for loading and unloading wafers W. Furthermore, the functions of transport mechanisms 31 and 34 are differentiated: transport mechanism 31 performs the transfer of carrier C on the moving platform 12, while transport mechanism 34 performs the transfer between modules in the module stack T1. By differentiating the functions of the transport mechanisms in this way, the number of operation steps of transport mechanisms 31 and 34 (the number of sections in which transport mechanisms 31 and 34 perform transport along the aforementioned transport path) and the travel distance of transport mechanisms 31 and 34 in one operation step can be reduced, thereby increasing the processing capacity of the apparatus. Furthermore, through the arrangement of the aforementioned transport mechanisms 31 and 34, the module stack T1, and the moving platform 12, a larger space can be ensured in front of the module stack T1, which can be used as a chemical liquid storage area 36. This reduces the required floor area (footprint) of the coating and developing apparatus 1, preventing it from becoming too large, and, as mentioned above, brings the chemical liquid storage area 36 close to the liquid processing module, suppressing the mixing of particles originating from the length of the piping 52 into the coating film, thus preventing a decrease in the yield of semiconductor products.

[0069] Furthermore, mobile platforms 12 are arranged in front of and behind the conveying mechanism 31. Regarding the conveying mechanism 31, the carriers C on each mobile platform 12 can be accessed by changing the orientation of the base 32 and by moving the holding part 33 forward and backward. Due to this configuration, when accessing each carrier C, it is not necessary to connect the conveying mechanism 31 to the mobile mechanism for lateral movement. Therefore, the floor space can be reduced more reliably, and the throughput can be improved. Furthermore, since this lateral movement mechanism is not required, the manufacturing cost of the device can also be reduced.

[0070] Furthermore, multiple mobile platforms 12 are arranged in an overlapping manner in front of and behind the transport area 17. By arranging the mobile platforms 12 in this way, lateral movement of the base 32 of the transport mechanism 31 is not required, and a sufficient number of mobile platforms 12 can be ensured, so that the transport mechanism 31 can access the carrier C at the desired time. That is, with this configuration, the footprint of the device can be more reliably suppressed, and the reduction in throughput can be prevented.

[0071] Furthermore, the orientation of the carrier C when accessed by the transport mechanism 31 differs from the orientation of the carrier C placed on the external transfer platform 11 by the external transport mechanism (OHT). This orientation change can be achieved, for example, by connecting the mobile platform 12 to a rotating mechanism, which rotates the mobile platform 12. In such a configuration, the rotating mechanism can directly transfer the carrier C to the mobile platform 12. That is, the external transfer platform 11 and the mobile platform 12 can also be made the same.

[0072] However, rather than making the rotation mechanism an orientation-changing mechanism, it is preferable to make the vehicle transfer mechanism 26 an orientation-changing mechanism as described above. As shown in Figures 5-7, when the vehicle transfer mechanism 26 transfers the vehicle C between platforms, the orientation change is performed using the space available for this transfer, eliminating the need to ensure sufficient space around the moving platform 12 for the rotation of the vehicle C. As a result, the size of the device is reduced. Furthermore, by performing the orientation change and the movement of the platform towards the transfer target in parallel, a reduction in throughput is prevented, making this a suitable approach.

[0073] Furthermore, although the carrier C on the retraction platform 13 of the canopy 24 is arranged in a front-to-back direction relative to the carrier C on the mobile platform 12 and the lower support 23 of the mobile platform 12, the carrier C on this retraction platform 13 also has its opening facing the front-to-back direction, just like the carrier C on the mobile platform 12. As mentioned above, regarding the carrier C, the left-right width L1 is greater than the front-to-back width L2, so the carrier C is configured by changing its orientation to reduce the front-to-back space occupied. Therefore, even if the space on the left side of the carrier block D1 is reduced to accommodate the portion of the protruding wall 16 used for the aforementioned transport mechanism 31, the expansion of the front-to-back width of the carrier block D1 can still be suppressed, and multiple retraction platforms 13 can be configured. In the example shown in Figure 4, the vehicle C is placed with the rearward platform 13 of each canopy 24 facing forward, and the frontward platform 13 of each canopy 24 facing backward. However, the front and rear orientations can be reversed.

[0074] Furthermore, by arranging multiple retraction platforms 13 in this way, unwanted carriers C can be retracted from the moving platform 12 at any time, allowing other carriers C to be placed on the moving platform 12 for wafer W loading and unloading, thus enabling efficient loading and unloading. Therefore, as described above, changing the orientation to differ from when the carriers are placed on the external transfer platform 11, and configuring the carriers C on the aforementioned retraction platforms 13, helps prevent the carrier block D1 from becoming too large, thereby preventing an increase in the device's footprint and a decrease in the device's throughput.

[0075] Furthermore, the inspection module 39, which becomes elongated due to the movement of the internal platform, is configured to extend in the front-back direction from the aforementioned protrusion 16, utilizing the space formed in front of and behind it, and overlap with each platform 11-13. This configuration prevents an increase in the footprint of the device caused by the installation of the inspection module 39.

[0076] Furthermore, a hydrophobic treatment module 35 is configured as a processing module in the space formed behind the transport mechanism 34 of each module in the access module stack T1, and the wafer W is transferred by the transport mechanism 34. By configuring this hydrophobic treatment module 35, the lateral width of the coating and developing apparatus 1 is also prevented from expanding.

[0077] Alternatively, other modules such as an inspection module 45 can be installed instead of the hydrophobicity treatment module 35, and transported by the transport mechanism 34. However, when the hydrophobicity treatment module 35 performs the treatment, the mounting portion (hot plate) of the wafer W does not need to move laterally. That is, when the processing module is installed behind the transport mechanism 34, in order to prevent the carrier block D1 from becoming too large, it is advisable to install a processing module that performs the treatment in a way that does not cause the mounting portion of the wafer W to move laterally.

[0078] Additionally, supplementary explanation is provided regarding the configuration of the hydrophobic treatment module 35. Airflow forming units are provided on the upper part of the housing 14 of the carrier block D1, and on the upper parts of the housings of the first stacked processing blocks D2, the second stacked processing blocks D3, and the interface block D4. Each airflow forming unit introduces air from outside the coating and developing apparatus 1 and supplies this air to the transport path of the wafer W in the block where the airflow forming unit is located, thereby forming a downward airflow. Furthermore, exhaust ports are also provided in each block to form a downward airflow in this manner.

[0079] Furthermore, in the carrier block D1, a longitudinally elongated filter is provided on the front side of the module stack T1; the airflow forming unit of the carrier block D1 also supplies air to this filter. Air is supplied from this filter to the rear side of the space 19, so that the air passes through the inter-modules constituting the module stack T1, toward the hydrophobic treatment module 35, and is exhausted from the exhaust port located further rearward than the module stack T1 and opening at the bottom of the device. By adjusting the balance of the air supply and exhaust volume generated by the airflow forming units of each block, the transport area 42 of the first stack processing block D2 is made to have a higher pressure than the space 19 of the carrier block D1. In this way, a portion of the air supplied to the transport area 42 flows toward the space 19, toward the rear, and this air is also exhausted from the exhaust port on the rear side of the module stack T1.

[0080] By supplying air from the gas supply section (filter) and the inflow of air from the transport area 42, the flow of the processing gas used in the hydrophobic treatment module 35 into the transport area 42 of the first stacked processing block D2 is more reliably prevented. If the processing gas were to flow into the developing module 41 via the transport area 42 and react with the developer, there is a concern that developing defects might occur. However, the aforementioned airflow control prevents such defects from occurring.

[0081] Furthermore, transport shuttles 4B and 4D are respectively provided in processing blocks 2B and 2D. Then, using transport shuttles 4B and 4D, wafers W processed in one of the processing blocks 2B and 2D are transported towards carrier block D1 by passing through the processing module of the other processing block. Specifically, transport shuttle 4B transfers wafer W to transport mechanism 34 of carrier block D1 via transfer module TRS, and transport shuttle 4D transfers wafer W to main transport mechanism 3B of processing block 2B. By transporting wafers W in this way, the load on main transport mechanisms 3B and 3D of processing block 2B and processing block 2D is reduced (more specifically, the number of necessary transport steps within the blocks is reduced). As a result, the throughput of coating and developing apparatus 1 can be further improved.

[0082] Alternatively, in the inspection module 45 of processing blocks 2B and 2D, the imaging and inspection of the processed wafer W can be performed by the inspection module 39 of carrier block D1, instead of by using the device. In this case, before the wafer W, which has been transported to the module stack T1, returns to the carrier C after processing, it can be transported to the inspection module 39 by the transport mechanism 31. Furthermore, an inspection module can also be installed in the processing module stack 43 of processing block 2A, allowing for imaging and inspection of the wafer W before processing by transporting it from each processing block. Regarding the inspection module 39 in carrier block D1, only one of the two modules can be installed, or there may be no inspection module 39 installed in carrier block D1.

[0083] Furthermore, regarding the four mobile platforms 12 of the carrier block D1, although the platforms used as loading sections and the platforms used as unloading sections are different in the above-described transport example, one mobile platform 12 can also serve as both a loading section and an unloading section. Moreover, even when used separately as loading and unloading sections, it is not limited to using the lower mobile platform 12 as a loading section and the upper mobile platform 12 as an unloading section as in the aforementioned example; any mobile platform can be set as either a loading or unloading section. Since the transport mechanism 31 is a configuration shared by the four mobile platforms 12, it has the advantage of easily switching the function of the mobile platforms 12. Furthermore, the orientation of the carrier C in the mobile platform 12 is the same as the orientation of the carrier C in the retraction platform 13 of the transport rack 15, therefore, the retraction platform 13 can also replace one of the mobile platforms 12 in front of or behind the transport area 17.

[0084] Furthermore, in each batch, wafer W is stored in carrier C. On the other hand, in the manufacture of semiconductor devices, there is a tendency to produce a variety of products in small quantities each time. In response to this tendency, sometimes a small number of wafers W are stored in carrier C, and a larger number of carriers C are moved into the device for processing. In such cases, it is more advantageous to have a greater number of the aforementioned retreat platforms 13. The top view of Figure 15 and the side view of Figure 16 show the carrier block D11 configured such that the number of platforms 13 is increased.

[0085] In vehicle block D11, a retraction platform 13 is installed on the shelf 15 where the external transfer platform 11 is provided in the aforementioned vehicle block D1. Furthermore, three layers of shelves 81 are provided in vehicle block D11; these shelves 81 are located to the left of the retraction platform 13 on the bottom platform 25. Four external transfer platforms 11 are arranged side-by-side along the front-back direction on the upper shelf 81. Additionally, four retraction platforms 13 are arranged side-by-side along the front-back direction on each of the middle and lower shelves 81. The platforms 11 and 13 of each shelf 81 can also be used for transferring vehicle C using the vehicle transfer mechanism 26.

[0086] In vehicle block D11, although the vehicle C is placed on each of the retreat platforms 13 of the shelf 15 and the middle and lower shelves 81 with the same orientation as the vehicle C on the external transfer platform 11, it can also be placed in the same way as the vehicle C on the shelf 24, facing forward and backward. In addition, the external transfer platform 11 can be set at a position that allows the loading and unloading of the vehicle C by the external handling mechanism that accesses it from above the device, and therefore can also be set on the shelf 15 in the same way as vehicle block D1.

[0087] Furthermore, in the top view of Figure 17, a carrier block D12, a variant of carrier block D1, is shown. To describe the configuration of this carrier block D12 in a simplified manner, the carrier block D1 is separated to the left and right at the boundary between the transport area 17 and the space 19, forming a region 82 containing modules and a transport mechanism. This region can also be considered as where other blocks are inserted. In region 82, on the left side, a module stack T4 containing a plurality of transfer modules TRS is provided at the center in the front-rear direction. A transport mechanism 83, with the same configuration as the transport mechanism 34, is provided, sandwiched between the module stacks T1 and T4. Furthermore, in the top view, an inspection module 84 is provided behind the module stack T4 and the transport mechanism 83. The transport mechanism 83 performs the transfer of the wafer W between the module stacks T1 and T4 and the inspection module 84. In addition, the transport mechanism 31 replaces the module stack T1 to transfer the wafer W to the module stack T4.

[0088] Therefore, when wafer W is transported from carrier C to module stack T1, it sequentially passes through module stack T4 and transport mechanism 83; when wafer W is transported from module stack T1 to carrier C, it sequentially passes through transport mechanism 83 and module stack T4. As an inspection module 84, it can also be used for any inspection before or after processing the processing block. When inspecting wafer W before processing, wafer W is transported to inspection module 84 between transporting from module stack T4 to module stack T1; when inspecting wafer W after processing, wafer W is transported to inspection module 84 between transporting from module stack T1 to module stack T4. As described above, the transport of the wafer W between the first substrate transport mechanism, i.e., transport mechanism 31, and the plurality of substrate mounting portions, i.e., the module stack T1 arranged along the longitudinal direction, can also be performed by a transport mechanism 83 (third substrate transport mechanism) that is different from the transport mechanism 31.

[0089] Alternatively, in the coating and developing apparatus 1, the upper processing block can be used as the outgoing route for wafer W, and the lower processing block can be used as the return route for wafer W. Specifically, for example, the formation of an anti-reflection film is not performed in the apparatus, but photoresist film forming modules 49 are respectively provided as liquid processing modules for the upper processing blocks 2B and 2D. In addition, developing modules 41 are respectively provided as liquid processing modules for the lower processing blocks 2A and 2C. Furthermore, the wafer W can be transported between blocks using a transport path opposite to the aforementioned transport path to sequentially perform photoresist film formation, exposure, and development to form a photoresist pattern.

[0090] Therefore, the transport shuttle is not limited to forming a return path; and the carrier block D1 is not limited to a configuration where the wafer W is transferred to the transport module TRS used to form the return path. Furthermore, the transport shuttle can also be provided in the lower processing blocks 2A and 2C. For example, the liquid processing modules of these processing blocks 2A and 2C can both be photoresist film forming modules 49; the transport shuttle can also be used for transport, allowing the wafer W to be processed by the photoresist film forming module 49 of either processing block.

[0091] Furthermore, the liquid processing performed by the apparatus is not limited to the examples mentioned above, and may also include: forming an insulating film by coating with a chemical liquid, forming a protective film for surface protection of a photoresist film by coating with a chemical liquid, and coating with an adhesive for bonding wafers W together. Additionally, a cleaning process can be performed by supplying a cleaning solution to the surface or back side of the wafer W. Therefore, the substrate processing apparatus of this technology is not limited to a coating and developing apparatus.

[0092] Furthermore, the lower processing block and the upper processing block can be connected to each other without the interface block D4. Specifically, this will be explained with reference to a schematic diagram of the substrate processing apparatus 8 in FIG18. In FIG18, the lower processing block is shown as G1 and the upper processing block is shown as G2. The module stack T1 includes transfer modules TRS21 to TRS23. Transfer module TRS21 is used for transfer of the carrier C, and the wafer W is transferred between the carrier C and transfer module TRS21 by the transfer mechanism 31. Transfer modules TRS22 and TRS23 are used for transfer of the lower processing block G1 and the upper processing block G2, respectively, and the wafer W is transferred between transfer modules TRS21 and TRS22, and between transfer modules TRS21 and TRS23 by the transfer mechanism 34. The wafer W, which is moved from carrier C via transfer module TRS21, and from transfer modules TRS22 and TRS23 via lower processing block G1 and upper processing block G2 respectively, is processed and then returned to carrier C via transfer modules TRS22 and TRS23 via transfer module TRS21. That is, the device can also be configured such that the wafer W is processed only in one of the lower processing block or the upper processing block before returning to carrier C.

[0093] Furthermore, the lower processing block and the upper processing block are not limited to being composed of two processing blocks arranged in the left-right direction, but can also be composed of a single processing block. Additionally, the lower processing block and the upper processing block can each be composed of three or more processing blocks arranged in the left-right direction, with the wafer W being transported between the left-right arranged processing blocks. Furthermore, the processing blocks are not limited to being stacked vertically; they can also be configured to connect only the carrier block D1 to a single processing block.

[0094] Furthermore, although the liquid processing module is positioned at the front and the processing module stack 43 at the rear in each processing block, this arrangement can be reversed. Additionally, in carrier block D1, the arrangement of the transport mechanisms 31, 34, or the platforms used by carrier C can also be reversed. Furthermore, the arrangement of carrier block D1 with other blocks can be reversed horizontally. Moreover, regarding the transfer module TRS and temperature adjustment module SCPL constituting the module stack T1, their heights and overlapping order can be appropriately changed within the range where wafer W can be transported within the device.

[0095] Furthermore, the hydrophobication module 35 can also be configured to overlap with the transfer module TRS and temperature adjustment module SCPL constituting the module stack T1. However, by arranging multiple transfer modules TRS and temperature adjustment modules SCPL on the module stack T1 to mount the wafer W, the transfer of wafer W between carrier block D1 and the first stack processing block D2, and between carrier C and carrier block D1, can be performed quickly. Therefore, the hydrophobication module 35 should preferably be configured as described above, behind the module stack T1.

[0096] Furthermore, although Figure 11 depicts the bottles in the chemical liquid storage area 36 as being used for liquid processing in the lower processing block 2A, the bottles used for liquid processing in the upper processing block 2B can also be placed in the chemical liquid storage area 36, ​​depending on the liquid processing performed in that block. Placing the bottles of processing block 2B in the chemical liquid storage area 36 in this way achieves the same effect as placing the bottles of processing block 2A in the chemical liquid storage area 36.

[0097] Furthermore, it should be understood that the embodiments disclosed herein are merely illustrative and not intended to be limiting. The aforementioned embodiments may also be omitted, substituted, altered, and combined in various forms without departing from the scope and intent of the appended patent application.

[0098] 1: Coating and developing apparatus 2A~2D: Processing Blocks 3A~3D: Main transport mechanism 4B, 4D: Transport shuttle 5B, 5D: Space 8: Substrate processing apparatus 10: Control Department 11: External transmission platform 12: Mobile Platform 13: Retreat Platform 14: Shell 15: scaffolding 16:Protruding wall part 17: Transport Area 19: Space 20: Exposure machine 21: Opening 22: Door panel 23: Support Department 24: Shed 25: Base 26: Vehicle transfer mechanism 27: Multi-joint robotic arm 28: Mobile mechanism 29:Claws 31: Handling organization 32:Abutment 33: Fixed Section 34: Handling organization 35: Hydrophobic treatment module 36: Chemical liquid storage area 39: Check the module 40B, 40D: Transport path 41: Developing Module 42: Transport Area 43: Processing module stack 44: Heating Module 45: Check the module 46: Mobile mechanism 47: Anti-reflective film formation module 48: Heating Module 49: Photoresist film formation module 52:Piping 53: Filter 61~63: Handling mechanisms 65: Rear cleaning module 66: Post-exposure cleaning module 71: Matrix 72: Intermediate Moving Body 73: Support body 75: Support board 76: Sales 81: scaffolding 82: Area 83: Transporting organization 84: Check Module C: Vehicle C1: Cover C2: Handle D1, D11, D12: Vehicle Blocks D2: First Stack Processing Block D3: Second Stack Processing Block D4: Interface Block E1~E8: Social Stratification G1: Lower processing block G2: Upper processing block ICPL: Temperature Adjustment Module L1, L2: Width SCPL, SCPL1~SCPL4: Temperature Regulation Module T1~T4: Module stack TRS, TRS1~TRS3, TRS5~7, TRS11B, TRS11D, TRS12B, TRS12D, TRS21~TRS23: Transmission Module W: Wafer

Claims

1. A substrate processing apparatus, comprising: a carrier block having a plurality of carrier placement portions for placing the carrier in order to move the substrate into and out of a carrier storing a substrate; a first carrier placement portion and a second carrier placement portion included in the plurality of carrier placement portions, arranged side-by-side in a front-rear direction when viewed from above; a substrate placement portion disposed on one side of the left and right sides of a transfer area of ​​the substrate formed between the first carrier placement portion and the second carrier placement portion when viewed from above, and for placing the substrate; and a first substrate transfer mechanism disposed in the transfer area and rotating about a longitudinal axis for transferring the substrate between the carrier of the first carrier placement portion and the first substrate placement portion included in the substrate placement portion.

2. The substrate processing apparatus as described in claim 1, wherein, The first substrate transport mechanism includes: a base that does not move in the forward / backward or left / right directions; and a holding part that moves forward and backward on the base and holds the substrate.

3. The substrate processing apparatus as described in claim 1, wherein, The first carrier placement section and the second carrier placement section are each carrier placement sections used for moving the substrate in and out; the first substrate transport mechanism rotates so that it becomes one orientation for the carrier of the first carrier placement section to transfer the substrate in one orientation and another orientation opposite to the first orientation for the carrier of the second carrier placement section to transfer the substrate in the second orientation.

4. The substrate processing apparatus as described in any one of claims 1 to 3, wherein, The plurality of carrier placement sections include a third carrier placement section that places the carrier in a first orientation for moving the carrier into and out of the carrier block; the carrier placement section for moving the substrate into and out places the carrier in a second orientation different from the first orientation, such that it is disposed at the opening for moving the substrate into and out of the carrier, facing the side where the first substrate transport mechanism exists, either in front or behind. An orientation-changing mechanism is provided, which changes the orientation of the vehicle between the first orientation and the second orientation.

5. The substrate processing apparatus as described in claim 4, wherein, A transport mechanism for a vehicle is provided, which transports the vehicle between the vehicle mounting sections; the orientation changing mechanism is the transport mechanism for the vehicle.

6. The substrate processing apparatus as described in claim 5, wherein, The plurality of carrier placement sections include, in addition to the carrier placement section for loading and unloading the substrate and the third carrier placement section, a standby carrier placement section for activating the carrier; the carrier placement section for loading and unloading the substrate and the standby carrier placement section are arranged side by side with their openings facing forward or backward, respectively.

7. The substrate processing apparatus as claimed in claim 1, wherein, The substrate loading and unloading carrier is arranged in a plurality of longitudinal sections; the first substrate transport mechanism is raised and lowered so that it can be shared by the plurality of substrate loading and unloading carriers.

8. The substrate processing apparatus of claim 1 further comprises: a processing block disposed on one side of the carrier block for processing the substrate; and a second substrate transport mechanism that moves up and down to transfer the substrate between the first substrate placement portion and the second substrate placement portion included in the substrate placement portion and for placing the substrate in order to transfer the substrate to the processing block.

9. The substrate processing apparatus as described in claim 8, wherein, The processing block includes a lower processing block and an upper processing block stacked on top of each other, each having a first processing module for processing the substrate and a main transport mechanism for transferring the substrate to the first processing module; the second substrate mounting portion includes a lower substrate mounting portion and an upper substrate mounting portion, which are respectively used to transfer the substrate to the main transport mechanism of the lower processing block and the main transport mechanism of the upper processing block.

10. The substrate processing apparatus as claimed in claim 9, wherein, If the side where the plurality of substrates are placed is in front relative to the second substrate transport mechanism, then the second processing module that performs gas treatment on the substrate by transferring the substrate through the second substrate transport mechanism is provided behind the second substrate transport mechanism.

11. The substrate processing apparatus as claimed in claim 9, wherein, At least one of the upper processing block and the lower processing block has a processing block and another processing block arranged side by side, each having the first processing module, the main transport mechanism, and a bypass transport mechanism for transporting the substrate downstream of the transport path without using the first processing module; if the block on the carrier block side of the one processing block and the other processing block is taken as a processing block, then the substrate is transferred between the bypass transport mechanism and the second substrate transport mechanism in the one processing block; the substrate is transferred between the bypass transport mechanism and the main transport mechanism of the one processing block in the other processing block.

12. The substrate processing apparatus as claimed in claim 9, wherein, The first processing module, which is located in at least one of the lower processing block and the upper processing block, includes a liquid processing module for supplying processing liquid to the substrate; when viewed from above, on the side opposite to the side where the second substrate transport mechanism is provided in the front-back direction to the plurality of substrates, a storage section is provided for storing the processing liquid for supplying to the liquid processing module.

13. The substrate processing apparatus as claimed in claim 1, wherein, An inspection module for inspecting the substrate is provided in a manner that overlaps with the first carrier placement section or the second carrier placement section when viewed from above; the first substrate transport mechanism is raised and lowered so that the carrier placement section used to move the substrate in and out is shared by the inspection module.

14. A substrate processing method, which is a substrate processing apparatus comprising the following elements: a carrier block having a plurality of carrier placement portions for placing the carrier to move the substrate in and out of a carrier storing the substrate; a first carrier placement portion and a second carrier placement portion included in the plurality of carrier placement portions, arranged side by side in a front-rear direction when viewed from above; a substrate placement portion disposed on one side of the left and right sides of a transfer area of ​​the substrate formed between the first carrier placement portion and the second carrier placement portion when viewed from above, and placing the substrate thereon; and a first substrate transfer mechanism disposed in the transfer area and rotating about a longitudinal axis; the substrate processing method comprising the following steps: a first substrate transfer step, wherein the first substrate transfer mechanism is used to transfer the substrate between the carrier of the first carrier placement portion and the first substrate placement portion included in the substrate placement portion.

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