Device for electrochemical processing and method for processing the same

Abstract

This invention proposes an electrochemical processing apparatus and method, which first provides an array of electrode heads disposed on a circuit board, and then placed on a moving platform within an electrolyte container, thereby enabling electrochemical deposition in electrochemical additive manufacturing. The displacement of the moving platform compensates for the electrode spacing of the array of electrode heads, thereby improving the deposition resolution and uniformity of electrochemical additive manufacturing. At the same time, the cost is reduced through the independent electrical connection of the array of electrode heads.

Claims

1. An electrochemical processing apparatus for use in electrochemical additive manufacturing, the electrochemical processing apparatus comprising: an electrolyte container; a moving platform disposed within the electrolyte container; a circuit board disposed on the moving platform, the circuit board having a plurality of conductive connectors disposed thereon; and an array electrode head disposed on the circuit board, the array electrode head comprising a plurality of electrode pads disposed on the circuit board and forming a plurality of independent electrical connections via the conductive connectors; wherein an electrode spacing is present between the electrode pads, and the moving platform compensates for the electrode spacing by at least one displacement movement.

2. The electrochemical processing apparatus as claimed in claim 1 further comprises: at least one circuit board disposed between the circuit board and the array electrode head, the at least one circuit board having a plurality of circuits and a plurality of conductive vias, the conductive connectors being electrically connected to the circuits vias, the circuits being connected to the electrode pads, the conductive vias being connected to the conductive connectors, and the electrode pads forming independent electrical connections vias, conductive vias and conductive connectors.

3. The electrochemical processing apparatus as claimed in claim 1 further comprises: a sensor electrically connected to the circuit board and located on one side of the array electrode head, the sensor being further electrically connected to one of the conductive connectors; and a control circuit electrically connected to the circuit board and located on one side of the array electrode head and the sensor, the control circuit being electrically connected to the conductive connectors.

4. The electrochemical processing apparatus as described in claim 3 further comprises: a host unit electrically connected to the control circuit and the moving platform, controlling the moving platform to move and compensate the electrode pads, and controlling the control circuit to output a voltage signal to at least one of the electrode pads.

5. The electrochemical processing apparatus as claimed in claim 1, wherein the electrode pads are further coated with a coating layer on one surface of the electrode pads, the coating layer being selected from the group consisting of platinum, iridium, and rhodium.

6. The electrochemical processing apparatus as described in claim 1, wherein the moving platform is a multi-axis moving platform.

7. The electrochemical processing apparatus as claimed in claim 1, wherein one of the displacements of the at least one displacement is equal to the electrode spacing, the electrode spacing being greater than or equal to 0.5 times the size of one of the electrode pads.

8. A processing method of an electrochemical machining apparatus for electrochemically depositing a workpiece according to an electrochemical additive manufacturing process, the processing method comprising: providing an array electrode head disposed on a circuit board, and a movable platform disposed in an electrolyte container and located in an electrolyte within the electrolyte container, wherein the array electrode head includes a plurality of electrode pads having an electrode spacing between the electrode pads; driving the movable platform to move the array electrode head relative to the circuit board and electrochemically depositing the workpiece using the array electrode head, wherein... The moving platform compensates for the electrode spacing of the array electrode head by at least one displacement movement; and when the workpiece completes each layer of deposition pattern, the workpiece is lifted and the moving platform is driven to move the array electrode head and the circuit board so that the array electrode head electrochemically deposits the next layer of deposition pattern until the electrochemical deposition of the workpiece is completed.

9. A processing method of the electrochemical processing apparatus as described in claim 8, wherein the moving platform is a multi-axis moving platform.

10. A processing method of the electrochemical processing apparatus as described in claim 8, wherein one of the displacements of the at least one displacement is equal to the electrode spacing, the electrode spacing being greater than or equal to 0.5 times the size of one of the electrode pads.

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