Stamping fixed positioning pillar

Abstract

This invention provides a novel stamped fixing and positioning column, including a base column located on a circuit board. A snap-fit ​​cover is provided on the base column, the snap-fit ​​cover having a geometric structure that is stamped and snapped onto the surface of the circuit board. By machining the base column on a fixing plate to obtain the snap-fit ​​cover, and then using a punch press to integrally stamp the circuit board and the fixing plate, the process is simple, easy to operate, and facilitates the streamlined assembly of circuit boards, improving enterprise production efficiency. Furthermore, the base column replaces traditional screws and rivets, and can be directly produced on products of different specifications without the need for matching according to requirements, saving manufacturing costs and effectively improving economic efficiency.

Claims

1. A stamped fixing and positioning post for connecting a circuit board and a fixing plate, the stamped fixing and positioning post comprising: The base column, integrally formed on the fixing plate, has its outer diameter matched and positioned with the connection holes on the circuit board. A snap-fit ​​cover, with an outer diameter smaller than that of the foundation column, is installed at the top of the foundation column. The snap-fit ​​cover has at least two slots along the axial direction to form a multi-lobed geometric structure that can be flipped outwards. Its interior has a tapered inner hole that mates with a punch. During the stamping assembly of the snap-fit ​​cover, a stamping device is equipped with a first punch and a second punch. The first punch first flips each lobe outwards to form a first deformed section. Then, the second punch presses the snap-fit ​​cover flat onto the surface of the circuit board along the axial direction of the foundation column to form a second deformed section. The outer edge of the flipped snap-fit ​​cover avoids the wall of the connecting hole and does not contact the inner wall of the circuit board.

2. The stamped fixed positioning post as described in claim 1, wherein, The snap-fit ​​cover has a four-lobed structure, and the slots are perpendicular to each other.

3. The stamped fixed positioning post as described in claim 1, wherein, The snap-fit ​​cover has a three-groove, six-lobed structure with the grooves evenly distributed around the perimeter.

4. The stamped fixed positioning post as described in claim 1, wherein, The outer diameter of the fastening cover is 60% to 90% of the outer diameter of the foundation column.

5. The stamped fixed positioning post as described in claim 1, wherein, The cone angle of the tapered inner hole is 10° to 30°.

6. The stamped fixed positioning post as described in claim 1, wherein, The first punch has an outwardly expanding boss end for achieving the first deformation segment with a flipping angle of 45° to 75°.

7. The stamped fixed positioning post as described in claim 1, wherein, The second punch is a flat pressure head, and the pressing depth is equal to the thickness of the snap-fit ​​cover ±0.1mm.

8. The stamped fixed positioning post as described in claim 1, wherein, The outermost edge of the snap-fit ​​cover after flipping over maintains a gap of 0.05 to 0.3 mm with the wall of the connecting hole.

9. The stamped fixed positioning post as described in claim 1, wherein, The final pressed state of the snap-fit ​​cover allows it to form a contact area of ​​at least 3 square millimeters with the contact surface of the circuit board.

10. The stamped fixed positioning post as described in claim 1, wherein, The punching force generated during the stamping and assembly process is less than the bending strength of the circuit board material.

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