Substrate processing apparatus, substrate processing method and memory medium

Abstract

[Problem] Forming a coating film on the periphery and side surface of a substrate. [Solution] A substrate processing apparatus for forming a coating film (R) on the periphery of the surface and side surface of a substrate, comprising: a substrate holding section for rotatably holding the substrate; a first liquid supply section for supplying a first liquid to the periphery of the substrate containing the substrate; a portion removal section for removing at least a portion of the first liquid adhering to the surface and side surface of the substrate from the first liquid supplied to the substrate; a second liquid supply section for supplying a second liquid for forming the coating film to the surface and side surface of the substrate; a first liquid removal section for removing the first liquid remaining on the substrate to which the second liquid is adhered; and a control section for controlling the substrate holding section, the first liquid supply section, the portion removal section, the second liquid supply section, and the first liquid removal section.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus, a substrate processing method, and a memory medium. Prior Technology

[0002] Patent document 1 discloses a technique for forming a ring-shaped coating film by applying a coating liquid to the periphery of a substrate. [Previous Technical Documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2013-62436 Summary of the Invention

[0004] [The problem the invention aims to solve] This disclosure provides a technique for forming a coating film on the periphery and sides of a substrate surface. [Problem-solving methods]

[0005] The substrate processing apparatus disclosed herein is a substrate processing apparatus for forming a coating film on the periphery of the surface and side surfaces of a substrate. It includes: a substrate holding section for rotatably holding the substrate; a first liquid supply section for supplying a first liquid to the periphery of the substrate containing the inner surface of the substrate; a portion removal section for removing at least a portion of the first liquid adhering to the surface and side surfaces of the substrate from the first liquid supplied to the substrate; a second liquid supply section for supplying a second liquid for forming the coating film to the surface and side surfaces of the substrate; a first liquid removal section for removing the first liquid remaining on the substrate to which the second liquid adheres; and a control section for controlling the substrate holding section, the first liquid supply section, the portion removal section, the second liquid supply section, and the first liquid removal section. [The effects of the invention]

[0006] According to this disclosure, a technique is provided that enables the formation of a coating film on the periphery and sides of a substrate surface. Simple Explanation of the Diagram

[0007] [Figure 1] Figure 1 is a perspective view showing the substrate processing system. [Figure 2] Figure 2 is a side view that schematically shows an example of the interior of a substrate processing system. [Figure 3] Figure 3 is a schematic diagram showing an example of a coating unit. [Figure 4] Figure 4 is a block diagram showing an example of the hardware structure of a control device. [Figure 5] Figure 5 is a schematic diagram showing an example of the shape of a coating film formed on a workpiece. [Figure 6] Figure 6 is a flowchart illustrating an example of a substrate processing method. [Figure 7] Figures 7(a) to 7(f) are schematic diagrams illustrating an example of a substrate processing method. [Fig. 8] Fig. 8(a) to Fig. 8(f) are schematic diagrams illustrating variations of the substrate processing method. [Figure 9] Figures 9(a) and 9(b) are schematic diagrams illustrating variations of the substrate processing method. Implementation

[0008] The following describes the implementation forms of various examples.

[0009] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus is for forming a coating film on the periphery of the surface and side surfaces of a substrate, and includes: a substrate holding section for rotatably holding the substrate; a first liquid supply section for supplying a first liquid to the periphery of the substrate containing the inner surface; a portion removal section for removing at least a portion of the first liquid adhering to the surface and side surfaces of the substrate from the first liquid supplied to the substrate; a second liquid supply section for supplying a second liquid for forming the coating film to the surface and side surfaces of the substrate; a first liquid removal section for removing the first liquid remaining on the substrate to which the second liquid adheres; and a control section for controlling the substrate holding section, the first liquid supply section, the portion removal section, the second liquid supply section, and the first liquid removal section.

[0010] According to the aforementioned substrate processing apparatus, after supplying a first solution to the periphery of the substrate containing the inner substrate, the first solution adhering to at least a portion of the surface and side surfaces of the substrate is removed. Then, after supplying a second solution to the surface and side surfaces of the substrate, the first solution remaining on the substrate is removed. In this way, when the second solution for forming a coating film is supplied, since the inner substrate is still adhering to the first solution, preventing the second solution from adhering to the inner substrate, a coating film can be formed on the surface and side surfaces of the substrate. Therefore, it is possible to prevent the formation of a coating film on the inner substrate while simultaneously forming a coating film on the periphery of the surface and side surfaces of the substrate.

[0011] The aforementioned first liquid supply unit is located on the inner side of the aforementioned substrate and includes a first nozzle that dispenses the aforementioned first liquid to the periphery of the aforementioned substrate; the aforementioned second liquid supply unit is located on the surface side of the aforementioned substrate and may include a second nozzle that dispenses the aforementioned second liquid to the surface and side of the aforementioned substrate.

[0012] Because the first nozzle that dispenses the first liquid is located on the inside of the substrate, the first liquid can be properly adhered to the periphery of the substrate. Therefore, the first liquid can prevent the second liquid from adhering to the inside of the substrate, while forming a coating film on the periphery of the surface and the periphery of the side of the substrate.

[0013] The aforementioned first liquid supply unit is provided on the surface side of the aforementioned substrate and includes a first nozzle that dispenses the aforementioned first liquid to the periphery of the aforementioned substrate; the aforementioned second liquid supply unit is provided on the surface side of the aforementioned substrate and may include a second nozzle that dispenses the aforementioned second liquid to the surface and side of the aforementioned substrate.

[0014] When the first nozzle for dispensing the first liquid is located on the surface side of the substrate, it prevents the configuration of the mechanism for supplying the first liquid on the inside side of the substrate from becoming complicated.

[0015] The aforementioned partial removal unit is provided on the surface side of the aforementioned substrate and includes a third nozzle that ejects the aforementioned first liquid solution onto the aforementioned substrate; the aforementioned control unit may control the state of the aforementioned substrate holding unit and the aforementioned partial removal unit in such a way that the aforementioned solvent is ejected onto the aforementioned substrate while the aforementioned substrate is rotated.

[0016] By rotating the substrate while simultaneously supplying solvent from the third nozzle to remove a portion of the first solution, the first solution adhering to at least a portion of the surface and sides of the substrate can be appropriately removed using the solvent. Therefore, a second solution used to form a coating film can be appropriately adhered to the surface and sides of the substrate.

[0017] The aforementioned control unit controls the aforementioned substrate holding unit and the aforementioned second liquid supply unit in such a way that the aforementioned second liquid is supplied while the aforementioned substrate is rotating; it is also possible that the number of rotations of the aforementioned substrate when the aforementioned solvent is supplied by the aforementioned second liquid supply unit is smaller than the number of rotations of the aforementioned substrate when the aforementioned solvent is supplied by the aforementioned partial removal unit.

[0018] As described above, compared to the rotation number of the substrate when the solvent is supplied by the aforementioned partial removal section, by making the rotation number of the substrate when the second liquid supply section supplies the aforementioned second liquid a smaller number, it is possible to prevent the solvent from moving to the inner side of the substrate. Furthermore, by reducing the rotation number of the substrate when supplying the second liquid, it is possible to supply the second liquid evenly to the substrate and to prevent the second liquid from scattering due to liquid bullets or the like.

[0019] The aforementioned third nozzle can also spray the aforementioned solvent onto the aforementioned substrate in a mist form. By spraying the solvent in a mist form, the solvent can be supplied to the desired location on the substrate, and the first liquid can be appropriately removed by the solvent.

[0020] The aforementioned removal section may include a removal member that removes the first liquid by contacting the surface and side surfaces of the substrate while the substrate is rotated by the substrate holding section. In this way, when the first liquid is removed by contacting the surface and side surfaces of the substrate with the removal member to remove the first liquid, the first liquid at the desired location can be removed appropriately.

[0021] In one exemplary embodiment, a substrate processing method is provided. The substrate processing method is a method for forming a coating film on the peripheral edges of the surface and side surfaces of a substrate, comprising: supplying a first solution to the peripheral edge of the substrate, which includes the interior of the substrate; removing at least a portion of the first solution that adheres to the surface and side surfaces of the substrate from the first solution supplied to the substrate; supplying a second solution for forming the coating film to the surface and side surfaces of the substrate; and removing the first solution remaining on the substrate to which the second solution adheres.

[0022] According to the above-described substrate processing method, after supplying a first solution to the periphery of the substrate containing the inner substrate, the first solution adhering to at least a portion of the surface and side surfaces of the substrate is removed. Then, after supplying a second solution to the surface and side surfaces of the substrate, the residual first solution on the substrate is removed. Therefore, when the second solution for forming a coating film is supplied, since the inner substrate is still adhering to the first solution, the second solution is prevented from adhering to the inner substrate, allowing a coating film to be formed on the surface and side surfaces of the substrate. Thus, it is possible to prevent the formation of a coating film on the inner substrate while simultaneously forming a coating film on the periphery of the surface and side surfaces of the substrate.

[0023] In one exemplary embodiment, a computer-readable memory medium is provided. This computer-readable memory medium may store a program used to cause a device to execute the above-described method. The memory medium achieves the same effect as the substrate processing method described above.

[0024] The following description, with reference to the drawings, describes one embodiment. In the description, the same elements or elements having the same function are marked with the same symbol, and repeated descriptions are omitted.

[0025] [Substrate Processing System] The substrate processing system 1 shown in Figure 1 is a system for forming a photosensitive film on a workpiece W, exposing the photosensitive film, and developing the photosensitive film. The workpiece W to be processed is, for example, a substrate, or a substrate that has been formed into films and circuits by applying a predetermined process. For example, the substrate contained in the workpiece W is a silicon-containing wafer. The workpiece W (substrate) may also be circular. The workpiece W to be processed may also be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or an intermediate obtained by applying a predetermined process to such substrates. The photosensitive film is, for example, a photoresist film.

[0026] The substrate processing system 1 includes a coating / developing apparatus 2, an exposure apparatus 3, and a control apparatus 100 (control unit). The exposure apparatus 3 is used to expose a photoresist film (photosensitive film) formed on a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates energy lines onto the exposed portion of the photoresist film using methods such as immersion exposure. Before the exposure process performed by the exposure apparatus 3, the coating / developing apparatus 2 coats a photoresist (solution) onto the surface of the workpiece W to form a photoresist film, and performs a development process on the photoresist film after the exposure process.

[0027] (Substrate processing apparatus) The structure of the coating / developing apparatus 2 will be described below as an example of a substrate processing apparatus. As shown in Figures 1 and 2, the coating / developing apparatus 2 includes a carrier block 4, a processing block 5, and an interface block 6.

[0028] Carrier block 4 is used for importing and exporting workpieces W into and from the coating / developing apparatus 2. For example, carrier block 4 can support multiple carriers C for workpieces W and includes a conveying device A1 containing a receiving arm. Carrier C, for example, holds multiple circular sheet workpieces W. The conveying device A1 removes workpieces W from carrier C and moves them to processing block 5, receives workpieces W from processing block 5, and returns them to carrier C. Processing block 5 has multiple processing modules 11, 12, 13, and 14.

[0029] The processing module 11 includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. The processing module 11 forms a lower film on the surface of the workpiece W using the coating unit U1 and the heat treatment unit U2. The coating unit U1 applies a processing solution for forming the lower film to the workpiece W. The heat treatment unit U2 performs various heat treatments accompanying the formation of the lower film.

[0030] The processing module 12 (liquid treatment unit) includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying the workpiece W to these units. The processing module 12 performs liquid treatment, including forming a photoresist film on a lower film using the coating unit U1 and the heat treatment unit U2. The coating unit U1 coats the lower film with a processing liquid (photoresist) for photoresist film formation. The heat treatment unit U2 performs various heat treatments accompanying the film formation. Furthermore, the coating unit U1 has the function of forming a coating film of photoresist liquid around the periphery of the workpiece W.

[0031] The processing module 13 includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. The processing module 13 forms an upper film on the photoresist film using the coating unit U1 and the heat treatment unit U2. The coating unit U1 coats the photoresist film with a liquid for forming the upper film. The heat treatment unit U2 performs various heat treatments accompanying the formation of the upper film.

[0032] The processing module 14 includes a coating unit U1, a heat treatment unit U2, and a conveying device A3 for transporting workpieces W to these units. The processing module 14 performs development processing and heat treatment of the photoresist film accompanying the exposure process via the coating unit U1 and the heat treatment unit U2. The coating unit U1 coats the surface of the exposed workpiece W with a developer solution, then rinses it with a rinsing solution to perform development processing on the photoresist film. The heat treatment unit U2 performs various heat treatments accompanying the development process. Specific examples of heat treatment include post-exposure bake (PEB) and post-bake (PB).

[0033] A shelving unit U10 is provided on the side of the carrier block 4 within processing block 5. The shelving unit U10 is divided into a plurality of units arranged in the vertical direction. A conveying device A7, including a lifting arm, is provided near the shelving unit U10. The conveying device A7 raises and lowers the workpiece W between the units of the shelving unit U10.

[0034] A shelving unit U11 is provided on the side of the interface block 6 within the processing block 5. The shelving unit U11 is divided into a plurality of units arranged in the vertical direction.

[0035] Interface block 6 handles the receiving and receiving of workpiece W between itself and exposure device 3. For example, interface block 6 may contain a conveying device A8 with a receiving and receiving arm, which is connected to exposure device 3. The conveying device A8 transfers workpiece W, which is configured in shelf unit U11, to exposure device 3. The conveying device A8 receives workpiece W from exposure device 3 and returns it to shelf unit U11.

[0036] [Coating Unit] Next, the coating unit U1 of the processing module 12 will be described in detail. As shown in FIG3, the coating unit U1 of the processing module 12 includes a turntable 21 (substrate holding part), a rotation drive part 22, a support pin 23, a track ring 25, a cup 26, an exhaust pipe 28, and a drain port 29. Furthermore, the coating unit U1 includes a first processing liquid supply part 31, a second processing liquid supply part 32, a third processing liquid supply part 33, and a fourth processing liquid supply part 34.

[0037] Furthermore, the first processing liquid supply unit 31 to the fourth processing liquid supply unit 34 mentioned above are processing liquids used when forming a coating film on the periphery of the workpiece W.

[0038] Turntable 21 holds the workpiece W horizontally. Turntable 21 is connected to rotary drive unit 22 via an extension shaft in the vertical direction. Rotary drive unit 22 rotates turntable 21 at a predetermined rotation speed based on a control signal output from control device 100.

[0039] Support pins 23 are internal pins that support the workpiece W. For example, three support pins are arranged around the axis of the turntable 21. Support pins 23 can be raised and lowered by a lifting mechanism (not shown). The workpiece W is moved between the workpiece W's conveying mechanism (not shown) and the turntable 21 using support pins 23.

[0040] A guide ring 25, located below the workpiece W held by the turntable 21, guides the processing fluid supplied to the surface of the workpiece W towards the drain port. A cup 26, surrounding the outer periphery of the guide ring 25, is provided to suppress the splashing of the processing fluid. The cup 26 has an opening at its top, allowing for the receiving and receiving of the workpiece W onto the turntable 21. A space 27, serving as a liquid discharge path, is formed between the side peripheral surface of the cup 26 and the outer periphery of the guide ring 25. Below the cup 26, an exhaust pipe 28 with an exhaust port 28a and a drain port 29 are provided to discharge the liquid moving within the space 27.

[0041] Furthermore, the coating unit U1 is equipped with four processing liquid supply units for supplying four types of processing liquids. The first processing liquid supply unit 31 (partial removal unit) and the second processing liquid supply unit 32 (second chemical liquid supply unit) dispense processing liquid from the workpiece W supported by the turntable 21 towards the periphery of the surface side of the workpiece W. The third processing liquid supply unit 33 (first chemical liquid supply unit) and the fourth processing liquid supply unit 34 (first chemical liquid supply unit) dispense processing liquid from the workpiece W supported by the turntable 21 towards the periphery of the inner side of the workpiece W.

[0042] The first processing fluid supply unit 31 includes a nozzle 31a (the third nozzle), a processing fluid supply source 31b, and piping 31c. Similarly, the second processing fluid supply unit 32 includes a nozzle 32a (the second nozzle), a processing fluid supply source 32b, and piping 32c. The third processing fluid supply unit 33 includes a nozzle 33a (the first nozzle), a processing fluid supply source 33b, and piping 33c. The fourth processing fluid supply unit 34 includes a nozzle 34a, a processing fluid supply source 34b, and piping 34c. Switching valves controlled by the control device 100 may be installed on the piping of each of the first to fourth processing fluid supply units 31 to 34. The supply / stop of processing fluid may be switched by changing the open and closed states of the switching valves based on control signals from the control device 100.

[0043] Furthermore, the processing liquid supplied from the first processing liquid supply unit 31 may include, for example, a solvent. The solvent supplied from the first processing liquid supply unit 31 may be, for example, a solvent capable of dissolving the processing liquid supplied from the third processing liquid supply unit 33 (e.g., a diluent). Also, the processing liquid supplied from the second processing liquid supply unit 32 may be, for example, a processing liquid used when forming a coating film on the periphery of the workpiece W (e.g., a photoresist). The solvent supplied from the third processing liquid supply unit 33 may be, for example, a liquid capable of adhering to the end face of the workpiece W and capable of dissolving the solvent supplied from the first processing liquid supply unit 31. Furthermore, the solvent supplied from the fourth processing liquid supply unit 34 may be a solvent capable of removing the processing liquid supplied from the third processing liquid supply unit 33 and incapable of dissolving the processing liquid supplied from the second processing liquid supply unit 32. In the following description, there are cases where the processing liquid supplied from the third processing liquid supply unit 33 is used as the first chemical solution R1, and the processing liquid (processing liquid for coating film formation) supplied from the second processing liquid supply unit 32 is used as the second chemical solution R2. Also, there are cases where the solvent supplied from the first processing liquid supply unit 31 is used as the first solvent F1, and the solvent supplied from the fourth processing liquid supply unit 34 is used as the second solvent F2. Based on the above relationships, it is possible to select a chemical agent that is different from the first chemical solution R1 and the second chemical solution R2. Furthermore, it is possible to select a chemical agent that is different from the first solvent F1 and the second solvent F2. However, for example, it is also possible to select the same chemical agent as the first solvent F1 and the second solvent F2.

[0044] Furthermore, the "dissolution" of a specific liquid with a specific solvent used in this embodiment does not mean that the components constituting the liquid dissolve in the solvent when the specific liquid is mixed with the specific solvent, but rather that the components constituting the liquid become mobile. Specifically, the state in which a specific liquid adheres to, for example, a workpiece W without moving refers to a state in which the components constituting the liquid (e.g., resin particles in the case of photoresist) are in close proximity to each other. When a specific solvent is mixed with a liquid in this state, the solvent enters between the components constituting the liquid. As a result, the components in the liquid become mobile (flow), resulting in a state in which the liquid is removed from the area where it is adhered. The "dissolution" in this embodiment refers to a state in which the liquid can be removed as a result of the aforementioned mobility of the liquid.

[0045] The nozzles 31a of the first processing fluid supply unit 31 and 32a of the second processing fluid supply unit 32 are, for example, mounted on an arm extending in the horizontal direction and are movable in the horizontal direction. Furthermore, the nozzles 31a and 32a are also movable in the vertical direction. A moving mechanism is provided for moving the nozzles 31a and 32a in both the horizontal and vertical directions. By operating the moving mechanism, the nozzles 31a and 32a can move between a standby position outside the cup 26 and the workpiece W.

[0046] The nozzles 33a of the third processing fluid supply unit 33 and 34a of the fourth processing fluid supply unit 34, like those of nozzles 31a and 32a, can move in the vertical and horizontal directions via a moving mechanism. Furthermore, the standby positions of nozzles 33a and 34a can be set differently from those of nozzles 31a and 32a.

[0047] As nozzles 31a to 34a, any one of them can be a nozzle with a certain degree of narrow diameter at the outlet of the treatment fluid (for example, the diameter of the outlet is about 0.2 mm to 1.2 mm). When such a narrow-diameter nozzle is used, by moving the position of the nozzle in the vertical and horizontal directions, the treatment fluid can be appropriately supplied to a specific position on the workpiece W. However, the diameter / shape of nozzles 31a to 34a is not limited to the examples described above.

[0048] The control device 100 controls the coating / developing device 2. The control device 100 applies liquid treatment to the workpiece W via the processing module 12 according to predetermined conditions. For example, the control device 100 supplies each processing liquid to the workpiece W via the first processing liquid supply unit 31 to the fourth processing liquid supply unit 34 based on predetermined conditions, and controls the rotation of the workpiece W at the same time. The control device 100 may also be configured with multiple functional modules for performing the above-mentioned liquid treatment. Each functional module is not limited to being implemented by executing a program; it may also be implemented by dedicated circuits (e.g., logic circuits) or integrated circuits (ASICs).

[0049] The hardware of the control device 100 may be configured, for example, by one or more computers for control. As shown in FIG4, the control device 100 includes a circuit 201 as its hardware configuration. The circuit 201 may be configured as a circuit element. The circuit 201 may include a processor 202, a memory 203, a storage device 204, a driver 205, and an input / output port 206.

[0050] The processor 202, at least one of the memory 203 and storage 204 cooperates to execute a program, and performs signal input / output via the input / output port 206, thus constituting the aforementioned functional modules. The memory 203 and storage 204 store various information / programs used by the control device 100. The driver 205 is a circuit that drives various devices of the coating / developing apparatus 2. The input / output port 206 performs signal input / output between the driver 205 and the various parts constituting the coating / developing apparatus 2.

[0051] The substrate processing system 1 may include a single control device 100 or a controller group (control unit) composed of multiple control devices 100. When the substrate processing system 1 includes a controller group, for example, each of the aforementioned multiple functional modules may be implemented by a different controller device, or by a combination of two or more control devices 100. When the control device 100 is composed of multiple computers (circuit 201), each of the multiple functional modules may be implemented by a single computer (circuit 201). Alternatively, the control device 100 may be implemented by a combination of two or more computers (circuit 201). The control device 100 may also have multiple processors 202. In this case, each of the aforementioned functional modules may be implemented by a single processor 202, or by a combination of two or more processors 202. Alternatively, a portion of the functionality of the control device 100 of the substrate processing system 1 may be located in a device different from the substrate processing system 1, and the substrate processing system 1 may be connected via a network to achieve various operations of this embodiment. For example, if the functions of the processor 202, memory 203, and storage 204 of the multiple substrate processing system 1 are implemented by one or more different devices, the information and actions of the multiple substrate processing system 1 can be remotely managed and controlled.

[0052] Next, the processing of workpiece W performed in substrate processing system 1 will be described. Control device 100 controls coating / developing device 2 to process workpiece W in the following order, for example. First, control device 100 controls transfer device A1 to transfer workpiece W in carrier C to booth unit U10, and controls transfer device A7 to place workpiece W in unit for processing module 11.

[0053] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shed unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 11. Furthermore, the control device 100 controls the coating unit U1 and heat treatment unit U2 to form a lower film on the surface of the workpiece W. Then, the control device 100 controls the conveying device A3 to return the workpiece W with the lower film formed to the shed unit U10, and controls the conveying device A7 to place the workpiece W in the processing module 12.

[0054] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 within the processing module 12. The control device 100 controls the coating unit U1 and heat treatment unit U2 to form a photoresist film on the lower layer of the workpiece W. An example of the liquid treatment method performed in the processing module 12 will be described later. Then, the control device 100 controls the conveying device A3 to return the workpiece W to the shelf unit U10, and controls the conveying device A7 to place the workpiece W in the unit for the processing module 13.

[0055] Next, the control device 100 controls the conveying device A3 to transport the workpiece W from the shed unit U10 to the coating unit U1 and heat treatment unit U2 within the processing module 13. Furthermore, the control device 100 controls the coating unit U1 and heat treatment unit U2 to form an upper film on the photoresist film of the workpiece W. Afterward, the control device 100 controls the conveying device A3 to transport the workpiece W to the shed unit U11.

[0056] Next, the control device 100 controls the conveying device A8 to send the workpiece W housed in the shelf unit U11 to the exposure device 3. Then, in the exposure device 3, the photoresist film formed on the workpiece W is exposed. Afterwards, the control device 100 controls the conveying device A8 to receive the exposed workpiece W from the exposure device 3 and to place the workpiece W in the unit of the processing module 14 in the shelf unit U11.

[0057] Next, the control device 100 controls the conveying device A3 to transfer the workpiece W from the shed unit U11 to the heat treatment unit U2 of the processing module 14. Then, the control device 100 controls the coating unit U1 and the heat treatment unit U2 to perform heat treatment accompanied by imaging processing and imaging processing. Through the above, the control device 100 completes the substrate processing of one workpiece W.

[0058] [Substrate Processing Method] Next, an example of the substrate processing method performed in the processing module 12 will be described. As a liquid processing method, a method for forming a coating film resulting from a photoresist film on the periphery of the workpiece W will be explained. Figure 5 shows an example of a workpiece W with a coating film R formed on its periphery. In the processing module 12, although a coating film (photoresist film) is also formed on the surface W1 of the workpiece W outside the periphery, the description of the coating film outside the periphery is omitted. The coating film R applied to the periphery of the workpiece W is provided in an area on the surface W1 of the workpiece W that is different from the central portion where the photoresist pattern is formed.

[0059] As shown in Figure 5, the workpiece W has a surface W1 and an inner surface W2 forming a pair of main surfaces, and a strip-shaped side surface W3 extending vertically from the surface W1 and the inner surface W2. Furthermore, an inclined surface W4 is formed between the surface W1 and the side surface W3 of the workpiece W, and an inclined surface W5 is also formed between the inner surface W2 and the side surface W3. A coating film R, for example, is formed in a region approximately several millimeters in the radial direction from the side surface W3 of the workpiece W, with a thickness of approximately 10 nm to 100 μm. Furthermore, the coating film R is also formed on the inclined surface W4 and the side surface W3. Specifically, the coating film R is formed in the upper part of the side surface W3, in a region approximately 30% to 100% of the height (length) of the side surface W3 relative to the thickness direction of the workpiece W (the direction perpendicular to the surface W1 and the inner surface W2). The thickness of the coating film R on the side surface W3 is, for example, set to approximately 10 nm to 100 μm.

[0060] Thus, the coating film R is formed in such a way that it covers the periphery of the surface W1 of the workpiece W, and a portion of the inclined surface W4 and the side surface W3 that are continuous from the periphery of the surface W1. In this way, the surface W1 of the workpiece W can also be protected regarding the inclined surface W4 and the portion of the side surface W3 of the workpiece W. That is, the periphery of the workpiece W to which the coating film R is formed refers to the periphery of the surface W1, and a portion of the inclined surface W4 and the side surface W3 that are continuous from the periphery of the surface W1. However, considering the transport of the workpiece W after the coating film R is formed, it is required that the coating film R not be formed on the inclined surface W5 and the inner surface W2 of the workpiece W.

[0061] Figure 6 is a diagram illustrating an example of the processing sequence for forming a coating film R on the peripheral portion of the surface W1 of the workpiece W, as shown in Figure 5, and on a portion of the inclined surface W4 and side surface W3 that are continuous from the peripheral edge of the surface W1. Figures 7(a) to 7(f) illustrate the condition of the periphery of the workpiece W in each sequence shown in Figure 6. Furthermore, in Figures 7 and 8 (described later), only a portion of the cross-section of the workpiece W (the periphery) is shown. As will be described later, because the workpiece W is rotated while the processing liquids are supplied to it, the processing liquids will form a ring-shaped coating (adhere) on the workpiece W.

[0062] As shown in Figure 6, the control device 100 executes step S01. In step S01, the control device 100 controls the conveying device A3 and the support pin 23 of the coating unit U1 to support the workpiece W on the turntable 21 of the coating unit U1.

[0063] Next, the control device 100 executes step S02. In step S02, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the third processing liquid supply unit 33 to dispense the first liquid from the nozzle 33a into the inside W2 of the workpiece W. As shown in FIG7(a), the first liquid R1 is applied to the inside W2, the inclined surface W5, and the side surface W3 of the workpiece W.

[0064] Next, the control device 100 executes step S03. In step S03, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the first processing liquid supply unit 31 to discharge the first solvent F1 from the nozzle 31a onto the surface W1 of the workpiece W. As shown in FIG7(b), the first solvent F1 adheres to the surface W1, inclined surface W4, and upper surface W3 of the workpiece W. By controlling the rotation number of the workpiece W caused by the rotary drive unit 22, the first solvent F1 supplied to the surface W1 of the workpiece W expands towards the outer periphery of the workpiece W, and simultaneously expands towards the surface W1, inclined surface W4, and upper surface W3. By adjusting the rotation number, the expansion of the first solvent F1 on the workpiece W can be controlled. While the type and properties of the solvent also depend on the size of the workpiece W, the rotation speed of the workpiece W is increased to a certain extent by ensuring that the first solvent F1 reaches the side W3 of the workpiece W, but does not reach the inclined surface W5 or the inner surface W2. That is, the rotation speed of the workpiece W in step S02 is controlled so that the first solvent F1 can move outwards from the workpiece W, but is difficult to penetrate the inclined surface W5 and the inner surface W2. For example, the rotation speed of the workpiece W is set to approximately 1000 rpm to 4000 rpm.

[0065] The first chemical solution R1 is designed to be removable by the first solvent F1. Therefore, when the solvent is supplied over the first chemical solution R1, the first chemical solution R1 attached to the workpiece W is removed. As a result, as shown in FIG7(c), the first chemical solution R1 in the area where the first solvent F1 is supplied is removed, and a portion of the removed first chemical solution R1' remains.

[0066] Next, the control device 100 executes step S04. In step S04, the control device 100, while driving the rotary drive unit 22 to rotate the workpiece W, controls the second processing liquid supply unit 32 to dispense the second liquid from the nozzle 32a. As shown in FIG7(d), the second liquid R2 adheres to the surface W1, inclined surface W4, and side surface W3 of the workpiece W. By controlling the rotation number of the workpiece W caused by the rotary drive unit 22, the second liquid R2 supplied to the surface W1 of the workpiece W expands towards the outer periphery of the workpiece W, and simultaneously expands towards the surface W1, inclined surface W4, and side surface W3. By adjusting the rotation number, the expansion of the second liquid R2 on the workpiece W can be controlled. Because the second liquid R2 expands along each surface of the workpiece W, the second liquid R2 expands along the areas where the first liquid R1 was removed by the first solvent F1 and the areas where the first liquid R1 was not originally attached. Furthermore, since the second drug solution R2 does not have the property of removing the first drug solution R1, as shown in Figure 7(d), even if the second drug solution R2 expands on the first drug solution R1' after a portion has been removed, it cannot remove the first drug solution R1' and remains attached above the first drug solution R1'.

[0067] While the type and characteristics of the second solvent R2 also depend on the size of the workpiece W, the rotation speed of the workpiece W is adjusted to a certain level to control the expansion of the second solvent R2 when it reaches the side W3 of the workpiece W. That is, the rotation speed of the workpiece W in step S04 is smaller than the rotation speed when the first solvent F1 expands outward from the center side on the surface W1 of the workpiece W (the rotation speed in step S02). As an example, the rotation speed of the workpiece W is set to 1000 rpm or less at this time.

[0068] Next, the control device 100 executes step S05. In step S05, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the fourth processing liquid supply unit 34 to discharge the second solvent F2 from the nozzle 34a into the inside W2 of the workpiece W. As shown in FIG7(e), the first drug solution R1' remaining on the inside W2, the inclined surface W5, and the side surface W3 of the workpiece W comes into contact with the second solvent F2. The first drug solution R1' is designed to be removed by the second solvent F2. Therefore, when the solvent is supplied on the attached first drug solution R1', the first drug solution R1' attached to the workpiece W is removed. The second solvent F2 is discharged to the extent that the first drug solution R1' attached to the workpiece W is completely removed. On the other hand, the second drug solution R2 is selected as a drug / solvent so that it will not be removed from the workpiece W by the second solvent F2. As a result, as shown in Figure 7(f), the first chemical solution R1' is removed, while the second chemical solution R2 remains. This second chemical solution R2 becomes the coating film R formed on the workpiece W.

[0069] Through the above processing, a coating film R as shown in FIG5 is formed on the periphery of the workpiece W. Furthermore, although FIG6 only illustrates the coating of the processing liquid (chemical solution or solvent) onto the workpiece W, heat treatment or drying treatment can be performed between steps for purposes such as fixing the chemical solution or promoting the removal of solvent-induced defects. For example, during heat treatment, the workpiece W can be moved to the heat treatment unit U2 for heat treatment.

[0070] (Example of a change in substrate processing method - 1) Regarding the modified examples of the substrate processing methods shown in Figures 6 and 7, reference will be made to Figure 8. The modified substrate processing method is also performed in the same order as the flowchart shown in Figure 6, but the specific processing methods in some steps differ from the aforementioned substrate processing method. The following description focuses on the areas of modification.

[0071] The control device 100 executes step S01. In step S01, the control device 100 controls the conveying device A3 and the support pin 23 of the coating unit U1 to support the workpiece W on the turntable 21 of the coating unit U1.

[0072] Next, the control device 100 executes step S02. In step S02, the control device 100 supplies the first liquid while the workpiece W is rotated by driving the rotation drive unit 22. In the modified substrate processing method, the first liquid is supplied from the surface side of the workpiece W. Therefore, instead of the nozzle 33a of the third processing liquid supply unit 33, the first liquid is dispensed from the nozzle 35a provided on the surface side of the workpiece W toward the surface W1 of the workpiece W. At this time, the control device 100 controls the rotation number of the workpiece W, etc., as shown in FIG8(a), so that the first liquid reaches the inside W2 from the surface W1 of the workpiece W via the side W3. In this way, the first liquid R1 adheres to the surface W1, the inclined surface W4, the inside W2, the inclined surface W5, and the side W3 of the workpiece W.

[0073] Next, the control device 100 executes step S03. In step S03, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the first processing liquid supply unit 31 to discharge the first solvent F1 from the nozzle 31a onto the surface W1 of the workpiece W. As shown in FIG8(b), the first solvent F1 adheres to the surface W1, inclined surface W4, and side surface W3 of the workpiece W. By controlling the rotation number of the workpiece W caused by the rotary drive unit 22, the first solvent F1 supplied to the surface W1 of the workpiece W expands outwards from the workpiece W, simultaneously expanding to the surface W1, inclined surface W4, and side surface W3. By adjusting the rotation number, the expansion of the first solvent F1 on the workpiece W can be controlled.

[0074] The first liquid R1 is designed to be removable by the first solvent F1. Therefore, when the solvent is supplied onto the first liquid R1, the first liquid R1 attached to the workpiece W is removed. As a result, as shown in FIG8(c), the first liquid R1 in the area where the first solvent F1 is supplied is removed, leaving a portion of the removed first liquid R1'. This state is slightly the same as that shown in FIG7(c). However, when the first liquid R1 is supplied from the surface W1 side of the workpiece W, although it also depends on the characteristics such as the viscosity of the first liquid R1, compared with the case where it is supplied from the inside W2 side as shown in FIG7(c), there is a case where less first liquid R1' remains on the inside W2 side.

[0075] Next, the control device 100 executes step S04. In step S04, while the workpiece W is rotated by driving the rotation drive unit 22, the control device 100 controls the second processing liquid supply unit 32 to discharge the second liquid from the nozzle 32a. As shown in FIG8(d), the second liquid R2 is attached to the surface W1, inclined surface W4 and side surface W3 of the workpiece W.

[0076] Next, the control device 100 executes step S05. In step S05, while the workpiece W is rotated by driving the rotary drive unit 22, the control device 100 controls the fourth processing liquid supply unit 34 to discharge the second solvent F2 from the nozzle 34a into the inside W2 of the workpiece W. As shown in FIG8(e), the first liquid R1' remaining on the inside W2, the inclined surface W5, and the side surface W3 of the workpiece W comes into contact with the second solvent F2, and the first liquid R1' adhering to the workpiece W is removed. As a result, as shown in FIG8(f), the first liquid R1' is removed, and the second liquid R2 remains. This second liquid R2 becomes a coating film R formed on the workpiece W.

[0077] Through the above processing, a coating film R as shown in FIG5 is formed on the periphery of the workpiece W. Furthermore, although FIG6 only illustrates the coating of the processing liquid (chemical solution or solvent) onto the workpiece W, heat treatment or drying treatment can be performed between steps to achieve purposes such as fixing the chemical solution or promoting the removal of solvent-induced defects. For example, during heat treatment, the workpiece W can be moved to the heat treatment unit U2 for heat treatment. The sequence is the same as shown in FIG8.

[0078] Similar to the substrate processing method described in the modified example with reference to FIG8, the first solution R1 can also be supplied to the workpiece W from the surface W1 side. However, the first solution R1 is used to prevent the formation of a coating film R formed by the second solution R2 on the inner surface W2 and the inclined surface W5 of the workpiece W. By selecting the supply of the first solution R1 in a manner that the first solution R1 sufficiently adheres to each area of ​​the inner surface W2 and the inclined surface W5 of the workpiece W where the second solution R2 may adhere in step S04, the above-mentioned objective can be achieved.

[0079] (Example 2 of the modification of substrate processing method) Next, referring to FIG9, a modified example of step S03 in the substrate processing method will be described. In step S03, although a portion of the first liquid R1 adhering to the workpiece W is removed, the method of removal is not limited to the method of ejecting the first solvent F1 caused by the nozzle 31a described above.

[0080] Figure 9(a) shows an example of removing a portion of the first liquid medicine R1 using a brush 90 with bristles 91 (removal member) that abuts against the surface W1, inclined surface W4, and side surface W3 of a workpiece W to which the first liquid medicine R1 is attached. By bringing the brush 90 against the workpiece W, the first liquid medicine R1 attached to the surface W1, inclined surface W4, and side surface W3 of the workpiece W can be removed, leaving the first liquid medicine R1 remaining below. The shape of the bristles 91 corresponds to the shape of the periphery of the workpiece W, and a structure that prevents the workpiece W from breaking is also possible. In addition, a structure in which the brush 90 can be moved horizontally and vertically by means of a moving mechanism (not shown), and is kept in standby outside the cup 26 when the brush 90 is not in use, is also possible. Also, although a brush 90 with bristles 91 is shown in Figure 9(a), the removal member used to remove the first liquid medicine R1 is not limited to bristles 91; for example, a sponge or the like can also be used.

[0081] In Figure 9(b), when the first solvent F1 is ejected from the nozzle 31a of the first processing liquid supply unit 31, the first solvent F1 is sprayed from the nozzle 31a in a mist (spray) manner. Thus, the ejection method of the first solvent F1 can also be changed. When the first solvent F1 is sprayed in a mist, the first drug solution R1 and the first solvent F1 become more easily contacted, which promotes the movement (removal) of the first drug solution R1 caused by the first solvent F1. Therefore, when controlling the range of removal of the first drug solution R1 by utilizing the movement of the first solvent F1, high-precision control is possible.

[0082] [effect] According to the substrate processing apparatus (coating / developing apparatus 2) and substrate processing method described above, after supplying a first solution R1 to the periphery of the workpiece W, which includes the inner surface W2 of the workpiece W, the first solution R1 adhering to at least a portion of the surface W1 and side surface W3 of the workpiece W is removed. Then, after supplying a second solution R2 to the surface W1 and side surface of the workpiece W, the remaining first solution R1 (first solution R1') on the workpiece W is removed by a second solvent F2. Therefore, when the second solution R2 for forming the coating film R is supplied, since the inner surface of the workpiece W is in a state where the first solution R1 is adhering, the second solution R2 is prevented from adhering to the inner surface of the workpiece W, allowing the coating film R to be formed on the surface W1 and side surface of the workpiece W. Thus, it is possible to prevent the formation of a coating film on the inner surface of the workpiece W, while simultaneously forming a coating film on the periphery of the surface W1 and side surface of the workpiece W.

[0083] Previously, it was examined how to form a coating film, such as a photoresist, around the periphery of the surface W1 of a workpiece W to prevent peripheral damage during various processing steps, such as etching. However, since damage can also occur on the side surface W3 of the workpiece W and the inclined surface W4 between the surface W1 and the side surface W3 due to subsequent processing, it was examined how to form a coating film on the inclined surface W4 and the side surface W3 to protect the workpiece W. However, when forming a coating film around the periphery of the surface W1 of the workpiece W and supplying the processing liquid for coating film formation to the side surface W3, there is a possibility that the processing liquid may seep into the interior W2 of the workpiece W. If the processing liquid seeps into the interior W2, it may affect subsequent transport of the workpiece W. Therefore, it is required to control the supply of processing liquid in a way that prevents the formation of a coating film on the inclined surface W5, which is below the side surface W3 of the workpiece W, and on the interior W2.

[0084] In contrast to the method described above, since the first solution R1 is supplied to the inside W2 of the workpiece W before the second solution R2 is applied, the inside W2 of the workpiece W is protected by the first solution R1 when the second solution R2 is supplied. Therefore, the second solution R2 is prevented from adhering to the inside W2 of the workpiece W, and the formation of the coating film R is also prevented. Furthermore, the first solution R1 adhering to the side W3, etc., is removed, for example, by the supply of the first solvent F1 caused by the first processing liquid supply section 31, before the supply of the second solution R2. Therefore, since the second solution R2 is supplied after the first solution R1 is removed from the side W3 of the workpiece W, the formation of the coating film caused by the second solution R2 is appropriately achieved. Therefore, the formation of the coating film R on the inside W2 of the workpiece W can be prevented, and the coating film R is appropriately formed on the periphery of the surface W1 and the side W3.

[0085] Furthermore, in the aforementioned apparatus, the third processing liquid supply unit 33 (first processing liquid supply unit) supplying the first processing liquid R1 is provided on the inner W2 side of the workpiece W, and includes a nozzle 33a (first nozzle) for dispensing the first processing liquid R1 to the periphery of the workpiece W. Also, the second processing liquid supply unit 32 (second processing liquid supply unit) supplying the second processing liquid R2 is provided on the surface W1 side of the workpiece W, and includes a nozzle 32a (second nozzle) for dispensing the second processing liquid R2 to the surface W1 and the aforementioned side surface of the workpiece W. With this configuration, the first processing liquid R1 can be appropriately adhered to the periphery of the inner W2 of the workpiece W. Therefore, the first processing liquid R1 can prevent the second processing liquid R2 from adhering to the inner W2 of the workpiece W, and a coating film R can be formed on the periphery of the surface W1 and the periphery of the side surface W3 of the workpiece W.

[0086] Furthermore, as illustrated in the modified example shown in Figure 8, the first liquid supply unit for supplying the first liquid R1 may be located on the surface W1 side of the workpiece W, and may include a nozzle 35a (first nozzle) that dispenses the first liquid R1 to the periphery of the workpiece W. When the nozzle 35a is located on the surface W1 side of the workpiece W, it prevents the configuration of the mechanism for supplying the first liquid to the inside of the workpiece W from becoming complicated.

[0087] Furthermore, in the coating / developing apparatus 2 described above, a first processing liquid supply unit 31, which is part of the removal unit, is provided on the surface W1 side of the workpiece W, and includes a nozzle 31a (third nozzle) that dispenses a first solvent F1 capable of removing the first chemical solution R1. Next, the control device 100 controls each unit to dispense solvent onto the workpiece W while the workpiece W is rotated. With this configuration, the first chemical solution R1 adhering to at least a portion of the surface W1 and side surfaces of the workpiece W can be appropriately removed using the first solvent F1. Therefore, a second chemical solution R2 for forming a coating film R can be appropriately adhered to the surface W1 and side surfaces of the workpiece W.

[0088] Furthermore, the control device 100 controls each part in a manner that supplies the second liquid R2 while the workpiece W is rotating. At this time, the rotation number of the workpiece W when supplying the second liquid R2 from the second liquid supply unit 32 (which is the second liquid supply unit) can be smaller than the rotation number of the workpiece W when supplying the first solvent F1 from the first processing liquid supply unit 31 (which is a part removal unit). Therefore, by increasing the rotation number of the workpiece W before supplying the first solvent F1, it is possible to prevent the first solvent F1 from moving to the inner W2 side of the workpiece W. Furthermore, by reducing the rotation number of the workpiece W when supplying the second liquid R2, the second liquid R2 can be supplied evenly to the workpiece W. Also, liquid droplets can be prevented on the workpiece W when supplying the second liquid R2, thus preventing the second liquid R2 from scattering.

[0089] Furthermore, as described above, the nozzle 31a supplying the first solvent F1 can also spray the first solvent F1 onto the workpiece W in a mist form. In this case, the solvent can be supplied to the desired location on the workpiece W, and the first chemical solution R1 can be appropriately removed by the first solvent F1.

[0090] Furthermore, as a removal section replacing the first processing liquid supply section 31 that supplies the first solvent F1, a structure in which the first chemical solution R1 is removed by the bristles 91 of the brush 90 is also possible. That is, the workpiece W is held by the turntable 21, which serves as the substrate holding section, and while the workpiece W is rotating, the bristles 91 of the brush 90, which acts as the removal member, comes into contact with the surface W1 and side W3 of the workpiece W to remove the first chemical solution R1. In this way, the structure in which the first chemical solution R1 is removed by the removal member coming into contact with the surface W1 and side W3 of the workpiece W can appropriately remove the first chemical solution R1 from the desired location.

[0091] The above describes various illustrative implementation forms, but is not limited to those examples. Various omissions, substitutions, and changes are possible. Furthermore, elements from different implementation forms can be combined to form other implementation forms.

[0092] For example, the configuration of each part in the substrate processing apparatus (coating / developing apparatus 2) can be adapted. For example, the structure for supplying the processing liquid (chemical solution / solvent) to the workpiece W can be adapted. Furthermore, the configuration of the nozzles (31a~35a) for supplying the processing liquid, the configuration of the processing liquid supply source (31b~34b), and the configuration of the piping (31c~34c) can also be adapted. Furthermore, the configuration of each part of the coating unit U1, including the turntable 21 (substrate holding part), the rotation drive part 22, the guide ring 25, and the cup 26, can also be adapted.

[0093] Furthermore, in the embodiment described above, the coating unit U1 of the processing module 12 for substrate processing is described as the unit for forming a coating film R on the periphery of the workpiece W, but other units with the same function in other modules may also be provided.

[0094] Based on the above description, the various embodiments disclosed herein are for illustrative purposes and should be understood to be subject to various modifications without departing from the scope and spirit of this disclosure. Therefore, the various embodiments disclosed herein are not intended to be limiting; the true scope and spirit are indicated by the claims.

[0095] 1: Substrate processing system 2: Coating / Developing Device 11~14: Processing Module 21: Turntable 22: Rotary drive unit 31: First Processing Fluid Supply Department 32: Second Processing Fluid Supply Department 33: Third Processing Fluid Supply Department 34: Fourth Processing Fluid Supply Department 90: Brush 91: Raw Material 100: Control device F1: First solvent F2: Second solvent R: Coated film R1: First potion R2: Second potion W: Workpiece

Claims

1. A substrate processing apparatus for forming a coating film on the periphery of the surface and the periphery of the side of a substrate, comprising: a substrate holding section for rotatably holding the substrate; a first solution supply section for supplying a first solution to the periphery of the substrate containing the inner side of the substrate; a portion removal section for supplying a solvent for removing at least a portion of the first solution adhering to the surface and the side of the substrate; a second solution supply section for supplying a second solution to the surface and the side of the substrate; a first solution removal section for removing the first solution remaining on the substrate to which the second solution is adhering; and a control section; wherein the control section controls the substrate holding section and the portion removal section to supply the solution while the substrate is rotated, and controls the substrate holding section and the second solution supply section to supply the second solution while the substrate is rotated, wherein the number of rotations of the substrate when the second solution is supplied is smaller than the number of rotations of the substrate when the solution is supplied.

2. The substrate processing apparatus as described in claim 1, wherein, The aforementioned first liquid supply unit is located on the inner side of the aforementioned substrate and includes a first nozzle that dispenses the aforementioned first liquid to the periphery of the aforementioned substrate; the aforementioned second liquid supply unit is located on the surface side of the aforementioned substrate and includes a second nozzle that dispenses the aforementioned second liquid to the surface and side of the aforementioned substrate.

3. The substrate processing apparatus as described in claim 1, wherein, The aforementioned first liquid supply unit is provided on the surface side of the aforementioned substrate and includes a first nozzle that dispenses the aforementioned first liquid to the periphery of the aforementioned substrate; the aforementioned second liquid supply unit is provided on the surface side of the aforementioned substrate and includes a second nozzle that dispenses the aforementioned second liquid to the surface and side of the aforementioned substrate.

4. The substrate processing apparatus as described in any one of claims 1 to 3, wherein, The aforementioned part removal section is provided on the surface side of the aforementioned substrate and includes a third nozzle that ejects solvent capable of removing the aforementioned first drug solution onto the aforementioned substrate.

5. The substrate processing apparatus as described in any one of claims 1 to 3, wherein, The aforementioned first liquid removal unit is configured to supply a solvent that can remove the aforementioned first liquid but cannot dissolve the aforementioned second liquid.

6. The substrate processing apparatus as described in claim 4, wherein, The aforementioned third nozzle sprays the aforementioned solvent onto the aforementioned substrate in a mist form.

7. The substrate processing apparatus as described in any one of claims 1 to 3, wherein, The aforementioned removal section includes a removal member that can remove the first liquid by contacting the surface and side of the substrate while the substrate is rotated by the substrate holding section.

8. A substrate processing method for forming a coating film on the periphery of the surface and the periphery of the side of a substrate, comprising: supplying a first solution to the periphery of the substrate inside the substrate; after supplying the first solution, supplying a solvent to remove at least a portion of the first solution adhering to the surface and the side of the substrate while the substrate is rotated; after supplying the first solution, supplying a second solution to the surface and the side of the substrate while the substrate is rotated; and after supplying the second solution, removing the first solution remaining on the substrate, wherein the number of rotations of the substrate when supplying the second solution is smaller than the number of rotations of the substrate when supplying the solution.

9. A memory medium, which is a computer-readable memory medium, which stores a program used to cause a device to perform the method described in request item 8.

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