Enclosure system structure

Abstract

An enclosure system includes walls, including side walls and a bottom wall. The enclosure system further includes an enclosure cover configured to be removably attached to one or more side walls. The walls and the enclosure cover at least partially enclose an internal volume of the enclosure system. The enclosure system further includes a top window disposed within the enclosure cover. The top window is configured for orientation verification of objects disposed within the internal volume. The enclosure system further includes a radio frequency identification (RFID) holder coupled to a rear wall. The RFID holder is configured to secure RFID components. The enclosure system further includes supports disposed within the internal volume. Each support is configured to support a corresponding object among the objects.

Description

[Technical Field]

[0001] The embodiments disclosed herein relate to structures, such as those used in association with a substrate processing system, and more particularly to a housing system structure configured to support a processing sleeve ring and / or a carrier of the processing sleeve ring. [Previous Technology]

[0002] In substrate processing and other electronic processing, platforms are frequently used that employ robotic arms to transport objects (such as substrates) between processing chambers from a storage area (e.g., a front-opening unified pod (FOUP)) to a processing chamber, from a processing chamber to a storage area, and so on. Processing systems (such as substrate processing systems) have one or more processing chambers for processing substrates. Gases are used to etch the substrate within the processing chamber (e.g., etching the substrate while simultaneously electrostatically clamping it in place within the etching chamber). Robotic arms are used to pick up objects from a specific location and transport them to another specific location. [Summary of the Invention]

[0003] The following is a brief overview of this disclosure in order to provide a basic understanding of some aspects of this disclosure. This overview is not an exhaustive summary of this disclosure. It is not intended to identify any important or key elements of this disclosure, nor is it intended to describe any category of specific embodiments of this disclosure or any category of the scope of the claims. Its sole purpose is to present some concepts of this disclosure in a concise form as an introduction to the more detailed description that follows.

[0004] In one embodiment of this disclosure, a housing system includes walls, including side walls and a bottom wall. The housing system further includes a housing cover configured to be removably attached to one or more side walls. The walls and housing cover at least partially enclose the internal volume of the housing system. The housing system further includes a top window disposed in the housing cover. The top window is configured for orientation verification of objects disposed in the internal volume. The housing system further includes a radio-frequency identification (RFID) holder coupled to a rear wall. The RFID holder is configured to secure RFID components. The housing system further includes supports disposed in the internal volume. Each of the supports is configured to support a corresponding object among the objects.

[0005] In another embodiment of this disclosure, a housing system includes walls, including side walls and a bottom wall. The housing system further includes a housing cover configured to be removably attached to one or more side walls. The walls and housing cover at least partially enclose the internal volume of the housing system. The housing system further includes pillars disposed within the internal volume of the housing system. The pillars are secured to the bottom wall of the housing system. A corresponding upper surface of each pillar is configured to be removably interfaced with a corresponding component of the housing cover. The housing system further includes supports. Each support is configured to support a corresponding object. Each support is secured to at least one corresponding pillar among the pillars.

[0006] In another embodiment of this disclosure, a method includes removably attaching a housing cover to one or more walls of a housing system. The method further includes loading an object onto a support disposed within an internal volume formed by the housing system. An upper window disposed in the housing cover is configured for orientation verification of the object. The method further includes inserting an RFID component into an RFID holder coupled to a rear wall.

Implementation Method

[0022] The embodiments described herein relate to the structure of the housing system.

[0023] A substrate processing system is used to process substrates. The substrate processing system includes a fab interface, a loading gate, a transfer chamber, and a processing chamber. A substrate storage system (e.g., FOUP) is coupled (e.g., docked via a loading port) to the fab interface. A fab interface robot transports substrates from the substrate storage system (through the fab interface) to the loading gate. A transfer chamber robot transports substrates from the loading gate (through the transfer chamber) to the processing chamber to be processed. The processed substrates are transported to the loading gate by the transfer chamber robot and from the loading gate to the substrate storage system by the fab interface robot. The fab interface maintains a first environment (e.g., an atmospheric environment, an inert environment, etc.) and the transfer chamber maintains a second environment (e.g., a vacuum environment) to avoid contaminating the substrates and the substrate processing system.

[0024] Components of the substrate processing system wear out over time and will be removed and replaced. For example, a processing sleeve ring is disposed in the processing chamber and wears out over time due to substrate processing operations and should be replaced. Opening the substrate processing system (e.g., transfer chamber, processing chamber, etc.) to remove and replace components (e.g., processing sleeve rings) causes contamination of the substrate processing chamber and necessitates a restart process that keeps the substrate processing system offline, which reduces yield, energy consumption, and operator time.

[0025] The substrate storage system for unprocessed substrates is transported to and coupled (e.g., via a loading gate) to the factory interface, and the substrate storage system for processed substrates is decoupled from the factory interface (e.g., the substrate storage system is detached from the loading port) and transported from the factory interface. During loading, transport, and handling, objects placed in the substrate storage system may be improperly loaded, improperly oriented, and / or similarly, which may result in reduced yield, substrate damage, opening of the substrate processing system, restart of the process, increased energy consumption, and increased operator time.

[0026] The apparatus, system, and method disclosed herein provide a housing system structure. The housing system is configured for storing and transporting objects, such as carriers, processing sleeve rings, substrates, verification wafers (e.g., for placing verification wafers), and / or the like. Each carrier may support one or more processing sleeve rings.

[0027] The housing system may have walls, including side walls and a bottom wall. The housing system may include a housing cover removably attached to one or more side walls. The walls and covers at least partially enclose the internal volume of the housing system. In some embodiments, a housing door of the housing system is removably attached to one or more side walls. The housing door, walls, and housing cover provide a sealed environment within the internal volume of the housing system. A support is disposed within the internal volume to support objects (e.g., carriers, verification wafers, etc.) within the housing system.

[0028] In some embodiments, a top window is disposed within the housing cover. The top window is configured for orientation verification of objects disposed within the internal volume of the housing system. In some embodiments, a rear window is disposed within the rear wall of the sidewall. The rear window is removable for orientation adjustment of the objects. In some instances, orientation verification is performed through the top window (e.g., automatically or manually), identifying incorrectly oriented objects, and the rear window is removed to adjust the orientation of the objects (e.g., automatically or manually).

[0029] In some embodiments, the struts are disposed within the internal volume of the housing system. The struts are secured to the bottom wall of the housing system. The upper surface of each strut is configured to removably interface with a corresponding component of the housing cover.

[0030] In some embodiments, the housing system includes a radio frequency identification (RFID) holder disposed near the rear wall of the housing system. The RFID holder can hold an RFID component (e.g., an RFID pill). In some embodiments, the RFID holder is configured to hold the RFID component in a horizontal or vertical orientation. The RFID component may electronically store information about the housing system that will be read by an RFID reader, such as information about the inventory of the housing system and / or the type of the housing system.

[0031] In some embodiments, the support includes a first support configured to support a first distal end of a carrier and a second support configured to support a second distal end of a carrier. The first support forms a first recess and the second support forms a second recess. One or more processing sleeve rings disposed on the carrier supported by the first and second supports are disposed in the first and second recesses without contacting the first support and without contacting the second support. The first and second recesses are configured to maintain one or more processing sleeve rings on the carrier during movement of the housing system (e.g., during bumps, rapid movement, etc.). In some embodiments, the first support forms a first alignment feature and the second support forms a second alignment feature. The first and second alignment features may be configured to align and place a verification wafer on the first and second supports. In some embodiments, when the first and second supports support the carrier, the first and second alignment features do not interfere with the processing sleeve rings on the carrier.

[0032] The apparatus, systems, and methods disclosed herein have advantages over conventional solutions. The housing system provides replacement components (e.g., processing sleeve rings) for a substrate processing system without opening the sealed environment (e.g., without opening the transfer chamber or processing chamber) and without the time- and energy-intensive re-running process of conventional systems. The housing system provides orientation verification and orientation adjustment for objects placed within the housing system, which reduces defective substrates and increases yield compared to conventional systems. The housing system provides reorientation of objects placed within the housing system during movement (e.g., bumping, rapid movement, etc.), providing less orientation error compared to conventional systems. The housing system stores electronic information associated with the housing system, thereby reducing the need for separate cataloging of the housing system. In some embodiments, the housing system provides the ability to store and place verification wafers or processing sleeve rings on a carrier on a single set of supports, thereby reducing the need for different supports for supporting different objects. When compared to conventional systems, the housing system provides better sealing, thereby reducing contamination and increasing cleanliness compared to conventional systems.

[0033] Although parts of this description relate to processing sleeve rings and carriers, this description can be applied to different types of contents (e.g., other components of a substrate processing system). Although parts of this description relate to substrate processing systems, this description can be applied to other types of systems (e.g., other manufacturing systems).

[0034] Figure 1 illustrates a processing system 100 (e.g., a substrate processing system, a semiconductor processing system) according to certain embodiments. The processing system 100 includes a fab interface 101 and loading ports 128 (e.g., loading ports 128A-D). In some embodiments, loading ports 128A-D are directly mounted to (e.g., sealed to) the fab interface 101. Housing systems 130 (e.g., cassettes, FOUPs, processing kit housing systems, or the like) are configured to be removably coupled (e.g., mated) to loading ports 128A-D. Referring to Figure 1, housing system 130A is coupled to loading port 128A, housing system 130B is coupled to loading port 128B, housing system 130C is coupled to loading port 128C, and housing system 130D is coupled to loading port 128D. In some embodiments, one or more housing systems 130 are coupled to loading ports 128 for transferring substrates and / or other substrates into and out of the processing system 100. Each of the housing systems 130 is sealed to a corresponding loading port 128. In some embodiments, a first housing system 130A is mated to loading port 128A (e.g., for replacing a used processing sleeve ring). Once one or more of these operations are performed, the first housing system 130A is then detached from loading port 128A, and a second housing system 130 (e.g., a FOUP containing a substrate) is subsequently mated to the same loading port 128A. In some embodiments, the housing system 130 (e.g., housing system 130A) is a housing system with supports for aligning the carrier and / or processing sleeve ring.

[0035] In some embodiments, the loading port 128 includes a door interface portion 238 (e.g., a front interface) that forms a vertical opening (or substantially vertical opening). The loading port 128 additionally includes a horizontal surface for supporting a housing system 130 (e.g., a cassette, a processing kit housing system). Each housing system 130 (e.g., a FOUP of a substrate, a processing kit housing system) has a door interface portion 248 (e.g., a front interface) that forms a vertical opening. The size of the door interface portion 248 (e.g., the front interface) of the housing system 130 is adjusted to interface with (e.g., seal to) the door interface portion 248 (e.g., the front interface) of the loading port 128 (e.g., the vertical opening of the housing system 130 is approximately the same size as the vertical opening of the loading port 128). The housing system 130 is placed on the horizontal surface of the loading port 128 and the vertical opening of the housing system 130 is aligned with the vertical opening of the loading port 128. The door interface portion 238 (e.g., front interface) of the housing system 130 interconnects with the door interface portion 248 (e.g., front interface) of the loading port 128 (e.g., clamping to, securing to, sealing to the door interface portion 248). The base plate (e.g., base plate) of the housing system 130 has features that engage with the horizontal surface of the loading port 128 (e.g., loading features, such as recesses, grooves, or sockets, which engage with loading port movement pin features, loading port features for pin clearance, and / or housing system docking tray latch clamping features). The same loading port 128 is used for different types of housing systems 130 (e.g., processing kit housing systems, cassettes containing substrates, etc.).

[0036] In some embodiments, the housing system 130 includes one or more supports for aligning the carrier and / or the processing sleeve ring. In some embodiments, the housing system 130 includes a pair of supports for aligning the carrier and / or contents disposed on the carrier (e.g., processing sleeve ring, processing chamber component, etc.). In some embodiments, the housing system 130 includes two pairs, three pairs, four pairs, five pairs, six pairs, seven pairs, eight pairs, and / or the like for aligning objects (e.g., carrier, processing sleeve ring, placement verification wafer, etc.). In some embodiments, each support of the pair of supports includes an alignment feature configured to align with the placement verification wafer disposed on the pair of supports. Each alignment feature may be further configured not to interfere with the contents disposed on the carrier when the carrier is disposed on the pair of supports.

[0037] In some embodiments, the housing system 130 (e.g., a processing kit housing system) includes one or more items of the contents 110 (e.g., a processing kit ring, an empty processing kit ring carrier, a processing kit ring disposed on the processing kit ring carrier, a place for a verification wafer, etc.). In some instances, the housing system 130 is coupled to the factory interface 101 (e.g., via loading port 128) to enable the automatic transfer of a processing kit ring from the processing kit ring carrier to the processing system 100 for replacement of a used processing kit ring.

[0038] In some embodiments, the housing system 130 includes an RFID holder configured to hold an RFID component. The RFID component may store electronic information associated with the housing system 130 (e.g., inventory of the housing system 130, type of the housing system 130, etc.) that can be read by an RFID reader (e.g., at loading port 128). In some embodiments, the RFID component transmits electronic information in an RF cloud (e.g., an electromagnetic field emitted by the RFID component) near the housing system 130. The RFID reader at loading port 128 may read the electronic information stored on the RFID component in response to docking the housing system 130 to loading port 128.

[0039] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b that couple the factory interface 101 to the respective degassing chambers 104a, 104b (e.g., loading gates). Second vacuum ports 105a, 105b are coupled to the respective degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate the transfer of the substrate and contents 110 (e.g., processing sleeve ring) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around and coupled thereto. The processing chambers 107 are coupled to the transfer chamber 106 via corresponding ports 108 (such as slit valves or the like). In some embodiments, the plant interface 101 is at a higher pressure (e.g., atmospheric pressure) and the transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber 104 (e.g., loading gate, pressure chamber) has a first door (e.g., a first vacuum port 103) for sealing the degassing chamber 104 to isolate the plant interface 101 and a second door (e.g., a second vacuum port 105) for sealing the degassing chamber 104 to isolate the transfer chamber 106. The contents will be transferred from the plant interface 101 to the degassing chamber 104, while the first door opens and the second door closes. As the first door closes, the pressure in the degassing chamber 104 decreases to match the transfer chamber 106. The second door opens, and the contents are transferred out of the degassing chamber 104. A local center finding (LCF) device will be used to align the contents in the transfer chamber 106 (e.g., before entering the processing chamber 107 and after exiting the processing chamber 107).

[0040] In some embodiments, the processing chamber 107 includes one or more of the following: an etching chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an annealing chamber, or the like.

[0041] Factory interface 101 includes factory interface robot 111. Factory interface robot 111 includes a robotic arm, such as a selective compliance assembly robot arm (SCARA) robot. Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, and so on. Factory interface robot 111 includes an end effector at the end of the robotic arm. The end effector is configured to pick up and transport specific objects, such as substrates. Alternatively or additionally, the end effector is configured to transport objects, such as carriers and / or handle assembly rings (edge ​​rings). The robotic arm has one or more links or components (e.g., wrist component, upper arm component, forearm component, etc.) configured to move to move the end effector in different orientations and to move the end effector to different positions.

[0042] The factory interface robot 111 is configured to transfer objects between the housing system 130 (e.g., cassette, FOUP) and the degassing chambers 104a, 104b (or loading port). Although conventional systems are associated with misalignment of contents or opening of the processing system 100 (e.g., factory interface 101) to align misaligned contents, the processing system 100 is configured to facilitate alignment of contents (e.g., via the support of the housing system 130, via the removable rear window of the housing system 130) without being opened by an operator (e.g., by disassembly of the processing system 100, by breaking the seal of the processing system 100, by contaminating the processing system 100). Thus, in the embodiment, the sealed environment including the internal volume of the housing system 130 and the internal volume of the factory interface 101 is maintained during alignment of the contents (e.g., via the bracket of the housing system 130, via the removable rear window of the housing system 130).

[0043] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robotic arm, wherein an end effector is provided at the end of the robotic arm. The end effector is configured to handle a specific object, such as a substrate. In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments it has fewer links and / or fewer degrees of freedom compared to the factory interface robot 111.

[0044] Controller 109 controls various configurations of the processing system 100. Controller 109 is and / or includes computing devices, such as personal computers, server computers, programmable logic controllers (PLCs), microcontrollers, etc. Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices, such as microprocessors, central processing units, or the like. More specifically, in some embodiments, the processing devices are complex instruction set computing (CISC) microprocessors, reduced instruction set computing (RISC) microprocessors, very long instruction word (VLIW) microprocessors, or processors implementing other instruction sets or combinations of instruction sets. In some embodiments, the processing devices are one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, or the like. In some embodiments, controller 109 includes data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. In some embodiments, controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer-readable storage medium including one or more of main memory, static memory, secondary storage, and / or processing devices (during instruction execution). In some embodiments, controller 109 receives signals from and sends control to factory interface robot 111 and substrate transfer chamber robot 112.

[0045] Figure 1 schematically illustrates the transfer of contents 110 (e.g., a processing sleeve ring disposed on a carrier) into processing chamber 107. According to one embodiment of this disclosure, contents 110 are removed from housing system 130 via a factory interface robot 111 located in factory interface 101. Factory interface robot 111 transfers contents 110 through one of first vacuum ports 103a, 103b and transfers contents 110 into corresponding degassing chambers 104a, 104b. Transfer chamber robot 112 located in transfer chamber 106 removes contents 110 from one of degassing chambers 104a, 104b through a second vacuum port 105a or 105b. Transfer chamber robot 112 moves contents 110 into transfer chamber 106, where contents 110 are transferred through corresponding port 108 into processing chamber 107. Although not shown in Figure 1 for clarity, the transfer contents 110 include a transfer processing sleeve ring disposed on a carrier, a transfer empty processing sleeve ring carrier, a transfer placement verification wafer, a component of the processing system 100 disposed on a carrier, a transfer substrate disposed on a carrier, a transfer empty carrier, and a transfer processing sleeve ring without a carrier.

[0046] Figure 1 illustrates one example of the transfer of contents 110; however, other examples are also contemplated. In some examples, it will be contemplated that the housing system 130 is coupled to the transfer chamber 106 (e.g., via a loading port mounted to the transfer chamber 106). The contents 110 are loaded from the transfer chamber 106 into the processing chamber 107 by a transfer chamber robot 112. Furthermore, in some embodiments, the contents 110 are loaded in a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned to communicate with the factory interface 101, opposite to the SSP shown. The processed contents 110 (e.g., a used processing sleeve ring) will be removed from the processing system 100 in a manner contrary to any of the methods described herein. When multiple housing systems 130 or a combination of housing systems 130 and SSPs are used, in some embodiments, one SSP or housing system 130 will be used for unprocessed contents 110 (e.g., a new processing sleeve ring), while another SSP or housing system 130 will be used to receive processed contents 110 (e.g., a used processing sleeve ring). The housing system 130 is used to align the contents 110 before and / or before transferring them via the robotic arm (e.g., via a bracket in the housing system 130, via a removable rear window of the housing system 130, via alignment features of the bracket in the housing system 130). The bracket is aligned with the contents 110 and / or with the contents 110 via the removable rear window of the housing system 130, enabling the robotic arm to properly remove the contents 110 from a specific location within the housing system 130, properly securing the contents 110 within the housing system 130 (e.g., enabling the bracket to secure the contents 110), and enabling the housing system 130 to properly transport the contents 110.

[0047] The processing system 100 includes chambers, such as a factory interface 101 (e.g., an equipment front end module (EFEM)) and adjacent chambers adjacent to the factory interface 101 (e.g., a loading port 128, a housing system 130, an SSP, a degassing chamber 104 such as a loading gate, or the like). One or more chambers are sealed (e.g., each of the chambers is sealed). Adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some instances, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM microenvironment) within the factory interface 101, so that users do not need to enter the factory interface 101 (e.g., the processing system 100 is configured to allow no human access within the factory interface 101).

[0048] In some embodiments, an airflow (e.g., inert gas, nitrogen) is provided to one or more chambers of the processing system 100 (e.g., the plant interface 101, the housing system 130). In some embodiments, the airflow is greater than leakage through one or more chambers to maintain a positive pressure in one or more chambers. In some embodiments, the inert gas within the plant interface 101 is recirculated. In some embodiments, a portion of the inert gas is discharged. In some embodiments, the airflow of unrecirculated gas into the plant interface 101 is greater than the discharged airflow and gas leakage to maintain a positive pressure of the inert gas within the plant interface 101. In some embodiments, the plant interface 101 is coupled to one or more valves and / or pumps to provide airflow into and out of the plant interface 101. A processing device (e.g., controller 109) controls the airflow into and out of the plant interface 101 and / or the housing system 130. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensor, humidity sensor, motion sensor, door actuation sensor, temperature sensor, pressure sensor, etc.) and determines the flow rate of the inert gas flowing into and out of the plant interface 101 and / or housing system 130 based on the sensor data.

[0049] The housing system 130 allows alignment of contents 110 (e.g., carriers, processing sleeve rings, placement of verification wafers, and / or the like) without opening the sealed environment of the fab interface 101 and adjacent chambers. In response to mating with loading port 128, the housing system 130 is sealed to loading port 128. The housing system 130 provides a decontamination port access, allowing the interior of the housing system 130 to be decontaminated before opening the housing system 130 to minimize disturbance to the inert environment within the fab interface 101.

[0050] Figure 2A shows a perspective view of a housing system 200 (e.g., housing system 130 of Figure 1) according to certain embodiments.

[0051] The housing system 200 includes walls, including side walls 210 (e.g., side walls 210A-B), one or more rear walls, and a bottom wall 220. The housing system 200 includes a housing cover 230 (e.g., a removable upper wall) coupled to (e.g., top surface mounted, side perimeter mounted) one or more walls (e.g., one or more side walls 210 and / or one or more rear walls) to at least partially enclose the internal volume of the housing system 200. In some embodiments, the housing cover 230 is configured to be removably attached to one or more walls.

[0052] In some embodiments, the housing cover 230 is attached to the overhead transport component 232. In some embodiments, the housing system has one or more windows (e.g., observation windows). In some embodiments, the housing cover 230 includes an upper window 234 (e.g., an upper observation window). In some embodiments, at least one of the rear walls of the housing system includes a rear window 236 (e.g., a rear observation window).

[0053] The support column 240 is coupled to the base wall 220 (e.g., via the base connector 242). The bracket 244 is disposed within the internal volume of the housing system 200. Each of the brackets 244 may be configured to support a corresponding object (e.g., the contents 110 of Figure 1). In some embodiments, each bracket 244 is connected to at least one support column 240.

[0054] In some embodiments, a first set of pillars 240 (e.g., a first pair of pillars 240, two pillars 240) is coupled to the base wall 220 (e.g., via the same base connector 242) and near the side wall 210A, and a second set of pillars 240 (e.g., a second pair of pillars 240, two additional pillars 240) is coupled to the base wall 220 (e.g., via different base connectors 242) and near the side wall 210B. A set of supports 244 (e.g., a pair of supports 244, two supports 244, a first support 244 and a second support 244, coplanar supports 244) can be used to support an object (e.g., contents 110). A first support 244 can be attached to the first set of pillars 240 and a second support 244 can be attached to the second set of pillars 240. The first subgroup and the second subgroup of supports 244 can be oriented relative to each other within the internal volume (e.g., in mirror positions of each other).

[0055] The objects supported by the bracket 244 may include a carrier 250, one or more processing sleeve rings 252 disposed on the carrier 250, a placement verification wafer 254, a substrate, and / or the like.

[0056] In some embodiments, the placement of the verification wafer 254 (e.g., the verification wafer) is an inspection wafer that includes sensors (e.g., imaging sensors, such as cameras) that provide sensor data to inspect the interior of a manufacturing equipment chamber (e.g., a substrate processing chamber) and / or components of the manufacturing equipment.

[0057] The placement and verification wafer 254 may include multiple imaging sensors to capture images of the cover of a chamber (e.g., a processing chamber, EFEM, transfer chamber, loading gate, FOUP, SSP, etc.), one or more sidewalls of the chamber, the bottom wall of the chamber, and / or components of the chamber (e.g., a processing sleeve ring). Images from the multiple imaging sensors may be stitched together to produce a stitched image of the entire inner surface of the chamber. In some embodiments, the imaging sensors capture the visible spectrum of light. In some embodiments, the imaging sensors capture thermal radiation and / or visible light.

[0058] In some embodiments, the placement verification wafer 254 includes one or more sensors (e.g., three sensors) to emit and receive a light beam to measure the distance the beam has traveled. In some embodiments, the placement verification wafer 254 includes a displacement sensor, an impedance sensor, and / or an acoustic sensor. The placement verification wafer 254 may include multiple sensors, including a pressure sensor, a temperature sensor, a vibration sensor, an accelerometer, and / or a reflection measurement sensor. In some embodiments, the placement verification wafer 254 includes a piezoresistive sensor and / or a piezoacoustic sensor. In some embodiments, the placement verification wafer 254 includes a non-contact sensor. The non-contact sensor may include a radar sensor that can scan the surface of a component in the processing chamber. Additionally, the non-contact sensor may include an x-ray emitter (e.g., an x-ray laser) and an x-ray detector. Furthermore, the placement verification wafer 254 may include an illumination component. The illumination component may at least partially illuminate the internal volume of the chamber.

[0059] In some embodiments, the placement verification wafer 254 provides sensor data to determine whether components of the processing chamber (e.g., processing sleeve rings) are in a predefined state (e.g., predefined orientation). For example, the placement verification wafer 254 can provide sensor data to verify the position of the processing sleeve rings in the processing chamber. The sensor data may include (e.g., alignment data of the processing sleeve rings disposed in the processing chamber), image data (e.g., one or more captured images), beam data (e.g., laser beam data), vibration data, temperature data, humidity data, processing gas data, particle data, pressure data, proximity data, displacement data, impedance data, acoustic data, position data, etc. The sensor data may be correlated with the condition of the processing sleeve rings disposed in the processing chamber.

[0060] The placement and verification wafer 254 may include memory for storing sensor data. The placement and verification wafer 254 may include a power source (e.g., an electrical storage device, a rechargeable battery). In some embodiments, the placement and verification wafer 254 includes one or more supercapacitors to store electrical energy for powering the placement and verification wafer 254. The supercapacitor may be a high-capacity capacitor with a capacitance value much higher than that of conventional capacitors. In some embodiments, the supercapacitor stores 10 to 100 times more electrical energy per unit volume compared to an electrolytic capacitor. In some embodiments, the supercapacitor can be recharged. If the supercapacitor falls and breaks inside the processing chamber, the supercapacitor may not contaminate the processing chamber. In some embodiments, the supercapacitor can supply high current for a short period of time. Furthermore, if the supercapacitor falls onto the hot clamp of the processing chamber, the supercapacitor may not pose a fire hazard.

[0061] In some embodiments, the carrier 250 is configured to support one or more objects (e.g., processing sleeve rings). In some embodiments, each carrier 250 has carrier features that are simultaneously visible through the upper window and / or sensors of the housing system 200 or the verification wafer 254. In some embodiments, the carrier features of each carrier 250, features on the upper surface of each processing sleeve ring 252, and the flat portion of each processing sleeve ring 252 are simultaneously visible through the upper window 234 of the housing system 200 or the verification wafer 254 and / or the sensors. In response to the flat portion of the processing sleeve ring 252 being in the wrong position or the carrier features being in the wrong position, the rear window of the housing system 200 may be removed to adjust the orientation of the processing sleeve ring 252 and / or the carrier 250. In response to features on the upper part of the processing sleeve ring 252 being invisible via the upper window and / or sensor of the housing system 200 or the verification wafer 254 (e.g., not in an upward orientation, flipped), the housing cover 230 and / or housing door are removed to flip the processing sleeve ring 252.

[0062] In some embodiments, the processing sleeve ring 252 is a replaceable component of the processing chamber. The processing sleeve ring 252 may be a ring configured to be disposed on a chuck (e.g., an electrostatic chuck) of the processing chamber. The processing sleeve ring 252 may be a sacrificial part (e.g., a worn part) that deteriorates over time during the plasma process in the processing chamber. In some embodiments, the processing sleeve ring disposed in the processing chamber is periodically replaced with a new processing sleeve ring 252 disposed within the housing system 200.

[0063] In some embodiments, the carrier 250 is disposed on the first support 244 and the second support 244, and one or more processing sleeve rings 252 are disposed on the carrier 250 without contacting the support 244. In response to movement of the housing system 200 (e.g., bumping, rapid movement), each support 244 may form a recess to guide the processing sleeve ring 252 into the correct position on the carrier 250. In some embodiments, each support 244 includes alignment features to align the placement verification wafer 254 on the support 244. In response to the carrier holding the processing sleeve ring disposed on the support, the alignment features may not interfere with the carrier 250 or the processing sleeve ring 252. In some embodiments, each support 244 is configured to support the carrier 250 and the processing sleeve ring 252, or to place the verification wafer 254.

[0064] In some embodiments, the upper window is configured for orientation verification (e.g., automatic or manual orientation verification) of objects positioned within the internal volume. In some embodiments, the rear window 236 is movable for orientation adjustment (e.g., manual or automatic orientation adjustment) of one or more objects.

[0065] In some embodiments, each of the processing sleeve rings 252 has a corresponding flat portion (e.g., a flat inner portion) visible through the upper window 234. In some embodiments, each of the processing sleeve rings 252 includes features (e.g., notches, peripheral notches, recesses, markings, upper surface peripheral notches, etc.) visible through the upper window 234 on the upper surface (or lower surface) of the processing sleeve ring 252. In some embodiments, the feature corresponds to an upper surface peripheral notch. In some embodiments, the feature (e.g., a peripheral notch) is a step on the upper surface of the processing sleeve ring 252 near the inner diameter of the processing sleeve ring (e.g., a step between the upper surface of the processing sleeve ring and the inner sidewall). In some embodiments, the flat portion and / or features (e.g., on the upper surface) of each of the processing sleeve rings 252 are simultaneously visible through the upper window 234. In some embodiments, each carrier 250 has carrier features simultaneously visible through the upper window 234. In some embodiments, the carrier features of each carrier 250, features on the upper surface of each processing sleeve ring 252, and the flat portion of each processing sleeve ring 252 are simultaneously visible via the upper window 234. In response to the flat portion of the processing sleeve ring 252 being out of position or the carrier features being out of position, the rear window 236 may be removed to adjust the orientation of the processing sleeve ring 252 and / or the carrier 250. In response to the upper features of the processing sleeve ring 252 being out of view via the upper window 234 (e.g., not in an upward orientation, flipped up), the housing cover 230 and / or housing door may be removed to flip the processing sleeve ring 252.

[0066] The corresponding upper surface of each of the pillars 240 may be configured to be removably connected to a corresponding part of the housing cover 230. In some embodiments, the corresponding upper surface of each of the pillars 240 forms a tapered recess configured to receive a tapered protrusion (e.g., a fastener, etc.) coupled to the housing cover 230 to align each of the pillars 240 with the housing cover 230.

[0067] Each of the supports 244 may be configured to align objects (e.g., contents 110 of Figure 1), such as carrier 250 and / or processing sleeve ring 252. In some embodiments, each support 244 has alignment features and / or surfaces configured to align objects on the support 244. In some embodiments, each of the supports 244 may include features for aligning the placement of the verification wafer 254. If the robotic arm places the object on the support 244 in an incorrect position and / or transport of the housing system 200 causes the object to move, the alignment features and / or surfaces align the object in the correct position. In some embodiments, the support 244 has holding means configured to hold the object to the support 244.

[0068] In some embodiments, the internal volume of the housing system 200 is a microenvironment (e.g., a sealed environment). In some embodiments, the internal volume of the housing system 200 remains substantially particle-free (e.g., substantially uncontaminated). In some embodiments, the housing system 200 includes a fan (e.g., at the top surface) to suppress any particles in the internal volume. In some embodiments, the internal volume is substantially free of (or completely free of) moisture, oxygen, particles (e.g., dust), or one or more of the like. In some embodiments, the housing system 200 includes multiple seals and / or multiple sealing surfaces. For example, a handle 212A may be mounted to a bracket that forms a fully sealed interface between the sidewall 210A and the handle 212A. Furthermore, in some embodiments, the housing system 200 includes multiple sealing fasteners (e.g., fasteners 274 in Figures 2D to 2E) that seal portions of the housing system 200, wherein the fasteners pass through walls (e.g., sidewall 210, housing cover 230, bottom wall 220, etc.). In some embodiments, the fasteners of the housing system 200 are threaded into coupling nuts. In some embodiments, the fasteners of the housing system 200 are threaded into the sealing nut (see, for example, Figures 2D to 2E).

[0069] One or more walls of the housing system 200 may be formed or coupled to a door interface portion 248 (e.g., a front interface, a frame). In some embodiments, the door interface portion 248 forms one or more recesses 247. The door interface portion may form one or more recesses to engage with a latch of a door. The door interface portion 248 (e.g., a front interface) is configured to connect to (e.g., seal to) a door for transporting the housing system 200 (e.g., and provide a sealed environment). The door interface portion 248 (e.g., a front interface) is configured to interface with (e.g., seal to) a substantially vertical portion of a loading port of a substrate processing system. In response to sealing the door interface portion 248 (e.g., the front interface) to a door or loading port, the housing system 200 creates a sealed environment (e.g., gases and / or particles do not leave or enter the housing system 200 from the surrounding environment outside the substrate processing system).

[0070] In some embodiments, the door interface portion 248 includes a recess 247 (e.g., a latch recess) for engaging with a latch interface of a door. The recess 247 may be a cutout in the inner surface of the door interface portion 248. In some embodiments, the recess 247 extends from the inner surface of the door interface portion 248 through the thickness of the door interface portion 248. In some embodiments, the recess 247A is formed by the upper inner surface of the door interface portion 248. In some embodiments, one or more recesses 247B are formed by the lower inner surface of the door interface portion 248. In some embodiments, a door latch is clamped onto the surface of the door interface portion 248, the latch forming one of the recesses 247 to clamp and / or seal the door to the door interface portion 248 (e.g., see Figures 2B to 2C).

[0071] In some embodiments, the bottom wall 220 includes or is coupled to a base plate (e.g., a connector plate). The base plate is configured to interface with a horizontal portion of the loading port. The base plate has features (e.g., recesses, receptacles, dynamic interfaces) for receiving the horizontal portion of the loading port. In some embodiments, the base plate is secured to the bottom wall 220 before the housing system 200 is connected to the loading port interface. In some embodiments, the base plate is secured to the loading port and then the bottom wall 220 is secured to the base plate. In some embodiments, the housing system 200 has seals (e.g., compressible seals, gaskets) to seal one or more openings in the bottom wall 220.

[0072] In some embodiments, an identification pin 243 (e.g., a detection pin) extends from a wall of the housing system 200. In some embodiments, the identification pin 243 extends from a bottom wall 220 near the front opening of the housing system 200 (e.g., into an internal volume formed by the housing system 200). In some embodiments, the identification pin 243 extends from a housing cover 230 into the internal volume. The identification pin 243 may be configured to be scanned by a robot (e.g., a factory interface robot). The identification pin 243 may be configured to interrupt the beam of a robot (e.g., the factory interface robot 111 of Figure 1) in response to a portion of the robot (e.g., a portion of an end effector) extending through the front opening of the housing system 200. The beam may be interrupted when a portion of the robot passes through the identification pin 243.

[0073] In some embodiments, the robot (e.g., the factory interface robot 111 of Figure 1) includes an end effector (e.g., for supporting and transporting objects), a wrist member (e.g., for rotating the end effector), etc. The end effector and / or wrist member includes a beam sensor, which in some embodiments includes a light source and a light receiver. A light emitting fiber is coupled to the light source. The light emitting fiber is delivered through the wrist member and the end effector and terminates at a first end of the end effector. A light receiving fiber is coupled to the light receiver. The light receiving fiber is delivered through the wrist member and the end effector and terminates at a second end of the end effector. The first and second ends of the end effector are spaced apart by a gap that forms an uneven area for certain types of processing (including detecting the peripheral edge of a substrate, other contents, and / or objects (e.g., identification pin 243)).

[0074] The light emitting fiber terminates at a first optical path opening near the first end. Similarly, the light receiving fiber terminates at a second optical path opening near the second end. The first and second optical path openings face each other and form a light transmission path (e.g., a light beam) for detecting the presence or absence of the peripheral edge of the substrate, other contents, and / or objects (e.g., identification pin 243). The light transmission path extends between the first and second ends (e.g., between two points), thereby enabling the detection of objects in the gap.

[0075] The beam sensor further includes a light emitting / receiving module that detects the light transmission rate between the light emitting fiber and the light receiving fiber. When a substrate or other object obstructs the light transmission path, the light emitting / receiving module senses the peripheral edge of the substrate or other object (e.g., identification pin 243) located between the first and second light path openings. The output signal generated by the light emitting / receiving module is provided to a controller (e.g., controller 109 of Figure 1) via a conductor (not shown) passing through the robot. In some embodiments, the robot may be used to detect the thickness of the identification pin 243. The controller (e.g., controller 109 of Figure 1) may control the robot to cause the light source to provide light transmission (e.g., a beam) between the first and second ends of the end effector. The controller can further cause the end effector to move at a predetermined speed to interrupt the light beam using the identification pin 243 (e.g., the identification pin is along the light transmission path between the first and second ends of the end effector) and continue at the predetermined speed until the light beam is no longer interrupted (e.g., the identification pin 243 is between a portion of the end effector between the first and second ends of the end effector and the light transmission path). The controller can determine the amount of time from the interruption of the light beam until the light beam is no longer interrupted at the predetermined speed. The controller can use a robot to determine the thickness of the identification pin 243 by multiplying the speed of the robot (e.g., the end effector) as it crosses the identification pin 243 in that portion by the amount of time from the interruption of the light beam to the point where the light beam is no longer interrupted. In some embodiments, a thickness difference of approximately two millimeters in the identification pin 243 is sufficient for the robot to detect the difference in identification pin thickness.

[0076] Each housing system 200 may have an identification pin 243 of a predetermined thickness to indicate the type of housing system 200 or the type of contents of the housing system 200. The thickness of the identification pin 243 can be used to determine which object (e.g., carrier 250, processing sleeve ring 252, placement verification wafer 254, etc.) the housing system 200 is configured to support. In some embodiments, the identification pin 243 can be used to determine that the housing system is configured to support an object. For example, an identification pin 243 of a first thickness can indicate that the housing system 200 is configured to support a plurality of processing sleeve rings 252 disposed on a carrier 250. In another example, an identification pin 243 of a second thickness can indicate that the housing system 200 is configured to support a plurality of empty carriers 250. In yet another example, an identification pin 243 of a third thickness can indicate that the housing system 200 is configured to support a placement verification wafer 254.

[0077] In some embodiments, one or more overhead transport components 232 (e.g., overhead transport flanges) or at least one handle 212 are coupled to one or more surfaces of the housing system 200 for transporting (e.g., automated transport, manual transport, etc.) the housing system 200. In some embodiments, the overhead transfer (OTT) component 232 is coupled (e.g., attached) to the housing cover 230. In some embodiments, a handle 212A is provided on a sidewall 210A and a second handle is provided on a sidewall 210B.

[0078] In some embodiments, one or more purge connectors are disposed in the bottom wall 220 (e.g., inserted into an opening formed in the bottom wall 220). The purge connectors are used for one or more of the following: filling the housing system 200 with a gas (e.g., nitrogen (N2)), removing a gas from the housing system, passing a gas through the housing system 200, or the like. The purge connectors extend through the substrate to be fluidly coupled to one or more gas or vacuum lines (e.g., for purifying the housing system 200, for creating a vacuum in the housing system 200, for filling the housing system 200 with a gas, etc.). Each of the purge connectors provides a seal at a corresponding opening in the bottom wall 220 (e.g., for providing a sealed environment). In some embodiments, the housing system 200 is sealed to the loading port in response to docking with the loading port. The internal volume of the housing system 200 is configured to be purged via one or more purge connectors before the housing system 200 is opened.

[0079] Figures 2B to 2C show cross-sectional side views of components of a housing system (e.g., housing system 200) associated with a fixed door according to certain embodiments.

[0080] Referring to Figure 2B, in some embodiments, the door interface portion 248 has a recess 247A (e.g., a latch recess) formed in its inner upper surface. The recess 247A may extend partially through the thickness of the door interface portion 248 from its inner surface without extending to its outer surface, to prevent gas leakage between the exterior and interior volumes of the housing structure. In conventional systems, the latch may be connected to an opening (e.g., a through-hole) interface that extends completely through the entire thickness of the door interface portion 248 (e.g., from the inner to the outer surface), which may allow gas and / or contaminants to leak through the opening.

[0081] As shown in Figure 2B, the recess 247A may extend only partially through the thickness of the door interface portion 248, thereby preventing or reducing air leakage and / or contamination of the housing system 200. In some embodiments, the door interface portion 248 is coupled to the housing cover 230 by fasteners 274 (e.g., a plurality of fasteners 274).

[0082] As shown in Figure 2B, the latch 249A can be interfaced with the surface of the door interface portion 248 forming the recess 247A. In some embodiments, the latch 249A is actuated by a lever. In response to the interface connection between the latch 249A and the recess 247A, the door 246 can be sealed to the surface of the door interface portion 248.

[0083] Referring to Figure 2C, in some embodiments, the door interface portion 248 forms a recess 247B in its lower inner surface. The recess 247B may extend partially through the thickness of the door interface portion 248 from its surface. In some embodiments, the door interface portion 248 includes a boss 251 corresponding to the recess 247B. The boss 251 may be a protrusion on the outer surface of the door interface portion 248 to reinforce the door interface portion 248 opposite to the recess 247B (e.g., and to provide sufficient material to form the recess 247B). In some embodiments, the boss 251 may have an inner fillet. In some embodiments, the door interface portion 248 is coupled to the bottom wall 220 by fasteners 274 (e.g., a plurality of fasteners 274).

[0084] As shown in Figure 2C, the latch 249B may be interfaced with the surface of the door interface portion 248 at the recess 247B. In some embodiments, the latch 249B is actuated by a lever. The latch 249B may be coupled to the latch 249A by a linkage. In response to the interface connection between the latch 249B and the recess 247B, the door 246 may be sealed to the surface of the door interface portion 248.

[0085] Figures 2D to 2E show cross-sectional side views of components of a housing system (e.g., housing system 200) associated with a fastener according to certain embodiments.

[0086] Referring to Figure 2D, in some embodiments, the walls (e.g., of the housing system 200) include fasteners 274, nuts 275, and / or sealing nuts 277. In some embodiments (e.g., as shown in Figure 2D), fasteners 274 are inserted through an opening formed by the bottom wall 220. In some embodiments, fasteners 274 are inserted through openings formed by the side walls 210, the housing cover 230, and / or the rear wall of the housing system 200. In some embodiments, fasteners 274 are threaded fasteners. Nuts 275 may be threaded nuts. In some embodiments, sealing nuts 277 seal the opening through which fasteners 274 are inserted (e.g., the surface of the bottom wall 220). Sealing nuts 277 may include a boss (e.g., a protrusion) that interfaces with a countersunk (e.g., a recess) of the opening formed by the wall. The seal prevents and / or reduces leakage of gas and / or particles between the exterior of the housing structure 200 and the interior volume of the housing structure 200 (e.g., which could contaminate the interior volume of the housing system 200) by means of the opening formed by the wall.

[0087] Referring to Figure 2E, in some embodiments, the housing system (e.g., housing system 200) includes a fastener 274 and a blind-hole nut 276. The blind-hole nut 276 can fasten the fastener 274 to a threaded nut therein. In some embodiments, the blind-hole nut 276 includes a sealing surface configured to abut against the inner surface of the bottom wall 220. The blind-hole nut 276 can seal the opening through which the fastener 274 is inserted.

[0088] Figure 3A shows a top view of a housing system 300 according to some embodiments. Figure 3B shows a rear perspective view of a housing system 300 according to some embodiments. In some embodiments, features having element symbols similar to those in other figures include features and / or functionalities similar to those described in other figures. In some instances, housing system 300 has features and / or functionalities similar to housing system 130 of Figure 1 and / or housing system 200 of Figure 2.

[0089] The housing cover 330 (e.g., housing cover 230 of Figure 2) includes a top window 334 (e.g., top window 234 of Figure 2). Objects disposed within the internal volume of the housing system 300 are visible via the top window 334. In some embodiments, each of the processing sleeve rings 352 (e.g., processing sleeve ring 252 of Figure 2) is visible via the top window 334. In some embodiments, each of the processing sleeve rings 352 is visible from an oblique (e.g., angled) viewpoint (e.g., not upward at 90 degrees to the top window 334). Each of the processing sleeve rings 352 may include one or more features that are visible via the top window 334. In some instances, a flat surface 360 ​​and / or upper surface features (e.g., notches, markings, recesses, etc.) of each of the processing sleeve rings 352 are visible via the top window 334. In some embodiments, the flat surface 360 ​​forms a corresponding flat inner portion of the processing sleeve ring 352. In response to the flat surface 360 ​​not being in the correct position in the view via the upper window 334, the orientation of the processing sleeve ring 352 will be adjusted (e.g., rotated to be in the correct position). In response to the upper surface feature not being visible via the upper window 334, the processing sleeve ring 352 will be flipped (e.g., the upper surface feature is currently oriented downwards and the processing sleeve ring 352 will be flipped to have an upper surface feature oriented upwards).

[0090] Referring to Figure 3B, the housing system 300 has one or more rear walls 314. In some instances, rear wall 314A is coupled (e.g., integrated with it, angularly offset) to a side wall (e.g., side wall 210A in Figure 2) having a handle 312A (e.g., handle 212A in Figure 2), and rear wall 314B is coupled (e.g., integrated with it, angularly offset) to a side wall (e.g., side wall 210B in Figure 2) having a handle 312B (e.g., handle 212A in Figure 2). A rear wall 314C (e.g., a central rear wall) may be disposed between rear walls 314A and rear walls 314B. Rear wall 314C may include a rear window 336, which is removable to adjust the orientation of one or more processing sleeve rings 352 and / or one or more carriers 350. In some embodiments, rear wall 314A has a rear window 336 (e.g., fixed or movable) and / or rear wall 314B has a rear window 336 (e.g., fixed or movable). RFID holder 370 may be removably coupled to the lower portion of rear wall 314C.

[0091] Figures 3C to 3E illustrate components of a housing system 300 (e.g., housing system 130 of Figure 1, housing systems of Figures 2A to 2E, etc.) associated with an RFID holder 370 according to certain embodiments. Figure 3C shows a rear exploded view of the components of the housing system 300 according to certain embodiments. Figure 3D shows a rear view of the components of the housing system 300 according to certain embodiments. Figure 3E shows a side view of the components of the housing system 300 according to certain embodiments.

[0092] In some embodiments, the housing system 300 includes an RFID component 372 (e.g., an RFID pill, an RFID tag, etc.). The RFID component 372 may store and / or broadcast electronic information about the housing system 300 (e.g., inventory of the housing system 300, types of objects the housing system 300 is configured to support, etc.) that will be read by an RFID reader (e.g., a loading port, etc.). In some embodiments, the RFID component 372 is secured (e.g., held therein) by an RFID holder 370. The RFID holder 370 may be configured to secure the RFID component 372 in a vertical orientation and / or a horizontal orientation. The RFID component 372 may be secured in an RFID component recess 373 formed by the RFID holder 370. The RFID component recess 373 may be an internal cavity formed by the RFID holder 370.

[0093] In some embodiments, the RFID holder 370 may be removably coupled to the rear wall 314C at an opening (e.g., opening 371) formed by the rear wall 314C. The opening 371 may be a cutout in the rear wall 314C to minimize interference from the rear wall 314C to signals broadcast by the RFID component 372. Although coupled to the rear wall 314C at the opening 371, the RFID holder 370 may seal the rear wall 314C at the opening 371 to prevent leakage of gases and / or contaminants between the internal volume of the housing system 300 and the external volume of the housing system 300. In some embodiments, a gasket is secured between the RFID holder 370 and the boundary of the rear wall 314C forming the opening 371 to seal the area between the RFID holder 370 and the rear wall 314C at the opening 371. In some embodiments, the RFID holder 370 may be removably coupled to the bottom wall 320 by a fastener 374 and a corresponding blind-hole nut 376. In some embodiments, the RFID holder 370 may be removably coupled by two fasteners 374 and two corresponding blind-hole nuts 376. In some embodiments, the fasteners 374 are non-metallic fasteners. In some embodiments, the fasteners 374 are threaded Nylon fasteners. The fasteners 374 may be made of a material that does not interfere with signals broadcast by the RFID component 372. In some embodiments, the RFID holder 370 is coupled to the base wall 320 behind the substrate 340 of the housing system 300.

[0094] In some embodiments, the RFID holder 370 and the opening formed by the walls of the housing system 300 cause the weight of the housing system 300 to be substantially balanced in response to the housing system 300 being coupled to a transport device (e.g., a robot) via an overhead transport component (e.g., overhead transport component 232 of Figure 2A) (e.g., the RFID holder 370 is configured to act as a counterweight). In some embodiments, the RFID holder 370 is configured to balance the housing system 300 in a near-vertical orientation while the housing system 300 is transported via an overhead transport component. The RFID holder 370 allows the housing system 300 to be balanced within approximately + / - 1 to 10 mm, 1 to 5 mm, or 1 mm off-center while the housing system 300 is coupled to the transport device via the overhead transport component.

[0095] Figure 4A shows a cross-sectional front view of the housing system 400 according to some embodiments. Figure 4B shows a cross-sectional side view of the housing system 400 according to some embodiments. Figure 4C shows a cross-sectional top view of the housing system 400 according to some embodiments. In some embodiments, features having element symbols similar to those in other figures include features and / or functionalities similar to those described in other figures. In some instances, the housing system 400 has features and / or functionalities similar to those of the housing system 130 of Figure 1, the housing system 200 of Figure 2, and / or the housing system 300 of Figures 3A to 3B.

[0096] The housing system 400 includes walls, including one or more side walls 410A-B (e.g., side walls 210A-B in Figure 2), rear walls 414A-C (e.g., rear walls 314A-C in Figure 3B), and a bottom wall 420 (e.g., bottom wall 220 in Figure 2). A housing cover 430 (e.g., housing cover 230 in Figure 1) is configured to couple to one or more walls of the housing system 400 (e.g., via one or more fasteners 374 (e.g., flathead screws)). The housing cover 430 includes an upper window (e.g., upper window 234 in Figure 2, etc.). One or more rear walls 414 include a rear window 436 (e.g., rear window 236 in Figure 2, etc.). One or more rear windows 436 are removable to adjust the orientation of one or more of the carrier 450, the processing sleeve ring 452, and / or the placement of verification wafers 454. The overhead transport component 432 can be coupled to the housing cover 430.

[0097] A support post 440 (e.g., support post 240 in Figure 2) is coupled to a base wall 420 (e.g., via a base connector 442 and one or more fasteners 474). The support post 440 is removably interfaced with a housing cover 430. In some embodiments, a recess 472 is formed on the upper surface of each support post 440, and components 470 of the housing cover 430 (e.g., fasteners 474, protrusions, guide pins, etc.) interface with the recess 472 (e.g., sleeves, plastic sleeves, nylon sleeves, etc.). In some embodiments, the recess 472 is a tapered recess and the component 470 is a tapered protrusion to align the housing cover 430 with the support post 440. A bracket 444 is coupled (e.g., via fasteners 474) to the support post 440. A carrier 450 is disposed on two brackets 444 (e.g., a pair of brackets 444). A verification wafer placement 454 is disposed on two brackets (e.g., a pair of brackets 444). One or more processing sleeve rings are disposed on the carrier 450 (e.g., one or more processing sleeve rings 452 do not contact the bracket 444).

[0098] In some embodiments, the support 444 includes a sloped surface 480A for aligning with a carrier 450 on the support 444. In some embodiments, the support 444 includes recesses 482 (e.g., recesses of a deep recess support 444) formed by sloped surfaces 480B-C to align with a processing sleeve ring 452 on the carrier 450 in response to movement of the housing system 400 (e.g., bumping, rapid movement, etc.). In some embodiments, the support 444 includes alignment features (e.g., alignment feature 445, see Figures 4D-4E) for aligning with a placement verification wafer 454 on the support 444. The alignment features may not interfere with the processing sleeve ring 452 on the carrier 450 disposed on the support. The alignment features may allow the support 444 to support the carrier 450 for placing the verification wafer 454 or holding the processing sleeve ring 452. In some embodiments, the support forms alignment features.

[0099] Referring to Figure 4B, each bracket 444 may be coupled (e.g., fastened, attached, etc.) to two pillars 440. The two pillars 440 are coupled to the base wall 420 via the same base connector 442. In some embodiments, the housing door 490 is configured to be removably coupled (e.g., attached, clamped, sealed, etc.) to one or more walls and / or housing covers 430 of the housing system 400.

[0100] Referring to Figure 4C, the processing sleeve ring 452 has a flat surface 460 (e.g., the flat surface 360 ​​of Figure 3A, a flat inner surface, etc.) and / or upper surface features 462 (e.g., notches, markings, recesses, etc.) of each of the processing sleeve ring 452 that will be visible via the upper window. In some embodiments, the processing sleeve ring 452 includes corresponding features (e.g., upper surface peripheral notches, steps on the upper surface of the processing sleeve ring 252 near the inner diameter of the processing sleeve ring, steps between the upper surface of the processing sleeve ring and the inner sidewall). In response to the flat surface 460 not being in the correct position in the view via the upper window 334, the orientation of the processing sleeve ring 452 will be adjusted (e.g., rotated to be in the correct position). In response to the upper surface feature 462 not being visible, the processing sleeve ring 452 will be flipped (e.g., such that the upper surface feature 462 is oriented upwards instead of downwards). In some embodiments, the carrier has a carrier feature 464 (e.g., a recess, a cutout) disposed near a flat surface 460 of the processing sleeve ring 452. The carrier feature 464 is visible through a top window of the housing cover to determine whether the carrier 450 is correctly oriented. In some embodiments, the carrier 450 includes fingers 492 that support the processing sleeve ring 452.

[0101] Figures 4D to 4E show perspective views of components of a housing system 400 (e.g., housing system 130 of Figure 1, housing system 200 of Figures 2A to 2E, housing system 300 of Figures 3A to 3E, etc.) according to certain embodiments.

[0102] In some embodiments, a pair of supports 444 are configured to support a test wafer 454 in response to a test wafer 454 being disposed on the pair of supports 444, and are configured to support a carrier 450 in response to a processing sleeve ring 452 disposed on one or more supports 444, the carrier supporting the processing sleeve ring 452.

[0103] In some embodiments, the pair of holders 444 includes alignment features 445 for aligning the placement verification wafer 454 on the holder 444. In response to the processing sleeve ring 452 and / or carrier being positioned on the holder 444 (as shown in Figure 4E), the alignment features may not interfere with the processing sleeve ring 452 and / or carrier 450. In some embodiments, the alignment features 445 are wedge-shaped features on the top surface of the holder 444 adjacent to the inclined surface 480C. The alignment features 445 can align the placement verification wafer 454 on the holder 444 by holding the edge of the placement verification wafer in a lateral position (e.g., side-to-side position, see Figure 4D). In some embodiments, the alignment features 445 are used to align the placement verification wafer 454 in a predetermined position and hold the placement verification wafer 454 in the predetermined position during movement of the housing system 400 (e.g., during bumps, rapid movement, etc.). Referring to Figure 4E, the alignment features 445 may be disposed within the inner radius of the processing sleeve ring 452. Alignment feature 445 may not interfere with processing sleeve ring 452 and / or carrier 450.

[0104] Figure 5 illustrates a method 500 using a housing system according to certain embodiments. In some embodiments, one or more operations of method 500 are performed by a robotic arm (e.g., the robotic arm of the factory interface robot 111 in Figure 1), an overhead transport robot, and / or by a controller (e.g., the controller 109 in Figure 1). Although illustrated in a specific sequence or order, the process order may be modified unless otherwise stated. Therefore, the illustrated embodiments should be understood as examples only, and the illustrated processes may be performed in different orders, and some processes may be performed in parallel. Furthermore, one or more processes may be omitted in various embodiments. Therefore, not all processes are included in each embodiment.

[0105] Referring to method 500 of Figure 5, at block 502, the housing cover is removably attached (e.g., via fasteners, via clamps, etc.) to one or more walls (e.g., one or more side walls and / or one or more rear walls) of the housing system to at least partially enclose the internal volume of the housing system.

[0106] In block 504, a corresponding upper surface of each pillar disposed within the internal volume corresponds to a corresponding component of the housing cover. In some embodiments, the pillars are coupled to the bottom wall of the housing system (e.g., via a base connector and / or fasteners). The upper surface of each pillar may form a recess, and the corresponding component of the housing cover may be a protrusion that interfaces with the recess. In some embodiments, the recess of the pillar is a tapered recess and / or the corresponding component of the housing cover is a tapered protrusion. The tapered recess and / or tapered protrusion are configured to align the pillar with the housing cover.

[0107] At block 506, an object is mounted on a support disposed within the internal volume. In some embodiments, a carrier supporting one or more processing sleeve rings is mounted on two planar supports. In response to placing the carrier on two supports, the one or more processing sleeve rings supported by the carrier may not contact the two supports. In some embodiments, a verification wafer is mounted on two substantially coplanar supports.

[0108] At block 508, the door is secured to the housing system. In some embodiments, block 508 includes a latch that actuates the door to engage the latch with a recess formed in the door interface portion of the housing system.

[0109] At block 510, at least a portion of the housing system (e.g., an overhead transport component, a handle, etc.) is secured for transporting the housing system. In some embodiments, the overhead transport (OTH) vehicle lifts the housing system via the overhead transport component. The RFID holder may be configured to act as a counterweight for the housing system to balance it, while being supported by the OHT vehicle.

[0110] At block 512, orientation verification of the object is performed via an upper window provided in the housing cover. Orientation verification can be performed by determining whether the flat portion of the processing sleeve ring and the carrier features (e.g., notches) of the carrier are correctly aligned in the upper window. Orientation verification can be further performed by determining whether the upper surface features of the processing sleeve ring are visible through the upper window (e.g., verifying that the processing sleeve ring is not flipped).

[0111] At block 514, an RFID component is inserted into an RFID holder. The RFID holder may be coupled to the rear wall of the housing system. In some embodiments, the RFID component may be inserted into the RFID holder in a horizontal or vertical orientation. An RFID reader (e.g., at the loading port) may read the RFID component in response to insertion of the RFID component into the RFID holder.

[0112] At block 516, a rear window disposed in the rear wall of the wall is removed to adjust the orientation (e.g., rotation) of one or more objects. In some embodiments, block 512 responds to errors in determining the orientation via the upper window.

[0113] In some embodiments, each of the operations of method 500 is performed while maintaining a sealed environment in the plant interface.

[0114] Unless otherwise specifically stated, terms such as “attach,” “load,” “remove,” “interface connection,” “fix,” “transport,” “move,” “lower,” “cause,” “remove,” “place,” “set,” “actuate,” “position,” “close,” “lock,” “align,” “insert,” or similar refer to actions and processes performed or implemented by a computer system that manipulate and transform data representing physical (electronic) quantities in the registers and memory of a computer system into other data representing physical quantities in the memory or registers or other such information storage, transmission, or display devices of a computer system. Furthermore, as used herein, the terms “first,” “second,” “third,” “fourth,” etc., are designations for distinguishing different elements and, according to their numerical designations, do not have ordinal meaning.

[0115] The examples described herein also relate to an apparatus for performing the methods described herein. In some embodiments, this apparatus is specifically configured to perform the methods described herein, or includes a general-purpose computer system designed by means of computer programs selectively programmed by means of computer programs stored in a computer system. In some embodiments, such computer programs are stored in a computer-readable tangible storage medium.

[0116] The methods and illustrative examples described herein are not inherently related to any particular computer or other device. Various general-purpose systems may be used in accordance with the teachings described herein, or more specialized devices may be constructed to perform the methods described herein and / or each of their individual functions, norms, sub-norms, or operations. Examples of structures for various such systems are set forth in the foregoing description.

[0117] The foregoing description sets forth several specific details, such as examples of specific systems, components, methods, etc., to provide a good understanding of several embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure can be practiced without such specific details. In other instances, well-known components or methods are not described in detail and are provided in a simple block diagram format to avoid unnecessarily obscuring the present disclosure. Therefore, the specific details set forth are merely exemplary. Specific implementations may be modified from such exemplary details and still contemplated within the scope of the present disclosure.

[0118] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the phrases "in an embodiment" or "in one embodiment" appearing in various places throughout this specification do not necessarily refer to the same embodiment. Additionally, the term "or" is intended to mean an inclusive "or" rather than an exclusionary "or". When the terms "about" or "approximately" are used herein, it is intended to mean that the provided nominal values ​​are accurate within ±10%.

[0119] Although the operations of the methods herein are illustrated and described in a specific order, the order of operations of each method may be changed, such that some operations are executed in reverse order, or that some operations are executed at least partially concurrently with other operations. In another embodiment, instructions or sub-operations of different operations are performed intermittently and / or alternately.

[0120] As used herein, the terms “above,” “below,” “between,” “on,” and “above” refer to the relative position of a material layer or component with respect to other layers or components. For example, a layer disposed on, above, or below another layer may be in direct contact with other layers or may have one or more intercalation layers. Furthermore, a layer disposed between two layers may be in direct contact with both layers or may have one or more intercalation layers. Similarly, unless otherwise expressly stated, a feature disposed between two features may be in direct contact with the adjacent feature or may have one or more intercalation layers.

[0121] It will be understood that the above description is intended to be illustrative and not restrictive. Numerous other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. Therefore, the scope of this disclosure should be determined by reference to the entire scope of the appended claims and their equivalents. [Simplified Explanation of the Diagram]

[0007] This disclosure is illustrated by way of example in the accompanying drawings and is not intended to be limiting, in which like references designate similar elements. It should be noted that in this disclosure, different references to "an" or "one" embodiments are not necessarily the same embodiments, and such references imply at least one.

[0008] Figure 1 illustrates a processing system according to certain embodiments.

[0009] Figure 2A shows a perspective view of a housing system according to certain embodiments.

[0010] Figures 2B to 2C show cross-sectional side views of components of a housing system associated with a fixed door according to certain embodiments.

[0011] Figures 2D to 2E show cross-sectional side views of components of a housing system associated with fastening according to certain embodiments.

[0012] Figure 3A shows a top view of a housing system according to certain embodiments.

[0013] Figure 3B shows a rear perspective view of a housing system according to certain embodiments.

[0014] Figure 3C shows a rear exploded view of the components of a housing system according to certain embodiments.

[0015] The 3D figure shows a rear view of the components of the housing system according to certain embodiments.

[0016] Figure 3E shows a side view of components of a housing system according to certain embodiments.

[0017] Figure 4A shows a cross-sectional front view of the housing system according to certain embodiments.

[0018] Figure 4B shows a cross-sectional side view of the housing system according to certain embodiments.

[0019] Figure 4C shows a cross-sectional top view of the housing system according to certain embodiments.

[0020] Figures 4D to 4E show perspective views of components of a housing system according to certain embodiments.

[0021] Figure 5 illustrates a method of using a housing system according to certain embodiments. [Biomaterial Storage]

[0123] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A housing system comprising: a plurality of walls, including a plurality of side walls and a bottom wall; a housing cover configured to be removably attached to one or more of the plurality of side walls, wherein the plurality of side walls and the housing cover at least partially enclose an internal volume of the housing system; a top window disposed in the housing cover, wherein the top window is configured for orientation verification of a plurality of objects disposed in the internal volume; a radio frequency identification (RFID) holder coupled to a rear wall of the plurality of side walls and configured to seal an opening formed in the rear wall, wherein the RFID holder is configured to secure an RFID component; and a plurality of supports disposed in the internal volume, wherein each of the plurality of supports is configured to support a corresponding object of the plurality of objects.

2. The housing system as claimed in claim 1, wherein a first subgroup of the plurality of supports and a second subgroup of the plurality of supports are oriented relative to each other in the internal volume.

3. The housing system as claimed in claim 1, further comprising a rear window disposed in the rear wall, wherein the rear window is removable for orientation adjustments of one or more of the plurality of objects.

4. The housing system as claimed in claim 1, further comprising: an overhead transport component coupled to a top surface of the housing cover, the overhead transport component being configured to be secured for transporting the housing system, wherein the RFID holder is configured to function as a counterweight to balance the housing system and maintain an approximately vertical orientation of the housing system during transport.

5. The housing system as claimed in claim 1, further comprising: an identification pin extending from the bottom wall into the internal volume, wherein the identification pin is configured to be scanned by a factory interface robot to determine one or more types of the plurality of objects disposed in the internal volume.

6. The housing system as claimed in claim 1, further comprising: a door interface portion forming one or more front openings for transferring the plurality of objects between the internal volume and an equipment front-end module (EFEM), and wherein the door interface portion forms a recess for engaging with a latch interface of a door.

7. The enclosure system as claimed in claim 2, wherein: The plurality of objects includes a carrier configured to support one or more of the plurality of objects; the carrier is disposed on a first support of a first subgroup of the plurality of supports and a second support of a second subgroup of the plurality of supports; and the carrier disposed on the first support and the second support is configured to support one or more processing sleeve rings, wherein the one or more processing sleeve rings do not contact the first support and the one or more processing sleeve rings do not contact the second support.

8. The housing system of claim 1, wherein the plurality of objects includes a plurality of processing sleeve rings supported by a plurality of carriers disposed on the plurality of supports, wherein each of the processing sleeve rings includes a corresponding flat interior portion visible through the upper window for orientation verification of the plurality of processing sleeve rings.

9. The housing system of claim 1, wherein the plurality of objects includes a plurality of processing sleeve rings supported by a plurality of carriers disposed on the plurality of supports, wherein each of the processing sleeve rings includes a corresponding feature visible through the upper window to verify that a corresponding upper surface of each of the processing sleeve rings is oriented upward.

10. The housing system of claim 1, wherein one or more of the plurality of supports form a plurality of alignment features configured to align a verification wafer in response to a verification wafer being disposed on the one or more supports, and wherein the one or more supports are configured to support a carrier and a processing sleeve ring in response to a carrier and a processing sleeve ring being disposed on the one or more supports.

11. A housing system comprising: a plurality of walls, including a plurality of side walls and a bottom wall; a housing cover configured to be removably attached to one or more of the plurality of side walls, wherein the plurality of side walls and the housing cover at least partially enclose an internal volume of the housing system; a plurality of supports disposed in the internal volume of the housing system, the plurality of supports being fixed to the bottom wall of the housing system, wherein each of the plurality of supports forms a corresponding recess for removably connecting to a corresponding part of the housing cover; and a plurality of brackets, wherein each of the plurality of brackets is configured to support a corresponding object of the plurality of objects, wherein each of the plurality of brackets is fixed to at least one corresponding support of the plurality of supports.

12. The housing system of claim 11, wherein a corresponding upper surface of each of the plurality of pillars forms a tapered recess configured to receive a tapered protrusion coupled to the housing cover to align each of the plurality of pillars with the housing cover.

13. The housing system of claim 11, wherein a first subgroup of the plurality of supports is fixed to a first subgroup of the plurality of pillars, and wherein a second subgroup of the plurality of supports is fixed to a second subgroup of the plurality of pillars.

14. The housing system of claim 13, wherein the plurality of objects includes a carrier configured to support one or more of the plurality of objects, wherein the carrier is disposed on a first support of a first subgroup of the plurality of supports and a second support of a second subgroup of the plurality of supports.

15. The housing system of claim 13, wherein the plurality of objects comprises a verification wafer disposed on a first support of a first subgroup of the plurality of supports and a second support of a second subgroup of the plurality of supports.

16. The housing system of claim 11, further comprising: an overhead transport component coupled to an upper surface of the housing cover, wherein the overhead transport component is configured to be fixed for transporting the housing system; and a radio frequency identification (RFID) holder coupled to a rear wall of the plurality of sidewalls, wherein the RFID holder is configured to hold an RFID component, wherein the RFID holder is configured to function as a counterweight to balance the housing system to maintain an approximately vertical orientation of the housing system during transport.

17. A method of using a housing system, comprising the steps of: removably attaching a housing cover to one or more of a plurality of walls of a housing system; loading a plurality of objects onto a plurality of supports disposed in an internal volume formed by the housing system, wherein an upper window disposed in the housing cover is configured for orientation verification of the plurality of objects; and inserting a radio frequency identification (RFID) component into an RFID holder coupled to a rear wall of the plurality of walls and configured to seal an opening formed in the rear wall.

18. The method of claim 17, wherein the step of loading the plurality of objects on the plurality of supports comprises the step of: loading a verification wafer onto one or more supports of the plurality of supports, wherein a plurality of alignment features of the one or more supports are configured to align the verification wafer on the one or more supports.

19. The method of claim 17 further comprises the step of: actuating a latch of a door to interface the latch with a recess formed in a door interface portion of the housing system.

20. The method of claim 17 further comprises the step of: removably interface-connecting a corresponding upper surface of each of the plurality of supports disposed in the internal volume to a corresponding component of the housing cover, wherein each of the plurality of supports is secured to at least one of the plurality of supports.

Images