Electronic device and antenna device

Abstract

This invention discloses an antenna device. The antenna device includes a first substrate, an antenna element, a second substrate, a circuit structure, and a conductive structure. The antenna element is disposed on one side of the first substrate, and the second substrate is disposed on the other side of the first substrate. The conductive structure includes at least one through-hole penetrating the second substrate and a conductive element disposed in the through-hole. At least a portion of the conductive structure electrically connects the antenna element and the circuit structure, and the antenna element is correspondingly electrically connected to the electronic components.

Description

Electronic devices and antenna devices This invention relates to an electronic device, and more particularly to an antenna device with a thin profile. With the advancement of communication technology, its application in technological products is increasing, leading to a greater diversification of related communication products. In particular, in recent years, consumers have increasingly higher demands for the functionality of communication products, resulting in the continuous emergence of many communication products with different designs and functions. Electronic products with wireless communication capabilities have become a recent hot trend. Furthermore, the increasing maturity of integrated circuit technology has led to a gradual trend towards thinner and smaller product sizes. In communication products, antennas used in wireless communication electronic devices must be small in size, high in performance, and low in cost to gain widespread market acceptance. Among various antennas, patch antennas have the following advantages: 1. They have a planar structure, making them easy to integrate with components and circuits into modules. 2. They are small in size, low in height, lightweight, and easy to manufacture, making them suitable for mass production of printed circuits. 3. They are easy to design with linear polarization, circular polarization, dual-band, and wideband characteristics, thus becoming increasingly common in wireless product applications. Furthermore, with the increasing development of low-Earth orbit satellites, the demand for phased array antennas has also emerged. Therefore, the industry is still considering solutions to the thickness problem of patch antennas, related devices (such as using patch antennas to form phased array antenna structures), and diversified applications (such as fields involving the integration of heterogeneous materials). The purpose of this invention is to provide an electronic device and antenna device with the advantage of thinness, which can meet the current demand for thinness in electronic products. Another object of the present invention is to provide a heterogeneously integrated electronic device and antenna device. To achieve the above objectives, an electronic device according to the present invention includes a first substrate, a metal unit, a second substrate, a circuit structure, electronic components, and one or more conductive structures. The first substrate defines a first surface and a second surface opposite to each other; the metal unit is disposed on the first surface of the first substrate; the second substrate is disposed on the second surface of the first substrate and defines a connection surface connecting to the first substrate and an actuating surface opposite to the connection surface; the electronic components are disposed on the actuating surface of the second substrate and electrically connected to the circuit structure; each conductive structure includes at least one through-hole penetrating the second substrate and a conductive element disposed in the through-hole; wherein, one conductive structure electrically connects the metal unit and the circuit structure, and the metal unit corresponds to the electronic component; the first substrate and the second substrate are made of different materials. In one embodiment, the first substrate is a rigid plate. In one embodiment, the first substrate includes glass, polytetrafluoroethylene, glass fiber epoxy resin, or ceramic material. In one embodiment, the second substrate is a flexible plate. In one embodiment, the second substrate comprises a polyimide material. In one embodiment, the perforation of each conductive structure further penetrates the first substrate. In one embodiment, the first substrate has one or more internal conductive structures along a normal direction perpendicular to one of the first surfaces. Each internal conductive structure includes a through-hole and an internal conductive element disposed in the through-hole and electrically connected to a signal layer. The signal layer is located between the first substrate and the second substrate, and the internal conductive structures are electrically connected to the signal layer and the conductive structures. In one embodiment, there is a ground plane that is electrically connected to the electronic components. In one embodiment, the ground layer has a tin, gold, copper or silver material, or an alloy or eutectic containing any of the above materials. In one embodiment, the conductive elements of each conductive structure are independent of each other from the ground layer. In one embodiment, the ground layer is located between the first substrate and the second substrate. In one embodiment, a ground layer is disposed on a first surface of a first substrate. In one embodiment, one of the electronic components is electrically connected to a line structure at its signal terminal and electrically connected to a ground layer at its other signal terminal. In one embodiment, some of the conductive structures are electrically connected to a ground layer; one signal terminal of the electronic component is electrically connected to a circuit structure, and its other signal terminal is electrically connected to the ground layer through one of the conductive structures. In one embodiment, the electronic component is a driver. An antenna device according to the present invention includes a first substrate, a plurality of antenna elements, a second substrate, a circuit structure, a plurality of electronic components, and a plurality of conductive structures. The first substrate defines a first surface and a second surface opposite to each other; the antenna elements are disposed on the first surface of the first substrate; the second substrate is disposed on the second surface of the first substrate and defines a connection surface connecting to the first substrate and an actuating surface opposite to the connection surface; the circuit structure is disposed on the second substrate; each conductive structure includes at least one through-hole penetrating the second substrate and a conductive element disposed in the through-hole; wherein at least a portion of the conductive structures electrically connects the antenna elements and the circuit structure, and the antenna elements are correspondingly electrically connected to the electronic components. In one embodiment, the first substrate is a rigid plate. In one embodiment, the first substrate includes glass, polytetrafluoroethylene, glass fiber epoxy resin, or ceramic material. In one embodiment, the second substrate is a flexible plate. In one embodiment, the second substrate comprises a polyimide material. In one embodiment, the perforation of each conductive structure further penetrates the first substrate. In one embodiment, the first substrate has one or more internal conductive structures along a normal direction perpendicular to one of the first surfaces. Each internal conductive structure includes a through-hole and an internal conductive element disposed in the through-hole and electrically connected to a signal layer. The signal layer is located between the first substrate and the second substrate, and the internal conductive structures electrically connect the antenna elements and the conductive structures. In one embodiment, there is a ground plane that is electrically connected to the electronic components. In one embodiment, the ground layer has a tin, gold, copper or silver material, or an alloy or eutectic containing any of the above materials. In one embodiment, the conductive elements of each conductive structure are independent of each other from the ground layer. In one embodiment, the ground layer is located between the first substrate and the second substrate. In one embodiment, a ground layer is disposed on a first surface of a first substrate. In one embodiment, one of the electronic components is electrically connected to a line structure at its signal terminal and electrically connected to a ground layer at its other signal terminal. In one embodiment, some of the conductive structures are electrically connected to a ground layer; one signal terminal of the electronic component is electrically connected to a circuit structure, and its other signal terminal is electrically connected to the ground layer through one of the conductive structures. In one embodiment, the electronic component is a driver. In one embodiment, the driver is a radio frequency integrated circuit. In one embodiment, the electronic component is a variable capacitor. The following description, with reference to the accompanying drawings, illustrates electronic devices and antenna devices according to some embodiments of the present invention, wherein the same elements are described using the same reference numerals. The drawings in the following embodiments are merely schematic representations of the relative relationships between elements or units and do not represent the actual dimensions or proportions of the elements or units. Please refer to Figures 1A and 1B, where Figure 1A is a perspective cross-sectional view of an electronic device according to an embodiment of the present invention, and Figure 1B is a schematic diagram of the electronic device in Figure 1A. The electronic device 1 includes a first substrate 11, one or more metal units 12, a second substrate 13, a circuit structure 17, an electronic component 18, and one or more conductive structures 15. One of the conductive structures 15 is electrically connected to the metal unit 12 and the circuit structure 17. Each conductive structure 15 includes at least one through-hole H1 penetrating the second substrate 13 and a conductive element 151 disposed in the through-hole H1. The metal unit 12 is correspondingly electrically connected to the electronic component 18. The first substrate 11 and the second substrate 13 are made of different materials. The first substrate 11 has a first surface S1 and a second surface S2 facing each other. Here, the first surface S1 of the first substrate 11 is the upper surface, and the second surface S2 is the lower surface. The first substrate 11 can be a flexible board, a rigid board, or a composite board, and its material may include, for example, glass, glass fiber epoxy resin (FR4), low temperature co-fired ceramic (LTCC), polyimide (PI), polytetrafluoroethylene (PTFE), polyoxymethylene (PPO / PPE), or a substrate composed of at least the aforementioned materials. Furthermore, the first substrate 11 can be a single-layer substrate, a multi-layer substrate, or a composite substrate. In this embodiment, the first substrate 11 is a rigid board, and for example, a single-layer glass substrate is used as an example. The metal unit 12 can be an electrical layer that simply provides electrical connections, or a circuit layer that provides specific electrical functions. It can be an antenna module containing one or more antenna elements, or a single antenna element. In this embodiment, each metal unit 12 is an example of an antenna element, which is disposed on the first surface S1 of the first substrate 11. In some embodiments, the surface of the antenna element can be planar or non-planar; in this embodiment, the antenna element is a planar antenna. In some embodiments, the shape of the antenna element can be polygonal (e.g., quadrilateral), circular, oval, sector-shaped, or ring-shaped; in this embodiment, the shape of the antenna element is quadrilateral (e.g., square). In some embodiments, the first substrate 11 may further include a circuit layer electrically connected to the metal units 12, which is not limited herein. The second substrate 13 can be disposed directly or indirectly on the second surface S2 of the first substrate 11. The second substrate 13 defines a connecting surface S3 connecting to the first substrate 11 and an actuating surface S4 opposite to the connecting surface S3. Here, the second substrate 13 can be attached to the lower surface of the first substrate 11, for example, by adhesive bonding (insulating adhesive not shown). The second substrate 13 can be a flexible board, a rigid board, or a composite board, and may include, for example, glass, fiberglass epoxy resin (FR4), ceramic, polyimide (PI), polytetrafluoroethylene (PTFE), polyoxymethylene (PPO / PPE), or a substrate made of a composite material including at least the aforementioned materials. This embodiment uses a flexible board, specifically a PI substrate, as an example. The circuit structure 17 is disposed on the second substrate 13. In this embodiment, the circuit structure 17 is disposed on the lower surface (acting surface S4) of the second substrate 13 away from the first substrate 11, but it is not limited thereto. In different embodiments, the circuit structure 17 may also be disposed on the upper surface (connection surface S3) of the second substrate 13 facing the first substrate 11, or simultaneously disposed on both surfaces facing and away from the first substrate 11; or, further, disposed on the inner side of the second substrate 13. The present invention is not limited thereto. In some embodiments, the circuit structure 17 may include a conductive layer and / or wires for transmitting electrical signals, so that the second substrate 13 can serve as a driving circuit board. In some embodiments, the material of the circuit structure 17 may include, for example, metals such as gold, copper, or aluminum, or any combination thereof, or alloys of any combination thereof, or other conductive materials. The conductive structure 15 includes at least one through-hole H1 penetrating the second substrate 13, and a conductive element 151 disposed in the through-hole H1, and electrically connects the metal unit 12 and the circuit structure 17. The through-hole H1 may further penetrate the first substrate 11, as shown in Figures 1A and 1B. Furthermore, the conductive structure 15 and a ground layer 14 (described further below) are electrically independent of each other, for example, electrically insulated; it is worth noting that electrical insulation means that the conductive structure 15 is not electrically connected by other circuits or electronic components. The conductive element 151 includes, for example, but not limited to, tin, gold, copper, or silver, or alloys or eutectic materials containing any of the above materials, or other conductive metal materials. The aforementioned metal material is positioned in the perforation H1 by spraying, coating, high-temperature heat fusion (e.g., laser melting), or electroplating, and the conductive material can cover the entire perforation H1. Alternatively, the conductive element 151 can be in the form of a sleeve, post, pin, or needle. In this embodiment, the conductive element 151 further includes a large-diameter portion 15x and a small-diameter portion 15y. The large and small diameters are determined by comparing the two. The small-diameter portion 15y is electrically connected to the metal unit 12 (antenna element). The maximum width of the large-diameter portion 15x is greater than the aperture of the perforation H1, and the large-diameter portion 15x at least covers and is electrically connected to a portion of the circuit structure 17. It is understood that the conductive structure 15 can be directly or indirectly electrically connected to the metal unit 12. Indirect connection is, for example, the conductive structure 15 is electrically connected to the metal unit 12 through the circuit structure of the first substrate 11. In some embodiments, the conductive element 151 can be integrated into the metal unit 12 (antenna element) as a single molded component, or it can be independent of the metal unit 12 (antenna element). It is worth noting that the metal unit 12 (antenna element) is not limited to covering the through-hole H1; in some embodiments, a circuit structure is arranged on the first surface S1 of the first substrate 11, the metal unit 12 (antenna element) is electrically connected to the aforementioned circuit structure, and the aforementioned circuit structure covers the through-hole H1 (not shown); in some embodiments, the metal unit 12 (antenna element) and the through-hole H1 are adjacent to each other and are electrically connected via the aforementioned circuit structure (not shown). It is worth noting that the conductive element 151 can be a selection or combination of the aforementioned states, or one combination thereof. The conductive element 151 can be directly or indirectly electrically connected to the metal unit 12 (antenna element), and can meet the requirements of good impedance matching, low transmission loss, low radiation effect, sufficient bandwidth, and power capacity with the metal unit 12 (antenna element). Electronic component 18 is disposed on the second substrate 13 and may be a driving element, an active element, a passive element, an active circuit, or a passive circuit. In some embodiments, electronic component 18 is disposed on the actuating surface S4 of the second substrate 13. In some embodiments, electronic component 18 may include a power amplifier (PA), a low noise amplifier (LNA), a variable capacitor (e.g., a varactor), a passive element, or any combination thereof; it is worth noting that the type or number of the aforementioned electronic components is not limited. In some embodiments, one or more electronic components 18 may be high-frequency components. Here, "high frequency" can be defined as a frequency range between 3MHz and several hundred GHz; in some embodiments, electronic component 18 may include, but is not limited to, power amplifier circuits and / or low noise amplifier circuits made of materials such as gallium arsenide (GaAs), gallium nitride (GaN), indium phosphide (InP), or combinations thereof; in some embodiments, one or more electronic components 18 may be passive components, such as resistor-inductor-capacitor (RLC) circuits; in some embodiments, one or more of the electronic components 18 may be flip-chip circuits. The electronic components 18 are surface-mount devices (SMDs). In some embodiments, one or more of these electronic components 18 may be thin-film devices fabricated using thin-film processes, such as thin-film transistors (TFTs). The thin-film processes may be semiconductor processes such as low-temperature polycrystalline silicon (LTPS), high-temperature polycrystalline silicon (HTPS), low-temperature polycrystalline oxide (LTPO), or indium gallium zinc oxide (IGZO). In some embodiments, one or more of these electronic components 18 may be a radio frequency integrated circuit or a driver integrated circuit (driver IC), such as including silicon or non-silicon integrated circuits. The radio frequency integrated circuit may be, for example, a silicon-based radio frequency integrated circuit (Silicon RFIC) or a non-silicon radio frequency integrated circuit (non-Silicon RFIC, such as a gallium arsenide single-crystal microwave integrated circuit, GaAs MMIC) to drive the antenna unit 12 to transmit wireless signals. This invention does not limit the type or variety of electronic components 18. Therefore, the signal (e.g., radio frequency signal) emitted by the electronic component 18 can be electrically connected to the metal unit 12 (antenna element) via the circuit structure 17 and the conductive structure 15, so as to transmit the signal (radio frequency signal) through the metal unit 12 (antenna element). Here, electronic component 18 is exemplified as a flip-chip device. One signal terminal E1 of electronic component 18 is electrically connected to the circuit structure 17 of the second substrate 13, and the other signal terminal E2 of electronic component 18 is electrically connected to another electrical layer (e.g., a ground layer). In some embodiments, electronic component 18 may include at least one signal terminal E1 or at least one signal terminal E2 (which may be one or more signal terminals E1, E2). In some embodiments, electronic component 18 is exemplified as a surface mount device (SMD), but is not limited thereto. Surface mount technology (SMT) is used to electrically connect signal terminal E1 to the circuit structure 17, while signal terminal E2 is electrically connected to another electrical layer, and both are electrically connected through a conductive material 155. The conductive material 155 may include tin, gold, copper, or silver, or an alloy or eutectic containing any of the above materials, or other conductive metallic materials, and is not limited thereto. In some embodiments, the signal terminals E1 and E2 of electronic component 18 may also be eutecticly connected by high-temperature thermal melting, such as laser melting, and the materials may also be as described above. In this embodiment, the signal terminal E2 is electrically connected to another electrical layer (e.g., ground layer 14) through another through hole H1' of the second substrate 13, the conductive material 155, and a conductive element (not shown) disposed in the other through hole H1'. However, this is not the limitation. In different embodiments, conductive lines, conductive materials, or conductive layers may be disposed on the side of the second substrate 13 adjacent to the signal terminal E2, so that the signal terminal E2 can be electrically connected to another electrical layer (ground layer 14) through conductive lines, conductive materials, or conductive layers or other similar connection means located on the side of the second substrate 13. The electronic device 1 in this embodiment further includes a ground layer 14, which is electrically connected to the electronic components 18. The ground layer 14 may be located on the first surface S1 of the first substrate 11, or between the first substrate 11 and the second substrate 13, or on the actuating surface S4 of the second substrate 13; wherein, between the first substrate 11 and the second substrate 13, a ground metal layer may be located between them, or the ground layer 14 may be disposed on the second surface S2 of the first substrate 11 or the connecting surface S3 of the second substrate 13. In this embodiment, the ground layer 14 is disposed on the second surface S2 of the first substrate 11. Therefore, the ground layer 14 is disposed on the second surface S2 of the first substrate 11, and the second substrate 13 is attached to the first substrate 11 having the ground layer 14, so that the ground layer 14 is sandwiched between the first substrate 11 and the second substrate 13. In some embodiments, the number of ground layers 14 may be more than one, or the ground layer 14 may be disposed inside the substrate. In some embodiments, the ground layer 14 may be made of tin, gold, copper, or silver, or an alloy or eutectic containing any of the above materials, or other conductive metallic materials, without limitation. As described above, one signal terminal E1 of the electronic component 18 is electrically connected to the circuit structure 17, and the other signal terminal E2 can be electrically connected to the ground layer 14. When the ground layer 14 and the electronic component 18 are not located on the same side or in the same layer, the other signal terminal E2 can be electrically connected to the ground layer 14 through one of the conductive structures 15. Continuing from the above, in the electronic device 1 of this embodiment, a metal unit 12 (antenna element) is disposed on the first surface S1 of the first substrate 11, and a second substrate 13 is disposed on the second surface S2 of the first substrate 11. An electronic component 18 is placed on the second substrate 11, and a conductive structure 15 is electrically connected to the circuit structure 17 located on the metal unit 12 on the first substrate 11 and the second substrate 13. Through the conductive structure 15, the signal emitted by the electronic component 18 on the second substrate 13 can be transmitted to the metal unit 12 (antenna element) via the circuit structure 17 and the conductive structure 15. Therefore, this compact component configuration is suitable for the current demand for thinner electronic products; and this configuration also allows the first substrate 11 and the second substrate 13, made of different materials, to achieve electrical connection. It is worth noting that this compact component configuration can also meet the requirements of high-frequency signals, such as good impedance matching, low transmission loss, low radiation effect, sufficient bandwidth, and power capacity. Figures 2 to 5 are schematic diagrams of electronic devices according to different embodiments of the present invention. As shown in Figure 2, the main difference from the electronic device 1 in the previous embodiment is that the conductive part 151a of the electronic device 1a in this embodiment does not fill the through hole H1. The small diameter part 15y is electrically connected to the metal unit 12 (antenna element), while the maximum width of the large diameter part 15x is greater than the diameter of the through hole H1. Furthermore, as shown in Figure 3, the main difference from the electronic device 1 or 1a in the aforementioned embodiments is that, in the electronic device 1b of this embodiment, a wire is provided to electrically connect the metal unit 12 (antenna element) to the conductive structure 15. Here, the metal unit 12 (antenna element) of this embodiment has a through-hole H2, and the conductive element 151b is a circuit structure 17 electrically connecting the metal unit 12 (antenna element) to the second substrate 13 through the through-hole H2 and the through-hole H1. The diameters of the through-hole H2 and the through-hole H1 are not limited to being the same, nor are they limited to being center-aligned. The conductive element 151b of this embodiment includes a small-diameter portion 15y' and two large-diameter portions 15x', with one large-diameter portion 15x' disposed and covering the through-hole H2. In some embodiments, the small-diameter portion 15y' is a wire that may or may not directly contact the wall of the through-hole H1. The small-diameter portion 15y' may have a wire diameter, which may be greater than or equal to 0.01 mm. Here, the wire diameter is the largest wire diameter of the smaller diameter section 15y' itself, for example, it could be 50. m (micrometer), 1 mil (approximately 25) m, material can be, for example, copper or gold), 15 m (material may be, for example, copper) or 10 m (the material may be, for example, gold). In some embodiments, the wire diameter of the smaller diameter portion 15y' may be greater than or equal to 0.005. m. Understandably, the wire diameter of the small diameter section 15y' must also be designed to accommodate the diameters of the through holes H1 and H2. Furthermore, as shown in Figure 4, the main difference from the electronic device 1b of the aforementioned embodiment is that the electronic device 1c of this embodiment further includes a filler 152 disposed in one of the perforations H1, and the filler 152 connects the wire (15y') to the wall of one of the perforations H1. The filler 152 in this embodiment fills the gaps within the perforation H1, but is not limited thereto. In some embodiments, the filler 152 may be an organic material, which may include silicone, acrylic, or resin materials. The features of the filler 152 in this embodiment can also be applied to the embodiments shown in Figure 2 or the high-temperature heat-melting embodiment. Furthermore, as shown in Figure 5, the main difference from the electronic device 1 in the aforementioned embodiment is that the electronic device 1d in this embodiment may further include two conductive materials 155 and 155'. Here, conductive materials 155 and 155' are, for example, conductive pastes, and the thickness of conductive material 155' is greater than that of conductive material 155. Where the material properties of the second substrate 13 and conductive material 155' allow, conductive material 155' may also be greater than the thickness of the second substrate 13a. The signal terminal E1 of electronic component 18 is electrically connected to the circuit structure 17 of the second substrate 13a through conductive material 155, while the signal terminal E2 of electronic component 18 protrudes from the side of the second substrate 13a and is electrically connected to the ground layer 14 through another conductive material 155'. The aforementioned "thickness" refers to the thickness of the first surface S1 or the second surface S2 perpendicular to the first substrate 11. The materials of conductive materials 155 and 155' may include, for example, tin, gold, copper, or silver, or alloys or eutectic materials containing any of the above materials, or other conductive metallic materials, and are not limited thereto. The feature of the thicker conductive material 155' in this embodiment can also be applied to the above embodiments. In some embodiments, the thickness of the conductive material 155' is increased through processes such as thin film or printing (not shown), and the thickness can be increased or kept constant, as long as it achieves electrical connection with the ground layer 14; alternatively, the conductive materials 155 and 155' can be omitted (not shown), and the thickened signal terminal E2 can be electrically connected to the ground layer 14 by high-temperature thermal fusion. In some embodiments, the ground layer 14 is located on the side of the first substrate 11 facing the second substrate 13a, and extends out in a manner external to the second substrate 13a (not shown) to correspond to and electrically connect to the signal terminal E2 of the electronic component 18. In some embodiments, the number of metal units 12 may be one or more, forming, for example, a unit array with the first substrate 11, such as, but not limited to, a rectangular array or a circular array. The foregoing embodiments are based on one metal unit 12. Additionally, the number of conductive structures 15 may be one or more, each corresponding to a number of metal units 12. At least one metal unit 12 is controlled by one electronic component 18. For example, the number of electronic components 18 may be one or more, similar to the antenna unit 12, allowing multiple electronic components 18 to individually correspond to and independently operate the metal units 12, or multiple metal units 12 to be operated (controlled) by the same electronic component 18. This invention is not limited in scope. Please refer to Figures 6A to 6D, which are schematic diagrams of different embodiments of the electronic device. The main difference from the above embodiments is that the conductive structure 15 disclosed in FIG6A has a metal plating layer 153 on the portion of the through hole H1 located at least on the first substrate 11; in different embodiments, the conductive structure 15 may further have a metal plating layer (not shown) on the portion of the through hole H1 located on the second substrate 13; it should be noted that the metal plating layer 153 should be applicable to other embodiments of this invention without violating physics. The main difference from the above embodiments is that Figure 6B reveals that the diameters of the through hole H3 penetrating the first substrate 11 and the through hole H1 penetrating the second substrate 13 are inconsistent and not centered. The conductive element 151 is disposed in the through hole H3 and the through hole H1 and connects the two. It can be understood that the through hole H3 and the through hole H1 can be implemented in the same process or different processes. The main difference from the above embodiments is that the through-hole H3 and the through-hole H1 disclosed in FIG. 6C are completely offset from each other. In this embodiment, the first substrate 11 has an internal conductive structure 19 along a normal direction perpendicular to the first surface S1. Each internal conductive structure 19 includes the aforementioned through-hole H3 and an internal conductive element 191 disposed in the through-hole H3 and electrically connected to a signal layer 16. These internal conductive structures 19 are electrically connected to the signal layer 16 located between the first substrate 11 and the second substrate 13 and to these conductive structures 15. The main difference from the above embodiments is that FIG. 6D discloses multiple internal conductive structures 19 (two). The internal conductive elements 191 of these internal conductive structures 19 can be offset from each other along a normal direction perpendicular to the first surface S1, but are not limited thereto. One of the internal conductive structures 19 can be directly electrically connected to the conductive structure 15, the signal layer 16 and / or the circuit structure 17, thereby achieving the same electrical connection effect. In summary, in the antenna device (electronic device) of the present invention, a metal unit is disposed on the first surface of a first substrate, a second substrate is disposed on the second surface of the first substrate, a ground layer is disposed between the first and second substrates, and a conductive structure is disposed in the through-hole, forming a circuit structure that electrically connects the metal unit to the second substrate. Furthermore, the design of one signal terminal of the electronic component being electrically connected to the circuit structure and the other signal terminal being electrically connected to another circuit layer (e.g., a ground layer) allows the signal emitted by the electronic component to be transmitted to the metal unit via the circuit structure and conductive structure. Therefore, the electronic device of the present invention has a compact structure that achieves thinness, meeting the current demand for thinner electronic products. In addition, the electronic device of the present invention can integrate substrates of different materials into one unit through the conductive structure, enabling diverse applications. The above description is illustrative only and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the appended claims. 1, 1a~1d: Antenna device; 11: First substrate; 12: Metal unit; 13, 13a: Second substrate; 14: Ground layer; 15: Conductive structure; 15x, 15x': Large diameter portion; 15y, 15y': Small diameter portion; 151, 151a, 151b: Conductive component; 152: Filler; 153: Metal plating; 155, 155': Conductive material; 16: Signal layer; 17: Circuit structure; 18: Electronic component; 19: Internal conductive structure; 191: Internal conductive component; E1, E2: Signal terminal; H1, H1': Through hole; H2, H3: Through hole; S1: First surface; S2: Second surface; S3: Connection surface; S4: Actuating surface. Figure 1A is a perspective cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 1B is a schematic diagram of the electronic device of Figure 1A. Figures 2 to 5 are schematic diagrams of electronic devices according to different embodiments of the present invention. Figures 6A to 6D are schematic diagrams of electronic devices according to different embodiments of the present invention. 1: Antenna device 11: First substrate 12: Metal Unit 13: Second substrate 14: Grounding layer 15: Conductive Structure 151: Conductive component 15x: Large diameter part 15y: Small diameter 155: Conductive component 17: Line Structure 18: Electronic Components E1, E2: Signal terminals H1,H1': ​​Perforation S1: First Page S2: Second side S3: Connecting surface S4: Actuating surface

Claims

1. An electronic device comprising: A first substrate is defined with a first surface and a second surface opposite to each other; a metal unit is disposed on the first surface of the first substrate; A second substrate is disposed on the second surface of the first substrate and defines a connection surface connecting the first substrate and an actuating surface relative to the connection surface; an adhesive layer is disposed between the second surface of the first substrate and the connection surface of the second substrate; a circuit structure is disposed on the second substrate; an electronic component is disposed on the actuating surface of the second substrate and electrically connected to the circuit structure; and one or more conductive structures, including at least one through-hole penetrating the second substrate and a conductive element disposed on the through-hole; wherein one of the conductive structures electrically connects the metal unit and the circuit structure, and the metal unit corresponds to the electronic component; wherein the first substrate and the second substrate are made of different materials; wherein the conductive element includes a large-diameter portion and a small-diameter portion, the small-diameter portion is electrically connected to the metal unit, the maximum width of the large-diameter portion is greater than the diameter of the through-hole, and the large-diameter portion at least covers and electrically connects to a portion of the circuit structure.

2. The electronic device as claimed in claim 1, wherein the first substrate is a rigid plate and the second substrate is a flexible plate.

3. The electronic device as claimed in claim 1, wherein the through-hole of each of the conductive structures further penetrates the first substrate.

4. The electronic device of claim 1, wherein the first substrate has one or more internal conductive structures, each internal conductive structure including a through-hole and an internal conductive member disposed in the through-hole and electrically connected to a signal layer; the signal layer is located between the first substrate and the second substrate, and the internal conductive structures are electrically connected to the signal layer and the conductive structures.

5. The electronic device as claimed in claim 1, further comprising: A grounding layer is electrically connected to the electronic component, wherein the grounding layer is located between the first substrate and the second substrate.

6. The electronic device as claimed in claim 5, wherein a portion of the conductive structures are electrically connected to the ground plane; one signal terminal of the electronic element is electrically connected to the circuit structure, and another signal terminal of the electronic element is electrically connected to the ground plane through one of the conductive structures.

7. An antenna device, comprising: A first substrate is defined with a first surface and a second surface opposite to each other; a plurality of antenna elements are disposed on the first surface of the first substrate; A second substrate is disposed on the second surface of the first substrate and defines a connection surface connecting the first substrate and an actuating surface relative to the connection surface; an adhesive layer is disposed between the second surface of the first substrate and the connection surface of the second substrate; a circuit structure is disposed on the second substrate; a plurality of electronic components are disposed on the actuating surface of the second substrate and electrically connected to the circuit structure; and a plurality of conductive structures; each conductive structure includes at least one through-hole penetrating the second substrate and a conductive element disposed in the through-hole; wherein at least a portion of the conductive structures electrically connects the antenna elements to the circuit structure, and the antenna elements correspond to the electronic components; wherein the conductive element includes a large-diameter portion and a small-diameter portion, the small-diameter portion is electrically connected to the metal unit, the maximum width of the large-diameter portion is greater than the aperture of the through-hole, and the large-diameter portion at least covers and electrically connects to a portion of the circuit structure.

8. The antenna device as claimed in claim 7, wherein the first substrate is a rigid plate and the second substrate is a flexible plate.

9. The antenna device as claimed in claim 7, wherein the perforation of each of the conductive structures further penetrates the first substrate.

10. The antenna device of claim 7, wherein the first substrate has one or more internal conductive structures, each internal conductive structure including a via and an internal conductive element disposed in the via and electrically connected to a signal layer; the signal layer is located between the first substrate and the second substrate, and the internal conductive structures electrically connect the antenna elements to the conductive structures.

11. The antenna device as described in claim 7, further comprising: A grounding layer is electrically connected to the electronic components, wherein the grounding layer is located between the first substrate and the second substrate.

12. The antenna device as claimed in claim 11, wherein a portion of the conductive structures are electrically connected to the ground plane; one signal terminal of the electronic element is electrically connected to the circuit structure, and another signal terminal of the electronic element is electrically connected to the ground plane through one of the conductive structures.

13. The antenna device as claimed in claim 7, wherein the electronic element is a driver or a variable capacitor.

Images