Method for manufacturing electronic assembly

Abstract

This invention provides an electronic component, a method for manufacturing the electronic component, and a composite heat-conducting sheet. The electronic component includes a circuit board, a heat source, an anti-overflow component, a heat-conducting block, and a phase-change heat-conducting sheet. The heat source is disposed and electrically connected to the circuit board. The anti-overflow component is disposed on the side of the heat source away from the circuit board and has an opening. The heat-conducting block is disposed on the side of the anti-overflow component away from the heat source. The phase-change heat-conducting sheet is located in the opening of the anti-overflow component and is surrounded by the anti-overflow component. The opposite sides of the phase-change heat-conducting sheet are in thermal contact with the heat source and the heat-conducting block, respectively.

Description

Technical Field

[0001] The present invention relates to an electronic component, a method for manufacturing the electronic component, and a composite heat-conducting sheet, and in particular to an electronic component including an overflow prevention part, a method for manufacturing the electronic component, and a composite heat-conducting sheet including an overflow prevention part. Prior Art

[0002] Because materials absorb a significant amount of heat when melting from a solid to a liquid state, some manufacturers incorporate phase-change material between the processor and the copper block in gaming laptops. This effectively transfers heat from the processor to the copper block through the liquefaction of the phase-change material, maintaining the processor within a suitable temperature range.

[0003] However, after the phase-change material absorbs a large amount of heat and melts into a liquid state, it becomes difficult to maintain the liquid phase-change material between the copper block and the processor. In other words, the liquid phase-change material easily overflows from the gap between the copper block and the processor, causing a pump-out phenomenon. This not only reduces the phase-change material's efficiency in transferring heat generated by the processor to the copper block, but also potentially damages electronic components near the processor due to the liquid phase-change material flowing to the copper block. Summary of the Invention

[0004] The present invention provides an electronic component, a method for manufacturing the electronic component, and a composite heat conducting sheet, which prevents the liquefied phase change heat conducting sheet or phase change portion from overflowing from between a heat source and a heat conducting block through an overflow prevention member or overflow prevention portion.

[0005] An electronic assembly disclosed in one embodiment of the present invention includes a circuit board, a heat source, an overflow prevention member, a heat conductive block, and a phase change thermal conductive sheet. The heat source is disposed and electrically connected to the circuit board. The overflow prevention member is disposed on a side of the heat source away from the circuit board and has an opening. The heat conductive block is disposed on a side of the overflow prevention member away from the heat source. The phase change thermal conductive sheet is located in the opening of the overflow prevention member and is surrounded by the overflow prevention member. Opposite sides of the phase change thermal conductive sheet are in thermal contact with the heat source and the heat conductive block, respectively.

[0006] Another embodiment of the present invention discloses a method for manufacturing an electronic component, comprising: disposing a spill prevention member on a side of a heat source away from a circuit board; placing a phase change thermal conductive material layer on the side of the spill prevention member away from the heat source; and pressing the phase change thermal conductive material layer into the spill prevention member to form a phase change thermal conductive sheet surrounded by the spill prevention member. Furthermore, a thermal conductive block is disposed on the side of the spill prevention member away from the heat source. Opposite sides of the phase change thermal conductive sheet are in thermal contact with the heat source and the thermal conductive block, respectively.

[0007] Another embodiment of the present invention discloses a composite thermally conductive sheet comprising a phase change portion and an overflow prevention portion. The phase change portion is made of an indium-bismuth-tin alloy. The overflow prevention portion is made of indium and is superimposed on one side of the phase change portion. The overflow prevention portion has an opening that exposes a portion of the phase change portion.

[0008] According to the electronic components, electronic component manufacturing methods, and composite thermally conductive sheets disclosed in the aforementioned embodiments, since the phase-change thermally conductive sheet is surrounded by the overflow prevention member, once the phase-change thermally conductive sheet liquefies, the overflow prevention member prevents the liquefied phase-change thermally conductive sheet from overflowing from between the heat source and the thermally conductive block. This not only maintains the efficiency of the phase-change thermally conductive sheet in transferring heat generated by the heat source to the thermally conductive block, but also prevents the liquefied phase-change thermally conductive sheet from flowing to electronic components near the heat source. Furthermore, since the opening of the overflow prevention member exposes a portion of the phase-change portion, when the composite thermally conductive sheet is positioned between the heat source and the thermally conductive block, the overflow prevention member in the composite thermally conductive sheet achieves the same overflow prevention effect as the overflow prevention member. Simple diagram description

[0009] FIG1 is a schematic side cross-sectional view of an electronic component according to a first embodiment of the present invention. FIG2 is a top view schematically illustrating the heat source, overflow prevention member, and phase change thermal conductive sheet of the electronic component in FIG1 . 3 to 5 are schematic side cross-sectional views illustrating a method for manufacturing the electronic component in FIG. 1 . FIG6 is a schematic side cross-sectional view of an electronic component according to a second embodiment of the present invention. FIG. 7 is a perspective view of a composite thermally conductive sheet according to a third embodiment of the present invention. Implementation Method

[0010] The following detailed descriptions of the features and advantages of the embodiments of the present invention are sufficient to enable anyone skilled in the art to understand the technical aspects of the embodiments and implement them accordingly. Furthermore, based on the disclosure, claims, and figures of this specification, anyone skilled in the art can readily understand the objectives and advantages of the present invention. The following examples further illustrate the concepts of the present invention and are not intended to limit the scope of the present invention in any way.

[0011] Please refer to Figures 1 and 2. Figure 1 is a side cross-sectional view of an electronic component according to a first embodiment of the present invention. Figure 2 is a top view of the heat source, overflow prevention member, and phase change thermal conductive sheet of the electronic component in Figure 1.

[0012] The electronic component 10 is disposed in a notebook computer (not shown), for example. In this embodiment, the electronic component 10 includes a circuit board 100, a heat source 200, an overflow prevention member 300, a heat conducting block 400, and a phase change heat conducting sheet 500.

[0013] The heat source 200 is, for example, a central processing unit (CPU). The heat source 200 is disposed and electrically connected to the circuit board 100. In this embodiment, the overflow prevention member 300 is made of, for example, indium. In this embodiment, the overflow prevention member 300 has a bottom surface 301, a top surface 302, and an opening 303. The bottom surface 301 and the top surface 302 face away from each other. The opening 303 extends through the bottom surface 301 and the top surface 302. The bottom surface 301 of the overflow prevention member 300 is disposed on the side of the heat source 200 away from the circuit board 100.

[0014] The heat conducting block 400 is disposed on the side of the overflow prevention member 300 away from the heat source 200. In this embodiment, the heat conducting block 400 is, for example, a copper block. In other words, the heat conducting block 400 is, for example, made of copper. Therefore, in this embodiment, the overflow prevention member 300 and the heat conducting block 400 are, for example, made of different materials.

[0015] The phase-change thermal conductive sheet 500 is located within the opening 303 of the overflow prevention member 300 and is surrounded by the overflow prevention member 300. Opposite sides of the phase-change thermal conductive sheet 500 are in thermal contact with the heat source 200 and the heat conductive block 400, respectively. In this embodiment, the phase-change thermal conductive sheet 500 is made of, for example, an indium-bismuth-tin alloy.

[0016] When the phase-change thermally conductive sheet 500 liquefies, the overflow prevention member 300 prevents the liquefied phase-change thermally conductive sheet 500 from overflowing from between the heat source 200 and the heat conductive block 400. This not only maintains the efficiency of the phase-change thermally conductive sheet 500 in transferring heat generated by the heat source 200 to the heat conductive block 400, but also prevents the liquefied phase-change thermally conductive sheet 500 from flowing to electronic components (not shown) near the heat source 200.

[0017] Furthermore, in this embodiment, the melting point of the overflow prevention member 300 is, for example, higher than that of the phase-change thermal conductive sheet 500. Therefore, when the phase-change thermal conductive sheet 500 absorbs heat generated by the heat source 200 and liquefies, the overflow prevention member 300 remains solid, preventing the liquefied phase-change thermal conductive sheet 500 from overflowing from between the heat source 200 and the thermal block 400. Furthermore, in this embodiment, the overflow prevention member 300 is, for example, made of indium, and the phase-change thermal conductive sheet 500 is, for example, made of an indium-bismuth-tin alloy. In other words, the metal material comprising the overflow prevention member 300 is one of the metal materials in the alloy material comprising the phase-change thermal conductive sheet 500. Therefore, when the phase-change thermal conductive sheet 500 liquefies, it bonds to the overflow prevention member 300 and does not overflow from between the heat source 200 and the thermal block 400.

[0018] Furthermore, in this embodiment, as shown in FIG. 2 , the heat source 200 has a thermal contact surface 201. The thermal contact surface 201 faces away from the circuit board 100 and includes a hot zone 202 and a cold zone 203 connected to each other. When the heat source 200 is in operation, the majority of the heat generated by the heat source 200 is transferred to the hot zone 202, causing the temperature of the hot zone 202 to be higher than that of the cold zone 203. Furthermore, the overflow prevention member 300 is disposed, for example, in the cold zone 203, and the phase change thermal conductive sheet 500 is in thermal contact with the hot zone 202. Since the majority of the heat generated by the heat source 200 is transferred to the hot zone 202, the phase change thermal conductive sheet 500, in thermal contact with the hot zone 202, can effectively absorb the majority of the heat generated by the heat source 200.

[0019] It should be noted that in other embodiments, a plurality of ribs may be provided in the opening of the overflow prevention member, for example forming a grid-like shape, wherein these ribs divide the opening into a plurality of accommodating spaces, and the phase change heat sink will be located in these accommodating spaces when liquefied.

[0020] 3 to 5, which are schematic side cross-sectional views illustrating a method for manufacturing the electronic component 10 in FIG1. ​​The method for manufacturing the electronic component 10 in FIG1 includes the following steps.

[0021] As shown in FIG3 , the overflow prevention member 300 is positioned on the side of the heat source 200 away from the circuit board 100. Next, as shown in FIG4 , a phase-change thermal conductive material layer 550 is positioned on the side of the overflow prevention member 300 away from the heat source 200, that is, on the top surface 302 of the overflow prevention member 300. It should be noted that in this embodiment, the thickness T1 of the phase-change thermal conductive material layer 550 along the stacking direction D of the overflow prevention member 300 and the heat source 200 is, for example, greater than the thickness T2 of the overflow prevention member 300 along the stacking direction D. Specifically, the thickness T1 of the phase-change thermal conductive material layer 550 is 110 to 150 percent of the thickness T2 of the overflow prevention member 300.

[0022] Next, as shown in Figures 4 and 5 , a phase-change thermally conductive material layer 550 is pressed into the overflow prevention member 300 to form the phase-change thermally conductive sheet 500 surrounded by the overflow prevention member 300. The thermally conductive block 400 is then positioned on the side of the overflow prevention member 300 away from the heat source 200. Due to the aforementioned thickness relationship between the phase-change thermally conductive material layer 550 and the overflow prevention member 300 (thickness T1 being greater than thickness T2), the phase-change thermally conductive sheet 500 formed by the phase-change thermally conductive material layer 550 more effectively fills the gap between the heat source 200 and the thermally conductive block 400, thereby increasing the efficiency of the phase-change thermally conductive sheet 500 in transferring heat generated by the heat source 200 to the thermally conductive block 400.

[0023] The present invention is not limited to the structure of the electronic component. Please refer to Figure 6, which is a schematic side cross-sectional view of an electronic component according to a second embodiment of the present invention. The electronic component 10a of this embodiment includes a circuit board 100, a heat source 200, an overflow prevention member 300, a heat conductive block 400, a phase change thermal conductive sheet 500, and at least one heat pipe 600a. The circuit board 100, heat source 200, overflow prevention member 300, heat conductive block 400, and phase change thermal conductive sheet 500 are identical to those of the first embodiment and will not be described in detail. The at least one heat pipe 600a is in thermal contact with the side of the heat conductive block 400 facing away from the overflow prevention member 300.

[0024] The present invention further provides a composite thermally conductive sheet 20b. Please refer to Figure 7, which is a perspective view of a composite thermally conductive sheet according to a third embodiment of the present invention. In this embodiment, the composite thermally conductive sheet 20b includes a phase change portion 21b and an overflow prevention portion 22b. The phase change portion 21b is made of an indium-bismuth-tin alloy. The overflow prevention portion 22b is made of indium. The overflow prevention portion 22b has a bottom surface 23b, a top surface 24b, and an opening 25b. The bottom surface 23b and the top surface 24b face each other. The opening 25b extends through the bottom surface 23b and the top surface 24b. The top surface 24b of the overflow prevention portion 22b is superimposed on one side of the phase change portion 21b. The opening 25b exposes a portion of the phase change portion 21b. It should be noted that the overflow prevention member 300 and the phase change thermally conductive sheet 500 in Figure 1 can also be replaced by placing the composite thermally conductive sheet 20b on the heat source 200 in Figure 1.

[0025] According to the electronic components, electronic component manufacturing methods, and composite thermally conductive sheets disclosed in the aforementioned embodiments, since the phase-change thermally conductive sheet is surrounded by the overflow prevention member, once the phase-change thermally conductive sheet liquefies, the overflow prevention member prevents the liquefied phase-change thermally conductive sheet from overflowing from between the heat source and the thermally conductive block. This not only maintains the efficiency of transferring heat generated by the heat source through the phase-change thermally conductive sheet to the thermally conductive block, but also prevents the liquefied phase-change thermally conductive sheet from flowing to electronic components near the heat source. Furthermore, since the opening of the overflow prevention member exposes a portion of the phase-change portion, when the composite thermally conductive sheet is positioned between the heat source and the thermally conductive block, the overflow prevention member in the composite thermally conductive sheet achieves the same overflow prevention effect as the overflow prevention member.

[0026] Furthermore, according to experimental data, after a specific burn-in period, the processor wattage of conventional electronic components without overflow prevention components drops from 110 watts to 80 to 85 watts. However, after three days of burn-in, the processor wattage of electronic components equipped with overflow prevention components according to the present invention can still be maintained at 105 to 110 watts, compared to the initial 110 watts. Therefore, the overflow prevention components according to the present invention significantly improve the reliability of electronic components.

[0027] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

[0028] 10,10a: Electronic components 100: Circuit board 200: Heat source 201: Thermal contact surface 202: Hot Zone 203: Cold Zone 300: Overflow prevention parts 301: Bottom surface 302: Top surface 303: Opening 400: Thermal block 500: Phase change thermal conductive sheet 550: Phase change thermal conductive material layer D: Stacking direction T1, T2: thickness 600a: Heat pipe 20b: Composite thermal conductive sheet 21b: Phase change part 22b: Overflow prevention part 23b: bottom 24b: Top surface 25b: Opening

Claims

1. A method for manufacturing an electronic component, comprising: disposing an anti-overflow member on a side of a heat source away from a circuit board; placing a phase change thermally conductive material layer with a width greater than an opening of the anti-overflow member on the side of the anti-overflow member away from the heat source; pressing the phase change thermally conductive material layer into the anti-overflow member to form a phase change thermally conductive sheet surrounded by the anti-overflow member, and disposing a thermally conductive block on the side of the anti-overflow member away from the heat source, wherein opposite sides of the phase change thermally conductive sheet are in thermal contact with the heat source and the thermally conductive block, respectively.

2. The method of manufacturing an electronic component as claimed in claim 1, wherein the thickness of the phase-change thermally conductive material layer is greater than the thickness of the anti-overflow component.

3. The method of manufacturing an electronic component as described in claim 2, wherein the thickness of the phase change thermally conductive material layer is 110% to 150% of the thickness of the spill prevention component.

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