Substrate holder, plating apparatus, and management method for substrate holder

Abstract

This invention relates to a substrate holder, a plating apparatus, and a method for managing the substrate holder. It provides technology for appropriately handling a substrate holder according to its usage status. A substrate holder is provided for holding a substrate to be plated in a plating apparatus. The substrate holder includes an RFID tag having a storage area for storing usage attributes, including attributes indicating the state of use during the plating process.

Description

Technical Field

[0001] This application relates to substrate holders, plating apparatus, and methods for managing substrate holders. Prior Technology

[0002] Conventional methods exist for electroplating where a substrate held by a substrate holder is immersed in a plating bath containing plating solution. In such plating apparatuses, the substrate holder is stored in a storage container before the apparatus begins operation. The substrate holder is removed from the storage container at the start of operation to hold the substrate, such as a wafer, to be processed. The substrate holder holding the substrate is then transported by a substrate holder transporter to the plating bath and various processing tanks required for plating, where the necessary processing is performed sequentially. Furthermore, substrate holders found to have power supply issues are returned to the storage container and their use is restricted until maintenance is completed.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2017-190507 Patent Document 2: Japanese Patent Application Publication No. 2014-19900 Patent Document 3: Japanese Patent Application Publication No. 2018-53301

[0004] In such plating apparatuses, if defects occur, users may remove substrate holders from storage or during processing to eliminate the defects. In such cases, there is concern that it is unclear whether the substrate holder was unused at the time of processing or is still in the process. Using a substrate holder in the process as if it were unused could lead to substrate contamination and prevent proper maintenance. Furthermore, historically, the management of substrate holders stored in storage, ensuring they are properly maintained and stored as unused, has been left to operators. Therefore, if operators fail to manage them properly, unmaintained substrate holders may be used as if they were unused. Summary of the Invention

[0005] In view of the above-mentioned circumstances, one of the objectives of this application is to provide a technique for appropriately handling a substrate holder according to its usage status.

[0006] According to one embodiment, a substrate holder is provided for holding a substrate to be plated in a plating apparatus. The substrate holder includes an RFID tag having a storage area for storing usage attributes, including attributes indicating that the substrate is being used in a plating process.

[0007] According to another embodiment, a method for managing a substrate holder is provided, which is a method for managing a substrate holder used in a plating apparatus. The method includes: reading an RFID tag disposed on the substrate holder within the plating apparatus; selecting a transport destination for the substrate holder based on usage attributes stored in the RFID tag; and updating the usage attributes stored in the RFID tag for the substrate holder used in the processing of the plating apparatus. Simple Explanation of the Diagram

[0008] Figure 1 is an overall configuration diagram of a plating apparatus according to one embodiment. Figure 2 is a schematic diagram showing the structure of a substrate holder according to one embodiment. Figure 3 is a flowchart illustrating the use of the substrate holder in a plating apparatus according to one embodiment. Figure 4 is a flowchart illustrating the maintenance process of a substrate holder based on a maintenance terminal in one embodiment. Figure 5 is a simplified structural diagram of a modified plating system with multiple processing channels. Implementation

[0009] Hereinafter, embodiments of the plating apparatus and plating method of the present invention will be described based on the accompanying drawings. In the accompanying drawings, there are instances where the same or similar elements are given the same or similar reference numerals, and repeated descriptions related to the same or similar elements are omitted in the descriptions of each embodiment. Furthermore, features shown in each embodiment can also be applied to other embodiments as long as they do not contradict each other.

[0010] Figure 1 is an overall configuration diagram of the plating apparatus in this embodiment. The object to be plated in this embodiment is a substrate such as a semiconductor wafer. The substrate includes angular substrates such as square or hexagonal substrates and circular substrates. As shown in Figure 1, the plating apparatus is roughly divided into a loading port 170A and a processing section 170B for processing substrates. The loading port 170A is used to load substrates into or unload substrates from the substrate holder 60.

[0011] Loading port 170A includes two cassette-type worktables 102, an alignment device 104, and a spin dryer 106. The cassette-type worktables 102 house cassettes 100 containing substrates such as semiconductor wafers. The alignment device 104 is provided to align the orientation plane and notches of the substrates with a specified direction. The spin dryer 106 is provided to rotate the plated substrates at high speed and dry them. A substrate loading and unloading mechanism 120 is located near the spin dryer 106, which is used by the substrate holder 60 to load and unload substrates. A substrate handling device 122, consisting of a handling robot that moves substrates between these units, is centrally located among these units 100, 104, 106, and 120.

[0012] The substrate loading and unloading mechanism 120 includes a flat mounting plate 152 that slides laterally along a guide rail 150. Two substrate holders 60 are placed side-by-side horizontally on the mounting plate 152. After a substrate is transferred between one substrate holder 60 and the substrate transport device 122, the mounting plate 152 slides laterally to transfer the substrate between the other substrate holder 60 and the substrate transport device 122. The substrate loading and unloading mechanism 120 may also function as a leakage detection device and a current measuring device for performing various inspections on the substrate holders 60.

[0013] A leakage detection device is used to check for leaks in the sealed space of a substrate holder 60. As described later, the substrate holder 60 seals the surface of the substrate while it is held, creating a space that prevents plating liquid from entering. The substrate holder 60 has a plurality of electrical contacts in this sealed space for contacting the substrate surface and allowing current to flow through the substrate. If the sealing function deteriorates, plating liquid can enter the electrical contacts of the substrate holder during the plating process, preventing proper current flow to the substrate. Therefore, the sealing performance of the substrate holder 60 is checked using a leakage detection device. Any device, including known leakage detection devices, can be used for the leakage detection device. Furthermore, the leakage detection device can be configured to check for leaks in the substrate holder before and after the plating process. Alternatively, a plurality of leakage detection devices can be provided, with some used for leak checks before plating and others for leak checks after plating. For example, as a leak detection device for leak inspection before plating, it is possible to form a device that evacuates the sealed area of ​​the substrate holder 60 to check whether a specified vacuum level can be maintained for a specified time. In addition, as a leak detection device for leak inspection after plating, it is possible to form a device that checks whether liquids such as plating solution are adhering to the sealed area of ​​the substrate holder 60.

[0014] The current measuring device is used to measure the current or resistance of the electrical contacts of the substrate holder 60. The substrate holder 60 has a plurality of electrical contacts to ensure a uniform current flow to the substrate being held. If an abnormality occurs at one of the electrical contacts, causing its resistance to be higher or lower than other contacts, the current cannot flow uniformly to the substrate, thus preventing normal plating. Therefore, the current measuring device measures the current or resistance flowing to the electrical contacts of the substrate holder 60 before plating to check for any abnormalities in the electrical contacts of the substrate holder 60. Any device, including known current measuring devices, can be used.

[0015] The processing unit 170B of the plating apparatus includes a storage tank 124, a pre-wetting tank 126, a pre-immersion tank 128, a first cleaning tank 130a, a blower tank 132, a second cleaning tank 130b, and a plating tank 50 in the plating module 10. In the storage tank 124, the substrate holder 60 is stored and temporarily placed. In the pre-wetting tank 126, the substrate is immersed in a pre-wetting solution such as pure water. In the pre-immersion tank 128, the oxide film on the surface of the conductive layer, such as the seed layer, formed on the surface of the substrate is etched away. In the first cleaning tank 130a, the pre-immersed substrate and the substrate holder 60 are cleaned together with a cleaning solution (pure water, etc.). In the blower tank 132, the cleaned substrate is drained. In the second cleaning tank 130b, the plated substrate and the substrate holder 60 are cleaned together with a cleaning solution. Storage tank 124, pre-wetting tank 126, pre-immersion tank 128, first cleaning tank 130a, air blowing tank 132, second cleaning tank 130b and plating tank 50 are arranged sequentially as an example.

[0016] The plating module 10, for example, has a plurality of plating tanks 50 with overflow channels 54. Each plating tank 50 houses a substrate, and the substrate is immersed in a plating solution held inside to perform copper plating or other plating on the surface of the substrate.

[0017] The plating apparatus includes, for example, a substrate holder transport module 140 employing a linear motor. This module 140 is located to the side of the various devices and transports the substrate holder 60 along with the substrate between these devices. The substrate holder transport module 140 includes a first transporter 142 and a second transporter 144. The first transporter 142 is configured to transport the substrate between the substrate loading / unloading mechanism 120, the storage tank 124, the pre-wetting tank 126, the pre-immersion tank 128, the first cleaning tank 130a, and the blowing tank 132. The second transporter 144 is configured to transport the substrate between the first cleaning tank 130a, the second cleaning tank 130b, the blowing tank 132, and the plating tank 50. In other embodiments, the plating apparatus may also include only either the first transporter 142 or the second transporter 144.

[0018] A paddle drive device 19 is arranged on both sides of the overflow tank 54. The paddle drive device 19 is used to drive a paddle (not shown) that acts as a stirring rod located inside each plating tank 50 and stirs the plating liquid in the plating tank 50.

[0019] The plating apparatus includes a controller 175, which is configured as a control module to control the aforementioned components. The controller 175 includes a memory 175B storing a predetermined program, a CPU (Central Processing Unit) 175A executing the program in the memory 175B, and a control unit 175C implemented by the CPU 175A executing the program. The control unit 175C can, for example, perform transport control of the substrate transport device 122, transport control of the substrate holder transport module 140, and control of the plating current and plating time in the plating module 10. The controller 175 can be configured as, for example, a general-purpose computer or a special-purpose computer equipped with input / output devices, a display device, and a storage device, and can be equipped with a program for controlling the operation of the plating apparatus. Furthermore, the controller 175 is configured, as an example, to communicate with a higher-level controller (not shown) that comprehensively controls the plating apparatus and other related devices, and can exchange data with a database possessed by the higher-level controller.

[0020] In addition, in this embodiment, a maintenance terminal 200 for maintaining the plating apparatus is provided. The maintenance terminal 200 can be configured, for example, a general-purpose computer or a special-purpose computer equipped with input / output devices, a display device, a storage device, etc., and can be equipped with a maintenance program. The maintenance terminal 200 includes a memory 200B storing a predetermined program, a CPU 200A executing the program in the memory 200B, and a control unit 200C implemented by the CPU 200A executing the program. The maintenance terminal 200 and the controller 175 are configured to be connected via wired or wireless means. The control unit 200C can perform maintenance operations such as resetting or backing up the controller 175 of the plating apparatus. Furthermore, the maintenance terminal 200 is configured to have the function of an RFID reader / writer capable of reading and writing information stored in the RFID tag 62 of the substrate holder 60 (described later), enabling maintenance of the substrate holder 60.

[0021] Figure 2 is a simplified diagram showing the structure of a substrate holder 60 that can be used in a plating apparatus according to one embodiment of the present invention. The substrate holder 60 of this embodiment has a handle bar 111 at one end. The handle bar 111 is held by a substrate holder transport module 140. The handle bar 111 is in the shape of a round bar and can rotate freely when the substrate holder 60 changes position from a vertical state to a horizontal state or from a horizontal state to a vertical state.

[0022] To address the issue of plating solution adhesion, the handlebar 111 is preferably made of highly corrosion-resistant stainless steel. Furthermore, if stainless steel cannot withstand the corrosion of the plating solution, it is recommended to improve corrosion resistance by chrome plating or TiC coating on the stainless steel surface. Additionally, the handlebar 111 can also be made of highly corrosion-resistant titanium.

[0023] Additionally, cuboid or cubic suspension portions 112 are provided at both ends of the upper part of the substrate holder 60. When the substrate holder 60 is placed in each processing tank, the suspension portions 112 are positioned on the suspension bearing member (not shown), thereby functioning as supports for suspending the substrate holder 60. In the storage tank 124 shown in FIG. 1, the suspension portions 112 are hooked onto the upper surface of the peripheral wall of the storage tank 124, thereby vertically suspending and supporting the substrate holder 60. Furthermore, the substrate holder 60 is transported by holding the suspended portion 112 of the suspended substrate holder 60 by the first conveying device 142 or the second conveying device 144. Moreover, even in the pre-wetting tank 126, pre-immersion tank 128, cleaning tanks 130a, 130b, blowing tank 132, and plating tank 50, the substrate holder 60 is also suspended and supported on their peripheral walls via the suspension portions 112. Additionally, an external contact 114 for connecting to an external power supply is provided in the suspension portion 112. This external contact 114 is electrically connected to an electrical contact (not shown) for supplying current to the substrate Wf via a plurality of wiring inside the substrate holder 60. When the substrate Wf is held in the substrate holder 60, a plurality of electrical contacts of the substrate holder 60 are arranged on the outer circumference of the substrate Wf such that the ends of the electrical contacts contact the surface of the substrate Wf. Furthermore, a conductive layer (seed layer) is formed on the surface of the substrate Wf. When the substrate Wf is held by the substrate holder 60, the electrical contacts contact the conductive film on the surface of the substrate Wf, thereby allowing current to flow to the substrate Wf. By the contact between the external contact 114 provided in the suspension portion 112 and the electrical contacts of the suspension bearing member, current can be supplied from an external power source to the plated surface of the substrate Wf via the plurality of electrical contacts of the substrate holder 60. When the substrate holder 60 is suspended from the suspension bearing component, the external contact 114 is positioned so as not to come into contact with the plating solution in the plating tank.

[0024] The substrate holder 60 has a movable retaining member 11 serving as a cover and a fixed retaining member 15 mounted on a mounting plate 152 of the substrate loading and unloading mechanism 120. The substrate Wf is clamped by the movable retaining member 11 and the fixed retaining member 15 (the clamped state is shown in FIG. 2). The movable retaining member 11 is a generally circular ring with a pressing member 12 and an ear 13 protruding outwardly from the pressing member 12 integrally. The movable retaining member 11 can be fixed to the fixed retaining member 15 and can be detached from the fixed retaining member 15. The fixed retaining member 15 has a clamp 16 at a position corresponding to the ear 13. The clamp 16 is in the shape of an inverted L-shape, with the front end bent inward, and the ear 13 enters (fits into) the inside of the bent portion at the front end, thereby fixing the movable retaining member 11 relative to the fixed retaining member 15. Furthermore, the ear 13 and the clamp 16 preferably have a tapered portion for smooth engagement.

[0025] The pressing member 12 is held so that it can rotate relative to the movable retaining member 11 without disengaging, and rotates together with the ear 13 about the center R of the movable retaining member 11 as the center of rotation and about a generally horizontal plane as the plane of rotation. The pressing member 12 is, for example, a generally circular ring.

[0026] The movable retaining member 11 and the fixed retaining member 15 clamp the substrate. The pressing member 12 is rotated to engage the ear portion 13 with the clamp 16, thereby securing the substrate Wf. Furthermore, during substrate installation and removal, the pressing member 12 is rotated to release the engagement of the ear portion 13 with the clamp 16. The movable retaining member 11 has a sealing ring for isolating unplated portions of the substrate Wf, such as the ends and back surfaces, from the plating solution, and an electrical contact (not shown) that contacts the sealed end region of the substrate Wf to energize it.

[0027] Additionally, the substrate holder 60 is equipped with an RFID tag 62. As an example, the RFID tag 62 is installed in the suspension portion 112 of the retaining member 15, but it can also be installed at any position on the substrate holder 60. Various information can be stored in the RFID tag 62. As an example, the RFID tag 62 can store the substrate holder 60's manufacturing date, the substrate holder's management number (substrate holder ID, etc.), plating equipment information (plating equipment ID, etc.), the storage room number where the substrate holder should be installed, cleaning dates, the total number of cleanings since the substrate holder was manufactured, the number of cleanings since the substrate holder was placed in the plating equipment, the cumulative current value through the substrate holder's electrical contacts, the number of NGs by the current measuring device or leakage detection device in the substrate loading / unloading mechanism 120, maintenance dates, replacement dates for components such as sealing rings and electrical contacts, and other inherent information and maintenance history of the substrate holder. Furthermore, in this embodiment, the RFID tag 62 has a storage area 62a for storing "usage attributes". As an example, storage area 62a can be composed of virtual logical volumes in RFID tag 62. "Usage attribute" is information indicating the current usage status of substrate holder 60, including at least an attribute indicating that substrate holder 60 is currently being used in the plating process. Additionally, the usage attribute may also include a status indicating that substrate holder 60 is under maintenance or awaiting maintenance. Furthermore, the usage attribute may also include an attribute indicating that substrate holder 60 is usable in the plating process. Here, a usable status for substrate holder 60 in the plating process may include a status indicating that substrate holder 60 is unused, a status indicating that substrate holder 60 has been maintained, etc. In this embodiment, "maintenance" includes cleaning. However, the "usage attribute" may also be distinct from "maintenance" and include states related to cleaning, such as "awaiting cleaning." Furthermore, it is preferable to store the time information when the usage attribute was updated in the "usage attribute."

[0028] In this embodiment, the conveying device 142 for transporting the substrate holder 60 includes an RFID reader 142a, which is configured to read information stored in the RFID tag 62 of the substrate holder 60 (see FIG1). The RFID reader 142a is controlled by a controller 175. Furthermore, not limited to this example, the RFID reader may be provided on the substrate loading / unloading mechanism 120 or the conveying device 144, or not on the conveying device 142, or the RFID reader may be provided on both the conveying device 142 and the substrate loading / unloading mechanism 120 or the conveying device 144. Additionally, in this embodiment, the RFID reader 142a functions as a writer capable of updating the information stored in the RFID tag 62 of the substrate holder 60. However, not limited to such examples, the structure with the function of an RFID writer may be provided in the substrate loading and unloading mechanism 120 or the conveying device 144, but not in the RFID reader 142a, or the structure with the function of an RFID writer may be provided in the RFID reader 142a, and also in the substrate loading and unloading mechanism 120 or the conveying device 144.

[0029] Figure 3 is a flowchart illustrating the usage process of a substrate holder in a plating apparatus according to one embodiment. This flowchart is executed when the controller 175 intends to use a specific substrate holder 60 to perform a plating process on substrate Wf. In this process, firstly, the substrate holder 60 is retrieved from the storage 124 in order to use the specific substrate holder 60 (S102). Specifically, according to an instruction from the controller 175, the first transfer device 142 retrieves the specific substrate holder 60 from the storage 124. At this time, the information stored in the RFID tag 62 of the substrate holder 60 is read by the RFID reader 142a of the first transfer device 142 (S104). The information read by the RFID reader 142a includes the usage attributes of the substrate holder 60.

[0030] Then, the controller 175 determines whether the substrate holder 60 can be used for the plating process based on the information read from the RFID tag 62 (S106). In the process of S106, specifically, the controller 175 determines whether the substrate holder 60 can be used based on the usage attributes of the substrate holder 60. As an example, if the usage attribute of the substrate holder 60 indicates "available for use in the plating process", it is determined that the substrate holder 60 can be used. On the other hand, if the usage attribute of the substrate holder 60 indicates "under maintenance" or "awaiting maintenance", it is determined that the substrate holder 60 should be maintained and therefore cannot be used. Furthermore, if the usage attribute of the substrate holder 60 indicates "currently being used in the plating process", it is determined that the previous plating process of the substrate holder 60 was not properly completed and therefore cannot be used. Furthermore, in the processing of S106, the controller 175 can also determine whether the substrate holder 60 can be used for plating processing based on the usage attributes of the substrate holder 60, as well as other information read from the RFID tag 62. As an example, even if the usage attributes of the substrate holder 60 indicate "it can be used in plating processing", the controller 175 can still determine that the substrate holder 60 cannot be used based on the inherent information and maintenance history of the substrate holder stored in the RFID tag 62.

[0031] If the substrate holder 60 is determined to be usable based on the information stored in the RFID tag 62 (S106: Yes), the substrate holder 60 is used to perform the plating process (S108). At this time, the usage attributes stored in the RFID tag 62 should be updated by the RFID reader 142a to indicate "currently being used in the plating process". In addition, if the controller 175 detects an abnormality (NG) in the substrate holder 60 to be used by the leakage detection device or current measuring device in the substrate loading and unloading mechanism 120, the substrate holder 60 can be cleaned so that it can be used in the plating process. In addition, if the controller 175 detects an abnormality in the substrate holder 60 in the substrate loading and unloading mechanism 120, the usage attributes stored in the RFID tag 62 can be updated to indicate "awaiting maintenance" and the substrate holder 60 can be returned to the storage 124.

[0032] If the plating process of the substrate holder 60 is started, the controller 175 stores information related to the utilization status of the substrate holder 60, such as the cumulative current value of the electrical contacts of the substrate holder 60 and the number of NGs in the substrate loading and unloading mechanism 120, until the plating process ends (S110). Then, if the plating process ends (S110: Yes), the controller 175 updates the information stored in the RFID tag 62 based on the information related to the utilization status of the substrate holder 60 stored during the plating process (S112). As a result, the inherent information of the substrate holder 60 stored in the RFID tag 62 is updated. In addition, at this time, it is advisable to update the usage attribute of the substrate holder 60 stored in the RFID tag 62 to information indicating "waiting for maintenance" or "usable during the plating process". Then, the controller 175 returns the substrate holder 60 to the storage 124 (S114), ending the use of the substrate holder 60.

[0033] If the controller 175 determines that the substrate holder 60 cannot be used based on the information stored in the RFID tag 62 (S106: No), it will not perform the plating process using the substrate holder 60 and will execute the unused process (S118). This unused process includes returning the substrate holder 60 to the storage 124 unchanged. Furthermore, in the unused process, different processing can be performed based on the usage attributes stored in the RFID tag 62. For example, if the substrate holder 60 is under maintenance or awaiting maintenance, a predetermined maintenance process can be performed on the substrate holder 60. Additionally, as an example, if the substrate holder 60 retrieved from the storage 124 is "currently being used in the plating process," the substrate holder 60 can be returned to the storage 124 unchanged, and an abnormality can be reported using a light, buzzer, or display. Alternatively, when not in use, the substrate holder 60 can be removed from the plating apparatus. In this case, a swap station (not shown) provided with the plating apparatus can be used. Then, if the controller 175 performs the unused processing on the substrate holder 60, the usage process shown in FIG3 ends.

[0034] Based on the usage process of this substrate holder, "usage attributes" are stored in the RFID tag 62 of the substrate holder 60. Then, the controller 175 of the plating apparatus determines whether plating processing of the substrate Wf using the substrate holder 60 has been performed based on the "usage attributes" stored in the RFID tag. Thus, the substrate holder can be appropriately processed according to its usage status.

[0035] Next, the maintenance of the substrate holder 60 using the maintenance terminal will be described. Figure 4 is a flowchart showing the maintenance process of one embodiment. As an example, this process is performed by an operator removing the substrate holder 60 from the storage 124 and connecting the substrate holder 60 to the maintenance terminal 200. Alternatively, as another example, the process shown in Figure 4 is performed by using a switchboard (not shown) to remove the substrate holder 60 from the plating apparatus and transport it to a designated maintenance location.

[0036] During the maintenance process of the substrate holder 60 based on the maintenance terminal 200, firstly, the RFID tag 62 of the substrate holder 60 is read by the maintenance terminal 200 (S204). Next, the maintenance terminal 200 determines whether the usage attribute stored in the RFID tag 62 indicates "currently in use during plating processing" (S206). Then, if the "usage attribute" does not indicate "currently in use during plating processing" (S206: No), the normal maintenance process using the maintenance terminal 200 is performed (S208). In the process of S208, as an example, components such as the sealing ring and electrical contacts of the substrate holder 60 are replaced, and the inherent information and maintenance history of the substrate holder stored in the RFID tag 62 are updated. Then, if the maintenance terminal 200 ends the maintenance process of the substrate holder 60, it updates the usage attribute of the RFID tag 62 to information indicating "usable during plating processing" (S212), thereby ending the maintenance process. The substrate holder 60, having completed its maintenance process, is returned to the storage 124, whereby it can be reused for plating in the plating apparatus.

[0037] When the maintenance terminal 200 detects that the usage attribute stored in the RFID tag 62 indicates "currently in use during plating processing" (S206: Yes), it determines that an abnormal process has occurred during the plating process using the substrate holder 60, and executes abnormal situation processing (S218). In this abnormal situation processing, as an example, the maintenance terminal 200 may also communicate with the controller 175 of the plating apparatus to investigate the cause. Specifically, when the RFID tag 62 contains time information indicating that the usage attribute has been updated to "currently in use during plating processing," the cause can be investigated based on this time information. Furthermore, during abnormal situation processing, leakage detection or electrical contact abnormalities in the substrate holder 60 may also be detected. Additionally, the substrate holder 60 may be cleaned during abnormal situation processing. Then, if the maintenance terminal 200 ends the abnormal situation processing, it updates the usage attribute of the RFID tag 62 based on the result of the abnormal situation processing (S212), thereby ending the maintenance process. As an example, if the maintenance terminal 200 determines during an abnormality process that the substrate holder 60 can also be used for plating, it should update the usage attribute of the RFID tag 62 to indicate "it can be used in plating". In this case, the substrate holder 60 is returned to the storage 124 and is thus used again in the plating process of the plating apparatus.

[0038] <Variation Example> Figure 5 is a simplified structural diagram of a plating system with a plurality of processing channels according to a modified example. The plating system shown in Figure 5 includes a first processing channel 20A and a second processing channel 20B. Furthermore, the plating system may also have three or more processing channels. In this modified example, the first processing channel 20A and the second processing channel 20B respectively correspond to the processing unit 170B in the above-described embodiment. Additionally, the plating system includes a structure corresponding to the controller 175 and maintenance terminal 200 in the plating apparatus described above. Structures identical to those described in the above-described embodiment are given the same reference numerals, and repeated descriptions are omitted.

[0039] In this variation, the "usage attribute" of the RFID tag 62 stored in the substrate holder 60 includes information for individually identifying the channel (device) currently occupied by the substrate holder 60. Specifically, the usage attribute includes, for example, information indicating "the first processing channel is being used" and "the second processing channel is being used." Furthermore, in this variation, the usage attribute includes information indicating "unused state" where neither the first processing channel 20A nor the second processing channel 20B is being used, and "status awaiting maintenance" indicating that maintenance is required in addition to the first processing channel 20A and the second processing channel 20B.

[0040] In this modified example, the controller 175 of the plating system determines whether the substrate holder 60 is permitted or prohibited from use at its intended destination based on the usage attributes stored in the RFID tag 62 on the substrate holder 60. As an example, for a substrate holder 60 whose usage attribute indicates "currently in use in the first processing channel," the controller 175 permits its use in the first processing channel 20A and prohibits its use in the second processing channel 20B. Conversely, for a substrate holder 60 whose usage attribute indicates "currently in use in the second processing channel," the controller 175 prohibits its use in the first processing channel 20A but permits its use in the second processing channel 20B. Furthermore, if the substrate holder 60's usage attribute is "unused," the controller 175 permits its use in either the first processing channel 20A or the second processing channel 20B. Finally, if the substrate holder 60's usage attribute is "awaiting maintenance," the controller 175 prohibits its use in either the first processing channel 20A or the second processing channel 20B.

[0041] The plating system according to the modified example described above has a plurality of processing channels using the substrate holder 60. The processing channel for which the substrate holder 60 can be used is determined based on the usage attributes stored in the RFID tag 62 of the substrate holder 60. This prevents the substrate holder, which would otherwise be used in a different processing channel, from being used in an undesirable processing channel. For example, when different processing solutions are being used in a processing channel, mixing of different processing solutions can be prevented. Therefore, according to the modified plating system, the substrate holder 60 can be appropriately processed according to the usage state.

[0042] The present invention can also be described in the following manner. [Method 1] According to Method 1, a substrate holder is provided for holding a substrate to be plated in a plating apparatus. The substrate holder includes an RFID tag with a storage area storing usage attributes, including attributes indicating the state of use during the plating process. According to Method 1, the substrate holder can be appropriately processed based on the usage attributes stored in the RFID tag.

[0043] [Method 2] According to Method 2, based on Method 1, the usage attributes stored in the aforementioned storage area include whether the substrate holder is under maintenance or whether the substrate holder is awaiting maintenance. According to Method 2, based on the usage attributes stored in the RFID tag, it is possible to determine whether the substrate holder is under maintenance or whether the substrate holder is awaiting maintenance.

[0044] [Method 3] According to Method 3, based on Method 1 or Method 2, the usage attributes stored in the aforementioned storage area include information for individually identifying the device currently in use. According to Method 3, by reading the RFID tag, it is possible to determine the device currently in which the substrate holder is located.

[0045] [Method 4] According to Method 4, based on Methods 1 to 3, the usage attributes stored in the aforementioned storage area include information about the time when the usage attributes were updated. According to Method 4, it is possible to know the update time of the usage attributes stored in the RFID tag.

[0046] [Method 5] According to Method 5, based on Methods 1 to 4, the RFID tag stores information indicating the number of times or the usage time of each component constituting the substrate holder. According to Method 5, the number of times or the usage time of the substrate holder can be managed based on the state stored in the RFID tag.

[0047] [Method 6] According to Method 6, a plating apparatus is provided, which has a plating tank. The plating apparatus includes: a substrate holder according to any one of Methods 1 to 5; a transport module that transports the substrate holder; an RFID reader configured to read information from the RFID tag stored in the substrate holder; and a control module that determines whether plating processing of the substrate using the substrate holder has been performed based on the usage attributes of the substrate holder read by the RFID reader. According to Method 6, the same effect as Methods 1 to 5 can be achieved.

[0048] [Method 7] According to Method 7, based on Method 6, the plating apparatus has a first processing channel and a second processing channel. The usage attributes of the substrate holder stored in the storage area include attributes indicating "unused state," "being used in the first processing channel," "being used in the second processing channel," and "awaiting maintenance state." The control module allows the substrate holder with the usage attribute indicating "unused state" to be used in the first or second processing channel, allows the substrate holder with the usage attribute indicating "being used in the first processing channel" to be used in the first processing channel, allows the substrate holder with the usage attribute indicating "being used in the second processing channel" to be used in the second processing channel, and prohibits the substrate holder with the usage attribute indicating "awaiting maintenance state" from being used in both the first and second processing channels. According to Method 7, the substrate holder can be appropriately processed according to its usage state.

[0049] [Method 8] According to Method 8, based on Method 6 or 7, the above-mentioned RFID reader is installed in the above-mentioned handling module.

[0050] [Method 9] According to Method 9, based on Methods 6 to 8, the RFID reader can update the information stored in the RFID tag.

[0051] [Method 10] According to Method 10, based on Method 9, the RFID reader reads the usage attributes stored in the RFID tag at the start of use of the substrate holder, the control module stores the utilization status of the substrate holder during the plating process, and the RFID reader updates the usage attributes stored in the RFID tag based on the utilization status of the substrate holder stored by the control module at the end of use of the substrate holder.

[0052] [Method 11] According to Method 11, a method for managing a substrate holder used in a plating apparatus is provided. This method includes: reading an RFID tag disposed on the substrate holder within the plating apparatus; determining whether plating processing of a substrate using the substrate holder has been performed based on usage attributes stored in the RFID tag; and updating the usage attributes stored in the RFID tag for the substrate holder used in the plating process. According to Method 11, the substrate holder can be appropriately managed based on the usage attributes stored in the RFID tag.

[0053] [Method 12] According to Method 12, based on Method 11, the above-mentioned reading step is performed when the above-mentioned substrate holder is first used, and the above-mentioned updating step is performed when the above-mentioned substrate holder is no longer used.

[0054] [Method 13] According to Method 13, based on Method 11 or 12, the plating apparatus has a first processing channel and a second processing channel. The usage attributes include attributes indicating "unused state," "being used in the first processing channel," "being used in the second processing channel," and "awaiting maintenance state." The management method allows the substrate holder with the usage attribute indicating "unused state" to be used in the first or second processing channel; allows the substrate holder with the usage attribute indicating "being used in the first processing channel" to be used in the first processing channel; allows the substrate holder with the usage attribute indicating "being used in the second processing channel" to be used in the second processing channel; and prohibits the substrate holder with the usage attribute indicating "awaiting maintenance state" from being used in both the first and second processing channels. According to Method 13, the substrate holder can be appropriately processed according to its usage state.

[0055] The embodiments of the present invention have been described above. However, the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be modified and improved without departing from its spirit, and the present invention naturally includes its equivalents. In addition, within the scope of solving at least a portion of the above-described problems, or within the scope of achieving at least a portion of the effect, any combination of embodiments and modifications is possible, and any combination or omission of the constituent elements described in the claims and specification is possible.

[0056] This application claims priority based on Japanese Patent Application No. 2021-198699, filed on December 7, 2021. All disclosures of Japanese Patent Application No. 2021-198699, including the specification, claims, drawings, and abstract, are incorporated herein by reference in their entirety. All disclosures of Japanese Patent Application Publication No. 2017-190507 (Patent Document 1), Japanese Patent Application Publication No. 2014-19900 (Patent Document 2), and Japanese Patent Application Publication No. 2018-53301 (Patent Document 3), including the specification, claims, drawings, and abstract, are incorporated herein by reference in their entirety.

[0057] 20A, 20B... processing channels 50…plating tank 60…Substrate holder 62…RFID tags 62a… Storage area 120…Substrate loading and unloading mechanism 122…Substrate handling device 124… Storage warehouse 140…Substrate Holder Handling Module 142…First Transmission Device 142a…RFID reader 175… Controller 200… Maintenance Terminal

Claims

1. A plating apparatus having a plating tank, the plating apparatus comprising: a substrate holder for holding a substrate to be plating, wherein the substrate holder has an RFID tag having a storage area for storing usage attributes, the usage attributes including attributes indicating a state of use in a plating process; a transport module for transporting the substrate holder; an RFID reader configured to read information stored in the RFID tag on the substrate holder; and a control module for determining whether a plating process has been performed on the substrate using the substrate holder based on the usage attributes of the substrate holder read by the RFID reader.

2. The plating apparatus according to claim 1, wherein, The usage attributes stored in the storage area include whether the substrate holder is under maintenance or the substrate holder is awaiting maintenance.

3. The plating apparatus according to claim 1, wherein, The usage attributes stored in the storage area contain information for individually identifying the device currently in use.

4. The plating apparatus according to claim 1, wherein, The usage attributes stored in the storage area contain information about when the usage attributes were updated.

5. The plating apparatus according to claim 1, wherein, The RFID tag contains information indicating the number of times or the duration of use of each component constituting the substrate holder.

6. The plating apparatus according to any one of claims 1 to 5, wherein, The plating apparatus has a first processing channel and a second processing channel. The usage attributes of the substrate holder stored in the storage area include attributes indicating "unused state", "being used in the first processing channel", "being used in the second processing channel", and "awaiting maintenance state". The control module allows the substrate holder with the usage attribute indicating "unused state" to be used in the first processing channel or the second processing channel, allows the substrate holder with the usage attribute indicating "being used in the first processing channel" to be used in the first processing channel, allows the substrate holder with the usage attribute indicating "being used in the second processing channel" to be used in the second processing channel, and prohibits the substrate holder with the usage attribute indicating "awaiting maintenance state" from being used in the first processing channel and the second processing channel.

7. The plating apparatus according to any one of claims 1 to 5, wherein, The RFID reader is installed in the handling module.

8. The plating apparatus according to any one of claims 1 to 5, wherein, The RFID reader can update the information stored in the RFID tag.

9. The plating apparatus according to claim 8, wherein, The RFID reader reads the usage attributes stored in the RFID tag at the start of the use of the substrate holder. The control module stores the utilization status of the substrate holder during the plating process. At the end of the use of the substrate holder, the RFID reader updates the usage attributes stored in the RFID tag based on the utilization status of the substrate holder stored by the control module.

10. A method for managing a substrate holder used in a plating apparatus, the method comprising: The step of reading the RFID tag disposed on the substrate holder within the plating apparatus; Based on the usage attributes stored in the RFID tag, a step is taken to determine whether the substrate using the substrate holder has undergone a plating process. And the step of updating the usage attributes stored in the RFID tag for the substrate holder used in the plating process.

11. The management method according to claim 10, wherein, The reading step is performed at the start of use of the substrate holder, and the updating step is performed at the end of use of the substrate holder.

12. The management method according to claim 10, wherein, The plating apparatus has a first processing channel and a second processing channel. The usage attributes include attributes indicating "unused state", "being used in the first processing channel", "being used in the second processing channel", and "awaiting maintenance state". The management method allows the substrate holder with the usage attribute indicating "unused state" to be used in the first processing channel or the second processing channel, allows the substrate holder with the usage attribute indicating "being used in the first processing channel" to be used in the first processing channel, allows the substrate holder with the usage attribute indicating "being used in the second processing channel" to be used in the second processing channel, and prohibits the substrate holder with the usage attribute indicating "awaiting maintenance state" from being used in both the first processing channel and the second processing channel.

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