Substrate support method and substrate processing apparatus

Abstract

[Problem] To provide a substrate supporting method and substrate processing apparatus that "supports a flexible substrate in a desired shape while supporting it with lifting pins". [Solution] A substrate supporting method involves detaching and supporting a flexible rectangular substrate placed on a mounting surface of a mounting table. The substrate supporting method is characterized in that the mounting table has a plurality of lifting pins that can protrude / recess from the mounting surface, and includes a process of "raising the lifting pins to the molding position in such a way that the lifting pins with a large driving amount from the beginning to the molding position stop at the molding position, thereby molding the shape of the substrate"; and a process of raising the lifting pins to the target position.

Description

[Technical Field]

[0001] This disclosure relates to a substrate support method and a substrate processing apparatus. [Previous Technology]

[0002] Patent Document 1 discloses a substrate mounting mechanism comprising: a mounting stage for mounting a flexible substrate to be processed; a plurality of lifting pins configured to protrude / recess freely onto the mounting surface of the mounting stage, supporting the substrate to be processed and moving between a receiving position for receiving the substrate above the mounting stage and a mounting position on the mounting stage; and a driving mechanism for driving the lifting pins, wherein the plurality of lifting pins comprises: a first lifting pin supporting the periphery of the substrate to be processed; and a second lifting pin supporting the central portion of the substrate to be processed; wherein the driving mechanism, when the substrate to be processed is moved up and down, causes the first lifting pin to protrude higher than the second lifting pin, stably supporting the substrate to bend downwards into a convex shape. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2008-60285 [Summary of the Invention]

[0004] [The problem that this invention aims to solve]

[0005] However, warping or bending sometimes occurs when the substrate is placed on the mounting stage. In this case, after the lifting pin is raised to lift the substrate and shape it into the desired shape, the lifting pin is lowered and the substrate is placed back on the mounting stage.

[0006] In one embodiment, this disclosure provides a substrate supporting method and substrate processing apparatus that "supports a flexible substrate in a desired shape while supporting it with lifting pins." [Means for solving the problem]

[0007] To solve the above-mentioned problems, according to one embodiment, a substrate support method is provided, which detaches and supports a flexible rectangular substrate placed on a mounting surface of a mounting stage. The substrate support method is characterized in that the mounting stage has a plurality of lifting pins that can protrude / recess from the mounting surface, and includes a process of: "raising the lifting pins to the molding position in such a way that the lifting pins with a large driving amount from the point of travel to the molding position first stop at the molding position, thereby molding the shape of the substrate"; and a process of raising the lifting pins to the target position. [Effects of the Invention]

[0008] According to one example, a substrate support method and substrate processing apparatus are provided that "supports a substrate with a desired shape while supporting a flexible substrate with lifting pins".

Implementation Method

[0010] Hereinafter, with reference to the drawings, the form used to implement this disclosure will be explained. In the various drawings, the same symbols are sometimes used for the same constituent parts, and repeated descriptions are omitted.

[0011] <Substrate Processing Apparatus> Using FIGS. 1 to 3, the substrate processing apparatus 1 of this embodiment will be described. FIG. 1 is an example of a schematic cross-sectional view of the substrate processing apparatus 1. The substrate processing apparatus 1 is an apparatus for placing a substrate G on a mounting stage and applying a desired process (e.g., etching process) to the substrate G. Furthermore, the mounting stage is configured to adjust (e.g., cool) the temperature of the placed substrate G. In addition, the horizontal direction is referred to as the X direction, the horizontal direction orthogonal to the X direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction.

[0012] Furthermore, the substrate G processed in the substrate processing apparatus 1, in other words, the substrate G placed on the mounting stage, is rectangular in shape when viewed from above and is a flexible substrate. The substrate G may, for example, be a flexible rectangular glass substrate. The substrate G may, for example, be a thin-film glass substrate with a thickness of approximately 0.2 mm to several mm. The substrate G may, for example, have planar dimensions ranging from approximately 1500 mm × 1800 mm (6th generation) to approximately 3000 mm × 3400 mm (10.5th generation). The substrate G may, for example, be a glass substrate used in the manufacture of a flat panel display.

[0013] The substrate processing apparatus 1 includes a chamber 2, which serves as a processing container, for housing the substrate G. The chamber 2 is, for example, made of aluminum whose surface has been treated with acid-resistant aluminum (anodized), and is formed into a quadrangular cylindrical shape corresponding to the shape of the substrate G.

[0014] At the bottom of the chamber 2, a base 4, serving as a stage, is provided to hold the substrate G. The base 4 is formed in the shape of a square plate or column corresponding to the shape of the substrate G. The base 4 has a substrate 4a made of a conductive material such as metal, and an insulating member 4b disposed between the bottom of the substrate 4a and the bottom surface of the chamber 2. A power supply line 23 for supplying high-frequency power is connected to the substrate 4a. The power supply line 23 is connected to a high-frequency power supply 25 via a matching device 24. The high-frequency power supply 25 applies, for example, 13.56MHz high-frequency power to the base 4. The matching device 24 matches the output impedance of the high-frequency power supply 25 with the input impedance on the load side. Thus, the base 4 is configured to function as a lower electrode.

[0015] Furthermore, an electrostatic chuck 40 is provided on the base 4 to adsorb the substrate G by electrostatic attraction. The electrostatic chuck 40 is disposed on the upper part of the substrate 4a. The electrostatic chuck 40 has a dielectric 41 and an internal electrode 42 disposed inside the dielectric 41. A power supply line 43 for applying voltage is connected to the internal electrode 42. The power supply line 43 is connected to a power source 45 via a switch 44. The power source 45 applies voltage to the internal electrode 42. The switch 44 turns the voltage application on / off.

[0016] Furthermore, the substrate mounting surface 4c on the base 4 (electrostatic chuck 40) serves as the substrate mounting surface 4c for mounting the substrate G. The substrate mounting surface 4c has an outer edge (not shown) that contacts the outer periphery of the back surface of the substrate G; and a recess (not shown) formed inside the outer edge. The recess is configured to supply a heat transfer gas such as He gas. By electrostatically adsorbing the substrate G using the electrostatic chuck 40, the outer periphery of the back surface of the substrate G and the outer edge of the substrate mounting surface 4c are hermetically adsorbed. Furthermore, the substrate G mounted on the base 4 is configured to cool (adjust temperature) by supplying He gas to the space formed as a gap between the back surface of the substrate G and the recess of the substrate mounting surface 4c. Additionally, a plurality of tiny protrusions may be provided in the recess, and the substrate G may be supported by the outer edge and the protrusions.

[0017] A nozzle 11 is provided on the upper part or upper wall of the chamber 2, facing the base 4, to "supply processing gas into the chamber 2 and function as an upper electrode". The nozzle 11 has a gas diffusion space 12 formed inside to diffuse the processing gas, and a plurality of discharge holes 13 for discharging the processing gas are formed on its lower surface or the surface facing the base 4. The nozzle 11 is grounded and together with the base 4 constitutes a pair of parallel plate electrodes. In addition, although this embodiment describes the application of the present disclosure to a substrate processing apparatus that generates plasma by parallel plate electrodes, the present disclosure can also be applied to a substrate processing apparatus that generates plasma by inductive coupling, and of course, the present disclosure can also be applied to a substrate processing apparatus that generates plasma by other methods.

[0018] A gas inlet 14 is provided above the nozzle 11. A processing gas supply pipe 15 is connected to the gas inlet 14. The processing gas supply pipe 15 is connected to a processing gas supply source 18 via a valve 16 and a mass flow controller 17. A processing gas, for example for etching, is supplied from the processing gas supply source 18. As the processing gas, halogen-based gases, O2 gases, Ar gases, and other gases commonly used in this field can be used.

[0019] An exhaust pipe 19 is connected to the bottom wall of chamber 2, and an exhaust device 20 is connected to the exhaust pipe 19. The exhaust device 20 is a vacuum pump equipped with a turbomolecular pump, etc., thereby being configured to evacuate the chamber 2 to a predetermined depressurized atmosphere. An inlet / outlet 21 for moving the substrate G is formed on the side wall of chamber 2, and a gate valve 22 for opening and closing the inlet / outlet 21 is provided. When the inlet / outlet 21 is open, the substrate G is configured to be supported from below by the conveying arm 50 (see Figure 2 described later) as a conveying member, and is conveyed between the substrate G and a conveying chamber (not shown) adjacent to the inlet / outlet 21 and the gate valve 22.

[0020] Through holes 7 are formed on the bottom wall of the chamber 2 and the base 4 at the outer periphery and the center (or closer to the center than the outer periphery). In each through hole 7, a lifting pin 8 is inserted, protruding / submerged relative to the substrate mounting surface 4c of the base 4, to support the substrate G from below and move it up and down. The lifting pin 8 is configured to abut against the outer periphery and center of the substrate G when protruding, and is positioned in the radial or width direction by a positioning bushing (not shown) and inserted into the through hole 7.

[0021] The lifting pin 8 protrudes from the outer side of the chamber 2 at its lower part. A flange 26 is formed at the lower part of the lifting pin 8. One end (lower end) of a retractable bellows 27, configured to surround the lifting pin 8, is connected to the flange 26. The other end (upper end) of the bellows 27 is connected to the bottom wall of the chamber 2. Alternatively, the other end (upper end) of the bellows 27 can also be connected to the bottom wall of the base 4. In this way, the bellows 27 retracts and expands in accordance with the lifting pin 8, sealing the gap between the insertion hole 7 and the lifting pin 8.

[0022] Here, FIG2 will be used to further explain the configuration of the through hole 7 and the lifting pin 8. FIG2 is an example of a schematic cross-sectional view of the substrate processing apparatus 1 in the planar direction. In addition, in FIG2, the positions of the transfer arm 50 and the substrate G when the substrate G held by the transfer arm 50 is positioned above the placement area 4d are indicated by a two-point chain line.

[0023] As shown in Figure 2, the substrate G and the substrate mounting surface 4c of the base 4 on which the substrate G is mounted are rectangular in shape with a short side (Y direction) and a long side (X direction) when viewed from above. Furthermore, the substrate mounting surface 4c has a mounting area 4d corresponding to the substrate G (shown as a dashed line in Figure 2). When the substrate G is placed on the base 4, the substrate G is placed in the mounting area 4d. Additionally, in Figure 2, a dotted chain line represents the center line 4e (the line connecting the midpoint of one long side to the midpoint of the other long side) and the center line 4f (the line connecting the midpoint of one short side to the midpoint of the other short side) of the mounting area 4d. Furthermore, in Figure 2, for convenience, although the dashed line representing the mounting region 4d is drawn further inward than the two-point chain line representing the substrate G, this does not mean that the mounting region 4d is limited to being further inward than the outer periphery of the substrate G. Ideally, the mounting region 4d should have the same shape and area as the substrate G. Also, the mounting region 4d can also be a region having the shape and area containing the substrate G.

[0024] The base 4 has through holes 7a to 7d as through holes 7. The through holes 7a to 7d are provided on the outer periphery of the mounting region 4d. The through hole 4d is provided at the center of the surface of the mounting region 4d, which is surrounded by the outer periphery of the mounting region 4d. Lifting pins 8a to 8d are disposed in the through holes 7a to 7d as lifting pins 8.

[0025] At the corners of the rectangular mounting area 4d, through holes 7a are provided. In the example shown in FIG2, four through holes 7a are provided in the mounting area 4d with the center line 4e and the center line 4f as the axis of symmetry. Each through hole 7a is provided with a lifting pin 8a. Hereinafter, the four lifting pins 8a are also referred to as the first group Gr.1.

[0026] A through hole 7b is provided at the center of the short side of the rectangular mounting area 4d (between the two corners on the left and right sides (Y direction) with the center line 4f as the axis of symmetry). In the example shown in FIG2, two through holes 7b are provided at the center of one short side with the center line 4f as the axis of symmetry. Similarly, two through holes 7b are provided at the center of the other short side with the center line 4f as the axis of symmetry. Four through holes 7b are provided within the mounting area 4d. A lifting pin 8b is respectively arranged in each through hole 7b. Hereinafter, the four lifting pins 8b are also referred to as Group 2 Gr.2.

[0027] A through hole 7c is provided at the center of the long side of the rectangular mounting area 4d (between the two corners (in the X direction) before and after taking the center line 4e as the axis of symmetry). In the example shown in FIG2, a through hole 7c is provided on the center line 4e at the center of one long side. Similarly, a through hole 7c is provided on the center line 4e at the center of the other long side. There are two through holes 7c within the mounting area 4d. A lifting pin 8c is respectively arranged in each through hole 7c. Hereinafter, the two lifting pins 8c are also referred to as Group 3 Gr.3.

[0028] A through hole 7d is provided at the center of the surface near the center of the rectangular mounting area 4d. In the example shown in Figure 2, the through hole 7d is provided on the center line 4e, and two through holes 7d are provided with the center line 4f as the axis of symmetry. A lifting pin 8d is provided in each through hole 7d. Hereinafter, the two lifting pins 8d will also be referred to as the fourth group Gr.4.

[0029] Figure 3 is a block diagram showing an example of the structure of the drive mechanism for driving the lifting pins 8a to 8d.

[0030] Lifting pins 8a to 8d are respectively connected to drive units 9a to 9d. Lifting pins 8a to 8d are configured to protrude from and retract into the substrate mounting surface 4c of the base 4 by being driven to rise and fall by the drive units 9a to 9d. Drive units 9a to 9d are each configured, for example, using stepper motors. Furthermore, although it is shown in FIG3 that lifting pins 8a to 8d are configured to be driven individually, this is not a limitation; they can also be configured to be driven for each group (Group 1 Gr.1 to Group 4 Gr.4). With this configuration, the number of drive units (stepper motors) can be reduced.

[0031] The driving of the drive units 9a to 9d is configured to be individually controlled by a controller 31 equipped with a microprocessor (computer), thereby enabling the lifting pins 8a to 8d to rise and fall independently. The controller 31 is connected to: a user interface 32, consisting of a keyboard for engineers to input commands for managing the driving of the drive units 9a to 9d, or a display showing the driving status of the drive units 9a to 9d; and a memory unit 33, which stores and records control programs or driving condition data for implementing the driving of the drive units 9a to 9d under the control of the controller 31. Furthermore, as needed, any formula can be read from the memory unit 33 based on instructions from the user interface 32 and executed by the controller 31, thereby enabling and stopping the drive units 9a to 9d under the control of the controller 31. The aforementioned formula can be used, for example, by utilizing computer-readable memory media such as CD-ROMs, hard drives, and flash memory, or it can be used by transmitting it from other devices at any time via, for example, a dedicated line.

[0032] The controller 31, the user interface 32 and the memory unit 33 constitute a control unit that "controls the lifting of the lifting pins 8a to 8d by the drive units 9a to 9d". The base 4, the lifting pins 8a to 8d, the drive units 9a to 9d and the control unit constitute a substrate mounting mechanism.

[0033] Next, using Figures 4 to 6, the resetting operation of the substrate G in the substrate processing apparatus 1 will be explained.

[0034] Figure 4 is a flowchart illustrating an example of the resetting operation of the substrate G of the substrate processing apparatus 1 according to this embodiment. Figure 5 is a timing diagram showing an example of the operation of the lifting pin 8 during the resetting operation of the substrate G of the substrate processing apparatus 1 according to this embodiment. Figure 6 is a cross-sectional schematic diagram illustrating an example of the arrangement of the lifting pin 8 and the shape of the substrate G in each state of the resetting operation of the substrate G of the substrate processing apparatus 1 according to this embodiment. In addition, the bending of the substrate G is exaggerated in Figure 6.

[0035] Here, the resetting operation of the substrate G is an operation of "raising the lifting pins 8a to 8d to lift the substrate G and supporting the substrate G in the desired shape, then lowering the lifting pins 8a to 8d and repositioning the substrate G on the base 4". The height (target position) of the lifting pins 8a to 8d when supporting the substrate G in the desired shape is offset in a manner that is, as shown by the lifting pin height in step S110 of FIG5, "the height of the lifting pin 8a of the first group Gr.1 > the height of the lifting pin 8b of the second group Gr.2 > the height of the lifting pin 8c of the third group Gr.3 > the height of the lifting pin 8d of the fourth group Gr.4". In this way, when supporting the substrate G in the desired shape, the lifting pin 8a of the first group Gr.1 is positioned at the highest position. In other words, the offset of the lifting pin 8a of the first group Gr.1 is described as Loffset_1 and set to 0. Furthermore, when supporting the substrate G in the desired shape, the offset of the lifting pin 8a of the second group Gr.2 relative to the lifting pin 8a of the first group Gr.1 is defined as Loffset_2, the offset of the lifting pin 8c of the third group Gr.3 relative to the lifting pin 8a of the first group Gr.1 is defined as Loffset_3, and the offset of the lifting pin 8d of the fourth group Gr.4 relative to the lifting pin 8a of the first group Gr.1 is defined as Loffset_4.

[0036] In step S101, the controller 31 determines whether the substrate G placed on the base 4 is bending. The determination of whether the substrate G is bending can be based, for example, on the flow rate of the heat transfer gas supplied between the substrate G and the base 4. However, the determination of whether the substrate G is bending is not limited to this. If the substrate G is not bending (S101 • NO), the process of resetting the substrate G ends. If the substrate G is bending (S101 • YES), the controller 31 proceeds to step S102.

[0037] In step S102, the controller 31 releases the static chuck 40.

[0038] In step S103, the controller 31 begins to drive the lifting pin 8a of the first group Gr.1 to a predetermined forming position. Here, the predetermined forming position of the lifting pin 8a of the first group Gr.1 is the relative height of the lifting pin 8a of the first group Gr.1 with respect to the pin (lifting pin 8d of the fourth group Gr.4) which is configured at the lowest position in the target position, i.e., Loffset_4.

[0039] In step S104, the controller 31 stops the lifting pin 8a of the first group Gr.1 at a predetermined molding position. Figure 6(a) shows a schematic cross-sectional shape 201 of the AA section (see Figure 2) schematically representing the shape of the substrate G at the end of step S104, and a schematic cross-sectional shape 202 of the BB section (see Figure 2). Figure 6(b) shows a schematic cross-sectional shape 203 of the CC section (see Figure 2) schematically representing the shape of the substrate G at the end of step S104, and a schematic cross-sectional shape 204 of the DD section (see Figure 2).

[0040] In step S105, the controller 31 begins to drive the lifting pin 8b of the second group Gr.2 to a predetermined molding position. Here, the predetermined molding position of the lifting pin 8b of the second group Gr.2 is the relative height of the lifting pin 8b of the second group Gr.2 with respect to the pin (lifting pin 8d of the fourth group Gr.4) which is configured at the lowest position in the target position, namely "Loffset_4 - Loffset_2".

[0041] In step S106, the controller 31 stops the lifting pin 8b of the second group Gr.2 at a predetermined molding position. Figure 6(c) shows a schematic cross-sectional shape 201 of the AA section (see Figure 2) schematically representing the shape of the substrate G at the end of step S106, and a schematic cross-sectional shape 202 of the BB section (see Figure 2). Figure 6(d) shows a schematic cross-sectional shape 203 of the CC section (see Figure 2) schematically representing the shape of the substrate G at the end of step S106, and a schematic cross-sectional shape 204 of the DD section (see Figure 2).

[0042] In step S107, the controller 31 begins to drive the lifting pin 8c of the third group Gr.3 to a predetermined molding position. Here, the predetermined molding position of the lifting pin 8c of the third group Gr.3 is the relative height of the lifting pin 8c of the third group Gr.3 with respect to the pin (lifting pin 8d of the fourth group Gr.4) which is configured at the lowest position in the target position, namely "Loffset_4-Loffset_3".

[0043] In step S108, the controller 31 stops the lifting pin 8c of the third group Gr.3 at a predetermined molding position. Figure 6(e) shows a schematic cross-sectional shape 201 of the AA section (see Figure 2) schematically representing the shape of the substrate G at the end of step S108 and a schematic cross-sectional shape 202 of the BB section (see Figure 2). Figure 6(f) shows a schematic cross-sectional shape 203 of the CC section (see Figure 2) schematically representing the shape of the substrate G at the end of step S108 and a schematic cross-sectional shape 204 of the DD section (see Figure 2).

[0044] Furthermore, in steps S103 to S108, the lifting pin 8d of the fourth group Gr.4 does not protrude from the substrate mounting surface 4c of the base 4.

[0045] Through the molding process shown in steps S103 to S108 above, the lifting pins 8a to 8d are shaped with offsets (Loffset_2, Loffset_3, Loffset_4). Furthermore, in the molding process shown in steps S103 to S108, the lifting pins 8 with the largest driving amount up to the molding position are driven sequentially, and the lifting pins 8 with the largest driving amount up to the molding position are stopped sequentially. Through this molding process, the substrate G supported by the lifting pins 8a to 8d is molded into the desired shape. Additionally, the molded substrate G is in contact with the substrate mounting surface 4c of the base 4 near the center of its surface.

[0046] In step S109, the controller 31 starts to drive all the lifting pins 8 of the first group Gr.1 to the fourth group Gr.4 to the predetermined target position. By raising all the lifting pins 8 at the same time, the substrate G rises by means of the lifting pins 8 while maintaining the shape formed by the molding process.

[0047] In step S110, the controller 31 stops all the lifting pins 8 of the first group Gr.1 to the fourth group Gr.4 at a predetermined target position. Figure 6(g) shows a schematic cross-sectional shape 201 of the AA section (see Figure 2) schematically representing the shape of the substrate G at the end of step S110 and a schematic cross-sectional shape 202 of the BB section (see Figure 2). Figure 6(h) shows a schematic cross-sectional shape 203 of the CC section (see Figure 2) schematically representing the shape of the substrate G at the end of step S110 and a schematic cross-sectional shape 204 of the DD section (see Figure 2).

[0048] Through the lifting process shown in steps S109 to S110 above, the shape of the substrate G formed by the molding process shown in steps S103 to S108 is directly lifted to the target position.

[0049] In step S111, the controller 31 causes the lifting pin 8 to descend, placing the substrate G on the base 4.

[0050] In step S112, the controller 31 controls the electrostatic chuck 40 to electrostatically adsorb the substrate G onto the base 4.

[0051] In step S113, the controller 31 determines whether the bending of the substrate G placed on the base 4 has been eliminated. If the bending has not been eliminated (S113 • No), the controller 31 returns to step S102 and repeats the reset operation (S102~S112). If the bending has been eliminated (S113 • Yes), the reset operation of the substrate G ends.

[0052] In addition, although it has been explained that "after the lifting pin 8a of the first group Gr.1 is stopped in the molding position (see S104), the lifting pin 8b of the second group Gr.2 begins to rise (see S105), and after the lifting pin 8b of the second group Gr.2 is stopped in the molding position (see S106), the lifting pin 8c of the third group Gr.3 begins to rise (see S105)," it is not limited to this.

[0053] For example, it can also be controlled such that the lifting pin 8b of the second group Gr.2 starts to rise before the lifting pin 8a of the first group Gr.1 stops at the molding position, and the lifting pin 8b of the second group Gr.2 stops at the molding position after the lifting pin 8a of the first group Gr.1 stops. Alternatively, it can also be controlled such that the lifting pin 8c of the third group Gr.3 starts to rise before the lifting pin 8b of the second group Gr.2 stops at the molding position, and the lifting pin 8c of the third group Gr.3 stops at the molding position after the lifting pin 8b of the second group Gr.2 stops.

[0054] Next, using FIG7, the operation of the lifting pin during the substrate resetting operation of the substrate processing apparatus of the reference example will be explained. FIG7 is a timing diagram showing an example of the operation of the lifting pin during the substrate resetting operation of the substrate processing apparatus of the reference example.

[0055] In the substrate processing apparatus of the reference example, the controller 31 starts to drive all the lifting pins 8 of the first group Gr.1 lifting pins 8a to the fourth group Gr.4 lifting pins 8d to the predetermined molding position.

[0056] That is, the lifting pins 8a of group 1 Gr.1 to 8c of group 3 Gr.3 are driven. When the lifting pin 8c of group 3 Gr.3 reaches the forming position, the lifting pins 8a of group 1 Gr.1 and 8b of group 2 Gr.2 continue to be driven, while the lifting pin 8c of group 3 Gr.3 stops driving. When the lifting pin 8b of group 2 Gr.2 reaches the forming position, the lifting pins 8a of group 1 Gr.1 continue to be driven, while the lifting pin 8b of group 2 Gr.2 stops driving. That is, the lifting pins 8 with the smallest driving amount up to the forming position stop driving in sequence. When the lifting pin 8a of group 1 Gr.1 reaches the forming position, the process moves to the lifting process. In the lifting process, all the lifting pins from the lifting pins 8a of group 1 Gr.1 to 8d of group 4 Gr.4 are driven to the predetermined target position.

[0057] Figure 8 is a cross-sectional schematic diagram showing the state of the substrate G lifted by the lifting pin 8 in the reference example and this embodiment. In addition, Figure 8 schematically shows the relationship between the shape of the lifting pin 8 and the substrate G, and does not correspond to the actual arrangement of the lifting pin 8.

[0058] Figures 8(a) to 8(c) illustrate the lifting action of the substrate G in the substrate processing apparatus of the reference example. In the reference example, the lifting pins 8 with small driving amounts are sequentially stopped from the molding position up to the molding position. Figure 8(a) shows an example of the state in which the lifting pin 8c of the third group Gr.3 stops at the molding position. Figure 8(b) shows an example of the state in which the lifting pin 8b of the second group Gr.2 stops at the molding position. Figure 8(c) shows an example of the state in which the lifting pin 8a of the first group Gr.1 stops at the molding position.

[0059] In the lifting action shown in the reference example, from the stopped state of the lifting pins 8b of the second group Gr.2, the lifting pins 8c of the third group Gr.3, and the lifting pins 8d of the fourth group Gr.4 (see Figure 8(b)), the substrate G is lifted by the lifting pin 8a of the first group Gr.1, which has a large driving amount up to the forming position, as shown in Figure 8(c). The substrate G leaves the stopped lifting pins 8b, 8c, and 8d. Therefore, there is a risk that the actual shape of the substrate G may not be the shape obtained from the analysis (shown as a dashed line in Figure 8(c)). Furthermore, because the shape of the substrate G supported by the lifting pins 8 may not be the expected shape, there is a risk that the substrate G may be bent again when it is placed back on the base 4.

[0060] Figures 8(d) to 8(f) illustrate the lifting action of the substrate G in the substrate processing apparatus 1 of this embodiment. In this embodiment, the lifting pins 8 with the largest driving amount up to the molding position are sequentially stopped. Figure 8(d) shows an example of the state of the lifting pin 8a of the first group Gr.1 during its ascent to the molding position. Figure 8(e) shows an example of the state of the lifting pin 8b of the second group Gr.2 during its ascent to the molding position. Figure 8(f) shows an example of the state of the lifting pin 8c of the third group Gr.3 stopped at the molding position.

[0061] In the lifting action shown in this embodiment, the lifting pins 8 with large driving amounts from the point of reaching the forming position are sequentially stopped, thereby preventing the substrate G from leaving the lifting pins 8. This ensures that the actual shape of the substrate G matches the resolved shape. Furthermore, when the substrate G is repositioned on the base 4, the recurrence of substrate G bending is suppressed. Additionally, the number of re-positioning attempts for the substrate G is reduced, and the productivity of the substrate processing apparatus 1 is improved.

[0062] Although the substrate processing apparatus 1 has been described above, this disclosure is not limited to the above-described embodiments, and various modifications and improvements can be made within the scope of the spirit of the present invention as described in the claims. [Simplified Explanation of the Diagram]

[0009] [Fig. 1] An example of a schematic cross-sectional view of a substrate processing apparatus. [Fig. 2] An example of a schematic cross-sectional view of a substrate processing apparatus in a planar direction. [Fig. 3] An example of a block diagram showing the configuration of the drive mechanism for driving the lifting pin. [Fig. 4] A flowchart illustrating an example of the substrate resetting operation of the substrate processing apparatus of this embodiment. [Fig. 5] A timing diagram illustrating an example of the operation of the lifting pin during the substrate resetting operation of the substrate processing apparatus of this embodiment. [Fig. 6] An example of a cross-sectional schematic diagram illustrating the configuration of the lifting pin and the shape of the substrate in each state of the substrate resetting operation of the substrate processing apparatus of this embodiment. [Fig. 7] A timing diagram illustrating an example of the operation of the lifting pin during the substrate resetting operation of the substrate processing apparatus of the reference example. [Fig. 8] An example of a cross-sectional schematic diagram showing the state of the substrate lifted by the lifting pin.

Claims

1. A substrate support method, comprising detaching and supporting a flexible rectangular substrate placed on a mounting surface of a mounting stage, the substrate support method being characterized in that: the mounting stage is provided with a plurality of lifting pins that can protrude / recess from the mounting surface, and includes: a process of "raising the lifting pins to the molding position in such a way that the lifting pins with a large driving amount from the point of travel to the molding position first stop at the molding position, thereby molding the shape of the substrate"; and a process of raising the lifting pins to a target position, wherein the lifting pins are: a first lifting pin disposed on the mounting surface and disposed at the corner of the rectangular mounting area on which the substrate is mounted; a second lifting pin disposed at the center of the short side of the mounting area; a third lifting pin disposed at the center of the long side of the mounting area; and a fourth lifting pin disposed at the center of the surface of the mounting area; the process of molding the substrate includes: The process of starting to drive the first lifting pin and raising it to the forming position; the process of stopping the first lifting pin at the forming position; the process of starting to drive the second lifting pin and raising it to the forming position; the process of stopping the second lifting pin at the forming position after the first lifting pin stops; the process of starting to drive the third lifting pin and raising it to the forming position; the process of stopping the third lifting pin at the forming position after the second lifting pin stops.

2. The substrate support method as described in claim 1, wherein, The process of raising the second lifting pin to the forming position is to start driving the second lifting pin after the first lifting pin stops. The process of raising the third lifting pin to the forming position is to start driving the third lifting pin after the second lifting pin stops.

3. The substrate support method as described in claim 1 or 2, wherein, In the process of molding the aforementioned substrate, the aforementioned fourth lifting pin does not protrude from the aforementioned mounting surface.

4. The substrate support method as described in claim 1 or 2, wherein, The aforementioned substrate is a glass substrate used in the manufacture of flat panel displays.

5. A substrate processing apparatus, characterized in that it comprises: a mounting stage for placing a flexible rectangular substrate on a mounting surface; a plurality of lifting pins protruding from / into the mounting surface; and a control unit for controlling the lifting of the lifting pins, wherein the control unit is configured to raise the lifting pins to the molding position by first stopping the lifting pins at the molding position with a large driving amount from the point of travel to the molding position, thereby molding the shape of the substrate, and then raise the lifting pins to a target position, wherein the lifting pins comprise: a first lifting pin disposed on the mounting surface and at a corner of the rectangular mounting area on which the substrate is placed; a second lifting pin disposed at the center of the short side of the mounting area; a third lifting pin disposed at the center of the long side of the mounting area; and a fourth lifting pin disposed at the center of the surface of the mounting area, wherein the control unit is configured to start driving the first lifting pin to raise it to the molding position when molding the shape of the substrate. Stop the first lifting pin at the forming position, start driving the second lifting pin to rise to the forming position, stop the second lifting pin at the forming position after the first lifting pin stops, start driving the third lifting pin to rise to the forming position, and stop the third lifting pin at the forming position after the second lifting pin stops.

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