Pellicle package for packaging container containing pellicle, and pellicle container

Abstract

A protective film packaging body and a protective film containment body, wherein the total amount of volatile organic components escaping under heating conditions of 100°C for 30 minutes is less than 90 ppm.

Description

Protective film packaging and protective film containment This disclosure relates to a protective film packaging body and a protective film containment body. In photolithography, a technique for forming patterns by coating the surface of objects such as electronic components, printed circuit boards, and display panels with a photosensitive material and exposing it to form a pattern, a transparent substrate with a pattern formed on one side is used, called a mask. In these manufacturing steps, light is irradiated onto the photosensitive layer through a reticle (also called an exposure original plate or photomask) to pattern the material. If foreign matter adheres to the mask, the light is absorbed by the foreign matter or reflected and bent at the surface of the foreign matter. As a result, the formed pattern becomes distorted or has rough edges, affecting the size, quality, and appearance of the patterned material. To eliminate this problem, a protective film, including a light-transmitting protective film, is installed on the surface of the mask to inhibit the adhesion of foreign matter. In recent years, with the increasing performance of electronic components and the miniaturization of circuit widths, protective films have become more susceptible to the effects of trace amounts of escaping gases or fine particles. To reduce the adhesion of escaping gases to the surface of components, which could cause the surface to become blurred or deteriorate, for example, in Japanese Patent Application Publication No. 2007-12793, the container for containing the protective film is designed to contain polycarbonate resin and conductive carbon black in order to reduce the amount of volatile organic gases generated by the container. [Problem to be Solved by the Invention] The inventors have conducted intensive research and have made a new discovery: the volatile organic compounds that escape from the packaging body that encapsulates the protective film adhere to the packaged protective film and separate from the volatile compounds that originate from the materials that constitute the protective film itself. As these volatile compounds are generated from the protective film, they become one of the factors that cause contamination of the protective film. One embodiment of this disclosure aims to solve the problem of providing a protective film packaging body that reduces the amount of gas escaping from the protective film caused by the adhesion of volatile organic compounds generated by the packaging body. Another embodiment of this disclosure aims to solve the problem of providing a protective film containment body that reduces the amount of gas escaping from the protective film caused by the adhesion of volatile organic compounds generated by the packaging body. [Means for Solving the Problem] Specific means for solving the aforementioned problem include the following: <1> A protective film packaging body, wherein the total amount of volatile organic compounds escaping under heating conditions of 100°C for 30 minutes is 90 ppm or less. <2> The protective film packaging body as described in <1> comprises at least two layers: a sealant layer and a substrate layer. <3> The protective film packaging body as described in <2>, wherein the thickness of the sealant layer is 40 μm or less. <4> The protective film packaging body as described in <2> or <3>, wherein an adhesive layer is provided between the sealant layer and the substrate layer. <5> The protective film packaging body as described in any one of <2> to <4>, wherein the sealant layer comprises an ethylene-vinyl alcohol copolymer. <6> The protective film packaging body as described in any one of <1> to <5>, wherein the breaking strength is 5 N or more and 50 N or less. <7> The protective film packaging body as described in any one of <1> to <6> is a packaging body for a protective film having an original adhesive, wherein the original adhesive comprises a styrene-butadiene-based adhesive. <8> A protective film container comprising: a protective film; a protective film receiving container for receiving the protective film; and a protective film packaging body as described in any one of <1> to <7> for packaging the protective film receiving container. <9> The protective film container as described in <8>, wherein the protective film comprises an original adhesive, wherein the original adhesive is a styrene-butadiene-based adhesive. [Effects of the Invention] According to one embodiment of the present disclosure, a protective film packaging body can be provided, which can reduce the amount of gas escaping from the protective film caused by the adhesion of volatile organic compounds generated from the protective film packaging body. According to another embodiment of the present disclosure, a protective film containment body can be provided, which can reduce the amount of gas escaping from the protective film caused by the adhesion of volatile organic compounds generated from the protective film packaging body. In this disclosure, the numerical range indicated by "~" refers to the range in which the values ​​before and after "~" are respectively the minimum and maximum values. Within the numerical ranges described in stages in this disclosure, the upper or lower limit value described in a certain numerical range can be replaced by the upper or lower limit value of other numerical ranges described in stages. Furthermore, within the numerical ranges described in this disclosure, the upper or lower limit value described in a certain numerical range can be replaced by the value shown in the embodiments. In this disclosure, a combination of two or more preferred states constitutes a better state. In this disclosure, when multiple substances equivalent to each component are present, unless otherwise specified, the amount of each component refers to the total amount of the multiple substances. In this specification, the term "step" includes not only independent steps, but also steps that cannot be clearly distinguished from other steps, as long as the desired purpose of the step is achieved, are included in this terminology. <Protective Film Packaging> The protective film packaging disclosed herein exhibits a total volatile organic compound (VOC) escaping amount of less than 90 ppm under heating conditions of 100°C for 30 minutes. By using the protective film packaging disclosed herein, the amount of escaping gas from the protective film caused by the adhesion of VOCs generated from the protective film packaging can be reduced. The term "protective film packaging" refers to packaging components that encase a protective film. Volatile organic compounds (VOCs) refer to components with a vapor pressure of 0.01 kPa or higher at 25°C. Examples of VOCs include aromatic hydrocarbons and aliphatic hydrocarbons. Escape gases refer to gases generated from materials such as resins that constitute the protective film packaging. The total amount of volatile organic compounds (VOCs) escaping from the protective film packaging under heating conditions of 100°C for 30 minutes is 90 ppm or less, preferably 30 ppm or less, more preferably 15 ppm or less, further preferably 10 ppm or less, and particularly preferably 5 ppm or less. That is, the closer the total amount of VOCs escaping from the protective film packaging under heating conditions of 100°C for 30 minutes is to 0 ppm, the better, and more preferably below the detection limit or 0 ppm. If the total amount of VOCs escaping from the protective film packaging is within the aforementioned range, the amount of escaping from the protective film caused by the adhesion of VOCs escaping from the protective film packaging can be further reduced. The amount of volatile organic compounds (VOCs) escaping was determined as follows. A 10 mg sample was cut from the protective film packaging and used as a test piece. The test piece was placed in a two-way capped glass insert. Next, while He gas was flowing in at a rate of 3.0 mL / min as the carrier gas, the mixture was heated at 100°C for 30 minutes, and the volatilized VOCs were collected using a -20°C cold trap. The amount of collected VOCs (converted to n-decane) was determined using gas chromatograph-mass spectrometry (GCMS) as the amount of escaping gas. The GCMS determination conditions were as follows. Measurement device name: QP2010plus; Column: DB-1 (inner diameter: 0.32 mm, length: 60 m, thickness: 1.00 μm); Scan range: 35 m / Z~450 m / Z; Ionization: 0.78 kV; Measurement method: The amount of gas generated at 100℃ for 30 minutes was calculated by converting to n-decane. There are no particular limitations on the specific method for setting the volatile organic compound escaping amount within the specified range; methods such as adjusting the material forming the protective film packaging can be cited. For example, the method may be to set the protective film packaging as a laminate comprising at least two layers, a sealant layer and a substrate layer, and to adjust the material or thickness of the sealant layer. In terms of strength in use, the breaking strength of the protective film packaging is preferably 5 N or more and 50 N or less, more preferably 7 N or more and 45 N or less, and even more preferably 10 N or more and 40 N or less. The breaking strength was determined according to Japanese Industrial Standards (JIS)-K7127-5 (1999) (corresponding to ISO 527-3:1995). The breaking strength was measured by stretching both ends of a JIS-K7127 test piece type 5 (dumbbell shape, 115 mm in total length, 6 mm in width of parallel sections, 25 mm between markings, and 25 mm in width of the gripping section). There are no particular limitations on the specific method for setting the destructive strength to the range, for example, methods such as adjusting the material or thickness of the substrate layer can be listed. The protective film packaging preferably comprises at least two layers: a sealant layer and a substrate layer; more preferably, it comprises a sealant layer, an adhesive layer, and a substrate layer in sequence. When the protective film packaging is a laminate comprising at least two layers (a sealant layer and a substrate layer), or when it comprises a laminate comprising a sealant layer, an adhesive layer, and a substrate layer in sequence, the outermost surface of the protective film side may be the sealant layer, and the outermost surface of the outer peripheral side may be the substrate layer. When the protective film packaging is composed of at least two layers (a sealant layer and a substrate layer), or when it comprises a laminate comprising a sealant layer, an adhesive layer, and a substrate layer in sequence, it is considered that volatile organic compounds (VOCs) in the protective film packaging are more likely to escape from the sealant layer. Therefore, if the outermost surface of the protective film side is the sealant layer, the adhesion of VOCs escaping from the protective film packaging becomes significant. In contrast, the protective film packaging disclosed herein, by having the aforementioned structure, easily maintains a low amount of escaping gas from the protective film caused by the adhesion of volatile organic components generated from the protective film packaging. (Sealant Layer) The sealant layer can be a single layer or a laminate containing two or more layers. There are no particular limitations on the material of the sealant layer; compositions containing known resins can be used. Examples of such resins include: polyethylene (PE) (including high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), etc.), polypropylene (PP), polybutene, polymethylpentene, and other homopolymers, i.e., polyolefin resins; copolymers of two or more olefins selected from the group consisting of ethylene, propylene, butene, methylpentene, etc.; polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate; polyamide resins such as nylon-6, nylon-6,6, m-xylenediamine-adipic acid condensate, and polymethyl methacrylate amide; ethylene-vinyl alcohol copolymers, etc. A single resin can be used, or two or more resins can be used in combination. In this context, the material used as the sealant layer, from the viewpoint of further reducing the amount of gas escaping from the protective film caused by the adhesion of volatile organic components generated by the self-protective film packaging, is preferably at least one selected from the group consisting of polyester resin, polyamide resin, and ethylene-vinyl alcohol copolymer, more preferably at least one selected from the group consisting of polyester resin and ethylene-vinyl alcohol copolymer, and even more preferably ethylene-vinyl alcohol copolymer. The thickness of the sealant layer (the total thickness in the case of a laminated structure comprising two or more layers) is preferably 500 μm or less, more preferably 100 μm or less, further preferably 50 μm or less, and particularly preferably 40 μm or less. If the thickness of the sealant layer is within the aforementioned range, the amount of gas escaping from the protective film caused by the adhesion of volatile organic compounds generated by the self-protective film packaging is further reduced. From the viewpoint of sealing, the thickness of the sealant layer (the total thickness in the case of a laminated structure comprising two or more layers) can be 3 μm or more, 5 μm or more, or 15 μm or more. From the aforementioned viewpoint, the thickness of the sealant layer (the total thickness in the case of a laminated structure comprising two or more layers) can be 3 μm or more and 500 μm or less, or 3 μm or more and 40 μm or less. The thickness of the sealant layer (total thickness in the case of a laminated structure comprising two or more layers) can be 40 μm or more, 70 μm or more, or 90 μm or more. As described above, when the protective film packaging is composed of at least two layers, a sealant layer and a substrate layer, it is considered easy for volatile organic compounds (VOCs) in the protective film packaging to escape from the sealant layer. Therefore, as the thickness of the sealant layer increases, the adhesion of VOCs escaping from the protective film packaging also becomes more significant. In contrast, the protective film packaging disclosed herein, by having the aforementioned structure, easily maintains a low amount of escaping from the protective film caused by the adhesion of VOCs escaping from the protective film packaging, even when the thickness of the sealant layer is within the aforementioned range. (Substrate layer) The substrate layer can be a single layer or a laminate containing two or more layers. There are no particular limitations on the material of the substrate layer, and compositions containing known resins can be used. Examples of such resins include: polyethylene (including high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), etc.), ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, polypropylene (PP), ethylene-vinyl acetate copolymers, ethylene-methyl methacrylate copolymers, ionomer resins, and other polyolefin resins; polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate, and other polyester resins; nylon-6, nylon-6,6, and m-xylenediamine-adipic acid condensate. Acrylamide resins such as polymethyl methacrylate amide; acrylic resins such as polymethyl methacrylate; styrene-acrylonitrile resins such as polystyrene, styrene-acrylonitrile copolymer, styrene-acrylonitrile-butadiene copolymer, and polyacrylonitrile; hydrophobic cellulose resins such as cellulose triacetate and cellulose diacetate; halogenated resins such as polyvinyl chloride, polyvinylidene chloride, polyvinylidene fluoride, and Teflon (registered trademark); highly hydrogen-bonded resins such as polyvinyl alcohol, ethylene-vinyl alcohol copolymer, and cellulose derivatives; engineering plastic resins such as polycarbonate resin, polyurethane resin, polyether resin, polyetheretherketone resin, polyphenylene ether resin, polyoxymethylene resin, and liquid crystal resin. Resins can be a single type or a combination of two or more. In this context, the material used as the substrate layer is preferably a material that is not prone to generating static electricity, from the viewpoint of preventing dust and other particles from adhering to the surface of the protective film packaging. This material may include a resin that has undergone antistatic treatment, or more preferably a resin that includes either polyethylene terephthalate or polyethylene naphthalate. The thickness of the substrate layer (or the total thickness in the case of a multilayer structure containing two or more layers) is not particularly limited, but is preferably 0.1 μm or more and 500 μm or less, more preferably 1 μm or more and 100 μm or less, and even more preferably 5 μm or more and 30 μm or less. (Adhesive Layer) The protective film packaging disclosed herein may have an adhesive layer between the sealant layer and the substrate layer, as needed. The adhesive layer may be a single layer or a laminate containing two or more layers. There are no particular limitations on the material of the adhering layer, and compositions containing known resins can be used. Examples of such resins include polyurethane resins, polyester resins, polyether resins, and mixtures thereof. There is no particular limitation on the thickness of the adhesive layer. However, from the viewpoint of adhesion strength, it is preferably 1 μm or more, and more preferably 2 μm or more. There is also no particular limitation on the thickness of the adhesive layer. However, from the viewpoint of shortening the curing reaction time during adhesive layer formation and reducing the proportion of unreacted material or residual solvent during the effect reaction, it is preferably 5 μm or less, and more preferably 4 μm or less. (Shape or Properties of Protective Film Packaging) There are no particular limitations on the shape of the protective film packaging. Examples of possible shapes include: sheet-like, bag-like, pouch-like, box-like, etc. The protective film packaging may be configured such that, to achieve the effects disclosed herein, a portion of the packaging contains, as needed, a packaging element in which the total amount of volatile organic compounds released under heating conditions at 100°C for 30 minutes exceeds 90 ppm. On the other hand, the proportion of the packaging element in the protective film packaging containing the total amount of said volatile organic compounds exceeding 90 ppm is preferably 20% by mass or less, more preferably 10% by mass or less, and even more preferably 5% by mass or less of the total protective film packaging. Preferably, the protective film packaging does not contain a packaging element in which the total amount of said volatile organic compounds exceeds 90 ppm. There are no particular limitations on the volume of the protective film packaging; it can be appropriately set according to the size of the protective film or the packaging form. For example, a preferred volume for the packaging is 2000 cm³. 3 ~70000 cm 3 4000 cm is preferred. 3 ~30000 cm 3 Therefore, the ideal height is 5000 cm. 3 ~10000 cm 3 . If the volume of the protective film packaging is within the aforementioned range, the balance between the volume of the protective film or protective film shell and the surface area of ​​the protective film packaging can be easily optimized. Therefore, the proportion of volatile organic compounds escaping from the protective film packaging becomes less, further reducing the amount of escaping from the protective film caused by the adhesion of escaping gases derived from the protective film packaging. As an example, the protective film packaging disclosed herein can also be used for packaging with a protective film containing a styrene-butadiene-based adhesive for the original printing plate. The protective film containment disclosed herein includes: a protective film; a protective film receiving container for containing the protective film; and a protective film packaging body for packaging the protective film receiving container. By means of the protective film containment disclosed herein, the amount of gas escaping from the protective film caused by the adhesion of volatile organic compounds generated from the protective film packaging body can be reduced. A protective film containment body refers to a structure that uses the protective film packaging body disclosed herein to package a container containing a protective film. The protective film can be any known type. For example, the protective film comprises a protective film and a support frame supporting the protective film. The shape of the container holding the protective film is not particularly limited; for example, a box shape can be used. The following description refers to one aspect of the protective film. Figure 1 is a schematic cross-sectional view of the protective film 10. In the protective film 10, the protective film 12 and the support frame 14 are bonded together via a film adhesive layer 13. Ventilation holes 16 are formed on the support frame 14, and a template adhesive layer 15 is formed thereon. Although not shown, a release sheet (e.g., a partition) for protecting the template adhesive layer 15 may be further disposed on the surface of the template adhesive layer 15. The ventilation holes 16 may not be formed on the support frame 14, and the support frame 14 may be a structure consisting of multiple laminated layers. The protective film 12 is supported by the support frame 14. Materials for the protective film 12 include transparent materials such as quartz glass, fluorinated resins, cellulose acetate, and carbon nanotubes. Materials for the support frame 14 include aluminum frames treated with acid-resistant aluminum, titanium frames, and silicon frames. From the viewpoint of preventing reflection of exposed light and facilitating the inspection of any attached foreign matter, the support frame 14 is preferably black. An adhesive layer 13 bonds the support frame to the protective film. The material for the adhesive layer 13 is not particularly limited; examples include fluoropolymers such as acrylic resin adhesives, epoxy resin adhesives, silicone resin adhesives, and fluoropolymers containing fluorinated silicone. The original adhesive layer 15 can be formed by coating with a known adhesive and then drying. The material used for the original adhesive layer 15 (hereinafter also referred to as the original adhesive) is not particularly limited, and examples include: acrylic, silicone, styrene-butadiene, urethane, and olefin adhesives. That is, the protective film containment disclosed herein may contain an adhesive for the original plate, wherein the adhesive for the original plate is a styrene-butadiene-based adhesive. To easily suppress deformation of the original plate, a styrene-butadiene adhesive is preferably used as the material for the adhesive layer 15 for bonding the support frame 14 to the original plate. The styrene-butadiene adhesive is more likely to generate volatile organic compounds (VOCs) from the self-protective film packaging after they adhere to the protective film. By having the aforementioned structure, the protective film packaging disclosed herein can reduce the amount of volatile organic compounds (VOCs) from the protective film that adhere to the packaging, even when using a styrene-butadiene adhesive as the material for the adhesive layer 15. In this disclosure, "adhesive" is a concept that includes both adhesives and binders. In this disclosure, "adhesive layer" is a concept that includes both adhesive layers and bonding layers. Materials used as release sheets include polyethylene terephthalate film and polypropylene film. Depending on the materials of the protective film 12 and the support frame 14, the support frame and the protective film can also be bonded together without the film adhesive layer 13. The protective film receiving container can be any known type of protective film receiving container. Materials used for the protective film receiving container include, for example, resins such as polycarbonate, carbon nanotubes, conductive carbon black, and conductive materials such as inorganic particles. The preferred embodiment of the protective film package in the protective film containment disclosed herein is the same as the preferred embodiment listed in the protective film package disclosed herein. [Example] The present disclosure will now be described in more detail by way of examples, but the invention disclosed herein is not limited to these examples. <Examples 1-3 and Comparative Example 1> Protective film packaging bodies comprising a substrate layer and a sealant layer with the materials and film thicknesses shown in the table were respectively fabricated. For each of the obtained protective film packaging bodies, the total amount of volatile organic components escaping under heating conditions of 100°C for 30 minutes (referred to as "total amount of escaping gas from the protective film packaging body" in the table) as measured by the aforementioned method is shown in Table 1. Furthermore, for each of the protective film packaging bodies, the destructive strength values ​​measured by the aforementioned method were all in the range of 10 N or more and 40 N or less. <Evaluation of the total amount of gas escape from the protective film> (1) Preparation of various components as raw materials for masking adhesives • Thermoplastic elastomer (A) Styrene-hydrogenated isoprene-styrene block copolymer (trade name "HYBRAR 7125" (manufactured by Kuraray Co., Ltd.), tanδ peak temperature: -5℃, styrene content: 20% by mass) • Adhesion-improving resins (B) Hydrogenated alicyclic petroleum resins: C9 series hydrogenated petroleum resin (trade name "Alcon P-100" (manufactured by Arakawa Chemical Industry Co., Ltd.), softening point: 100℃±5℃, number average molecular weight (Mn): 610) Rosin ester resin (trade name "Pinecrystal KE-311" (manufactured by Arakawa Chemical Industry Co., Ltd.), softening point: 100℃±5℃) • Plasticizer polybutene (trade name "Nissan Polybutene 30N" (manufactured by Nippon Oil Company)) • Polypropylene thermal decomposable wax (trade name "Hi-wax" NP055 (manufactured by Mitsui Chemicals)) (2) Manufacturing of the protective film: 100 parts by weight of thermoplastic elastomer (A), 100 parts by weight of adhesive resin (B), and 200 parts by weight of softener are mixed in a total of 48 g to obtain a raw material mixture. The obtained raw material mixture is put into a Labo plastomill (manufactured by Toyo Seiki Co., Ltd., capacity: 60 mL) and sealed. It is mixed at 100 rpm for 20 minutes at 200°C to obtain a block-shaped masking adhesive. About 10 g of the masking adhesive is put into a heating bath (heating temperature: 200°C) and melted. On the other hand, an anodized aluminum support frame 14 (outer dimensions: 148.77 mm × 114.9 mm, frame height H: 2.5 mm, frame width W: 2 mm) is prepared as shown in Figure 1. Molten masking adhesive, extruded from a needle tip connected to a heating bath, is applied to one end face of the support frame 14 to form a master adhesive layer 15. The thickness of the formed master adhesive layer 15 is 0.6 mm. Additionally, a partition is disposed on the surface of the master adhesive layer 15. A protective film 10 is obtained by attaching a separator adhesive layer 13 (fluoropolymer (AGC Corporation, CYTOP A type)) to the other end face of the support frame 14 (i.e., the end face where the master adhesive layer 15 is not formed). (Evaluation of Total Escape Gas) The following preparations were made: Each protective film was placed in a clean oven under atmospheric conditions and heated at 70°C–80°C for 20 hours for degassing. The protective films were packaged in their respective packaging containers and stored at 23°C for one week. After storage, the protective films were removed from their packaging containers and placed in the oven. Then, the escape gas generated under heating conditions at 50°C for 4 hours was adsorbed onto Tenax (trademark, manufactured by GL Science, Inc.), a powdered adsorbent material. Subsequently, the Tenax was placed in a GCMS, and the total amount (μg) of the volatile organic compounds escaped from the protective film was measured (converted to n-decane) under heating conditions at 280°C for 10 minutes. This amount was recorded as "Total Amount of Escape Gas from Protective Film (μg / Protective Film)". The results are shown in Table 1. In Table 1, polyethylene is labeled as PE and polyethylene terephthalate is labeled as PET. [Table 1] As shown in Table 1, it can be seen that, compared with the protective film packaging of the comparative example, the protective film packaging of the embodiment can reduce the amount of gas escaping from the protective film caused by the adhesion of volatile organic components generated by the protective film packaging. The disclosure of Japanese Patent Application No. 2022-045759, filed on March 22, 2022, is incorporated herein by reference in its entirety. All documents, patent applications, and technical specifications described in this specification are incorporated herein by reference to the same extent that each document, patent application, and technical specification is specifically and individually described herein. 10: Protective film 12: Protective thin film 13: Adhesive layer for film 14: Support frame 15: Adhesive layer for original plate 16: Vent hole Figure 1 is a schematic cross-sectional view showing an example of a protective film. 10: Protective film 12: Protective film 13: Adhesive layer for membrane 14: Support frame 15: Original version uses adhesive layer 16: Vent hole

Claims

1. A protective film packaging body for packaging a container containing a protective film, wherein the total amount of volatile organic components released under heating conditions of 100°C for 30 minutes is less than 90 ppm, comprising at least two layers: a sealant layer and a substrate layer.

2. The protective film packaging body as claimed in claim 1, wherein the thickness of the sealant layer is less than 40 μm.

3. The protective film packaging body as claimed in claim 1, wherein an adhesive layer is provided between the sealant layer and the substrate layer.

4. The protective film package as claimed in any one of claims 1 to 3, wherein the sealant layer comprises an ethylene-vinyl alcohol copolymer.

5. The protective film packaging body as claimed in any one of claims 1 to 3, wherein the breaking strength is 5 N or more and 50 N or less.

6. The protective film packaging body as claimed in any one of claims 1 to 3 is a packaging body for a protective film having an original adhesive, wherein the original adhesive comprises a styrene-butadiene-based adhesive.

7. A protective membrane containment body, comprising: Protective film; A protective film receiving container is used to house the protective film. And a protective film package as described in any one of claims 1 to 6, for packaging the protective film receiving container.

8. The protective film containment as claimed in claim 7, wherein the protective film comprises an adhesive for the original printing plate, the adhesive for the original printing plate being a styrene-butadiene-based adhesive.

Images