Curable resin composition, cured resin material thereof, semiconductor package and display device with that cured material

Abstract

This invention provides a curable resin composition that yields a curable film that is not prone to yellowing over time caused by electromagnetic waves with wavelengths around 340 nm to 480 nm. The curable resin composition comprises (A) an alkali-soluble resin containing unsaturated groups, (B) a polymeric compound having two or more unsaturated bonds, (C) an epoxy compound having two or more epoxy groups, and (D) a solvent. Component (A) is a resin in which the energy difference between the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) is calculated to be 3.7 eV or higher using quantum chemical calculations.

Description

Curable resin compositions, resin-cured films, semiconductor packaging and display devices This invention relates to a curable resin composition, a resin curable film, a semiconductor package, and a display device. Protective films are used in semiconductor devices or image display devices to seal and protect various components to a substrate. As a protective film requiring transparency or heat resistance, a hardened film can be used, which is a hardened film formed by coating a hardened resin composition containing an alkali-soluble resin having unsaturated groups and a fluorene backbone, and then patterning and hardening it (e.g., Patent Document 1, etc.). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2003-089716 [Problem to be Solved by the Invention] It is known that hardened films made from alkali-soluble resins with a fluorene framework, as described in Patent Document 1, have excellent transparency and heat resistance. However, based on the inventors' understanding, if the hardened film absorbs electromagnetic waves with wavelengths around 340 nm to 480 nm emitted by ultraviolet-light emitting diodes (UV-LEDs) or blue-light emitting diodes (Blue-LEDs), it will slowly deteriorate and sometimes yellow over time. The present invention was made in view of the aforementioned problems, and its object is to provide a curable resin composition, a resin curable film formed from the curable resin composition, and a semiconductor package and display device having the resin curable film, wherein the curable resin composition can produce a curable film that is not prone to yellowing over time caused by electromagnetic waves with wavelengths of 340 nm to 480 nm. [Technical Means for Solving the Problem] One aspect of the present invention for solving the problem relates to the curable resin composition described below [1] to [4]. [1] A curable resin composition comprising: (A) an alkali-soluble resin containing unsaturated groups, (B) a polymeric compound having two or more unsaturated bonds, (C) an epoxy compound having two or more epoxy groups, and (D) a solvent, wherein the (A) component is a resin in which the energy difference between the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) calculated by quantum chemical calculation is 3.7 eV or more. [2] The curable resin composition according to [1] wherein the (A) component is a resin represented by the following general formula (1). [Chemistry 1] (In formula (1), Ar is independently an aromatic hydrocarbon group having 6 or more and 14 or fewer carbon atoms, and a portion of the hydrogen atom constituting Ar may be substituted by a substituent selected from the group consisting of alkyl groups having 1 or more and 10 or fewer carbon atoms, aryl or arylalkyl groups having 6 or more and 10 or fewer carbon atoms, cycloalkyl or cycloalkylalkyl groups having 3 or more and 10 or fewer carbon atoms, alkoxy groups having 1 or more and 5 or fewer carbon atoms, and halogen groups; R 1 is independently an alkyl group having 2 or more and 4 or fewer carbon atoms; l is independently a number having 0 or more and 3 or fewer carbon atoms; G is independently (meth)propenyl, or a substituent represented by the following general formula (2) or the following general formula (3); Y is a tetravalent carboxylic acid residue; Z is independently a hydrogen atom or a substituent represented by the following general formula (4), at least one of Z being a substituent represented by the following general formula (4); n is a number with an average value of 1 or more and 20 or fewer. [Chemistry 2] [Chemistry 3] (In equations (2) and (3), R) 2 represents a hydrogen atom or a methyl group, R 3 is an alkyl or alkylaryl group having 2 or more but fewer than 10 carbon atoms, R 4 represents a saturated or unsaturated hydrocarbon group with 2 or more carbon atoms but less than 20; p represents a number between 0 and 10; and * represents a bonding site. [Chemistry 4] (In formula (4), W is a divalent or trivalent carboxylic acid residue, m is a number of 1 or 2, and * is a bonding site) [3] According to the curable resin composition of [1] or [2], the (A) component is a resin with a weight average molecular weight of 1000 or more and 40000 or less and an acid value of 50 mgKOH / g or more and 200 mgKOH / g or less. [4] According to any one of [1] to [3], the curable resin composition comprises at least one of (E) a polymerization initiator and (F) a sensitizer. Another aspect of the present invention relates to a resin-curing film as described below [5]. [5] A resin-curing film is formed by curing a curable resin composition according to any one of [1] to [4]. Another aspect of the present invention relates to a semiconductor package as described below [6]. [6] A semiconductor package is formed by using a resin curing film according to [5] as at least one protective film. Another aspect of the present invention relates to a display device as described below [7]. [7] A display device is formed by using a resin-cured film according to [5] as at least one protective film. [Effects of the Invention] The present invention provides a curable resin composition, a resin curable film formed from the curable resin composition, and a semiconductor packaging and display device having the resin curable film. The curable resin composition can produce a curable film that is not prone to yellowing over time caused by electromagnetic waves with wavelengths of 340 nm to 480 nm. 1. Curable resin composition In one embodiment of the present invention, the curable resin composition comprises (A) an alkali-soluble resin containing unsaturated groups, (B) a polymeric compound having two or more unsaturated bonds, (C) an epoxy compound having two or more epoxy groups, and (D) a solvent. [Component (A)] Component (A) is an alkali-soluble resin containing unsaturated groups. Component (A) is soluble in alkali developing solutions and can impart patterning properties to curing resin compositions. (A) Component (A) preferably has a polymerizable unsaturated group and an acidic group for exhibiting alkali solubility in one molecule, and more preferably has a polymerizable unsaturated group and a carboxyl group. Component (A) is not particularly limited to any type of resin. Because component (A) has a polymerizable unsaturated group, it imparts excellent photocuring properties to the curable resin composition. Furthermore, during curing, its molecular weight increases, thus acting as an adhesive. Additionally, because component (A) has an acidic group, it improves developability and patterning characteristics (pattern linewidth, pattern straightness), etc. In this embodiment, component (A) is a resin with an energy difference of 3.7 eV or more between the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) calculated by quantum chemical calculations. This energy difference between the HOMO and LUMO is greater than the energy of electromagnetic waves with wavelengths around 340 nm to 480 nm. Therefore, component (A) does not readily absorb electromagnetic waves with wavelengths around 340 nm to 480 nm, thus reducing the likelihood of time-related degradation caused by the absorption of these electromagnetic waves. The energy difference is based on the structural unit of component (A), and is calculated using density functional theory (DFT) to determine the energy difference between the HOMO and LUMO energies in the most stable structure of the structural unit. The most stable structure can be determined based on the molecular structure of component (A) using known structure optimization methods. In this specification, the HOMO and LUMO energies of component (A) are defined using the Gaussian 16, Revision B.01 software package (Gaussian Inc.), for the molecular structure of component (A), with charge 0 and multiplicity 1, using density functional theory (DFT), with B3LYP as the functional and 6-31G(d) as the basis function, and using (Gaussian input line "#B3LYP / 6-31G(d)OPT"), for the most stable structure of the molecular structure. In the DFT and Time-Dependent Density Functional Theory (TDDFT) calculations, other computational science software with similar functions can be used. Furthermore, during the quantum science calculations, for the partial structures of the unconjugated (A) component, the energies of the HOMO and LUMO are calculated separately, and the minimum energy difference between the HOMO and LUMO obtained from these partial structures is set as the energy difference. The energy difference is preferably 3.7 eV or higher and 6.0 eV or lower. If the energy difference is 3.7 eV or higher, it is less likely to absorb electromagnetic waves with wavelengths around 340 nm to 480 nm, thereby suppressing the time-related degradation of component (A) and the associated yellowing of the hardened film. The upper limit of the energy difference is not particularly limited, but it can be set to 6.0 eV or lower. (A) Component can be any alkali-soluble resin as long as it meets the necessary condition of the energy difference. Examples of component (A) include: (i) an alkali-soluble resin containing unsaturated groups obtained by reacting an epoxy compound having two or more epoxy groups with a monocarboxylic acid containing unsaturated groups, and then with a polycarboxylic acid or its anhydride; (ii) an alkali-soluble resin containing unsaturated groups as an acrylic (co)polymer; and (iii) an alkali-soluble resin containing unsaturated groups as a polysiloxane containing multiple siloxane bonds. Examples of monocarboxylic acids containing unsaturated groups used in the synthesis of each of the components (A) include (meth)acrylic acid and compounds obtained by reacting (meth)acrylic acid with dicarboxylic acids such as succinic acid, maleic acid, and phthalic acid, or their monoanhydrides. Furthermore, the term "(meth)acrylic acid" is a general term for acrylic acid and methacrylic acid, "(meth)acryl" is a general term for acrylonitrile and methacryl, and "(meth)acrylate" is a general term for acrylate and methacrylate; all of these refer to one or both of these. The alkali-soluble resin containing unsaturated groups in (i) is preferably a low molecular weight resin of polyester with an average degree of polymerization of about 2 to 500, which is generated during manufacturing by the reaction of hydroxyl groups with polycarboxylic acids. Examples of epoxy compounds having two or more epoxy groups include: bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, bisnaphthol fluorene type epoxy compounds, diphenyl fluorene type epoxy compounds, phenolic varnish type epoxy compounds, o-cresol phenolic varnish type epoxy compounds, m-cresol phenolic varnish type epoxy compounds, p-cresol phenolic varnish type epoxy compounds, phenol aralkyl type epoxy compounds, and biphenyl type epoxy compounds (e.g., jER). YX4000: Manufactured by Mitsubishi Chemical Corporation, "jER" is a registered trademark of the company), phenolic varnish compounds containing a naphthalene skeleton (e.g., NC-7000L: Manufactured by Nippon Kayaku Co., Ltd.), naphthol aralkyl type epoxy compounds, triphenol methane type epoxy compounds (e.g., EPPN-501H: Manufactured by Nippon Kayaku Co., Ltd.), tetraphenol ethane type epoxy compounds and other epoxy compounds with aromatic structures, glycidyl ethers of polyols, glycidyl esters of polycarboxylic acids, copolymers of methacrylic acid and glycidyl methacrylate, copolymers of monomers containing (meth)acrylic acid glycidyl ester as units, and hydrogenated bisphenol A diglycidyl ethers (e.g., Ricarex). Rikaresin HBE-100 (manufactured by Shin Nippon Rika Co., Ltd., "Rikaresin" is a registered trademark of the company) and other glycidyl epoxides, 1,4-cyclohexanediethanol-bis(3,4-epoxycyclohexane carboxylate, 2-(3,4-epoxy)cyclohexyl-5,1-spiro(3,4-epoxy)cyclohexyl-m-dioxane (e.g., Araldite CY175: manufactured by Huntsman Corporation, "Araldite" is a registered trademark of the company), bis(3,4-epoxycyclohexylmethyl) adipate (e.g., CYRACURE UVR-6128: manufactured by Dow Chemical Company). Chemicals, Inc.; 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate (e.g., Celloxide 2021P: manufactured by Daicel Inc., "Celloxide" is a registered trademark of the company); tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone of butanetetracarboxylate (e.g., EPOLEAD GT401: manufactured by Daicel Inc., "EPOLEAD" is a registered trademark of the company); epoxy compounds having an epoxycyclohexyl group (e.g., HiREM-1: manufactured by Shikoku Chemical Industry Co., Ltd.); polyfunctional epoxy compounds having a dicyclopentadiene skeleton (e.g., HP7200 series: manufactured by DIC Inc.); 2,Alicyclic epoxy compounds such as the 1,2-epoxy-4-(2-oxetanepropyl)cyclohexane adduct of 2-bis(hydroxymethyl)-1-butanol (e.g., EHPE3150: manufactured by Daicel Inc.), epoxy-based polybutadiene (e.g., NISSO-PB·JP-100: manufactured by Nippon Soda Co., Ltd., "NISSO-PB" is a registered trademark of the company), and epoxy compounds having a silicone backbone, etc. Examples of alkali-soluble resins containing unsaturated groups as acrylic (co)polymers in (ii) include resins having (meth)acrylic acid and carboxyl groups as copolymers of (meth)acrylic acid, (meth)acrylate, etc. Examples of such resins include alkali-soluble resins containing polymerizable unsaturated groups obtained by copolymerizing (meth)acrylates containing glycidyl (meth)acrylate in a solvent to obtain a copolymer, reacting the obtained copolymer with (meth)acrylic acid, and finally reacting it with an anhydride of dicarboxylic acid or tricarboxylic acid. The copolymer may refer to: the copolymer disclosed in Japanese Patent Application Publication No. 2014-111722, which comprises 20 mol% to 90 mol% repeating units derived from glycerol ester, which is obtained by esterifying the hydroxyl groups at both ends of (meth)acrylic acid, and 10 mol% to 80 mol% repeating units derived from one or more polymeric unsaturated compounds that can copolymerize therewith, and has a number average molecular weight (Mn) of 2000 to 20000 and an acid value of 35 mgKOH / g to 120 mgKOH / g; and the polymer disclosed in Japanese Patent Application Publication No. 2018-141968, which comprises units derived from (meth)acrylate compounds and units having (meth)acrylic acid and dicarboxylic acid residues or tricarboxylic acid residues, has a weight average molecular weight (Mw) of 3000 to 50000, and an acid value of 30 mgKOH / g to 200 mgKOH / g, i.e., an alkali-soluble resin containing polymeric unsaturated groups. The examples of alkali-soluble resins containing unsaturated groups as polysiloxanes described in (iii) include polysiloxane compounds having (meth)acrylic and carboxyl groups. Examples of such compounds include: siloxane-modified acrylic resins obtained by reacting acrylate epoxy esters, siloxane diamines, and aromatic acid dianhydrides (Japanese Patent Application Publication No. 2002-226549, etc.); siloxane-containing polyamide resins obtained by reacting siloxane diamines, aromatic diamines having vinyl unsaturated bonds, and aromatic tetracarboxylic acid dianhydrides (International Publication No. 2009 / 075217, etc.); and siloxane-containing polyamide resins obtained by reacting a diamine containing siloxane diamines with aromatic tetracarboxylic acid dianhydrides (Japanese Patent Application Publication No. 2008-). (Examples include: Publication No. 070477, International Publication No. 2006 / 109514, Japanese Patent Application Publication No. 2010-204590, etc.); alkali-soluble resins obtained by means of substituents having groups containing polymerizable double bonds and carboxyl groups bonded to the isocyanuric acid ring skeleton: reacting an epoxy silicone compound having an isocyanuric acid ring skeleton with a carboxylic acid containing polymerizable double bonds to obtain a polyol compound, and reacting the obtained polyol compound with a dicarboxylic acid or its monohydric anhydride (Japanese Patent Application Publication No. 2011-141518, etc.). For these resins, for example, by reducing the number of aromatic rings, the energy difference between the HOMO and LUMO energies can be increased. Specifically, for aromatic dicarboxylic acids, aromatic tricarboxylic acids, aromatic tetracarboxylic acids, or their anhydrides used in the synthesis of conventional alkali-soluble resins, by setting at least a portion of them as non-aromatic carboxylic acids or their anhydrides, the energy difference between the HOMO and LUMO energies can be increased to the aforementioned range. From the viewpoint of suppressing the thermal decomposition of the resin curing film and increasing the glass transition temperature to suppress thermal deformation, component (A) preferably has multiple aromatic rings. Furthermore, from the viewpoint of further improving adhesion and solvent resistance, component (A) is more preferably composed of repeating units containing fluorene structures, and more preferably composed of repeating units containing a diarylfluorene skeleton. For example, component (A) is preferably a resin represented by the following general formula (1). [Chemistry 5] In formula (1), Ar is independently an aromatic hydrocarbon group with 6 or more carbon atoms and 14 or fewer carbon atoms. A portion of the hydrogen atom constituting Ar may be substituted with an alkyl group with 1 or more carbon atoms and 10 or fewer carbon atoms, an aryl or arylalkyl group with 6 or more carbon atoms and 10 or fewer carbon atoms, a cycloalkyl or cycloalkylalkyl group with 3 or more carbon atoms and 10 or fewer carbon atoms, an alkoxy group with 1 or more carbon atoms and 5 or fewer carbon atoms, or a halogen group. R 1 is an alkyl group having 2 or more carbon atoms and 4 or fewer carbon atoms. l is a number having 0 or more carbon atoms and 3 or fewer carbon atoms. G is a (meth)acrylyl group or a substituent represented by the following general formula (2) or the following general formula (3). Y is a tetravalent carboxylic acid residue. Z is a hydrogen atom or a substituent represented by the following general formula (4), at least one of Z being a substituent represented by the following general formula (4). n is a number with an average value of 1 or more and 20 or fewer. [Chemistry 6] [Chemistry 7] In equations (2) and (3), R 2 represents a hydrogen atom or a methyl group, R 3 is an alkyl or alkylaryl group having 2 or more but fewer than 10 carbon atoms, R 4 represents a saturated or unsaturated hydrocarbon group with 2 or more carbon atoms and less than 20 carbon atoms; p represents a number with 0 or more carbon atoms and less than 10 carbon atoms; and * represents a bonding site. [Chemistry 8] In formula (4), W is a divalent or trivalent carboxylic acid residue, m is the number of 1 or 2, and * is the bonding site. The resin represented by general formula (1) can be synthesized using the following methods. First, an epoxy compound (a-1) (hereinafter also simply referred to as "epoxide compound (a-1)") having a diarylfluorene skeleton and containing a plurality of alkylene oxide modifying groups within one molecule, represented by general formula (5) below, is reacted with at least one of (meth)acrylic acid, a (meth)acrylic acid derivative represented by general formula (6) below, and a (meth)acrylic acid derivative represented by general formula (7) below to obtain a diol compound as an epoxy ester of (meth)acrylic acid. Furthermore, the diarylfluorene skeleton is preferably a bis(naphthol)fluorene skeleton or a bis(phenol)fluorene skeleton. [Chemistry 9] In formula (5), Ar is independently an aromatic hydrocarbon group with 6 or more carbon atoms and 14 or less. A portion of the hydrogen atom constituting Ar may be substituted with an alkyl group with 1 or more carbon atoms and 10 or less, an aryl or arylalkyl group with 6 or more carbon atoms and 10 or less, a cycloalkyl or cycloalkylalkyl group with 3 or more carbon atoms and 10 or less, an alkoxy or halogen group with 1 or more carbon atoms and 5 or less. R 1 is an alkyl group that independently has 2 or more carbon atoms and 4 or fewer carbon atoms. l is an alkyl group that independently has 0 or more carbon atoms and 3 or fewer carbon atoms. [Chemistry 10] [Chemistry 11] In equations (6) and (7), R 2 represents a hydrogen atom or a methyl group, R 3 is an alkyl or alkylaryl group having 2 or more but fewer than 10 carbon atoms, R 4 represents a saturated or unsaturated hydrocarbon group with 2 or more carbon atoms and less than 20 carbon atoms, and p represents a number of carbon atoms greater than 0 and less than 10. The reaction of the epoxy compound (a-1) with (meth)acrylic acid or a derivative thereof can be carried out using known methods. For example, Japanese Patent Application Publication No. 4-355450 discloses that a diol compound containing polymerizable unsaturated groups can be obtained by using about 2 moles of (meth)acrylic acid relative to 1 mole of an epoxy compound having two epoxy groups. In this embodiment, the compound obtained by the reaction is a diol (d) containing polymerizable unsaturated groups represented by the following general formula (8) (hereinafter also simply referred to as "diol (d)"). [Chemistry 12] In formula (8), Ar is independently an aromatic hydrocarbon group having 6 or more and 14 or fewer carbon atoms. A portion of the hydrogen atom constituting Ar may be substituted with an alkyl group having 1 or more and 10 or fewer carbon atoms, an aryl or arylalkyl group having 6 or more and 10 or fewer carbon atoms, a cycloalkyl or cycloalkylalkyl group having 3 or more and 10 or fewer carbon atoms, an alkoxy or halogen group having 1 or more and 5 or fewer carbon atoms. G is independently a (meth)acrylonitrile group, a substituent represented by general formula (2) or general formula (3), and R is a substituent represented by a methylpropenyl group. 1 is an alkyl group that independently has 2 or more carbon atoms and 4 or fewer carbon atoms. l is an alkyl group that independently has 0 or more carbon atoms and 3 or fewer carbon atoms. [Chemistry 13] [Chemistry 14] In equations (2) and (3), R 2 represents a hydrogen atom or a methyl group, R 3 is an alkyl or alkylaryl group having 2 or more but fewer than 10 carbon atoms, R 4 represents a saturated or unsaturated hydrocarbon group with 2 or more carbon atoms and less than 20 carbon atoms; p represents a number with 0 or more carbon atoms and less than 10 carbon atoms; and * represents a bonding site. Secondly, by reacting the obtained diol (d), dicarboxylic acid or tricarboxylic acid or its monohydric anhydride (b) and tetracarboxylic acid or its dianhydride (c), a curable resin containing unsaturated groups, represented by general formula (1), having a carboxyl group and a polymerizable unsaturated group in one molecule, can be obtained. The acid component is a polybasic acid component that can react with the hydroxyl group in the diol (d) molecule. To obtain the resin represented by general formula (1), it is necessary to use dicarboxylic acid or tricarboxylic acid or their monohydric anhydride (b) and tetracarboxylic acid or its dianhydride (c). The carboxylic acid residues of the acid component can be either saturated or unsaturated hydrocarbon groups. In addition, these carboxylic acid residues may also contain heterogeneous bonds such as -O-, -S-, and carbonyl groups. Examples of the dicarboxylic or tricarboxylic acids or their monohydric anhydrides (b) include: chain hydrocarbon dicarboxylic or tricarboxylic acids, alicyclic hydrocarbon dicarboxylic or tricarboxylic acids, aromatic hydrocarbon dicarboxylic or tricarboxylic acids and their monohydric anhydrides, etc. Examples of the chain-type dicarboxylic or tricarboxylic acids include: succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, octanoic acid, and diethylene glycol, as well as these dicarboxylic or tricarboxylic acids with any substituents. Examples of the alicyclic hydrocarbon dicarboxylic acids or tricarboxylic acids include: cyclobutane dicarboxylic acid, cyclopentane dicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, methyltetrahydrophthalic acid, methylintomethyltetrahydrophthalic acid, chlorobenzic acid, hexahydrotriphenylcarboxylic acid, and norbornane dicarboxylic acid, as well as these dicarboxylic acids or tricarboxylic acids with any substituents. Examples of the aromatic hydrocarbon dicarboxylic acids or tricarboxylic acids include: phthalic acid, isophthalic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid and trimellitic acid, as well as these dicarboxylic acids or tricarboxylic acids with any substituents. Among these, the dicarboxylic acid or tricarboxylic acid is preferably succinic acid, itaconic acid, tetrahydrophthalic acid, hexahydrotriphenyl phthalic acid, phthalic acid and trimellitic acid, more preferably succinic acid, itaconic acid and tetrahydrophthalic acid. The dicarboxylic acid or tricarboxylic acid is preferably its monoanhydride. Furthermore, from the viewpoint of being able to form finer patterns, these dicarboxylic acids or tricarboxylic acids are preferably cyclic structures. More specifically, alicyclic hydrocarbon dicarboxylic acids or tricarboxylic acids, aromatic hydrocarbon dicarboxylic acids or tricarboxylic acids, or their monoanhydrides are preferred. If dicarboxylic acids or tricarboxylic acids with cyclic structures are used, the introduction of cyclic structures at the ends reduces the fluidity of the resin, thereby inhibiting the peeling of the coating film during pattern formation, and thus it is believed that finer patterns can be formed. Examples of the tetracarboxylic acids or their dianhydrides (c) include: chain-type tetracarboxylic acids, alicyclic tetracarboxylic acids, aromatic tetracarboxylic acids, and their dianhydrides. Among these, chain-type tetracarboxylic acids, alicyclic tetracarboxylic acids, and their dianhydrides are preferred. Examples of the chain tetracarboxylic acids include: butane tetracarboxylic acid, pentane tetracarboxylic acid, hexane tetracarboxylic acid, and other chain tetracarboxylic acids with substituents such as alicyclic hydrocarbon groups and unsaturated hydrocarbon groups. Examples of alicyclic tetracarboxylic acids include: cyclobutane tetracarboxylic acid, cyclopentane tetracarboxylic acid, cyclohexane tetracarboxylic acid, cycloheptane tetracarboxylic acid, and norbornene tetracarboxylic acid, as well as these alicyclic tetracarboxylic acids with substituents such as chain hydrocarbon groups and unsaturated hydrocarbon groups. Examples of the aromatic tetracarboxylic acids include: pyromellitic tetracarboxylic acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, diphenyl ether tetracarboxylic acid, diphenyl tannic acid tetracarboxylic acid, naphthalene-1,4,5,8-tetracarboxylic acid, and naphthalene-2,3,6,7-tetracarboxylic acid. From the viewpoint of increasing LUMO to further increase the energy difference between HOMO and LUNO, these aromatic tetracarboxylic acids are preferably those using aromatic tetracarboxylic acids in which electron-donating atoms such as oxygen are introduced into the aromatic ring of the anhydride moiety or dispersed in multiple non-conjugated aromatic rings of the anhydride skeleton. For example, diphenyl ether tetracarboxylic acid is preferred. The tetracarboxylic acid is preferably its dianhydride. Alternatively, aryl esters of dipyridine tricarboxylic anhydride may be used instead of the tetracarboxylic acid or its dianhydride (c). Anyl esters of dipyridine tricarboxylic anhydride are, for example, compounds produced by the method described in International Publication No. 2010 / 074065, which are dianhydrides in the form of ester bonds formed by the reaction of two hydroxyl groups of an aromatic diol (naphthalene glycol, biphenol, and terphenyl glycol, etc.) with the carboxyl groups of two molecules of dipyridine tricarboxylic anhydride. There are no particular limitations on the reaction method between the diol (d) and the acid components (b) and (c), and known methods can be used. For example, Japanese Patent Application Publication No. 9-325494 discloses a method for reacting (meth)acrylate epoxy ester with tetracarboxylic acid dianhydride at a reaction temperature of 90°C to 140°C. In this case, in order to make the end of the compound a carboxyl group, it is preferred to carry out the reaction in such a molar ratio as (meth)acrylate epoxy ester (diol (d)), dicarboxylic acid or tricarboxylic acid or their monohydric anhydride (b) and tetracarboxylic acid dianhydride (c) (d):(b):(c) = 1.0:0.01 to 1.0:0.2 to 1.0. For example, when using monohydric anhydride (b) and dianhydride (c), it is preferable to carry out the reaction in a molar ratio of the amount of acid component [(b) / 2+(c)] to diol (d) [[(b) / 2+(c)] / (d)] greater than 0.5 and less than 1.0. If the molar ratio is less than 1.0, the end of the curing resin containing unsaturated groups represented by general formula (1) will not become anhydride, thus suppressing the increase in the content of unreacted dianhydride and improving the long-term stability of the curing composition. In addition, if the molar ratio is greater than 0.5, the increase in the residual amount of unreacted components in diol (d) containing polymerizable unsaturated groups can be suppressed, thereby improving the long-term stability of the curing composition. Furthermore, for the purpose of adjusting the acid value and molecular weight of the curing resin containing unsaturated groups represented by general formula (1), the molar ratios of each component (b), (c) and (d) can be arbitrarily changed within the range stated. Furthermore, the synthesis of diol (d) and the subsequent reactions of polycarboxylic acids or their anhydrides are usually carried out in a solvent with the use of a catalyst as needed. Examples of the solvents include: cellosol solvents such as ethyl cellosol acetate and butyl cellosol acetate; high-boiling-point ether or ester solvents such as diethylene glycol dimethyl ether, ethyl carbitol acetate, butyl carbitol acetate, and propylene glycol monomethyl ether acetate; and ketone solvents such as cyclohexanone and diisobutyl ketone. Furthermore, there are no particular limitations on the reaction conditions regarding the solvents, catalysts, etc., used; for example, it is preferable to use a solvent without hydroxyl groups and having a boiling point higher than the reaction temperature as the reaction solvent. Furthermore, the reaction between the epoxy group and the carboxyl or hydroxyl group is preferably carried out using a catalyst. As such catalysts, Japanese Patent Application Publication No. 9-325494 discloses ammonium salts such as tetraethylammonium bromide and triethylbenzylammonium chloride, as well as phosphine derivatives such as triphenylphosphine and tris(2,6-dimethoxyphenyl)phosphine. When using the resin represented by the general formula (1) as component (A), from the viewpoint of suppressing the thermal decomposition of the resin-cured film and increasing the glass transition temperature to suppress thermal deformation, the LUMO energy of component (A) is preferably -2.0 eV or higher. If the LUMO energy is -2.0 eV or higher, the heat resistance of the resin-cured film can be improved by moderately increasing the aromatic rings in the resin (specifically, aromatic rings derived from dicarboxylic acids or tricarboxylic acids or their monohydric anhydrides (b), or tetracarboxylic acids or their dianhydrides (c)). Component (A) is preferably a compound with a weight average molecular weight (Mw) of 1,000 or more and 40,000 or less, and more preferably a compound with a weight average molecular weight (Mw) of 2,000 or more and 20,000 or less. The higher the Mw of component (A), the better the adhesion and flexibility of the resin-cured film, and the easier it is to adjust the crosslinking density. On the other hand, the lower the Mw of component (A), the better its solubility in the solvent, and the better its compatibility with component (B), and the better its ability to suppress turbidity, flatness, and patternability of the resin-cured film. From the viewpoint of further improving compatibility with component (B), the Mw of component (A) is preferably 1,000 or more and 30,000 or less, and more preferably 1,500 or more and 25,000 or less. Furthermore, when using the resin represented by the general formula (1) as component (A), the Mw of component (A) is preferably 1000 or more and 6000 or less, more preferably 2000 or more and 4000 or less. In this embodiment, a compound with a relatively large acrylic equivalent and a large molecular weight is used as component (B). For example, when the molecular weight (Mw) of component (B) is 3000 or more, their compatibility can be sufficiently improved by setting the Mw of component (A) to 6000 or less. From the same point of view, the acid value of component (A) is preferably above 30 mgKOH / g and below 200 mgKOH / g. In this specification, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) of each component can be set as styrene conversion values ​​obtained using a gel permeation chromatograph (GPC) (e.g., "HLC-8220GPC" (manufactured by Tosoh Corporation)). Additionally, the acid value can be set as a value obtained using a potentiometric titration apparatus (e.g., "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.)). For compounds whose molecular weight can be calculated based on their structure, such as monomers, the value calculated based on the structure can be set as the molecular weight of the compound. The content of component (A) relative to the total mass of the solid components is preferably 10% by mass or more and 90% by mass or less, more preferably 20% by mass or more and 80% by mass or less, and further preferably 40% by mass or more and 80% by mass or less when patterning characteristics are important. If the content of component (A) is 10% by mass or more, high-resolution patterns can be formed. In addition, (A) ingredient can be used alone or in combination with two or more ingredients. [Component (B)] Component (B) is a polymeric compound having two or more unsaturated bonds. Examples of ingredients (B) include: ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tetramethyl glycol di(meth)acrylate, glycerol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, glycerol tri(meth)acrylate, sorbitol penta(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, phosphazene epoxy-modified hexa(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, and other (meth)acrylates. Only one of these polymeric compounds may be used alone, or two or more may be used in combination. Component (B) only needs to function to crosslink the molecules of component (A) with each other; from the viewpoint of further maximizing the aforementioned function, it is preferable to use a component having three or more unsaturated bonds. Furthermore, the acrylate equivalent, obtained by dividing the molecular weight of the polymeric compound by the number of (meth)acrylic acid groups in one molecule, is preferably 50 to 300, and more preferably 80 to 200. In addition, component (B) does not have free carboxyl groups. As component (B), examples may also include dendritic polymers having a (meth)acrylic group. Examples of dendritic polymers having a (meth)acrylic group include dendritic polymers obtained by adding a polythiol compound to a portion of the carbon-carbon double bond in the (meth)acrylic group of a polyfunctional (meth)acrylate. Specifically, this includes dendritic polymers obtained by reacting the (meth)acrylic group of a polyfunctional (meth)acrylate represented by the following general formula (9) with a polythiol compound represented by the following general formula (10). [Chemistry 15] (In equation (9), R) 5 represents a hydrogen atom or a methyl group, R 6 is to R 7(OH) k The k hydroxyl groups within the q hydroxyl groups are supplied to the residual portion after the ester bond in the formula; a preferred R 7(OH) kPolyols having a non-aromatic straight-chain or branched hydrocarbon skeleton having 2 to 8 carbon atoms, or polyol ethers formed by the dehydration condensation of multiple molecules of said polyol and their linkage via ether bonds, or esters of these polyols or polyol ethers with hydroxy acids; k and q independently represent integers from 2 to 20, but k ≧ q) [Chemistry 16] (In equation (10), R) 8 is a single bond or a hydrocarbon group with 1 to 6 carbon atoms in divalent to hexavalent states, in R When 8 is a single bond, r is 2, and in R When 8 is the base value for divalent to hexavalent valence, r is the value of R. (Numbers with the same value as 8) Examples of polyfunctional (meth)acrylates represented by general formula (9) include: ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethylene oxide modified trimethylolpropane tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and caprolactone modified pentaerythritol tri(meth)acrylate, etc. These compounds may be used alone or in combination with two or more. Examples of polythiol compounds represented by general formula (10) include: trimethylolpropane tris (thioglycolate), trimethylolpropane tris (thioglycolate), pentaerythritol tetras (thioglycolate), pentaerythritol tris (thioglycolate), pentaerythritol tetras (thioglycolate), dipentaerythritol hexas (thioglycolate), and dipentaerythritol hexas (thioglycolate). These compounds may be used alone or in combination with two or more. Here, the Michael addition of the polythiol compound represented by general formula (10) to the polyfunctional (meth)acrylate represented by general formula (9) is preferably carried out in such a way that the carbon-carbon double bonds remain in the range of 0.1 mol% to 50 mol% when the total amount of carbon-carbon double bonds in the compound represented by general formula (9) is set to 100 mol%, so that the resulting dendritic polymer can be further subjected to radiopolymerization based on carbon-carbon double bonds. For example, the thiol group of the polythiol compound represented by general formula (10) and the carbon-carbon double bond of the polyfunctional (meth)acrylate represented by general formula (9) (in general formula (9), it refers to CH) 2=C(R 5) The addition ratio of the double bond represented by the molar ratio (referred to as double bond in the case of calculating the molar ratio) is preferably 1 / 100 to 1 / 3, more preferably 1 / 50 to 1 / 5, and especially preferably 1 / 20 to 1 / 8. Furthermore, the dendritic polymer preferably has a sufficient amount of functional groups to undergo radiopolymerization. Therefore, the acrylate equivalent of the dendritic polymer is preferably in the range of 100 to 10,000. Additionally, dendritic polymers containing (meth)acrylic groups have a large molecular weight, thus suppressing the penetration of developer into the exposed portion of the coating during patterning and suppressing yellowing of the resin-cured film during formal curing (post-baking). For example, the weight-average molecular weight (Mw) of the dendritic polymer containing (meth)acrylic groups is preferably in the range of 1,000 to 20,000, more preferably in the range of 7,000 to 20,000, and even more preferably in the range of 8,000 to 15,000. The mixing ratio of component (A) to component (B), by mass ratio (A) / (B), is preferably 30 / 70 to 90 / 10, more preferably 60 / 40 to 80 / 20. If the mixing ratio of component (A) is 30 / 70 or higher, the cured product after photocuring is less likely to become brittle. Furthermore, the acid value of the coating in the unexposed area is less likely to decrease, thus suppressing a decrease in solubility in alkaline developer. Therefore, defects such as burrs or dullness at the pattern edges are less likely to occur. Additionally, if the mixing ratio of component (A) is 90 / 10 or lower, the proportion of photoreactive functional groups in the resin is sufficient, thus allowing for the formation of the desired cross-linked structure. Moreover, since the acid value of the resin component is not too high, the solubility of the exposed area in alkaline developer is less likely to increase, thus suppressing the formation of a pattern that is thinner than the target line width or pattern defects. [Component (C)] Component (C) is an epoxy compound having two or more epoxy groups. Component (C) can improve the chemical resistance and moisture-resistant adhesion of the resin-cured film. This is believed to be because the hygroscopicity of component (A) caused by the carboxyl groups is reduced by reacting the carboxyl groups of component (A) with the epoxy groups of component (C) during formal curing (post-baking). Examples of component (C) include epoxy compounds having two or more epoxy groups as described for component (A). Furthermore, these compounds may be used with only one of them, or with two or more in combination. Among these, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, bisnaphthol fluorene type epoxy compounds, phenolic varnish type epoxy compounds, cresol phenolic varnish type epoxy compounds, and biphenyl type epoxy compounds are preferred, with biphenyl type epoxy compounds being even more preferred. Biphenyl type epoxy compounds can achieve both the required mechanical strength and chemical resistance of the cured material. The epoxy equivalent of component (C) is preferably 100 g / eq or more and 300 g / eq or less, more preferably 100 g / eq or more and 250 g / eq or less. Furthermore, the number average molecular weight (Mn) of component (C) is preferably 100 or more and 5000 or less. If the epoxy equivalent of component (C) is 100 g / eq or more, the solvent resistance of the cured film is improved. If the epoxy equivalent of component (C) is 300 g / eq or less, sufficient alkali resistance can be maintained even when alkaline solutions are used in subsequent processes. Furthermore, if the Mn of component (C) is 5000 or less, sufficient alkali resistance can be maintained even when alkaline solutions are used in subsequent processes. In addition, the epoxy equivalent of component (C) can be determined by titration using a potentiometric titration apparatus "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.) and a 1 / 10 N-perchloric acid solution. The content of component (C) relative to the total mass of the solid components is preferably 1% by mass or more and 30% by mass or less, more preferably 3% by mass or more and 25% by mass or less. Setting the content of component (C) to 1% by mass or more further improves the chemical resistance and moisture adhesion of the resin-cured film. Setting the content of component (C) to 30% by mass or less further improves the adhesion of the resin-cured film to the substrate. [(D) component] (D) component is a solvent. Examples of ingredients in (D) include: alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol, 3-methoxy-1-butanol, ethylene glycol monobutyl ether, 3-hydroxy-2-butanone, and diacetone alcohol; terpenes such as α-terpineol or β-terpineol; ketones such as acetone, methyl ethyl ketone, cyclohexanone, and N-methyl-2-pyrrolidone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; methyl cellosolve, ethyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol, diethylene glycol ethyl methyl ether, and propylene glycol monomethyl ether. Diol ethers such as propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monomethyl ether, and triethylene glycol monoethyl ether; acetates such as ethyl acetate, butyl acetate, ethyl lactate, 3-methoxybutyl acetate, 3-methoxy-3-butyl acetate, 3-methoxy-3-methyl-1-butyl acetate, cellolytic acetate, ethyl cellolytic acetate, butyl cellolytic acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate. (D) Components can be used alone or in combination with two or more. The content of component (D) varies depending on the target viscosity, and is preferably 30% by mass or more and 90% by mass or less relative to the total mass of the curable resin composition. If the content of component (D) is 30% by mass or more, it can be set to a viscosity that makes it easy to coat the curable resin composition onto the substrate; if it is 90% by mass or less, the drying time required after coating the curable resin composition onto the substrate can be shortened. [Component (E), Component (F)] Component (E) is a polymerization initiator, and component (F) is a sensitizer. (E) is not particularly limited to any compound capable of initiating addition polymerization of a compound having polymerizable unsaturated bonds. Examples of components in (E) include photopolymerization initiators such as acetophenone compounds, triazine compounds, benzoin compounds, benzophenone compounds, thioxanthone compounds, imidazole compounds, and acetylglucime compounds. Furthermore, in this specification, photopolymerization initiator is used to include sensitizers. Examples of acetophenone compounds include: acetophenone, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, benzodiazepine dimethyl ketal, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propane-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-2-morpholino-1-(4-methylthiophenyl)propane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butane-1-one, oligomers of 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propane-1-one, etc. Examples of triazine compounds include: 2,4,6-tris(trichloromethyl)-1,3,5-triazine, 2-methyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-phenyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-chlorophenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, and 2-(4-methoxynaphthyl) 2-(4-methoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(3,4,5-trimethoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methylthiostyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(propynyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, etc. Examples of benzoin compounds include: benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin-tert-butyl ether, etc. Examples of benzophenone compounds include: benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4,4'-bis(N,N-diethylamino)benzophenone, etc. Examples of thioxanthone compounds include: thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, etc. Examples of imidazole compounds include: 2-(o-chlorophenyl)-4,5-phenylimidazolium dimer, 2-(o-chlorophenyl)-4,5-di(m-methoxyphenyl)imidazolium dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazolium dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazolium dimer, 2,4,5-triarylimidazolium dimer, etc. Examples of acetylated oxime compounds include: 1-[9-ethyl-6-(2-methylbenzoyl)-9H-chloro-3-yl]-dicycloheptyl-1-ketooxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-chloro-3-yl]-adamantylmethane-1-ketooxime-O-benzoate, 1-[9-ethyl-6- [(2-Methylbenzoyl)-9H-Gerazol-3-yl]-adamantylmethane-1-ketooxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-Gerazol-3-yl]-tetrahydrofuranylmethane-1-ketooxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-Gerazol-3-yl] -Tetrahydrofuranylmethane-1-ketooxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-gezol-3-yl]-thiophenylmethane-1-ketooxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-gezol-3-yl]-thiophenylmethane-1-ketooxime-O-acetate, 1-[9 [9-Ethyl-6-(2-methylbenzoyl)-9H-Gezol-3-yl]-morpholinylmethane-1-ketooxime-O-benzoate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-Gezol-3-yl]-morpholinylmethane-1-ketooxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-Gezol-3-yl]-morpholinylmethane-1-ketooxime-O-acetate [9-ethyl-6-(2-methylbenzoyl)-9H-chloro-3-yl]-ethyl-1-ketooxime-O-tricyclodecane carboxylate, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-chloro-3-yl]-ethyl-1-ketooxime-O-tricyclodecane carboxylate, 1-[ 4-(phenylhydrothio)phenyl]octane-1,2-dione = 2-O-benzoyl oxime, 1-[9-ethyl-6-(2-methylbenzoyl)zozol-3-yl]acetone-O-acetyl oxime, (2-methylphenyl)(7-nitro-9,9-dipropyl-9H-fluorene-2-yl)-acetyl oxime, acetone, 1-[7-(2-methylbenzoyl) [-9,9-dipropyl-9H-fluoren-2-yl]-1-(O-acetylglucosamine), acetone, 1-(9,9-dibutyl-7-nitro-9H-fluoren-2-yl)-1-O-acetylglucosamine, acetone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-gezol-3-yl]-,1-(O-acetylglucosamine), 1,2-octadiene, 1-[4-(phenylthio)-,2-(O-benzoyl oxime)], acetone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-zozol-3-yl]-,1-(O-acetylated oxime), 1-(4-phenylthiophenyl)butane-1,2-dione-2-oxime-O-benzoate, 1-(4-methylthiophenyl)butane-1,Examples of photopolymerization initiators include 2-dione-2-oxime-O-acetate, 1-(4-methylhydrothiophenyl)butane-1-one-oxime-O-acetate, 4-ethoxy-2-methylphenyl-9-ethyl-6-nitro-9H-zozazo-3-yl-O-acetylated oxime, 5-(4-isopropylphenylthio)-1,2-indanedione, and 2-(O-acetylated oxime). The photopolymerization initiator can be used alone or in combination with two or more agents. Other examples of acetylated photopolymerization initiators include O-acetylated photopolymerization initiators represented by general formula (11) or general formula (12). [Chemistry 17] In equation (11), R 9. R 10 Each of the following groups independently represents an alkyl group having 1 to 15 carbon atoms, an aryl group having 6 to 18 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or a heterocyclic group having 4 to 12 carbon atoms; R 11 This refers to alkyl groups having 1 to 15 carbon atoms, aryl groups having 6 to 18 carbon atoms, and arylalkyl groups having 7 to 20 carbon atoms. Here, the alkyl and aryl groups may be substituted with alkyl groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 10 carbon atoms, alkoxy groups having 1 to 10 carbon atoms, or halogens. The extended alkyl moiety may contain unsaturated bonds, ether bonds, thioether bonds, or ester bonds. Furthermore, the alkyl group may be any type of straight-chain, branched, or cyclic alkyl group. [Chemistry 18] (In equation (12), R) 12 and R 13 Each is independently a straight-chain or branched alkyl group having 1 to 10 carbon atoms, or a cycloalkyl, cycloalkylalkyl, or alkylcycloalkyl group having 4 to 10 carbon atoms, or a phenyl group that may be substituted by an alkyl group having 1 to 6 carbon atoms; R 14 Each is independently a straight-chain or branched alkyl or alkenyl group having 2 to 10 carbon atoms, wherein the -CH group in the alkyl or alkenyl group... A portion of the 2- group can be substituted with an -O- group; consequently, these R groups... 12 ~R 14 (Some of the hydrogen atoms in the radical can also be replaced by halogen atoms) Furthermore, component (E) preferably has a molar absorptivity of 10,000 L / mol·cm or higher at 365 nm. Because of its high sensitivity, this photopolymerization initiator ensures sufficient photosensitivity even in curable resin compositions containing a relatively large acrylic equivalent of component (B), thus significantly improving the developability (resolution) of the curable resin composition. Examples of such photopolymerization initiators include: Omnirad 1312 (manufactured by IGM Resins BV, "Omnirad" is a registered trademark of the company) and ADEKA ARKLS NCI-831 (manufactured by ADEKA Inc., "ADEKA ARKLS" is a registered trademark of the company), etc. In this specification, the molar absorptivity of the photopolymerization initiator can be set as follows: the value obtained by measuring the absorbance of a 0.001% by weight acetonitrile solution in a quartz unit with an optical path length of 1 cm using a UV-Vis-IR spectrophotometer "UH4150" (manufactured by Hitachi High-Tech Science Co., Ltd.). Additionally, as component (E), a thermal polymerization initiator may also be used. Examples of thermal polymerization initiators include organic peroxides such as benzoyl peroxide, lauryl peroxide, di-tert-butyl peroxide, tert-butyl peroxide-2-ethylhexanoate, and 1,1-tert-butylperoxide-3,3,5-trimethylcyclohexane; azo compounds such as azobisisobutyronitrile, azobis-4-methoxy-2,4-dimethylpentanonitrile, azobiscyclohexanone-1-carboxynitrile, azobisbenzoyl, 1,1'-azobis(1-acetoxy-1-phenylethane), and 2,2'-azobis(methyl isobutyrate); water-soluble catalysts such as potassium persulfate and ammonium persulfate; and redox catalysts obtained from combinations of peroxides or persulfates with reducing agents, as well as any of the compounds commonly used in free radical polymerization. The thermal polymerization initiator can be selected with consideration of the storage stability of the thermosetting resin composition of the present invention or the formation conditions of the cured product. In addition, active free radical generators or acid generators may also be used as component (E). Examples of active free radical generators include: 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 10-butyl-2-chloroacridone, 2-ethylanthraquinone, benzodiazepine, 9,10-phenanthroquinone, camphorquinone, methyl phenylglyoxylate, and titanium decene compounds. Examples of acid-generating agents include: 4-hydroxyphenyl dimethyl strontium p-toluenesulfonate, 4-hydroxyphenyl dimethyl strontium hexafluoroantimonate, 4-acetoxyphenyl dimethyl strontium p-toluenesulfonate, 4-acetoxyphenyl-methyl-benzyl strontium hexafluoroantimonate, triphenyl strontium p-toluenesulfonate, triphenyl strontium hexafluoroantimonate, diphenyl strontium p-toluenesulfonate, diphenyl strontium hexafluoroantimonate, and other ononium salts, nitrobenzyl toluenesulfonates, benzoin toluenesulfonates, etc. Examples of sensitizers in (F) include: triethylamine, triethanolamine, methyldiethanolamine, triisopropanolamine, benzophenone, 4,4'-bis(dimethylamino)benzophenone (Mischel ketone), 4-phenylbenzophenone, 4,4'-dichlorobenzophenone, hydroxybenzophenone, 4,4'-diethylaminobenzophenone, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminoacetophenone, dichloroacetophenone, trichloroacetophenone, and p-tert-butylacetophenone, etc.; benzoin, benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether, etc.; benzoin ethers such as 2-dimethylaminoethylbenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate (n-butoxy) benzoate, isoamyl 4-dimethylaminobenzoate, etc. 2-Ethylhexyl benzoate, N,N-dimethyl-p-toluidine, 2,4-diethylthioxanthrone, 2,4-diisopropylthioxanthrone, 4-benzoyl-4'-methyl-diphenyl sulfide, propylene-acrylated benzophenone, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone and 3,3'-dimethyl-4-methoxybenzophenone and other benzophenone series; 2-isopropylthioxanthrone, Thioxanthone series such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, and 2,4-dichlorothioxanthone; aminobenzophenone series such as 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 4,4'-bis(ethylmethylamino)benzophenone; 10-butyl-2-chloroacridone, 2-ethylanthraquinone, 9,10-phenanthroquinone, and camphorquinone, etc. Relative to the total of 100 parts by mass of components (A) and (B), the content of component (E) is preferably 1 part by mass or more and 30 parts by mass or less, more preferably 2 parts by mass or more and 10 parts by mass or less. Furthermore, when using a acetooxime-based photopolymerization initiator as component (D), relative to the total of 100 parts by mass of components (A) and (B), the content of component (E) is preferably 0.5 parts by mass or more and 20 parts by mass or less, more preferably 1 part by mass or more and 10 parts by mass or less. If the content of component (E) is at or above the lower limit, a suitable photopolymerization rate is achieved, thus ensuring sufficient sensitivity. Furthermore, if the content of component (E) is below the upper limit, linewidths faithful to the mask can be reproduced, and pattern edges are sharp. When the total mass of component (E) is set to 100 parts by mass, the content of component (F) is preferably 0.5 parts by mass or more and 400 parts by mass or less, more preferably 1 part by mass or more and 300 parts by mass or less. If the content of the photosensitizer is 0.5 parts by mass or more, the sensitivity of the photopolymerization initiator can be increased, and the photopolymerization rate can be accelerated. In addition, if the content of the photosensitizer is 400 parts by mass or less, excessive increase in sensitivity can be suppressed, and scorching, peeling residue, etc. are less likely to occur when irradiated. [Other Components] Other resin components, hardeners, hardening accelerators, thermal polymerization inhibitors and antioxidants, plasticizers, fillers, leveling agents, defoamers, ultraviolet absorbers, surfactants, coupling agents and viscosity modifiers may also be added to the curing resin composition as needed. Examples of other resin components include: vinyl resin, polyester resin, polyamide resin, polyimide resin, polyurethane resin, polyether resin, and melamine resin. Examples of curing agents include: amine compounds, polycarboxylic acid compounds, phenolic resins, amino resins, dicyandiamine, Lewis acid complexes, etc., which help cure epoxy resins. Examples of curing accelerators include: tertiary amines, quaternary ammonium salts, tertiary phosphine, quaternary phosphonium salts, borate esters, Lewis acids, organometallic compounds, imidazoles, etc., which help promote the curing of epoxy resins. Examples of thermal polymerization inhibitors and antioxidants include: hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, phenothiazine, hindered phenolic compounds, etc. Examples of plasticizers include: dibutyl phthalate, dioctyl phthalate, tricresyl phosphate, etc. Examples of fillers include: glass fiber, silicon dioxide, mica, alumina, etc. Examples of leveling agents or defoamers include silicone-based, fluorine-based, and acrylic-based compounds. Examples of ultraviolet absorbers include: benzotriazole compounds, benzophenone compounds, triazine compounds, etc. Examples of surfactants include: anionic surfactants such as ammonium lauryl sulfate and triethanolamine polyoxyethylene alkyl ether sulfate; cationic surfactants such as stearamine acetate and lauryl trimethylammonium chloride; amphoteric surfactants such as lauryl dimethylamine oxide and lauryl carboxymethyl hydroxyethyl imidazolium betaine; nonionic surfactants such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and sorbitan monostearate; silicone surfactants with polydimethylsiloxane as the main framework; and fluorinated surfactants. Examples of coupling agents include silane coupling agents. Preferably, silane coupling agents have amino, isocyanate, urea, epoxy, vinyl, (meth)acryl, or mercapto groups as reactive groups. More preferably, silane coupling agents have epoxy, isocyanate, or (meth)acryl groups as reactive groups. Specific examples of such coupling agents include 3-(glycidoxy)propyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-isocyanopropyltriethoxysilane, and 3-ureopropyltriethoxysilane. [Manufacturing Method] The curable resin composition can be obtained by mixing the components. 2. Applications The described curable resin composition can form a resin curing film by irradiation with radiation, and is used as a protective layer in various display devices such as liquid crystal displays, organic electroluminescence (EL) display devices, micron light emitting diode (μLED) display devices, and quantum dot display devices; insulating films for printed wiring boards and semiconductor packaging, such as solder resist layers, plated resist layers, etched resist layers, etc., interlayer insulating layers for multilayer printed wiring boards, gas barrier films; sealing materials for semiconductor light-emitting elements such as lenses and light-emitting diodes (LEDs); topcoat coatings for paints or inks; hard coatings for plastics; rust-proof films for metals, etc. Furthermore, in this specification, semiconductor packaging refers not only to flip-chip packaging, wafer-level packaging, etc., but also to packaging that includes semiconductor chips and can be mounted on a printed circuit board, such as flip-chip packaging stacked on an interposer. This is particularly useful for optical semiconductor packaging combined with light-emitting elements (preferably LEDs such as UV-LEDs or Blue-LEDs). Additionally, the thermosetting resin composition can be molded itself and applied to the manufacture of films, substrates, plastic parts, optical lenses, etc. In particular, the resin-cured film is less prone to yellowing over time caused by electromagnetic waves with wavelengths around 340 nm to 480 nm. Therefore, when used in various devices with light sources emitting such electromagnetic waves (e.g., UV-LEDs or Blue-LEDs), it can suppress the drawbacks caused by yellowing over time. From this perspective, the resin-cured film is preferably positioned closer to the light source, especially when used as a protective film (sealing material) for arranging and sealing the light source on a mounting substrate; compared to other materials, it significantly suppresses the drawbacks caused by yellowing over time. The resin-curing film can be manufactured, for example, by coating the curable resin composition onto a substrate, drying it, and then irradiating (exposing) it with light (including ultraviolet light, radiation, etc.) to cure it. In this case, by using a light mask or the like to set up parts that are irradiated with light and parts that are not irradiated with light, curing only the parts that are irradiated with light, and dissolving the other parts with an alkaline solution, a cured material with the desired pattern can be obtained. When coating the curable resin composition onto the substrate, any known method may be used, such as solution impregnation, spraying, or using a roller coater, land coater, slot coater, or rotary coater. After the curable resin composition is coated to the desired thickness using these methods, the solvent is removed (pre-baking), thereby forming a film. Pre-baking is performed by heating using an oven and hot plates, vacuum drying, or a combination thereof. The heating temperature and time during pre-baking can be appropriately selected depending on the solvent used, for example, at a temperature of 80°C to 120°C for 1 to 10 minutes. Examples of radiation used in exposure include visible light, ultraviolet light, far ultraviolet light, electron beams, and X-rays, preferably radiation with wavelengths in the range of 250 nm to 450 nm. Alkaline development can be performed using aqueous solutions of substances such as sodium carbonate, potassium carbonate, potassium hydroxide, diethanolamine, and tetramethylammonium hydroxide as developing solutions. These developing solutions can be selected based on the characteristics of the resin layer, and surfactants may be added as needed. Development is preferably performed at a temperature of 20°C to 35°C. Fine, detailed images can be precisely formed using commercially available developing machines or ultrasonic cleaners. Furthermore, water washing is typically performed after alkaline development. Examples of developing methods include spray development, immersion development, dip development, and puddle development. After development in the manner described, a heat treatment (post-baking) is performed at a temperature of 180°C to 250°C for 20 to 100 minutes. This post-baking is performed to improve the adhesion between the patterned coating and the substrate. Similar to pre-baking, post-baking can be performed using an oven or hot plate. Subsequently, polymerization or curing (sometimes both are combined and referred to as curing) is completed by heating, resulting in a cured film such as an insulating film. The preferred curing temperature at this time is in the range of 160°C to 250°C. Furthermore, when using a thermal polymerization initiator to produce a resin-cured film via thermal curing, it is sufficient to simply coat the curable resin composition onto a substrate or similar material, dry it, and then heat-treat it. The conditions for coating, drying (pre-baking), and heat treatment (post-baking) can be set to the same conditions described for the methods including the exposure and alkaline development described above. [Examples] Hereinafter, embodiments and comparative examples will be specifically described to illustrate the implementation of the present invention, but the present invention is not limited to these examples. First, we will begin with an example of the synthesis of an alkali-soluble resin containing an unsaturated group as component (A). However, unless otherwise stated, the resins in these synthetic examples will be evaluated as follows. Furthermore, regarding various measuring devices, when using the same model, the device manufacturer's name is omitted starting from the second reference. Additionally, in the embodiments, all glass substrates used in the fabrication of the resin-cured film substrate for measurement are subjected to the same treatment before use. Furthermore, regarding the content of each component, when the first decimal place is 0, the description below the decimal point is sometimes omitted. [Solid Component Concentration] 1 g of the resin solution obtained in the synthesis example was impregnated in a glass filter (weight: W). The weight of the sample after weighing is 0 (g) [W]. 1 (g)], and the weight of the product after heating at 160°C for 2 hours [W] 2 (g)] and use the following formula to calculate. Solid component concentration (wt%) = 100 × (W 2-W 0) / (W 1-W 0) [Acid Value] The acid value is determined by dissolving the resin solution in dioxane, using a potentiometric titration apparatus "COM-1600" (manufactured by Hiranuma Sangyo Co., Ltd.), and titrating with a 1 / 10 N-KOH aqueous solution. [Molecular Weight] The molecular weight was determined using a gel permeation chromatograph (GPC) "HLC-8220GPC" (manufactured by Tosoh Corporation, solvent: tetrahydrofuran, column: TSKgelSuper H-2000 (2 columns) + TSKgelSuper H-3000 (1 column) + TSKgelSuper H-4000 (1 column) + TSKgelSuper H-5000 (1 column) (manufactured by Tosoh Corporation), temperature: 40℃, speed: 0.6 ml / min), and the weight average molecular weight (Mw) was calculated by converting it to the standard polystyrene (manufactured by Tosoh Corporation, PS-oligomer kit). The abbreviations used in the synthesis examples are as follows. BPFE: Bisphenol fluorene type epoxy resin (in general formula (5), Ar is a benzene ring and l is 0, epoxy equivalent 256 g / eq) TPP: Triphenyl phosphine (TPP) AA: Acrylic acid (AA) PGMEA: Propylene glycol monomethyl ether acetate (PGMEA) HPMDA: 1,2,4,5-cyclohexane tetracarboxylic dianhydride (ODPA) ODPA: 4,4'-oxydiphthalic dianhydride (ODPA) THPA: 1,2,3,6-tetrahydrophthalic anhydride (THPA) PA: Phthalic anhydride (PA) SA: Succinic anhydride (SA) anhydride (SA) DCPMA: dicyclopentanyl methacrylate (DCPMA) GMA: glycidyl methacrylate (GMA) St: styrene (St) AIBN: azobisisobutyronitrile (AIBN) TDMAMP: tris-dimethyl amino methyl phenol (TDMAMP) HQ: hydroquinone (HQ) TEA: triethyl amine (TEA) BPDA: 3,3',4,4'-biphenyl tetracarboxylic dianhydride (BPDA) BTDA: 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA) PMDA: Benzene 1,2,4,5-tetracarboxylic acid dianhydride (benzene 1,2,4,5-Tetracarboxylic dianhydride (PMDA) DPHA: Dipentaerythritol hexaacrylate (DPHA) PTMA: Pentaerythritol tetra(mercaptoacetate) (PTMA) BzDMA: Benzyl dimethyl amine (BzDMA) (Base-soluble resin containing unsaturated groups) [Synthesis Example 1] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, HPMDA (10.95 g, 0.05 mol) and THPA (7.43 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)-1 containing unsaturated groups. The obtained resin solution had a solids content of 56.0% by mass, an acid value (converted from solids content) of 105 mgKOH / g, and a Mw of 4000 based on GPC analysis. [Synthesis Example 2] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, 1,2,3,4-butanetetracarboxylic acid dianhydride (9.67 g, 0.05 mol) and THPA (7.43 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)-2 containing unsaturated groups. The obtained resin solution had a solids content of 55.6% by mass, an acid value (converted from solids content) of 106 mgKOH / g, and a Mw of 3300 based on GPC analysis. [Synthesis Example 3] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, 1,2,3,4-butanetetracarboxylic acid dianhydride (9.67 g, 0.05 mol) and PA (7.23 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)-3 containing unsaturated groups. The obtained resin solution had a solids content of 55.9% by mass, an acid value (converted from solids content) of 110 mgKOH / g, and a Mw of 2500 based on GPC analysis. [Synthesis Example 4] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, 1,2,3,4-butanetetracarboxylic acid dianhydride (9.67 g, 0.05 mol) and SA (4.89 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)-4 containing unsaturated groups. The obtained resin solution had a solids content of 54.8% by mass, an acid value (converted from solids content) of 110 mgKOH / g, and a Mw of 4000 based on GPC analysis. [Synthesis Example 5] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, ODPA (15.15 g, 0.05 mol) and THPA (7.43 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)-5 containing unsaturated groups. The obtained resin solution had a solids content of 57.2% by mass, an acid value (converted from solids content) of 96 mgKOH / g, and a Mw of 3500 based on GPC analysis. [Synthesis Example 6] PGMEA (300 g) was placed in a 1 L four-necked flask equipped with a reflux condenser. After purging the flask with nitrogen, the temperature was raised to 120 °C. The following mixture was added dropwise into the flask through a dropping funnel over a period of 2 hours: a mixture of AIBN (10 g) dissolved in a monomer mixture (DCPMA (77.1 g, 0.35 mol), GMA (49.8 g, 0.35 mol), and St (31.2 g, 0.30 mol)). The mixture was then stirred at 120 °C for 2 hours to obtain a copolymer solution. Subsequently, after replacing the flask system with air, AA (24.0 g, 95% of the mole number of glycidyl groups), TDMAMP (0.8 g), and HQ (0.15 g) were added to the obtained copolymer solution, and the mixture was stirred at 120 °C for 6 hours to obtain a copolymer solution containing polymerizable unsaturated groups. SA (30.0 g, 90% of the mole number of AA) and TEA (0.5 g) were added to the obtained copolymer solution containing polymerizable unsaturated groups, and the reaction was carried out at 120 °C for 4 hours to obtain an alkali-soluble copolymer resin solution (A)-6 containing polymerizable unsaturated groups. The solids concentration of the resin solution was 46.0% by mass, the acid value (converted from solids content) was 76 mgKOH / g, and the Mw obtained based on GPC analysis was 5300. [Synthesis Example 7] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, BPDA (14.37 g, 0.05 mol) and THPA (7.43 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)'-7 containing unsaturated groups. The obtained resin solution had a solids content of 57.0% by mass, an acid value (converted from solids content) of 96 mgKOH / g, and a Mw of 3600 based on GPC analysis. [Synthesis Example 8] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, BTDA (15.73 g, 0.05 mol) and THPA (7.43 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)'-8 containing unsaturated groups. The obtained resin solution had a solids content of 57.4% by mass, an acid value (converted from solids content) of 105 mgKOH / g, and a Mw of 3200 based on GPC analysis. [Synthesis Example 9] BPFE (50.00 g, 0.10 mol), AA (14.07 g, 0.20 mol), TPP (0.26 g), and PGMEA (40.00 g) were added to a 250 mL four-necked flask equipped with a reflux condenser. The mixture was stirred at 100°C–105°C for 12 hours to obtain the reaction product. Subsequently, PGMEA (25.00 g) was added to adjust the solid content to 50% by mass. Subsequently, PMDA (10.65 g, 0.05 mol) and THPA (7.43 g, 0.05 mol) were added to the obtained reaction product, and the mixture was stirred at 115℃–120℃ for 6 hours to obtain an alkali-soluble resin (A)'-9 containing unsaturated groups. The obtained resin solution had a solids content of 55.9% by mass, an acid value (converted from solids content) of 105 mgKOH / g, and a Mw of 3600 based on GPC analysis. [Synthesis Example 10] PTMA (20.00 g, 0.19 mol thiol), DPHA (212.00 g, 2.12 mol acrylate), PGMEA (58.00 g), HQ (0.1 g), and BzDMA (0.01 g) were added to a 1 L four-necked flask and reacted at 60 °C for 12 hours to obtain a dendritic polymer solution (B)-2. The disappearance of thiol groups in the obtained dendritic polymer was confirmed using the iodine quantification method. The solid content of the obtained dendritic polymer solution was 80.0% by mass, and the Mw obtained based on GPC analysis was 10000. The curable resin compositions of Examples 1 to 10 and Comparative Examples 1 to 3 were prepared using the formulation amounts (in mass %) listed in Table 1. The formulation components used in Table 1 are as described below. (Base-soluble resin containing unsaturated groups) (A)-1: Resin solution obtained in Synthesis Example 1 (solid content concentration 56.0% by mass) (A)-2: Resin solution obtained in Synthesis Example 2 (solid content concentration 55.6% by mass) (A)-3: Resin solution obtained in Synthesis Example 3 (solid content concentration 55.9% by mass) (A)-4: Resin solution obtained in Synthesis Example 4 (solid content concentration 54.8% by mass) (A)-5: Resin solution obtained in Synthesis Example 5 (solid content concentration 57.2% by mass) (A)-6: Resin solution obtained in Synthesis Example 6 (solid content concentration 46.0% by mass) (A)'-7: Resin solution obtained in Synthesis Example 7 (solid content concentration 57.0% by mass) (A)'-8: Resin solution obtained in Synthesis Example 8 (solid content concentration 57.4% by mass) (A)'-9: Resin solution obtained in Synthesis Example 9 (solid content concentration 55.9% by mass) (Polymerizable Compounds) (B)-1: Dipentaerythritol penta / hexaacrylate mixture (KAYARAD DPHA, molecular weight 740, manufactured by Nippon Kayaku Co., Ltd., "KAYARAD" is a registered trademark of the company) (B)-2: Dendritic polymer solution obtained in Synthesis Example 10 (solids concentration 80.0% by mass) (Epoxy Compound) (C): Biphenyl type epoxy resin (jER YX4000, manufactured by Mitsubishi Chemical Corporation) (Solvent) (D): Propylene glycol monomethyl ether acetate (PGMEA) (Polymerization Initiator) (E): 2-[4-(methylthio)benzoyl]-2-(4-morpholinyl)propane ("Omnirad 907" is manufactured by IGM Resins BV, "Omnirad" is a registered trademark of the company) (Sensitizer) (F): Miskelion [Table 1] [Evaluation] [Calculation of Highest Occupied Molecular Orbital (HOMO) and Lowest Unoccupied Molecular Orbital (LUMO)] The energies of the highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) of alkali-soluble resins containing unsaturated groups ((A)-1 to (A)-5 and (A)'-7 to (A)'-9) were determined by quantum chemical calculations based on the structural units of these resins represented by the following general formula (13). The quantum chemical calculations were performed using the Gaussian 16, Revision B.01 software package (Gaussian Inc.). Specifically, for the molecular structure (molecular coordinates) of the structural unit (terminally hydrogen-substituted) of these resins represented by general formula (13), with charge 0 and multiplicity 1, the most stable structure of the structural unit and the energies of the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) in this structure are calculated by density functional method (DFT) using B3LYP as the functional and 6-31G(d) as the basis function (Gaussian input line "#B3LYP / 6-31G(d)OPT"). [Chemistry 19] (In formula (13), Y is a residue of tetracarboxylic dianhydride used in the synthesis of each resin, and Z is a residue of dicarboxylic dianhydride used in the synthesis of each resin.) The energies of the highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) of the alkali-soluble resin containing unsaturated groups ((A)-6) are calculated in the same manner as (A)-1 to (A)-5 and (A)'-7 to (A)'-9, based on the structural units of these resins represented by the following general formula (14). [Chemistry 20] (In equation (14), a, b and c are the molar ratios of each structural unit, which are set to a:b:c=1:1:1 during calculation) (Preparation of a substrate with a resin-cured film for transmittance evaluation after initial transmittance / lightfastness testing) The photosensitive resin composition shown in Table 1 was coated onto the following glass substrate "#1737" using a spin coater, with a film thickness of 10.0 μm after heat curing. The substrate was pre-irradiated with a low-pressure mercury lamp at a wavelength of 254 nm and an illuminance of 1000 mJ / cm². 2 On a 125 mm × 125 mm glass substrate "#1737" after being cleaned with ultraviolet light, a pre-baking process was performed at 90°C for 3 minutes using a hot plate to create a dry film. Subsequently, the substrate was formally cured (post-baked) at 230°C for 30 minutes using a hot air dryer to obtain the substrates with resin-cured films of Examples 1 to 10 and Comparative Examples 1 to 3. [Initial Transmittance Evaluation] The transmittance of the substrate with the hardened film after formal curing and before the lightfastness test was measured at a wavelength of 400 nm using a UV-Vis-IR spectrophotometer "UH4150" (manufactured by Hitachi High-Tech Science Co., Ltd.). [Evaluation of transmittance after lightfastness test] A blue filter "IEB400" (manufactured by Gosuzu Seiko Glass Co., Ltd., 50 mm × 50 mm × 5 mm, transmittance of less than 10% at wavelengths below 340 nm / above 480 nm) was placed on the substrate with the hardened film after formal curing, and light irradiation was performed for 500 hours using the Xe test chamber "Q-SUN Xe-1" (manufactured by Q-Lab Corporation). The transmittance at a wavelength of 400 nm was measured in the area of ​​the substrate with the resin hardened film separated by the blue filter after light irradiation using a UV-Vis-IR spectrophotometer "UH4150" (manufactured by Hitachi High-Tech Science Co., Ltd.). (Preparation of resin-cured film powder for evaluating heat resistance and decomposition resistance) The photosensitive resin composition shown in Table 1 was coated onto a glass substrate "#1737" using a spin coater to achieve a film thickness of 10.0 μm after heat curing. A pre-baking process was performed at 90°C for 3 minutes using a hot plate to create a dried film. Subsequently, a formal curing process (post-baking) was performed at 230°C for 30 minutes using a hot air dryer to obtain substrates with resin-cured films as described in Examples 1-10 and Comparative Examples 1-3. The obtained cured films were cut into powder form and used for thermogravimetry / differential thermal analysis (TG / DTA) measurements. [Evaluation of Heat Decomposition Resistance] (Evaluation Method) For the obtained resin-cured film powder, using a TG-DTA apparatus "TG / DTA6200" (manufactured by Seiko Instruments Co., Ltd.), the temperature was increased from 30°C to 400°C in air at a heating rate of 5°C / min, and the temperature at which the weight of the test object decreased by 5% was measured. Furthermore, a value of △ or above was considered acceptable. (Evaluation Criteria) ◎: 5% weight loss at a temperature above 320℃ ○: 5% weight loss at a temperature above 300℃ but below 320℃ △: 5% weight loss at a temperature above 280℃ but below 300℃ ×: 5% weight loss at a temperature below 280℃ (Preparation of resin-cured film for glass transition temperature evaluation) The photosensitive resin composition shown in Table 1 was coated onto a release foil "sepanium" (manufactured by Toyo Aluminum Co., Ltd.) with a thickness of 30.0 μm after heat curing using a spin coater. The film was pre-baked at 90°C for 3 minutes using a hot plate to create a dried film. Subsequently, it was formally cured (post-baked) at 230°C for 30 minutes using a hot air dryer. Finally, the resin-cured film was peeled off from the release foil to obtain the resin-cured films of Examples 1-10 and Comparative Examples 1-3. [Glass Transition Temperature Evaluation] Using a dynamic viscoelasticity (dynamic thermomechanical analysis, DMA) measuring apparatus (RSA-G2 manufactured by TA Instruments Inc.), a hardened film with a width of 5 mm was set with a clamp length of 22 mm, and the glass transition temperature was measured in the temperature range of 30°C to 300°C. Furthermore, a value above Δ was considered acceptable. (Evaluation Criteria) ◎: Glass transition temperature above 180℃ ○: Glass transition temperature above 160℃ but below 180℃ △: Glass transition temperature above 140℃ but below 160℃ ×: Glass transition temperature below 140℃ (Preparation of a substrate with a resin-cured film for evaluating development adhesion / initial pattern transmittance) Using a spin coater, the photosensitive resin composition shown in Table 1 was coated onto a glass substrate "#1737" with a film thickness of 10.0 μm after heat curing. The film was then pre-baked at 90°C for 3 minutes using a hot plate to create a dry film. Subsequently, the film was subjected to i-ray irradiation of 30 mW / cm². 2 The drying film was irradiated with an ultra-high pressure mercury lamp at 500 mJ / cm 2 The ultraviolet light is used to carry out the photocuring reaction of the drying film. Subsequently, the exposed film was subjected to treatment with 2.38% tetramethylammonium hydroxide (TMAH) at 23°C at a concentration of 1 kgf / cm³. 2 After a 60-second development process under a spray pressure of 5 kgf / cm, the mixture is then subjected to further treatment. 2 The substrates were sprayed with water to remove unexposed areas and form a 10 μm dot pattern. Finally, they were formally cured (post-baked) at 230°C for 30 minutes using a hot air dryer to obtain the substrates with resin-cured films of Examples 1 to 10 and Comparative Examples 1 to 3. [Development Adhesion] The 10 μm dot pattern of the resin-cured film on the obtained substrate with the resin-cured film was observed using an optical microscope, and it was determined whether the pattern had peeled off. In addition, △ or above was considered acceptable. (Evaluation Criteria) ○: No pattern peeling observed △: Very small portion of the pattern peeling observed ×: Most of the pattern peeling [Evaluation of initial pattern transmittance] The transmittance of the substrate with the hardened film after development / formal hardening was measured at a wavelength of 400 nm using a UV-Vis-IR spectrophotometer "UH4150" (manufactured by Hitachi High-Tech Science Co., Ltd.). The evaluation results are shown in Table 2. [Table 2] As shown in Table 2, it can be seen that the resin-cured films of Examples 1 to 10 obtained from the photosensitive resin composition of the present invention exhibit small changes in transmittance and suppress yellowing when irradiated with light of wavelengths from 340 nm to 480 nm. This is believed to be because by setting the energy difference between the HOMO and LUMO of component (A) to 3.7 eV or higher, the absorption of light in the aforementioned wavelength region can be suppressed, thereby inhibiting the deterioration of the resin-cured film. By using a thermosetting resin containing unsaturated groups as represented by general formula (1) as component (A), the resistance to thermal decomposition can be improved, thereby increasing the glass transition temperature and thus improving the dimensional stability during heating. This is believed to be because the thermosetting resin containing unsaturated groups represented by general formula (1) has multiple aromatic rings and therefore excellent thermal stability. As shown in Examples 7 to 9, it can be seen that by using a resin containing a dicarboxylic acid or tricarboxylic acid or its monohydric anhydride with a cyclic structure as component (A), peeling during pattern formation can be suppressed, and fine patterns of the resin-cured film can be formed. As shown in Examples 7 to 10, it can be seen that by using dendritic polymer as component (B), the penetration of developer into the photocuring part can be suppressed, thereby suppressing the yellowing of the resin curing film during formal curing (post-baking). [Industrial Applicability] The present invention provides photosensitive resin compositions that can be used in the manufacture of various articles. In particular, it provides resin-cured films suitable for fixing and sealing photodiodes to mounting substrates. none. none.

Claims

1. A curable resin composition comprising: (A) an alkali-soluble resin containing unsaturated groups, (B) a polymeric compound having two or more unsaturated bonds, (C) an epoxy compound having two or more epoxy groups, and (D) a solvent, wherein component (A) is a resin for which the energy difference between the highest occupied molecular orbital and the lowest unoccupied molecular orbital, calculated by quantum chemical calculations, is 3.7 eV or more, wherein... The component (A) is selected from at least one of the following groups (i) to (iii): (i) an alkali-soluble resin containing unsaturated groups obtained by reacting an epoxy compound having two or more epoxy groups with a monocarboxylic acid containing unsaturated groups, and then with a polycarboxylic acid or its anhydride; (ii) an alkali-soluble resin containing unsaturated groups as an acrylic (co)polymer; and (iii) an alkali-soluble resin containing unsaturated groups as a polysiloxane containing a plurality of siloxane bonds.

2. The curable resin composition as claimed in claim 1, wherein, The component (A) is a resin represented by the following general formula (1); In formula (1), Ar is independently an aromatic hydrocarbon group having 6 or more and 14 or less carbon atoms, and a portion of the hydrogen atom constituting Ar may be substituted with a substituent selected from the group consisting of alkyl with 1 or more and 10 or less carbon atoms, aryl or arylalkyl with 6 or more and 10 or less carbon atoms, cycloalkyl or cycloalkylalkyl with 3 or more and 10 or less carbon atoms, alkoxy with 1 or more and 5 or less carbon atoms, and halogen groups; R1 is independently an alkyl group having 2 or more and 4 or less carbon atoms; l is independently a number of 0 or more and 3 or less; G is independently (meth)acrylyl, or a substituent represented by the following general formula (2) or the following general formula (3); Y is a tetravalent carboxylic acid residue; Z is independently a hydrogen atom or a substituent represented by the following general formula (4), at least one of Z being a substituent represented by the following general formula (4); n is a number with an average value of 1 or more and 20 or less. In formulas (2) and (3), R2 is a hydrogen atom or a methyl group, R3 is an alkyl group or an alkylaryl group with 2 or more carbon atoms and less than 10 carbon atoms, R4 is a saturated or unsaturated hydrocarbon group with 2 or more carbon atoms and less than 20 carbon atoms, p is a number with 0 or more carbon atoms and less than 10 carbon atoms, and * is a bonding site. In formula (4), W is a divalent or trivalent carboxylic acid residue, m is a number with 1 or 2 carbon atoms, and * is a bonding site.

3. The curable resin composition as claimed in claim 1 or claim 2, wherein component (A) is a resin having a weight average molecular weight of 1,000 or more and 40,000 or less and an acid value of 50 mgKOH / g or more and 200 mgKOH / g or less.

4. The curable resin composition as claimed in claim 1 or claim 2, comprising at least one of (E) a polymerization initiator and (F) a sensitizer.

5. A resin-curing film is formed by curing a curable resin composition as described in any one of claims 1 to 4.

6. A semiconductor package comprising using a resin-cured film as described in claim 5 as at least one protective film.

7. A display device comprising using a resin-cured film as described in claim 5 as at least one protective film.