Antenna device

Abstract

An antenna device includes a first housing, a second housing, a heat sink, and an antenna module. The second housing is connected to the first housing to form a receiving space. The second housing includes a bottom wall, a side wall, and a plurality of heat sinks. The bottom wall has an inner surface facing the first housing. The side wall is connected to the bottom wall. The heat sinks are disposed on the inner surface. The heat sink is disposed on the inner surface and includes a body portion and a hollow portion penetrating the body portion, the body portion being adjacent to the side wall. The antenna module is located in the receiving space and includes a circuit board. The circuit board is located between the heat sink and the first housing. The circuit board includes a first hot zone and a second hot zone, the second hot zone surrounding the first hot zone. The body portion contacts the second hot zone, and the heat sinks penetrate the hollow portion to contact the first hot zone.

Description

Antenna device The present invention relates to an antenna device, and in particular to an antenna device for a low-orbit satellite user terminal. Low-Earth orbit (LEO) user terminal antennas receive signals from satellites in low Earth orbit. Unlike traditional wired or cellular networks, these antennas allow users to directly access data from satellites and communicate with remote locations. These antennas are primarily used in remote areas such as mountains, deserts, and outlying islands. However, this antenna device generates a high amount of heat, which may cause the antenna performance to degrade or even be damaged due to overheating. The present invention provides an antenna device which can achieve uniform heat dissipation effect. The antenna device of the present invention includes a first shell, a second shell, a heat sink and an antenna module. The second shell is connected to the first shell to form a storage space, and the second shell includes a bottom wall, a side wall and a plurality of heat sinks. The bottom wall has an inner surface facing the first shell. The side wall is connected to the bottom wall. The heat sink is arranged on the inner surface. The heat sink is arranged on the inner surface, and the heat sink includes a main body and a hollow part passing through the main body, and the main body is adjacent to the side wall. The antenna module is located in the storage space and includes a circuit board, and the circuit board is located between the heat sink and the first shell. The circuit board includes a first hot zone and a second hot zone, and the second hot zone surrounds the first hot zone, the main body contacts the second hot zone, and the heat sink passes through the hollow part to contact the first hot zone. In one embodiment of the present invention, the heat energy of the first heating zone is adapted to be transferred to the bottom wall of the second housing via the heat dissipation columns, and the heat energy of the second heating zone is adapted to be transferred to the side wall of the second housing via the heat dissipation plates. In one embodiment of the present invention, the first shell includes a first peripheral portion, and the second shell includes a second peripheral portion. In one embodiment of the present invention, in a normal direction of the circuit board, a gap is defined between the first peripheral portion and the second peripheral portion. In one embodiment of the present invention, the side wall has a first side and a second side opposite to each other, the circuit board is located on the first side, and the first peripheral portion and the second peripheral portion correspond to the second side. In one embodiment of the present invention, in a normal direction of the circuit board, the first peripheral portion covers the second peripheral portion. In one embodiment of the present invention, the heat dissipation plate includes an extension portion, which extends from the main body portion through the side wall to between the first peripheral portion and the second peripheral portion. In one embodiment of the present invention, at least a portion of the extension portion is exposed outside the first shell and the second shell. In one embodiment of the present invention, in the direction parallel to the surface of the circuit board, the first peripheral portion has a first length, the second peripheral portion has a second length, and the first length is greater than or equal to the second length. In one embodiment of the present invention, the second peripheral portion includes a plurality of side edges, each side edge has a plurality of heat dissipation holes, and the diameter of the heat dissipation holes gradually decreases from the center area of ​​each side edge toward both sides. In one embodiment of the present invention, the first peripheral portion has a guide curved surface facing the second peripheral portion, and an external airflow is suitable for passing through the heat dissipation hole from the bottom of the second shell toward the first shell. The guide curved surface is suitable for guiding the external airflow to diffuse outward. In one embodiment of the present invention, the second peripheral portion includes a plurality of corners, there is a corner between adjacent side edges, and the straight-line distance between the corner and the heat dissipation column is greater than the straight-line distance between the adjacent side edges and the heat dissipation column. In one embodiment of the present invention, the bottom wall has an outer surface facing away from the first shell, and the second shell further includes a plurality of protruding ribs on the outer surface. In one embodiment of the present invention, the area of ​​the second hot zone is 0.25 to 0.75 times the area of ​​the first hot zone. In one embodiment of the present invention, the antenna module includes a plurality of antenna units disposed on a circuit board, and the antenna units are arranged in an array. In one embodiment of the present invention, the heat dissipation plate has a top surface facing the first housing and includes a plurality of heat dissipation pads located on the top surface. In one embodiment of the present invention, the heat dissipation plate has a top surface facing the first housing, and heat dissipation grease is disposed between the top surface and the second hot zone of the circuit board. In one embodiment of the present invention, the heat dissipation column has a top end facing the first housing and includes a plurality of heat dissipation pads located at the top end. In one embodiment of the present invention, the thermal conductivity of the heat dissipation plate is greater than or equal to the thermal conductivity of the second housing. In one embodiment of the present invention, the heat dissipation plate is made of copper, the first housing is made of plastic, and the second housing is made of aluminum. Based on the above, in the antenna device of the present invention, heat energy from the first hot zone of the circuit board is adapted to be transferred via the heat dissipation posts to the bottom wall of the second housing, where it is conducted downward and then further dissipated. Heat energy from the second hot zone of the circuit board is adapted to be transferred via the heat dissipation plates to the side walls of the second housing, where it is conducted laterally and then further dissipated. This allows different hot zones to dissipate heat through distinct heat dissipation paths, preventing heat accumulation and achieving uniform heat dissipation. In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. FIG1 is a perspective schematic diagram of an antenna device according to an embodiment of the present invention. FIG2 is a side view of the antenna device of FIG1 . FIG3 is a component disassembled diagram of the antenna device of FIG1 . Referring to FIG1 to FIG3 , the antenna device 100 of this embodiment includes a first housing 110, a second housing 120, a heat sink 130, and an antenna module 140. The second housing 120 is connected to the first housing 110 to form a storage space A1. The antenna module 140 is located in the storage space A1 and includes a circuit board 141 and a plurality of antenna units 142. The circuit board 141 is located between the heat sink 130 and the first housing 110. In this embodiment, antenna units 142 are disposed on circuit board 141 and electrically connected to the computing module. Antenna units 142 are arranged in an array to form a plurality of array antenna units for communicating signals with external satellites. Here, antenna device 100 is, for example, but not limited to, a low-orbit satellite user terminal antenna. In this embodiment, the circuit board 141 includes a first hot zone H1 and a second hot zone H2, with the second hot zone H2 surrounding the first hot zone H1. The temperature of the first hot zone H1 is higher than that of the second hot zone H2. In other words, heat energy is concentrated in the center of the circuit board 141. Here, the area of ​​the second hot zone H2 is 0.25 to 0.75 times that of the first hot zone H1, but this is not limited to this. Figure 4A is a cross-sectional view of the antenna device of Figure 1. Figure 4B is a partially enlarged view of the antenna device of Figure 4A. Referring to Figures 3, 4A, and 4B, in this embodiment, the second housing 120 includes a bottom wall 121, a side wall 122, and a plurality of heat dissipation posts 123. The bottom wall 121 has an inner surface F1 facing the first housing 110. The side wall 122 is connected to the bottom wall 121. The heat dissipation posts 123 are disposed on the inner surface F1. In one embodiment, the bottom wall 121, the side wall 122, and the heat dissipation posts 123 are integrally formed, but this is not a limitation. In this embodiment, the thermal conductivity of the heat sink 130 is greater than that of the second housing 120. For example, the heat sink 130 is made of copper, the first housing 110 is made of plastic, and the second housing 120 is made of aluminum, but this is not limiting. In other embodiments, the thermal conductivity of the heat sink 130 is equal to that of the second housing 120, and both the heat sink 130 and the second housing 120 are made of aluminum, but this is not a limitation of the present invention. In this embodiment, the heat dissipation plate 130 is disposed on the inner surface F1 and includes a main body 131 and a hollow portion 132 extending through the main body 131. The main body 131 is adjacent to the sidewall 122. Specifically, the main body 131 contacts the second hot zone H2, and the heat dissipation posts 123 pass through the hollow portion 132 to contact the first hot zone H1. In this configuration, the heat sink 123 corresponds to and contacts the first hot zone H1, which has a higher heat dissipation requirement, while the heat sink 130 corresponds to and contacts the second hot zone H2. Heat energy from the first hot zone H1 is transferred via the heat sink 123 to the bottom wall 121 of the second housing 120 for downward conduction. Heat energy from the second hot zone H2 is transferred via the heat sink 130 to the side walls 122 of the second housing 120 for laterally conduction. This allows different hot zones to dissipate heat through distinct heat dissipation pathways, preventing heat accumulation and achieving uniform heat dissipation. Specifically, referring to Figure 3 , in one embodiment, the heat sink 130 has a top surface 133 facing the first housing 110 and includes a plurality of heat dissipation pads T1 located on the top surface 133 to enhance heat dissipation efficiency, but the present invention is not limited thereto. In another embodiment, thermal grease is applied between the top surface 133 and the second hot zone H2 of the circuit board 141 to enhance heat dissipation efficiency, but the present invention is not limited thereto. Furthermore, the antenna device 100 includes a waterproof ring 150 located between the first housing 110 and the second housing 120 to provide dust and water resistance. Referring to Figures 2 and 4B , in this embodiment, the first housing 110 includes a first peripheral portion 111, and the second housing 120 includes a second peripheral portion 124. The sidewall 122 has a first side S1 and a second side S2 opposite each other. The circuit board 141 is located on the first side S1, and the first peripheral portion 111 and the second peripheral portion 124 correspond to the second side S2. In this embodiment, in a normal direction N1 of the circuit board, the first peripheral portion 111 covers the second peripheral portion 124 to prevent the second peripheral portion 124 from being directly exposed to sunlight, thereby achieving a sunshade effect, but the present invention is not limited thereto. In this embodiment, a gap G1 is defined between the first peripheral portion 111 and the second peripheral portion 124 along the normal direction N1 of the circuit board 141. Furthermore, the first peripheral portion 111 has a curved flow-guiding surface C1 facing the second peripheral portion 124. This design provides the advantage of allowing external airflow to flow from the bottom of the second housing 120 toward the first housing 110, upward through the heat dissipation holes E1. The curved flow-guiding surface C1 guides the external airflow outward, dissipating heat through the airflow. Figure 5 is a top view of the second housing shown in Figure 3. Referring to Figure 5, in this embodiment, the second peripheral portion 124 includes a plurality of side edges 1241. Each side edge 1241 has a plurality of heat dissipation holes E1. The diameter of the heat dissipation holes E1 gradually decreases from the center of each side edge 1241 toward the sides. In other words, the diameter of the heat dissipation holes E1 located in the center is larger, while the diameters of the remaining heat dissipation holes E1 gradually decrease from the center toward the ends. Furthermore, in this embodiment, the second peripheral portion 124 includes a plurality of corners 1242, and there is a corner 1242 between adjacent side edges 1241. The straight-line distance K1 between the corner 1242 and the heat dissipation column 123 is greater than the straight-line distance K2 between the adjacent side edges 1241 and the heat dissipation column 123. In other words, the straight-line distance between each corner 1242 and the first hot zone H1 is greater than the straight-line distance between each side edge 1241 and the first hot zone H1. Thus, the heat dissipation hole E1 located at the corner 1242 is farther from the center of the antenna module 140. The heat dissipation hole E1 with a smaller aperture area can prevent the temperature from dropping too quickly, and can prevent the rapid formation of icicles in low-temperature cold regions, thereby achieving a uniform heat dissipation effect. Figure 6 is a schematic diagram of some components of the antenna device of Figure 3. Referring to Figures 3 and 6, in this embodiment, the heat dissipation column 123 has a top 1231 facing the first housing 110 and includes a plurality of heat dissipation pads D1 located at the top 1231 to enhance heat dissipation efficiency, but the present invention is not limited thereto. In other embodiments, thermal grease may be applied between the top 1231 of the heat dissipation column 123 and the first hot zone H1 of the circuit board 141 to enhance heat dissipation efficiency, but the present invention is not limited thereto. Figure 7 is a schematic diagram of the heat sink of Figure 3 from another perspective. Referring to Figures 3 and 7, in this embodiment, the heat sink 130 has a recess 134 facing the bottom wall 121. This design advantage prevents the second hot zone H2 from directly contacting the bottom wall 121 of the second housing 120. In other words, the second hot zone H2 is spaced apart from the bottom wall 121. Here, the second hot zone H2 contacts the side wall 122 of the second housing 120 through the side panels 1301 of the heat sink 130, thereby dissipating heat laterally. The following examples are provided for illustration purposes only. It should be noted that the following examples share the same component numbers and some of the details as the previous examples, with the same numbers used to represent the same or similar components, and descriptions of the same technical details omitted. For the omitted details, please refer to the previous examples, and the following examples will not be repeated. Figure 8 is a perspective schematic diagram of an antenna device according to another embodiment of the present invention. Figure 9 is a component disassembled view of the antenna device of Figure 8. Figure 10A is a cross-sectional view of the antenna device of Figure 8. Figure 10B is a partially enlarged view of the antenna device of Figure 10A. Figure 11 is a schematic diagram of the antenna device of Figure 8 from another perspective. 8 to 10B , the antenna device 100B of this embodiment includes a first housing 110B, a second housing 120B, a heat sink 130B, and an antenna module 140. The second housing 120B is connected to the first housing 110B to form an accommodating space A1 ′. In this embodiment, the second housing 120B includes a bottom wall 121B, a side wall 122B, and a plurality of heat dissipation posts 123B. The bottom wall 121B has an inner surface F1' facing the first housing 110B. The side wall 122B is connected to the bottom wall 121B. The heat dissipation posts 123B are disposed on the inner surface F1' and connected to the first hot zone H1 through the hollow portion 132B. In this embodiment, the heat sink 130B includes an extension portion B1. The extension portion B1 extends from the main body 131B through the sidewall 122B to between the first peripheral portion 111B and the second peripheral portion 124B. For example, the sidewall 122B has a perforation, and the extension portion B1 extends from the first side S1' through the perforation to the second side S2', but this is not limited to the embodiment. In one embodiment, the extension portion B1 of the heat sink 130B only contacts the third side S3' and does not bend to contact the first side S1' or the second side S2'. The extension method of the extension portion B1 can be adjusted appropriately according to actual needs, and the present invention is not limited to this. In this way, at least a portion of the extension portion B1 is exposed outside the first housing 110B and the second housing 120B, and heat can be directly transferred to the outside through the extension portion B1 of the heat dissipation plate 130B, thereby improving heat dissipation efficiency. In this embodiment, the end of the extension portion B1 is curled to form a skirt, but the present invention is not limited thereto. In this embodiment, in a direction parallel to the surface of the circuit board 141, the first peripheral portion 111B has a first length L1, and the second peripheral portion 124B has a second length L2. The first length L1 is greater than or equal to the second length L2, thereby preventing the second peripheral portion 124B from being directly exposed to sunlight to achieve a sunshade effect, but is not limited to this. 11 , in this embodiment, the bottom wall 121 has an outer surface F2 away from the first housing 110 , and the second housing 120 further includes a plurality of protruding ribs 125 on the outer surface F2 to increase heat dissipation performance, which is not limited to the present invention. In summary, in the antenna device of the present invention, heat energy from the first hot zone of the circuit board is transferred via the heat dissipation posts to the bottom wall of the second housing, where it is conducted downward and then dissipated outward. Heat energy from the second hot zone of the circuit board is transferred via the heat dissipation plates to the side walls of the second housing, where it is conducted laterally and then dissipated outward. This allows different hot zones to dissipate heat through distinct heat dissipation paths, preventing heat accumulation and achieving uniform heat dissipation. Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Anyone with ordinary skill in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent applications. 100, 100B: antenna device 110, 110B: first housing 111, 111B: first peripheral portion 120, 120B: second housing 121, 121B: bottom wall 122, 122B: side wall 123, 123B: heat dissipation column 1231: top 124, 124B: second peripheral portion 1241: side 1242: corner 125: protruding rib 130, 130B: heat dissipation plate 1301: side plate 131, 131B: main body 132, 132B: hollow portion 13 3: Top surface 134: Recess 140: Antenna module 141: Circuit board 142: Antenna unit 150: Waterproof ring A1, A1': Accommodation space B1: Extension C1: Guide surface D1: Heat dissipation pad E1: Heat dissipation holes F1, F1': Inner surface F2: Outer surface G1: Gap H1: First hot zone H2: Second hot zone K1, K2: Straight distance L1: First length L2: Second length N1: Normal direction S1, S1': First side S2, S1': Second side S3': Third side T1: Heat dissipation pad FIG1 is a perspective schematic diagram of an antenna device according to an embodiment of the present invention. FIG2 is a side view of the antenna device of FIG1. ​​FIG3 is a component disassembled diagram of the antenna device of FIG1. ​​FIG4A is a cross-sectional view of the antenna device of FIG1. ​​FIG4B is a partially enlarged view of the antenna device of FIG4A. FIG5 is a top view of the second shell of FIG3. FIG6 is a partial component schematic diagram of the antenna device of FIG3. FIG7 is a schematic diagram of the heat sink of FIG3 from another perspective. FIG8 is a perspective schematic diagram of an antenna device according to another embodiment of the present invention. FIG9 is a component disassembled diagram of the antenna device of FIG8. FIG10A is a cross-sectional view of the antenna device of FIG8. FIG10B is a partially enlarged view of the antenna device of FIG10A. FIG11 is a schematic diagram of the antenna device of FIG8 from another perspective. 100: Antenna device 110: First shell 111: First peripheral portion 120: Second shell 121: Bottom wall 122: Sidewall 123: Heat dissipation column 124: Second peripheral portion 1241: Side 1242: Corner 130: heat sink 1301: Side panel 131: Ontology part 132: Hollow 133: Top 134: Depression 140: Antenna module 141: Circuit Board 142: Antenna unit A1: Accommodation space C1: flow guide surface E1: Heat dissipation holes F1: inner surface G1: Gap H1: The first hot zone H2: The second hot zone N1: normal direction S1: First side S2: Second side

Claims

1. An antenna device, comprising: First shell; A second housing, connected to the first housing to form a receiving space, the second housing comprising: a bottom wall having an inner surface facing the first housing; a side wall connected to the bottom wall; and a plurality of heat dissipation columns disposed on the inner surface; a heat dissipation plate disposed on the inner surface, the heat dissipation plate comprising a body portion and a hollow portion penetrating the body portion, the body portion being adjacent to the side wall; and an antenna module located in the receiving space, and comprising a circuit board located between the heat dissipation plate and the first housing, the circuit board comprising a first hot zone and a second hot zone, the second hot zone surrounding the first hot zone, the body portion contacting the second hot zone, and the heat dissipation columns penetrating the hollow portion to contact the first hot zone.

2. The antenna device as claimed in claim 1, wherein the heat energy of the first hot zone is adapted to be transferred to the bottom wall of the second housing via the heat dissipation columns, and the heat energy of the second hot zone is adapted to be transferred to the side wall of the second housing via the heat dissipation plate.

3. The antenna device as claimed in claim 1, wherein the first housing includes a first peripheral portion and the second housing includes a second peripheral portion.

4. The antenna device as claimed in claim 3, wherein a gap exists between the first peripheral portion and the second peripheral portion in a normal direction of the circuit board.

5. The antenna device as claimed in claim 3, wherein the sidewall has a first side and a second side opposite to each other, the circuit board is located on the first side, and the first peripheral portion and the second peripheral portion correspond to the second side.

6. The antenna device as claimed in claim 3, wherein the first periphery covers the second periphery in a normal direction of the circuit board.

7. The antenna device as claimed in claim 3, wherein the heat sink includes an extension that extends from the body portion through the sidewall to between the first peripheral portion and the second peripheral portion.

8. The antenna device as claimed in claim 7, wherein at least a portion of the extension is exposed outside the first housing and the second housing.

9. The antenna device as claimed in claim 3, wherein in a direction parallel to the surface of the circuit board, the first peripheral portion has a first length, the second peripheral portion has a second length, and the first length is greater than or equal to the second length.

10. The antenna device as claimed in claim 3, wherein the second peripheral portion includes a plurality of sides, each side having a plurality of heat dissipation holes, the diameter of the heat dissipation holes gradually decreasing from the central region of each side toward both sides.

11. The antenna device of claim 10, wherein the first periphery has a guide surface facing the second periphery, an external airflow is adapted to pass through the heat dissipation holes from the bottom of the second housing toward the first housing, and the guide surface is adapted to guide the external airflow to diffuse outward.

12. The antenna device of claim 10, wherein the second periphery includes a plurality of corners, one of which is between adjacent sides, and the straight-line distance between the corner and the heat sink is greater than the straight-line distance between the adjacent side and the heat sink.

13. The antenna device as claimed in claim 1, wherein the bottom wall has an outer surface opposite to the first housing, and the second housing further includes a plurality of protruding ribs located on the outer surface.

14. The antenna device as claimed in claim 1, wherein the area of ​​the second hot zone is 0.25 to 0.75 times the area of ​​the first hot zone.

15. The antenna device as claimed in claim 1, wherein the antenna module includes a plurality of antenna elements disposed on the circuit board, the antenna elements being arranged in an array.

16. The antenna device as claimed in claim 1, wherein the heat sink has a top surface facing the first housing and includes a plurality of heat sinks located on the top surface.

17. The antenna device as claimed in claim 1, wherein the heat sink has a top surface facing the first housing, and thermal paste is provided between the top surface and the second hot zone of the circuit board.

18. The antenna device as claimed in claim 1, wherein the heat dissipation column has a top end facing the first housing and includes a plurality of heat dissipation pads located at the top end.

19. The antenna device as claimed in claim 1, wherein the thermal conductivity of the heat sink is greater than or equal to the thermal conductivity of the second housing.

20. The antenna device as claimed in claim 1, wherein the heat sink is made of copper, the first housing is made of plastic, and the second housing is made of aluminum.

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