Package structure

Abstract

An encapsulation structure includes a substrate structure, an optoelectronic module, a heat sink, and an optical communication unit. The heat sink and the optoelectronic module are disposed on the substrate structure. The heat sink has a slot, and the optoelectronic module has a photonic chip. The slot is used for the optical communication unit to pass through and connect to the photonic chip, thereby improving heat dissipation efficiency and shortening signal transmission distance.

Description

Technical Field

[0001] This disclosure relates to a semiconductor device, and more particularly to a packaging structure for optical communication. Prior Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multi-functionality and high performance. Currently, the application of fifth-generation (5G) communication technology has expanded to fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data will be generated that needs to be efficiently transmitted, computed, and stored. Therefore, in recent years, large data centers and cloud servers have seen a surge in demand for data transmission, leading the industry to enter the field of optical communication, using "light" instead of "electricity" as the data transmission carrier. Against this backdrop, co-package optics has become a future trend in semiconductor and packaging technology.

[0003] Figure 1 is a cross-sectional schematic diagram of a conventional co-packaged optics semiconductor package 1. The substrate 10 of the semiconductor package 1 is provided with an electronic component 11, an electronic integrated circuit (EIC) component 12 and a photonic integrated circuit (PIC) component 13, and one end of the photonic integrated circuit component 13 is connected to an optical fiber 14.

[0004] The electronic component 11 and the electronic integrated circuit element 12 are connected to the substrate 10 through the first circuit structure 15, while the photonic integrated circuit element 13 is connected to the substrate 10 through the second circuit structure 16. In other words, the electronic component 11 and the electronic integrated circuit element need to be electrically connected to the photonic integrated circuit element 13 through the first circuit structure 15, the substrate 10, and the second circuit structure 16.

[0005] However, the aforementioned co-packaged optical semiconductor package has an excessively long signal transmission path, resulting in signal loss and making it unable to meet the rapidly increasing data transmission demands of future technologies and products. Furthermore, considering the surge in data transmission demands, if the heat generated during operation cannot be effectively dissipated, it will affect operational performance and lifespan.

[0006] Overcoming the various problems of the aforementioned conventional technologies has become an urgent issue for the industry. Summary of the Invention

[0007] This disclosure provides a packaging structure, including: a substrate structure; an optoelectronic module disposed on the substrate structure and having photonic elements; a heat sink disposed on the substrate structure and having a slot formed therein; and an optical communication unit disposed on the substrate structure and connected to the photonic elements through the slot.

[0008] As described above in the packaging structure, the optoelectronic module is electrically connected to the substrate structure via a plurality of conductive bumps.

[0009] As described above, the optoelectronic module includes a wiring structure, semiconductor and electronic components disposed on one side of the wiring structure, and photonic components disposed on the other side of the wiring structure.

[0010] As described in the aforementioned packaging structure, the semiconductor element is an integrated circuit chip, which is attached to the first side of the wiring structure and electrically connected to the wiring structure.

[0011] As described in the aforementioned packaging structure, the photonic element is a photonic integrated circuit chip, which is attached to the second side of the wiring structure and electrically connected to the wiring structure.

[0012] As described in the aforementioned packaging structure, the heat sink includes a cover portion and a support portion. The support portion is disposed around the cover portion so that the cover portion and the support portion enclose and form an accommodating space.

[0013] As described in the aforementioned packaging structure, the heat sink is erected on the substrate structure by the support portion, and the photoelectric module is covered by the shielding portion, so that the photoelectric module is housed in the accommodating space.

[0014] As described in the aforementioned packaging structure, the optical communication unit is a fiber optic array unit used to connect optical fibers.

[0015] As described in the aforementioned packaging structure, the planar dimension of the slot in the heat sink is larger than the planar dimension of the optical communication unit.

[0016] The aforementioned packaging structure further includes a plurality of conductive elements disposed on the bottom side of the substrate structure.

[0017] As described in the aforementioned packaging structure, the optical communication unit passes through the slot to connect to the photonic element.

[0018] As described in the aforementioned packaging structure, both the photonic element and the optical communication unit extend into the slot to connect with each other.

[0019] Therefore, the packaging structure disclosed herein mainly includes a substrate structure and an optoelectronic module, a heat sink, and an optical communication unit disposed on the substrate structure. The optoelectronic module has a wiring structure, semiconductor and electronic components disposed on a first side of the wiring structure, and photonic components disposed on a second side of the wiring structure, so that the semiconductor and electronic components can be directly electrically connected to the photonic components through the wiring structure to shorten the signal transmission distance. At the same time, the heat sink has a slot for the optical communication unit to pass through and connect to the photonic chip, which can improve the connection efficiency between the optical communication components and the photonic chip and improve the heat dissipation efficiency. Simple Explanation of the Diagram

[0020] Figure 1 is a cross-sectional schematic diagram of a semiconductor package for conventional co-packaged optics.

[0021] Figure 2 is a cross-sectional schematic diagram of the first embodiment of the packaging structure disclosed herein.

[0022] Figure 3 is a partial cross-sectional schematic diagram of the packaging structure disclosed herein.

[0023] Figure 4 is a cross-sectional schematic diagram of the second embodiment of the packaging structure disclosed herein. Implementation

[0024] The following specific embodiments illustrate the implementation of this disclosure. Those skilled in the art can easily understand the other advantages and effects of this disclosure from the content disclosed in this specification.

[0025] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which this disclosure can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and purposes that this disclosure can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "first," "second," "at least one," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of implementation of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of this disclosure.

[0026] Please refer to Figure 2, which is a cross-sectional schematic diagram of the packaging structure disclosed herein. As shown in the figure, the packaging structure 2 includes a substrate structure 20, an optoelectronic module 21 disposed on the substrate structure 20, a heat sink 22 disposed on the substrate structure 20, and an optical communication unit 23 disposed on the substrate structure 20 and connected to the optoelectronic module 21.

[0027] The substrate structure 20 is, for example, a packaging substrate with a core layer or a coreless packaging substrate, which includes an insulating layer 201 and a circuit layer 202 bonded to the insulating layer 201. The insulating layer 201 is made of dielectric materials such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer 202 can be made of copper or other conductive materials.

[0028] The optoelectronic module 21 includes a wiring structure 210, a semiconductor element 211 and an electronic element 212 disposed on one side of the wiring structure, and a photonic element 213 disposed on the other side of the wiring structure 210. The optoelectronic module 21 can be electrically connected to the substrate structure 20 by a plurality of conductive bumps 214 such as solder bumps and copper bumps.

[0029] The cabling structure 210 has a first side 210a and a second side 210b opposite to each other, and includes an insulating layer and a cabling layer disposed on the insulating layer, such as a redistribution layer (RDL) specification.

[0030] The semiconductor element 211 is, for example, an electronic integrated circuit (EIC) chip, which is attached to and electrically connected to the first side 210a of the wiring structure 210.

[0031] The electronic component 212 is disposed on the first side 210a of the wiring structure 210 and electrically connected to the wiring structure 210. It is an active component such as a switch chip, system-on-a-chip (SOC), high-bandwidth memory (HBM) chip or other functional chip, or it can be a passive component such as a resistor, capacitor or inductor.

[0032] The photonic element 213 is, for example, a photonic integrated circuit (PIC) chip, which is attached to the second side 210b of the wiring structure 210 and electrically connected to the wiring structure 210, so that the semiconductor element 211 and the electronic element 212 can be electrically connected to the photonic element 213 directly through the wiring structure 210.

[0033] The heat sink 22 is disposed on the substrate structure 20 and covers the optoelectronic module 21.

[0034] The heat sink 22 includes a covering portion 221 and a supporting portion 222. The supporting portion 222 is disposed around the covering portion 221, so that the covering portion 221 and the supporting portion 222 enclose and form an accommodating space 223. The heat sink 22 can be erected on the substrate structure 20 by means of the supporting portion 222, and the covering portion 221 covers the optoelectronic module 21, so that the optoelectronic module 21 is housed in the accommodating space 223. In addition, the supporting portion 222 has a slot 2220 corresponding to the position of the photonic element 213 of the optoelectronic module 21 to serve as an optical signal channel.

[0035] In addition, the shielding portion 221 of the heat sink 22 can be attached to the semiconductor element 211 and the electronic element 212 through the conductive interface material (TIM) 220 to effectively dissipate the heat generated by the semiconductor element 211 and the electronic element 212 during operation.

[0036] The optical communication unit 23 is disposed on the substrate structure 20 and is connected to the photonic element 213 of the optoelectronic module 21 through the slot 2220 of the heat sink 22. The optical communication unit 23 is, for example, a fiber array unit (FAU) for connecting optical fibers.

[0037] Please refer to Figure 3 at the same time. The planar dimension of the slot 2220 of the heat sink 22 is larger than the planar dimension of the optical communication unit 23, so that the optical communication unit 23 can easily pass through the slot 2220 and connect with the photonic element 213.

[0038] In this embodiment, the width W of the optical communication unit 23 and the width S of the slot 2220 of the heat sink 22 are such that the difference between the width W and the width S is less than 10 μm, which is beneficial for the alignment of the optical communication unit 23 and the photonic element 213 and improves the connection efficiency.

[0039] Alternatively, a plurality of conductive elements 24, such as solder balls, can be provided on the bottom side of the substrate structure 20 for connection to other electronic devices (not shown).

[0040] Please refer to Figure 4, which is a cross-sectional schematic diagram of the second embodiment of the packaging structure disclosed herein.

[0041] This embodiment is largely the same as the previous embodiments, with the main difference being that in the disclosed packaging structure 3, the photonic element 213 extends from the inner side (accommodating space 223) of the heat sink 22 into the slot 2220 of the heat sink 22, while the optical communication unit 23 extends from the outer side of the heat sink 22 into the slot 2220 of the heat sink 22 and connects with the photonic element 213. That is, both the photonic element 213 and the optical communication unit 23 extend into the slot 2220, which facilitates the alignment and connection of the photonic element 213 and the optical communication unit 23.

[0042] In summary, the packaging structure disclosed herein mainly includes a substrate structure and an optoelectronic module, a heat sink, and an optical communication unit disposed on the substrate structure. The optoelectronic module has a wiring structure, semiconductor and electronic components disposed on a first side of the wiring structure, and photonic components disposed on a second side of the wiring structure, so that the semiconductor and electronic components can be directly electrically connected to the photonic components through the wiring structure to shorten the signal transmission distance. At the same time, the heat sink has a slot for the optical communication unit to pass through and connect to the photonic chip, which can improve the connection efficiency between the optical communication unit and the photonic chip and improve the heat dissipation efficiency.

[0043] The above embodiments are illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure should be as set forth in the following patent application claims.

[0044] 1: Semiconductor package 10:Substrate 11: Electronic components 12: Electronic integrated circuit elements 13: Photonic integrated circuit elements 14: Optical Fiber 15: First line structure 16: Second line structure 2,3: Packaging Structure 20: Substrate Structure 201: Insulation layer 202: Line Layer 21: Optoelectronic Module 210: Wiring Structure 210a: First side 210b: Second side 211: Semiconductor components 212: Electronic Components 213: Photonic elements 214: Conductive bump 22: Heat sink 221: Covered part 222: Support section 220: Thermally conductive interface material 2220: Slotting 223: Storage space 23: Optical Communication Unit 24: Conductive elements S,W: Width

Claims

1. A packaging structure, comprising: Substrate structure; The optoelectronic module is disposed on the substrate structure and directly connected to the surface of the substrate structure, and has photonic elements; A heat sink is disposed on the substrate structure and has a slot formed therein; and an optical communication unit is disposed on the substrate structure to connect to an optical fiber outside the package structure and is connected to the photonic element through the slot.

2. The encapsulation structure as described in claim 1, wherein, The optoelectronic module is electrically connected to the substrate structure via a plurality of conductive bumps.

3. The encapsulation structure as described in claim 1, wherein, The optoelectronic module includes a wiring structure, semiconductor and electronic components disposed on one side of the wiring structure, and photonic components disposed on the other side of the wiring structure.

4. The encapsulation structure as described in claim 3, wherein, The semiconductor element is an integrated circuit chip, which is attached to the first side of the wiring structure and electrically connected to the wiring structure.

5. The encapsulation structure as described in claim 3, wherein, The photonic element is a photonic integrated circuit chip, which is attached to the second side of the wiring structure and electrically connected to the wiring structure.

6. The encapsulation structure as described in claim 1, wherein, The heat sink includes a cover portion and a support portion. The support portion is disposed around the cover portion so that the cover portion and the support portion enclose and form an accommodating space.

7. The encapsulation structure as described in claim 6, wherein, The heat sink is erected on the substrate structure by the support portion and the photoelectric module is covered by the cover portion, so that the photoelectric module is housed in the accommodating space.

8. The encapsulation structure as described in claim 1, wherein, This optical communication unit is a fiber optic array unit used to connect optical fibers.

9. The encapsulation structure as described in claim 1, wherein, The planar dimension of the slot in the heat sink is larger than the planar dimension of the optical communication unit.

10. The packaging structure as described in claim 1 further includes a plurality of conductive elements disposed on the bottom side of the substrate structure.

11. The encapsulation structure as described in claim 1, wherein, The optical communication unit passes through the slot to connect to the photonic element.

12. The encapsulation structure as described in claim 1, wherein, Both the photonic element and the optical communication unit extend into the slot to connect with each other.

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