Substrate transfer apparatus
Patent Information
- Application Number
- TW113148713
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-03-05
- Filing Date
- 2024-12-13
- Publication Date
- 2026-10-11
- Estimated Expiration
- 2044-12-12
AI Technical Summary
Traditional substrate transport devices face limitations in drive range and generate particulate matter due to rotary motors, and magnetic levitation systems struggle with incomplete electromagnetic force transmission and heat/static electricity management in high-vacuum environments.
A transport unit using magnetic levitation with a stator outside the vacuum space, minimizing the gap and ensuring electromagnetic force transmission, and a substrate support portion made of materials like aluminum or ceramic for heat and static electricity discharge.
The solution enables stable magnetic levitation and effective heat and static electricity management in high-vacuum environments, maintaining substrate transport accuracy and preventing particulate matter accumulation.
Smart Images

Figure TWG2TB001915268_001 
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Abstract
Description
Technical Field
[0001] The present invention relates to a transport unit and a substrate transport apparatus including the transport unit, and more specifically, to a transport unit for transporting substrates by magnetic levitation in a vacuum environment and a substrate transport apparatus including the transport unit. Prior Technology
[0002] Generally, a substrate processing system includes: a load locking module for introducing the substrate and converting the pressure between the outside and the inside of the substrate processing system; a substrate transport device for transporting the substrate introduced through the load locking module; and a substrate processing device that processes the introduced substrate adjacent to the substrate transport device.
[0003] The substrate transport device, under vacuum pressure, transfers the substrate to be processed to the substrate processing device or transfers the processed substrate from the substrate processing device to the load locking module.
[0004] In addition, traditional substrate transport devices use transport robots with multi-joint arms for transporting substrates and rotary motors for driving the transport robots. However, there are problems such as limited drive range and application due to the rotary motors, and various particulate matter may be generated due to friction.
[0005] Therefore, a substrate transport device using a planar motor driven by magnetic levitation has recently been proposed. However, the stator cannot be placed in a high-vacuum transport space, and if the stator is placed outside the transport space, the electromagnetic force used to drive the transport unit containing permanent magnets cannot be fully transmitted, resulting in problems such as the inability to achieve magnetic levitation and control or limitations.
[0006] To improve this problem, the gap between the stator located outside the transport space and the transport unit inside the transport space is minimized and the wall surface of the chamber forming the transport space is made thinner. However, in this case, the wall surface of the chamber will deform and the flatness will decrease due to the high vacuum of the transport space, resulting in uneven control based on the position of the transport unit.
[0007] Furthermore, since the transport unit is magnetically levitated and located in a vacuum transport space because it is in contact with and supports the relatively high temperature substrate, the transport unit cannot dissipate the heat and static electricity transferred from the substrate and thus accumulates, resulting in the problem of difficult particulate matter management.
[0008] In particular, the transport unit set up in a vacuum space does not have a separate medium for heat dissipation, so it cannot dissipate heat through conduction and radiation to maintain a high temperature, thus causing various particulate matter to scatter. Summary of the Invention
[0009] The technical problems to be solved
[0010] The purpose of this invention is to provide a transport unit for transporting a substrate using magnetic levitation in a vacuum environment and a substrate transport device including the transport unit, in order to solve the aforementioned problems. Problem-solving methods
[0011] The present invention is proposed to achieve the stated objective, and discloses a transport unit for transporting a substrate by moving a stator portion magnetically levitated by generating an electromagnetic field, comprising: a permanent magnet portion magnetically levitated based on the electromagnetic field of the stator portion; and a substrate support portion, one end of which is coupled to the stator portion side opposite the permanent magnet portion, and the other end of which supports the substrate.
[0012] The substrate support portion includes: a bonding portion, which is bonded to the permanent magnet portion; a support portion, which supports the substrate; and a connecting portion, which connects the bonding portion and the support portion.
[0013] The connecting portion includes: a vertical connecting portion extending vertically from the joining portion; and a horizontal connecting portion extending horizontally from the vertical connecting portion and connecting to the supporting portion.
[0014] The vertical connecting portion is guided and contacted by a groove formed at a corresponding position on the side of the permanent magnet portion.
[0015] The substrate support portion includes at least one material selected from aluminum, stainless steel, and ceramic, so that the electromagnetic field generated by the stator portion can pass through the permanent magnet portion side.
[0016] The substrate support portion may be made of ceramic material coated with a conductive material on the opposite side of the permanent magnet portion.
[0017] Furthermore, the present invention discloses a substrate transport device, comprising: a chamber portion forming a vacuum space inside; a transport unit that moves by magnetic levitation within the vacuum space to transport the substrate; and a plurality of stator portions disposed in the chamber portion, wherein the transport unit generates an electromagnetic field for magnetic levitation movement.
[0018] The present invention also includes a control unit that controls the movement of the transport unit by adjusting the electromagnetic field generated by the stator.
[0019] In order to discharge static electricity within the substrate support portion, the control unit controls the contact with the inner surface of the chamber portion that keeps the substrate support portion grounded.
[0020] The chamber portion forms a grounded area within a portion of the transport unit formed by the stator portion, which is kept grounded. In order to discharge static electricity within the substrate support portion, the control portion moves the transport unit to the grounded area, causing the substrate support portion to contact the grounded area.
[0021] The present invention also includes: an electrostatic sensor located in the chamber portion, for measuring the electrostatic charge of the substrate support portion within the vacuum space.
[0022] When the electrostatic value measured by the electrostatic sensor exceeds a preset value, the control unit causes the substrate support to contact the inner surface of the chamber.
[0023] To dissipate heat from the substrate support, the control unit makes the substrate support contact the inner surface of the chamber.
[0024] The chamber portion forms a heat dissipation area within a portion of the transport unit formed by the stator portion. The control unit moves the transport unit to the heat dissipation area to dissipate heat from the substrate support portion, causing the substrate support portion to contact the heat dissipation area.
[0025] At least one of the chamber portion and the stator portion corresponding to the heat dissipation area may include a cooling portion for heat exchange with the substrate support portion.
[0026] The present invention may further include: a temperature sensor located in the chamber portion, for measuring the temperature of the substrate support portion within the vacuum space.
[0027] When the temperature value measured by the temperature sensor exceeds a preset value, the control unit causes the substrate support to contact the inner surface of the chamber.
[0028] The stator section may include: a coil section that generates an electromagnetic field that magnetically levitates the transport unit; a circuit section that controls the coil section and receives power applied from the outside; and a cooling section for cooling the coil section. Effects of the Invention
[0029] The advantage of the transport unit and the substrate transport device including the transport unit of the present invention is that the substrate can be transported by magnetic levitation of a planar motor in a high vacuum space.
[0030] In particular, the advantages of the transport unit and the substrate transport device including the transport unit of the present invention are that by setting the stator in the mounting slot of the chamber module, sufficient electromagnetic force can be provided to control the transport unit and magnetic levitation and drive control in the vacuum space, thereby achieving a high vacuum space without changing the chamber module.
[0031] That is, the advantage of the transport unit and the substrate transport device including the transport unit of the present invention is that, while stably providing electromagnetic force between the stator part outside the vacuum space and the transport unit inside the vacuum space, it prevents deformation of the high vacuum space and maintains the flatness of the inner surface of the chamber module constituting the vacuum space, thereby maintaining the accuracy of the movement of the transport unit and the transport of the substrate.
[0032] In particular, the advantages of the transport unit and the substrate transport apparatus including the transport unit of the present invention are that they discharge static electricity accumulated in the transport unit due to contact with the support substrate, maintain a stable electrical state of the transport unit, and manage particulate matter.
[0033] Furthermore, the advantages of the transport unit and the substrate transport device including the transport unit of the present invention are that, due to contact with the substrate supporting the high temperature, the heat transferred to the transport unit can be released, and the temperature and particulate matter of the transport unit can be stably managed. Simple Explanation of the Diagram
[0034] Figure 1 is a cross-sectional view showing the substrate transport device of the present invention; Figure 2 is a perspective view showing the bottom surface of the base plate in the chamber module of the present invention; Figure 3 is a perspective view showing the insertion state of the stator slot in the chamber module of Figure 2; Figure 4 is a perspective view showing the state of the stator section in the chamber module of Figure 2; Figure 5 is an exploded perspective view showing the component configuration of the stator section in the chamber module of Figure 2; Figure 6 is a cross-sectional view showing the configuration of the stator section in the chamber module of Figure 2; Figure 7 is a diagram showing the transport unit in the substrate transport apparatus of Figure 1; and Figure 8 is a cross-sectional view showing the heat dissipation or electrostatic discharge state of the transport unit in the substrate transport apparatus of Figure 7. Implementation
[0035] The following describes in detail, with reference to the accompanying drawings, the transport unit of the present invention and the substrate transport apparatus including the transport unit.
[0036] The substrate transport device of the present invention, as shown in FIG1, includes: a chamber module 20, which forms a vacuum space S inside; and a transport unit 10, which is disposed in the vacuum space S and moves by magnetic levitation based on the electromagnetic force of the stator 200, thereby transporting the substrate 1.
[0037] In this invention, the substrate 1, which is the object of processing and transportation, may include semiconductor substrates, substrates used in display devices such as LEDs and LCDs, solar cell substrates, glass substrates, etc., and may be any type of substrate disclosed previously.
[0038] The transport unit 10 is a component of the substrate 1 that is disposed in a closed vacuum space S formed by the chamber module 20 and moves by magnetic levitation based on the electromagnetic force of the stator part 200 described later.
[0039] That is, the transport unit 10 is a component that moves in the manner of a planar motor, and includes a permanent magnet inside. It moves by magnetic levitation based on the electromagnetic force generated by the stator 200 described later.
[0040] In addition, the transport unit of the present invention will be described in detail with reference to the accompanying drawings.
[0041] As shown in FIG7, the transport unit of the present invention is a transport unit that moves by magnetic levitation through a stator portion 200 that generates electromagnetic force, thereby transporting a substrate 1. It may include: a permanent magnet portion 300, which is magnetically levitation based on the electromagnetic force of the stator portion 200; and a substrate support portion 400, one end of which is attached to the opposite side of the permanent magnet portion 300 on the stator portion 200 side, and the other end of which supports the substrate 1.
[0042] For example, the transport unit 10 may include: a permanent magnet portion 300, which is magnetically levitated based on the electromagnetic force of the stator portion 200; and a substrate support portion 400, which is combined with the permanent magnet portion 300 to support the substrate 1.
[0043] The permanent magnet part 300 is a guide member that moves by magnetic levitation through interaction with the electromagnetic force generated by the stator part 200, and can have various structures.
[0044] In particular, the permanent magnet section 300 may employ a plurality of permanent magnets that move in response to the electromagnetic field generated by the stator section 200, wherein the permanent magnets may employ various shapes and structures disclosed previously.
[0045] Furthermore, the permanent magnet section 300 may employ a specific arrangement of a plurality of permanent magnets, for example, it may employ a Halbach array of various forms disclosed previously.
[0046] The substrate support 400 is a component that supports the substrate 1 by being combined with the permanent magnet 300, and can adopt various structures.
[0047] For example, the substrate support portion 400 may be combined with the permanent magnet portion 300 that moves through the stator portion 200 and move together with the permanent magnet portion 300, so as to contact and support the substrate 1.
[0048] The substrate support 400 is a component that is attached at one end to the opposite side of the stator portion 200 in the permanent magnet portion 300 and at the other end to support the substrate 1.
[0049] That is, the substrate support portion 400 can be coupled to the opposite side of the stator portion 200 in the permanent magnet portion 300, thereby being located between the permanent magnet portion 300 and the stator portion 200 described later, thereby moving integrally with the permanent magnet portion 300 to support the substrate 1 for transport.
[0050] For example, as shown in FIG7, the substrate support portion 400 includes: a connecting portion 410, which is connected to the permanent magnet portion 300; a support portion 420, which supports the substrate 1; and a connecting portion 430, which connects the connecting portion 410 and the support portion 420.
[0051] The connecting part 410 is a component that is connected to the permanent magnet part 300, and can adopt various structures.
[0052] That is, the connecting part 410 is formed in a planar shape corresponding to the permanent magnet part 300, and can be connected to the surface of the permanent magnet part 300. As an example, the connecting part 410 is formed in the form of a circular plate corresponding to the permanent magnet part 300 which has a circular planar shape, and can be connected to the opposite surface of the stator part 200 in the permanent magnet part 300.
[0053] The joint 410 is made of a material that allows electromagnetic fields to pass through, which facilitates electromagnetic interaction between the permanent magnet part 300 and the stator part 200, and is formed with a relatively thin thickness.
[0054] The support portion 420 is a component located on the opposite side of the joint portion 410 and connected to the joint portion 410 via the connecting portion 430 to support the base plate 1, and various structures can be adopted.
[0055] For example, the support portion 420 is formed in the shape of a plate with a certain degree of flat area to stably support the substrate 1. As another example, it can be composed of a plurality of support members that are spaced apart from each other and extended to minimize the contact area with the substrate 1 and stably support the substrate 1.
[0056] Furthermore, the support portion 420 is connected by the connecting portion 430 (described later) and is located at a relatively higher position than the connecting portion 410. As a result, it is located at a relatively higher position than the permanent magnet portion 300, which prevents the substrate 1 from partially moving in the up and down direction in the supported state and coming into contact with the bottom surface of the chamber portion 100, thus enabling stable transport of the substrate 1.
[0057] The connecting part 430 is a component that connects the connecting part 410 and the supporting part 420, and can adopt various structures.
[0058] For example, the connecting portion 430 may include: a vertical connecting portion 431 extending vertically from the connecting portion 410; and a horizontal connecting portion 432 extending horizontally from the vertical connecting portion 431 and connecting to the support portion 420.
[0059] The vertical connecting part 431 is a component formed by extending vertically upward from a predetermined position on the edge of the connecting part 410, and has an appropriate length so that the supporting part 420 is located at a predetermined height.
[0060] Furthermore, the vertical connecting portion 431 is guided and contacted by the groove portion 301 formed on the side of the permanent magnet portion 300, so that the permanent magnet portion 300, in which a plurality of permanent magnets are arranged in a predetermined specific arrangement and structure, is positioned relative to the substrate support portion 400 at a predetermined position.
[0061] That is, the vertical connecting part 431 is inserted into the groove 301 formed at the corresponding position in the side of the permanent magnet part 300.
[0062] The horizontal connecting part 432 may be a component that extends horizontally from the vertical connecting part 431 and connects to the support part 420.
[0063] That is, the horizontal connecting part 432 may be a component that extends horizontally from the upper end of the vertical connecting part 431 and has a support part 420 at the end.
[0064] Furthermore, as described above, the substrate support portion 400 can be positioned such that the connecting portion 410 is located between the permanent magnet portion 300 and the stator portion 200, and is positioned relatively lower than the support portion 420. As another example, the connecting portion 410 is located between the permanent magnet portion 300 and the stator portion 200, or is connected to the side of the permanent magnet portion 300 opposite to the stator portion 200, so that the support portion 420 is positioned relatively lower than the permanent magnet portion 300.
[0065] That is, the substrate support portion 400 is located adjacent to the stator portion 200 compared to the permanent magnet portion 300. Based on the control of the control unit described later, the electromagnetic force on the stator portion 200 side is controlled to decrease, thereby contacting the inner surface of the chamber portion 100. Accordingly, the heat transferred from the relatively high temperature substrate 1 can be released and the accumulated static electricity can be discharged.
[0066] For example, the substrate support portion 400 controls the electromagnetic force of the stator portion 200 through the control portion described later, so that the joint portion 410 located between the permanent magnet portion 300 and the stator portion 200 contacts the inner surface of the chamber portion 100, thereby allowing the heat and static electricity transmitted from the support portion 420 side of the support substrate 1 through the connection portion 430 to be discharged to the outside through the inner surface of the chamber portion 100.
[0067] In addition, the substrate support portion 400 will be located on the inner surface of the chamber portion 100, that is, between the stator portion 200 and the permanent magnet portion 300. In order to accurately control the magnetic levitation and drive of the permanent magnet portion 300, it is made of a material that allows the electromagnetic interaction between the stator portion 200 and the permanent magnet portion 300 to occur smoothly.
[0068] That is, the substrate support portion 400, especially the joint portion 410, is a component with low permeability and easy passage of electromagnetic fields, and can be made of metal materials, such as aluminum or stainless steel including SUS.
[0069] Furthermore, the substrate support portion 400 releases static electricity and heat through contact as described above, and can be made of a metal material with low magnetic permeability and excellent electrical and thermal conductivity. As another example, it can be made of a ceramic material with low magnetic permeability and coated with a conductive material on the contact surface inside the contact chamber portion 100.
[0070] The chamber module 20 is a component that forms a vacuum space S inside, and can adopt various structures.
[0071] That is, the chamber module 20 is a component that forms a vacuum space S inside and transports the substrate 1, and a transport unit 10 for transporting the substrate 1 is provided inside.
[0072] The chamber module of the present invention will now be described in detail with reference to the accompanying drawings.
[0073] The chamber module of the present invention, as shown in FIG2, includes: a chamber portion 100, which forms a vacuum space S inside and a plurality of mounting slots 101 outside; and a plurality of stator portions 200, which are respectively disposed in the plurality of mounting slots 101 and generate electromagnetic force for magnetic levitation movement in the transport unit 10.
[0074] The chamber section 100 is a component that forms a vacuum space S inside and a plurality of slots 101 outside, and can adopt various structures.
[0075] That is, the chamber portion 100 is a component that forms a sealed vacuum space S inside and a plurality of mounting slots 101 for inserting and mounting the stator portion 200 (described later) on the outside.
[0076] The chamber portion 100 has a plurality of mounting slots 101 formed on at least one of its six faces, which are based on a cuboid. Depending on the formation of the movement path of the transport unit 10 in the vacuum space S, the mounting slots 101 can be formed on all six faces if necessary.
[0077] Furthermore, the chamber portion 100 forms a plurality of mounting slots 101 in one surface. Depending on the needs and taking into account the formation of the movement path of the transport unit 10, the mounting slots 101 can be formed at specific locations.
[0078] Furthermore, the following description assumes that the groove 101 is formed on the outer side of the bottom surface of the chamber portion 100, which constitutes the bottom, but is not limited thereto.
[0079] The chamber portion 100 may include: a chamber body 110 with an opening on its lower surface; and a base plate 120, which is attached to the opening to form a bottom surface, forming a sealed vacuum space S with the chamber body 110, and the bottom surface having a plurality of the mounting grooves 101.
[0080] The chamber body 110 is a component with an opening at the bottom, and the base plate 120 is disposed at the opening to form a closed vacuum space S together with the base plate 120.
[0081] The base plate 120 is attached to the opening to form a bottom surface and forms a sealed vacuum space S with the chamber body 110. The bottom surface forms a plurality of the setting grooves 101.
[0082] The base plate 120 may have a plurality of mounting slots 101 formed on its outer surface.
[0083] The slot 101 can form a grid structure, which is formed by rectangles on a plane.
[0084] Accordingly, a plurality of mounting slots 101 with a grid structure are formed on the outside of the base plate 120, and a plurality of frames perpendicular to each other on the plane of the base plate 120 are formed between adjacent mounting slots 101.
[0085] In addition, the base plate 120 is different from the above, and can be formed as an integral part of the chamber body 110. It can be combined with another grid frame so that a groove 101 is formed on the lower wall of the chamber body 110.
[0086] Furthermore, the chamber portion 100 may also include a cover member (not shown) that is attached to the setting slot 101 and covers the setting slot 101 for inserting the setting stator portion 200. In this case, the cover member is attached to and fastened to a grid frame formed between a plurality of setting slots 101 on the bottom surface of the base plate 120, or attached to the setting slot 101 in the state where the setting stator portion 200 has been inserted.
[0087] Furthermore, the chamber portion 100 may include a support portion 102 located on the bottom surface or the inner side of the mounting groove 101, supporting the stator portion 200 inserted into the mounting groove 101.
[0088] For example, the support portion 102 can protrude from the inner side of the setting groove 101 to support the stator portion 200. As another example, it can extend towards the setting groove 101 side of the bottom surface of the grid frame to support the stator portion 200.
[0089] Accordingly, when the stator portion 200 is inserted into the mounting slot 101, the support portion 102 interferes with a portion of the bottom surface of the circuit portion 220 on the lower side of the stator portion 200 to support the stator portion 200.
[0090] The chamber portion 100 further includes a fastening member 130 that passes through the support portion 102 and is connected to the stator portion 200 to fix the stator portion 200, thereby fixing the stator portion 200 into the mounting groove 101.
[0091] Furthermore, as shown in FIG6, the support portion 102 protrudes from the lowest side of the inner surface of the forming groove 101, and is formed in pairs opposite each other, or in pairs forming a diagonal arrangement on the plane, or in four pairs corresponding to the vertices of the quadrilateral stator portion 200 on the plane.
[0092] Furthermore, the support portion 102 can be a structure that simply protrudes in the horizontal direction. As another example, as shown in FIG6, it corresponds to the shape of the inner surface of the setting groove 101, with an opening in the center and a frame in the shape of a "ㄱ" in cross-section. The fastening member 130 passes through in the horizontal direction and is fixed to the inner surface of the setting groove 101, and the fastening member 130 passes through in the vertical direction and is fixed to the stator portion 200.
[0093] Alternatively, as another example, the support portion 102 may simply have a plurality of brackets in the shape of "ㄱ" and be fixedly connected to the stator portion 200 and the chamber portion 100 respectively to support the stator portion 200.
[0094] In this case, the chamber portion 100 may be provided with the aforementioned separate component cover to cover at least a portion of the mounting groove 101, but as another example, at least a portion of the mounting groove 101 may be covered by the aforementioned frame support portion 102, thereby the support portion 102 serves a covering function.
[0095] Thus, when the stator 200 is supported by the support 102, it is connected to an external or adjacent stator 200 through the inner surface of the support 102, and can be connected to a power supply, refrigerant, and various lines for transmitting various control signals.
[0096] Furthermore, a portion of the chamber portion 100 within the transfer area of the transport unit 10 formed by the stator portion 200 in the vacuum space S may additionally form a grounding region S1 and a heat dissipation region S2 that maintain a grounded state.
[0097] Among them, the grounding area S1 and the heat dissipation area S2 are areas that are distinct from each other in the transfer area. As another example, they can be areas that at least partially overlap with each other, forming part of the overall transfer area.
[0098] Additionally, the grounding area S1 is a region where the inner surface of the chamber portion 100 is connected to the external ground. It is a region that maintains a grounded state and releases static electricity by contacting the inner surface as the substrate support portion 400 descends. It can be distinguished from other parts of the transfer area that may use a different coating or a non-conductive cover. The contact surface with the substrate support portion 400 is made of a conductor and is a region where a discharge path for static electricity is set through the surface of the chamber portion 100.
[0099] The grounding area S1 may be provided with an electrostatic sensor, which will be described later. This area is where the electrostatic sensor installed in the chamber 100 performs electrostatic measurement on the substrate support 400.
[0100] The heat dissipation area S2 is a part of the inner surface of the chamber portion 100 that forms the transfer area, and is the area where the substrate support portion 400 contacts and releases heat to the outside.
[0101] The heat dissipation area S2 is a region that releases heat based on the contact of the substrate support 400 with a relatively low temperature control compared to other regions in the inner surface of the cavity 100, which cannot be further temperature-regulated and maintain a relatively high temperature. It is controlled at a relatively low temperature or at a low temperature.
[0102] For example, regarding the heat dissipation area S2, the corresponding stator portion 200 may include a cooling portion 230, which, compared to other cooling portions 230, relatively increases the refrigerant flow rate of the cooling portion 230 or reduces the refrigerant temperature to guide the heat dissipation of the substrate support portion 400 in contact with it.
[0103] Furthermore, as another example, regarding the heat dissipation area S2, the temperature can be controlled to decrease as additional refrigerant is supplied to the wall of the corresponding chamber section 100. As the same component as the cooling section 230 used in the stator section 200, the chamber section 100 of the corresponding heat dissipation area S2 has an additional cooling section.
[0104] Furthermore, as another example, the heat dissipation area S2 can be a relatively low temperature area in the vacuum space S1, for example, a region located at a relatively far distance from the substrate processing device that performs substrate processing and is adjacent to the substrate transport device.
[0105] Furthermore, as another example, the heat dissipation area S2 can be an area where the temperature is controlled at a lower temperature and the temperature of the substrate support 400 rises. For example, it is an area adjacent to the substrate processing device that performs substrate processing and is located next to the substrate transport device, receiving the high-temperature substrate after the substrate processing is completed.
[0106] The heat dissipation area S2 may be provided with a temperature sensor, which will be described later, and is the area where the temperature measurement of the substrate support 400 is performed based on the temperature sensor provided in the chamber section 100.
[0107] The stator 200 is a component that is respectively provided in a plurality of mounting slots 101 and generates an electromagnetic force for magnetic levitation movement on the transport unit 10, and can adopt various structures.
[0108] In particular, the stator section 200 is composed of a single module and the single module is disposed in the setting slot 101. In order to be disposed in a plurality of setting slots 101 respectively, a plurality of moving paths are formed in the vacuum space S of the transport unit 10.
[0109] Accordingly, the stator section 200 can independently control a portion of a plurality of stator sections 200 as needed, and can perform separate control of the smallest unit, i.e., a single module.
[0110] For example, as shown in Figures 4 and 5, the stator section 200 includes: a coil section 210 for applying electromagnetic force to the transport unit 10; a circuit section 220 for controlling the coil section 210 and receiving power applied from the outside; and a cooling section 230 for cooling the coil section 210.
[0111] As shown in FIG3, the stator section 200 is inserted from the insertion slot 101 toward the vacuum space S side in the order of coil section 210, cooling section 230 and circuit section 220, and can be combined into a module.
[0112] That is, in order to facilitate the electromagnetic force action based on the electromagnetic field formed between the transport unit 10, the coil section 210 is provided on the vacuum space S side in the insertion slot 101 adjacent to the transport unit 10, and the circuit section 220 is electrically connected to the coil section 210 with the cooling section 230 for cooling the high temperature state caused by the applied electromagnetic field provided adjacent to the coil section 210.
[0113] The coil section 210 is a component of the transport unit 10 that provides electromagnetic force through electromagnetic interaction with a permanent magnet, and can be a coil board in the form of a PCB.
[0114] The circuit section 220 may be a component that applies power to the coil section 210 and controls the power applied to the coil section 210 according to various control signals.
[0115] Furthermore, the coil portion 210 can be placed in the mounting groove 232 formed on the cooling portion 230, which is sealed with a sealing member 240 for sealing between it and the inner surface of the mounting groove 101.
[0116] The cooling section 230 is a component that forms a refrigerant circulation path 231 for transporting refrigerant from the outside and for cooling to be performed by the refrigerant circulating in the refrigerant circulation path 231.
[0117] That is, regarding the cooling section 230, a refrigerant circulation path 231 is formed inside the shell of a material that facilitates heat transfer. The refrigerant, which is supplied from the outside and circulates, exchanges heat with the coil section 210 and the bottom surface of the chamber section 100 and other surrounding components, thereby performing cooling.
[0118] The cooling section 230 can receive cooling refrigerant through an external heat exchange device, and the refrigerant circulation path 231 in the cooling section 230 between adjacent stator sections 200 is connected to each other so that the refrigerant can circulate.
[0119] Furthermore, the plurality of stator sections 200 are distinguished by a plurality of control units comprising at least two stator sections 200, and can be controlled individually according to the control unit. In a single control unit, a plurality of cooling sections 230 share the refrigerant because the refrigerant circulation path 231 is connected to each other and are jointly controlled.
[0120] Therefore, independent cooling control can be achieved by control unit, and cooling of specific areas in multiple stator sections 200, namely the areas of the chamber section 100 adjacent to the substrate processing device that maintain a relatively high temperature, can be strengthened as needed.
[0121] The substrate transport apparatus incorporating the transport unit of the present invention will now be described with reference to the accompanying drawings.
[0122] The substrate transport apparatus of the present invention includes: a chamber portion 100, which forms a vacuum space S inside; a transport unit 10, which moves by magnetic levitation within the vacuum space S to transport a substrate 1; a plurality of stator portions 200 disposed in the chamber portion 100 and generating electromagnetic forces for the transport unit 10 to move by magnetic levitation; and a control unit that adjusts the electromagnetic forces generated by the stator portions 200 to control the movement of the transport unit 10.
[0123] Furthermore, the substrate transport device of the present invention may include an electrostatic sensor located in the chamber portion 100 to measure the electrostatic charge of the substrate support portion 400 within the vacuum space S.
[0124] Furthermore, the substrate transport device of the present invention may also include a temperature sensor located in the chamber portion 100 to measure the temperature of the substrate support portion 400 in the vacuum space S.
[0125] The structures of the chamber section 100, stator section 200 and transport unit 10 are the same as those described above, so repeated descriptions are omitted.
[0126] The control unit is a component that adjusts the electromagnetic force generated by the stator 200 to control the movement of the transport unit 10, and can adopt various structures.
[0127] That is, the control unit appropriately adjusts the power applied to the coil section 210 side through the circuit section 220 of the stator section 200, thereby regulating the electromagnetic force generated through the stator section 200 and controlling the movement of the transport unit 10.
[0128] In addition, the problem with traditional transport units is that although heat is transferred from the substrate 1 and static electricity is accumulated around the substrate support 400 that supports the relatively high-temperature substrate 1, it is set in a high-vacuum space S in a magnetically levitated state, so it is difficult to remove the accumulated heat and static electricity, making particulate matter management more difficult.
[0129] To improve this problem, the control unit makes the substrate support 400 contact the inner surface of the chamber 100, which is kept in a grounded state, in order to discharge static electricity in the substrate support 400.
[0130] That is, in order to discharge the static electricity accumulated in the substrate support 400, as shown in FIG8, the control unit can interrupt the generation of electromagnetic force of a specific stator 200 and guide the permanent magnet 300 to descend. Accordingly, the joint 410 provided between the permanent magnet 300 and the stator 200 contacts the bottom surface of the chamber 100 and discharges static electricity along the bottom surface of the grounded chamber 100.
[0131] Therefore, the control unit receives the measurement value of an electrostatic sensor located inside or outside the chamber section 100 and measures the static electricity of the substrate support section 400 in the vacuum space S by contact or non-contact. When the measured value exceeds a preset value, a control signal is applied to cause the transport unit 10 to descend and contact the inner surface of the chamber section 100.
[0132] That is, when the electrostatic value measured by the electrostatic sensor exceeds a preset value, the control unit controls the substrate support 400 to contact the inner surface of the chamber 100.
[0133] Alternatively, the control unit may lower the substrate support 400 to contact the inner surface of the chamber 100 after a certain period of time, without relying on the measurement value of another electrostatic sensor, according to a preset cycle.
[0134] Furthermore, in order to dissipate heat from the substrate support portion 400, the control unit controls the substrate support portion 400 to contact the inner surface of the cavity portion 100.
[0135] That is, as shown in FIG8, the control unit has no other medium for heat transfer in the high vacuum space S, so that the magnetically levitated transport unit 10, especially for heat release of the substrate support 400, is lowered so that the joint 410 contacts the bottom surface of the chamber 100 and heat is released by transfer.
[0136] In addition, in this case, the substrate support portion 400, which receives heat from the substrate 1 and maintains a relatively high temperature, comes into contact with the inner surface of the chamber portion 100, which is maintained at a relatively low temperature by the cooling portion 230 inside the stator portion 200, thereby performing heat exchange to cool the substrate support portion 400.
[0137] The control unit is located inside or outside the chamber 100 and receives the temperature value of the temperature sensor that measures the temperature of the substrate support 400 in the vacuum space S through contact or non-contact. When the measured value exceeds the preset value, a control signal is applied to cause the transport unit 10 to descend and contact the inner surface of the chamber 100 to perform cooling.
[0138] That is, when the temperature value measured by the temperature sensor exceeds a preset value, the control unit causes the substrate support 400 to contact the inner surface of the chamber 100.
[0139] Alternatively, the control unit may lower the substrate support 400 to contact the inner surface of the chamber 100 after a certain period of time, without relying on the measurement value of another temperature sensor, according to a preset cycle.
[0140] Furthermore, the aforementioned electrostatic sensor and temperature sensor can be located outside the chamber 100 to perform measurements in a non-contact manner. However, as another example, they can be placed inside the vacuum space S to measure electrostatics and temperature respectively.
[0141] The above description is only a part of the preferred embodiments of the present invention. Therefore, it is well known that the scope of the present invention should not be limited to the above embodiments and should not be interpreted in a limited manner. The technical ideas and fundamental technical ideas of the present invention described above are all included within the scope of the present invention.
[0142] 1:Substrate 10: Delivery Unit 20: Chamber Module 100: Chamber section 101: Setting slot 102: Support section 110: Main body of the chamber 120: Base plate 130: Fastening components 200: Stator section 210: Coil section 220: Circuit Section 230: Cooling section 231: Refrigerant circulation path 232: Installation slot 240: Sealing component 300: Permanent Magnet Section 301: Groove 400: Substrate support portion 410: Joint 420: Support section 430: Connecting part 431: Vertical connection part 432: Horizontal connection part S: Vacuum space S1: Grounding area S2: Heat dissipation area
Claims
1. A substrate transport device, comprising: A chamber portion (100) forms a vacuum space (S) inside; a transport unit (10) moves by magnetic levitation within the vacuum space (S) to transport the substrate (1); and a plurality of stator portions (200) disposed in the chamber portion (100), generating an electromagnetic field for magnetic levitation movement in the transport unit (10); a control unit controls the movement of the transport unit (10) by adjusting the electromagnetic field generated by the stator portions (200); the transport unit (10) includes: a permanent magnet portion (300) magnetically levitation based on the electromagnetic field of the stator portions (200); and a substrate support portion (400), one end of which is coupled to the opposite side of the stator portion (200) in the permanent magnet portion (300), and the other end of which supports the substrate (1) so that it can contact the inner surface of the chamber portion (100) by means of the adjustment of the electromagnetic field by the control unit.
2. The substrate transport apparatus as claimed in claim 1, wherein, The substrate support portion (400) includes: a connecting portion (410) connected to the permanent magnet portion (300); a support portion (420) supporting the substrate (1); and a connecting portion (430) connecting the connecting portion (410) and the support portion (420).
3. The substrate transport apparatus as claimed in claim 2, wherein, The connecting portion (430) includes: a vertical connecting portion (431) extending vertically from the connecting portion (410); and a horizontal connecting portion (432) extending horizontally from the vertical connecting portion (431) and connecting to the supporting portion (420).
4. The substrate transport apparatus as claimed in claim 3, wherein, The vertical connecting part (431) is guided and contacted by a groove (301) formed at a corresponding position on the side of the permanent magnet part (300).
5. The substrate transport apparatus as claimed in claim 1, wherein, The substrate support portion (400) includes at least one material selected from aluminum, stainless steel and ceramic, so that the electromagnetic field generated by the stator portion (200) passes through the permanent magnet portion (300).
6. The substrate transport apparatus as claimed in claim 1, wherein, The substrate support (400) is made of ceramic material coated with conductive material on the opposite side of the permanent magnet (300).
7. The substrate transport apparatus as claimed in claim 1, wherein, In order to discharge static electricity from the substrate support portion (400), the control unit controls the contact with the inner surface of the chamber portion (100) that keeps the substrate support portion (400) grounded.
8. The substrate transport apparatus as claimed in claim 1, wherein, The chamber portion (100) forms a grounded area (S1) in a portion of the transfer area of the transport unit (10) formed by the stator portion (200), and the control unit moves the transport unit (10) to the grounded area (S1) in order to discharge static electricity in the substrate support portion (400), so that the substrate support portion (400) contacts the grounded area (S1).
9. The substrate transport apparatus as claimed in claim 7, further comprising: An electrostatic sensor is located in the chamber portion (100) to measure the electrostatic charge on the substrate support portion (400) within the vacuum space (S).
10. The substrate transport apparatus as claimed in claim 9, wherein, When a static electricity value measured by the electrostatic sensor exceeds a preset value, the control unit causes the substrate support (400) to contact the inner surface of the chamber (100).
11. The substrate transport apparatus as claimed in claim 1, wherein, In order to dissipate heat from the substrate support (400), the control unit makes the substrate support (400) contact the inner surface of the chamber (100).
12. The substrate transport apparatus as claimed in claim 1, wherein, The chamber portion (100) forms a heat dissipation area (S2) in a portion of the transfer area of the transport unit (10) formed by the stator portion (200), and the control unit moves the transport unit (10) to the heat dissipation area (S2) for heat dissipation of the substrate support portion (400), so that the substrate support portion (400) contacts the heat dissipation area (S2).
13. The substrate transport apparatus as claimed in claim 12, wherein, At least one of the chamber portion (100) and the stator portion (200) corresponding to the heat dissipation area (S2) includes a cooling portion for heat exchange with the substrate support portion (400).
14. The substrate transport apparatus as claimed in claim 11, further comprising: A temperature sensor is located in the chamber portion (100) to measure the temperature of the substrate support portion (400) within the vacuum space (S).
15. The substrate transport apparatus as claimed in claim 14, wherein, When a temperature value measured by the temperature sensor exceeds a preset value, the control unit causes the substrate support (400) to contact the inner surface of the chamber (100).
16. The substrate transport apparatus as claimed in claim 11, wherein, The stator section (200) includes: a coil section (210) that generates the electromagnetic field that causes the transport unit (10) to be magnetically levitated; a circuit section (220) that controls the coil section (210) and receives a power supply applied from the outside; and a cooling section (230) for cooling the coil section (210).
Citation Information
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