Signal transmission system for quantum control and read-out

Abstract

This disclosure provides a signal transmission system for quantum control and readout, comprising a control module, a first signal conversion module, a plastic waveguide unit, a second signal conversion module, and qubits. The control module is located at a first temperature. The first signal conversion module is connected to the control module. The plastic waveguide unit is connected to the first signal conversion module and located at a second temperature. The second signal conversion module is connected to the plastic waveguide unit. The qubits are connected to the second signal conversion module and located at the second temperature, wherein the first and second signal conversion modules are used to convert signals between the plastic waveguide unit and the qubits. The first temperature is higher than the second temperature.

Description

Technical Field

[0001] This disclosure relates to signal transmission systems, and in particular to signal transmission systems used for quantum control and readout. Prior Technology

[0002] Quantum computers generally refer to computing devices that use two quantum states to represent the state of a qubit. Because quantum computers offer significantly superior computing power compared to traditional computers, they are considered an important development project. Taking superconducting qubits as an example, they need to operate in extremely low-temperature environments, such as at very low Kelvin (K). Temperature control is crucial to ensuring stable operation of the qubits. In addition to using cryogenic cooling equipment, it is also necessary to ensure thermal isolation between the qubits and their external environment as much as possible.

[0003] Generally, the cavity storing qubits already has excellent thermal insulation capabilities, and the cables connecting the qubits to the outside world also have excellent low thermal conductivity. However, when the number of qubits exceeds one million, the heat generated by the cables connecting the qubits to the outside world cannot be ignored. Summary of the Invention

[0004] In one or more embodiments disclosed herein, a signal transmission system for quantum control and readout is provided, comprising a control module, a first signal conversion module, a plastic waveguide unit, a second signal conversion module, and qubits. The control module is at a first temperature. The first signal conversion module is connected to the control module. The plastic waveguide unit is connected to the first signal conversion module and is at a second temperature. The second signal conversion module is connected to the plastic waveguide unit. The qubits are connected to the second signal conversion module and are at a second temperature, wherein the first and second signal conversion modules are used to convert signals between the plastic waveguide unit and the qubits. The first temperature is greater than the second temperature.

[0005] In one or more embodiments disclosed herein, a signal transmission device for quantum control and readout is provided, comprising a control component, a heat-insulating cavity, a first signal conversion component, a plastic waveguide element, a second signal conversion component, and qubits. The control component is at a first temperature. The heat-insulating cavity has a cavity wall and a first accommodating space formed by the cavity wall, wherein the first accommodating space is at a second temperature, wherein the first temperature is greater than the second temperature. The first signal conversion component is partially disposed on the cavity wall or in the first accommodating space and is electrically connected to the control component. The plastic waveguide element is disposed in the first accommodating space and is electrically connected to the first signal conversion component. The second signal conversion component is disposed in the first accommodating space and is electrically connected to the plastic waveguide element. The qubit is disposed in the first accommodating space and is electrically connected to the second signal conversion component.

[0006] According to the signal transmission system and device described in one or more of the foregoing embodiments, a plastic waveguide element is used to transmit signals. Since the signal transmission method of the plastic waveguide element utilizes the form of waves and does not contain metal, the signal transmission system and device disclosed herein can ensure that the qubit can operate continuously in an extremely low-temperature environment without receiving heat from the outside. Simple Explanation of the Diagram

[0007] The following detailed description, in conjunction with the accompanying drawings, will provide a better understanding of the views expressed in the disclosed embodiments. It is worth noting that, according to industry standard practice, some features may not be drawn to scale. In fact, for clarity of description, the dimensions of different features may be increased or decreased. Figure 1 is a block diagram showing a signal transmission system for quantum control and readout according to some embodiments of the present disclosure. Figure 2 is a schematic diagram showing a hollow tube according to some embodiments disclosed herein. Figure 3 is a block diagram of a signal transmission system for quantum control and readout, according to another embodiment of the present disclosure. Figure 4 is a block diagram of a signal transmission system for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 5 is a schematic diagram of a signal transmission device for quantum control and readout, according to some embodiments of the present disclosure. Figure 6 is a schematic diagram showing the frequency of control signals / read signals and transmission signals according to some embodiments of the present disclosure. Figure 7 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 8 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 9 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 10 is a schematic diagram showing the frequency of control signals / read signals and transmission signals according to another embodiment of the present disclosure. Figure 11 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 12 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 13 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 14 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 15 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 16 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Figure 17 is a schematic diagram of a signal transmission device for quantum control and readout, according to yet another embodiment of the present disclosure. Implementation

[0008] In quantum computers, the qubits responsible for computation need to be in an extremely low-temperature environment to achieve a superconducting state, ensuring their effectiveness. A quantum computer can be a computing device that uses two quantum states to represent the state of a qubit. On one hand, using heat-insulated cavities and cooling devices largely meets these requirements. On the other hand, the cables used to transmit signals are mostly made of metal. Metal cables operate by using free electrons to transmit signals. Under normal circumstances, the heat generated by free electrons during operation is negligible. However, since the number of qubits can be hundreds of thousands or millions, the heat generated by a large number of cables during operation can significantly raise the temperature of the qubits, leading to qubit failure. Furthermore, metal cables are themselves good conductors of heat; therefore, a large number of cables may also become the main heat transfer path between the qubits and the outside world. Therefore, this disclosure uses plastic waveguide elements to transmit signals. Since the signal transmission method of plastic waveguide elements is in the form of waves, and the material of plastic waveguide elements does not contain metal... In this way, it can be ensured that the qubit remains in an extremely low temperature environment and does not receive heat from the outside.

[0009] It's worth noting that the "effectiveness" of the aforementioned qubits can be measured using fidelity. Specifically, a fidelity above a certain value is necessary to ensure sufficient correctness in quantum computation. For example, fidelity can be expressed as a percentage, and a value of at least 99.9% is required for adequate correctness in quantum computation. On the other hand, the "failure" of the aforementioned qubits refers to a situation where the fidelity of the qubits is too low, resulting in an excessively high error rate in the quantum computer. For example, with a fidelity below 99%, the quantum computer may suffer from insufficient correctness due to an excessively high error rate.

[0010] Please refer to Figure 1, which is a block diagram showing a signal transmission system 1A for quantum control and readout according to some embodiments of this disclosure. As shown in Figure 1, the signal transmission system 1A may include a control module 10, a first signal conversion module 11, a plastic waveguide unit 12, a second signal conversion module 13, and a qubit 14. In this embodiment, the control module 10 is at a first temperature T1, a portion of the first signal conversion module 11 is at the first temperature T1, and the other portion of the first signal conversion module 11, the plastic waveguide unit 12, the second signal conversion module 13, and the qubit 14 are at a second temperature T2. It is worth noting that the first temperature T1 is greater than the second temperature T2, and the second temperature T2 may be a better operating temperature for the qubit 14, for example, the second temperature T2 is less than or equal to 4 K, but this disclosure is not limited thereto, and the second temperature T2 may be designed to be within a temperature range suitable for the qubit 14 to reach a superconducting state. For a description of each component and its environment, please refer to the following text.

[0011] Specifically, the control module 10 can be used for the control and reading of the qubit 14. Specifically, the control module 10 can issue control signals (e.g., a first control signal CS1, detailed below) to control the qubit 14, and the control module 10 can read the read signals obtained by the computation of the qubit 14 (e.g., a second read signal RS2, detailed below). For example, the control module 10 may include control circuitry, write circuitry, and / or read circuitry for issuing control signals and receiving read signals. In some embodiments, the control module 10 may also control a first signal conversion module 11 and / or a second signal conversion module 13 to up-frequency or down-frequency the control signal (e.g., the first control signal CS1) or the read signal (e.g., the first read signal RS1). Therefore, in this case, the control module 10 may further include a signal generator to provide the timing signals required for up-frequency or down-frequency conversion, but this disclosure is not limited thereto.

[0012] In some embodiments, the control module 10 may further include processing and / or storage components such as a processor, computer-readable media, and memory to execute computer programs to achieve the aforementioned functions. For example, the processor may include a central processing unit (CPU), a multi-core CPU, a graphics processing unit (GPU), etc.; the computer-readable media may include a compact disc read-only memory (CD-ROM), a hard disk drive, erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), etc.; and the memory may include dynamic random access memory (DRAM), static random access memory (SRAM), flash memory, etc., but the processing and / or storage components disclosed herein are not limited to these.

[0013] In some embodiments, the control module 10 is at a first temperature T1. The first temperature T1 may be room temperature, for example, the first temperature T1 is between about 0 °C and about 40 °C, that is, between about 273 K and about 313 K, but this disclosure is not limited thereto.

[0014] In some embodiments, the first signal conversion module 11 may be electrically connected to the control module 10. The first signal conversion module 11 can convert the first control signal CS1 into a first transmission signal TS1. Specifically, since the signal transmission method of the plastic waveguide unit 12 is in the form of waves, the first control signal CS1 needs to be up-frequencyed and converted into the first transmission signal TS1 so that the signal can be transmitted in the plastic waveguide unit 12. In some embodiments, the first signal conversion module 11 can up-frequency the first control signal CS1, for example: the first control signal CS1 is converted into a first transmission signal TS1 with a frequency of 80 GHz to 110 GHz by the first signal conversion module 11, but this disclosure is not limited to this.

[0015] More specifically, the first signal conversion module 11 may further include a first mixing unit 110 and a first switching unit 111. In some embodiments, the first mixing unit 110 can be used to upsample the first control signal CS1, and the first switching unit 111 can be used to bridge (or switch) the first mixing unit 110 and the plastic waveguide unit 12, and the first switching unit 111 can convert the first control signal CS1 into a first transmission signal TS1. In some embodiments, the first mixing unit 110 may include a separate mixer or filter, or the first mixing unit 110 may be a part of the circuit on a printed circuit board, but this disclosure is not limited thereto. In some embodiments, the first switching unit 111 may be an interface that is electrically connected to the control module 10 and the plastic waveguide unit 12, and converts the first control signal CS1 into the first transmission signal TS1.

[0016] In some embodiments, the first mixing unit 110 of the first signal conversion module 11 is at a first temperature T1, and the first switching unit 111 of the first signal conversion module 11 is at a second temperature T2. The first temperature T1 can be room temperature, which will not be elaborated further here. In addition, the second temperature T2 is a suitable operating temperature for the qubit 14, for example, the second temperature T2 is between about 1 mK and about 4 K, but this disclosure is not limited thereto.

[0017] In some embodiments, the first signal conversion module 11 may further include a signal amplifier, a filter, a signal processor, other elements well known to those skilled in the art, or combinations thereof, to achieve the functions described above or other common functions. The aforementioned elements may be located at a first temperature T1 or a second temperature T2 depending on their characteristics, which will not be elaborated further here.

[0018] In some embodiments, the plastic waveguide unit 12 may be electrically connected to the first signal conversion module 11 and used to transmit the first transmission signal TS1 to the second signal conversion module 13. In other words, one end of the plastic waveguide unit 12 is physically connected to the first signal conversion module 11, and the other end is physically connected to the second signal conversion module 13, serving as a transmission medium between the two signal conversion modules (i.e., the first signal conversion module 11 and the second signal conversion module 13).

[0019] Please refer to Figures 1 and 2 together. Figure 2 is a schematic diagram showing a hollow tube 120 according to some embodiments of this disclosure. As shown in Figure 2, the plastic waveguide unit 12 may include one or more (e.g., hundreds of thousands or millions) hollow tubes 120, and any hollow tube 120 can be used to (indirectly) connect one or more qubits 14.

[0020] In some embodiments, the hollow tube 120 may include a tube wall 120a and a cavity 120b. More specifically, the tube wall 120a is substantially composed of a low-temperature resistant polymer. It is worth noting that, since the hollow tube 120 needs to be at the operating temperature of the qubit 14, "low-temperature resistant" refers to the property of not deforming, cracking, breaking, or losing its intended function at temperatures of several mK or several K. For example, the tube wall 120a of the hollow tube 120 may include polyethylene (PE 10), polytetrafluoroethylene (PTFE), polyimide (PI), combinations of the foregoing materials, and / or other low-temperature resistant materials or combinations thereof. In some embodiments, the tube wall 120a may substantially not contain any metallic elements, such as iron, cobalt, nickel, silver, gold, copper, etc. In this document, "not containing any metallic elements" means that the weight percentage of the metallic element is less than 1 wt%, 0.1 wt%, lower, or substantially unmeasurable. In some embodiments, cavity 120b may be filled with a specific gas as a medium, such as air, but this disclosure is not limited thereto. Similarly, cavity 120b may substantially not contain any metallic elements.

[0021] In some embodiments, the outer radius R1 (i.e., the distance from the outer side of the tube wall 120a to the center) and the inner radius R2 (i.e., the distance from the inner side of the tube wall 120a to the center) of the hollow tube 120 can be determined by electromagnetic simulation or calculation based on the frequency of the transmitted signal (i.e., the application frequency) and the material and / or characteristics of the hollow tube 120, but this disclosure is not limited thereto. In some embodiments, the hollow tube 120 may include multiple layers of tube walls 120a, and these tube walls 120a are concentric tubes. In other embodiments, any two layers of the multiple tube walls 120a may include different materials, but this disclosure is not limited thereto.

[0022] As shown in Figure 1, in some embodiments, the second signal conversion module 13 may be electrically connected to the plastic waveguide unit 12. The second signal conversion module 13 can convert the first transmission signal TS1 into a second control signal CS2. Specifically, since the signal (e.g., the first transmission signal TS1) has a high frequency and is transmitted in the form of a wave in the plastic waveguide unit 12, the second signal conversion module 13 can convert the first transmission signal TS1 into the second control signal CS2, and down-frequency the second control signal CS2 as appropriate, so that the qubit 14 can receive instructions. In some embodiments, the second signal conversion module 13 can down-frequency the second control signal CS2, for example, the first transmission signal TS1 is converted into the second control signal CS2 with a frequency of 5 GHz to 15 GHz by the second signal conversion module 13, but this disclosure is not limited thereto.

[0023] It is worth mentioning that, in some embodiments disclosed herein, qubit 14 is a millimeter-wave (mm-Wave) level qubit, which can directly receive a second control signal CS2 with a high frequency, which can be a frequency of 80 GHz to 110 GHz, but this disclosure is not limited thereto. Therefore, the frequency downsampling process and components can be omitted (see below for details).

[0024] More specifically, the second signal conversion module 13 may further include a second switching unit 130 and a second mixing unit 131. In some embodiments, the second switching unit 130 may be used to bridge (or switch) the plastic waveguide unit 12 and the second mixing unit 131 (or qubit 14, if the second mixing unit 131 is not present), and the second mixing unit 131 may be used to down-convert the second control signal CS2. In some embodiments, the second switching unit 130 may be an interface electrically connected to the plastic waveguide unit 12 and the second mixing unit 131 (or qubit 14), and convert the first transmission signal TS1 into the second control signal CS2. In some embodiments, the second mixing unit 131 may include a separate mixer, or it may be a part of the circuitry on a printed circuit board, but this disclosure is not limited thereto.

[0025] In some embodiments, the second switching unit 130 and the second mixing unit 131 of the second signal conversion module 13 are both at a second temperature T2. The second temperature T2 is the appropriate operating temperature of the qubit 14, for example, the second temperature T2 is between about 1 mK and about 4 K, but this disclosure is not limited thereto.

[0026] In some embodiments, the second signal conversion module 13 may further include a signal amplifier, a filter, a signal processor, other elements well known to those skilled in the art, or combinations thereof, to achieve the functions described above or other common functions.

[0027] In some embodiments, qubit 14 may be electrically connected to the second signal conversion module 13 and used to receive the second control signal CS2. In some embodiments, the number of qubits 14 may be hundreds of thousands to millions, but this disclosure is not limited thereto. In some embodiments, each of the qubits 14 may be electrically connected to the control module 10 via the hollow tube 120 of the plastic waveguide unit 12 to receive other control signals from the control module 10, thereby performing computational functions. It is worth noting that, compared with the use of metal cables in the prior art, the conduction method using the plastic waveguide unit 12 can effectively prevent heat energy from entering the qubit 14 from the outside, thereby preventing the qubit 14 from malfunctioning.

[0028] In some embodiments, qubit 14 is at a second temperature T2. The second temperature T2 is a suitable operating temperature for qubit 14, for example, it is between approximately 1 mK and approximately 4 K. Specifically, the second temperature T2 may vary depending on the type of qubit 14. In some embodiments, qubit 14 may be a millimeter-wave (mm-Wave) qubit or other qubits requiring high-frequency signals for control. It is noteworthy that, compared to the aforementioned common first temperature T1 as the operating temperature, using a second temperature T2 as the operating temperature can significantly reduce the number of cooling devices or lower their power, thereby further saving energy.

[0029] As described above, this disclosure provides a signal transmission system 1A, which includes a control module 10, a first signal conversion module 11, a plastic waveguide unit 12, a second signal conversion module 13, and a qubit 14. Specifically, the control module 10 is located at a first temperature T1 and emits a first control signal CS1. The first signal conversion module 11 converts the first control signal CS1 into a first transmission signal TS1. The plastic waveguide unit 12 is located at a second temperature T2 and transmits the first transmission signal TS1 to the second signal conversion module 13. The second switching unit 130 of the second signal conversion module 13 can convert the first transmission signal TS1 into a second control signal CS2. The qubit 14 is located at the second temperature T2 and receives the second control signal CS2. The first temperature T1 is greater than the second temperature T2, and the second temperature T2 is less than or equal to 4 K.

[0030] However, the signal transmission direction is not limited to transmission from control module 10 to qubit 14. Conversely, the signal transmission direction can also be from qubit 14 to control module 10. For example, qubit 14 can further emit a first read signal RS1 according to a second control signal CS2. The second mixer unit 131 in the second signal conversion module 13 can further up-frequency the first read signal RS1 (e.g., the up-frequency first read signal RS1 can have a frequency of 80 GHz to 110 GHz), and the second switching unit 130 in the second signal conversion module 13 can further convert the up-frequency first read signal RS1 into a second transmission signal TS2. The plastic waveguide unit 12 can further transmit the second transmission signal TS2 to the first signal conversion module 11. The first switching unit 111 of the first signal conversion module 11 can further convert the second transmission signal TS2 into a second read signal RS2, and the first mixing unit 110 in the first signal conversion module 11 can further down-frequency the second read signal RS2 (for example, the down-frequency second read signal RS2 has a frequency of 5 GHz to 15 GHz). The control module 10 can receive the down-frequency second read signal RS2. The detailed operation of the aforementioned modules can be found above and will not be repeated here.

[0031] Please refer to Figure 3, which is a block diagram showing a signal transmission system 1B for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 3, the signal transmission system 1B includes a control module 10, a first signal conversion module 11, a plastic waveguide unit 12, a second signal conversion module 13, and a qubit 14. The structure of the signal transmission system 1B can be referred to the embodiment described in Figure 1, and similar details will not be repeated. It is worth noting that the difference between the signal transmission system 1B of this embodiment and the embodiment in Figure 1 is that the control module 10 is at a first temperature T1, a portion of the first signal conversion module 11 is at a third temperature T3, and the other portion of the first signal conversion module 11, the plastic waveguide unit 12, the second signal conversion module 13, and the qubit 14 are at a second temperature T2. It is worth noting that the first temperature T1 is greater than the second temperature T2, and the third temperature T3 is between the first temperature T1 and the second temperature T2. The second temperature T2 may be the optimal operating temperature for the qubit 14. Other details about the second temperature T2 can be found above and will not be repeated here.

[0032] Specifically, the control module 10 is at a first temperature T1, the first mixer unit 110 of the first signal conversion module 11 is at a third temperature T3, and at least a portion of the first switching unit 111 of the first signal conversion module 11 is at a second temperature T2. More specifically, a portion of the first switching unit 111 of the first signal conversion module 11 may be at the third temperature T3 to connect to the first mixer unit 110 at the third temperature T3, and another portion may be at the second temperature T2 to connect to the plastic waveguide unit 12 at the second temperature T2. As mentioned above, by setting the first mixer unit 110 of the first signal conversion module 11 at a third temperature T3 environment between the first temperature T1 (e.g., room temperature) and the second temperature T2 (e.g., several mK to several K), the characteristics of the first mixer unit 110 can be adjusted. Therefore, in these embodiments, the first mixer unit 110 may be set at a third temperature T3 that is not part of the first temperature T1 or the second temperature T2. The third temperature T3 can be slightly greater than 4 K, for example, the third temperature T3 is between about 4 K and 10 K.

[0033] In some embodiments, the first signal conversion module 11 may further include a signal amplifier, a filter, a signal processor, other elements well known to those skilled in the art, or combinations thereof, to achieve the functions described above or other common functions. The aforementioned elements may be located at a third temperature T3 or a second temperature T2 depending on their characteristics, which will not be elaborated further here.

[0034] Please refer to Figure 4, which is a block diagram of a signal transmission system 1C for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 4, the signal transmission system 1C includes a control module 10, a first signal conversion module 11, a plastic waveguide unit 12, a second signal conversion module 13, and a qubit 14. The structure of the signal transmission system 1C can be referred to the embodiments described in Figures 1 and 3, and similar details will not be repeated. It is worth noting that the difference between the signal transmission system 1C in this embodiment and the embodiments in Figures 1 and 3 is that the control module 10 is at a first temperature T1, a portion of the first signal conversion module 11 is at the first temperature T1, and the other portion of the first signal conversion module 11, the plastic waveguide unit 12, the second signal conversion module 13, and the qubit 14 are at a second temperature T2. It is worth noting that the first temperature T1 in this embodiment is not the room temperature of the embodiment in Figure 1, but is slightly greater than 4 K. For example, the first temperature T1 is between about 4 K and 10 K, while the second temperature T2 can be the optimal operating temperature for the qubit 14. Other details of the second temperature T2 can be found above and will not be repeated here.

[0035] Specifically, both the control module 10 and the first mixing unit 110 of the first signal conversion module 11 are at a first temperature T1, and the first switching unit 111 of the first signal conversion module 11 is at a second temperature T2. As mentioned above, by setting the control module 10 and the first mixing unit 110 of the first signal conversion module 11 at the first temperature T1 (e.g., several mK to several K), the characteristics of the control module 10 and the first mixing unit 110 can be adjusted.

[0036] In summary, a signal transmission system has been described based on some embodiments of this disclosure. It is worth noting that the relative positions or environment of these components can be adjusted according to the characteristics of each component in the signal transmission system. Next, specific details of the signal transmission apparatus will be provided based on some embodiments of this disclosure. Specifically, the signal transmission apparatus employs the aforementioned operation mode of the signal transmission system and includes other components or parts that may be necessary during actual operation. Describing more specific embodiments will make this disclosure clearer and easier to understand.

[0037] Please refer to Figure 5, which is a schematic diagram showing a signal transmission device 2A for quantum control and readout according to some embodiments of this disclosure. As shown in Figure 5, the signal transmission device 2A may include a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit 24, and a heat-insulating cavity 25. In some embodiments, a portion of the first signal conversion component 21, the plastic waveguide element 22, the second signal conversion component 23, and the qubit 24 may be disposed within the heat-insulating cavity 25. Another portion of the control component 20 and the first signal conversion component 21 may be disposed outside the heat-insulating cavity 25, but this disclosure is not limited thereto.

[0038] In some embodiments, the control component 20 may further include circuitry 200 and signal generator 201. In some embodiments, the first signal conversion component 21 may further include a first mixer 210, a first adapter 211, and a first adapter 212. In some embodiments, the plastic waveguide element 22 may include plastic waveguide 220 and plastic waveguide 221. In some embodiments, the second signal conversion component 23 may further include a second adapter 230, a second adapter 231, and a second mixer 232. In some embodiments, the thermal insulation cavity 25 may have a cavity wall 250 and a first accommodating space 251 formed by the cavity wall 250. The descriptions of the various components and their elements are as follows.

[0039] Specifically, the insulated cavity 25 can be used to house the qubit 24. The insulated cavity 25 provides a suitable environment (e.g., an optimal operating temperature) for the operation of the qubit 24. For example, the insulated cavity 25 may include a freezer, a cryogenic storage dewar, other suitable containers, or combinations thereof, but this disclosure is not limited thereto. The qubit 24 is disposed in a first housing space 251 of the insulated cavity 25, and the first housing space 251 is a vacuum environment.

[0040] In some embodiments, the cavity wall 250 of the heat insulation cavity 25 may include ceramic, other suitable materials for heat insulation, dielectric properties, or combinations thereof, but this disclosure is not limited thereto. In some embodiments, the cavity wall 250 of the heat insulation cavity 25 may be a multilayer board or composite board to more effectively insulate heat energy.

[0041] In some embodiments, the first accommodating space 251 is filled with a gaseous medium, such as air, other suitable gases, or combinations thereof, but this disclosure is not limited thereto. In some embodiments, the temperature of the first accommodating space 251 is a second temperature T2, and the second temperature T2 is a suitable operating temperature for the qubit 24, for example, the second temperature T2 is between about 1 mK and about 4 K. In this embodiment, the second temperature T2 is preferably between about 10 mK and about 1 K.

[0042] Specifically, the control component 20 is disposed outside the heat-insulating cavity 25 and is positioned at a first temperature T1. In some embodiments, the first temperature T1 may be room temperature. For example, the first temperature T1 may be between approximately 273 K and approximately 313 K. Specific temperatures are described above and will not be repeated here.

[0043] The circuitry 200 of the control component 20 is disposed outside the heat-insulating cavity 25. In some embodiments, the circuitry 200 may include control circuitry, write circuitry, and / or read circuitry to issue a first control signal CS1 to control the qubit 24. The circuitry 200 may read a second read signal RS2 returned after computation by the qubit 24. The signal generator 201 is disposed outside the heat-insulating cavity 25 and is located at a first temperature T1. The signal generator 201 may be used to provide the mixing signal MS required for mixing (e.g., up-conversion and down-conversion).

[0044] Specifically, the first signal conversion component 21 may be partially disposed on the cavity wall 250 of the heat insulation cavity 25 and electrically connected to the control component 20. The first mixer 210 of the first signal conversion component 21 is disposed outside the heat insulation cavity 25 and is at a first temperature T1. The first mixer 210 may be electrically connected to the circuit 200 to receive the first control signal CS1 and may be electrically connected to the signal generator 201 to receive the mixing signal MS. Furthermore, the first mixer 210 may upsample the first control signal CS1 according to the mixing signal MS.

[0045] Please refer to Figures 5 and 6 together. Figure 6 is a schematic diagram showing the frequencies of control signals / read signals and transmission signals according to some embodiments disclosed herein. As shown in Figure 6, the frequency f0 in part (a) is the frequency suitable for manipulating the quantum bit 24, the frequency fc in part (b) is the frequency suitable for transmission in the plastic waveguide element 22, and the frequency f'0 in part (b) is the frequency after the control signal (or read signal) is up-frequency. In this case, the first control signal CS1 before up-frequency ... Equation (A)

[0046] In some embodiments, the frequency f0 may be between 5 GHz and 15 GHz, but this disclosure is not limited thereto. In some embodiments, the frequency f'0 may be between 30 GHz and 10 THz, for example, the frequency f'0 may be between 80 GHz and 110 GHz, but this disclosure is not limited thereto. In other words, the frequency f'0 may be between millimeter wave (mmWave) and megahertz wave (THz).

[0047] Returning to Figure 5, the first adapters 211 and 212 of the first signal conversion assembly 21 are disposed on the cavity wall 250. A portion of the first adapters 211 and 212 is at a first temperature T1, and the other portion is at a second temperature T2 (i.e., the first adapters 211 and 212 connect the outside and inside of the heat-insulating cavity 25). The first adapter 211 is electrically connected to the first mixer 210, converting the up-frequency first control signal CS1 into a first transmission signal TS1, and then transferring it to the plastic waveguide 220 of the plastic waveguide element 22. The first adapter 212 is electrically connected to the signal generator 201, converting the mixing signal MS into a mixing transmission signal MTS, and then transferring it to the plastic waveguide 221 of the plastic waveguide element 22.

[0048] Specifically, the plastic waveguide element 22 can be disposed in the first accommodating space 251 and at the second temperature T2, and can be electrically connected to the first signal conversion component 21. The plastic waveguide 220 of the plastic waveguide element 22 can be used to transmit the first transmission signal TS1 to the second adapter 230 of the second signal conversion component 23, and the plastic waveguide 221 of the plastic waveguide element 22 can be used to transmit the mixing transmission signal MTS to the second adapter 231 of the second signal conversion component 23.

[0049] Similar to the description above, plastic waveguides 220 and 221 may include a plurality of (e.g., hundreds of thousands or millions) hollow tubes, and any one hollow tube is used to (indirectly) connect one or more qubits 24. The walls of the hollow tubes may include polyethylene (PE 10), polytetrafluoroethylene (PTFE), polyimide (PI), combinations of the foregoing materials, and other low-temperature resistant plastics or combinations thereof. In some embodiments, the materials of plastic waveguides 220 and 221 may be similar or the same, but this disclosure is not limited thereto. In some embodiments, plastic waveguides 220 and 221 with different materials may be selected based on a first transmission signal TS1 (or a second transmission signal TS2) and a mixing transmission signal MTS.

[0050] Specifically, the second signal conversion component 23 can be disposed in the first accommodating space 251 and is located at a second temperature T2. The second signal conversion component 23 can be electrically connected to the plastic waveguide element 22. The second adapter 230 of the second signal conversion component 23 can be electrically connected to the plastic waveguide 220 of the plastic waveguide element 22, and converts the first transmission signal TS1 into a second control signal CS2 and transfers it to the second mixer 232. The second adapter 231 of the second signal conversion component 23 can be electrically connected to the plastic waveguide 221 of the plastic waveguide element 22, and converts the mixing transmission signal MTS into a mixing signal MS and transfers it to the second mixer 232. The second mixer 232 of the second signal conversion component 23 can be electrically connected to the second adapter 230 to receive the second control signal CS2, and can be electrically connected to the second adapter 231 to receive the mixing signal MS. In addition, the second mixer 232 can also down-convert the second control signal CS2 according to the mixing signal MS.

[0051] Similar to the above, please refer to Figures 5 and 6. As shown in Figure 6, the frequency f0 in part (a) is the frequency suitable for manipulating the quantum bit 24, the frequency fc in part (b) is the frequency suitable for transmission in the plastic waveguide element 22, and the frequency f'0 in part (b) is the frequency of the control signal before frequency reduction. That is, the second control signal CS2 before frequency reduction may have a frequency f'0, the second control signal CS2 after frequency reduction has a frequency f0, and the relationship between frequencies f'0, f0, and fc can be referred to the aforementioned equation (A). In some embodiments, the frequency f0 may be between 5 GHz and 15 GHz, and the frequency f'0 may be between 80 GHz and 110 GHz, but this disclosure is not limited thereto. In some embodiments, the frequency f0 of the first control signal CS1 before frequency increase may be different from the frequency f0 of the second control signal CS2 after frequency reduction, in order to improve the applicability or flexibility of signal control.

[0052] Returning to Figure 5, specifically, qubit 24 is disposed in the first accommodating space 251 and at the second temperature T2, and is electrically connected to the second signal conversion component 23. Similar to the operation of signal transmission systems 1A-1C in Figures 1, 3, and 4, qubit 24 can emit a first read signal RS1 according to the second control signal CS2. Then, the second mixer 232 in the second signal conversion component 23 can up-frequency the first read signal RS1, and the second adapter 230 in the second signal conversion component 23 can convert the first read signal RS1 into a second transmission signal TS2. The plastic waveguide element 22 can transmit the second transmission signal TS2 to the first signal conversion component 21. The first adapter 211 in the first signal conversion component 21 can convert the second transmission signal TS2 into the second read signal RS2, and the first mixer 210 in the first signal conversion component 21 can down-frequency the second read signal RS2. The control component 20 can receive the second read signal RS2. The detailed operation of each component and step can be found above and will not be repeated here.

[0053] In some embodiments, the signal transmission device 2A may further include some common equipment for maintaining the aforementioned environment. For example, the signal transmission device 2A may include cooling equipment for removing heat from the insulated cavity 25 to the external environment. In addition, the signal transmission device 2A may also include a power supply, a transformer, a temperature monitoring device, an input device (e.g., a monitor, a mouse, a keyboard), etc., which will not be described in detail here.

[0054] Please refer to Figure 7, which is a schematic diagram of a signal transmission device 2B for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 7, the signal transmission device 2B includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit 24, and a heat-insulating cavity 25. The structure of the signal transmission device 2B can be referred to the embodiment described in Figure 5, and similar details will not be repeated. It is worth noting that the signal transmission device 2B of this embodiment differs from the embodiment in Figure 5 in that the first adapter 211 and the first adapter 212 of the first signal conversion component 21 are not disposed on the cavity wall 250, but are disposed in the first accommodating space 251 and at a second temperature T2. In other words, the specific placement of the first signal conversion component 21 can be determined according to the actual situation. In this way, the applicability and flexibility of the signal transmission device 2B can be improved.

[0055] Please refer to Figure 8, which is a schematic diagram of a signal transmission device 2C for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 8, the signal transmission device 2C includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit 24, and a heat-insulating cavity 25. The structure of the signal transmission device 2C can be referred to the embodiment described in Figure 5, and similar details will not be repeated. It is worth noting that the signal transmission device 2C in this embodiment differs from the embodiment in Figure 5 in that: the first signal conversion component 21 includes a plurality of (e.g., n) first mixers 210_1 to 210_n and a plurality of first adapters 211_1 to 211_n; the plastic waveguide element 22 includes a plurality of plastic waveguides 220_1 to 220_n and a plastic waveguide 221; the second signal conversion component 23 includes a plurality of second adapters 230_1 to 230_n and second mixers 232_1 to 232_n; and the qubits 24 include qubits 24_1 to 24_n. Here, n can be a positive integer greater than 100,000, for example, n can be hundreds of thousands or millions.

[0056] In this embodiment, each of the qubits 24_1 to 24_n comprises a single qubit, and each of these qubits is connected to the control component 20 via a corresponding one of the second mixers 232_1 to 232_n, a corresponding one of the second adapters 230_1 to 230_n, a corresponding one of the plastic waveguides 220_1 to 220_n, a corresponding one of the first adapters 211_1 to 211_n, and a corresponding one of the first mixers 210_1 to 210_n, without sharing a channel. For example, qubit 24_1 corresponds to the second mixer 232_1, the second adapter 230_1, the plastic waveguide 220_1, the first adapter 211_1, and the first mixer 210_1. Similarly, qubit 24_n corresponds to the second mixer 232_n, the second adapter 230_n, the plastic waveguide 220_n, the first adapter 211_n, and the first mixer 210_n. Therefore, this structure can be called a multi-channel structure. This configuration avoids interference between different control signals or readout signals.

[0057] Please refer to Figures 9 and 10, which are schematic diagrams of a signal transmission device 2D for quantum control and readout, and frequency diagrams of control signals / readout signals and transmission signals, respectively, according to another embodiment of this disclosure. As shown in Figure 9, the signal transmission device 2D includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit array 26, and a heat-insulating cavity 25. The structure of the signal transmission device 2D can be referred to the embodiment described in Figure 8; similar details will not be repeated. It is worth noting that the signal transmission device 2D in this embodiment differs from the embodiment in Figure 8 in that the qubit array 26 may include qubit arrays 26_1 to 26_x. Here, x can be a positive integer greater than 100,000, for example, x can be hundreds of thousands or millions. In this embodiment, each of the qubit arrays 26_1 to 26_x includes multiple qubits. For example, each of the qubit groups 26_1 to 26_x may include y bits, where y can be a positive integer greater than 2. The multiple qubits in each of these qubit groups share a single channel and do not share channels with the multiple qubits in other groups.

[0058] Taking the signal of qubit 26_1 as an example, the first signal conversion component 21 can up-frequency, superimpose, and convert multiple first control signals CS1 into a single first transmission signal TS. As shown in Figure 10, the multiple first control signals CS1 before up-frequency conversion have frequencies f0~fy, and the multiple first control signals CS1 after up-frequency conversion have frequencies f'0~f'Y. The relationship between frequencies f'0, f0, and fc can be referred to in the aforementioned equation (A), and the relationship between frequencies f'y, fy, and fc can be referred to in equation (B). Equation (B)

[0059] Following the above steps, a single first transmission signal TS1 can be transmitted to the second adapter 230_1 via the plastic waveguide 220_1. The second signal conversion component 23 down-converts the single first transmission signal TS1 and converts it into multiple second control signals CS2, which are then provided to multiple qubits in the qubit group 26_1 to execute more complex instructions or operations. Similarly, as shown in Figure 10, the multiple second control signals CS2 before down-conversion have frequencies f'0 to f'Y, and the multiple second control signals CS2 after down-conversion have frequencies f0 to fY. The relationship between frequencies f'0, f0, and fc can be referred to in the aforementioned equation (A), and the relationship between frequencies f'y, fy, and fc can be referred to in the aforementioned equation (B).

[0060] As described above, in addition to employing a multi-channel structure, the device disclosed herein can also further employ a frequency-division multiplexing (FDM) structure. Since the plastic waveguide element 22 has an extremely wide applicable frequency range, the number of components in the device can be further simplified by employing a frequency-division multiplexing structure.

[0061] Please refer to Figure 11, which is a schematic diagram of a signal transmission device 2E for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 11, the signal transmission device 2E includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit array 26, and a heat-insulating cavity 25. The structure of the signal transmission device 2E can be referred to the embodiment described in Figure 9, and similar details will not be repeated. It is worth noting that the signal transmission device 2E in this embodiment differs from the embodiment in Figure 9 in that the second mixer 232_1~232_x in the second signal conversion component 23 is omitted in this embodiment. In this embodiment, the qubits in the qubit array 26 are millimeter-wave (mm-Wave) level qubits, and this qubit array 26 can directly receive a second control signal CS2 with a frequency of 80 GHz to 110 GHz. Therefore, the frequency reduction process and components (i.e., the second mixers 232_1 to 232_x) can be omitted.

[0062] Please refer to Figure 12, which is a schematic diagram of a signal transmission device 2F for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 12, the signal transmission device 2F includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit 24, and a heat-insulating cavity 25. The structure of the signal transmission device 2F can be referred to the embodiment described in Figure 7, and similar details will not be repeated. It is worth noting that the signal transmission device 2F of this embodiment differs from the embodiment in Figure 7 in that the heat-insulating cavity 25 may further include a second accommodating space 252 formed by the cavity wall 250. The first mixer 210 of the first signal conversion component 21 is disposed in the second accommodating space 252 of the heat-insulating cavity 25, rather than outside the heat-insulating cavity 25.

[0063] In some embodiments, the second accommodating space 252 may be filled with a gaseous medium, such as air; in other embodiments, the second accommodating space 252 may be in a vacuum state, but this disclosure is not limited thereto. In some embodiments, the temperature of the second accommodating space 252 is a third temperature T3, and the third temperature T3 is between the first temperature T1 and the second temperature T2, for example, the third temperature T3 is between about 4 K and about 10 K.

[0064] Please refer to Figure 13, which is a schematic diagram of a signal transmission device 2G for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 13, the signal transmission device 2G includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit array 26, and a heat-insulating cavity 25. The structure of the signal transmission device 2G can be referred to the embodiments described in Figures 9 and 12, and similar details such as system configuration and operation methods will not be repeated. It is worth noting that the signal transmission device 2G of this embodiment differs from the embodiments in Figures 9 and 12 in that this embodiment adopts the multi-channel structure and frequency division multiplexing structure mentioned above to avoid signal interference and further simplify the number of components in the device.

[0065] Please refer to Figure 14, which is a schematic diagram of a signal transmission device 2H for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 14, the signal transmission device 2H includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit array 26, and a heat-insulating cavity 25. The structure of the signal transmission device 2H can be referred to the embodiments described in Figures 11 and 13, and similar details will not be repeated. It is worth noting that the signal transmission device 2H in this embodiment differs from the embodiment in Figure 13 in that the qubits in the qubit array 26 of this embodiment are millimeter-wave (mm-Wave) level qubits. This qubit array 26 can directly receive the second control signal CS2 with a frequency of 80 GHz to 110 GHz. Therefore, the frequency downsampling process and components (i.e., the second mixers 232_1 to 232_x) can be omitted.

[0066] Please refer to Figure 15, which is a schematic diagram of a signal transmission device 2I for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 15, the signal transmission device 2I includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit 24, and a heat-insulating cavity 25. The structure of the signal transmission device 2I can be referred to the embodiments described in Figures 5, 7, and 12, and similar details will not be repeated. It is worth noting that the signal transmission device 2I in this embodiment differs from the embodiment in Figure 7 in that the heat-insulating cavity 25 may further include a second accommodating space 252 formed by the cavity wall 250. The first mixer 210 of both the control component 20 and the first signal conversion component 21 is disposed within the second accommodating space 252 of the heat-insulating cavity 25, rather than outside the heat-insulating cavity 25. In some embodiments, the temperature of the second accommodating space 252 is a first temperature T1, and the first temperature T1 is between about 4 K and about 10 K.

[0067] In these embodiments, the control component 20 may be in the form of a circuit and disposed on a substrate such as a printed circuit board. For example, the control component 20 may not include a housing and may include a circuit 200 and a signal generator 201 in the form of a circuit. In this case, the overall size of the device can be effectively reduced. In addition, for controlling the control component 20, the signal transmission device 21 may further include an input and output component 27. The input and output component 27 may include a display, keyboard, mouse, or other devices well known to those skilled in the art.

[0068] Please refer to Figure 16, which is a schematic diagram of a signal transmission device 2J for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 16, the signal transmission device 2J includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit array 26, and a heat-insulating cavity 25. The structure of the signal transmission device 2J can be referred to the embodiment described in Figure 15; similar details such as system configuration and operation methods will not be repeated here. It is worth noting that the signal transmission device 2J in this embodiment differs from the embodiment in Figure 15 in that this embodiment adopts the multi-channel structure and frequency division multiplexing structure mentioned above to avoid signal interference and further simplify the number of components in the device.

[0069] Please refer to Figure 17, which is a schematic diagram of a signal transmission device 2K for quantum control and readout according to another embodiment of this disclosure. As shown in Figure 17, the signal transmission device 2K includes a control component 20, a first signal conversion component 21, a plastic waveguide element 22, a second signal conversion component 23, a qubit array 26, and a heat-insulating cavity 25. The structure of the signal transmission device 2K can be referred to the embodiment described in Figure 16, and similar details will not be repeated. It is worth noting that the signal transmission device 2K in this embodiment differs from the embodiment in Figure 16 in that the qubits in the qubit array 26 of this embodiment are millimeter-wave (mm-Wave) level qubits. This qubit array 26 can directly receive the second control signal CS2 with a frequency of 80 GHz to 110 GHz. Therefore, the frequency downsampling process and components (i.e., the second mixers 232_1 to 232_x) can be omitted.

[0070] In summary, the embodiments disclosed herein provide a signal transmission system and a signal transmission device for quantum control and readout. Specifically, both the signal transmission system and the signal transmission device employ plastic waveguide elements to transmit signals. Since the signal transmission method of the plastic waveguide element utilizes the wave form itself and does not contain metal, it ensures that the qubits can remain in an extremely low-temperature environment without receiving heat from the outside.

[0071] 1A~1C: Signal transmission system 10: Control Module 11: First signal conversion module 110: First Mixer Unit 111: First Transfer Unit 12: Plastic waveguide unit 120: Hollow tube 120a: Pipe wall 120b: Cavity 13: Second signal conversion module 130: Second Adapter Unit 131: Second Mixer Unit 14: Quantum Bit 2A~2K: Signal transmission devices 20: Control components 200: Circuit 201: Signal Generator 21: First signal conversion component 210, 210_1~210_n, 210_x: First mixer 211, 211_1~211_n, 211_x, 212: First adapter 22: Plastic waveguide components 220, 220_1~220_n, 220_x, 221: Plastic waveguide 23: Second signal conversion component 230, 230_1~230_n, 230_x, 231: Second adapter 232, 232_1~232_n, 232_x: Second mixer 24, 24_1~24_n: qubit 25: Insulated cavity 250: Cavity wall 251: First Accommodation Space 252: Second Accommodation Space 26, 26_1~26_x: qubits 27: Input and Output Components CS1: First control signal CS2: Second control signal MS: Mixer signal MTS: Mixed frequency transmission signal R1: Outer radius R2: Inner radius RS1: First read signal RS2: Second read signal RT: Room temperature TS1: First Transmission Signal TS2: Second Transmission Signal f0, f'0, fc, fX, f'X: Frequency T1~T3: Temperature

Claims

1. A signal transmission system, comprising: A control module is located at a first temperature; A first signal conversion module is connected to the control module; A plastic waveguide unit is connected to the first signal conversion module and is located at a second temperature; a second signal conversion module is connected to the plastic waveguide unit; and a qubit is connected to the second signal conversion module and is located at the second temperature, wherein the first signal conversion module and the second signal conversion module are used to convert the signal between the plastic waveguide unit and the qubit, wherein the first temperature is greater than the second temperature, and wherein the first signal conversion module further includes a first mixer unit and a first switching unit, wherein the first mixer unit is located at the first temperature and the first switching unit is located at the second temperature.

2. The signal transmission system as described in claim 1, wherein the control module sends a first control signal, the first signal conversion module converts the first control signal into a first transmission signal, the plastic waveguide unit transmits the first transmission signal to the second signal conversion module, the second signal conversion module converts the first transmission signal into a second control signal, and the qubit receives the second control signal.

3. The signal transmission system as described in claim 2, wherein the qubit further emits a first readout signal according to the second control signal, the second signal conversion module converts the first readout signal into a second transmission signal, the plastic waveguide unit transmits the second transmission signal to the first signal conversion module, the first signal conversion module converts the second transmission signal into a second readout signal, and the control module receives the second readout signal.

4. The signal transmission system as described in claim 3, wherein the first switching unit connects the control module and the plastic waveguide unit, the first mixing unit up-frequencys the first control signal and down-frequencys the second read signal, and the first switching unit converts the second transmission signal into the down-frequency second read signal and converts the up-frequency first control signal into the first transmission signal.

5. The signal transmission system as described in claim 3, wherein the second signal conversion module further includes a second switching unit and a second mixing unit, the second switching unit being connected to the plastic waveguide unit and the quantum bit, the second mixing unit up-frequencying the first read signal and down-frequencying the second control signal, and the second switching unit converting the up-frequency first read signal into the second transmission signal and converting the first transmission signal into the down-frequency second control signal.

6. The signal transmission system as described in claim 1, wherein the plastic waveguide unit includes a hollow tube.

7. The signal transmission system as described in claim 6, wherein the hollow tube comprises polyethylene (PE 10), polytetrafluoroethylene (PTFE), polyimide (PI), or a combination thereof.

8. The signal transmission system as described in claim 1, wherein the second temperature is between 1 K and 4 K.

9. The signal transmission system as described in claim 1, wherein the first temperature is between 273 K and 313 K.

10. The signal transmission system as described in claim 1, wherein the first temperature is between 4 K and 10 K.

11. A signal transmission system, comprising: A control module is at a first temperature; a first signal conversion module is connected to the control module; A plastic waveguide unit is connected to the first signal conversion module and is located at a second temperature; a second signal conversion module is connected to the plastic waveguide unit; and a qubit is connected to the second signal conversion module and is located at the second temperature, wherein the first and second signal conversion modules are used to convert signals between the plastic waveguide unit and the qubit, wherein the first temperature is greater than the second temperature, wherein the first signal conversion module further includes a first mixer unit and a first switching unit, wherein the first mixer unit is located at a third temperature and the first switching unit is located at the second temperature, wherein the third temperature is between the first and second temperatures.

12. The signal transmission system as claimed in claim 11, wherein the first temperature is between 273 K and 313 K, and the third temperature is between 4 K and 10 K.

13. The signal transmission system as claimed in claim 1, wherein the second signal conversion module further includes a second switching unit and a second mixing unit, wherein the second mixing unit and the second switching unit are at the second temperature.

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