Electronic devices based on wafer on wafer packaging technology

Abstract

An electronic device based on wafer stacking and wafer packaging technology includes a first circuit layer, a second circuit layer, and a waveguide connector. The first circuit layer includes a first photoelectric conversion device for transmitting or receiving optical signals. The second circuit layer includes a second photoelectric conversion device, stacked on top of the first circuit layer. The second photoelectric conversion device is used to transmit or receive the optical signals. The waveguide connector is disposed between the first and second circuit layers and is used to transmit the optical signals. Therefore, different circuit layers in the electronic device can achieve high-speed data transmission using optical signals, reducing the number of connectors required for data transmission and thus lowering the manufacturing cost and operating power consumption of the electronic device.

Claims

1. An electronic device based on wafer stacking wafer packaging technology, the electronic device comprising: A first circuit layer includes a first circuit block and a first photoelectric conversion device, the first photoelectric conversion device being used to transmit or receive an optical signal; A second circuit layer, including a second circuit block and a second photoelectric conversion device, is stacked on the first circuit layer and connected to the first circuit layer by a connecting post. The second photoelectric conversion device is used to transmit or receive the optical signal. A waveguide connector is disposed between the first circuit layer and the second circuit layer. The waveguide connector transmits the optical signal along a first direction, which is horizontal to the stacking direction of the first circuit layer and the second circuit layer.

2. The electronic device as claimed in claim 1, wherein, The first photoelectric conversion device and the second photoelectric conversion device emit or receive the optical signal in the first direction.

3. The electronic device as claimed in claim 1, wherein, The first photoelectric conversion device and the second photoelectric conversion device emit or receive the optical signal in a second direction, which is perpendicular to the first direction.

4. The electronic device as claimed in claim 1, wherein, The electronic device includes: a first optical waveguide element connected to the waveguide connector and the first photoelectric conversion device; and a second optical waveguide element connected to the waveguide connector and the second photoelectric conversion device; wherein the first optical waveguide element, the waveguide connector and the second optical waveguide element form an optical channel for transmitting the optical signal along the first direction.

5. The electronic device as claimed in claim 1, wherein, The electronic device includes: a first optical waveguide element connected to the waveguide connector and the first photoelectric conversion device; and a second optical waveguide element connected to the waveguide connector and the second photoelectric conversion device; wherein the first optical waveguide element, the waveguide connector and the second optical waveguide element form a U-shaped optical channel.

6. The electronic device as claimed in claim 5, wherein, A portion of the first optical waveguide element and the first photoelectric conversion device are located in the same sublayer of the first circuit layer, and a portion of the second optical waveguide element and the second photoelectric conversion device are located in the same sublayer of the second circuit layer.

7. The electronic device as claimed in claim 5, wherein, The first optical waveguide element and the first photoelectric conversion device are located in different sub-layers of the first circuit layer, and the second optical waveguide element and the second photoelectric conversion device are located in different sub-layers of the second circuit layer.

8. The electronic device as claimed in claim 1, wherein, The vertical projection of the waveguide connector on the first circuit layer or the second circuit layer may or may not overlap with the vertical projection of the first photoelectric conversion device and the second photoelectric conversion device on the first circuit layer or the second circuit layer.

9. The electronic device as claimed in claim 1, wherein, The first circuit block and the first photoelectric conversion device are located in the same sub-layer of the first circuit layer, and the second circuit block and the second photoelectric conversion device are located in the same sub-layer of the second circuit layer.

10. The electronic device as claimed in claim 1, wherein, The first circuit block and part of the first photoelectric conversion device are located in different sub-layers of the first circuit layer, and the second circuit block and part of the second photoelectric conversion device are located in different sub-layers of the second circuit layer.

11. The electronic device as claimed in claim 1, wherein, The electronic device includes a photoelectric transmission layer located between the first circuit layer and the second circuit layer, and connected to the first circuit layer and the second circuit layer through a plurality of electrical connectors.

12. The electronic device as claimed in claim 11, wherein, A portion of the first photoelectric conversion device and a portion of the second photoelectric conversion device are disposed on the photoelectric transmission layer, and a portion of the first photoelectric conversion device and a portion of the second photoelectric conversion device are connected through an internal optical waveguide connector.

13. The electronic device as claimed in claim 1, wherein, The electronic device further includes: a plurality of waveguide connectors and a plurality of electrical connectors; a first optoelectronic transmission layer stacked on the first circuit layer and connected to the first circuit layer through the electrical connectors; a waveguide connection layer stacked on the first optoelectronic transmission layer and connected to the first optoelectronic transmission layer through the waveguide connectors; and a second optoelectronic transmission layer stacked on the waveguide connection layer and connected to the waveguide connection layer through the waveguide connectors and connected to the second circuit layer through the electrical connectors.

14. The electronic device as claimed in claim 13, wherein, A portion of the first photoelectric conversion device is disposed on the first photoelectric transmission layer, and a portion of the second photoelectric conversion device is disposed on the second photoelectric transmission layer.

Images