Circuit board and method for manufacturing the same

Abstract

A circuit board and a method for manufacturing the same. The circuit board includes two circuit structure substrates. Each of the two circuit structure substrates includes a glass plate, a plurality of conductive pillars, two redistribution layers, an insulating connection layer, and a metal pattern layer. The glass plate has an upper surface, a lower surface opposite to the upper surface, and a plurality of through holes. The two redistribution layers are respectively disposed on the upper and lower surfaces. The insulating connection layer is disposed on one of the two redistribution layers. The metal pattern layer is disposed within the insulating connection layer, wherein the insulating connection layers of the two circuit structure substrates are interconnected, and the metal pattern layers of the two circuit structure substrates are interconnected. The interconnected metal pattern layers form a plurality of conductive elements, and the plurality of conductive elements penetrate the insulating connection layers in the two circuit structure substrates and connect adjacent redistribution layers.

Claims

1. A circuit board, comprising: Two circuit structure substrates, each comprising: a glass plate having an upper surface, a lower surface opposite to the upper surface, and a plurality of through holes, wherein each of the through holes extends from the upper surface to the lower surface; a plurality of conductive pillars formed within the plurality of through holes; two redistribution layers disposed on the upper surface and the lower surface, respectively; an insulating connection layer disposed on one of the two redistribution layers; and a metal pattern layer disposed within the insulating connection layer, wherein the insulating connection layers of the two circuit structure substrates are interconnected, and the metal pattern layers of the two circuit structure substrates are interconnected; wherein the interconnected metal pattern layers form a plurality of conductive elements, and the plurality of conductive elements penetrate the insulating connection layers in the two circuit structure substrates and connect adjacent redistribution layers; a first interface existing between the two insulating connection layers; and a second interface existing between the two metal pattern layers.

2. The circuit board as described in claim 1, wherein the first interface and the second interface are coplanar.

3. The circuit board as claimed in claim 1, wherein each of the conductive elements comprises: The first column; A second column is connected to the first column, wherein at least one of the conductive elements is not coaxial between the first column and the second column.

4. The circuit board as described in claim 1, wherein the thickness of the redistribution layer is less than or equal to 100 micrometers.

5. The circuit board as claimed in claim 1, wherein the distance between the two adjacent glass plates of the two circuit structure substrates is less than or equal to 200 micrometers.

6. A method for manufacturing a circuit board, comprising: Forming at least two circuit structure substrates, each of the at least two circuit structure substrates comprising the following steps: providing a glass plate having an upper surface and a lower surface opposite to the upper surface; forming a plurality of through holes in the glass plate, wherein each of the through holes extends from the upper surface to the lower surface; forming a plurality of conductive pillars in the plurality of through holes; disposing two redistribution layers on the upper surface and the lower surface respectively; disposing an insulating connection layer in one of the two redistribution layers; and disposing a metal pattern layer in the insulating connection layer; surface-treating the insulating connection layer; after surface-treating the insulating connection layers of the plurality of circuit structure substrates, connecting the insulating connection layers of the two circuit structure substrates; and connecting the metal pattern layer of the two circuit structure substrates to form a plurality of conductive elements, wherein the plurality of conductive elements penetrate the insulating connection layers in the two circuit structure substrates and connect adjacent redistribution layers; wherein a first interface exists between two insulating connection layers; and wherein a second interface exists between two metal pattern layers.

7. A method for manufacturing a circuit board as described in claim 6, wherein the step of forming the metal pattern layer includes: The insulating connection layer is pressed onto the redistribution layer; Graphical representation of the insulating connection layer; After the insulating connection layer is graphically represented, a sublayer is formed on the insulating connection layer; Electroplating a metal layer onto the seed layer; and planarizing the metal layer until the insulating bonding layer is exposed.

8. A method for manufacturing a circuit board as claimed in claim 6, wherein the step of surface treatment on the insulating interconnect layer is ion bombardment of the insulating interconnect layer.

9. A method for manufacturing a circuit board as described in claim 6, wherein the step of connecting the metal patterned layers of the two circuit structure substrates includes: The two adjacent metal pattern layers of the two circuit structure substrates are heated.

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