Wafer Parallel Testing System with Contact Device

TWI942325BActive Publication Date: 2026-10-11UNITEST INC
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Patent Information

Application Number
TW114121849
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2025-05-13
Filing Date
2025-06-11
Publication Date
2026-10-11
Estimated Expiration
2045-06-10

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Abstract

This invention relates to a wafer parallel testing system with a contact device that functions as an interface for performing parallel testing of wafers. The system includes: a contact device having a carrier platform; a first ZIF connector is provided on the lower surface of the carrier platform; the connector is movable upwards or downwards, and when movable downwards, it can be electrically connected to a cassette containing wafers. The contact device can form a cable system for transmitting electrical signals from a tester to the cassette when electrically connected, to inspect the wafers for good and defective products.
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Claims

1. A wafer parallel testing system, comprising: a contact device having a carrier platform, the lower surface of the carrier platform having a first ZIF connector capable of moving upward or downward, and when moving downward, being electrically connected to a cassette containing wafers; the contact device may constitute a cable system for transmitting electrical signals of a tester to the cassette when electrically connected to it, to inspect the good and defective wafers; the contact device includes a plurality of up-and-down drive units disposed at a corner of the carrier platform for moving the upper or lower side of the carrier platform or fixing the position of the carrier platform, and the plurality of up-and-down drive units moving the carrier platform upward or downward according to an applied air pressure signal, but fixing the position of the carrier platform when the supplied air pressure is cut off.

2. A wafer parallel testing system, comprising: a contact device having a carrier stage, the lower surface of the carrier stage having a first ZIF connector, the connector being movable upwards or downwards, and when movable downwards, being electrically connected to a cassette containing wafers; the contact device being configured as a cable system for transmitting electrical signals of a tester to the cassette when electrically connected to it, to inspect the good and defective wafers; the contact device having a contact mechanism for arranging the first ZIF connector in a circular shape at the center of the carrier stage, and the contact mechanism including a plurality of locking / unlocking actuators respectively disposed on each side of the carrier stage and connected to the first ZIF connector to drive the latch of the first ZIF connector to a locked state or an unlocked state.

3. As in request item 2, a wafer parallel testing system, wherein, When the first ZIF connector moves below the support platform, it is electrically connected to the second ZIF connector, which is arranged in a circular shape on the periphery of the interface plate of the cartridge.

4. As in request item 2, a wafer parallel testing system, wherein, When the contact device moves downward, the latch of the first ZIF connector is driven to the locked state according to the applied air pressure signal, so that the first ZIF connector and the second ZIF connector are electrically connected. After the wafer test is completed, if the supplied air pressure is cut off, the latch of the first ZIF connector in the locked state is driven to the unlocked state, thereby releasing the electrical connection between the first ZIF connector and the second ZIF connector.

5. A wafer parallel testing system, comprising: a contact device having a carrier platform, the lower surface of which has a first ZIF connector, the connector being movable upwards or downwards, and when movable downwards, being electrically connected to a cassette containing wafers; the contact device may constitute a cable system for transmitting electrical signals of a tester to the cassette when electrically connected to it, to inspect the good and defective wafers; the contact device includes a guide pin configured to divide the first ZIF connector into a plurality of connectors to correct vertical and horizontal alignment errors of the first ZIF connector when the contact device is electrically connected to the cassette.

Citation Information

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