Heat dissipation device and electronic equipment

Abstract

This invention provides a heat dissipation device and an electronic device. The heat dissipation module of the heat dissipation device includes at least two first liquid cooling plates arranged side by side and connected in series. Each first liquid cooling plate includes a liquid cooling channel with an inlet and an outlet. The inlet of the first liquid cooling plate at one end is connected to a first liquid inlet pipe, and the outlet or inlet of the first liquid cooling plate at the other end is connected to a first liquid return pipe. Among the remaining outlets and inlets, adjacent outlets and adjacent inlets are interconnected through staggered connecting pipes. The staggered series connection of adjacent first liquid cooling plates through connecting pipes in the heat dissipation device increases the bending radius and operability of the connecting pipes, reduces water flow resistance, and improves heat dissipation capacity.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, and more specifically to a heat dissipation device and an electronic device. Prior Technology

[0002] With the continued growth in demand for high-density, high-performance optical modules in data centers and high-performance computing, heat dissipation has become one of the key factors restricting equipment performance. Traditional air cooling methods are inadequate for high-power-density optical modules, while liquid cooling, with its superior heat dissipation effect, is gradually becoming the mainstream trend in the industry. However, in practical applications, especially in high-density installation environments, multiple liquid cooling plates for multiple optical modules usually need to be installed side by side and closely spaced to maximize chassis space utilization.

[0003] Currently, the common practice is to connect adjacent liquid cooling plates by connecting their inlet and outlet ports in series through a connecting pipe. Due to the small size of the optical module itself, and in order to save space, the inlet and outlet ports of its liquid cooling plates are usually designed to be quite compact. This results in a very small bending radius of the connecting pipe between adjacent liquid cooling plates. This not only increases the difficulty of installing the connecting pipe, but also increases the water flow resistance due to the excessively sharp bending angle, affecting the cooling effect and even posing a risk of damage to the connecting pipe. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a heat dissipation device and an electronic device, which increase the bending radius and operability of the connecting pipes by means of staggered series connection, reduce water flow resistance, and improve heat dissipation capacity.

[0005] In a first aspect, embodiments of the present invention provide a heat dissipation device, which includes at least one heat dissipation module. The heat dissipation module includes at least two first liquid cooling plates arranged side by side and connected in series. Each first liquid cooling plate includes a liquid cooling channel having an inlet and an outlet. The inlet and the outlet are disposed on a first side surface of the first liquid cooling plate and are respectively close to the two side edges. The inlet and outlet of two adjacent first liquid cooling plates are arranged adjacent to each other. The liquid inlet of the first liquid cooling plate at one end is connected to a first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate at the other end is connected to a first liquid return pipe. All the other liquid outlets and liquid inlets are connected alternately through a connecting pipe between adjacent liquid outlets and between adjacent liquid inlets.

[0006] Optionally, the heat dissipation module includes an even number of first liquid cooling plates. The liquid inlets of the two first liquid cooling plates located at both ends are respectively connected to the first liquid inlet pipe and the first liquid return pipe. Among the remaining liquid outlets and liquid inlets, adjacent two liquid outlets and adjacent two liquid inlets are respectively connected to each other through the connecting pipe.

[0007] Optionally, the heat dissipation module includes an odd number of first liquid cooling plates. The liquid inlet of the first liquid cooling plate at one end is connected to the first liquid inlet pipe, and the liquid outlet of the first liquid cooling plate at the other end is connected to the first liquid return pipe. Among the remaining liquid outlets and liquid inlets, adjacent two liquid outlets and adjacent two liquid inlets are respectively connected alternately through the connecting pipe.

[0008] Optionally, the inlet is equipped with an inlet connector, the outlet is equipped with an outlet connector, and the inlet connector and the outlet connector are respectively connected to the first inlet pipe, the first return pipe, or the connecting pipe.

[0009] Optionally, a first connecting block is installed on the outside of the liquid inlet. The first connecting block is provided with a first mounting through hole. A first guiding channel is formed between the first connecting block and the first liquid cooling plate. The first mounting through hole and the liquid inlet are respectively connected to the two end openings of the first guiding channel, and the first mounting through hole and the liquid inlet are offset from each other and not opposite each other. A second connecting block is installed on the outside of the liquid outlet. The second connecting block is provided with a second mounting through hole. A second guiding channel is formed between the second connecting block and the first liquid cooling plate. The second mounting through hole and the liquid outlet are respectively connected to the two ends of the second guiding channel, and the second mounting through hole and the liquid outlet are offset from each other and not opposite each other.

[0010] Optionally, the first guide channel and the second guide channel extend along the height direction or along the length direction, the first mounting through hole and the liquid inlet are offset from each other along the height direction or along the length direction and are not opposite each other, and the second mounting through hole and the liquid outlet are offset from each other along the height direction or along the length direction and are not opposite each other.

[0011] Optionally, the first guide channel and the second guide channel are L-shaped channels or inclined extended channels, the first mounting through hole and the liquid inlet are obliquely offset and not opposite to each other, and the second mounting through hole and the liquid outlet are obliquely offset and not opposite to each other.

[0012] Optionally, the first liquid cooling plate is provided with a first fluid groove, which is located outside the liquid inlet and is connected to one end of the first fluid groove. The first connecting block is provided with a second fluid groove, which is located on one side of the first mounting through hole and is connected to the first mounting through hole. The first fluid groove and the second fluid groove are engaged to form the first guide channel. The first liquid cooling plate is provided with a third fluid groove, which is located outside the liquid outlet and is connected to one end of the liquid outlet. The second connecting block is provided with a fourth fluid groove, which is located on one side of the second mounting through hole and is connected to one end of the second mounting through hole. The third fluid groove and the fourth fluid groove are engaged to form the second guide channel.

[0013] Optionally, the heat dissipation device includes multiple sets of heat dissipation modules arranged side by side. The first inlet pipe and the first return pipe of the multiple sets of heat dissipation modules are respectively connected to a coolant distribution unit through a first distributor and a second distributor to form multiple parallel first coolant circuits.

[0014] Optionally, the heat dissipation device further includes a second liquid cooling plate, a second liquid inlet pipe and a second liquid return pipe of the second liquid cooling plate are respectively connected to the coolant distribution unit through the first liquid distributor and the second liquid distributor to form a second coolant circuit, and the second coolant circuit is arranged in parallel with the first coolant circuit.

[0015] Optionally, a main inlet pipe is connected between the first distributor and the coolant distribution unit, and a main return pipe is connected between the second distributor and the coolant distribution unit.

[0016] Secondly, embodiments of the present invention provide an electronic device, which includes a chassis and a heat dissipation device as described in the first aspect. At least two optical module groups are disposed inside the chassis, and the first liquid cooling plate is connected to the optical module groups in a one-to-one correspondence.

[0017] Optionally, the heat dissipation device further includes a second liquid cooling plate arranged in parallel with the circuit of the heat dissipation module, and the electronic device further includes an electronic component, the second liquid cooling plate being connected to the electronic component.

[0018] Optionally, the electronic device further includes a shielding cage and a heat sink fastening structure disposed above the shielding cage. The heat sink fastening structure includes a first fastening member and a second fastening member that are fastened together to form a receiving space. The first fastening member is engaged with the shielding cage. The first liquid cooling plate is installed in the receiving space, and the optical module assembly is installed in the shielding cage.

[0019] The heat dissipation device of this invention includes a heat dissipation module comprising at least two first liquid cooling plates arranged side-by-side and connected in series. Each first liquid cooling plate includes a liquid cooling channel with an inlet and an outlet. The inlet of one end of the first liquid cooling plate is connected to a first liquid inlet pipe, and the outlet or inlet of the other end of the first liquid cooling plate is connected to a first liquid return pipe. All other outlets and inlets are interconnected via connecting pipes. This method of interconnecting adjacent first liquid cooling plates via connecting pipes increases the bending radius and operability of the connecting pipes, reduces water flow resistance, and improves heat dissipation capacity. Simple Explanation of the Diagram

[0020] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the figures, in which: Figure 1 is a schematic diagram of the heat dissipation device according to an embodiment of the present invention; Figure 2 is a schematic diagram of the connection between the first liquid cooling plate, the liquid inlet connector, and the liquid outlet connector according to an embodiment of the present invention; Figure 3 is a schematic diagram of the connection between the first liquid cooling plate, the first connecting block, and the second connecting block according to another embodiment of the present invention; Figure 4 is a schematic diagram of the heat dissipation device according to another embodiment of the present invention; Figure 5 is a schematic diagram of the structure of the first liquid cooling plate according to another embodiment of the present invention; Figure 6 is a schematic diagram of the structure of the first connecting block according to another embodiment of the present invention; Figure 7 is a schematic diagram of the structure of the second connecting block according to another embodiment of the present invention; Figure 8 is a cross-sectional view of the connection between the first liquid cooling plate, the first connecting block, and the second connecting block according to another embodiment of the present invention; Figure 9 is a schematic diagram of the heat dissipation device according to another embodiment of the present invention; Figure 10 is a schematic diagram of the structure of the first liquid cooling plate according to another embodiment of the present invention; Figure 11 is a schematic diagram of the structure of the first connecting block according to another embodiment of the present invention; Figure 12 is a schematic diagram of the structure of the second connecting block according to another embodiment of the present invention; Figure 13 is a cross-sectional view of the connection between the first liquid cooling plate, the first connecting block, and the second connecting block according to another embodiment of the present invention; Figure 14 is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention. Implementation

[0021] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art to which this application pertains will fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0022] Furthermore, those skilled in the art to which this application pertains should understand that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0023] Unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixation" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art to which this application pertains can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0025] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0026] Figure 1 is a schematic diagram of the heat dissipation device according to an embodiment of this application. As shown in Figure 1, the heat dissipation device includes at least one set of heat dissipation modules 100. Each set of heat dissipation modules 100 includes at least two first liquid cooling plates 1 arranged side by side. All the first liquid cooling plates 1 in each set of heat dissipation modules 100 are connected in series. Each first liquid cooling plate 1 includes a liquid cooling channel 13 with an inlet 11 and an outlet 12. The inlet 11 and the outlet 12 are located on the first side surface of the first liquid cooling plate 1 and are close to the two side edges, respectively. The first side surface refers to the side surface of the first liquid cooling plate 1 along the width direction. Since all the first liquid cooling plates 1 are arranged side by side, the inlet 11 and outlet 12 in each set of heat dissipation modules 100 are arranged in an alternating sequence, that is, starting from one side, the sequence is inlet 11, outlet 12, inlet 11, outlet 12. This makes the inlet 11 of one first liquid cooling plate 1 and the outlet 12 of another first liquid cooling plate 1 adjacent to each other, with a short distance between them.

[0027] As shown in Figure 1, in each heat dissipation module 100, the liquid inlet 11 of the first liquid cooling plate 1 at one end is connected to the first liquid inlet pipe 2, and the liquid outlet 12 or liquid inlet 11 of the first liquid cooling plate 1 at the other end is connected to the first liquid return pipe 3. In the remaining liquid outlets 12 and liquid inlets 11 of the heat dissipation module 100, adjacent liquid outlets 12 and adjacent liquid inlets 11 are connected in an alternating manner through connecting pipes 4, i.e., staggered series connection. The staggered connection and staggered series connection mean that there is one liquid inlet 11 between two non-adjacent liquid outlets 12 connected at both ends of the connecting pipe 4, or one liquid outlet 12 between two non-adjacent liquid inlets 11. This staggered series connection method between adjacent first liquid cooling plates 1 in each heat dissipation module 100 increases the bending radius of the connecting pipe 4, reduces the installation difficulty of the connecting pipe 4 and the first liquid cooling plate 1, reduces water flow resistance, and improves the cooling effect.

[0028] The port where the first liquid cooling plate 1 at the other end connects to the first return pipe 3 depends on the number of first liquid cooling plates 1 in each heat dissipation module 100. Specifically, when the heat dissipation module 100 includes an even number of first liquid cooling plates 1, the first inlet pipe 2 and the first return pipe 3 are respectively connected to the inlet ports 11 of the two first liquid cooling plates 1 at both ends. Among all the remaining outlet ports 12 and inlet ports 11, adjacent outlet ports 12 and adjacent inlet ports 11 are alternately connected through a connecting pipe 4, as shown in Figure 1. When the heat dissipation module 100 includes an odd number of first liquid cooling plates 1, the inlet port 11 of the first liquid cooling plate 1 at one end is connected to the first inlet pipe 2, and the outlet port 12 of the first liquid cooling plate 1 at the other end is connected to the first return pipe 3. Among all the remaining outlet ports 12 and inlet ports 11, adjacent outlet ports 12 and adjacent inlet ports 11 are alternately connected through a connecting pipe 4, as shown in Figure 1.

[0029] In this embodiment, the heat dissipation device may include multiple heat dissipation modules 100, in which the first liquid cooling plates 1 are connected in an alternating series manner to form a circuit. The first liquid inlet pipe 2 and the first liquid return pipe 3 of the multiple heat dissipation modules 100 are respectively connected to the coolant distribution unit 200 through the first liquid distributor 9 and the second liquid distributor 10 to form multiple parallel first coolant circuits, as shown in Figure 1. A main liquid inlet pipe 103 connects the first liquid distributor 9 and the coolant distribution unit 200, and a main liquid return pipe 104 connects the second liquid distributor 10 and the coolant distribution unit 200, as shown in Figure 1.

[0030] The first distributor 9 and the second distributor 10 have multiple inlet and outlet ports. They are used to divide the coolant into multiple parallel loops. The parallel arrangement of multiple first coolant loops means that in the liquid cooling system, multiple first coolant loops are independently connected to the same coolant distribution unit 200. Each first coolant loop can be cooled independently, unaffected by other loops, effectively improving heat dissipation efficiency. In an optional embodiment, the main inlet pipe 103 and the main return pipe 104 can be connected to the coolant distribution unit 200 via quick-connect couplings. These quick-connect couplings allow for plug-and-play connection to the coolant distribution unit 200, making the installation of the heat dissipation device more convenient.

[0031] In this embodiment, the number of first liquid cooling plates 1 in each heat dissipation module 100 can be the same or different. The number of heat dissipation modules 100 and the number of first liquid cooling plates 1 in each heat dissipation module 100 are determined according to the specifications of the optical module product. In this embodiment, "multiple groups" and "more than" both refer to two or more. Preferably, multiple heat dissipation modules 100 are arranged side by side inside the electronic device. Side by side arrangement means that they are arranged in the same direction inside an electronic device or on a panel to achieve high-density installation and efficient management, which helps to optimize the space utilization inside the device and facilitates later maintenance and upgrades. In addition, multiple heat dissipation modules 100 can also be set in corresponding positions according to specific needs.

[0032] As shown in Figure 1, the heat dissipation device may further include a second liquid cooling plate 105. The second liquid cooling plate 105 may also be connected to the coolant distribution unit 200 through the first distributor 9 and the second distributor 10 to form a second coolant circuit. The second coolant circuit is arranged in parallel with the first coolant circuit, which can improve heat dissipation efficiency. Specifically, the first distributor 9 and the second liquid cooling plate 105 are connected through the second inlet pipe 101, and the second distributor 10 and the second liquid cooling plate 105 are connected through the second return pipe 102. The coolant flows out of the coolant distribution unit 200, through the main inlet pipe 103 and the first distributor 9, into the second inlet pipe 101, flows into the second liquid cooling plate 105, then flows out of the second liquid cooling plate 105, through the second return pipe 102 to the second distributor 10, and then returns to the coolant distribution unit 200 through the main return pipe 104.

[0033] In one embodiment, the inlet 11 of the first liquid cooling plate 1 is equipped with an inlet connector 5, and the outlet 12 is equipped with an outlet connector 6, as shown in Figure 2. The inlet connector 5 and the outlet connector 6 are directly connected to the first inlet pipe 2, the first return pipe 3, or the connecting pipe 4, respectively. The inlet connector 5 and the outlet connector 6 do not change the flow direction of the coolant. They ensure that the connection between the pipeline and the first liquid cooling plate 1 is both quick and reliable, while preventing leakage and ensuring long-term stable operation of the system. Common types of inlet connectors 5 and 6 include quick-connect couplings, threaded couplings, compression fittings, crimp couplings, and flange couplings. The selection of the couplings depends on the coolant type, operating pressure, temperature range, connection frequency, etc. The second liquid cooling plate 105, the first distributor 9, the second distributor 10, etc., can also be connected to the pipeline through the aforementioned couplings.

[0034] In another embodiment, a first connecting block 7 is installed outside the liquid inlet 11 of the first liquid cooling plate 1, and a second connecting block 8 is installed at the liquid outlet 12 of the first liquid cooling plate 1, as shown in Figures 3, 4, and 9. The first connecting block 7 has a first mounting through hole 71, and the second connecting block 8 has a second mounting through hole 81, as shown in Figures 3, 11, and 12. After the first connecting block 7 is connected to the outside of the liquid inlet 11 of the first liquid cooling plate 1, a first guiding channel 7a is formed between the first connecting block 7 and the first liquid cooling plate 1. The first mounting through hole 71 and the liquid inlet 11 are respectively connected to the openings at both ends of the first guiding channel 7a, so that the first mounting through hole 71 and the liquid inlet 11 are staggered and not opposite, as shown in Figure 8. Preferably, the first mounting through hole 71 and the liquid inlet 11 are respectively perpendicularly connected to the first guiding channel 7a. The first mounting through hole 71 is connected to a corresponding pipeline, which can be connected through a connector. After the second connecting block 8 is connected to the outside of the outlet 12 of the first liquid cooling plate 1, a second guiding channel 8a is formed between the second connecting block 8 and the first liquid cooling plate 1. The second mounting through hole 81 and the outlet 12 are respectively connected to the openings at both ends of the second guiding channel 8a, so that the second mounting through hole 81 and the outlet 12 are staggered and not opposite, as shown in Figure 8. Preferably, the second mounting through hole 81 and the outlet 12 are respectively perpendicularly connected to the second guiding channel 8a. The second mounting through hole 81 is connected to the corresponding pipeline, which can be connected through a connector. The first guiding channel 7a and the second guiding channel 8a are smooth channels to reduce the water flow resistance of the coolant, and their smoothness can be set according to requirements.

[0035] Specifically, "the first mounting through hole 71 and the liquid inlet 11 are offset and not opposite" means that the first mounting through hole 71 and the liquid inlet 11 can be offset in the vertical direction (i.e., the height direction / up and down) and / or in the horizontal direction (i.e., the length direction / left and right), so that they are not opposite each other. "The second mounting through hole 81 and the liquid outlet 12 are offset and not opposite" means that the second mounting through hole 81 and the liquid outlet 12 can be offset in the vertical direction (i.e., the height direction / up and down) and / or in the horizontal direction (i.e., the length direction / left and right), so that they are not opposite each other.

[0036] In this embodiment, the first liquid cooling plate 1 is provided with a first fluid groove 14, which is located outside the liquid inlet 11 and is connected to one end of the first fluid groove 14. The first liquid cooling plate 1 is provided with a third fluid groove 15, which is located outside the liquid outlet 12 and is connected to one end of the third fluid groove 15, as shown in Figures 5 and 10. The first connecting block 7 is provided with a second fluid groove 72, which is located on one side of the first mounting through hole 71 and is connected to one end of the first mounting through hole 71, as shown in Figures 6 and 11. The second connecting block 8 is provided with a fourth fluid groove 82, which is located on one side of the second mounting through hole 81 and is connected to one end of the second mounting through hole 81, as shown in Figures 7 and 12. The first fluid groove 14 and the second fluid groove 72 are completely symmetrical, as are the third fluid groove 15 and the fourth fluid groove 82. After the first connecting block 7, the second connecting block 8, and the first liquid cooling plate 1 are connected, the first fluid groove 14 and the second fluid groove 72 engage to form the first guide channel 7a, and the third fluid groove 15 and the fourth fluid groove 82 engage to form the second guide channel 8a, as shown in Figures 8 and 13. The above-mentioned formation of the first guide channel 7a and the second guide channel 8a facilitates processing and operation.

[0037] In one embodiment, the first guide channel 7a and the second guide channel 8a extend along the height direction or along the length direction, which causes the first mounting through hole 71 and the liquid inlet 11 to be staggered and not opposite each other along the height direction or along the length direction (horizontal direction), and the second mounting through hole 81 and the liquid outlet 12 to be staggered and not opposite each other along the height direction or along the length direction. Figures 10-12 are schematic diagrams of the structure of the first liquid cooling plate 1, the first connecting block 7, and the second connecting block 8, respectively, wherein the first fluid groove 14, the third fluid groove 15, the second fluid groove 72, and the fourth fluid groove 82 extend along the height direction. Figure 13 is a schematic diagram of the first guide channel 7a and the second guide channel 8a extending along the height direction, wherein the first mounting through hole 71 and the liquid inlet 11 are staggered along the height direction. The structure of the first guide channel 7a and the second guide channel 8a extending along the length direction is not shown, but the arrangement is basically similar to that of the above embodiment. The first mounting through hole 71 and liquid inlet 11, and the second mounting through hole 81 and liquid outlet 12 are offset along the length direction or along the height direction, depending on the space in front of the first liquid cooling plate 1.

[0038] In another embodiment, the first guide channel 7a and the second guide channel 8a are L-shaped channels or inclined extending channels, which makes the first mounting through hole 71 and the liquid inlet 11 obliquely offset and not opposite, and the second mounting through hole 81 and the liquid outlet 12 obliquely offset and not opposite. Oblique offset and not opposite includes oblique upward offset or oblique downward offset, which means that the two are simultaneously offset in the height direction and the horizontal direction. Among them, the oblique offset and not opposite method can meet the installation space requirements. Figures 5-7 are schematic diagrams of the structure of the first liquid cooling plate 1, the first connecting block 7, and the second connecting block 8, respectively, wherein the first fluid groove 14, the third fluid groove 15, the second fluid groove 72, and the fourth fluid groove 82 are L-shaped grooves, and their two ends are offset in both the height direction and the length direction.

[0039] In the heat dissipation device of this application embodiment, the heat dissipation module includes at least two first liquid cooling plates arranged side by side and connected in series. The liquid inlet of the first liquid cooling plate at one end is connected to the first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate at the other end is connected to the first liquid return pipe. Among all the remaining liquid outlets and liquid inlets, adjacent two liquid outlets and adjacent two liquid inlets are connected by connecting pipes to achieve staggered hole connection, which increases the bending radius and operability of the connecting pipes, reduces water flow resistance, and improves heat dissipation capacity.

[0040] Figure 14 is a schematic diagram of the structure of an electronic device according to an embodiment of this application. The electronic device includes a chassis and a heat dissipation device as described in the above embodiment. Optical module groups are disposed within the chassis. Each optical module group may include multiple optical modules. The heat dissipation device can be installed inside the chassis to dissipate heat from the heat-generating components within the chassis. The number of first liquid cooling plates 1 in the heat dissipation device is the same as the number of optical module groups. One first liquid cooling plate 1 is connected above each optical module group, improving heat dissipation capacity through liquid cooling.

[0041] In one specific embodiment, multiple optical module groups can be arranged side-by-side at one end of the chassis, with corresponding first liquid cooling plates 1 installed side-by-side above each optical module group. This maximizes chassis space utilization and minimizes internal chassis temperature. Each optical module group is installed side-by-side within a corresponding shielding cage. The first liquid cooling plate 1 is connected to the top of the shielding cage via a heatsink fastening structure, thereby cooling the optical modules within the shielding cage. The heatsink fastening structure includes a first fastening member and a second fastening member that are connected vertically to form a receiving space. The first fastening member can also engage with the shielding cage. The first liquid cooling plate 1 is installed within the receiving space, forming a single unit for easy disassembly and installation.

[0042] The chassis also houses electronic components such as processors, chips, and circuit boards. A second liquid cooling plate 105 in the heat dissipation device is connected to the electronic components to cool them. In this application, the chassis is structured as a two-layer structure with partitions. The heat dissipation device can be located on the upper layer, making it smaller and thinner, allowing for easier installation in electronic devices with high-density electronic components, resulting in a thinner and smaller overall electronic device. The lower layer of the chassis can house a fan-based heat dissipation structure to cool other electronic components within the chassis.

[0043] In the heat dissipation device of the electronic device in this application embodiment, the adjacent first liquid cooling plates are connected in series through staggered holes of the connecting pipe, which increases the bending radius and operability of the connecting pipe, reduces water flow resistance, and improves heat dissipation capacity.

[0044] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0045] 100: Heat dissipation module 1: First liquid cooling plate 11: Liquid Inlet 12:Liquid outlet 13: Liquid cooling channel 14: First fluid groove 15: Third fluid groove 2: First inlet tube 3: First return pipe 4: Connecting pipe 5: Liquid inlet connector 6: Liquid outlet connector 7: First Connecting Component 71: First mounting through hole 72: Second fluid groove 7a: First Guiding Channel 8: Second Connecting Block 81: Second mounting through hole 82: Fourth fluid groove 8a: Second guidance channel 9: First separator 10: Second separator 101: Second inlet tube 102: Second return pipe 103: Main inlet pipe 104: Main return fluid pipe 105: Second liquid cooling plate 200: Coolant Distribution Unit

Claims

1. A heat dissipation device comprising at least one heat dissipation module (100), the heat dissipation module (100) comprising at least two first liquid cooling plates (1) arranged side by side and connected in series, each first liquid cooling plate (1) comprising a liquid cooling channel (13) having a liquid inlet (11) and a liquid outlet (12), the liquid inlet (11) and the liquid outlet (12) being disposed on a first side surface of the first liquid cooling plate (1) and respectively close to the two side edges, wherein the liquid inlet (11) and the liquid outlet (12) of two adjacent first liquid cooling plates (1) are arranged adjacent to each other; wherein, In the heat dissipation module (100), the inlet (11) of the first liquid cooling plate (1) at one end is connected to a first liquid inlet pipe (2), and the outlet (12) or inlet (11) of the first liquid cooling plate (1) at the other end is connected to a first return pipe (3). Among the remaining outlets (12) and inlets (11), adjacent outlets (12) and adjacent inlets (11) are connected alternately through a connecting pipe (4).

2. The heat dissipation device as claimed in claim 1, wherein, The heat dissipation module (100) includes an even number of first liquid cooling plates (1). The inlets (11) of the two first liquid cooling plates (1) located at both ends are connected to the first liquid inlet pipe (2) and the first liquid return pipe (3), respectively. Among the remaining outlets (12) and inlets (11), adjacent outlets (12) and adjacent inlets (11) are connected alternately through the connecting pipe (4).

3. The heat dissipation device as claimed in claim 1, wherein, The heat dissipation module (100) includes an odd number of first liquid cooling plates (1). The liquid inlet (11) of the first liquid cooling plate (1) at one end is connected to the first liquid inlet pipe (2), and the liquid outlet (12) of the first liquid cooling plate (1) at the other end is connected to the first liquid return pipe (3). Among the remaining liquid outlets (12) and liquid inlets (11), adjacent two liquid outlets (12) and adjacent two liquid inlets (11) are connected alternately through the connecting pipe (4).

4. The heat dissipation device as described in any one of claims 1 to 3, wherein, The inlet (11) is equipped with an inlet connector (5), and the outlet (12) is equipped with an outlet connector (6). The inlet connector (5) and the outlet connector (6) are respectively connected to the first inlet pipe (2), the first return pipe (3), or the connecting pipe (4).

5. The heat dissipation device as described in any one of claims 1 to 3, wherein, A first connecting block (7) is installed on the outside of the liquid inlet (11). The first connecting block (7) is provided with a first mounting through hole (71). A first guiding channel (7a) is formed between the first connecting block (7) and the first liquid cooling plate (1). The first mounting through hole (71) and the liquid inlet (11) are respectively connected to the openings at both ends of the first guiding channel (7a). The first mounting through hole (71) and the liquid inlet (11) are offset and not opposite to each other. A second connecting block (8) is installed on the outside of the liquid outlet (12). The second connecting block (8) is provided with a second mounting through hole (81). A second guiding channel (8a) is formed between the second connecting block (8) and the first liquid cooling plate (1). The second mounting through hole (81) and the liquid outlet (12) are respectively connected to the openings at both ends of the second guiding channel (8a). The second mounting through hole (81) and the liquid outlet (12) are offset and not opposite to each other.

6. The heat dissipation device as claimed in claim 5, wherein, The first guide channel (7a) and the second guide channel (8a) extend along the height direction or along the length direction. The first mounting through hole (71) and the liquid inlet (11) are offset from each other along the height direction or along the length direction. The second mounting through hole (81) and the liquid outlet (12) are offset from each other along the height direction or along the length direction.

7. The heat dissipation device as claimed in claim 5, wherein, The first guide channel (7a) and the second guide channel (8a) are L-shaped channels or inclined extended channels. The first mounting through hole (71) and the liquid inlet (11) are obliquely offset and not opposite to each other. The second mounting through hole (81) and the liquid outlet (12) are obliquely offset and not opposite to each other.

8. The heat dissipation device as claimed in claim 5, wherein, The first liquid cooling plate (1) is provided with a first fluid groove (14), which is located outside the liquid inlet (11) and is connected to one end of the first fluid groove (14). The first connecting block (7) is provided with a second fluid groove (72), which is located on one side of the first mounting through hole (71) and is connected to one end of the first mounting through hole (71). The first fluid groove (14) and the second fluid groove (72) are engaged to form the first guide channel (7a). The first liquid cooling plate (1) is provided with a third fluid groove (15), which is located outside the liquid outlet (12) and is connected to one end of the liquid outlet (12). The second connecting block (8) is provided with a fourth fluid groove (82), which is located on one side of the second mounting through hole (81) and is connected to one end of the second mounting through hole (81). The third fluid groove (15) and the fourth fluid groove (82) are engaged to form the second guide channel (8a).

9. The heat dissipation device as claimed in claim 1, wherein, The heat dissipation device includes multiple sets of heat dissipation modules (100) arranged side by side. The first liquid inlet pipe (2) and the first liquid return pipe (3) of the multiple sets of heat dissipation modules (100) are respectively connected to a coolant distribution unit (200) through a first liquid distributor (9) and a second liquid distributor (10) to form multiple parallel first coolant circuits.

10. The heat dissipation device as claimed in claim 9, wherein, The heat dissipation device also includes a second liquid cooling plate (105). A second liquid inlet pipe (101) and a second liquid return pipe (102) of the second liquid cooling plate (105) are respectively connected to the coolant distribution unit (200) through the first liquid distributor (9) and the second liquid distributor (10) to form a second coolant circuit. The second coolant circuit is arranged in parallel with the first coolant circuit.

11. The heat dissipation device as claimed in claim 10, wherein, A main inlet pipe (103) is connected between the first distributor (9) and the coolant distribution unit (200), and a main return pipe (104) is connected between the second distributor (10) and the coolant distribution unit (200).

12. An electronic device comprising a chassis and a heat dissipation device as claimed in any one of claims 1 to 11, wherein at least two optical module groups are disposed in the chassis, and the first liquid cooling plate (1) is connected to the optical module groups in a one-to-one correspondence.

13. The electronic device as claimed in claim 12, wherein, The heat dissipation device also includes a second liquid cooling plate (105) connected in parallel with the circuit of the heat dissipation module (100), and the electronic device also includes an electronic device, the second liquid cooling plate (105) being connected to the electronic device.

14. The electronic device as claimed in claim 12, wherein, The electronic device also includes a shielding cage (400) and a heat sink fastening structure (500) disposed above the shielding cage (400). The heat sink fastening structure (500) includes a first fastening member (501) and a second fastening member (502) that are fastened together to form a receiving space. The first fastening member (501) is engaged with the shielding cage (400). The first liquid cooling plate (1) is installed in the receiving space. The optical module assembly (300) is installed in the shielding cage (400).

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