Panel release system and method of operating the same

Abstract

This application discloses a release station for processing intermediate panel-carrier assemblies, a panel release system including the release station for processing intermediate panel-carrier assemblies, and a method of operating the panel release system. The release station may include a carrier platform having a surface for supporting the intermediate panel-carrier assembly and equipped with a carrier platform heater associated with the surface for heating the intermediate panel-carrier assembly to a release temperature. The release station may also include a release unit having a release head movable toward the surface of the carrier platform to contact a molded panel in the intermediate panel-carrier assembly located on the surface. The panel release system may further include a panel processing station, a carrier processing station, an unloading station, a preheating station, a feeding station, and / or a cutting station.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a panel release system and its operating method for processing intermediate panel-carrier assemblies (including molded panels and carriers). The panel release system includes a release station for releasing the molded panel from the carrier. Prior Technology

[0002] In panel-level packaging (PLP) processes, electronic components (such as chips, wafers, passive components, and metal components) are bonded to a first carrier and encapsulated into a molded panel on the first carrier during a first molding process. Subsequently, the molded panel containing the electronic components is released from the first carrier and flipped onto a second carrier to expose the active surfaces of the electronic components, thereby forming circuitry on these active surfaces. Finally, the molded panel and the circuitry formed thereon undergo a second molding process before being released from the second carrier.

[0003] Conventionally, during the process of releasing the molded panel from the carrier plate, the molded panel is usually released by means of heating or ultraviolet (UV) light irradiation, which are the two main methods for releasing the molded panel.

[0004] To release molded panels using ultraviolet (UV) light, a glass carrier plate is required. A UV release adhesive layer is applied to the glass carrier plate. Then, the components involved in the encapsulation, such as bare dies and / or silicon wafers and / or passive components and / or metal components, are arranged on the glass carrier plate through the UV release adhesive layer. Following this, an encapsulation process is performed to form a molding layer on the glass carrier plate to cover the components involved in the encapsulation, thus forming the molded panel. To release the molded panel, the back of the glass carrier plate is irradiated with UV light, causing the molded panel adhered to the glass carrier plate to separate from it. However, the UV release method is not ideal because glass is expensive and fragile. Furthermore, the use of a glass carrier plate limits its size, as large glass carrier plates are generally not feasible due to their fragile nature. Additionally, due to the fragile nature of glass, the use of a glass carrier plate during release and transfer requires some manual handling. For example, electrostatic discharge (ESD) can easily occur during the manual peeling and removal of the UV release adhesive layer, which can lead to significant product quality issues in the panel-level encapsulation process.

[0005] To release molded panels using heating, a heat-release adhesive layer is typically laminated onto a glass substrate. The components involved in the encapsulation are then arranged on the glass substrate through the heat-release adhesive layer, followed by an encapsulation process to form a molding compound on the glass substrate to cover the components, thus forming the molded panel. To release the molded panel, heat is applied to the glass substrate to separate it. However, directly applying heat to the glass substrate can damage it. Furthermore, heating can cause uncontrolled warping of the molded panel. In addition, similar to UV separation methods, the use of a glass substrate limits its size. Moreover, due to the fragile nature of glass, the use of a glass substrate during release and transfer requires some manual handling. For example, electrostatic discharge can easily occur during the manual peeling and removal of the UV release adhesive layer, which can lead to significant product quality issues in the panel-level encapsulation process.

[0006] Therefore, a more efficient panel release system and method are needed to solve the above problems, especially the problem of releasing the molded panel with circuitry from the second carrier after the second packaging process. Summary of the Invention

[0007] This application discloses a release station for processing an intermediate panel-carrier assembly. The release station includes a carrier platform and a release unit. The carrier platform includes a platform for supporting the intermediate panel-carrier assembly, wherein the intermediate panel-carrier assembly includes a molded panel attached to the carrier by a heat-release tape; and a carrier platform heater associated with the platform, capable of heating the intermediate panel-carrier assembly to a heat-release temperature of the heat-release tape when the intermediate panel-carrier assembly is supported on the platform. The release unit includes a release head movable toward the platform for engaging with the molded panel in the intermediate panel-carrier assembly located on the platform, wherein the release head further includes a release head retaining member that releasably retains the molded panel on an engagement surface of the release head when the molded panel has been separated from the carrier and engaged with the release head. Wherein, after the carrier stage heater has heated the intermediate panel-carrier assembly to the heat release temperature, and after the release head holding member has releasably held the molded panel on the mating surface of the release head, the release head can move away from the platform of the carrier stage, thereby separating the molded panel from the carrier, and the molded panel separated from the carrier is located on the mating surface of the release head, while the carrier with the heat release tape is held on the platform of the carrier stage.

[0008] This application also discloses a panel release system for processing intermediate panel-carrier assemblies. The panel release system includes: a release station as described in claim 1; a panel processing station for receiving a molded panel separated from the carrier from the release station; and a panel platform movable between the panel processing station and the release station. Wherein, when the panel platform is located within the release station and aligned with the release head of the release unit, the release head can release the molded panel separated from the carrier onto the panel platform; wherein, after the molded panel separated from the carrier is released onto the panel platform, the panel platform can move from the release station to the panel processing station, thereby transporting the molded panel separated from the carrier from the release station to the panel processing station; wherein, the panel processing station includes: a panel processing unit. The panel processing unit further includes: a panel processing head, which, when the panel platform is located at the panel processing station and holding the molded panel separated from the carrier, can move toward the panel platform for engaging the molded panel separated from the carrier. The panel processing head includes a panel processing head holding member. When the panel processing head moves to engage a molded panel separate from the carrier, the panel processing head can releasably hold the molded panel on the engagement surface of a panel processing head of the panel processing unit and remove the molded panel held by it from the panel table for removing the molded panel from the panel release system.

[0009] This application further discloses a method for operating the panel release system. The method includes: heating an intermediate panel-carrier assembly held on the surface of the carrier stage via a carrier stage heater associated with the surface of the carrier stage, wherein the intermediate panel-carrier assembly is heated to the release temperature of the heat-release tape; when the carrier stage is aligned with a release head in a release station, the release head of the release unit moves toward the surface of the carrier stage to contact the intermediate panel-carrier assembly located on the surface of the carrier stage, and temporarily holds the molded panel at the mating surface of the release head; after the carrier stage heater has heated the intermediate panel-carrier assembly to the heat release temperature, the release head that temporarily holds the molded panel moves away from the surface of the carrier stage, thereby separating the molded panel from the carrier and holding the separated molded panel at the mating surface of the release head, while the carrier remains on the surface of the carrier stage. Simple Explanation of the Diagram

[0010] According to several embodiments, Figures 1A and 1B schematically illustrate a panel release processing system and a release station therein. According to several embodiments, Figures 1C and 1D schematically illustrate a panel release system having the release station shown in Figure 1A, and a corresponding panel processing station and carrier processing station. According to several embodiments, FIG1E schematically shows a panel release system having an unloading station that can be connected to the carrier processing station in FIG1C and FIG1D. According to several embodiments, Figure 1F schematically shows that the unloading station in the panel release system is directly connected to the release station. According to several embodiments, Figures 1G to 1J schematically illustrate one operating mode of the tape removal tool. According to several embodiments, Figures 1K to 1N schematically illustrate another operating mode of the tape removal tool. According to several embodiments, Figures 10 and 1P schematically illustrate the operating mechanism of the tape removal tool. According to several embodiments, Figure 1Q schematically shows a panel release system having a preheating station connected to the release station. According to several embodiments, Figure 1R schematically shows a direct connection between a feeding station and a preheating station, wherein the feeding station includes an alignment unit. According to several embodiments, Figure 2A schematically shows a perspective view of another panel release system. According to several embodiments, Figures 2B and 2C schematically illustrate other configurations of the panel release system. According to several embodiments, Figure 3A schematically illustrates a control unit that can be integrated into a panel release system (e.g., a release station). According to several embodiments, Figure 3B schematically illustrates the cutting station of the panel release system. According to several embodiments, Figure 3C schematically shows that the peripheral edge portion of the molded panel is cut off. According to several embodiments, Figure 3D schematically shows a molded panel cut into multiple unit regions. According to several embodiments, Figure 3E schematically shows a plan view of a release head having a multi-zone vacuum holding device. According to several embodiments, Figure 3F schematically illustrates a cutting station integrated into a panel release system. According to several embodiments, Figure 3G schematically illustrates one mode in which the cutting station and the feeding station are connected. According to several embodiments, Figure 3H schematically illustrates another mode in which the cutting station and the feeding station are connected. According to several embodiments, Figure 4 schematically shows a perspective view of another panel release system. According to several embodiments, Figures 5A to 5F schematically illustrate the first and second release processes. Implementation

[0011] The embodiments described in the context of the following apparatus are similarly effective for the corresponding methods, and vice versa. Furthermore, it is understood that the embodiments described below can be combined, for example, a part of one embodiment can be combined with a part of another embodiment.

[0012] It should be understood that the terms “up,” “top,” “bottom,” “lower,” “side,” “rear,” “left,” “right,” “front,” “lateral,” “side,” “above,” and “below,” etc., when used in the following description, are for convenience and to aid in understanding relative position or direction, and are not intended to limit the orientation of any device, structure, or any part of any device or structure. Furthermore, singular terms may include plural references unless the context clearly indicates otherwise. Similarly, unless the context clearly indicates otherwise, the word “or” is intended to include “and.”

[0013] According to several embodiments, Figures 1A and 1B show a release station 110 and a panel release system 1000.

[0014] According to various embodiments, processing of the molded panel 101 may include releasing the molded panel 101. The molded panel 101 may be attached to a carrier 103 using a heat-release tape (also known as a heat-release film) 102. The heat-release tape 102 may be sandwiched between the molded panel 101 and the carrier 103, thereby fixing the molded panel 101 to the carrier 103 to form an intermediate panel-carrier assembly 104. For example, the molded panel 101 may encapsulate multiple electronic components, such as one or more wafers, chips, passive components (such as capacitors, resistors, etc.), and / or metal parts. The carrier 103 may be a supporting substrate (e.g., a temporary or reusable substrate) that facilitates processing, handling, and transportation of the molded panel 101 prior to release from the carrier 103. The carrier 103 may have a planar or substantially planar structure and may be made of a single material or a composite material, such as a metal or metal alloy (e.g., steel alloy, particularly steel alloy 46). The material used to manufacture the carrier 103 may possess one or more of the following properties: high temperature resistance, high mechanical strength, good thermal stability, dimensional stability under thermal cycling, rigidity, good toughness, durability, high thermal conductivity, good thermal conductivity, and compatibility with the heat-release tape 102 (e.g., no chemical reaction with the heat-release tape 102). Durable materials can be used to enable the carrier 103 to withstand various process conditions and handling processes (e.g., mechanical handling), thereby supporting efficient and scalable panel-level manufacturing processes.

[0015] According to several embodiments, heating the heat-release tape 102 of the intermediate panel-carrier assembly 104 to a predetermined or specific temperature (referred to as the "heat release temperature") can reduce or even eliminate the adhesion of the heat-release tape 102 to one side of the molded panel 101. For example, as shown in FIG1A(a) (marked by an elliptical dashed line), the heat-release tape 102 has a thermally sensitive adhesive layer 102a, an opposing pressure-sensitive adhesive layer 102b, and a base layer 102c sandwiched between the two. The thermally sensitive adhesive layer 102a and the pressure-sensitive adhesive layer 102b are in contact with the molded panel 101 and the carrier 103, respectively. Upon reaching the predetermined temperature, the thermally sensitive adhesive layer 102a loses its adhesiveness and can therefore separate from the molded panel 101; while the pressure-sensitive adhesive layer 102b retains its adhesion to the carrier 103. The base layer 102c provides mechanical support for the thermally sensitive adhesive layer 102a and the pressure-sensitive adhesive layer 102b. Optionally, the heat release temperature is approximately 210°C.

[0016] According to several embodiments, referring to FIG1A, the panel release system 1000 may include a release station 110. The release station 110 may process the intermediate panel-carrier assembly 104 so that the molded panel 101 can be released or separated from the carrier 103.

[0017] According to various embodiments, the release station 110 may include a carrier platform 111 (e.g., a stand-alone or dedicated table, workbench, platform, support, etc.), which may have a table surface 111a (e.g., an upper surface or an upward-facing surface) for supporting the intermediate panel-carrier assembly 104. Specifically, the table surface 111a of the carrier platform 111 is capable of supporting the intermediate panel-carrier assembly 104 and giving it a specific orientation, i.e., the molded panel 101 is located on top of or above the intermediate panel-carrier assembly 104. Therefore, when the intermediate panel-carrier assembly 104 is placed or supported on the table surface 111a of the carrier platform 111, the carrier 103 will be located between the carrier platform 111 and the molded panel 101.

[0018] According to several embodiments, the intermediate panel-carrier assembly 104 can be conveyed to the release station 110 with the panel 101 molded on top. For example, the release station 110 can be a stand-alone machine connected to one or more components of the panel release system 1000. Alternatively, the release station 110 can be an intermediate component of the panel release system 1000, receiving the intermediate panel-carrier assembly 104 from other components of the panel release system 1000 via a conveying mechanism (e.g., one or more movable platforms and / or actuating components of the panel release system 1000). Alternatively, the release station 110 can be the first component of the panel release system 1000. The intermediate panel-carrier assembly 104 can be fed into the release station 110 via a feeder mechanism or manually. Therefore, the release station 110 can receive the intermediate panel-carrier assembly according to the configuration of the panel release system 1000 and the overall production, manufacturing, assembly, or packaging process.

[0019] According to various embodiments, the carrier stage 111 may include a carrier stage heater 112 for heating the intermediate panel-carrier assembly 104 when it is on the carrier stage 111 (e.g., when the carrier stage 111 is located within the release station 110). The carrier stage heater 112 may be associated with the platform surface 111a of the carrier stage 111 such that the carrier stage heater 112 can heat the intermediate panel-carrier assembly 104 when it comes into contact with the platform surface 111a of the carrier stage 111. For example, the carrier stage heater 112 may be disposed on the platform surface 111a of the carrier stage 111, thereby enabling it to form a direct or indirect thermal conductive connection with the intermediate panel-carrier assembly 104 located on the platform surface 111a. In other words, when the intermediate panel-carrier assembly 104 is on the platform surface 111a of the carrier stage 111, the carrier stage heater 112 may form a direct or indirect thermal coupling relationship with it. For example, the carrier stage heater 112 may be arranged along the platform 111a of the carrier stage 111, forming direct contact with the intermediate panel-carrier assembly 104 when it is situated on the platform 111a. The carrier stage heater 112 may be embedded in the platform 111a (or embedded in an upper structure of the carrier stage 111d near the platform 111a), or otherwise coupled to the platform 111a (e.g., arranged below the platform 111a) to heat the platform 111a (e.g., by heat transfer). Thus, the platform 111a can conduct heat from the carrier stage heater 112 to the intermediate panel-carrier assembly 104. The platform 111a may comprise or be made of a thermally conductive or heat-conducting material. Optionally, a thermal interface material may be disposed on the platform 111a (e.g., between the platform 111a and the intermediate panel-carrier assembly 104). Therefore, the carrier 103 in the intermediate panel-carrier assembly 104 can form direct or indirect thermal contact with the table surface 111a of the carrier stage 111 and / or the carrier stage heater 112. Optionally, the carrier stage heater 112 may include a heating plate. Optionally, the heating plate may constitute or serve as the table surface 111a of the carrier stage 111. Optionally, the heating plate may be independent of the table surface 111a of the carrier stage 111. For example, the independent heating plate may be arranged below the table surface 111a and thermally coupled to the table surface 111a. It is understood that the carrier stage heater 112 can be implemented in any other suitable manner, including (but not limited to) solid-state heating elements, radiant heating devices (e.g., directly or indirectly coupled to the carrier stage 111), or any other suitable configuration capable of achieving the desired thermal effect. Optionally, the carrier stage heater 112 may heat based on a heating control signal. The heating control signal may be transmitted to the carrier stage heater 112 when or after the intermediate panel-carrier assembly 104 is on the carrier stage 111 (e.g., within the release station 110).Optionally, the carrier stage 111 includes a sensor for detecting contact or coupling between the carrier stage 111 and the intermediate panel-carrier assembly 104, for triggering a heating control signal.

[0020] According to several embodiments, when the intermediate panel-carrier assembly 104 is located on the platform 111a of the carrier stage 111, the carrier stage heater 112 can heat the intermediate panel-carrier assembly 104 to the heat release temperature of the heat release tape 102 (and maintain the heat release temperature for a certain period of time) until the adhesion strength between the heat release tape 102 and the molded panel 101 weakens or decreases, thereby enabling the molded panel 101 to separate from the carrier 103.

[0021] According to several embodiments, the release station 110 may include a release unit 115. Optionally, the release unit 115 includes a release head 116 as a driving component. Optionally, the release head 116 is located within the release station 110 and opposite and / or above the carrier platform 111. For example, in the release station 110, the carrier platform 111 may be located in the lower region, while the release head 116 may be located in the upper region.

[0022] According to several embodiments, the release head 116 is movable within the release station 110 along a release head movement plane 116p. The release head movement plane 116p may be a substantially flat plane and may be substantially vertically oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is placed vertically and / or facing upwards onto the ground). Specifically, when the carrier platform 111 is located within the release station 110, the release head movement plane 116p may be aligned (e.g., intersecting) with the carrier platform 111 (e.g., its platform surface 111a). Optionally, the release unit 115 can operate similarly to a pressing or pressing device, wherein the release head 116 can move upward and downward (e.g., in opposing linear directions) within the release head movement plane 116p, so as to engage with the intermediate panel-carrier assembly 104 when the intermediate panel-carrier assembly 104 is aligned with and / or located below the release head 116, and / or at least lift the molded panel 101 of the intermediate panel-carrier assembly 104 away from the carrier stage 111. Therefore, when the carrier stage 111 is located within the release station 110 and aligned with the release head 116, the release head 116 can move toward the table surface 111a of the carrier stage 111 to engage the molded panel 101 of the intermediate panel-carrier assembly 104 located on the table surface 111a of the carrier stage 111. The movement of the release head 116 along the release head movement plane 116p can be based on a movement signal. The movement signal can be transmitted to the release head 116 or its connected actuator to indicate the movement of the release head 116.

[0023] According to several embodiments, the release head 116 may include one or more release head retainers 118 for releasably retaining (e.g., releasably clamping or securing) the molded panel 101 of the intermediate panel-carrier assembly 104, or a molded panel 101 separate from the carrier 103, to the contact surface (e.g., a downward-facing surface) of the release head 116. Optionally, the release head retainer 118 is located at or near the contact surface of the release head 116. For example, the release head retainer 118 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a clamp or gripper), an electrostatic chuck, an end effector, etc. Optionally, the operation of the release head retainer 118 may be based on a holding control signal. The holding control signal may be transmitted to the release head retainer 118 to instruct the release head retainer 118 to perform the operation.

[0024] Therefore, after the carrier stage heater 112 of the carrier stage 111 heats the intermediate panel-carrier assembly 104 to the heat release temperature, until the adhesion of the heat-sensitive adhesive layer 102a of the heat-release tape 102 to the molded panel 101 fails, and the release head retainer 118 releasably holds the molded panel 101 at the contact surface of the release head 116, the release head 116 can move away from the surface of the carrier stage 111 (e.g., upward), thereby releasing or separating the molded panel 101 from the carrier 103. In particular, once the adhesive strength between the molded panel 101 of the intermediate panel-carrier assembly 104 and the heat-release tape 102 is weakened or reduced to a certain extent, the release head 116 can simply lift the molded panel 101, which is sufficient to separate the molded panel 101 from the carrier 103 below. When the molded panel 101 is lifted, the carrier 103 (along with the heat release tape 102) remains on the table surface 111a of the carrier platform 111.

[0025] According to several embodiments, the release head 116 may include a release head heater 117 (e.g., a heater or heating plate) that may be associated with the contact surface of the release head 116. For example, the release head heater 117 may be disposed at the contact surface of the release head 116. Optionally, the release head heater 117 may cooperate with the carrier stage heater 112 to heat the intermediate panel-carrier assembly 104, i.e., when the intermediate panel-carrier assembly 104 is located between the carrier stage 111 and the release head 116 (in other words, when the intermediate panel-carrier assembly 104 is located on the table surface 111a of the carrier stage 111 and the contact surface of the release head 116 is engaged with the intermediate panel-carrier assembly 104), so that the intermediate panel-carrier assembly 104 reaches and is maintained at a heat release temperature to weaken or reduce the adhesion strength between the heat release tape 102 and the molded panel 101, so that the release head 116 subsequently lifts and separates the molded panel 101 from the carrier 103. In other words, heat can be applied to both sides of the intermediate panel-carrier assembly 104 to weaken the adhesion strength between the heat release tape 102 and the molded panel 101. Optionally, the release head heater 117 can provide heating based on a heating control signal. Optionally, the heating control signal can be transmitted to the release head heater 117 when the release head 116 is engaged with the molded panel 101 and the carrier platform 111 is engaged with the carrier 103, thereby co-heating the intermediate panel-carrier assembly 104 together with the carrier platform heater 112. Optionally, the release station 110 (e.g., the release head 116) may also include a sensor for detecting the engagement between the release head 116 and the intermediate panel-carrier assembly 104, for triggering the heating control signal.

[0026] According to several embodiments, the carrier stage 111 may include one or more carrier stage retainers 113 for releasably retaining (e.g., releasably clamping or securing) the carrier 103 of the intermediate panel-carrier assembly 104 on the table surface 111a of the carrier stage 111. Optionally, the carrier stage retainer 113 is associated with the table surface 111a of the carrier stage 111 (e.g., located on or adjacent to the table surface 111a). Optionally, the carrier stage retainer 113 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a gripper or clamp), an electrostatic chuck, an end effector, etc. Optionally, to facilitate the separation of the molded panel 101 from the carrier 103, the carrier stage holder 113 can hold the carrier 103 on the platform 111a of the carrier stage 111, while the release head 116 can releasably hold the molded panel 101 on the mating surface of the release head 116 and lift the molded panel 101 from the carrier 103. Optionally, the operation of the carrier stage holder 113 can be based on a holding control signal. Optionally, the holding control signal can be transmitted to the carrier stage holder 113 to indicate the holding operation of the carrier stage holder 113.

[0027] According to several embodiments, Figures 1C and 1D show a panel release system 1000 having the release station shown in Figure 1A, and a corresponding panel processing station 120 and carrier processing station 130.

[0028] According to several embodiments, the panel release system 1000 may include one or more other components connected to the release station 110. Optionally, these other components may be connected to each other via a transport or delivery mechanism, such as one or more movable platforms and / or drive components.

[0029] According to several embodiments, as shown in Figures 1C and 1D, the panel release system 1000 may include a panel processing station 120 and / or a carrier processing station 130, which are respectively connected to the release station 110.

[0030] According to several embodiments, panel processing station 120 is capable of receiving molded panel 101, which has been separated from carrier 103, from release station 110. In other words, the (separated) molded panel 101 can be transported from release station 110 or moved to panel processing station 120.

[0031] According to several embodiments, panel processing station 120 may include panel table 121 (e.g., deck, workbench, platform, countertop, etc.) movable between panel processing station 120 and release station 110 for conveying (separated) molded panel 101 from release station 110 to panel processing station 120. Specifically, panel table 121 is movable at least from release station 110 to panel processing station 120 for conveying (separated) molded panel 101 from release station 110 to panel processing station 120. Thus, panel table 121 may correspond to a separate transfer table. Panel table 121 is movable along a panel table movement plane 121p extending between panel processing station 120 and release station 110. Panel table movement plane 121p may be a substantially flat plane and may be substantially horizontally oriented (e.g., relative to the base of panel release system 1000, and / or when panel release system 1000 is placed vertically and / or facing upwards on the ground). The panel stage movement plane 121p may not be parallel to the release head movement plane 116p (e.g., perpendicular or substantially perpendicular). The panel release system 1000 may include a corresponding guide rail, track, or slide rail (e.g., a linear guide rail, track, or slide rail) as a guide element extending between the panel processing station 120 and the release station 110, guiding the panel stage 121 to move along it. The panel stage 121 may move within the panel stage movement plane 121p in a lateral or sideways direction (e.g., opposite linear directions), i.e., moving out of the panel processing station 120 and into the release station 110, or moving out of the release station 110 and into the panel processing station 120. The movement of the panel stage 121 along the panel stage movement plane 121p may be based on a movement signal. Optionally, the movement signal may be transmitted to the panel stage 121 or an actuator connected to it to indicate the movement of the panel stage 121.

[0032] According to several embodiments, after the molded panel 101 is released or separated from the carrier 103 (at the release station 110), the panel stage 121 is movable into the release station 110 and aligned with the release head 116 so as to be able to receive the (separated) molded panel 101 from the release head 116.

[0033] Specifically, when the panel stage 121 is positioned within the release station 110 and aligned with the release head 116, the release head 116 can release the (separated) molded panel 101 onto the panel stage 121. Optionally, when the (separated) molded panel 101 is on the panel stage 121, the panel stage 121 can be moved out of the release station 110 and into the panel processing station 120, thereby transferring the (separated) molded panel 101 from the release station 110 to the panel processing station 120.

[0034] According to several embodiments, the panel platform 121's panel platform movement plane 121p may be spatially separated from and / or parallel to the carrier platform 111's carrier platform movement plane 111p (see FIG. 1D, as described below). Therefore, when the panel platform 121 moves to the release station 110, the panel platform 121 may be positioned above the carrier platform 111 (or its movement plane 111p), thereby aligning with the release head 116 and / or with the (separated) molded panel 101 it holds. It is understood that the panel platform movement plane 121p may also be located below the carrier platform movement plane 111p. Therefore, the carrier platform 111 may move along the carrier platform movement plane 111p, while the panel platform 121 may move along the panel platform movement plane 121p, with both 111p and 121p being parallel to and / or spaced apart from each other.

[0035] According to several embodiments, the carrier stage 111 can enter and exit the release station 110 synchronously with the panel stage 121. Therefore, the carrier stage 111 can exit the release station 110 to allow the panel stage 121 to enter the release station 110 and / or align with the release head 116 within the release station 110. Optionally, the carrier stage 111 and the panel stage 121 can move along the same plane, or they can move along different and spatially separated planes (e.g., one plane lies on top of another flat plate).

[0036] According to several embodiments, after the panel stage 121 is aligned with the release head 116, the release head 116 can move toward the panel stage 121 (along with the (separated) molded panel 101 held therein) to release the (separated) molded panel 101 onto the panel stage 121. Specifically, the release head 116 can move downward along the release head movement plane 116p until the (separated) molded panel 101 approaches or contacts the table surface 121a (e.g., its upper surface) of the panel stage 121, and then release the (separated) molded panel 101 onto the panel stage 121. After the (separated) molded panel 101 is placed on the panel stage 121, the release head 116 can move in the opposite direction, i.e., away from the panel stage 121, so that the panel stage 121 (which is now holding the (separated) molded panel 101) can be removed from the release station 110 and enter the panel processing station 120.

[0037] According to several embodiments, the panel processing station 120 may include a panel processing unit 125. Optionally, the panel processing unit 125 includes a panel processing head 126. Optionally, in the panel processing station 120, the panel processing head 126 is located relative to and / or above the panel table 121. For example, the panel table 121 may be located in the lower region, while the panel processing head 126 may be located in the upper region.

[0038] According to several embodiments, the panel processing head 126 is movable along a panel processing head movement plane 126p. The panel processing head movement plane 126p can be a substantially flat plane and can be substantially vertically oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is positioned upright on an external ground). Therefore, the panel processing head movement plane 126p located within the panel processing station 120 can be parallel or substantially parallel to the release head movement plane 116p located within the release station 110. Furthermore, the panel processing head movement plane 126p can be non-parallel to the panel table movement plane 121p (e.g., perpendicular or substantially perpendicular). When both the panel table 121 and the panel processing head 126 are located within the panel processing station 120, the panel processing head movement plane 126p can be aligned with the panel table 121 (e.g., intersecting its table surface 121a). The panel processing unit 125 can operate similarly to a pressing or pressing device, wherein the panel processing head 126 can move upward and downward (e.g., in opposite linear directions) along the panel processing head movement plane 126p. This arrangement allows it to engage the (separated) molded panel 101 when it is aligned with and / or beneath the panel processing head 126, and / or to lift (e.g., move away from) the (separated) molded panel 101 from the panel table 121. Therefore, when the panel table 121 is located within the panel processing station 120 and / or aligned with the panel processing head 126, the panel processing head 126 can move toward the table surface 121a of the panel table 121 (e.g., downward) to engage the (separated) molded panel 101 located on the table surface 121a (e.g., for transferring the (separated) molded panel 101 from the panel table 121 to the panel processing head 126). The movement of the panel processing head 126 along the panel processing head moving plane 126p can be based on a movement signal. Optionally, the movement signal can be transmitted to the panel processing head 126 to indicate its movement.

[0039] According to several embodiments, the panel processing head 126 may include one or more panel processing head retainers 128 for releasably retaining (e.g., releasably clamping or securing) the (separated) molded panel 101 to the mating surface (e.g., the downward-facing surface) of the panel processing head 126. Optionally, the panel processing head retainer 128 is associated with the mating surface of the panel processing head 126 (e.g., located at or near the mating surface). Optionally, the panel processing head retainer 128 includes a vacuum suction mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a gripper or clamp), an electrostatic chuck, an end effector, etc. Optionally, the panel processing head retainer 128 may be operated based on a holding control signal. Optionally, the holding control signal may be transmitted to the panel processing head retainer 128 to indicate its operation.

[0040] According to an embodiment, the panel processing head 126 may further include a temperature regulating heater 127 for regulating the temperature of the (separated) molded panel 101 (e.g., regulating it to a temperature below the heat release temperature).

[0041] According to several embodiments, a temperature-regulating heater 127 may be disposed at the mating surface of the panel processing head 126, thereby regulating the temperature of the (separated) molded panel 101 when the mating surface of the panel processing head 126 is engaged with the (separated) molded panel 101. For example, the temperature-regulating heater 127 may be disposed at the mating surface of the panel processing head 126 to form heat conduction or heat coupling with the (separated) molded panel 101 releasably fixed to the mating surface. Optionally, the temperature-regulating heater 127 is in direct contact with the (separated) molded panel 101. Optionally, the temperature-regulating heater 127 is embedded in the mating surface (or embedded in the lower part of the panel processing head 126 having the mating surface), or connected to the mating surface in a manner capable of heating or regulating the temperature of the mating surface (e.g., disposed behind or to the rear of the mating surface) so as to enable heat (e.g., in a controlled manner) to be conducted to the mating surface. The mating surface can conduct heat or thermal energy from the (separated) molded panel 101 to the temperature-regulating heater 127. Therefore, the mating surface can be made of a thermally conductive material. Optionally, a thermal interface material layer can be disposed on the mating surface (e.g., between the mating surface and the (separated) molded panel 101). Therefore, the (separated) molded panel 101 can be in direct or indirect thermal contact with the mating surface of the panel processing head 126 and / or the temperature-regulating heater 127. The temperature-regulating heater 127 of the panel processing head 126 can have a heating plate. Optionally, the heating plate can form the mating surface of the panel processing head 126. Alternatively, the heating plate can be disposed independently of the mating surface of the panel processing head 126. For example, a separate heating plate can be disposed adjacent to the mating surface (e.g., behind the mating surface) and thermally coupled to the mating surface. It is understood that the temperature-regulating heater 127 of the panel processing head 126 can also achieve the above-described functions in any other suitable form, including (but not limited to) solid-state heating elements, radiant heating devices (e.g., directly or indirectly coupled to the mating surface of the panel processing head 126), or any other suitable configuration capable of achieving the desired thermal effect. Optionally, the temperature-regulating heater 127 of the panel processing head 126 can be temperature-regulated according to a temperature regulation control signal. Optionally, the temperature regulation control signal can be transmitted to the temperature-regulating heater 127 of the panel processing head 126 after the molded panel 101 is separated and engaged with the panel processing head 126. Therefore, the panel release system 1000 or the panel processing station 120 (e.g., the panel processing head 126) may include a sensor that can detect the engagement between the panel processing head 126 and the (separated) molded panel 101 to trigger the temperature regulation control signal.

[0042] According to several embodiments, the temperature regulating heater 127 of the panel processing head 126 regulates the temperature of the panel processing head 126 (e.g., its mating surface) and the (separated) molded panel 101 to a temperature between the heat release temperature and the ambient temperature (i.e., below the heat release temperature). Optionally, when the (separated) molded panel 101 is transferred from the release station 110 to the panel processing station 120 via the panel stage 121, the molded panel 101 may be at or near the heat release temperature. Simultaneously, the temperature of the temperature regulating heater 127 (or its mating surface) of the panel processing head 126 may be between the ambient temperature and the heat release temperature, i.e., higher than the ambient temperature but lower than the heat release temperature and / or lower than the temperature of the (separated) molded panel 101. In this manner, when the panel processing head holder 128 is engaged with the (separated) molded panel 101, the temperature-regulating heater 127 allows the panel processing head 126 to act as a thermal buffer, enabling heat to be conducted from the (separated) molded panel 101 to the panel processing head 126, thereby initiating a controlled and / or gradual cooling process of the (separated) molded panel 101. Since the temperature difference between the panel processing head 126 and the (separated) molded panel 101 may be less than the temperature difference between the (separated) molded panel 101 and the ambient temperature, the cooling rate of the (separated) molded panel 101 can be regulated or controlled when the (separated) molded panel 101 is releasably held on the panel processing head 126 and / or in a state of thermal conduction or thermal coupling with the temperature-regulating heater 127. This gradual cooling process or gradual temperature decrease helps to minimize thermal stress and reduce or eliminate the potential risk of panel warping or deformation.

[0043] According to several embodiments, the panel platform 121 may act as another heat buffer. For example, the panel platform 121 may include a temperature regulating heater 122, serving as an auxiliary temperature regulating heater or temperature regulating element. Optionally, when the (separated) molded panel 101 is held on the support surface of the panel platform 121, the temperature regulating heater 122 may maintain the (separated) molded panel 101 at a temperature between the heat release temperature and the ambient temperature, that is, regulate its temperature to a temperature below the heat release temperature.

[0044] According to various embodiments, a temperature-regulating heater 122 may be associated with a support surface of the panel platform 121, which, when in contact with the (separated) molded panel 101, can maintain the (separated) molded panel 101 at a temperature between the heat release temperature and the ambient temperature. For example, the temperature-regulating heater 122 may be disposed on the support surface of the panel platform 121 to enable thermal communication or thermal coupling with the (separated) molded panel 101 transferred from the release head 116 to the support surface. Alternatively, the temperature-regulating heater 122 may be arranged along the support surface of the panel platform 121 to enable direct contact with the (separated) molded panel 101. Alternatively, the temperature-regulating heater 122 may be embedded within the support surface (or embedded in the upper region of the panel platform 121 having the support surface), or configured to be coupled to the support surface (e.g., disposed below the support surface), thereby enabling heating or temperature regulation of the support surface (e.g., by controlled heat conduction to the support surface). Therefore, the bearing surface can conduct or transfer heat or thermal energy from the (separated) molded panel 101 to the temperature-regulating heater 122. Optionally, the bearing surface of the panel 121 can be composed of a thermally conductive or heat-conducting material. Optionally, a thermal interface material layer can be provided on the bearing surface (e.g., between the bearing surface and the (separated) molded panel 101). Thus, the (separated) molded panel 101 can be in direct or indirect thermal contact with the bearing surface and / or the temperature-regulating heater 122 of the panel 121. Optionally, the temperature-regulating heater 122 of the panel 121 can have a heating plate. Optionally, the heating plate can constitute the bearing surface of the panel 121. Optionally, the heating plate can be separately disposed from the bearing surface of the panel 121. For example, a separate heating plate can be placed below the bearing surface and thermally coupled to the bearing surface. It is understood that the temperature-regulating heater 122 of the panel platform 121 can achieve its above-described functions in any other suitable form, including (but not limited to) solid-state heating elements, radiant heating devices (e.g., directly or indirectly coupled to the bearing surface of the panel platform 121), or any other suitable configuration capable of achieving the desired thermal effect. Optionally, the temperature-regulating heater 122 of the panel platform 121 can be temperature-regulated based on a temperature regulation control signal. The temperature regulation control signal can be transmitted to the temperature-regulating heater 122 when the molded panel 101 is separated from the carrier 103 and held or in contact with the panel platform 121. For example, the panel release system 1000 or the panel processing station 120 (e.g., the panel platform 121) may include a sensor for detecting the holding or contact between the panel platform 121 and the (separated) molded panel 101, thereby triggering the temperature regulation control signal.

[0045] According to several embodiments, the temperature regulating heater 122 of the panel platform 121 can regulate the temperature of the panel platform 121 and the (separated) molded panel 101 to a temperature between the heat release temperature and the ambient temperature (i.e., a temperature below the heat release temperature). Specifically, the temperature of the temperature regulating heater 122 can be controlled or regulated by a heater to be between the heat release temperature and the ambient temperature; more specifically, above the ambient temperature but below the heat release temperature, and / or below the temperature of the (separated) molded panel 101. In this way, when the temperature regulating heater 122 is operating, the panel platform 121 can act as a heat buffer when in contact with the (separated) molded panel 101, allowing heat to be transferred from the (separated) molded panel 101 to the panel platform 121, thereby enabling a controlled, gradual cooling process of the (separated) molded panel 101 on the panel platform 121.

[0046] According to several embodiments, when both the panel platform 121 and the panel processing head 126 include their respective temperature regulating heaters 122 and 127, the (separated) molded panel 101 can first be gradually cooled to a first temperature (e.g., a temperature lower than the heat release temperature but higher than the ambient temperature) by the panel platform 121 (i.e., by its temperature regulating heater 122), and then gradually cooled to a second temperature (lower than the first temperature) by the panel processing head 126 (i.e., by its temperature regulating heater 127). Therefore, the temperature regulating heater 122 of the panel platform 121 can regulate the temperature of the panel platform 121 and the (separated) molded panel 101 in contact with it to a temperature between the heat release temperature and the first temperature, while the temperature regulating heater 127 of the panel processing head 126 can regulate the temperature of the panel processing head 126 and the (separated) molded panel 101 in contact with it to a temperature between the first temperature and the second temperature.

[0047] According to several embodiments, the panel stage 121 may include one or more panel stage retainers 123 that releasably retain (e.g., releasably clamp or fix) the (separated) molded panel 101 on a bearing surface (e.g., an upward-facing surface) of the panel stage 121. Optionally, the panel stage retainer 123 may be disposed on or near the bearing surface of the panel stage 121 (e.g., at or near the bearing surface). Optionally, the panel stage retainer 123 may include a vacuum suction mechanism (e.g., a vacuum suction cup plate, vacuum suction hole, vacuum suction cup, etc.), a clamping mechanism (e.g., a gripper or clamp), an electrostatic chuck, an electric end effector, etc. Optionally, the panel stage retainer 123 may be operated based on a holding control signal. Optionally, the holding control signal may be transmitted to the panel stage retainer 123 to instruct it to perform a holding or releasing operation.

[0048] As shown, the panel processing head 126 is initially positioned (e.g., in the upper region within the panel processing station 120) so that the panel stage 121 moves out of the release station 110 (e.g., after receiving the (separated) molded panel 101) and into the panel processing station 120, positioned below the panel processing head 126. When the panel stage 121 (with the (separated) molded panel 101 held thereon) is aligned with the panel processing head 126 (e.g., directly below it), the panel processing head 126 can move toward the (separated) molded panel 101 to engage with it and releasably retain it via the panel processing head retainer 128. Subsequently, the panel handling head 126 (holding the (separated) molded panel 101) is movable or lifts the (separated) molded panel 101, detaching it from the panel table 121 (e.g., for transferring the (separated) molded panel 101 to another component or location of the panel release system 1000, or for removing it from the panel release system 1000). Optionally, the panel table 121 then returns to the release station 110 to receive the (separated) molded panel 101 delivered to another intermediate panel-carrier assembly 104 within the panel release system 1000.

[0049] According to several embodiments, the panel processing head 126 (or panel processing unit 125) can move laterally (or laterally) along a panel processing head lateral movement plane 226q (see Figures 2A to 2C), which may be non-parallel to the panel processing head movement plane 126p (e.g., perpendicular or substantially perpendicular). The panel processing head lateral movement plane 226q can be a substantially flat plane and can be substantially horizontally oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is configured to stand upright on an external ground). Therefore, the panel processing head 126 (or panel processing unit 125) can move along the panel processing head lateral movement plane 226q in a lateral or lateral direction (e.g., the opposite linear direction). Optionally, the direction of lateral or transverse movement of the panel processing head 126 (or panel processing unit 125) along the panel processing head lateral movement plane 226q may (but is not limited to) be non-parallel (e.g., perpendicular or substantially perpendicular) to the direction of lateral or transverse movement of the panel table 121 along the panel table movement plane 121p. This arrangement of the panel processing head 126 (or panel processing unit 125) allows the (separated) molded panel 101 held by the panel processing head 126 to be transported out of the panel processing station 120. For example, the (separated) molded panel 101 may be transported to another component or location for further processing or operation, or discharged from the panel release system 1000. The panel release system 1000 may include corresponding guide rails, tracks, or slides (e.g., linear guide rails, tracks, or slides) for guiding the panel processing head 126 in lateral movement along the panel processing head lateral movement plane 226q. The movement of the panel processing head 126 along the lateral movement plane 226q of the panel processing head can be based on a movement signal. Optionally, the movement signal can be transmitted to the panel processing head 126 to indicate its movement.

[0050] Referring to Figures 1C and 1D, according to various embodiments, carrier processing station 130 can receive carrier 103 from release station 110, which has been separated from molded panel 101 (while heat release tape 102 is still attached to it). In other words, carrier 103 (which has been separated) can be moved from release station 110 to carrier processing station 130.

[0051] According to several embodiments, the carrier stage 111 is movable between the release station 110 and the carrier processing station 130 for transporting the (separated) carrier 103 from the release station 110 to the carrier processing station 130. That is, the carrier stage 111 can move from the release station 110 to the carrier processing station 130 to transport the (separated) carrier 103 to the carrier processing station 130. The carrier stage 111 may have a separate movable platform (or slide, sliding platform). The carrier stage 111 is movable along a carrier stage movement plane 111p extending between the release station 110 and the carrier processing station 130 (see FIG. 1D). The carrier stage movement plane 111p may be a substantially flat plane and may be substantially horizontally oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is configured to stand upright on an external ground). Therefore, the carrier stage 111 can move laterally (e.g., in the opposite linear direction) along the carrier stage movement plane 111p between the release station 110 and the carrier processing station 130. The direction in which the carrier stage 111 moves laterally or laterally along the carrier stage movement plane 111p (between the release station 110 and the carrier processing station 130) can be (but is not limited to) non-parallel (e.g., perpendicular or substantially perpendicular) to the direction in which the panel stage 121 moves laterally or laterally along the panel stage movement plane 121p (between the panel processing station 120 and the release station 110). The movement of the carrier stage 111 along the carrier stage movement plane 111p can be based on a movement signal. Optionally, the movement signal is transmitted to the carrier stage 111 to indicate its movement.

[0052] According to several embodiments, the carrier stage moving plane 111p may not be parallel to the release head moving plane 116p (e.g., perpendicular or substantially perpendicular).

[0053] According to several embodiments, the lateral movement plane 226q of the panel processing head may (but is not limited to) be parallel to the movement plane 111p of the carrier stage, but spatially separated. In other words, the panel processing head 126 and the carrier stage 111 can move at different heights within the panel release system 1000 (e.g., when the panel release system 1000 is set upright on an external ground). Therefore, within the panel release system 1000, the panel processing head 126 and the carrier stage 111 can move at different heights along different and / or parallel guide rails, tracks, or slides.

[0054] According to several embodiments, the carrier stage moving plane 111p and the panel stage moving plane 121p may be parallel to each other. Therefore, the carrier stage moving plane 111p and the panel stage moving plane 121p may be horizontal or substantially horizontally oriented. The direction of movement of the carrier stage 111 along the carrier stage moving plane 111p may be non-parallel to the direction of movement of the panel stage 121 along the panel stage moving plane 121p (e.g., perpendicular or substantially perpendicular). Therefore, referring to FIG. 1D, the carrier stage 111 and the panel stage 121 may move in different and / or non-parallel (e.g., perpendicular) directions. This allows the carrier stage 111 and the panel stage 121 to move synchronously and / or coordinatedly and / or in parallel and / or simultaneously along the carrier stage moving plane 111p and the panel stage moving plane 121p, respectively (e.g., without overlapping or other interference). For example, the carrier platform 111 and the panel platform 121 can move in parallel and / or simultaneously: First, the carrier platform 111 is moved from the release station 110 toward the carrier processing station 130, thereby transporting the carrier 103, separated from the molded panel 101 and equipped with the heat-release tape 102, to the carrier processing station 130; Second, the panel platform 121 is moved from the panel processing station 120 toward the release station 110, thereby receiving the (separated) molded panel 101. In several embodiments, the movements of the carrier platform 111 and the panel platform 121 can be coordinated so that the carrier platform 111 leaves the release station 110 before the panel platform 121 enters the release station 110, or both can leave the panel processing station 120 and the carrier processing station 130 simultaneously, respectively. Panel stage 121 and carrier stage 111 can also leave release station 110 simultaneously (e.g., the (separated) molded panel 101 and (separated) carrier 103 are synchronously transferred to panel processing station 120 and carrier processing station 130, respectively). For example, panel stage 121 can move along panel stage movement plane 121p located above carrier stage movement plane 111p of carrier stage 111. Therefore, after the molded panel 101 separates from the carrier 103, the carrier 103 can remain on carrier stage 111, while panel stage 121 can move above carrier stage 111 (and the (separated) carrier 103 thereon) so that the (separated) molded panel 101 can be received from release head 116. Subsequently, the panel stage 121 (carrying the (separated) molded panel 101) and the carrier stage 111 (carrying the (separated) carrier 103) can leave the release station 110 in a coordinated and / or synchronous manner (e.g., in parallel or simultaneously). Therefore, the panel stage movement plane 121p of the panel stage 121 can be spatially separated from the carrier stage movement plane 111p of the carrier stage 111. For example, they can be parallel, but the panel stage movement plane 121p is located below the carrier stage movement plane 111p. This arrangement also allows the carrier stage 111 and the panel stage 121 to move in a coordinated and / or synchronous manner.

[0055] According to several embodiments, both panel processing station 120 and carrier processing station 130 can be connected to release station 110 and / or located downstream of release station 110.

[0056] For example, the panel release system 1000 may include corresponding guide rails, tracks, or slides (e.g., linear guide rails, tracks, or slides) for connecting the panel processing station 120 and the carrier processing station 130 to the release station 110, respectively. For example, one guide rail may extend between the release station 110 and the panel processing station 120 to guide the panel stage 121 to move between the release station 110 and the panel processing station 120; another guide rail may extend between the release station 110 and the carrier processing station 130 to guide the carrier stage 111 to move between the release station 110 and the carrier processing station 130.

[0057] According to several embodiments, the carrier processing station 130 may include a carrier processing unit 135. The carrier processing unit 135 may include a carrier processing head 136. When the carrier stage 111 is located within the carrier processing station 130, the carrier processing head 136 may be positioned opposite and / or above the carrier stage 111. That is, within the carrier processing station 130, the carrier stage 111 may be located in the lower region, while the carrier processing head 136 may be located in the upper region.

[0058] According to several embodiments, within carrier processing station 130, carrier processing head 136 is movable along a carrier processing head movement plane 136p. The carrier processing head movement plane 136p can be a substantially flat plane and can be substantially vertically oriented (e.g., relative to the base of panel release system 1000, and / or when panel release system 1000 is vertical to the external ground). The carrier processing head movement plane 136p within carrier processing station 130 can be parallel or substantially parallel to the release head movement plane 116p within release station 110, and / or the panel processing head movement plane 126p within panel processing station 120. Furthermore, the carrier processing head movement plane 136p can be non-parallel to the carrier platform movement plane 111p (e.g., perpendicular or substantially perpendicular). When carrier platform 111 is located within carrier processing station 130, the carrier processing head movement plane 136p can be aligned (e.g., intersecting) with carrier platform 111 (e.g., its platform surface 121a). Optionally, the carrier processing unit 135 operates in a manner similar to a pressing or pressing device. The carrier processing head 136 can move up and down (e.g., in opposite linear directions) along the carrier processing head movement plane 136p so that when the (separated) carrier 103 is aligned with and / or below the carrier processing head 136, the (separated) carrier 103 can be lifted and / or removed from the carrier stage 111. Therefore, when the carrier stage 111 is located within the carrier processing station 130 and aligned with the carrier processing head 136, the carrier processing head 136 can move along the carrier processing head movement plane 136p to the table surface 111a of the carrier stage 111 to grasp the (separated) carrier 103 located on the table surface 111a of the carrier stage 111. The movement of the carrier processing head 136 along the carrier processing head movement plane 136p can be based on a movement signal. Optionally, the movement signal can be transmitted to the carrier processing head 136 to indicate its movement.

[0059] According to several embodiments, the carrier processing head 136 may include a carrier processing head holder 138. The carrier processing head holder 138 releasably retains (e.g., releasably grips or secures) a (separated) carrier 103, holding it at the engagement surface 136a of the carrier processing head 136. The carrier processing head holder 138 may be associated with (e.g., located at or near) the engagement surface 136a of the carrier processing head 136. Optionally, the carrier processing head holder 138 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a clamp or gripper), an electrostatic adsorbent, an end effector, etc. The carrier processing head holder 138 may be operated based on a holding control signal. Optionally, the holding control signal may be transmitted to the carrier processing head holder 138 to instruct its operation.

[0060] According to several embodiments, the carrier processing head 136 is in an initial position (e.g., located in the upper region of the carrier processing station 130) to facilitate the entry of the carrier stage 111 carrying the (separated) carrier 103 into the carrier processing station 130. Subsequently, when the carrier stage 111 is aligned with the carrier processing head 136 (e.g., along the carrier processing head movement plane 136p), the carrier processing head 136 can move toward the (separated) carrier 103, engage the (separated) carrier 103, and releasably hold the (separated) carrier 103 at its engagement surface 136a by the carrier processing head retainer 138. Subsequently, the carrier processing head 136 can move (e.g., lift) the (separated) carrier 103 away from the carrier stage 111, and finally the carrier stage 111 is removed from the carrier processing station 130 (e.g., returned to the release station 110).

[0061] Figure 1E schematically illustrates a panel release system 1000 with an unloading station 140. According to several embodiments, the unloading station 140 may be connected to the carrier processing station 130 in Figures 1C and 1D.

[0062] According to several embodiments, the unloading station 140 in the panel release system 1000 may be connected to the carrier processing station 130. In particular, the unloading station 140 may be located downstream of the carrier processing station 130.

[0063] According to several embodiments, unloading station 140 may receive (separated) carrier 103 transmitted from carrier processing station 130.

[0064] According to several embodiments, unloading station 140 may include an unloading tray 141 movable between unloading station 140 and carrier processing station 130 for transporting (separated) carrier 103 from carrier processing station 130 to unloading station 140. Therefore, unloading tray 141 may be a separate conveyor (or shuttle, sliding table, or movable table). Unloading tray 141 may be movable along an unloading tray movement plane 141p extending between unloading station 140 and carrier processing station 130. Unloading tray movement plane 141p may be a substantially flat plane, possibly substantially horizontally oriented relative to the base of panel release system 1000 (e.g., when panel release system 1000 is placed and / or vertically placed on an external ground or surface). Optionally, unloading tray movement plane 141p is not parallel to carrier processing head movement plane 136p (e.g., perpendicular or substantially perpendicular). The unloading tray 141, moving between the unloading station 140 and the carrier processing station 130, can move laterally or laterally along the unloading tray movement plane 141p (e.g., in the opposite linear direction). Optionally, the direction of said lateral or lateral movement is parallel to the direction of the panel platform 121's lateral or lateral movement along the panel platform movement plane 121p, i.e., the direction of movement between the panel processing station 120 and the release station 110. The panel release system 1000 may include a track, guide rail, or slide rail (e.g., a linear track) extending between the unloading station 140 and the carrier processing station 130, allowing the unloading tray 141 to be guided and / or moved (e.g., slid) along it. Thus, the unloading tray 141 can be moved out of the unloading station 140 and into the carrier processing station 130, or vice versa. The movement of the unloading tray 141 along the unloading tray movement plane 141p may be based on a movement signal. Optionally, the movement signal can be transmitted to the unloading tray 141 to indicate its movement.

[0065] Furthermore, according to several embodiments, the upper side or upper surface of the unloading tray 141 (i.e. the part that can support the (separated) carrier 103) may include a roller or roller conveyor, or a movable conveyor belt or roller belt, etc., so that the (separated) carrier 103 can move thereon.

[0066] According to several embodiments, at carrier processing station 130, after carrier processing head 136 lifts (separated) carrier 103 from carrier stage 111, unloading tray 141 can be moved to carrier processing station 130 and aligned with carrier processing head 136 (at which time carrier processing head 136 can releasably hold (separated) carrier 103), and then receive (separated) carrier 103 held by carrier processing head 136 (e.g., received on the upper side or upper surface of unloading tray 141).

[0067] According to several embodiments, when the unloading tray 141 is located at the carrier processing station 130 and aligned with the carrier processing head 136, the carrier processing head 136 can release the (separated) carrier 103 onto the unloading tray 141. Once the (separated) carrier 103 is on the unloading tray 141, the unloading tray 141 can be removed from the carrier processing station 130 and enter the unloading station 140, thereby transporting the (separated) carrier 103 from the carrier processing station 130 to the unloading station 140 (e.g., for subsequently discharging the carrier 103 from the panel release system 1000).

[0068] According to several embodiments, the unloading tray moving plane 141p of the unloading tray 141 may be spatially separated from and parallel to the carrier stage moving plane 111p of the carrier stage 111. Therefore, when the unloading tray 141 is moved into the carrier processing station 130, the unloading tray 141 may be positioned above the carrier stage 111 (in other words, the unloading tray moving plane 141p is positioned above the carrier stage moving plane 111p) to align with the carrier processing head 136 and / or the (separated) carrier 103 releasably held by the carrier processing head 136. In other embodiments, the unloading tray moving plane 141p may also be positioned below the carrier stage moving plane 111p.

[0069] According to several embodiments, the carrier platform 111 can move synchronously with the unloading tray 141 into and out of the carrier processing station 130. Therefore, the carrier platform 111 can be moved out of the carrier processing station 130 to facilitate the unloading tray 141's entry into the carrier processing station 130. Optionally, the carrier platform 111 and the unloading tray 141 can move along the same plane, or they can move separately along different and spatially separated planes (e.g., one plane above / below another).

[0070] According to several embodiments, when the unloading tray 141 is aligned with the carrier processing head 136 (at which time the carrier processing head 136 releasably holds the (separated) carrier 103), the carrier processing head 136 can move toward the unloading tray 141 to release the (separated) carrier 103 onto the unloading tray 141. The carrier processing head 136 can move downward along the carrier processing head moving plane 136p until the (separated) carrier 103 contacts the upper side or upper surface of the unloading tray 141, and then release the (separated) carrier 103 onto the unloading tray 141. Subsequently, the carrier processing head 136 can move in the opposite direction, away from the unloading tray 141, to facilitate the removal of the unloading tray 141 (which now carries the (separated) carrier 103) from the carrier processing station 130 and into the unloading station 140. Therefore, after the carrier processing head 136 releases the (separated) carrier 103 onto the unloading tray 141, the unloading tray 141 can transport the (separated) carrier 103 to the unloading station 140 (e.g., for removing the carrier 103 from the panel release system 1000).

[0071] According to several embodiments, the carrier 103 may include an orientation feature 103a (e.g., a chamfer or chamfered edge, mark, notch, or other physical identification mark) for indicating the orientation of the carrier 103 in the panel release system 1000. Orientation identification of the carrier 103 ensures that the carrier 103 (and the bonded molded panel 101) can be correctly aligned and handled in the panel release system 1000. As shown in FIG1A(b), the orientation feature 103a is a chamfer, which can be formed by cutting a corner of the carrier 103, which is originally square or approximately square.

[0072] According to several embodiments, the direction of lateral or transverse movement of the unloading tray 141 along the unloading tray movement plane 141p may be non-parallel (e.g., perpendicular or substantially perpendicular) to the direction of lateral or transverse movement of the carrier platform 111 along the carrier platform movement plane 111p. In other words, the carrier platform 111 and the unloading tray 141 may move in directions that are different from and / or non-parallel (e.g., perpendicular) to each other. Therefore, before releasing the (separated) carrier 103 onto the unloading tray 141, and while the carrier handling head retainer 138 still holds the (separated) carrier 103 on the engagement surface 136a of the carrier handling head 136, the carrier handling head 136 may also rotate the (separated) carrier 103 by an angle (e.g., approximately a right angle or 90° clockwise). Optionally, the rotation angle is approximately equal to the angle between the direction of movement of the unloading tray 141 on the unloading tray moving plane 141p and the direction of movement of the carrier stage 111 on the carrier stage moving plane 111p, so as to align the (separated) carrier 103 with downstream processes before it is delivered out of the panel release system 1000. Specifically, the carrier processing head 136 (or at least its lower portion having a mating surface 136a) is rotatable about a carrier processing unit rotation axis 136r (see FIG. 1C). Optionally, the carrier processing unit rotation axis 136r is perpendicular or substantially perpendicular to the base and / or the ground erected vertically relative to the panel release system 1000. Optionally, the carrier processing unit rotation axis 136r passes through the carrier processing head 136 (e.g., through its central axis) and is aligned (e.g., parallel and / or coincident) with the carrier processing head moving plane 136p.

[0073] In several embodiments, the rotation angle of the carrier 103 about the carrier processing unit rotation axis 136r may be based not only on the direction of relative movement between the unloading tray 141 and the carrier stage 111, but also on the alignment requirements affected by the layout of the unloading station 140 and / or the carrier processing station 130, and / or other factors. For example, the rotation angle of the carrier 103 about the carrier processing unit rotation axis 136r may be determined by a number of factors, including (but not limited to) the layout of the various components within the panel release system 1000 (e.g., the unloading station 140 and / or the carrier processing station 130), and the positioning requirements of upstream and / or downstream processes and / or automation adjacent to the panel release system 1000.

[0074] According to several embodiments, the rotation of the carrier processing head 136 about the carrier processing unit rotation axis 136r can be based on a rotation signal. Optionally, the rotation signal can be transmitted to the carrier processing head 136 to instruct it to rotate according to a set setting.

[0075] According to several embodiments, FIG1F schematically shows that in the panel release system 1000, the unloading station 140 can be directly connected to the release station 110.

[0076] As shown in Figure 1F, the unloading station 140 can be directly connected to the release station 110, that is, the unloading station 140 can be located adjacent to and downstream of the release station 110.

[0077] As shown in Figure 1F, the carrier stage 111 can move between the release station 110 and the unloading station 140 to transport the (separated) carrier 103 directly from the release station 110 to the unloading station 140. Compared with Figure 1E, there is no carrier processing station 130 between the release station 110 and the unloading station 140.

[0078] According to several embodiments, Figures 1G to 1J schematically show one operating mode of the tape removal tool 131.

[0079] According to several embodiments, the panel release system 1000 may include a tape removal tool 131 for removing the heat-release tape 102 from the carrier 103. After the molded panel 101 is separated from the carrier 103 at the release station 110, the heat-release tape 102 can still adhere to the (separated) carrier 103 because the pressure-sensitive adhesive layer 102b in the heat-release tape 102 can retain its stickiness after being heated to the heat release temperature (i.e., after the release operation is completed).

[0080] As shown in Figures 1G to 1J, when the carrier platform 111, carrying the carrier 103 and the residual heat-release tape 102 on it, is aligned with the tape removal tool 131, the tape removal tool 131 can remove the heat-release tape 102 remaining on the carrier 103 after the molded panel 101 is separated from the carrier 103. The tape removal tool 131 can first peel the peripheral portion 1022 of the heat-release tape 102 upward from the carrier 103. Subsequently, the tape removal tool 131 can grasp (e.g., clamp) the peripheral portion 1022 of the heat-release tape 102, at which point the remaining portion 1024 of the heat-release tape 102 is still adhered to the carrier 103. Optionally, after grasping the heat-release tape 102, the tape removal tool 131 can move between the first edge portion 102d and the opposite second edge portion 102e of the carrier 103, thereby picking up the heat-release tape 102 from the first edge portion 102d of the carrier 103 and moving it across the entire carrier 103 toward the second edge portion 102e, thereby completely removing the heat-release tape 102.

[0081] Optionally, the tape removal tool 131 includes an attachment mechanism for clamping the peripheral portion 1022 (and the resulting raised portion 1026) of the heat-release tape 102. Optionally, the attachment mechanism includes a clamping mechanism 137 (e.g., jaws, clamps, pincers, or fingers) for gripping the peripheral portion 1022 of the heat-release tape 102. Optionally, as shown in FIG1G, the clamping mechanism 137 may include a first clamping finger 1372 and a second clamping finger 1374 disposed opposite each other. As shown in FIG1H, the first clamping finger 1372 and the second clamping finger 1374 may move toward each other (as indicated by opposite dashed arrows in FIG1H) to apply a clamping force to clamp the peripheral portion 1022 (e.g., raised portion 1026) of the heat-release tape 102. Alternatively, the attachment mechanism may also include a vacuum mechanism (e.g., a suction cup) (not shown) for picking up the peripheral portion 1022 of the heat-release tape 102. The attachment mechanism can be operated according to a corresponding control signal to pick up the peripheral portion 1022 of the heat-release tape 102. Optionally, the tape removal tool 131 can move on the carrier 103 (e.g., from the first edge portion 102d to the opposite second edge portion 102e) while maintaining the grip on the heat-release tape 102, thereby peeling or pulling off the remaining portion 1024 from the carrier 103 (as shown in FIG. 1I) to achieve complete removal of the heat-release tape 102 from the carrier 103 (as shown in FIG. 1H). The tape removal tool 131 can also move along a predetermined path or movement trajectory (e.g., a straight line, an arc, or a multi-segment path) to completely separate the heat-release tape 102 from the carrier 103.

[0082] According to several embodiments, to facilitate engagement with the heat-release tape 102 and initiate the tape removal process, the tape removal tool 131 may further include a separation aid 132 for an initial separation step. Optionally, the separation aid 132 may include a plowing member 133 (e.g., a blade) that can move laterally or in a parallel direction (i.e., "plow") onto the peripheral portion 1022 of the heat-release tape 102, thereby hooking the heat-release tape 102 and forming a ridge 1026 (i.e., a wave-like structure formed on the peripheral portion 1022 of the heat-release tape 102, as shown in FIG. 1H). Subsequently, the ridge 1026 can be easily clamped, pulled up, and peeled off by the tape removal tool 131. The initial separation step may be performed before or in conjunction with the tape removal tool 131, thereby continuously and reliably removing the heat-release tape 102 from the surface of the carrier 103.

[0083] Optionally, the separation aid 132 may first be positioned on the same plane as the heat-release tape 102, and then apply a pushing force toward the side or edge of the heat-release tape 102 to form a ridge 1026 on the heat-release tape 102. Subsequently, the ridge 1026 may be clamped by the opposing first clamping fingers 1372 and second clamping fingers 1374 of the clamping mechanism 137, thereby initiating the peeling or removal process of the heat-release tape 102.

[0084] According to several embodiments, Figures 1K to 1N schematically illustrate another operating mode of the tape removal tool 131.

[0085] Optionally, the separation aid 132 includes a plowing member 133, which has limited lateral or transverse movement (e.g., is not movable laterally or transversely), but can move up and down along a plowing member movement plane 133p. Optionally, the plowing member movement plane 133p can be parallel or substantially parallel to the release head movement plane 116p. Specifically, when the heat release tape 102 is aligned with the plowing member 133, the plowing member 133 can move away from or towards the heat release tape 102 on the carrier 103.

[0086] In several embodiments, the plowing member 133 may initially be in a raised position so that the carrier platform 111 (carrier 103 carrying the heat-release tape 102) can move smoothly until the peripheral portion 1022 of the heat-release tape 102 is aligned with the plowing member 133. Subsequently, the plowing member 133 may descend to contact and engage with the peripheral portion 1022 of the heat-release tape 102 (as shown in FIG. 1L). Then, the carrier platform 111 carrying the heat-release tape 102 may move laterally or sideways relative to the plowing member 133 (e.g., along the carrier platform movement plane 111p), at which point the plowing member 133 remains fixed and engages with the peripheral portion 1022 of the heat-release tape 102 (as shown in FIG. 1M). Through this relative movement, the peripheral portion 1022 of the heat-release tape 102 is hooked or held by the plowing member 133, thereby bringing the heat-release tape 102 into contact with the plowing member 133 and forming a bulge 1026 during movement (as shown in FIG. 1N). Once the raised portion 1026 is formed, the tape removal tool 131 can easily clamp, peel, and pull up the raised portion 1026. After the process is completed, the plowing member 133 can be lifted (e.g., to the lifted position) away from the carrier platform 111, so that the carrier platform 111 can be removed from the plowing member 133 (e.g., moved to another component or other location of the panel release system 1000).

[0087] According to several embodiments, Figures 10 and 1P schematically illustrate the operating mechanism of the tape removal tool 131 operated in accordance with the manner described in Figures 1K to 1N. Specifically, Figure 10 schematically shows a cross-sectional view along section AA in Figure 1K.

[0088] According to several embodiments, referring to Figures 10 and 1P, the separation aid 132 may include one or more blades 134 for engaging the heat-release tape 102. For example, the blades 134 may include one or more blades 134a for engaging a first peripheral portion 1022a of the heat-release tape 102; one or more blades 134b for engaging a second (opposite) peripheral portion 1022b of the heat-release tape 102; and one or more blades 134c for engaging an intermediate peripheral portion 1022c of the heat-release tape 102 (e.g., located between the first peripheral portion 1022a and the second peripheral portion 1022b).

[0089] According to several embodiments, the blade 134 may be mounted on the blade support head 139 of the separation aid 132. For example, the blade 134 may be rigidly fixed to the blade support head 139. Alternatively, the blade 134 may be elastically connected to the blade support head 139 via a damping mechanism (e.g., a spring (not shown)) that can controllably adjust the connection between the blade 134 and the heat-release tape 102, ensuring sufficient contact between the blade 134 and the heat-release tape 102 while preventing the blade 134 from applying excessive pressure to the heat-release tape 102. Optionally, multiple blades 134 may be arranged in a straight line, thus engaging with the heat-release tape 102 linearly (i.e., along the width direction of the heat-release tape 102), facilitating uniform peeling of the heat-release tape 102 from the carrier 103.

[0090] According to several embodiments, the density (e.g., number of blades per unit length or unit area) of the blades 134a, 134b at the first and second peripheral portions 1022a, 1022b of the heat-release tape 102 may be higher than the blade density at the intermediate peripheral portion 1022c. Since the heat-release tape 102 typically has stronger adhesion at the first and second peripheral portions 1022a, 1022b, making initiation of peeling more difficult, this design facilitates more efficient formation of the raised portion 1026 at the first and second peripheries 1022a, 1022b. However, the density of the blades 134a, 134b at the first and second peripheral portions 1022a, 1022b of the heat-release tape 102 may also be the same as or similar to the density of the blades 134c at the intermediate peripheral portion 1022c.

[0091] According to several embodiments, referring to FIG10, the plowing member 133 may include a pair of blades 134a fixed to a first edge portion 139a of the blade support head 139 (e.g., arranged in a linear single row or laterally side by side) for engaging a first peripheral portion 1022a of the heat-release tape 102; and another pair of blades 134b fixed to a second (opposite) edge portion 139b of the blade support head 139 for engaging a second peripheral portion 1022b of the heat-release tape 102. Optionally, the plowing member 133 includes a blade 134c fixed to an inner portion 139c of the blade support head 139, i.e., located between the first edge portion 139a and the second edge portion 139b. Optionally, the plowing member 133 may also include a pair of blades 134c fixed to an inner portion 139c of the blade support head 139.

[0092] According to several embodiments, the blade support head 139 may be connected to an actuator 80 (e.g., a pneumatic actuator, a linear actuator) of the panel release system 1000. The actuator 80 may move the blade support head 139 together with the blade 134 along the plowing member movement plane 133p relative to the heat release tape 102 on the carrier 103.

[0093] According to several embodiments, the plurality of first clamping fingers 1372 of the clamping mechanism 137 can work in conjunction with the corresponding plurality of second clamping fingers 1374 (as shown in Figures 1G to 1N) to clamp the heat-release tape 102 after the raised portion 1026 is formed on the heat-release tape 102, thereby initiating the peeling or removal of the heat-release tape 102.

[0094] According to several embodiments, the movement of the blade 134 along the plowing member movement plane 133p (see FIG. 1K) can be independent of the movement of the clamping mechanism 137 (e.g., clamping fingers 1372, 1374). In other words, the blade 134 can move freely relative to the clamping mechanism 137. However, the blade 134 and the clamping mechanism 137 (e.g., clamping fingers 1372, 1374) can also move synchronously or cooperatively as a whole along the plowing member movement plane 133p.

[0095] According to several embodiments, a plurality of blades 134 of the plowing member 133 may be arranged between the opposing gripping fingers 1372 and 1374 of the clamping mechanism 137. For example, the plowing member 133 is equidistant from the opposing gripping fingers 1372 and 1374. In other words, the plowing member 133 (e.g., the plurality of blades 134) may be located on the central axis of the clamping mechanism 137.

[0096] According to several embodiments, the tape removal tool 131 may be a separate removal module in the panel release system 1000, or part of the removal module. Alternatively, the removal module may be integrated into any suitable component of the panel release system 1000 (e.g., located at release station 110, or at a suitable location downstream of release station 110, such as carrier processing station 130).

[0097] Alternatively, the removal of the heat-release tape 102 can also be performed outside the panel release system 1000. For example, the carrier 103, along with the heat-release tape 102 still adhered to it, can be removed from the panel release system 1000 (i.e., without a removal process). Accordingly, the removal of the heat-release tape 102 can be performed in a separate external device outside the panel release system 1000, for example, in a downstream process connected to the panel release system 1000.

[0098] According to several embodiments, FIG1Q schematically shows a panel release system 1000 having a preheating station 150 connected to a release station 110.

[0099] According to several embodiments, the preheating station 150 may be connected to the release station 110 (directly or indirectly). Specifically, the preheating station 150 may be located upstream of the release station 110 (e.g., directly upstream).

[0100] According to several embodiments, the intermediate panel-carrier assembly 104 may pass through a preheating station 150 before being sent to the release station 110.

[0101] According to several embodiments, the preheating station 150 may be configured to receive the intermediate panel-carrier assembly 104, depending on the setup of the panel release system 1000 in the entire packaging process and its integration into the entire production, manufacturing, and assembly process. For example, the intermediate panel-carrier assembly 104 may be fed into the preheating station 150 with the molded panel 101 on top, either manually or via the feeding station 160 (as shown in FIG. 1Q below).

[0102] According to several embodiments, the preheating station 150 may include a preheating table 151. The preheating table 151 may have a table surface 151a (e.g., its upper surface or upward-facing surface) for receiving and / or supporting the intermediate panel-carrier assembly 104. Specifically, the table surface 151a of the preheating table 151 may support the intermediate panel-carrier assembly 104 and keep the molded panel 101 facing upward.

[0103] According to several embodiments, the preheating platform 151 may further include a preheater 152, which can heat (i.e., "preheat") the intermediate panel-carrier assembly 104 when it is located on the platform 151a of the preheating platform 151. The preheating can bring the intermediate panel-carrier assembly 104 to an intermediate temperature between ambient temperature and heat release temperature. Preferably, the intermediate temperature is approximately 120°C. Optionally, the preheater 152 may be associated with the platform 151a of the preheating platform 151. When the platform 151a of the preheating platform 151 contacts the intermediate panel-carrier assembly 104, the preheater 152 can preheat the intermediate panel-carrier assembly 104. For example, the preheater 152 may be disposed at the platform 151a of the preheating platform 151, enabling heat conduction or heat coupling with the intermediate panel-carrier assembly 104 when it is located on the platform 151a. For example, the preheater 152 can be arranged on the platform 151a of the preheating table 151, so that the intermediate panel-carrier assembly 104 can be in direct contact with the platform 151a. Alternatively, the preheater 152 can be embedded within the platform 151a, thus heating the platform 151a. The platform 151a can then conduct the heat generated by the preheater 152 to the intermediate panel-carrier assembly 104. In this case, the platform 151a can be made of a material with good thermal conductivity. Alternatively, a thermal interface material can be provided on the platform 151a (e.g., between the platform 151a and the intermediate panel-carrier assembly 104). Therefore, the carrier 103 in the intermediate panel-carrier assembly 104 can be in direct or indirect thermal contact with the platform 151a and / or the preheater 152. Optionally, the preheater 152 has a heating plate. Optionally, the heating plate can also be separately disposed from the platform 151a of the preheating table 151. For example, the heating plate is independent and positioned below and thermally coupled to the tabletop 151a. It is understood that the preheater 152 of the preheating table 151 can also be implemented in any other suitable manner, including (but not limited to) solid-state heating elements, radiant heating devices, or any other construction capable of producing the desired thermal effect. Optionally, the preheater 152 of the preheating table 151 can be preheated based on a preheating control signal. The preheating control signal can be transmitted to the preheater 152 of the preheating table 151 after the intermediate panel-carrier assembly 104 is placed onto the preheating table 151 within the preheating station 150, and / or before the intermediate panel-carrier assembly 104 is released at the release station 110. Accordingly, the panel release system 1000 (e.g., the preheating table 151) may include sensors for detecting contact or engagement between the preheating table 151 and the intermediate panel-carrier assembly 104, thereby triggering the preheating control signal.

[0104] According to several embodiments, the preheating table 151 may further include a preheating table holder 153 that releasably holds the intermediate panel-carrier assembly 104 on the table surface 151a of the preheating table 151. Optionally, the preheating table holder 153 may be associated with (e.g., located on or near) the table surface 151a of the preheating table 151. Optionally, the preheating table holder 153 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a clamp or gripper), an electrostatic holder, an end effector, etc. Operation of the preheating table holder 153 may be based on a holding control signal. Optionally, the holding control signal may be transmitted to the preheating table holder 153 to instruct its operation.

[0105] According to several embodiments, the preheating station 150 (e.g., via preheater 152) can gradually heat the intermediate panel-carrier assembly 104, causing its temperature to gradually rise to the intermediate temperature, and then maintain the intermediate temperature or near it for a predetermined period of time.

[0106] According to several embodiments, the preheating station 150 may include a preheating unit 155. The preheating unit 155 may include a preheating head 156. The preheating head 156 may be disposed within the preheating station 150, opposite and / or above the preheating platform 151. For example, within the preheating station 150, the preheating platform 151 may be located in a lower region (lower part), while the preheating head 156 is located in a higher region (upper part).

[0107] According to several embodiments, the preheating head 156 may be movable within the preheating station 150 along a preheating head movement plane 156p. The preheating head movement plane 156p may be a substantially flat plane and substantially vertically oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is placed vertically on an external ground). The preheating head movement plane 156p may be parallel or substantially parallel to the release head movement plane 116p at the release station 110. According to several embodiments, when the preheating table 151 is located within the preheating station 150, the preheating head movement plane 156p may be aligned (e.g., intersect) with the preheating table 151. Optionally, the preheating unit 155 can operate similarly to a pressing device or an upper pressing device. The preheating head 156 can move upward and downward along the preheating head moving plane 156p, and can engage with the intermediate panel-carrier assembly 104 when the intermediate panel-carrier assembly 104 is aligned with and / or located below the preheating head 156, and / or can lift the intermediate panel-carrier assembly 104. When the preheating table 151 is located within the preheating station 150 and aligned with the preheating head 156, the preheating head 156 can move toward the table surface 151a of the preheating table 151 to engage the molded panel 101 of the intermediate panel-carrier assembly 104. The movement of the preheating head 156 along the preheating head moving plane 156p can be based on a movement signal. Optionally, the movement signal can be transmitted to the preheating head 156 to indicate its movement.

[0108] According to several embodiments, the preheating head 156 may include a preheating head retainer 158. The preheating head retainer 158 may be used to releasably retain (e.g., releasably secure or lock) the intermediate panel-carrier assembly 104 at the mating surface 156a of the preheating head 156. The preheating head retainer 158 may be associated with the mating surface 156a of the preheating head 156. Optionally, the preheating head retainer 158 may include a vacuum adsorption mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a gripper or clamp), an electrostatic chuck, an end effector, etc. Operation of the preheating head retainer 158 may be based on a holding control signal. Optionally, the holding control signal may be transmitted to the preheating head retainer 158 to indicate its operation.

[0109] According to several embodiments, the preheating head 156 may include a preheater 157 associated with the mating surface 156a of the preheating head 156, such that the preheater 157 can preheat the intermediate panel-carrier assembly 104 when the mating surface 156a of the preheating head 156 is engaged with the intermediate panel-carrier assembly 104. For example, the preheater 157 may be disposed at the mating surface 156a of the preheating head 156. When the intermediate panel-carrier assembly 104 is held on the platform 151a of the preheating table 151 and the mating surface 156a of the preheating head 156 is engaged with the intermediate panel-carrier assembly 104, the preheater 157 of the preheating head 156 can preheat the intermediate panel-carrier assembly 104 in a cooperative manner with the preheater 152 of the preheating table 151. The preheater 157 of the preheating head 156 can perform preheating operation according to a preheating control signal. When both the preheating head 156 and the preheating platform 151 are engaged with the intermediate panel-carrier assembly 104, the preheating control signal can be transmitted to the preheater 157 of the preheating head 156 to achieve coordinated preheating of the intermediate panel-carrier assembly 104. The panel release system 1000 (e.g., the preheating head 156) may also include a sensor for detecting the engagement status of the preheating head 156 with the intermediate panel-carrier assembly 104, and for triggering the preheating control signal.

[0110] According to several embodiments, the preheating platform 151 is movable between the preheating station 150 and the release station 110. Specifically, the preheating platform 151 can be moved from the preheating station 150 to the release station 110 to transport the intermediate panel-carrier assembly 104 from the preheating station 150 to the release station 110. Thus, the preheating platform 151 may correspond to a separate transfer (or shuttle, sliding, movable) platform (or workbench). The preheating platform 151 is movable along a preheating platform movement plane 151p extending between the preheating station 150 and the release station 110. The preheating platform movement plane 151p may be a substantially flat plane and may be substantially horizontally oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is placed vertically on an external ground). The preheating platform movement plane 151p may not be parallel to the preheating head movement plane 156p (e.g., perpendicular or substantially perpendicular). The preheating platform 151 can move between the preheating station 150 and the release station 110 in a lateral or transverse direction along the preheating platform movement plane 151p. This lateral or transverse direction of movement may (but is not limited to) be non-parallel (e.g., perpendicular or substantially perpendicular) to the direction of movement of the panel platform 121 along the panel platform movement plane 121p (i.e., the direction of movement of the panel platform 121 between the panel processing station 120 and the release station 110). The panel release system 1000 may include a track, guide rail, or slide rail (e.g., a linear track) extending between the preheating station 150 and the release station 110, along which the preheating platform 151 can move (e.g., slide). The movement of the preheating platform 151 along the preheating platform movement plane 151p may be based on a movement signal. Optionally, the movement signal may be transmitted to the preheating platform 151 to indicate its movement.

[0111] According to several embodiments, the preheating stage moving plane 151p may be parallel to the carrier stage moving plane 111p.

[0112] According to several embodiments, the preheating platform moving plane 151p of the preheating platform 151 may be spatially separated from and / or parallel to and / or located above or below the carrier platform moving plane 111p of the carrier platform 111. For example, when the preheating platform 151 moves into the release station 110, it may be located above the carrier platform 111 (i.e., above the carrier platform moving plane 111p) to align with the release head 116, which can then lift the intermediate panel-carrier assembly 104 from the preheating platform 151. Optionally, the preheating platform moving plane 151p may also be located below the carrier platform moving plane 111p. After the release head 116 lifts the intermediate panel-carrier assembly 104 from the preheating platform 151, the preheating platform 151 may be moved out of the release station 110 (e.g., back to the preheating station 150), while the carrier platform 111 may move into the release station 110 and align with the release head 116. Subsequently, the release head 116 can release the intermediate panel-carrier assembly 104 onto the carrier stage 111. This allows the intermediate panel-carrier assembly 104 to be first heated to its heat release temperature before the release operation, separating the molded panel 101 from the carrier 103. Therefore, when the preheating stage 151 carrying the intermediate panel-carrier assembly 104 moves into the release station 110 and aligns with the release head 116, the release head 116 can move toward the preheating stage 151. When the carrier stage 111 is aligned with the release head 116, the release head 116 can releasably hold the intermediate panel-carrier assembly 104 on its mating surface 116a, thereby removing the intermediate panel-carrier assembly 104 from the preheating stage 151, after which the intermediate panel-carrier assembly 104 can be released onto the carrier stage 111. The preheating stage moving plane 151p of the preheating stage 151 may be parallel to and / or spaced apart from the carrier stage moving plane 111p of the carrier stage 111 and / or the panel stage moving plane 121p of the panel stage 121.

[0113] According to several embodiments, the preheating stage moving plane 151p and the carrier stage moving plane 111p may be parallel and aligned (e.g., coincident). Optionally, the panel release system 1000 may include a single and continuous track, guide rail, or slide rail along which the preheating stage 151 and the carrier stage 111 can move. Thus, the carrier stage 111 may first move out of the release station 110, thereby allowing the preheating stage 151 to move into the release station 110.

[0114] According to several embodiments, referring to FIG1Q, the panel release system 1000 may include a feed station 160, which may be connected to (e.g., directly connected to) a preheating station 150. Specifically, the feed station 160 may be located upstream of (e.g., immediately adjacent to) the preheating station 150.

[0115] It is understood that the feed station 160 may also have other configurations. For example, the feed station 160 may be connected to the release station 110 (e.g., directly connected) and may be located upstream of the release station 110 (e.g., adjacent upstream position) so as to convey the intermediate panel-carrier assembly 104 directly from the feed station 160 to the release station 110.

[0116] Referring to Figure 1Q, according to various embodiments, the feed station 160 can receive and transfer the intermediate panel-carrier assembly 104 to a corresponding location connected thereto (e.g., preheating station 150). In other words, when the feed station 160 is connected to the preheating station 150, it may have the configuration or function of transferring the intermediate panel-carrier assembly 104 to the preheating station 150.

[0117] According to several embodiments, the feeding station 160 may include a feeding mechanism 161 (e.g., a conveyor, platform, or feeding tray). The feeding mechanism 161 may receive the intermediate panel-carrier assembly 104 from outside the panel release system 1000. The intermediate panel-carrier assembly 104 may be placed on the conveying surface 161a above the feeding mechanism 161 by means of a robotic arm, pick-and-place system, automated guided vehicle or tool, conveyor belt, or any other suitable means or mechanism.

[0118] According to several embodiments, the conveying surface 161a of the feeding mechanism 161 can support the intermediate panel-carrier assembly 104 and align the intermediate panel-carrier assembly 104 relative to an alignment structure 154 (e.g., a stop, end stop, limiter, cylinder stop, etc.) and limit its movement position. Optionally, the alignment structure 154 is located in the preheating station 150. Optionally, the conveying surface 161a of the feeding mechanism 161 includes rollers, roller conveyors, roller belts, or any other rolling mechanism or any suitable movable conveying device for aligning the intermediate panel-carrier assembly 104 within the preheating station 150 when the intermediate panel-carrier assembly 104 is in the conveying surface 161a of the feeding mechanism 161 (i.e., with a rolling mechanism).

[0119] According to several embodiments, the alignment structure 154 at the preheating station 150 has a limiting element function, which can ensure that the intermediate panel-carrier assembly 104 is aligned with the preheating head 156 in the preheating station 150 by preventing the intermediate panel-carrier assembly 104 from moving unexpectedly beyond a predetermined position in the preheating station 150.

[0120] According to several embodiments, the alignment structure 154 at the preheating station 150 can move up and down in a direction parallel or substantially parallel to the preheating head moving plane 156p. Therefore, when the intermediate panel-carrier assembly 104 is located on the conveying surface of the feeding mechanism 161 within the preheating station 150, the alignment structure 154 can move upward to contact one side of the intermediate panel-carrier assembly 104, thereby aligning the intermediate panel-carrier assembly 104 with the preheating head 156 of the preheating station 150. Once alignment is complete, before or after the intermediate panel-carrier assembly 104 is picked up by the preheating head 156, the alignment structure 154 can move downward to allow the preheating table 151 to move into the preheating station 150 and align with the preheating head 156 and the intermediate panel-carrier assembly 104.

[0121] According to several embodiments, the feeding mechanism 161 is movable between the feeding station 160 and the preheating station 150. Specifically, the feeding mechanism 161 moves from the feeding station 160 to the preheating station 150 to transport the intermediate panel-carrier assembly 104 from the feeding station 160 to the preheating station 150. Optionally, the feeding mechanism 161 is a separate transfer table (or slide, moving platform, etc.). The feeding mechanism 161 is movable along a feeding mechanism movement plane 161p extending between the feeding station 160 and the preheating station 150. The feeding mechanism movement plane 161p can be a substantially flat plane and can be oriented substantially horizontally (e.g., relative to the base of the panel release system 1000 and / or when the panel release system 1000 is placed vertically on an external ground or ground). The feeding mechanism movement plane 161p can be non-parallel to the preheating head movement plane 156p and / or the release head movement plane 116p (e.g., perpendicular or substantially perpendicular). The feeding mechanism moving plane 161p can (but is not limited to) be parallel to the panel table moving plane 121p and / or the unloading tray moving plane 141p. Therefore, the feeding mechanism 161 can move laterally or sideways along the feeding mechanism moving plane 161p between the feeding station 160 and the preheating station 150. The direction of this lateral or sideways movement can (but is not limited to) be parallel to the direction of the panel table 121's lateral or sideways movement along the panel table moving plane 121p between the panel processing station 120 and the release station 110. Optionally, the panel release system 1000 includes a guide rail, track, or slide rail (e.g., a linear guide rail) disposed between the feeding station 160 and the preheating station 150 to guide the movement (e.g., sliding) of the feeding mechanism 161. Therefore, the feeding mechanism 161 can be moved out of the feeding station 160 and subsequently into the preheating station 150; or it can be moved out of the preheating station 150 and subsequently into the feeding station 160. Optionally, the movement of the feeding mechanism 161 along the feeding mechanism moving plane 161p can be based on a movement signal. Optionally, the movement signal can be transmitted to the feeding mechanism 161 to instruct its movement.

[0122] According to several embodiments, when the preheating head 156 is located in the upper region of the preheating station 150, the feeding mechanism 161 can move into the preheating station 150 and align with the preheating head 156 (e.g., located below the preheating head 156). Furthermore, when the feeding mechanism 161 is located within the preheating station 150, the conveying surface 161a of the feeding mechanism 161 can align the intermediate panel-carrier assembly 104 relative to the alignment structure 154 within the preheating station 150 and align it with the preheating head 156 of the preheating station 150.

[0123] Specifically, when the feeding mechanism 161 carrying the intermediate panel-carrier assembly 104 moves into the preheating station 150 and aligns with the preheating head 156, the preheating head 156 can move to the feeding mechanism 161 to engage the intermediate panel-carrier assembly 104, releasably hold the intermediate panel-carrier assembly 104 on the engagement surface 156a of the preheating head 156, and remove the intermediate panel-carrier assembly 104 from the feeding mechanism 161. Subsequently, within the preheating station 150, when the preheating table 151 aligns with the preheating head 156, the preheating head 156 can release the intermediate panel-carrier assembly 104 onto the preheating table 151 to preheat the intermediate panel-carrier assembly 104 to an intermediate temperature.

[0124] According to several embodiments, the feeding mechanism moving plane 161p of the feeding mechanism 161 may be spatially separated from and / or parallel to and / or located above the preheating table moving plane 151p of the preheating table 151. Therefore, when the feeding mechanism 161 moves into the preheating station 150, the feeding mechanism 161 may be located above the preheating table 151 (or the preheating table moving plane 151p) to align with the preheating head 156. Optionally, the feeding mechanism moving plane 161p may also be located below the preheating table moving plane 151p.

[0125] According to several embodiments, the preheating table 151 can move synchronously with the feeding mechanism 161 to enter and exit the preheating station 150. Therefore, the preheating table 151 can be moved out of the preheating station 150 (e.g., to the release station 110, or to a location between the preheating station 150 and the release station 110), thereby facilitating the feeding mechanism 161's entry into the preheating station 150 and / or alignment with the preheating head 156 within the preheating station 150. Optionally, the preheating table 151 and the feeding mechanism 161 can move along the same plane, or they can move separately along different and spatially separated planes (e.g., one plane lies on top of another).

[0126] According to several embodiments, when the feeding mechanism 161 is aligned with the preheating head 156, the preheating head 156 can move toward the feeding mechanism 161 to releasably hold and lift the intermediate panel-carrier assembly 104 away from the feeding mechanism 161 (e.g., using a preheating head holder 158). Therefore, when the preheating head 156 (which releasably holds the intermediate panel-carrier assembly 104) is removed from the feeding mechanism 161, the feeding mechanism 161 (which no longer has the intermediate panel-carrier assembly 104 on it) moves out of the preheating station 150 and returns to the feeding station 160 (where the next intermediate panel-carrier assembly 104 can be received). Subsequently, when the preheating table 151 is aligned with the preheating head 156, the preheating head 156 can place the intermediate panel-carrier assembly 104 onto the preheating table 151.

[0127] According to several embodiments, the feeding mechanism moving plane 161p and the preheating table moving plane 151p can be horizontal or substantially horizontal (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is placed and / or erected on an external ground or floor). Simultaneously, the direction of lateral or transverse movement of the feeding mechanism 161 along the feeding mechanism moving plane 161p may not be parallel to the direction of lateral or transverse movement of the preheating table 151 along the preheating table moving plane 151p (e.g., perpendicular or substantially perpendicular). In other words, the feeding mechanism 161 and the preheating table 151 can move in different and / or non-parallel (e.g., perpendicular) directions. Optionally, the preheating head 156 can rotate about a preheating head rotation axis 156r relative to the intermediate panel-carrier assembly 104. The preheating head rotation axis 156r can be vertically oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is set and / or placed upright on an external ground or floor), can pass through the preheating head 156 (e.g., its central axis), or can be aligned with the preheating head movement plane 156p (e.g., parallel and / or coincident). Before releasing the intermediate panel-carrier assembly 104 onto the preheating stage 151, while the preheating head 156 releasably holds the intermediate panel-carrier assembly 104 on the mating surface 156a, the preheating head 156 can rotate the intermediate panel-carrier assembly 104 by an angle about the preheating head rotation axis 156r (e.g., a right angle clockwise when viewed from the top or top view). The angle is approximately equal to the angle (e.g., a right angle) between the direction of movement of the feeding mechanism 161 along the feeding mechanism moving plane 161p and the direction of movement of the preheating table 151 along the preheating table moving plane 151p, so that the intermediate panel-carrier assembly 104 is aligned with the preheating station 150.

[0128] According to several embodiments, determining the angle of rotation of the intermediate panel-carrier assembly 104 about the preheating head rotation axis 156r is based not only on the direction of relative movement between the feeding mechanism 161 and the preheating station 151, but also on the relative positions of the feeding station 160 and / or the preheating station 150, as well as other possible factors. The angle of rotation of the intermediate panel-carrier assembly 104 about the preheating head rotation axis 156r can be determined by one or more factors, including (but not limited to): the layout of the components in the panel release system 1000 (e.g., the feeding station 160 and / or the preheating station 150), the requirements of processes or automation outside the panel release system 1000 (upstream and / or downstream), etc.

[0129] According to several embodiments, the rotation of the preheating head 156 about the preheating head rotation axis 156r can be based on a rotation signal. Optionally, the rotation signal can be transmitted to the preheating head 156 to indicate its rotation.

[0130] According to several embodiments, FIG1R schematically shows the direct connection between the feed station 160 and the preheating station 150, wherein the feed station 160 includes an alignment unit 165.

[0131] According to several embodiments, the alignment unit 165 can rotate the intermediate panel-carrier assembly 104 by an angle (e.g., clockwise when viewed from the top or top view of the panel release system 1000). This angle may be approximately equal to the angle between the direction of movement of the feeding mechanism 161 along the feeding mechanism moving plane 161p and the direction of movement of the preheating table 151 along the preheating table moving plane 151p.

[0132] According to several embodiments, the alignment unit 165 may include an alignment head 166. The alignment head 166 may be located on the opposite side and / or above the feeding mechanism 161 within the feeding station 160. Thus, within the feeding station 160, the feeding mechanism 161 may be located in the lower region, while the alignment head 166 may be located in the upper region.

[0133] According to several embodiments, the alignment head 166 can move within the feed station 160 along an alignment head movement plane 166p. Optionally, the alignment head movement plane 166p can be a substantially flat plane and is substantially vertically oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is positioned and / or upright on an external ground or floor). Within the feed station 160, the alignment head movement plane 166p can be parallel or substantially parallel to the release head movement plane 116p at the release station 110. The alignment head movement plane 166p can also be non-parallel to (e.g., perpendicular or substantially perpendicular to) the feed mechanism movement plane 161p. When the feed mechanism 161 is located within the feed station 160, the alignment head movement plane 166p can be aligned (e.g., intersecting) with the feed mechanism 161 (e.g., its conveying surface 161a). Optionally, the alignment unit 165 can operate as a pressing device or an upper pressing device, and the alignment head 166 can move vertically along the alignment head moving plane 166p. When the intermediate panel-carrier assembly 104 is aligned with and below the alignment head 166, the alignment head 166 can engage with the intermediate panel-carrier assembly 104 and lift the intermediate panel-carrier assembly 104 from the feeding mechanism 161 and away from the feeding mechanism 161. When the feeding mechanism 161 (which carries the intermediate panel-carrier assembly 104) is located within the feeding station 160 and aligned with the alignment head 166, the alignment head 166 can move toward the conveying surface 161a of the feeding mechanism 161 to engage with the intermediate panel-carrier assembly 104 on the feeding mechanism 161. The movement of the alignment head 166 along the alignment head moving plane 166p can be based on a movement signal. Optionally, the movement signal can be transmitted to the alignment head 166 to indicate its movement.

[0134] According to several embodiments, the alignment head 166 may include an alignment head retainer 168. The alignment head retainer 168 may releasably retain (e.g., releasably secure or grip) the intermediate panel-carrier assembly 104 on the mating surface 166a (e.g., the lower surface) of the alignment head 166. Optionally, the alignment head retainer 168 is disposed at or near the mating surface 166a of the alignment head 166. The alignment head retainer 168 may include a vacuum suction mechanism (e.g., a vacuum plate, vacuum suction port, vacuum suction cup, etc.), a clamping mechanism (e.g., a gripper or clamp), an electrostatic chuck, an end effector, etc. Operation of the alignment head retainer 168 may be based on a holding control signal. Optionally, the holding control signal may be transmitted to the alignment head retainer 168 to instruct its operation.

[0135] According to several embodiments, the alignment head 166 may also rotate about an alignment unit rotation axis 166r. The alignment unit rotation axis 166r may be vertically oriented (e.g., relative to the base of the panel release system 1000, and / or when the panel release system 1000 is placed vertically on an external ground), and may also pass through the alignment head 166 (e.g., through its central axis), and may also be aligned with the alignment head movement plane 166p (e.g., parallel and / or coincident).

[0136] According to several embodiments, when the intermediate panel-carrier assembly 104 is releasably held on the mating surface 166a of the alignment head 166, and before the alignment head 166 releases the intermediate panel-carrier assembly 104 to the feeding mechanism 161, the alignment head 166 can rotate the intermediate panel-carrier assembly 104 about the alignment unit rotation axis 166r. Optionally, the rotation angle is approximately equal to the angle (e.g., a right angle) formed by the direction of movement of the feeding mechanism 161 along the feeding mechanism movement plane 161p and the direction of movement of the preheating table 151 along the preheating table movement plane 151p.

[0137] According to several embodiments, the rotation angle of the intermediate panel-carrier assembly 104 about the alignment unit rotation axis 166r is not necessarily determined solely by the direction of relative movement between the feeding mechanism 161 and the preheating station 151, but may also be determined by the positional relationship between the feeding station 160 and / or the preheating station 150, as well as other factors. That is, the rotation angle of the intermediate panel-carrier assembly 104 about the alignment unit rotation axis 166r can be determined by a combination of multiple factors, including but not limited to the layout of the components within the panel release system 1000 (e.g., the feeding station 160 and / or the preheating station 150), upstream and / or downstream processes or automation outside the panel release system 1000, etc.

[0138] According to several embodiments, the rotation of the alignment head 166 about the alignment unit rotation axis 166r can be based on a rotation signal. Optionally, the rotation signal can be transmitted to the alignment head 166 to indicate its rotation.

[0139] According to several embodiments, FIG2A schematically shows a perspective view of a panel release system 2000.

[0140] According to several embodiments, the panel release system 2000 may have any or more features of the panel release system 1000. Conversely, the other way around.

[0141] According to several embodiments, the panel release system 2000 may include a feed station 260, which may have any or more features of the feed station 160. Conversely, the same applies.

[0142] According to several embodiments, the panel release system 2000 may include a preheating station 250, which may have any or more features of the preheating station 150. Conversely, the preheating station 250 may be directly or indirectly connected to the feed station 260 (e.g., via a transport mechanism such as one or more movable platforms and / or actuating components in the panel release system 2000). For example, the preheating station 250 may be located downstream of the feed station 260.

[0143] According to several embodiments, the panel release system 2000 may include a release station 210, which may have any or more features of the release station 110. Conversely, the release station 210 may be directly or indirectly connected to the preheating station 250 (e.g., via a transport mechanism such as one or more movable platforms and / or actuating components). For example, the release station 210 may be located downstream of the preheating station 250.

[0144] According to several embodiments, the panel release system 2000 may include a panel processing station 220, which may have any or more features of the panel processing station 120. Conversely, the panel processing station 220 may be directly or indirectly connected to the release station 210 (e.g., via one or more movable platforms and / or actuating components). For example, the panel processing station 220 may be located downstream of the release station 210.

[0145] According to several embodiments, the panel release system 2000 may include a carrier processing station 230, which may have any or more features of the carrier processing station 210. The carrier processing station 230 may be directly or indirectly connected to the release station 210 (e.g., connected via one or more movable platforms and / or actuating components). For example, the carrier processing station 230 may be located downstream of the release station 210.

[0146] According to several embodiments, when the panel release system 2000 includes both a panel processing station 220 and a carrier processing station 230, both the panel processing station 220 and the carrier processing station 230 may be connected to the release station 210 (e.g., connected through different surfaces of the release station 210), and both may be located downstream of the release station 210 (e.g., connected downstream from different surfaces of the release station 210 respectively).

[0147] According to several embodiments, the panel release system 2000 may include an unloading station 240, which may have any or more features of the unloading station 240. The unloading station 240 may be directly or indirectly connected to the carrier processing station 230 (e.g., connected via one or more movable platforms and / or actuating components). For example, the unloading station 240 may be located downstream of the carrier processing station 230.

[0148] According to several embodiments, the panel processing head 226 of the panel processing station 220 (same as or similar to the panel processing head 126) may move along a panel processing head lateral movement plane 226q; the unloading tray 241 of the unloading station 240 (same as or similar to the unloading tray 141) may move along an unloading tray movement plane 241p. The panel processing head lateral movement plane 226q may be parallel to and / or spatially separated from the unloading tray movement plane 241p (e.g., one is above / below the other). Alternatively, the direction of movement of the panel processing head 226 of the panel processing station 220 along the panel processing head lateral movement plane 226q (as shown by dashed arrow 222) may also be perpendicular or substantially perpendicular to the direction of movement of the unloading tray 241 of the unloading station 240 along the unloading tray movement plane 241p (as shown by solid arrow 242). After processing by the panel release system 2000, the molded panel 101 of the intermediate panel-carrier assembly 104 separates from the carrier 103. The (separated) molded panel 101 and (separated) carrier 103 can be transported out of the panel release system 2000 in substantially horizontal but perpendicular or orthogonal directions (as shown by dashed arrow 222 and solid arrow 242). Furthermore, the (separated) molded panel 101 and (separated) carrier 103 are also transported out from different heights of the panel release system 2000. Optionally, the panel processing station 220 may include a panel processing guide rail 229 (e.g., a track, rail, or slide rail) for guiding the panel processing head 226 of the panel processing station 220 to move along the lateral movement plane 226q of the panel processing head in the direction shown by dashed arrow 222. Optionally, the panel processing guide rail 229 may also include an actuator. The actuator can drive the panel processing head 226 to move according to a movement signal transmitted to it.

[0149] According to several embodiments, the panel release system 2000 (and / or its components, such as release station 210, panel processing station 220, carrier processing station 230, unloading station 240, preheating station 250 and / or feeding station 260) can be implemented using a modular architecture. For example, any or more applicable components can be adjusted, omitted, repositioned or replaced as needed.

[0150] According to several embodiments, Figures 2B and 2C illustrate other configurations of the panel release system 2000.

[0151] According to various embodiments, the spatial arrangement of any or more components in the panel release system 2000 may differ. For example, as shown in FIG2B, the feed station 260, preheating station 250, and release station 210 may be aligned in a linear arrangement. Therefore, as shown in FIG2B, the feed station 260 and release station 210 may be located on opposite sides of the preheating station 250. Thus, the intermediate panel-carrier assembly 104 may enter the panel release system 2000 from the feed station 260 and be sequentially conveyed along a linear path to the preheating station 250, and then to the release station 210.

[0152] According to several embodiments, the modular architecture of the panel release system 2000 is characterized by flexibility, adaptability to different manufacturing sites, processes or automation flows, and / or integration with other equipment.

[0153] According to several embodiments, as shown in FIG2C, the (separated) carrier 103 can be directly output from the release station 210 of the panel release system 2000 (i.e., without passing through the carrier processing station 230 and / or unloading station 240). In other words, in FIG2C, the carrier processing station 230 and / or unloading station 240 can be omitted from the panel release system 2000. Optionally, any one or more components in the panel release system 2000 can be selectively omitted.

[0154] According to several embodiments, FIG3A schematically illustrates a control unit 180 that can be integrated into a panel release system 1000. The control unit 180 can be integrated into any or more components of the panel release system 1000, such as release station 110 and / or cutting station 170 (which will be described in FIG3B).

[0155] According to various embodiments, the control unit 180 (e.g., a control module, processor, controller, or microcontroller) can directly or indirectly control the operation performed on the intermediate panel-carrier assembly 104 to disrupt or weaken the adhesive strength between the molded panel 101 and the carrier 103 before the intermediate panel-carrier assembly 104 is heated to the release temperature (e.g., by the carrier stage heater 112 at the carrier stage 111 and / or the release head heater 117 of the release head 116), and / or before the molded panel 101 is separated from the carrier 103.

[0156] In other words, the panel release system 1000 may include a pre-release arrangement / process that performs one or more operations on the intermediate panel-carrier assembly 104 before the molded panel 101 is separated from the carrier 103, for disturbing or weakening the adhesion between the molded panel 101 and the carrier 103. The pre-release arrangement / process may be controlled by a control unit 180 to operate one or more elements of the panel release system 1000 (e.g., carrier stage 111 and / or material removal tool (e.g., cutter 179 as described in FIG. 3B)) to perform operations on the intermediate panel-carrier assembly 104 for disturbing or weakening the adhesive strength between the molded panel 101 and the carrier 103.

[0157] According to several embodiments, the pre-release arrangement / process may apply appropriate force (e.g., mechanical force) to the heat-release tape 102. For example, a shearing or lateral force applied by the carrier stage 111, or a cutting force applied by a material removal tool (e.g., cutter 179), to weaken the adhesion between the carrier 103 and the molded panel 101 in the intermediate panel-carrier assembly 104, thereby reducing the adhesive strength of the heat-release tape 102 before the molded panel 101 is completely separated from the carrier 103.

[0158] According to several embodiments, as shown in FIG3A, the control unit 180 may be integrated with the release station 110 (e.g., electrical and / or communication connections, directly or indirectly). The control unit 180 may control one or more components of the control release system 1000 (e.g., release station 110) to operate the pre-release arrangement / process.

[0159] According to several embodiments, when the carrier stage 111 and the release head 116 cooperatively hold the intermediate panel-carrier assembly 104 (i.e., the carrier stage 111 and the release head 116 are in contact with the carrier 103 and the molded panel 101 in the intermediate panel-carrier assembly 104, respectively), the control unit 180 can control the carrier stage 111 to move a predetermined distance along the carrier stage movement plane 111p (e.g., laterally or shearing). Optionally, the movement is performed by the carrier stage 111 relative to the release head 116. Optionally, the pre-release arrangement / process is performed before the molded panel 101 is completely separated from the carrier 103 (i.e., before the release operation is performed). When the carrier stage 111 and the release head 116 hold the intermediate panel-carrier assembly 104 in a cooperative manner, the relative lateral or shearing movement can mechanically disturb the adhesive interface between the molded panel 101 and the heat-sensitive adhesive layer 102a of the heat-release tape 102, thereby disrupting or weakening the adhesive strength of the heat-release tape 102 and promoting partial detachment of the molded panel 101 from the carrier 103 before complete separation from the carrier 103. Optionally, the pre-release arrangement / process is located at the release station 110. The pre-release arrangement / process can improve the efficiency of subsequent complete separation or release of the intermediate panel-carrier assembly 104. For example, the control unit 180 can control the carrier stage 111 to move (e.g., laterally or shearingly) relative to the release head 116 by the predetermined distance to induce shearing movement, thereby inducing stress, disturbance, or displacement at the adhesive interface between the molded panel 101 and the heat-release tape 102, facilitating the subsequent complete separation process between the molded panel 101 and the heat-release tape 102. Optionally, the predetermined distance by which the carrier stage 111 is controlled to move can be in the range of 0.5 to 3.5 mm, more specifically in the range of 1.5 to 2.5 mm, and more preferably about 2 mm. The carrier stage 111 can be controlled to move unidirectionally or bidirectionally (e.g., moving about 2 mm to the right and / or 2 mm to the left). When the release head holder 118 releasably holds the molded panel 101 in the intermediate panel-carrier assembly 104 on the mating surface 116a of the release head 116, and the carrier platform holder 113 releasably holds the carrier 103 in the intermediate panel-carrier assembly 104 on the platform surface 111a of the carrier platform 111, the control unit 180 can control the carrier platform 111 to move the predetermined distance relative to the release head 116 (at this time, the molded panel 101 and the carrier 103 still overlap each other). Therefore, when the carrier platform 111 and the release head 116 respectively hold the carrier 103 and the molded panel 101, the carrier platform 111 can move the predetermined distance within the release station 110 along the carrier platform movement plane 111p to achieve the pre-release arrangement / process before the molded panel 101 is completely separated from the carrier 103.

[0160] According to several embodiments, the panel release system 1000 may include an actuator (e.g., a motor) connected to a carrier stage 111, capable of driving the carrier stage 111 to move the predetermined distance along a carrier stage movement plane 111p. A control unit 180 may be connected to the actuator (e.g., via communication) to control the movement of the carrier stage 111. The control unit 180 may initiate, regulate, and / or synchronize the movement of the carrier stage 111 relative to the release head 116 by controlling the operation of the actuator, for achieving the desired disturbance at the adhesive interface between the molded panel 101 and the heat-release tape 102.

[0161] According to several embodiments, the carrier stage 111 and the release head 116 may each include alignment elements 182a and 182b (e.g., reference marks). Optionally, the alignment elements 182a and 182b are positioned at corresponding locations on the carrier stage 111 and the release head 116. Optionally, during the pre-release arrangement / process, the alignment elements 182a and 182b allow for monitoring of the relative lateral or shear displacement between the carrier stage 111 and the release head 116 (e.g., vision-based sensors). During the synergistic heating process of the heat-release tape 102 in the intermediate panel-carrier assembly 104 to the heat-release temperature, but before the molded panel 101 is separated from the carrier 103, the alignment elements 182a and 182b may be aligned with each other. Subsequently, the release head 116 remains stationary, while the carrier stage 111 is controlled (e.g., by the control unit 180) to generate relative lateral or shear movement to disturb the adhesive interface between the molded panel 101 and the heat-release tape 102's heat-sensitive adhesive layer 102a. At this point, the alignment elements 182a, 182b on the carrier stage 111 and the release head 116 may lose their previous alignment (misalignment). The misalignment between the alignment elements 182a, 182b can be detected (e.g., by a visual or optical sensor) to confirm the lateral or shear movement at the specified distance. The misalignment between the alignment elements 182a, 182b can be used to verify, measure, or calibrate the displacement produced by an actuator controlled by the control unit 180 (e.g., a motor for controlling the movement of the carrier stage 111), thereby ensuring that the disturbance to the adhesive interface between the molded panel 101 and the heat-release tape 102 has been performed as intended. Sensors (e.g., optical sensors, camera-based image recognition modules, etc.) of the panel release system 1000 may be disposed within the release station 110 to detect alignment and / or misalignment between alignment elements 182a and 182b. These sensors may be communicatively connected to the control unit 180, enabling the control unit 180 to receive and acknowledge signals or measurements related to the predetermined distance. Therefore, the control unit 180 may utilize this information to verify, calibrate, or adjust the lateral or shear movement, and / or provide closed-loop control feedback for actuators that move the carrier stage 111 relative to the release head 116 during the pre-release arrangement / process. Optionally, alignment elements 182a and 182b may be disposed on (matching or complementary) textures or patterns on the outer surfaces of the carrier stage 111 and the release head 116, or any other suitable type of reference marking (e.g., ink or paint-based markings).

[0162] According to several embodiments, the pre-release arrangement / process of the panel release system 1000 may include a carrier stage 111 (i.e., a first mechanical component of the pre-release arrangement) and a release head 116 (i.e., a second mechanical component of the pre-release arrangement), wherein the carrier stage 111 is movable along a carrier stage movement plane 111p. At this time, the release head holder 118 and the carrier stage holder 113 respectively hold the molded panel 101 and the carrier 103 in the intermediate panel-carrier assembly 104 on the mating surface 116a of the release head 116 and the table surface 111a of the carrier stage 111. Optionally, the pre-release arrangement / process may also include a control unit 180 for driving the carrier stage 111.

[0163] According to several embodiments, Figure 3B schematically illustrates the cutting station 170 of the panel release system 1000.

[0164] According to several embodiments, the cutting station 170 can be used to implement the pre-release arrangement / process. Optionally, the cutting station 170 is located upstream of the release station 110 (e.g., directly or indirectly upstream). The cutting station 170 can be connected to the release station 110 (e.g., directly or indirectly) via a moving or conveying mechanism (e.g., one or more movable platforms and / or actuating members) of the panel release system 1000.

[0165] According to several embodiments, the cutting station 170 may include the material removal tool, such as a cutter 179. Optionally, the material removal tool may remove at least a portion (e.g., at least a portion of the molding material of the intermediate panel-carrier assembly 104) before the molded panel 101 is separated from the carrier 103 (e.g., by cutting with the cutter 179). Optionally, the material removal tool may also remove at least a portion of the molding material of the molded panel 101 after the molded panel 101 has been separated from the carrier 103.

[0166] It is understood that the material removal tool may also be located at other components of the panel release system 1000, such as the feed station 160, the release station 110, or the panel processing station 120. Therefore, the panel release system 1000 may also not include a separate cutting station 170.

[0167] According to several embodiments, a cutter 179 can be used to cut and remove at least a portion of the molding material of the molded panel 101. Optionally, the cutting occurs before the molded panel 101 is separated from the carrier 103, cutting through the entire thickness of the molded panel 101 (i.e., completely cutting through it in the thickness direction), but the cut molded panel 101 is still attached to the carrier 103 at this time.

[0168] In several embodiments, the cutter 179 may serve as a corresponding mechanical component in the panel release system 1000 to implement the pre-release arrangement / process.

[0169] In several embodiments, the cutter 179 can form a Q panel as shown in FIG3D by cutting at least a portion of the molding material of the molded panel 101 (before or after separation from the carrier 103).

[0170] Figure 3C schematically shows the molded panel 101 (shown in the dashed box in the figure) that is attached to the carrier 103 before being released from the carrier 103 or that exists independently after being released from the carrier 103.

[0171] According to several embodiments, the cutter 179 can cut and remove the peripheral edge portion 101a of the molded panel 101. In other words, the control unit 180 can control the cutter 179 to completely cut through the peripheral edge portion 101a of the molded panel 101.

[0172] According to several embodiments, the peripheral edge portion 101a may be a continuous and uninterrupted annular portion of the molded panel 101, which may surround or enclose the inner central portion 101b of the molded panel 101. However, the peripheral edge portion 101a may also be one or more discrete edge portions located around the periphery of the molded panel 101. It is understood that because the peripheral edge portion 101a of the molded panel 101 may adhere more firmly to the heat-release tape 102 than the inner central portion 101b, cutting the peripheral edge portion 101a of the molded panel 101 facilitates the subsequent complete separation of the inner central portion 101b of the molded panel 101 from the heat-release tape 102.

[0173] In several embodiments, the peripheral edge portion 101a of the molded panel 101 may correspond to an inactive or non-functional area in the molded panel 101. That is, the peripheral edge portion 101a may only include molding material and does not contain any wafers, dies, and / or other active or passive circuit elements. Meanwhile, the internal central portion 101b of the molded panel 101 may correspond to an active or functional area, that is, the internal central portion 101b may include wafers, dies, and / or other active or passive circuit elements.

[0174] According to various embodiments, the cutter 179 may include a laser cutter, a mechanical cutter (e.g., a blade, saw blade, cutter head, milling cutter head, etc.), or any other suitable cutting device.

[0175] According to several embodiments, when the cutter 179 includes a laser cutter, a focused laser beam can be directed onto the molded panel 101 to selectively ablate, melt, or vaporize the molding material along a predetermined cutting path, thereby separating the peripheral edge portion 101a from the inner central portion 101b. The laser cutter can cut according to a pre-programmed cutting profile, thus defining the boundary between the peripheral edge portion 101a and the inner central portion 101b. Optionally, the laser cutter can completely ablate, melt, or vaporize the molded panel 101 along the boundary in the thickness direction. Optionally, the laser cutter can be controlled by a control unit 180 based on a cutting control signal.

[0176] According to several embodiments, when the cutter 179 includes a mechanical cutter, it is mechanically movable relative to the molding panel 101 for cutting and removing molding material along the boundary. For example, the mechanical cutter may be mounted on a movable member. The movable member may be driven by an actuator (e.g., an electric motor) and controlled by a control unit 180 based on a cutting control signal.

[0177] According to several embodiments, the panel size of the molded panel 101 may be slightly smaller than the carrier size of the carrier 103 (as shown in the dashed box, for example, a square of approximately 700 mm × 700 mm). In this case, the width of the peripheral edge portion 101a can be varied to adjust the size of the inner central portion 101b, thereby adapting the inner central portion 101b to subsequent processes. Additionally, removing the peripheral edge portion 101a of the molded panel 101 helps define a cleaner and more regular boundary for its inner central portion 101b, facilitating subsequent processes.

[0178] According to several embodiments, FIG3D schematically shows the molded panel 101 (before or after separation from the carrier 103) and a plurality of unit regions 101c cut by the cutter 179 in the panel release system 1000 (e.g., cutting station 170, or other components).

[0179] According to several embodiments, as shown in FIG3D, the cutter 179 can divide a plurality of unit regions 101c from the molded panel 101. That is, the cutter 179 can cut the molded panel 101 into one or more smaller portions (i.e., Q panels).

[0180] In several embodiments, after the molded panel 101 is cut, but before the molded panel 101 is separated from the carrier 103, the Q panel can still be attached to the carrier 103 by heat-release tape 102 (at this time it is still referred to as the intermediate panel-carrier assembly 104).

[0181] In several embodiments, the peripheral edge portion 101a is cut supplementarily or alternatively, and the cutter 179 may also cut the inner central portion 101b of the molded panel 101.

[0182] In several embodiments, multiple unit regions 101c may be defined by predetermined cutting paths in the internal central portion 101b of the molded panel 101. Optionally, the cutter 179 may cut along the predetermined cutting paths corresponding to each unit region 101c, such that each unit region 101c can be separated from the remainder of the molded panel 101 after the cutting operation is completed (e.g., separated individually or simultaneously as a whole). Optionally, the cut may penetrate the entire thickness of the molded panel 101, in which case each unit region 101c may exist independently. Optionally, the cutter 179 may also partially cut the molded panel 101 along its thickness, in which case each unit region 101c does not exist independently.

[0183] According to various embodiments, each unit region 101c may correspond to the shape or external boundary of one (e.g., a single-chip module (SCM)) or multiple (e.g., a multi-chip module (MCM)) wafers, wafer sets, device packages, integrated circuits, package units, functional units and / or any applicable electronic, microelectronic or optoelectronic units, sub-units or devices, etc.

[0184] According to several embodiments, the shapes and sizes of the multiple unit regions 101c may be the same as each other, or they may be different from each other.

[0185] According to several embodiments, the cutter 179 can cut the molded panel 101 into a plurality of unit regions 101c (e.g., as shown, cut into 9 unit regions 101c in a “3×3” array). Optionally, the plurality of unit regions 101c can be distributed on the molded panel 101 in a manner that is evenly spaced from each other. Optionally, the plurality of unit regions 101c can also be distributed in any other manner.

[0186] According to several embodiments, Figure 3F schematically shows the cutting station 170 integrated into the panel release system 1000.

[0187] Figure 3G schematically illustrates one configuration in which the cutting station 170 is connected to the feeding station 160.

[0188] According to several embodiments, as shown in Figures 3F and 3G, the intermediate panel-carrier assembly 104 can enter the panel release system 1000 from the feed station 160 before cutting (including the pre-cutting). For example, the intermediate panel-carrier assembly 104 can be placed on the feed mechanism 161 with the molded panel 101 facing upwards. Subsequently, the feed mechanism 161 can move from the feed station 160 to the cutting station 170. For example, the feed mechanism 161 can move laterally or sideways between the feed station 160 and the cutting station 170 along the feed mechanism movement plane 161p. According to several embodiments, the lateral or sideways movement of the feed mechanism 161 between the feed station 160 and the cutting station 170 along the feed mechanism movement plane 161p can be based on a movement signal. Optionally, the movement signal can be transmitted to the feed mechanism 161 to indicate its lateral or sideways movement.

[0189] According to several embodiments, at the cutting station 170, the cutter 179 can cut the molded panel 101 adhered to the carrier 103. Optionally, during cutting, the intermediate panel-carrier assembly 104 (including the molded panel 101) is held on the feeding mechanism 161.

[0190] According to several embodiments, the intermediate panel-carrier assembly 104 can be transferred from the feeding mechanism 161 to a cutting table 171 (e.g., a cutting deck or platform) in the cutting station 170, as shown in FIG3H, to cut the molded panel 101, and then the (cut) molded panel 101 is sent back to the feeding mechanism 161.

[0191] After the cutting is completed, the feeding mechanism 161 may also transport the intermediate panel-carrier assembly 104 (at which point the molded panel 101 has been cut into one or more Q panels) to another component of the panel release system 1000, such as the preheating station 150. For example, the feeding mechanism 161 may first return to or pass through the feeding station 160 before continuing downstream to the preheating station 150. For example, the preheating station 150 and the cutting station 170 may be located on opposite linear or orthogonal sides of the feeding station 160, respectively. Therefore, the direction of movement of the feeding mechanism 161 between the feeding station 160 and the cutting station 170 may be parallel to (arranged on the linear sides) or perpendicular to (arranged on the orthogonal sides) the direction of movement between the feeding station 160 and the preheating station 150.

[0192] Figure 3H schematically illustrates another embodiment in which the cutting station 170 is connected to the feeding station 160.

[0193] According to several embodiments, as shown in FIG3H, the alignment head 166 is movable between the feed station 160 and the cutting station 170. Optionally, the alignment head 166 can be moved laterally along an alignment head lateral movement plane 166q. The alignment head lateral movement plane 166q can be a substantially flat plane that is substantially horizontal relative to the base of the panel release system 1000 (e.g., when the panel release system 1000 is placed vertically and / or positioned on an external ground or floor). Optionally, the alignment head lateral movement plane 166q and the alignment head movement plane 166p are not parallel to each other (e.g., perpendicular or substantially perpendicular). Optionally, the alignment head lateral movement plane 166q is parallel to the carrier stage movement plane 111p. Therefore, the alignment head 166 can move laterally (e.g., in a relative straight line direction) between the feed station 160 and the cutting station 170 along the alignment head lateral movement plane 166q. Optionally, the direction in which the alignment head 166 moves laterally along the alignment head lateral movement plane 166q between the feeding station 160 and the cutting station 170 can be (but is not limited to) non-parallel (e.g., perpendicular) to the direction in which the panel table 121 moves laterally along the panel table movement plane 121p between the panel processing station 120 and the release station 110. Optionally, the panel release system 1000 includes a guide rail, track, or slide rail (e.g., a linear guide rail). The guide rail may extend between the feeding station 160 and the cutting station 170 and guide the alignment head 166 along it. Optionally, the movement of the alignment head 166 along the alignment head lateral movement plane 166q may be based on a movement signal. The movement signal may be transmitted to the alignment head 166 to indicate its movement.

[0194] According to several embodiments, after the intermediate panel-carrier assembly 104 (having an uncut or pre-cut molded panel 101) is placed at the feed station 160 (e.g., above the feed mechanism 161), the alignment head 166 can engage the intermediate panel-carrier assembly 104 at the feed station 160 (e.g., via the alignment head holder 168), thereby releasably holding the intermediate panel-carrier assembly 104, which is then lifted (e.g., from the feed mechanism 161) and transported laterally to the cutting station 170.

[0195] According to several embodiments, at the cutting station 170, the alignment head 166 can be aligned with the cutting table 171, and the intermediate panel-carrier assembly 104 can be placed on the cutting table 171. At this time, the alignment head 166 and the cutting table 171 can be located in a higher region and a lower region of the cutting station 170, respectively. Specifically, after the alignment head 166 is aligned with the cutting table 171, the alignment head 166 can move along the alignment head moving plane 166p to release the intermediate panel-carrier assembly 104 onto the cutting table 171 at the cutting station 170.

[0196] According to several embodiments, the cutting table 171 of the cutting station 170 may include a cutting table holder 173 (e.g., a vacuum suction mechanism, a clamping mechanism, an electrostatic chuck, an end effector, etc.) for releasably securing the molded panel 101 during cutting. Optionally, the cutting table holder 173 may be operated based on a holding control signal. The holding control signal may be transmitted to the cutting table holder 173 to instruct its operation.

[0197] Therefore, after the molded panel 101 is placed on the cutting table 171, the cutter 179 can perform the cutting operation.

[0198] After the cutting is completed, the alignment head 166 can engage the intermediate panel-carrier assembly 104 (with the (cut) molded panel 101), and then the intermediate panel-carrier assembly 104 (with the (cut) molded panel 101) is lifted from the cutting table 171 and, following the process of the panel release system 1000, the intermediate panel-carrier assembly 104 (along with the (cut) molded panel 101) is conveyed to the next component of the panel release system 1000 (e.g., preheating station 150). Optionally, the intermediate panel-carrier assembly 104 can be returned to the feed station 160 (e.g., when the feed station 160 is located between the cutting station 170 and the next component) before the alignment head 166 moves to the next component of the panel release system 1000. For example, the next component is the preheating station 150, and the alignment head 166 can pass through the feeding station 160 again during the process of conveying the intermediate panel-carrier assembly 104 (with the (cut) molded panel 101) from the cutting station 170 to the preheating station 150.

[0199] According to several embodiments, functional or active portions of the molded panel 101, such as the inner central portion 101b and / or the individual unit regions 101c (i.e., Q panels), can be detached from the carrier 103 within the release station 110. In other words, non-functional or inactive portions of the molded panel 101, such as the peripheral edge portion 101a or any remaining portions located outside the unit regions 101c, may not be detached from the carrier 103.

[0200] According to several embodiments, the molded panel 101 may not be cut before being released from the carrier 103. Therefore, the (separated) molded panel 101 can be removed from the release station 110 while still in a cut state (as a whole). Subsequently, the (separated) molded panel 101 is moved out of the release station 110 and then moved to the cutting station 170 (e.g., possibly via the panel processing station 120), and cut as described above (e.g., cut into one or more Q panels). Optionally, the cutting station 170 may also be located outside the panel release system 1000. After the (separated) molded panel 101 is removed from the panel release system 1000, it can enter (the cutting station 170 or similar device located outside the panel release system 1000) and be cut as described above or similarly.

[0201] According to several embodiments, FIG3E schematically shows a plan view of a release head 116, wherein the release head 116 has a multi-zone vacuum holding device 190.

[0202] According to several embodiments, the release head 116 includes a multi-region vacuum holding device 190. Optionally, the multi-region vacuum holding device 190 may be located at the mating surface 116a of the release head 116. As shown in FIG3E, the multi-region vacuum holding device 190 may have a first vacuum holding region 190a, a second vacuum holding region 190b surrounded by the first vacuum holding region 190a, and a third vacuum holding region 190c surrounded by the second vacuum holding region 190b. That is, the second vacuum holding region 190b is located between the first vacuum holding region 190a and the third vacuum holding region 190c. As shown in FIG3E, both the first vacuum holding region 190a and the second vacuum holding region 190b may be annular (e.g., a continuous or discontinuous closed loop). It should be understood that the multi-zone vacuum holding device 190 may include any number of vacuum holding zones (e.g., 2 or more than 3 vacuum holding zones), and other (additional) vacuum holding zones may have the same or similar structure as the first vacuum holding zone 190a, the second vacuum holding zone 190b, or the third vacuum holding zone 190c.

[0203] According to several embodiments, the multi-zone vacuum holding device 190 may include a main vacuum inlet 191 and an auxiliary vacuum inlet 192 for holding the molded panel 101 (cut or uncut) by vacuum adsorption. Optionally, the main vacuum inlet 191 may be larger than the auxiliary vacuum inlet 192, so that the main vacuum inlet 191 can provide stronger suction, thereby holding the molded panel 101 more securely on the mating surface 116a of the release head 116.

[0204] According to several embodiments, the first vacuum holding region 190a can hold an uncut or pre-cut molded panel 101 (which is still attached to the carrier 103 or has been separated from the carrier 103). Optionally, the first vacuum holding region 190a can also engage with the peripheral edge portion 101a of the molded panel 101 (e.g., an inactive or non-functional area). Thus, the first vacuum holding region 190a can releasably hold the molded panel 101 entirely on the engagement surface 116a of the release head 116. Optionally, the first vacuum holding region 190a includes a set of main vacuum ports 191 and / or a set of auxiliary vacuum ports 192. For example, the main vacuum ports 191 and / or auxiliary vacuum ports 192 may be distributed at intervals along the annular structure of the first vacuum holding region 190a.

[0205] According to several embodiments, a second vacuum holding region 190b and / or a third vacuum holding region 190c may be used to hold the inner central portion 101b or Q panel formed after the molding panel 101 has been cut. Therefore, the second vacuum holding region 190b and / or the third vacuum holding region 190c can releasably hold the inner central portion 101b or Q panel on the mating surface 116a of the release head 116. The active or dynamic elements (e.g., wafers) of the inner central portion 101b of the molding panel 101 may have a small pitch, which would limit the use of a main vacuum port 191 in the inner central portion 101b, requiring a larger space. Therefore, the second vacuum holding region 190b and the third vacuum holding region 190c may only have auxiliary vacuum ports 192, i.e., the auxiliary vacuum ports 192 can be distributed on the mating surface 116a of the release head 116 in a manner that matches the compact layout of the inner central portion 101b or Q panel of the molding panel 101. In other words, the second vacuum holding region 190b and the third vacuum holding region 190c may not have a main vacuum suction port 191.

[0206] Optionally, vacuum holding zones 190a, 190b, and 190c operate independently. Preferably, each main vacuum inlet 191 and / or each auxiliary vacuum inlet 192 within vacuum holding zones 190a, 190b, and 190c can operate independently. For example, the multi-zone vacuum holding device 190 may have independent vacuum lines corresponding to vacuum holding zones 190a, 190b, and 190c, respectively. Furthermore, each vacuum line may be connected to its dedicated vacuum source or vacuum module. For example, as shown in Figure 3E, each vacuum line in vacuum holding zones 190a, 190b, and 190c can correspond to a pump 193a, 193b, or 193c (e.g., a vacuum pump), a valve 194a, 194b, or 194c (e.g., a solenoid valve), a screening program 195a, 195b, or 195c (e.g., a particulate air screening program), and a sensor 196a, 196b, or 196c (e.g., a vacuum sensor) to collaboratively monitor and control the vacuum level of the corresponding vacuum holding zones 190a, 190b, and 190c. In other words, vacuum holding zones 190a, 190b, and 190c can each be equipped with their own independent vacuum system (i.e., pump 193, valve 194, screening program 195, and sensor 196), thereby ensuring operational redundancy and reliability. Therefore, if one or even two of the three vacuum holding zones 190a, 190b, and 190c fail, the remaining vacuum holding zones 190a, 190b, and 190c can still provide vacuum suction to hold the molded panel 101 (including the internal central portion 101b, unit area 101c, or Q panel).

[0207] According to several embodiments, pump 193a associated with the first vacuum holding region 190a can provide greater vacuum suction compared to pumps 193b and 193c associated with the second and third vacuum holding regions 190b and 190c.

[0208] According to several embodiments, the multi-zone vacuum holding device 190 can also be applied to different components within the panel release system 1000 that require holding functionality. For example, the multi-zone vacuum holding device 190 can be applied to any one or more of the following components: carrier stage 111, panel stage 121, panel processing head 126, preheating stage 151, preheating head 156, alignment head 166, cutting stage 171, and / or any component that can releasably hold the molded panel 101 (e.g., the molded panel 101 (still attached to the carrier 103), or the internal central portion 101b, or a single unit area 101c, or a Q panel).

[0209] As shown in Figures 3D and 3F, after the molded panel 101 is cut into multiple individual unit regions 101c, the release head retainer 118 of the release head 116 can be configured (e.g., in terms of position, shape, and / or size, etc.) to releasably retain the individual unit regions 101c of the molded panel 101 on the mating surface 116a of the release head 116. For example, the release head retainer 118 may selectively contact only the individual unit regions 101c of the molded panel 101 without contacting the rest of the molded panel 101 (e.g., the rest of the interior central portion 101b of the molded panel 101 other than the individual unit regions 101c). Thus, after the release station 110 heats the heat release tape 102 to the heat release temperature, the release head retainer 118 can separate the individual unit regions 101c of the molded panel 101 from the carrier 103 (e.g., sequentially, or as a whole). In other words, the cut-out active or functional areas of the molded panel 101 (e.g., the internal central portion 101b, or the unit region 101c, or the Q-panel) can be separated from the carrier 103. Accordingly, the remaining portion of the molded panel 101 (i.e., the inactive or functional areas still adhering to the carrier 103) can be selectively removed from the panel release system 1000 via the release station 110, or can be removed from the panel release system 1000 together with the carrier 103 via the unloading station 140.

[0210] In several embodiments, when the cutting station 170 can cut the molded panel 101 into multiple individual unit regions 101c (i.e., Q-panels), the panel platform holder 123 and / or the panel processing head holder 128 may be configured (e.g., positioning, shaping, and / or sizing, etc.) to contact and / or releasably retain only the individual unit regions 101c in the molded panel 101 (e.g., retaining them sequentially one by one, or retaining them as a whole at once). For example, the panel platform holder 123 and / or the panel processing head holder 128 may have vacuum suction ports (e.g., similar to vacuum suction holes 191, 192). The layout and / or location of the vacuum suction holes may correspond to the layout and / or location of the multiple individual unit regions 101c in the molded panel 101 after being cut into Q-panels (e.g., matching the layout of the downstream components of the panel release system 1000 through which they will pass).

[0211] According to several embodiments, as shown in FIG3A, the control unit 180 of the panel release system 1000 can transmit various signals, instructions, or commands to various components and / or corresponding elements in the panel release system 1000, such as movement signals and / or control signals (e.g., heating control signals, temperature regulation control signals, preheating control signals, holding control signals, cutting control signals, etc.). Therefore, the control unit 180 can be communicatively connected to various components and / or elements in the panel release system 1000 for indicating and / or controlling their operation. For example, movable elements in the panel release system 1000 can be driven by corresponding actuators, which can be controlled by the control unit 180.

[0212] According to several embodiments, FIG4 schematically shows a perspective view of a panel release system 4000.

[0213] According to several embodiments, the panel release system 4000 may include any or more features of the panel release systems 1000 and / or 2000. Conversely, the other two may also be different.

[0214] According to several embodiments, the panel release system 4000 may differ from the panel release system 2000 shown in FIG. 2A, in that the panel release system 4000 may further include a cutting station 470. The cutting station 470 may include any or more features of the cutting station 170.

[0215] According to several embodiments, the cutting station 470 may be located directly or indirectly upstream of the release station 210.

[0216] According to several embodiments, the panel release system 4000 may include a conveying mechanism 4001 for conveying the intermediate panel-carrier assembly 104 to a carrier stage 111 located within the release station 210. The conveying mechanism 4001 may include one or more movable platforms and / or actuators of the panel release system 4000.

[0217] As shown in Figure 4, the cutting station 470 can be connected to the feeding station 260 in the following manner: after the intermediate panel-carrier assembly 104 enters the panel release system 4000 through the feeding station 260, it can be conveyed from the feeding station 260 to the cutting station 470 for cutting the molded panel 101 in the intermediate panel-carrier assembly 104 as described above. As shown in Figure 4, both the cutting station 470 and the preheating station 250 can be connected to the feeding station 260, and the connection positions are respectively located on non-opposite sides of the feeding station 260. Optionally, the cutting station 470 can be directly connected to the feeding station 260 through an alignment head (e.g., the same as or similar to the alignment head 166 in Figure 3H), which can move laterally between the feeding station 260 and the cutting station 470. Meanwhile, the preheating station 250 can be directly connected to the feeding station 260 via the feeding mechanism of the feeding station 260 (for example, the same as or similar to the feeding mechanism 161 in Figure 3H), which can move between the feeding station 260 and the preheating station 250.

[0218] Subsequently, the (cut) molded panel 101 can be transported from the cutting station 470 to the preheating station 250 (e.g., via the feed station 260) for preheating the intermediate panel-carrier assembly 104 (in this case, the (cut) molded panel 101). According to several embodiments, both the preheating station 250 and the cutting station 470 can be connected to the feed station 260. For example, the feed station 260 is located between the preheating station 250 and the cutting station 470. However, it is understood that the panel release system 4000 can also employ any other arrangement for the cutting station 470. For example, the cutting station 470 can be located directly (immediately) downstream of the feed station 260, while the preheating station 250 can be located directly (immediately) downstream of the cutting station 470. For example, the cutting station 470 can be located directly (immediately) upstream of the release station 210.

[0219] After the preheating of the intermediate panel-carrier assembly 104 is completed, the intermediate panel-carrier assembly 104 can be transferred from the preheating station 250 to the release station 210, where the release is performed, i.e., the molded panel 101 can be separated from the heat release tape 102 and the carrier 103. When the molded panel 101 has been cut into individual unit regions 101c or Q panels, the separation performed at the release station 210 may only involve separating the unit regions 101c or Q panels of the molded panel 101 from the heat release tape 102 and the carrier 103 (e.g., sequentially, or all at once).

[0220] Subsequently, the (separated) molded panel 101 or Q panel can be conveyed to panel processing station 220; while carrier 103, the heat release tape 102 attached thereto, and the remaining portion of molded panel 101 can be conveyed to carrier processing station 230 and removed from panel release system 4000 via unloading station 240.

[0221] As shown in Figure 4, the panel release system 4000 may further include a control unit 480 (which may include all or part of the functions of the control unit 180). Optionally, the control unit 480 may send various signals, instructions, or commands to the various components and / or elements within the panel release system 4000, such as movement signals and / or control signals (e.g., heating control signals, temperature regulation control signals, preheating control signals, holding control signals, cutting control signals). Therefore, the control unit 480 may be communicatively connected to the various components and / or elements within the panel release system 4000 for controlling their operation. Optionally, the movable parts of the panel release system 4000 may be driven by corresponding actuators, which may be controlled by the control unit 480.

[0222] According to several embodiments, the panel release system 4000 (and its various components, such as release station 210, panel processing station 220, carrier processing station 230, unloading station 240, preheating station 250, feeding station 260, and / or cutting station 470) can be implemented using a modular architecture. For example, any or more of the components or elements thereof can be omitted, repositioned, or replaced as needed.

[0223] According to several embodiments, this application provides a method for processing an intermediate panel-carrier assembly 104 (including a molded panel 101), for example, an automated method using a panel release system 1000, 2000, or 4000. The method may include: heating the intermediate panel-carrier assembly 104 to the release temperature of the heat-release tape 102 by a carrier stage heater 112 at the carrier stage 111 when the intermediate panel-carrier assembly 104 is held on the table surface 111a of a carrier stage 111 and the molded panel 101 is positioned above it. The method may further include: moving a release head 116 toward the intermediate panel-carrier assembly 104 held by the table surface 111a of the carrier stage 111, thereby engaging with the molded panel 101 of the intermediate panel-carrier assembly 104. Specifically, the method may include: within the release station 110, when the carrier stage 111 is aligned with the release head 116, the release head 116 of the release unit 115 moves toward the table surface 111a of the carrier stage 111 to engage with the intermediate panel-carrier assembly 104 on the table surface 111a of the carrier stage 111. The method may further include: subsequently, using the release head 116 to releasably hold the molded panel 101 on the engagement surface 116a of the release head 116, and removing the release head 116 from the table surface 111a of the carrier stage 111, wherein the release head retainer 118 releasably holds the molded panel 101 (uncut or cut) on the engagement surface 116a of the release head 116, thereby separating the molded panel 101 from the carrier 103, at which point the heat-release tape 102 is adhered to the carrier 103, both of which remain on the table surface 111a of the carrier stage 111. Therefore, the operation can be referred to as a "release operation" or a "heat-release operation".

[0224] According to several embodiments, the heating-release operation may further include: using the release head heater 117 at the release head 116, in coordination with the carrier stage heater 112 at the carrier stage 111, to heat the intermediate panel-carrier assembly 104 to the release temperature of the heat release tape 102; and then separating the molded panel 101 from the heat release tape 102 and the carrier 103. Optionally, the coordinated heating is performed within the release station 110.

[0225] According to several embodiments, the method may further include: moving the panel stage 121 into the release station 110 to align with the release head 116 within the release station 110, and receiving the (separated) molded panel 101 (uncut or cut) from the release head 116. Optionally, this operation is performed after the heat-release operation is completed. Subsequently, the panel stage 121 holding the (separated) molded panel 101 is moved to the panel processing station 120 for conveying the (separated) molded panel 101 from the release station 110 to the panel processing station 120.

[0226] According to several embodiments, the method may further include: when the (separated) molded panel 101 is held on the panel stage 121, and / or during the process of the panel stage 121 moving the (separated) molded panel 101 from the release station 110 to the panel processing station 120, the temperature of the (separated) molded panel 101 may be regulated by the temperature regulating heater 122 of the panel stage 121 to be between the heat release temperature and the ambient temperature. This operation may be referred to as a "temperature regulation operation". Optionally, the temperature regulation operation may be performed after the heating-release operation.

[0227] According to several embodiments, the method may further include: releasably holding (e.g., vacuum adsorption) the (separated) molded panel 101 at the mating surface 126a of the panel processing head 126 using the panel processing head 126. Specifically, the panel processing head 126 may lift the (separated) molded panel 101 from the panel stage 121 and remove it from the panel release system 1000.

[0228] According to several embodiments, the temperature regulation operation may further include: when the panel processing head 126 releasably secures the (separated) molded panel 101 to the mating surface 126a, the temperature of the (separated) molded panel 101 can be regulated to between the heat release temperature and the ambient temperature using the temperature regulating heater 127 at the panel processing head 126. This operation may also be performed separately from the temperature regulation operation performed by the temperature regulating heater 122 of the panel table 121. In other words, the temperature regulation operation can be performed using the temperature regulating heater 127 after the panel processing head 126 lifts the (separated) molded panel 101 from the panel table 121.

[0229] According to several embodiments, the method may further include: transferring a carrier stage 111 (on which heat-release tape 102 and carrier 103, still separated from the molded panel 101), from a release station 110 to a carrier processing station 130 for transporting heat-release tape 102 and carrier 103 from the release station 110 to the carrier processing station 130. The method may further include: releasably holding heat-release tape 102 and carrier 103 at their mating surfaces 136a using a carrier processing head 136, and lifting heat-release tape 102 and carrier 103 from the carrier stage 111. Subsequently, the carrier stage 111 (at this time without holding heat-release tape 102 and carrier 103) may be removed from the carrier processing station 130 (e.g., returned to the release station 110).

[0230] In several embodiments, at carrier processing station 130, before carrier 103 is held and / or lifted by carrier processing head 136, the method may further include: removing heat-release tape 102 still adhering to carrier 103 using tape removal tool 131. This operation may be referred to as a "tape removal operation." The tape removal operation may be performed on the heat-release tape 102 still adhering to carrier 103 after the heat release operation has been completed.

[0231] In several embodiments, the method may further include: moving the unloading tray 141 into the carrier processing station 130 and aligning it with the carrier processing head 136 (which releasably holds the (separated) carrier 103 at this time), and then receiving the carrier 103 from the carrier processing head 136. Subsequently, the unloading tray 141 holding the carrier 103 is moved to the unloading station 140 for removing the carrier 103 from the panel release system 1000.

[0232] In several embodiments, the method may further include preheating the intermediate panel-carrier assembly 104 prior to the heating and release operations. Specifically, the intermediate panel-carrier assembly 104 is placed on a preheating platform 151, and the intermediate panel-carrier assembly 104 is preheated to an intermediate temperature below the heat release temperature using a preheater 152 at the preheating platform 151. This operation may be referred to as a "preheating operation". Optionally, the preheating platform 151 holding the intermediate panel-carrier assembly 104 may be moved from a preheating station 150 to a release station 110. The preheating operation may be performed within the preheating station 150 (e.g., by the coordinated action of the preheating platform 151 and the preheating head 156), but may also be performed during the movement of the preheating platform 151 from the preheating station 150 to the release station 110 (e.g., by the preheating platform 151 alone).

[0233] In several embodiments, the preheating operation may further include: using a preheater 157 at the preheating head 156 to work in conjunction with the preheating head 156 at the preheating platform 151 to preheat the intermediate panel-carrier assembly 104 within the preheating station 150.

[0234] In several embodiments, prior to the heating and release operation, the control unit 180 of panel release system 1000, 2000 or the control unit 480 of panel release system 4000 may be used to control (e.g., directly or indirectly instruct or command) the pre-release arrangement / process of the intermediate panel-carrier assembly 104 (e.g., the heat-release tape 102 in the intermediate panel-carrier assembly 104) to disturb and / or weaken the adhesive strength between the heat-release tape 102 and the molded panel 101 in the intermediate panel-carrier assembly 104. This operation may be referred to as a "release initiation operation". Optionally, the release initiation operation may be performed before the heating and release operation or before the preheating operation.

[0235] According to several embodiments, the release initiation operation may include: moving the carrier stage 111 relative to the release head 116 while the release head retainer 118 releasably holds the molded panel 101 in the intermediate panel-carrier assembly 104 on the mating surface 116a of the release head 116, and the carrier stage retainer 113 releasably holds the heat-release tape 102 and the carrier 103 on the table surface 111a of the carrier stage 111. Optionally, the operation may be performed within the release station 110.

[0236] According to several embodiments, the release initiation operation may further include: cutting the molded panel 101 into peripheral edge portions 101a and / or individual unit regions 101c (e.g., using a cutter 179 within a cutting station 170). Subsequently, the cut molded panel 101, still attached to the carrier 103 by heat release tape 102, is transferred to another component (e.g., a preheating station 150).

[0237] In several embodiments, the method may further include: feeding the intermediate panel-carrier assembly 104 into the panel release system 1000 via the feeding station 160. Specifically, the intermediate panel-carrier assembly 104 is fed to the cutting station 170, the preheating station 150, or the release station 110 via the feeding station 160.

[0238] In several embodiments, the method may further include conveying an intermediate panel-carrier assembly 104, a molded panel 101 (e.g., as a whole before cutting or as a Q panel after cutting), and a carrier 103 (e.g., separated from or still attached to the heat-release tape 102) out of the panel release system 1000 via one or more movable trays and / or actuating components of the panel release system 1000.

[0239] According to several embodiments, Figures 5A to 5F show schematic diagrams of a first release process 300 and a second release process 320.

[0240] Figure 5A shows that multiple semiconductor wafers 302 can be mounted on a first carrier 306. Subsequently, a first molding compound 304 can be formed through a first packaging process to encapsulate the semiconductor wafers 302. This forms a first molded panel 301a. The first molded panel 301a may include the semiconductor wafers 302 and the first molding compound 304.

[0241] According to several embodiments, a first heat-release tape 308 may be pre-attached to a first carrier 306 to secure the semiconductor wafer 302 in place (e.g., to prevent movement during the first packaging process). Specifically, the first heat-release tape 308 may include a thermally sensitive layer (e.g., the same as or similar to the thermally sensitive adhesive layer 102a shown in FIG. 1A) and a pressure-sensitive layer (e.g., the same as or similar to the pressure-sensitive adhesive layer 102b shown in FIG. 1A), disposed opposite to each other. In this stage, the first heat-release tape 308 may be configured to contact and adhere the thermally sensitive layer to the first carrier 306, while simultaneously contacting and adhering the pressure-sensitive layer to the first molded panel 301a.

[0242] According to several embodiments, the panel size of the first molded panel 301a can be smaller than the tape size of the first heat-release tape 308, so that the peripheral portion 3082 of the first heat-release tape 308 will not come into contact with the first molded panel 301a.

[0243] Therefore, a first intermediate panel-carrier assembly 504a can be formed, which may include a first molded panel 301a, a first carrier 306, and a first heat-release tape 308.

[0244] Figure 5B illustrates the first release process 300. In this process, the first intermediate panel-carrier assembly 504a is heated to a first heat-release temperature of the first heat-release adhesive tape 308. At this first heat-release temperature, the heat-sensitive layer loses its adhesion to the first carrier 306, while the pressure-sensitive layer remains adhered to the first molded panel 301a. Therefore, as shown in Figure 5B, the first molded panel 301a, along with the first heat-release adhesive tape 308 adhered thereto, can be released or peeled off from the first carrier 306.

[0245] Figure 5C illustrates the process of removing the first heat-release tape 308 from the first molded panel 301a. According to various embodiments, the molded panel 101 may first be flipped so that its active panel surface 3012 faces upwards. Then, since the peripheral portion 3082 of the first heat-release tape 308 is not in contact with or blocked by the first molded panel 301a, the peripheral portion 3082 can be pushed upwards using a vertically movable ejector pin 310 (or other suitable instrument, such as an ejector rod or push rod) to form a bulge 312. Subsequently, a tape removal tool 314 (e.g., the same as or similar to tape removal tool 131) can clamp the bulge 312 and then laterally peel the first heat-release tape 308 from the first molded panel 301a until the first heat-release tape 308 is completely removed from the first molded panel 301a. This exposes the active panel surface 3012 of the first molded panel 301a for subsequent processes.

[0246] Figure 5D shows that the first molded panel 301a is subsequently mounted on the second carrier 322, with its active panel surface 3012 facing upwards. The second heat-release tape 324 has a similar structure to the first heat-release tape 308 and can be applied to the second carrier 322. However, at this stage, the application method of the second heat-release tape 324 is opposite to that of the first heat-release tape 308 described in Figure 5A; its heat-sensitive layer and pressure-sensitive layer contact and adhere to the first molded panel 301a and the second carrier 322, respectively. Subsequently, panel-level circuitry 326 is formed on the active panel surface 3012 of the first molded panel 301a.

[0247] In several embodiments, as shown in FIG5E, a second molding layer 328 can be formed by a second molding process to encapsulate the semiconductor wafer 302, the first molding layer 304, and the panel-level circuitry 326. Therefore, a second intermediate panel-carrier assembly 504b can be formed. The second intermediate panel-carrier assembly 504b may include a second molded panel 301b (including a first molded panel 301a, panel-level circuitry 326, and the second molding layer 328), a second carrier 322, and a second heat-release adhesive tape 324. As described above, the second intermediate panel-carrier assembly 504b can correspond to the intermediate panel-carrier assembly 104 described in FIGS. 1A to 4.

[0248] As shown in Figure 5E, in the second release process 320, the second intermediate panel-carrier assembly 504b can be heated to the second heat release temperature of the second heat release tape 324. At the second heat release temperature, the heat-sensitive layer of the second heat release tape 324 loses its adhesion to the second molded panel 301b, but its pressure-sensitive layer can still adhere to the second carrier 322. Therefore, the second molded panel 301b can be released or separated from the second carrier 322 and the second heat release tape 324.

[0249] Subsequently, the second heat-release tape 324 can be released or separated from the second carrier 322 by applying a force (e.g., a lateral force). However, the tape size of the second heat-release tape 324 may be approximately equal to the carrier size of the second carrier 322. In other words, the second heat-release tape 324 can substantially completely cover the second carrier 322. Therefore, the second heat-release tape 324 does not extend beyond the second carrier 322 at this time. For example, it does not have the peripheral portion 3082 similar to that of the first heat-release tape 308 as shown in FIG. 5C. Therefore, the ejector pin 310 described in FIG. 5C cannot be used to remove the second heat-release tape 324 at this time. To solve this problem, a separation aid 132 (as shown in FIG. 1G-1J or FIG. 1K-1N) can be used to form a protrusion 1026 to initiate the separation and removal of the second heat-release tape 324. Therefore, the release station 110 described above, and the panel release systems 1000, 2000, 4000 including the release station 110 and their associated operating methods are particularly suitable for removing the second heat release tape 324 (i.e., the corresponding heat release tape 102) from the second carrier 322 (i.e., the corresponding carrier 103) in the second release process 320 (i.e., after FIG. 5F).

[0250] 1000, 2000, 4000: Panel release system 101: Molded Panel 101a: Peripheral edge portion 101b: Internal Central Section 101c: Cell Region 102: Heat Release Tape 102a: Thermal adhesive layer 102b: Pressure-sensitive adhesive layer 102c: Basal layer 102d: First edge portion 102e: Second edge portion 1022: Surrounding Area 1022a: First peripheral section 1022b: Second peripheral section 1022c: Middle and peripheral parts 1024: Remaining parts 1026, 312: Elevated portion 103: Carrier 103a: Orientation Features 104: Intermediate Panel - Carrier Component 110, 210: Release Station 111: Carrier Platform 111a: Countertop 111p: Carrier stage moving plane 112: Carrier stage heater 113: Carrier stage retainer 115: Release Unit 116: Release Head 116a: Joint surface 116p: Release head moving plane 117: Release head heater 118: Release head retainer 120, 220: Panel processing station 121: Panel Platform 121p: Panel Stage Moving Plane 121a: Countertop 122: Temperature regulating heater 123: Panel retainer 125: Panel processing unit 126, 226: Panel processing head 126a: Joint surface 126p: Panel processing head moving plane 127: Temperature regulating heater 128: Panel processing head retainer 131, 314: Tape removal tools 132: Separation Auxiliary Tool 133: Plowing component 134, 134a, 134b, 134c: Blade 139: Blade support head 139a: First edge portion 139b: Second edge portion 139c: Inner part 137: Clamping mechanism 1372: First finger pinch 1374: Second finger pinch 130, 230: Carrier processing station 133p: Plowing component moving plane 135: Carrier Processing Unit 136: Carrier processing head 136a: Joint surface 136p: Carrier processing head moving plane 136r: Rotating shaft of carrier processing unit 138: Carrier processing head retainer 140, 240: Unloading station 141: Unload tray 141p, 241p: Unloading tray moving plane 150, 250: Preheating Station 151: Preheating Station 151a: Countertop 151p: Preheating table moving plane 152: Preheater 153: Preheating platform retainer 154: Alignment Structure 155: Preheating Unit 156: Preheating head 156a: Joint surface 156p: Preheating head moving plane 156r: Preheating head rotating shaft 157: Preheater 158: Preheating head retainer 160, 260: Feeding Station 161: Feeding mechanism 161p: Feeding mechanism moving plane 161a: Conveying surface 165: Alignment Unit 166: Aim at the head 166a: Joint surface 166p: Alignment Head Moving Plane 166q: Align the head with the lateral movement plane 166r: Alignment unit rotation axis 168: Alignment head retainer 170, 470: Cutting Station 171: Cutting table 173: Cutting table retainer 179: Cutter 180, 480: Control Unit 182a, 182b: Alignment elements 190: Multi-zone vacuum holding device 190a: First vacuum holding region 190b: Second vacuum holding region 190c: Third vacuum holding region 191: Main vacuum suction port 192: Auxiliary vacuum suction port 193, 193a, 193b, 193c: Pumps 194, 194a, 194b, 194c: Valves 195, 195a, 195b, 195c: Screening procedures 196, 196a, 196b, 196c: Sensors 222: Dashed arrow 242: Solid arrow 226q: Lateral moving plane of panel processing head 229: Panel Processing Guide Rail 241: Unload tray 300: First release process 3012: Panel active surface 301a: First molded panel 301b: Second molded panel 302: Semiconductor wafer 304: First sealing layer 306: The First Carrier 308: First heat release tape 3082: Surrounding Area 310: Thresh 320: Second release process 322: Second Carrier 324: Second heat release tape 326: Panel-level circuit 328: Second molding layer 4001: Conveying mechanism 504a: First intermediate panel - carrier assembly 504b: Second intermediate panel - carrier assembly 80: Actuator AA: Section

Claims

1. A release station for processing intermediate panel-carrier assemblies, comprising: A carrier platform includes: a platform for supporting the intermediate panel-carrier assembly, wherein the intermediate panel-carrier assembly includes a molded panel attached to a carrier by a heat-release tape; and a carrier platform heater associated with the platform for heating the intermediate panel-carrier assembly to a heat release temperature of the heat-release tape when the intermediate panel-carrier assembly is supported on the platform; and a release unit including: a release head movable toward the platform for engaging with the molded panel in the intermediate panel-carrier assembly located on the platform, wherein the release head further includes: a release head retaining member for retracting the molded panel when it has been separated from the carrier and engaged with the release head. The molded panel is releasably held on a mating surface of the release head; wherein, after the carrier stage heater has heated the intermediate panel-carrier assembly to the heat release temperature, and after the release head holding member releasably holds the molded panel on the mating surface of the release head, the release head can move away from the carrier stage surface, thereby separating the molded panel from the carrier, and the molded panel separated from the carrier is located on the mating surface of the release head, while the carrier with the heat release tape is held on the carrier stage surface; wherein the heat release tape includes a heat-sensitive layer and a pressure-sensitive layer, and when the heat release tape is located between the molded panel and the carrier, the heat-sensitive layer is adhered to the molded panel, and the pressure-sensitive layer is adhered to the carrier.

2. The release station as described in claim 1, wherein the release head further comprises: A release head heater associated with the mating surface of the release head is capable of heating the intermediate panel-carrier assembly in a cooperative manner with the carrier stage heater of the carrier stage when the intermediate panel-carrier assembly is located between the carrier stage and the release head.

3. A release station for processing intermediate panel-carrier assemblies, comprising: A carrier platform includes: a platform for supporting the intermediate panel-carrier assembly, wherein the intermediate panel-carrier assembly includes a molded panel attached to a carrier by a heat-release tape; and a carrier platform heater associated with the platform for heating the intermediate panel-carrier assembly to a heat release temperature of the heat-release tape when the intermediate panel-carrier assembly is supported on the platform; and a release unit including: a release head movable toward the platform for engaging the molded panel in the intermediate panel-carrier assembly located on the platform, wherein the release head further includes: a release head retaining member for releasably retaining the molded panel when the molded panel has been separated from the carrier and engaged with the release head. On a mating surface of the release head; wherein, after the carrier stage heater has heated the intermediate panel-carrier assembly to the heat release temperature, and after the release head holding member releasably holds the molded panel on the mating surface of the release head, the release head can move toward the table surface away from the carrier stage, thereby separating the molded panel from the carrier, and the molded panel separated from the carrier is located on the mating surface of the release head, while the carrier with the heat release tape is held on the table surface of the carrier stage; wherein, the release station further includes a tape removal tool for removing the heat release tape, wherein the tape removal tool further includes: a separation aid tool for forming a raised portion on the heat release tape; and an attachment mechanism for fixing the raised portion for initiating the removal of the heat release tape.

4. The release station as claimed in claim 3, wherein the separation aid is vertically movable toward an edge portion of the heat release tape for forming the raised portion on the heat release tape.

5. A panel release system for handling intermediate panel-carrier assemblies, comprising: Release station as described in request item 1; A panel processing station that can receive molded panels separated from the carrier from the release station; The system includes a panel platform movable between the panel processing station and the release station. When the panel platform is located within the release station and aligned with the release head of the release unit, the release head can release the molded panel separated from the carrier onto the panel platform. After the molded panel separated from the carrier is released onto the panel platform, the panel platform can move from the release station to the panel processing station, thereby transporting the molded panel separated from the carrier from the release station to the panel processing station. The panel processing station includes a panel processing unit, comprising a panel processing head, which, when the... When the panel platform is located at the panel processing station and holds the molded panel separate from the carrier, the panel processing head can move toward the panel platform to engage the molded panel separate from the carrier. The panel processing head includes a panel processing head holding member. When the panel processing head moves to engage the molded panel separate from the carrier, the panel processing head can releasably hold the molded panel on the engagement surface of a panel processing head of the panel processing unit and remove the molded panel held by it from the panel platform to remove the molded panel from the panel release system.

6. The panel release system as described in claim 5, wherein, The panel processing head also includes a temperature regulating heater associated with its mating surface; wherein, when the mating surface of the panel processing head is mated with the molded panel, the temperature regulating heater can regulate the temperature of the molded panel between the heat release temperature and the ambient temperature.

7. The panel release system as described in claim 5, wherein, The panel platform includes: a platform for supporting a molded panel separate from the carrier; and a temperature-regulating heater associated with the platform of the panel platform, wherein the temperature-regulating heater can maintain the temperature of the molded panel between the heat release temperature and the ambient temperature when the molded panel separate from the carrier is held on the platform of the panel platform.

8. The panel release system as described in claim 5, further comprising: A carrier processing station; wherein the carrier platform is movable between the release station and the carrier processing station; wherein the carrier processing station includes: a carrier processing unit including: a carrier processing head, wherein when the carrier platform and the carrier held thereon are located within the carrier processing station and aligned with the carrier processing head, the carrier processing head is movable toward the carrier platform to engage the carrier; the carrier processing head includes a carrier processing head holding member, which, when the carrier processing head engages the carrier, can releasably hold the carrier on a mating surface of the carrier processing head and remove the carrier held thereon from the carrier platform.

9. The panel release system as described in claim 8, further comprising: An unloading tray, when aligned with the carrier processing head within the carrier processing station, can receive the carrier from the carrier processing head; and after receiving the carrier, it can be removed from the carrier processing station to remove the carrier from the panel release system.

10. The panel release system as described in claim 8, wherein, After the molded panel is separated from the carrier in the release station, the heat-release tape remains on the carrier; wherein, the carrier processing station further includes: a tape removal tool, which can remove the heat-release tape from the carrier when the carrier having the heat-release tape is held on a carrier table located within the carrier processing station, before the carrier processing head releasably holds and removes the carrier from the carrier table; wherein, the tape removal tool is movable between a first side and an opposite second side of the carrier, and when the tape removal tool engages an edge portion at the first side of the heat-release tape, the heat-release tape covering the carrier can be removed sequentially from the first side to the second side.

11. The panel release system as described in claim 10, wherein, The tape removal tool includes a clamping mechanism for clamping the edge portion of the heat-release tape.

12. The panel release system of claim 8, wherein the panel platform is movable along a panel platform moving plane, the carrier platform is movable along a carrier platform moving plane, and the panel platform and the carrier platform are movable in a cooperative manner along the panel platform moving plane and the carrier platform moving plane, respectively, wherein the panel platform moving plane and the carrier platform moving plane are parallel.

13. The panel release system as claimed in claim 12, wherein the panel platform and the carrier platform move in directions that are not parallel to each other along the panel platform moving plane and the carrier platform moving plane, respectively.

14. The panel release system as described in claim 5, further comprising: A cutting station located upstream of the release station is capable of processing the intermediate panel-carrier assembly before it is conveyed to the release station. The cutting station includes: a cutter for cutting the molded panel into at least one Q panel; and a conveying mechanism for conveying the intermediate panel-carrier assembly having the molded panel cut into the at least one Q panel to a carrier stage within the release station, and heating the intermediate panel-carrier assembly to the release temperature using a carrier stage heater of the carrier stage.

15. The panel release system as described in claim 5, further comprising: A preheating station located upstream of the release station; And a preheating platform, comprising: a platform capable of holding the intermediate panel-carrier assembly, wherein the molded panel faces upward; a preheating heater, disposed connected to the platform of the preheating platform, for heating the intermediate panel-carrier assembly to an intermediate temperature below the release temperature when the intermediate panel-carrier assembly is located on the preheating platform; wherein the preheating platform is movable from the preheating station to the release station for transferring the intermediate panel-carrier assembly from the preheating station to the release station; wherein, when the preheating platform carrying the intermediate panel-carrier assembly moves from the preheating station to the release station and aligns with a release head in the release station, the release head is movable toward the preheating platform to contact the intermediate panel-carrier assembly and temporarily fixes it at the mating surface of the release head, and removes it from the preheating platform, so that the intermediate panel-carrier assembly can be released onto the carrier platform in the release station when the release head is aligned with the carrier platform.

16. The panel release system as claimed in claim 15, wherein the system further comprises: A preheating unit includes: a preheating head movable toward the surface of the preheating platform and in contact with an intermediate panel-carrier assembly held thereon; when the preheating platform carrying the intermediate panel-carrier assembly is located within the preheating station and aligned with the preheating head, the preheating head can engage the intermediate panel-carrier assembly; the preheating head includes: a preheater associated with a mating surface of the preheating head; when the intermediate panel-carrier assembly is located between the preheating platform and the preheating head, the preheating heater of the preheating head can cooperate with the preheater of the preheating platform to heat the intermediate panel-carrier assembly.

17. The panel release system as described in claim 16, further comprising: A feeding station includes: a feeding tray for receiving and supporting the intermediate panel-carrier assembly; wherein the feeding tray is movable from the feeding station to the preheating station for transferring the intermediate panel-carrier assembly from the feeding station to the preheating station; wherein the preheating head further includes a retainer for temporarily holding the intermediate panel-carrier assembly on the mating surface of the preheating head of the preheating unit when the preheating head engages with the intermediate panel-carrier assembly, wherein when the feeding tray carrying the intermediate panel-carrier assembly moves from the feeding station to the preheating station and aligns with the preheating head in the preheating station, the preheating head can move toward the feeding tray to contact the intermediate panel-carrier assembly, temporarily holding it on the mating surface of the preheating head, and removing it from the feeding tray, so that the preheating head can release the intermediate panel-carrier assembly onto the preheating table when subsequently aligned with the preheating table.

18. A panel release system for handling intermediate panel-carrier assemblies, comprising: The release station as described in request item 3; A panel processing station that can receive molded panels separated from the carrier from the release station; The system includes a panel platform movable between the panel processing station and the release station. When the panel platform is located within the release station and aligned with the release head of the release unit, the release head can release the molded panel separated from the carrier onto the panel platform. After the molded panel separated from the carrier is released onto the panel platform, the panel platform can move from the release station to the panel processing station, thereby transporting the molded panel separated from the carrier from the release station to the panel processing station. The panel processing station includes a panel processing unit, comprising a panel processing head, which, when the... When the panel platform is located at the panel processing station and holds the molded panel separate from the carrier, the panel processing head can move toward the panel platform to engage the molded panel separate from the carrier. The panel processing head includes a panel processing head holding member. When the panel processing head moves to engage the molded panel separate from the carrier, the panel processing head can releasably hold the molded panel on the engagement surface of a panel processing head of the panel processing unit and remove the molded panel held by it from the panel platform to remove the molded panel from the panel release system.

19. A method of operating a panel release system as described in any one of claims 5 to 18, comprising: The intermediate panel-carrier assembly held on the surface of the carrier platform is heated by a carrier platform heater associated with the platform surface, wherein the intermediate panel-carrier assembly is heated to the release temperature of the heat-release tape; when the carrier platform is aligned with the release head in the release station, the release head of the release unit moves toward the platform surface of the carrier platform to contact the intermediate panel-carrier assembly located on the platform surface of the carrier platform, and temporarily holds the molded panel at the mating surface of the release head; and after the carrier platform heater has heated the intermediate panel-carrier assembly to the heat release temperature, the release head that temporarily holds the molded panel moves away from the platform surface of the carrier platform, thereby separating the molded panel from the carrier and holding the separated molded panel at the mating surface of the release head, while the carrier remains on the platform surface of the carrier platform.

20. The operating method as described in claim 19, comprising: Position the panel platform within the release station and align it with the release head, temporarily holding the separated molded panel on the mating surface of the release head; then, release the separated molded panel from the release head onto the platform of the panel platform; then, move the panel platform carrying the separated molded panel from the release station to the panel processing station; then, when the panel platform is aligned with the panel processing head in the panel processing station, move the panel processing head toward the platform of the panel platform to contact the separated molded panel located thereon, and temporarily hold the molded panel at the mating surface of the panel processing head, for removing the separated molded panel from the panel release system via the panel processing head.

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