Method and device for producing contact metallizations

Abstract

The present invention provides a method for generating contact metallization on the bonding surface of a wafer by means of a manipulator device for operating a wafer and by means of multiple workstations, each workstation having a processing cavity for accommodating the wafer, wherein the multiple workstations have at least one deposition station having a processing cavity for accommodating a solution of contact metal deposited on the bonding surface of the wafer (11), comprising: step a) detecting measured values ​​of object characteristics of the wafer and / or workstations by means of sensors; and step b) determining the priority of assembling the processing cavity and / or the dwell time of the wafer in the processing cavity by means of querying the measured values ​​in a database and / or by means of inferring from a statistical model with input measured values; and step c) creating a control data set for the manipulator device; and step d) operating the wafer according to the control data set. Furthermore, the present invention also provides an apparatus for generating contact metallization on the bonding surface of a wafer.

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for generating contact metallization on the bonding surface of a wafer by means of a manipulator device and by means of a plurality of workstations preferably arranged in a line, the manipulator device being used to manipulate the wafer, the workstations each having a processing cavity for receiving the wafer, wherein the plurality of workstations includes at least one deposition station as a workstation, the deposition station having a processing cavity for receiving a solution consisting of contact metal dissolved in a carrier liquid for deposition onto the bonding surface of the wafer. [Previous Technology]

[0002] Contact metallization, technically termed under-bump metallization (UPM), is created on the chip's interconnect surfaces. This is performed on the wafer plane according to standards. That is, the entire wafer, along with multiple chips formed thereon, undergoes chemical processing before chip dicing from the wafer. An intermediate metallization, called under-bump metallization, is applied to the chip's interconnect surfaces. This intermediate metallization serves as an attachment base for subsequently applied solder bumps made of solder material. The interconnect surfaces initially have surface metallization made of aluminum or copper. Finally, chip dicing from the wafer is performed after the solder bumps are applied.

[0003] For example, the apparatus known from CN 203760439 U for producing such contact metallization typically includes a deposition station having a basin forming a processing chamber for containing, for example, a nickel solution, which typically contains nickel dissolved in nitric acid. When a wafer is accommodated in the processing chamber, nickel in the nickel solution can then be deposited on the bonding surface of the wafer as a contact metal. The process for forming contact metallization on the bonding surface of the wafer must be performed under cleanroom conditions to minimize the formation of defective sites. To perform the process, particularly including cleaning and rinsing operations on the wafer prior to contact metal deposition to form the contact metallization, several devices and measures are required. These devices and measures, on the one hand, enable control of the process, particularly regarding the association of the wafer with different workstations and the dwell time of the wafer in the workstations, and on the other hand, provide the media required for performing the process, such as deionized water for the rinsing process or a metal-containing solution for depositing the contact metallization.

[0004] As can be seen from the preconditions for performing the processing outlined above, the user must provide the corresponding processing parameters and apparatus in order to implement the contact metallization with the required reliability. Here, in addition to the obvious structural overhead, there is also the high overhead required for providing and determining the processing parameters, which is usually based on experience. This overhead ultimately also affects the manufacturing cost of the bondable chip, i.e., the chip with bump solder for subsequent contacts. [Summary of the Invention]

[0005] Therefore, the object upon which this invention is based is to provide a method and an apparatus that automate and facilitate the manufacture of contact metallization on the bonding surface of a wafer, ensuring high and consistent quality and further enabling cost-effective manufacturing of the corresponding wafer.

[0006] The objective is achieved in a surprisingly simple yet effective manner by a method for generating contact metallization on the bonding surface of a wafer, having features according to the invention, and an apparatus for generating contact metallization on the bonding surface of a wafer, having features according to the invention.

[0007] According to the present invention, a method is provided for generating contact metallization on the bonding surface of a wafer by means of a manipulator device and by means of a plurality of workstations preferably arranged in a line, the manipulator device being used to manipulate the wafer, the workstations each having a processing cavity for receiving the wafer, wherein the plurality of workstations include at least one deposition station as a workstation, the deposition station having a processing cavity for receiving a solution consisting of contact metal dissolved in a carrier liquid for deposition onto the bonding surface of the wafer, the method comprising the steps of: a. detecting at least one measurement of at least one object characteristic of the wafer and / or the workstation by means of at least one sensor of a sensor device; b. determining the priority of assembling the processing cavity and / or the dwell time of the wafer in the processing cavity by means of querying the measurement in a database or by means of inferring from a statistical model with input measurement; c. creating a control data set for the manipulator device taking into account the priority and / or dwell time determined in step b; and d. manipulating the wafer according to the control data set by means of the manipulator device.

[0008] It has been recognized within the scope of this invention that the operation of wafers, especially multiple wafers, that can be housed in transport receptacles is extremely complex and related to a number of influences. Within the scope of this invention, multiple wafers may also be referred to as wafer packages. Reliable, safe, and time-optimized contact metallization of wafers often fails due to the fact that priority of assembly processing cavities and / or wafer dwell time in processing cavities cannot be determined, resulting in only a single transport receptacle being transported through the equipment used to generate contact metallization, wherein the wafer housed in the transport receptacle passes through the processing cavities of the workstations according to a strictly preset order and dwell time. However, it has been recognized within the scope of this invention that it is advantageous to determine priority of assembly processing cavities and / or wafer dwell time in one of the processing cavities, taking into account environmental influences, the current position of the wafer, and / or the composition of the contents of the processing cavities of each workstation. The method according to the invention enables reliable contact metallization on the bonding surfaces of the wafers with reference to at least the parameters mentioned, thereby responding briefly and as automatically as possible to changes in the wafer manufacturing environment and / or the contents of the processing cavities.

[0009] For this purpose, in step a, at least one measurement of at least one object characteristic of the wafer and / or workstation is detected by means of at least one sensor of the sensing device. That is, characteristics of the wafer are detected, such as the weight of the wafer, the temperature of the wafer, the cleanliness and / or thickness of the contact metallization applied to the wafer on the bonding surface. Additionally or alternatively, object characteristics of the workstation can be detected, such as the composition of the liquid contents, particularly, of the processing chamber of the workstation, the temperature inside the processing chamber of the workstation or the temperature of the liquid contained in the processing chamber of the workstation, or the time period for which liquid is supplied in the processing chamber. The measurement value can be obtained by means of a sensor of the sensing device. It is conceivable that the sensor simultaneously or sequentially includes multiple identical object characteristics. For example, the sensor simultaneously or sequentially detects the weight of one or more wafers. It is also conceivable that the sensing device has a data processing device, and the measurement value is obtained by calculation in the data processing device from the data obtained by the sensor. Preferably, multiple identical or different measurement values ​​are measured.

[0010] The term “object characteristics” refers to state variables and / or features attributed to an object, which allow for the inference of the wafer’s identification, type and / or composition and / or the contents of the workstation’s processing cavity.

[0011] The term “measured value” refers to the quantification, representation and / or digitization of the characteristics of an object.

[0012] In step b, the measured values ​​measured in step a are retrieved from the database and / or input into the statistical model. The database may explicitly store at least one priority level of the assembly processing cavity and / or the dwell time of the wafer in the processing cavity for any number of measured values. Within the scope of the invention, the term "dwell time" refers to the time period during which a wafer or wafer package is brought into the processing cavity of the workstation. The term "priority level" within the scope of the invention refers to the setting according to urgency. In the present case, priority level refers to the order in which the assembly processing cavities are set according to urgency. For example, a transport container with a high priority wafer is operated by means of a manipulator device before a transport container with a low priority. Furthermore, optimal path planning for the manipulator device can be considered in the priority level. Path planning involves the geometric route planning of the manipulator device in its workspace. Path planning can be optimized in terms of route segments, route duration, and acceleration force during manipulator device activation and deactivation.

[0013] As long as the query for the measured value in the database is successful, that is, as long as the queried measured value is stored in the database, the database will send back the priority of the assembly processing cavity and / or the dwell time of the wafer in the processing cavity. Alternatively or additionally, the measured value can be input into a statistical model. The statistical model can be trained using a training dataset, which includes at least the training measured values, after, before, and / or during the execution of the method. The statistical model infers at least one optimal priority of the assembly processing cavity and / or the dwell time of the wafer in the processing cavity from the measured values. It is conceivable that the statistical model thereby infers at least one optimal priority of the assembly processing cavity and / or the dwell time of the wafer in the processing cavity such that all detected and weighted measured values ​​have the highest consistency with the training measured values ​​of the undetermined object characteristics of the wafer and / or workstation, thereby ensuring that the priority and / or dwell time stored for the wafer and / or the workstation is the optimal priority and / or dwell time. More preferably, it is conceivable that the statistical model infers the optimal priority level and / or dwell time based on the following: the individual detected and weighted measurements have the highest consistency with the individual training measurements, and the priority level and / or dwell time stored for each training measurement is the optimal priority level and / or dwell time. In other words, the inference of the statistical model corresponds to the priority level and / or the dwell time of a specific additional wafer and / or workstation, or the inference is formed by different priority levels and / or different wafer and / or workstation dwell times. Thus, advantageously, even if the measurement detected in step a cannot be directly correlated with the measurement in the database by querying the database, the priority level of the assembly processing cavity and / or the dwell time of the wafer in the processing cavity can be determined by inference with reference to historical data stored in the database. The database may be specifically set up for the method according to the invention. However, it is also conceivable that the database is generally accessible and / or set up for other other methods. In this case, the database is used for a general network, for digital accessibility of measurements, priority levels, and dwell times, and the method utilizes the stored information. Therefore, through the association of multiple devices for contacting the metallized part, multiple measurements and priority levels associated with the measurements and / or dwell times associated with the measurements are available for the method.

[0014] The term “optimal priority level and / or dwell time” refers to the following priority level and / or dwell time that a person skilled in the art, knowing the workstation and wafer, would classify as optimal in a given processing environment in which the method is performed, with regard to quality requirements and processing efficiency.

[0015] The term "inference" refers to deriving at least one new priority level and / or at least one new dwell time by means of a statistical model preferably created through training. The statistical model is preferably configured as a machine learning model. Preferably, the statistical model is created such that a statistical relationship, structure, and / or pattern is identified between the measured values ​​and the output values, i.e., the current priority level and / or dwell time. In other words, the statistical model can be trained using historical data comprising at least the measured values ​​and the output values ​​and / or using other datasets provided, wherein the data used to train the model is also referred to as the training dataset. Preferably, the training involves supervised learning, unsupervised learning, or reinforcement learning. Particularly preferred, the statistical model includes artificial neural networks, especially recurrent neural networks (RNNs), feedforward neural networks (FNNs), convolutional neural networks (CNNs), transformers, flow-based generative models, evolving neural networks, encoder-decoder models, variational autoencoders, autoregressive models (ARMA models), restricted Boltzmann machines (RBMs) and / or diffusion models, hidden Markov models (HMMs) and / or support vector machines (SVMs).Furthermore, it is conceivable to use genetic programming, boosting, decision tree machine learning, kernel density estimation (KDE), expert systems (ES), (naive) Bayesian classifiers, gradient boosting, linear discriminant analysis, nearest neighbor classification, clustering analysis methods, especially single-linkage methods, complete-linkage methods, Ward methods, K-means algorithm, fuzzy C-means algorithm, expectation-maximization algorithm (EM algorithm), DBSAN (Density-Based Spatial Clustering of Applications with Noise), STING algorithm (Statistical Information Grid-based Clustering Algorithm), and / or CLIQUE algorithm (Clustering Query Algorithm). Inquest-Algorithms and / or anomaly detection methods, particularly Local Outlier Factor (LOF), Isolation Forest, and / or Autoencoders and / or Principal Component Analysis (PCA). Furthermore, reinforcement learning methods, such as Associative Reinforcement Learning, Deep Reinforcement Learning, Adversarial Deep Reinforcement Learning, Fuzzy Reinforcement Learning, and / or Safe Reinforcement Learning, can be used. In particular, it is conceivable that methods for clustering data formation can also be used. Suitable measures for creating, using, and / or training are known to those skilled in the art. It is also conceivable that the training dataset is stored in a database, which is continuously expanded with new training datasets during operation or when using the method according to the invention.

[0016] Furthermore, it will be apparent to those skilled in the art that the measured values ​​are related to the type of sensor used, and depending on the type of sensor used, the measured values ​​also affect the transmission of priority levels and / or the dwell time of the wafer in the processing cavity. For example, in one design, the sensor device may have a time sensor and a position sensor, so that the measured values ​​can be the time value and position of the wafer, thereby allowing the wafer's dwell time in the processing cavity of the workstation to be determined, and the optimal dwell time of the wafer in the processing cavity can be determined in step b by querying the measured values ​​in a database and / or by inference from a statistical model with the input measured values. On the other hand, as long as multiple different positions of transport receptacles containing wafers are detected in step a and the time that the transport receptacles have been brought into the workstation is determined by means of the time sensor, the priority level of the processing cavity through which the assembly will still pass can be determined, making optimal path planning of the manipulator device feasible. Preferably, the priority level of the assembly processing cavity and the dwell time of the wafer in the processing cavity are determined in step b.

[0017] In step c, a control data set for the manipulator device is created, taking into account the priority level and / or dwell time determined in step b. It is also conceivable that other information, such as information not stored in a database, is considered when creating the control data set. This information may preferably relate to the manipulator device and / or workstation, particularly the state of the manipulator device and / or workstation, such as a workstation temporarily inactive due to maintenance or wafer assembly. Other information may also relate to the environment in which the method is performed, such as ambient temperature. Furthermore, it is conceivable that the user operating the method can influence the control data set by directly pre-setting other information. The control data set pre-sets paths and / or movement flows for the manipulator device, particularly which wafers should be introduced into which workstation at which time.

[0018] In step d, the manipulator operates the wafer according to the control data set. That is, the manipulator executes a motion sequence preset by the control data set. For example, taking into account the priority level determined in step b, the manipulator transports the first transport container along with the wafer to the first workstation and the second transport container along with the wafer to another workstation according to the control data set.

[0019] By means of the method according to the invention, it is possible to automatically transport multiple wafers, especially multiple different wafer packages, housed in transport receptacles to different workstations in a simple, fast, and easily adjustable manner according to priority level and / or dwell time by means of a manipulator device. Wafers can be transported between workstations in the correct priority order. It can be ensured that the most important wafer or the most important transport receptacle, i.e., the transport receptacle with the highest priority level, is always preferably transported or processed. Priority levels can be flexibly changed taking into account both external and internal influences. Therefore, by means of the method according to the invention, multiple transport receptacles can also be introduced into a device comprising multiple workstations, and each transport receptacle can be operated according to priority without affecting the metallization results of wafers in other transport receptacles. Coatings, especially those different in composition and layer thickness, can also be automatically applied to the bonding surfaces of wafers by taking into account dwell time and the priority level of the processing cavities of the assembly workstation. Another advantage of the method according to the invention is that, through inference, the quality of the contact metallization can be further improved because, through machine learning, the optimal timing for removing or assembling the processing cavity and for transporting the wafer can be continuously recalculated, taking into account various influences. This also minimizes operator error and reduces the correlation with the operator's experience and knowledge to a minimum. Furthermore, by taking into account processing time and acceleration force, the wafer can be operated uniformly, reliably, safely, and rapidly.

[0020] Advantageous embodiments of the invention are the subject of this document. Furthermore, all combinations of at least two features disclosed in the specification and / or drawings fall within the scope of the invention. It should be understood that embodiments of the method relate in an equivalent manner to the device according to the invention, without requiring separate mention of said device. In particular, it should be understood that conventional linguistic variations or semantically appropriate substitutions of corresponding terms within the scope of ordinary linguistic practice, especially the use of synonyms supported by generally recognized linguistic literature, are included in this disclosure without requiring explicit mention in their respective statements.

[0021] The object characteristics in step a can be characteristics inherent in the wafer or workspace, environmentally affected characteristics, and / or characteristics assigned to the wafer or workspace. Characteristics inherent in the wafer are, in particular, but not exclusively in any way, the wafer's volume, profile, size range, weight, and / or temperature. As long as multiple wafers disposed as wafer packages on transport receptacles move together between workstations and are transported to workstations, the characteristics inherent in the wafer also apply in an equivalent manner to the multiple wafers housed in the transport receptacles, thus relating to the wafer package. Characteristics inherent in the workstation, especially the workstation's processing cavity, can be the volume, profile, size range, fill level, aggregation state of the contents, density of the contents, composition of the contents, refractive index of the contents, residence time of the contents in the processing cavity, and / or temperature of the contents. Environmentally affected characteristics can be location, orientation within the equipment, orientation relative to other workstations, accessibility of the workstation, especially the workstation's processing cavity, or ambient temperature. For example, the characteristics assigned to a wafer and / or workstation could be an identification number, identification name, product number, product name, item number, and / or item name. In principle, the object characteristics are arbitrary, as long as the measurements representing them allow for the inference of at least one priority level and / or dwell time and / or the retrieval of at least one control data set in the database, taking into account the priority level and / or dwell time obtained in step b. The object characteristics previously listed enable the detection of measurements representing them, which are particularly suitable for comparison with a database and / or allow for the inference of optimal priority level and / or dwell time. In particular, the characteristics assigned to wafers and / or workstations are particularly suitable for comparison with a database. Object characteristics inherent in wafers and / or workstations are particularly suitable for comparing their associated measurements with statistical models.

[0022] According to an advantageous embodiment of the method, in step b, a priority level and / or dwell time can be determined taking into account the operating route between the processing cavities of the workstations to be assembled, the operating time for transporting the wafer between the processing cavities, the inertial forces during operation, the processing time in the processing cavities to be assembled, and / or the tolerance band of the processing time in the processing cavities to be assembled. Therefore, when determining the priority level and / or dwell time in step b, the required processing time, i.e., the time when the wafer is optimally brought into the processing cavity of the workstation, and the corresponding tolerance band, i.e., the possible deviation from the processing time, can be considered so as to obtain the desired result. Furthermore, the saturation of the solution contained in the processing cavity can also be considered, since the dwell time must be adjusted for optimal results based on the saturation of the solution contained in the processing cavity. Additionally, the operating route and operating time required for transporting the wafer between workstations, and the acceleration force generated during movement, can be considered. It has been recognized within the scope of the invention that a small acceleration force is advantageous when transporting the wafer.

[0023] Within the scope of this invention, the term "operation path" refers to the path along which a wafer moves by a manipulator device, particularly the gripper or end effector of the manipulator device traverses the movement path. In the simplest case, the movement path of the manipulator device, particularly the gripper or end effector of the manipulator device, may correspond to an operation path for transporting the wafer. Furthermore, within the scope of this invention, the term "operation time" refers to the time period during which the wafer moves by the manipulator device, particularly the gripper or end effector of the manipulator device traverses the movement path during the movement time. In the simplest case, the movement time of the manipulator device, particularly the gripper or end effector of the manipulator device, may correspond to an operation time for transporting the wafer.

[0024] The priority level determined in step b may include the order of assembly processing cavities and / or the path planning of the manipulator device. The determined priority level is the pre-defined priority of which wafer or wafer package the manipulator device should operate first. The path planning of the manipulator device is a precise geometric route pre-defined by the manipulator device within its workspace. Preferably, the order of assembly processing cavities is taken into account in the path planning of the manipulator device.

[0025] According to an advantageous embodiment, the database and / or statistical model can be expanded and / or updated in step b. The expansion of the database and / or statistical model can be achieved using measurements taken in step a and / or priority levels determined in step b and / or dwell times determined in step b. Within the scope of the invention, it has been recognized that the object characteristics of the wafer and / or workstation, particularly the contents of the workstation's processing cavity, can change temporarily or permanently. The reasons for this are essentially arbitrary, with possible conceivable reasons including, for example, changes in wafer temperature and / or the usage time of the solution in the processing cavity. Furthermore, it has been recognized that when a statistical model is trained using data from multiple typical datasets, also known as training datasets, the optimal priority level and / or dwell time can be inferred, in particular, from the statistical model. The measurements of the object characteristics that occur during the execution of the method are typical data particularly suitable for training the statistical model. By expanding and / or updating the database and / or statistical model, the method is continuously improved and kept up-to-date during continuous operation.

[0026] Furthermore, it has been considered advantageous that the operation includes grasping, receiving, lifting, transporting, releasing, and / or assembling a processing cavity of a workstation having a wafer and / or multiple wafers contained in a transport containment. Essentially arbitrary is how the wafer manipulation is performed by means of a manipulator device, as long as the operation is carried out according to priority level and / or wafer dwell time. The term "assembly" within the scope of the invention refers to introducing one or more wafers into the processing cavity of a workstation, particularly into a solution contained within the processing cavity.

[0027] According to one embodiment of the method, step d may further include evaluating the operation and obtaining the evaluation. The evaluation enables the judgment of the operation in terms of its quality. Furthermore, it is advantageous to expand and / or update the priority levels and / or dwell times in the database and / or statistical model by means of the evaluation, in order to obtain the advantages of expanding and / or updating the database and / or statistical model as described elsewhere. In this manner, the operation of the chip can be continuously optimized during continuous operation by means of a manipulator device. In particular, the statistical model can be continuously trained, improved, and / or adjusted through evaluation, so that even when the measured values ​​and / or object characteristics cannot be queried in the database, the optimal priority level and / or dwell time can be inferred with a higher probability by means of the statistical model when the method according to the invention is repeated. It is conceivable here to perform the evaluation by means of existing sensors or by means of sensors specifically installed for evaluation. The control dataset can be updated and / or expanded in step d, taking the evaluation into account. In this manner, it is possible to identify potentially defective and / or harmful operations during wafer operation, and to prevent wafer deterioration and / or damage during operation by preferably adjusting the control data set in real time.

[0028] According to an advantageous design, at least three, preferably four, transport receptacles accommodating multiple wafers can be operated in multiple workstations by means of a manipulator device. Based on the priority of the assembly processing cavities and / or the residence time of the wafers in the processing cavities obtained in step b, at least three, preferably four, transport receptacles can be reliably operated within a device including workstations, and contact metallization is preferably provided on the bonding surfaces of the wafers.

[0029] In another aspect, the present invention relates to an apparatus for generating contact metallization on the bonding surface of a wafer. The apparatus is adapted to perform the method according to the invention. The apparatus according to the invention comprises a plurality of workstations, each having a processing cavity for receiving a wafer. Preferably, the plurality of workstations are arranged in a line. Each of the plurality of workstations has at least one deposition station as a workstation, wherein the deposition station has a processing cavity for receiving a solution composed of contact metal dissolved in a carrier liquid for deposition onto the bonding surface of the wafer. Furthermore, the apparatus includes a manipulator device for manipulating the wafer. The manipulator device may be configured as a robot. The contact metal dissolved in the carrier liquid is preferably nickel, zinc, palladium, or gold. The apparatus is characterized in that the manipulator device is capable of assembling a wafer into a processing cavity according to a selectable priority level or a selectable dwell time in the processing cavity of the workstation. For this purpose, the apparatus includes a sensor device and a control device, wherein the control device is configured to control the movement of the manipulator device for assembling the processing cavity based on at least one measurement detected by means of the sensor device. In other words, the control device is configured to control the operation of the wafer by means of the manipulator device and, in particular, determine the order of the processing cavities to be assembled.

[0030] A workstation, particularly a deposition station, may include a basin device having a basin constituting a processing chamber for containing a liquid, particularly a solution of a contact metal dissolved in the liquid. In the deposition station, the contact metal can be deposited onto a wafer housed in the processing chamber, particularly onto the bonding surface of the wafer. Individual workstations may be configured as modules. Thus, multiple wafers can be delivered to different workstations or wafers can be assembled for different workstations using the apparatus according to the invention, wherein, according to a selectable priority level and / or a selectable residence time in the processing chamber, a required contact metallization can be applied to the bonding surface of the wafer.

[0031] The assembly of the processing cavity can be controlled by means of the device based on at least one measurement detected by a sensor device, such that a selectable priority level and / or a selectable dwell time in the processing cavity can be adjusted according to the measurement detected by the sensor device. Preferably, both the priority level and the dwell time in the processing cavity are considered when assembling the processing cavity.

[0032] The sensing device may include a position sensor, an acceleration sensor, a weight sensor, a temperature sensor, and / or a chemical sensor for analyzing liquid in one of a plurality of processing chambers and / or for monitoring deposition on the bonding surface of the wafer. The position sensor preferably determines the current position of the manipulator device and / or the wafer or wafer package within the device. The temperature sensor is preferably used to detect the temperature of the liquid in the processing chamber, the ambient temperature inside the device, the ambient temperature outside the device, and / or the temperature of the wafer or wafer package. The chemical sensor, used for analyzing the liquid, particularly for analyzing solutions composed of contact metal dissolved in a carrier liquid, can infer the liquid in one of the processing chambers, and in particular, determine the liquid's usage time and the necessity of liquid replacement. It is conceivable that the residence time in the corresponding processing chamber can be adjusted based on the liquid's usage time in one of the processing chambers. The chemical sensor can also be used to monitor deposition on the bonding surface of the contact metal to the wafer. For example, it can be monitored to what extent a sufficient layer thickness of the contact metal can be deposited on the bonding surface of the wafer.

[0033] The device can surround a transport container along with a plurality of wafers contained therein, wherein a processing cavity is configured to accommodate the transport container along with the plurality of wafers contained therein, and a manipulator device is configured to operate the transport container. The transport container is preferably inserted into the processing cavity from above, particularly into a tray of a workstation. This allows for the simultaneous delivery of multiple wafers to the processing cavity. The transport container can be configured as a basket. In the transport container, the wafers can be arranged parallel to each other, at uniform spacing, and oriented vertically or horizontally. Supporting elements can be provided on the bottom wall of the processing cavity, particularly the tray, on which the transport container along with the wafers contained therein can be supported. The manipulator device for operating the transport container can be configured to move the transport container vertically to insert it into the processing cavity, particularly into a tray of a workstation, and then remove it from the processing cavity again. Nevertheless, it is also possible, by means of the manipulator device, to move the transport container vertically to different workstations.

[0034] Advantageously, the manipulator device may include a conveying unit. The conveying unit may have a horizontally movable carrier connected to a conveyor belt of the conveying unit, the carrier having at least one gripper arm movable vertically relative to the carrier. The conveyor belt may be driven by a drive motor. The carrier may have a conveyor belt, and the gripper arm may be moved relative to the carrier by means of the conveyor belt, wherein the conveyor belt may be driven by a drive motor of the carrier. The gripper arm may be configured as a receiving portion. The sensing device may include sensors for monitoring the current of one or more drive motors, the temperature of one or more drive motors, the position of the carrier and / or the gripper arm, the acceleration of the carrier and / or the gripper arm, and / or the voltage of one or more conveyor belts. The transport receiving portion may have a receiving element that can be used to grip the transport receiving portion by means of the gripper arm. As long as the transport receiving portion has an identification element, such as a barcode or RFID transponder, the device may include a reading device or identification device for reading or identifying the identification element. This enables the association of transport accommodations with the processing flow or the monitoring of transport accommodations within the processing flow.

[0035] Alternatively or additionally, the manipulator device can be configured as a multi-axis robot for manipulating the wafer. The robot's end effector can be configured as a gripper. The gripper can be configured as a receiving portion. The transport receiving portion can have receiving elements that can be used to grasp the transport receiving portion by means of the robot's gripper. The sensing device can have sensors for monitoring the current of one or more drive motors of the robot, the temperature of one or more drive motors of the robot, the position of the robot's end effector, and / or the acceleration of the robot's end effector.

[0036] The device may preferably have an input / output station for assembling at least one transport container into the device or for removing the transport container from the device. Furthermore, multiple workstations may include at least one cleaning station, at least one rinsing station, and / or at least one drying station as workstations. In the processing chamber of the cleaning station, wafers, particularly the transport container along with the wafers contained therein, may be received and cleaned, preferably chemically and / or physically. In the processing chamber of the rinsing station for receiving the transport container along with the wafers contained therein, any possible residues may be removed from the wafer surface. Rinsing in the rinsing station is preferably performed with deionized water. The input / output station may have drawers that are preferably automatically removable in and out. The drawers may be part of an operating device and may be moved in and out by means of a drive motor, respectively. Alternatively or additionally, the corresponding handles of the drawers may allow for manual movement in and out of the drawers. Furthermore, each drawer may have a bottom along with positioning elements disposed on the bottom for positioning one or more wafers and / or transport containers. The assembly of the drawer with the transport receptacle can be identified by means of an identification device for the device or drawer, so that the manipulator can accommodate the transport receptacle after the automatic insertion of the drawer triggered by the identification of the assembly. The assembly and insertion of the drawer are preferably performed taking into account priority level and / or dwell time in the processing cavity of the device. Priority level and / or dwell time can preferably be determined by means of step b of the method according to the invention. As long as the transport receptacle is accommodated by means of the manipulator, the device can indicate by means of the automatic removal of the drawer and / or by means of the output notification, taking into account priority level and / or dwell time in the processing cavity, that the transport receptacle can be reassembled with the wafer. The wafer with completed processing, i.e., especially the wafer with contact metallization formed on the bonding surface, can be stored in the drawer of the output station by means of the manipulator, so that the transport receptacle can then be removed from the drawer, which is preferably automatically removed. Advantageously, the entire process can be performed almost entirely automatically based on the combined action of the control device, the sensor device and the manipulator and cause optimal contact metallization of the bonding surface of the wafer, wherein multiple transport receptacles, preferably four transport receptacles, can be operated simultaneously in the device.

[0037] The processing chamber of the workstation can be arranged on the processing side of the workstation according to one design scheme of the equipment, wherein the processing side is separated from the supply side by means of a separation device. A device for operating and controlling the processing occurring in the processing chamber can be provided on the supply side. An operating device for operating the transport and receiving section can be provided at the separation device. The equipment can be divided into areas of different cleanroom classes by means of the separation device. For example, a space of a lower cleanroom class can be constructed on the supply side than on the processing side. Then, under higher cleanroom class conditions, the workstation can be assembled by an operator on the processing side, while other work with lower cleanliness requirements, such as maintenance work on the unit or equipment, can be performed on the supply side of the equipment without thereby impairing the processing flow in the processing chamber on the processing side. In addition to the separation function, the separation device can also function as a receiving unit, a guiding unit, or a fastening unit for the operating device, so that the operating device can be arranged in the equipment in a simple manner and with minimal structural space saving. If each workstation has a component of the separation device configured as a separation wall, it is feasible to combine the various modules with each other with as little cost as possible, without having to add a separation device that would incur additional costs.

Implementation Method

[0039] Figures 1 to 11 provide an overview of an apparatus 10 for generating contact metallization on the bonding surface of a wafer 11 housed in a transport housing 16. The apparatus includes at least one sensor device 20, a control device 22, and multiple workstations. As workstations, the apparatus 10 according to the illustrated embodiment includes: an input / output station 50 for assembling the transport housing 16 into the apparatus 10; a cleaning station 51 with a processing cavity 12 for accommodating the transport housing 16 together with the wafer 11 housed therein; a deposition station 52; a rinsing station 53; and a drying station 54. The workstations are arranged in a line. The cleaning station 51, deposition station 52, rinsing station 53, and drying station 54 each have a processing cavity, wherein the processing cavities of the rinsing station 53 and the drying station 54 are not shown here, so that only the processing cavity 12 of the cleaning station 51 and the processing cavity 13 of the deposition station 52 can be seen from the diagrams in Figures 1 and 2. As further shown in Figure 2, it is feasible to install a separation device 44 in the device 10 to divide the workstation into areas of different cleanroom classes, thereby separating the processing side 40 from the supply side 42. In the current configuration, a grauraum exists on one side of the separation device 44, i.e., the supply side 42, and a cleanroom exists on the other side of the separation device 44, i.e., the processing side 40. This cleanroom has a higher cleanroom class than the grauraum and allows for workstation assembly by an operator under cleanroom conditions. Another operator can, for example, perform maintenance work on the units or devices on the supply side 42 of the device 10 without thereby damaging the processing flow in the processing chamber on the processing side 40 of the device 10.

[0040] Furthermore, the device 10 includes a manipulator device 15, which includes a conveyor unit 60. The conveyor unit 60 may have a conveyor belt 61 for horizontal movement of the gripper arm 63 and a conveyor belt 66 for vertical movement of the gripper arm 63. Additionally, the manipulator device 15 has a horizontally movable carrier 62 connected to the conveyor belt 66 of the conveyor unit 60, the carrier having a gripper arm 63 that is vertically movable relative to the carrier 62. The conveyor belt 61 is driven by a drive motor 64 of the conveyor unit 60. The carrier 62 has a conveyor belt 66 driven by a drive motor 65 of the carrier 62, by means of which the gripper arm 63 can be moved relative to the carrier 62. Therefore, the transport receiving section 16, together with the wafer 11 housed therein, can be transported to the processing cavity of the workstation in a simple manner and method by means of the manipulator device 15, wherein the order of transport to the processing cavity can be freely selected. According to the method of the invention, which can be performed using the illustrated device 10, the assembly of the processing cavity of the workstation is performed based on a priority level determined by the method and the dwell time of the wafer 11 in the processing cavity. The priority level and dwell time are determined by the control device 22. In addition to a server 30 storing a statistical model 32 and a database 31, the control device may also have a programmable logic controller 33 and a user interface 34. The control device 22 provides a control dataset S for controlling the manipulator device 15, wherein the control device can independently create the control dataset using artificial intelligence (AI) and / or machine learning. Additionally, the control dataset S can be created and / or adjusted by the operator themselves using the support of artificial intelligence (AI) and / or machine learning, either via the user interface 34 or the user interface 17 at the device. To create the control dataset S, the sensor device 20 detects a measurement M of the object characteristics of the wafer 11 and / or the workstation using at least one sensor 21. The measurement M is transmitted by the sensor device 20 to the control device 22 and to the database 30 and / or the statistical model 32. The control device 22 can be located at least partially remotely from the workstation. In particular, the server 30 can be located remotely from the workstation. Data exchange between the sensor device 20, the manipulator device 15, and the control device 22 can be wired and / or wireless. As long as a control data set S for the corresponding measurement value M is stored in the database 30, the control data set S can be output by querying the measurement value M in the database 30. Alternatively, the priority level and / or dwell time of the measurement value M can be optimally matched to the measurement value M by using the inference output of the statistical model 32. Taking into account the determined priority level and / or dwell time, the control device 22 can create a control data set S for the manipulator device 15. The control data set S preferably includes path planning for the manipulator device 15 for operating the transport container 16 between workstations of the device 10.Therefore, for example, by means of sensor 21 of sensor device 20, the chemical composition of the liquid in the processing chamber 13 of deposition station 52 can be determined, and considering the measurement value M output by sensor 21, the residence time matching the chemical composition of the liquid in processing chamber 13 can be determined. The matched residence time then affects the operation of another transport container 16 in the workstation, since processing chamber 13 is occupied for a specific time period, so that manipulator device 15 can equip another processing chamber with transport container 16 during the occupation time of processing chamber 13. Path planning for assembling the other processing chamber is performed after determining the priority level and / or residence time and is transmitted to manipulator device 15 by means of control data set S. Due to the feasibility of accessing historical data on priority level and residence time stored in database 31 and the feasibility of determining priority level and residence time according to statistical model 32, the equipment can be optimally utilized while maintaining the high quality of the contact metallization section. Furthermore, the equipment 10 is less dependent on the operator's practical experience and is therefore less prone to error operation.

[0041] As can be seen particularly from the overviews in Figures 2 and 3, the input / output station 50 may be configured with drawers 70, as shown separately in Figure 3. The drawers 70 can be automatically moved in and out by means of a drive motor 71. The corresponding handles 72 of the drawers 70 additionally allow for manual movement in and out by an operator. Furthermore, each drawer 70 has a bottom 73 together with positioning elements 74 provided on the base plate 73 for positioning the transport receiving portion 16. Additionally, receiving elements 75 of the transport receiving portion 16 can be seen, which are used to grip the transport receiving portion 16 by means of a gripping arm 63.

[0042] As is clearly seen again from the overviews of Figures 6 to 11, the transport container 16, together with the wafer 11 vertically positioned therein, can be inserted into or removed from the processing chamber 13 of the deposition station 52, wherein the transport container 16 inserted into the processing chamber 13 is supported on a support element 14 provided at the bottom of the processing chamber 13, which is configured as a basin. The same applies to the insertion or removal of the transport container 16 from the cleaning station 51, the rinsing station 53, and the drying station 54, which can also have processing chambers configured as basins.

[0043] According to the invention, the deposition station 52 includes a basin device having a basin constituting a processing chamber 13 for containing a solution of a metal dissolved in a liquid for deposition on the connecting surfaces of a plurality of wafers 11 housed in a transport receiving portion 16 that can be housed in the processing chamber 13. The wafers can be inserted into the processing chamber 13 from above for deposition processing or can be removed from the processing chamber 13 thereafter, and can be operated by means of a manipulator device 15. The deposition station 52 may have a storage container and a circulation pump for loading circulating liquid into the processing chamber 13. In addition, a storage container for storing contact metals, such as nickel, and a storage container for nitric acid may be provided, wherein the storage container for contact metals supplies contact metals to the processing chamber 13 for maintaining a constant contact metal content in the processing chamber 13, and the nitric acid is used on the one hand to produce the solution required in the processing chamber 13, and on the other hand for cleaning purposes, such as cleaning in the cleaning station 51.

[0044] FIG7 shows a cross-section of the diagram shown in FIG6, where it can be seen that the transport container 16 is almost completely inserted into the processing cavity 13, but is not yet supported on the support element 14. Instead, in FIG8, the transport container 16 is held outside the processing cavity 13 by the gripper arm 63 of the manipulator device 15. By means of the conveyor belt 66 provided at the carrier 62, the gripper arm 63 can be lowered so that the transport container 16 together with the wafer 11 housed therein can be introduced into the processing cavity. In FIG9, the gripper arm 63 is lowered further relative to the position shown in FIG8, and the transport container 16 is partially introduced into the processing cavity 13 of the deposition station 52. As can be seen from FIG. 10 and especially from the cross-sectional view shown in FIG. 11, which is illustrated in FIG. 10, by means of the gripper 63, the transport receiving portion 16 in FIG. 10 and FIG. 11 is further lowered relative to the position shown in FIG. 9 and fully inserted into the processing cavity 13, such that the transport receiving portion 16 is supported on the support element 14. [Simplified Explanation of the Diagram]

[0038] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The drawings show: [Fig. 1] an embodiment of the device according to the present invention; [Fig. 2] a perspective view of the workstation of the device according to FIG. 1 in an enlarged view; [Fig. 3] a perspective view of the drawer of the input / output station of the device according to FIG. 1; [Fig. 4] a perspective view of the manipulator device having a transport housing; [Fig. 5] a perspective partial view of the manipulator device shown in FIG. 4; [Fig. 6] a perspective partial view of the device when the transport housing is positioned inside the processing cavity; [Fig. 7] a cross-sectional view of the device when the transport housing is positioned inside the processing cavity; [Fig. 8] a perspective partial view of the device when the transport housing is positioned outside the processing cavity; [Fig. 9] a perspective partial view of the device when the transport housing is partially introduced into the processing cavity; [Fig. 10] a perspective partial view of the device when the transport housing is positioned inside the processing cavity; [Fig. 11] a cross-sectional view of the partial view shown by means of FIG. 10.

Claims

1. A method for generating contact metallization on the bonding surface of a wafer (11) by means of a manipulator device (15) and by means of a plurality of workstations, the manipulator device being used to operate the wafer (11), and the plurality of workstations preferably being arranged in a line and each having a processing cavity (12, 13) for accommodating the wafer (11), wherein the plurality of workstations includes at least one deposition station (52) as a workstation, the deposition station having a processing cavity (13) for accommodating a solution consisting of contact metal dissolved in a carrier liquid and for deposition onto the bonding surface of the wafer (11), the method comprising the steps of: a. detecting at least one measurement (M) of at least one object characteristic of the wafer (11) and / or the workstation by means of at least one sensor (21) of a sensor device (20); b. The priority of assembling the processing cavities (12, 13) and / or the dwell time of the wafer (11) in the processing cavities (12, 13) are determined by querying the measured value (M) in the database (30) and / or by inferring the measured value (M) using a statistical model (32). The priority and / or the dwell time are determined in step b, taking into account the operation route between the processing cavities (12, 13) to be assembled, the operation time between the processing cavities (12, 13) to be assembled, and / or the inertial forces during operation. c. Create a control data set (S) for the manipulator device (15) taking into account the priority level and / or the dwell time obtained in step b; and d. Operate the wafer (11) according to the control data set (S) by means of the manipulator device (15).

2. The method as described in claim 1, wherein the object characteristic in step a is a characteristic inherent in the wafer (11) or the workstation, an environmentally affected characteristic, and / or a characteristic assigned to the wafer (11) or the workstation.

3. The method as described in any of the preceding claims, wherein in step b, the priority level and / or the dwell time are determined taking into account the processing time in the processing chambers (12, 13) to be assembled and / or the tolerance zone of the processing time in the processing chambers (12, 13) to be assembled.

4. The method as described in claim 1 or 2, wherein the priority level determined in step b includes the order of assembling the processing cavities (12, 13) and / or the path planning of the manipulator device (15).

5. The method as described in claim 1 or 2, wherein in step b, the database (31) and / or the statistical model (32) are expanded and / or updated by means of the measurement value (M) measured in step a and / or by means of the priority level obtained in step b and / or by means of the dwell time obtained in step b.

6. The method as claimed in claim 1 or 2, wherein operating the wafer (11) includes gripping, receiving, lifting, transporting, releasing and / or assembling a processing cavity (12, 13) of a workstation having the wafer (11).

7. The method as described in claim 1 or 2, wherein step d further comprises: The operation is evaluated and an evaluation is obtained.

8. The method as described in claim 7, wherein step d further comprises: The control dataset (S) shall be updated and / or expanded in consideration of the assessment.

9. The method as claimed in claim 1 or 2, wherein at least three, preferably four, transport receptacles (16) accommodating a plurality of wafers (11) are operated by means of the manipulator device (15) in the plurality of workstations.

10. An apparatus (10) for generating contact metallization on the bonding surface of a wafer (11), the apparatus comprising a manipulator device (15) for operating the wafer (11) and a plurality of workstations preferably arranged in a line, each workstation having a processing chamber (12) for receiving the wafer (11), wherein the plurality of workstations includes at least one deposition station (52) as a workstation, the deposition station having a processing chamber (13) for receiving a solution consisting of contact metal dissolved in a carrier liquid for deposition onto the bonding surface of the wafer (11), wherein the manipulator device (15) is capable of selectively depositing contact metallization on the processing chambers (12, 13) according to a selectable priority level and / or selectable priority level. The dwell time in the processing cavity (12, 13) is implemented for assembling the wafer (11), wherein the device (10) includes a sensor device (20) and a control device (22), and the control device (22) is configured to: control the movement of the manipulator device (15) for assembling the processing cavity (12, 13) based on at least one measurement (M) detected by means of the sensor device (22), and wherein the priority level and / or the dwell time are determined in consideration of the operation route between the processing cavities (12, 13) to be assembled, in consideration of the operation time between the processing cavities (12, 13) to be assembled, and / or in consideration of the inertial forces during operation.

11. The device as claimed in claim 10, wherein at least one sensor (21) of the sensing device (22) is a position sensor, an acceleration sensor, a weight sensor, a temperature sensor and / or a chemical sensor for analyzing liquid in one of the processing cavities (12, 13) and / or for monitoring deposition on the bonding surface of the wafer (11).

12. The device as claimed in claim 10 or 11, wherein the transport receiving portion (16) together with a plurality of wafers (11) therein is surrounded, wherein the processing cavities (12, 13) are configured to receive the transport receiving portion (16) together with the plurality of wafers (11) therein, and the manipulator device (15) is configured to operate the transport receiving portion (16).

13. The device as claimed in claim 10 or 11, wherein the manipulator device (15) has a horizontally movable carrier (62) connected to the conveyor belt (61) of the conveyor unit (60), the carrier having at least one gripper (63) movable vertically relative to the carrier (62).

14. The device as claimed in claim 10 or 11, wherein the plurality of workstations as workstations have: at least one input / output station (50) for assembling at least one transport receiving portion (16) for the device (10); at least one cleaning station (51) having a processing cavity (12) for receiving the transport receiving portion (16) together with the wafer (11) therein; at least one rinsing station (53) having a processing cavity for receiving the transport receiving portion (16) together with the wafer (11) therein for removing possible residues from the wafer surface; and / or at least one drying station (54) having a processing cavity for receiving the transport receiving portion (16) together with the wafer (11) therein.

15. The device as claimed in claim 10 or 11, wherein the processing side (40) of the workstation is separated from the supply side (42) of the workstation by means of a separation device (44), wherein the processing chamber (12, 13) is provided on the processing side (40) and means for running and controlling the processing that occurs in the processing chamber (12, 13) are provided on the supply side (42), and wherein the manipulator device (15) is provided at the separation device (44) for operating the transport container (16).

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