Washer structure and method of assembling circuit board using the same

Abstract

A gasket structure is provided for attachment to an assembly hole on a substrate. The gasket structure includes a gasket body and an adhesive layer. The gasket body includes a through hole extending through the gasket body and a raised ring surrounding the through hole. The raised ring protrudes from a surface of the gasket body, and when the surface of the gasket body is attached to the substrate, at least a portion of the raised ring is located within the assembly hole. The adhesive layer is disposed on the surface to attach the gasket body to the substrate.

Claims

1. A gasket structure for attaching to an assembly hole on a substrate, comprising: The washer body includes a through hole extending through the washer body and a protruding ring surrounding the through hole, the protruding ring protruding from a surface of the washer body, wherein at least a portion of the protruding ring is located within the assembly hole when the surface of the washer body is attached to the substrate, wherein the substrate includes a nut, and the protruding ring abuts against the upper surface of the nut when at least a portion of the protruding ring is located within the assembly hole; and an adhesive layer disposed on the surface to attach the washer body to the substrate.

2. The washer structure as claimed in claim 1, wherein the thickness of the protruding ring extending beyond the surface is substantially less than or equal to 0.2 mm.

3. The gasket structure as claimed in claim 1, wherein the thickness of the gasket body is substantially between 0.5 mm and 1 mm.

4. The washer structure as claimed in claim 1, wherein the diameter of the washer body is substantially 1.6 to 2 times the diameter of the through hole.

5. A substrate assembly method, comprising: A substrate is provided, which includes an assembly hole through the substrate, a first surface, and a second surface opposite to the first surface; The washer structure is attached to a first surface of the substrate, wherein the washer structure includes a through hole and a raised ring surrounding the through hole, and at least a portion of the raised ring is located within the assembly hole; a nut is secured to the assembly hole from the second surface toward the first surface until the nut abuts against the raised ring; and the washer structure is removed.

6. The substrate assembly method as described in claim 5 further includes: A surface mount process is performed to mount electronic components on the first surface.

7. The substrate assembly method as claimed in claim 6, wherein the surface mounting process includes forming a solder layer on the first surface.

8. The substrate assembly method as described in claim 6 further includes: The heat dissipation element is locked onto the substrate and thermally coupled to the electronic component.

9. The substrate assembly method as described in claim 8, wherein securing the heat dissipation element to the substrate further comprises: The screw is tightened into the nut from the first surface toward the second surface.

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