High-precision micro-device transfer method and system based on integrated control of micro-suction / blowing heads and programmable electric fields

Abstract

This invention relates to a high-precision transfer method and system for micro-devices based on integrated control of micro-suction / blowing heads and programmable electric fields. The method includes: providing a release carrier for the micro-devices; using an integrated transfer module comprising a programmable micro-suction / blowing head array and a programmable electric field array to generate adjustable negative / positive pressure airflow and a multi-dimensional non-contact electric field above the carrier, achieving desorption, levitation, and controllable micro-contact of the micro-devices. Through synchronous adjustment of air pressure and electric field parameters by a control module, real-time and precise correction and alignment of the micro-devices' XYZ axis position and orientation are achieved, ultimately transferring the devices precisely to a target substrate. The system includes a source carrier platform, a target substrate platform, the aforementioned integrated transfer module, and a control module, and can selectively integrate the target substrate with the electric field unit to further improve alignment stability. This invention enables large-area, high-precision synchronous transfer of micro-devices, and is particularly suitable for advanced packaging processes such as Micro-LED, 2.5D / 3D IC stacking, and HBM.

Claims

1. A method for high-precision transfer of micro-devices, characterized in that it is executed using an integrated transfer module, the transfer module comprising: a programmable micro-suction / blowing head array for generating adjustable negative and positive pressure airflow; and a programmable electric field array for generating a directional and gradient non-contact electric field, both acting synergistically on a suspended micro-device; and the method comprising: 1.1 A control module synchronously adjusts the negative / positive pressure and electric field parameters of the transfer module according to a preset or programmed control strategy to precisely fine-tune the position and / or orientation of the micro-device on the XYZ axis and perform real-time accurate correction; and 1.2 The micro-device is precisely aligned and transferred to a predetermined position on a target substrate to complete the placement.

2. The method for high-precision transfer of micro-devices as described in claim 1, wherein, The programmable electric field array includes a plurality of independently controllable electrode units. The control method includes selectively adjusting the voltage, frequency and / or phase of each electrode unit to generate an electric field with specific directionality, intensity and / or gradient, thereby improving the alignment accuracy of micro-devices.

3. The method for high-precision transfer of micro-devices as described in claim 1, wherein, The programmable micro-suction / blowing head array is divided into multiple independently controllable zones. Each zone can generate different negative or positive pressures through programming according to the needs of the target area to perform local adsorption, temporary fixation or removal.

4. A high-precision transfer system for micro-devices with a target substrate-coordinated electric field control mechanism, characterized in that it comprises: 4.1 a transfer module, comprising an integrated programmable micro-suction / blowing head array and a programmable electric field array, for generating a non-contact force field for levitation, guidance, and alignment of the micro-devices; 4.2 a target substrate-coordinated electric field unit, disposed adjacent to or integrated into a target substrate platform, for generating a programmable electric field; and 4.3 a control module, electrically coupled to the transfer module and the target substrate-coordinated electric field unit, wherein the control module is configured to synchronously control the electric field parameters of the micro-suction / blowing head, the transfer module, and the target substrate-coordinated electric field unit, so as to synergistically improve the final alignment stability and precise placement effect of the micro-devices.

5. The high-precision transfer system for microdevices with a target substrate-coordinated electric field modulation mechanism as described in claim 4, wherein, The transfer module is a single entity integrated unit that can be repeatedly deployed in different transfer areas or configured as an array for parallel batch transfer.

6. The high-precision transfer system for microdevices with a target substrate-coordinated electric field modulation mechanism as described in claim 4, wherein, The programmable electric field array of the transfer module and / or the target substrate, together with the electrode configuration of the electric field unit, have a spatially anisotropic asymmetric electrode structure and support mixed-mode operation of electrostatic field and AC / pulse electric field, so as to achieve dynamic adjustment of field shape in each stage of micro-device suspension, driving and placement, and achieve a transfer accuracy of less than 0.5 μm in alignment error.

7. The high-precision transfer system for microdevices with a target substrate-coordinated electric field modulation mechanism as described in claim 4, wherein, The control module further includes an AI algorithm module configured to perform defect identification, deviation prediction and / or dynamic adjustment of transfer parameters of the micro-device based on external sensing data, so as to optimize the transfer strategy.

8. The high-precision transfer system for microdevices with a target substrate cooperative electric field control mechanism as described in claim 4 further includes a high-precision Z-axis adjustment module for controlling the vertical distance between the transfer module and the target substrate platform, and for performing final vertical fine-tuning at the micrometer or submicrometer level before the microdevice is finally placed.

9. The method or system as described in claim 1 or claim 4, wherein, When the size of the micro-device is sufficient to make the electric field force generated by the programmable electric field array greater than the aerodynamic force and gravity, the control module controls the programmable electric field array to levitate, align and adjust the attitude of the micro-device, and the programmable micro-suction / blowing head array is in a deactivated or standby state during this operation phase.

10. The method or system as described in claim 1 or claim 4, wherein, The micro-devices include, but are not limited to: Micro-LED chips, CIS sensing chips, microelectromechanical systems (MEMS) structures, or bare dies for high bandwidth memory (HBM) stacking; and the method or system is applicable to synchronous or asynchronous transfer under various process conditions such as large area, high density, heterogeneous integration or partition control, and is also applicable to application scenarios such as advanced wafer stacking, die-level packaging, flexible substrate assembly or synchronous deployment of multi-die arrays.

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