Fixing assembly and substrate carrier using the same
Patent Information
- Application Number
- TW114134170
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-12-02
- Filing Date
- 2025-09-05
- Publication Date
- 2026-10-11
- Estimated Expiration
- 2045-09-04
AI Technical Summary
Existing substrate carrier systems face issues with cumbersome assembly processes, unstable positioning due to loose screws, and high maintenance costs due to consumable kinematic coupling elements, which affect the precision and efficiency of semiconductor manufacturing.
A fixing component using a sleeve and pin mechanism that locks the positioning element and base without screws, employing a press-lock mechanism for secure attachment.
Simplifies assembly, enhances positioning stability, reduces maintenance costs, and maintains cleanliness by eliminating particle generation during tightening, thereby improving semiconductor manufacturing efficiency.
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Abstract
Description
Technical Field
[0001] This invention relates to a fixing component, and more particularly to a fixing component for use in the semiconductor field and a substrate carrier using the same. Prior Technology
[0002] In the semiconductor manufacturing industry, various substrates are widely used at every stage of the manufacturing process to ensure the smooth operation of various semiconductor processes. Whether in the early, middle, or late stages of the process, substrates typically need to be transferred from one workstation to another. During handling and transfer, to prevent substrates from being bumped or exposed to environmental contamination, substrate carriers are known to be used to hold the substrates.
[0003] A known substrate carrier includes a carrier body and a base. The base is used to fix the substrate carrier to the outer shell of the carrier body. The substrate carrier can be supported by external equipment through the base and assisted in its positioning between workstations. In known applications, in order to achieve precise positioning, the base is provided with multiple kinematic coupling (KC) elements, such as V-shaped KC grooves.
[0004] In one example, a substrate carrier is used to load wafers. According to the Semiconductor Equipment and Materials International (SEMI) standard, three KC elements must be installed on the substrate carrier base. When the substrate carrier is placed on the wafer loading / unloading equipment, these three KC elements engage with three KC locating pins on the equipment to achieve precise carrier positioning. However, after prolonged and repeated use, KC elements (such as KC slots) are prone to wear or damage, leading to decreased positioning accuracy and requiring replacement. Therefore, KC elements are consumable parts.
[0005] In one known technical solution, the KC component and the base are integrally molded. When replacing the KC component, the entire base must be replaced as well, resulting in a significant increase in maintenance costs.
[0006] In another known technical solution, the KC component is an independent part and is assembled and locked to the base by screws. However, this screw fixing method has the following disadvantages: (A) The assembly operation is cumbersome and time-consuming, and requires the use of additional tools (such as screwdrivers); (B) The screws are easy to loosen, resulting in unstable positioning of the KC component and affecting the overall assembly yield; (C) The metal screws increase the overall weight of the carrier, which is not conducive to handling and automated operation.
[0007] Therefore, how to provide an improved fixing component and a substrate carrier for using it, thereby simplifying the assembly process of KC components, improving the fixing stability of KC components and reducing maintenance costs, is one of the urgent issues to be solved in this technical field. Summary of the Invention
[0008] In view of this, the present invention provides a fixing component and a substrate carrier using the same. The fixing component includes a sleeve and a pin, the pin being used to wed into the sleeve to deform the sleeve and lock it with the positioning element and base of the substrate carrier. By using the fixing component, screws and additional tools are not required, simplifying the assembly process and improving the efficiency of semiconductor manufacturing.
[0009] One aspect of the present invention provides a fixing assembly suitable for a substrate carrier. The fixing assembly is used to fix a positioning element of the substrate carrier to a base of the substrate carrier. The fixing assembly includes a sleeve and a pin. The sleeve is inserted into a fixing hole of the positioning element and a through hole on the base. The pin is wedged into the sleeve to deform the sleeve and lock it with the positioning element and the base.
[0010] In one embodiment, the sleeve includes a head and a hollow column connected to the head. The head is larger in diameter than the hollow column. The hollow column is used to insert into a fixing hole and a through hole. When the hollow column is inserted into a positioning element, the head abuts against the positioning element.
[0011] In another embodiment, the pin includes a pin head and a pin post connected to the pin head. The pin head is used to be sleeved and fixed with the head, and the pin post is used to wed into the hollow cylinder to push the hollow cylinder from the inside out to deform it and to accommodate the pin post, thereby locking the sleeve with the positioning element and the base.
[0012] Another aspect of the present invention provides a substrate carrier, comprising: a housing, a base, a positioning element, and a fixing assembly. The housing has a bottom, the base is detachably assembled to the bottom, and the base has a through hole. The positioning element is disposed on the base and has a fixing hole at a portion of the through hole. The fixing assembly is used to fix the positioning element to the base, and the fixing assembly includes a sleeve and a pin. The sleeve is inserted into the fixing hole and the through hole, and the pin is wedged into the sleeve to deform the sleeve and lock it with the positioning element and the base.
[0013] In one embodiment, the sleeve includes a head and a hollow column connected to the head. The head is larger in diameter than the hollow column. The hollow column is used to insert into a fixing hole and a through hole. The pin includes a pin head and a pin post connected to the pin head. The pin head is used to be sleeved and fixed with the head. The pin post is used to wed into the hollow column and push the hollow column from the inside to the outside to deform it, and is sufficient to accommodate the pin post for locking with the positioning element and the base.
[0014] In another embodiment, the positioning element is a recessed piece for interacting with a positioning pin of an external machine to position the substrate carrier on the external machine.
[0015] In another embodiment, the base is provided with a first flange, and the bottom of the housing is provided with a second flange for engaging with the first flange to lock the base and the housing together.
[0016] In another embodiment, the first flange includes a first segment and a second segment that are separated from each other.
[0017] In another embodiment, the base has a latch arm, and the bottom of the housing has a protrusion for locking the latch arm.
[0018] In another embodiment, the buckle arm has a buckle hole, and the protrusion has an inclined surface. The buckle arm is used to slide on the inclined surface until the protrusion falls into the buckle hole, thereby locking the buckle arm.
[0019] The fixing component and substrate carrier using the same in this invention have a pin that wedges into a sleeve, causing the sleeve to deform and lock with the positioning element and base. This eliminates the need for screws and additional tools, simplifying assembly steps and improving assembly efficiency, ultimately enhancing the efficiency of semiconductor manufacturing processes. Another advantage of not using screws is that it avoids the generation of particles during screw tightening, contributing to the overall cleanliness of the substrate carrier. Simple Explanation of the Diagram
[0020] To make the above and other features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below. [Figure 1] shows a perspective view of a substrate carrier according to an embodiment of the present invention before assembly. [Figure 2] A three-dimensional view of the substrate carrier after assembly. [Fig. 3a] shows a perspective view of the sleeve and the pin. [Figure 3b] shows a three-dimensional view of the assembled sleeve and pin components. [Figure 4a] shows a schematic diagram of the base and positioning elements. [Figure 4b] shows a schematic diagram of the assembled components and sleeve of Figure 4a. [Figure 4c] shows a schematic diagram of the assembled components and pins of Figure 4b. [Figure 4d] shows a schematic diagram of the components in Figure 4c after assembly. [Figure 5] A schematic diagram of the shell and base of Figure 1. [Figure 6a] shows a schematic diagram before the base and the shell are connected. [Figure 6b] shows a schematic diagram of the base and the housing being connected. [Figure 6c] shows a schematic diagram of the base after it has moved a certain distance relative to the shell. [Figure 6d] shows a schematic diagram of the base after it has moved a certain distance relative to the shell. [Figure 6e] shows a schematic diagram of the interlocking of the base and the housing. Implementation
[0021] This invention patent application claims international priority to U.S. Patent Application No. 63 / 727,043, filed on December 2, 2024, entitled "FIXING ASSEMBLY AND SUBSTRATE CARRIER USING THE SAME," the contents of which are incorporated herein by reference and form part of the specification.
[0022] The technical content of the present invention will be described in detail below, with reference to the accompanying drawings for further explanation. The embodiments described are exemplary embodiments of the present invention and are not intended to limit the invention; in fact, the present invention can be implemented in many different ways, and its scope should not be construed as limited thereto. The description of these embodiments is intended to make the technical features of the present invention clearer and more complete, and its content fully discloses the technical features of the present invention so that those skilled in the art can implement it accordingly. In the detailed description of the embodiments, the same reference numerals denote the same or similar elements. The singular forms "a," "an," and "the" used herein are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when "comprising," "including," and "having" are used herein, their scope does not exclude the presence or addition of one or more other features, steps, elements, components, and / or groups.
[0023] Please refer to Figures 1 through 3b simultaneously. Figure 1 shows a perspective view of the substrate carrier according to an embodiment of the present invention before assembly; Figure 2 shows a perspective view of the substrate carrier after assembly; Figure 3a shows a perspective view of the sleeve and the pin; and Figure 3b shows a perspective view of the sleeve and the pin after assembly. The substrate carrier 100 of this embodiment includes a housing 170, a base 110, a positioning element 130, and a fixing assembly 140. The housing 170 has a bottom 179, and the base 110 is detachably assembled to the bottom 179. The base 110 has a through hole 110a, and the positioning element 130 is disposed on the base 110. The positioning element 130 has a fixing hole 130a communicating with a portion of the through hole 110a. Since the number of fixing holes 130a is one or more, and the number of connecting holes 110a is also one or more, regardless of whether the number of both is the same or different, as long as the fixing hole 130a corresponds to at least a portion of the connecting hole 110a, it falls within the scope of this invention. The fixing assembly 140 is used to fix the positioning element 130 to the base 110, and the fixing assembly 140 includes a sleeve 152 and a pin 151. The sleeve 152 is inserted into the fixing hole 130a and the connecting hole 110a, and the pin 151 is wedged into the sleeve 152, so that the sleeve 152 deforms and locks with the positioning element 130 and the base 110.
[0024] In this embodiment, the sleeve 152 includes a head 154 and a hollow column 156 connected to the head 154. The head 154 is larger in diameter than the hollow column 156. The hollow column 156 is used to insert into the fixing hole 130a and the through hole 110a. When the hollow column 156 is inserted into a positioning position, the head 154 abuts against the positioning element 130. In addition, the pin 151 in this embodiment includes a pin head 153 and a pin post 155 connected to the pin head 153. The pin head 153 is used to be sleeved and fixed with the head 154. The pin post 155 is used to wed into the hollow column 156 to push the hollow column 156 from the inside out to deform it and to accommodate the pin post 155, thereby locking the sleeve 152 with the positioning element 130 and the base 110. In this manner, the fixing component 140 of this embodiment is configured as a press-locking mechanism 150.
[0025] Furthermore, the pin 151 further includes a hook 157, and the sleeve 152 further includes a locking hole 158. The pin 151 is inserted into the sleeve 152, for example, along an axial direction A. When the pin 151 is wedged into position, the hook 157 engages with the locking hole 158, thereby securing the pin head 153 to the head 154. At this time, the pin 155, wedged into the hollow cylinder 156, is radially pushed from the inside and outside of the hollow cylinder 156, causing the hollow cylinder 156 to expand outward to engage with the through hole 110a and the fixing hole 130a.
[0026] The following details the locking mechanism between the sleeve 152, the positioning element 130, and the base 110. Please refer to Figures 4a to 4d. Figure 4a shows a schematic diagram of the base 110 and the positioning element 130. Figure 4b shows a schematic diagram of the assembled components of Figure 4a with the sleeve. Figure 4c shows a schematic diagram of the assembled components of Figure 4b with the pin. Figure 4d shows a schematic diagram of the assembled components of Figure 4c.
[0027] During assembly, as shown in Figure 4a, the base 110 has a receiving space 110b corresponding to the positioning element 130, which is used to accommodate the positioning element 130. During assembly, the positioning element 130 is first aligned with the receiving space 110b and then moved downward into the receiving space 110b.
[0028] As shown in Figure 4b, after the positioning element 130 is inserted into the receiving space 110b, the through hole 110a on the base 110 aligns with the fixing hole 130a of the positioning element 130, allowing the hollow column 156 of the sleeve 152 to pass through. When the sleeve 152 passes downward through the fixing hole 130a and the through hole 110a and is inserted into a positioning position, since the head 154 of the sleeve 152 is larger in diameter than the hollow column 156, the head 154 will abut against the surface of the positioning element 130.
[0029] As shown in Figure 4c, when the sleeve 152 is inserted into the positioning position, the base 110, the positioning element 130, and the head 154 of the sleeve 152 are stacked sequentially. Next, the pin 151 is inserted into the sleeve 152. When the pin 151 is inserted into the positioning position, the pin head 153 and the head 154 are engaged and fixed. In this embodiment, for example, the pin head 153 and the head 154 are engaged and fixed by the hook 157 of the pin 151 engaging with the locking hole 158 of the sleeve 152.
[0030] As shown in Figure 4d, after the pin 151 is wedged into the sleeve 152, the pin post 155 wedged into the inner side of the hollow column 156 and pushed the hollow column 156 from the inside out, causing it to deform and sufficiently accommodate the pin post 155. The technical solution used in this embodiment involves expanding the hollow column 156 outwards to tightly abut against the fixing hole 130a and the through hole 110a, thereby locking it with the positioning element 130 and the base 110. According to the aforementioned locking method, the fixing component 140 is configured as a press-lock mechanism 150, achieving a convenient press-lock effect.
[0031] In this embodiment, the positioning element 130 is, for example, a recessed part. After the positioning element 130 and the base 110 are fixed, the positioning element 130 can interact with a positioning pin of an external machine to position the substrate carrier 100 on the external machine. In one example, when the substrate carrier 100 is loaded with a wafer, the external machine can be a wafer loading and unloading device with an opening / closing mechanism. The present invention does not impose many limitations on the technical solutions of the external machine and its positioning pin. Furthermore, the fixing component 140 of the present invention and the substrate carrier 100 using it are not limited to wafer loading and unloading devices; other external devices that need to be positioned relative to the positioning element 130 of the substrate carrier 100 can also be applied to the present invention.
[0032] The fixing component and substrate carrier using the present invention employ a pin-shaped insert into a sleeve component, allowing the fixing component to conveniently, quickly, and tightly securely fix the positioning element to the base without the need for screws or additional tools. This simplifies assembly steps, improves assembly efficiency, and overall enhances the efficiency of semiconductor manufacturing processes. Another advantage of not using screws is that it avoids the generation of particles during screw tightening, contributing to the overall cleanliness of the substrate carrier.
[0033] Please continue referring to Figure 1. As mentioned earlier, the substrate carrier 100 in this embodiment includes a housing 170. Next, we will explain the technical solution for locking the base 110 and the housing 170 in this embodiment of the invention. Please refer to Figure 5 and Figures 6a to 6e. Figure 5 shows a schematic diagram of the housing and base in Figure 1. Figure 6a shows a schematic diagram before the base and housing are connected. Figure 6b shows a schematic diagram when the base and housing are connected. Figure 6c shows a schematic diagram after the base has moved a certain distance relative to the housing. Figure 6d shows a schematic diagram after the base has moved another certain distance relative to the housing. Figure 6e shows a schematic diagram when the base and housing are locked together.
[0034] Referring simultaneously to Figures 5 and 6a, in this embodiment, the base 110 has a first flange 111, and the bottom 179 of the housing 170 has a second flange 171 for engaging with the first flange 111 to lock the base 110 and the housing 170 together. Furthermore, the base 110 has a latching arm 117, and the bottom 179 of the housing 170 has a protrusion 177 for locking the latching arm 117. Additionally, the latching arm 117 has a latching hole 117a, and the protrusion 177 has an inclined surface 177a. The latching arm 117 slides on the inclined surface 177a until the protrusion 177 falls into the latching hole 117a, thereby locking the latching arm 117.
[0035] Referring to Figure 6a, when locking the base 110, the base 110 needs to be roughly aligned with the housing 170, so that the first flange 111 is adjacent to the position of the second flange 117. Then, the base 110 is moved closer to the housing 170 until at least one of the first flange 111 and the second flange 117 contacts the surface of the housing 170 or the base 110. In this embodiment, the second flange 171 contacts the surface of the base 110, as shown in Figure 6b.
[0036] As shown in Figure 6b, after the base 110 contacts the housing 170, the base 110 needs to move along the locking direction L on the surface of the housing 170.
[0037] As shown in Figure 6c, after the base 110 moves a certain distance along the locking direction L, the latch arm 117 contacts the inclined surface 177a of the protrusion 177. Then the base 110 continues to move.
[0038] As shown in Figure 6d, the base 110 continues to move along the locking direction L on the surface of the housing 170. At this time, the latch arm 117 will slide on the inclined plane 177a and be lifted by the protrusion 177. Then the base 110 continues to move.
[0039] As shown in Figure 6e, the base 110 continues to move along the locking direction L on the surface of the housing 170 until the protrusion 177 falls into the locking hole 117a of the locking arm 117. At this time, the locking arm 117 locks the protrusion 177, and the second flange 171 is also inserted into the first flange 111 to engage with it. In this way, the base 110 and the housing 170 can be conveniently, quickly, and tightly locked together.
[0040] Conversely, if you wish to remove the base 110, simply move the latch arm 117 to disengage the protrusion 177 from the latch hole 117a, and move the base 110 in the opposite direction of the aforementioned latch direction L, and you can easily remove the base 110 from the housing 170.
[0041] In addition, in this embodiment of the invention, the first flange 111 on the base 110 includes a first segment 111(1) and a second segment 111(2) that are separated from each other, and are located on opposite sides of the latch arm 117. As shown in FIG6e, the first flange 111 on the left side of the figure is the first segment 111(1), and the first flange 111 on the right side of the figure is the second segment 111(2). The multi-segment configuration of the first flange 111 can improve the stability of the interlocking between the base 110 and the housing 170. Correspondingly, the housing 170 also includes a second flange 171 with two segments, so as to engage with the first flange 111 of the first segment 111(1) and the second segment 111(2) respectively. However, this embodiment of the invention is not limited thereto. The first flange 111 and the second flange 171 may each include three or more segments, so as to engage with each other and provide a more stable engagement effect. The shape and structure of the first flange 111 and the second flange 171 are not limited to those shown in Figures 5, 6a to 6e of this invention. Other technical solutions that can achieve mutual engagement and docking in terms of mechanism design can be applied to this invention.
[0042] In another aspect, the present invention provides a fixing component. In one embodiment, the fixing component is adapted to a substrate carrier for fixing a positioning element of the substrate carrier to a base of the substrate carrier. The fixing component includes a sleeve and a pin. The sleeve is inserted into a fixing hole of the positioning element and a through hole on the base. The pin is wedged into the sleeve to deform the sleeve and lock it with the positioning element and the base. The fixing component described in this embodiment is technically the same as the fixing component 140 in the aforementioned substrate carrier 100 (as shown in Figures 1 to 6e), and will not be repeated here.
[0043] According to the fixing component and substrate carrier using the same embodiment of the present invention, the pin in the fixing component wedged into the sleeve component, causing the sleeve component to deform and lock with the positioning element and the base. Its advantages are that the positioning element can be set and fixed on the base without the need for screws or additional tools, simplifying assembly steps, improving assembly efficiency, and overall improving the efficiency of semiconductor manufacturing processes. Furthermore, another advantage of not using screws is that it avoids the generation of particles during screw tightening, further contributing to the overall cleanliness of the substrate carrier.
[0044] 100: Substrate carrier 110: Base 110a: Through hole 110b: Accommodation space 111: First flange 111(1): First segment 111(2): Second section 117: Arm Lock 117a: Buckle hole 130: Positioning element 130a: Fixing hole 140: Fixed component 150: Press-lock mechanism 151: Pin Part 152: Sleeve component 153: Pin Head 154: Head 155: Pin post 156: Hollow Column 157: Hook 158: Card slot 170: Casing 171: Second flange 177: Convex column 177a: Bevel 179: Bottom A: Axial L: Locking direction r: radial
Claims
1. A fixing assembly adapted for a substrate carrier, the fixing assembly being used to fix a positioning element of the substrate carrier to a base of the substrate carrier, the fixing assembly comprising: A sleeve for insertion into one of the fixing holes of the positioning element and one of the through holes on the base, the sleeve including a snap-fit hole; And a pin for wedging into the sleeve so that the sleeve deforms and expands outward to tightly abut against the fixing hole and the through hole, thereby locking with the positioning element and the base. The pin includes a hook that engages with the locking hole when the pin is wedged into the positioning position.
2. The fixing assembly as claimed in claim 1, wherein the sleeve includes a head and a hollow column connected to the head, the head being larger in diameter than the hollow column, the hollow column being inserted into the fixing hole and the through hole, and the head abutting against the positioning element when the hollow column is inserted into a positioning position.
3. The fixing assembly as claimed in claim 2, wherein the pin includes a pin head and a pin post connected to the pin head, the pin head being used to engage and fix with the head, and the pin post being used to wed into the hollow cylinder to push the hollow cylinder from the inside out to deform it, and to accommodate the pin post, thereby locking the sleeve with the positioning element and the base.
4. A substrate carrier, comprising: A housing having a bottom; a base detachably assembled to the bottom, the base having a through hole; a positioning element for being disposed on the base, the positioning element having a fixing hole communicating with a portion of the through hole; and a fixing assembly for fixing the positioning element to the base, the fixing assembly including a sleeve and a pin, the sleeve being inserted into the fixing hole and the through hole, the pin being wedged into the sleeve to cause the sleeve to deform and expand outward to tightly abut against the fixing hole and the through hole, thereby locking with the positioning element and the base, the sleeve including a locking hole, the pin including a locking hook, the locking hook engaging with the locking hole when the pin is wedged into the positioning position.
5. The substrate carrier as claimed in claim 4, wherein the sleeve includes a head and a hollow column connected to the head, the head being larger in diameter than the hollow column, the hollow column being inserted into the fixing hole and the through hole, the pin including a pin head and a pin post connected to the pin head, the pin head being sleeved and fixed to the head, the pin post being wedged into the hollow column and pushed from the inside out to deform the hollow column, and being sufficient to accommodate the pin post for locking with the positioning element and the base.
6. The substrate carrier as claimed in claim 4, wherein the positioning element is a recess for interacting with a positioning pin of an external machine to position the substrate carrier on the external machine.
7. The substrate carrier as described in claim 4, wherein the base is provided with a first flange and the bottom of the housing is provided with a second flange for engaging with the first flange to lock the base and the housing together.
8. The substrate carrier as claimed in claim 7, wherein the first flange includes a first segment and a second segment that are separated from each other.
9. The substrate carrier as claimed in claim 4, wherein the base has a latching arm and the bottom of the housing has a protrusion for locking the latching arm.
10. The substrate carrier as claimed in claim 9, wherein the latch arm has a latching hole, the protrusion has an inclined surface, and the latch arm is for sliding on the inclined surface until the protrusion falls into the latching hole to lock the latch arm.
Citation Information
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