Electronic component heat-dissipation module

Abstract

An electronic component heat dissipation module includes a circuit board, at least one electronic component, a heat dissipation insulating sleeve, a metal housing, and a clamping member. The at least one electronic component is electrically connected to the circuit board. The heat dissipation insulating sleeve is used to house the electronic component. The metal housing has an inner wall. The clamping member has a receiving portion for supporting the heat dissipation insulating sleeve and the electronic component, and a hook portion for clamping the inner wall.

Claims

1. An electronic component heat dissipation module, comprising: a circuit board; at least one electronic component electrically connected to the circuit board; a heat dissipation insulating sleeve for housing the electronic component; a metal housing having an inner wall and an outer wall; and a clamping member having a receiving portion for carrying the heat dissipation insulating sleeve and the electronic component, the clamping member having a hook portion for clamping the inner wall, wherein the receiving portion of the clamping member, the heat dissipation insulating sleeve and the electronic component are located in a receiving space defined between the inner wall and the outer wall, the clamping member including a flat plate portion connected between the receiving portion and the hook portion, and the flat plate portion contacting the heat dissipation insulating sleeve and the inner wall.

2. The electronic component heat dissipation module as described in claim 1, wherein the clamping member has an S-shaped cross-section.

3. The electronic component heat dissipation module as claimed in claim 1, wherein the electrical connection pin of the at least one electronic component is perpendicular to the surface of the circuit board.

4. The electronic component heat dissipation module as described in claim 1, wherein the length direction of the at least one electronic component is perpendicular to the surface of the circuit board.

5. The electronic component heat dissipation module as described in claim 1, wherein the plate portion is located between the heat dissipation insulating sleeve and the inner wall.

6. The electronic component heat dissipation module as described in claim 1, wherein the receiving portion and the hook portion are respectively located on two opposite sides of the flat plate portion.

7. The electronic component heat dissipation module as described in claim 1, wherein the thickness of the inner wall is greater than the thickness of the flat plate portion.

8. The electronic component heat dissipation module as described in claim 1, wherein the receiving portion, the hook portion, and the plate portion are continuous metal plates of equal thickness.

9. The electronic component heat dissipation module as claimed in claim 1, wherein the clamping member further includes two horizontal limiting members located on the same side of the plate portion as the receiving portion.

10. The electronic component heat dissipation module as claimed in claim 9, wherein the clamping member further includes a vertical limiting member located on the same side of the receiving portion as the flat plate portion, and the vertical limiting member is located between the two horizontal limiting members.

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