Probe system for double-sided inspection and its operation method

Abstract

A probe system for double-sided inspection includes a stage, upper and lower inspection devices, and a support device including a support member. The stage has a through hole for placing a substrate including a device under test on the stage, such that the edge of the substrate is supported by the stage and the center of the substrate corresponds to the through hole. The upper and lower inspection devices are respectively disposed above and below the through hole of the stage for inspecting the device under test on the top and bottom sides of the substrate. The system includes a probe device and an optical inspection device. The support device and the probe device are disposed on opposite sides of the stage. When the probe of the probe device contacts one of the top or bottom sides of the substrate, the support member of the support device contacts the other side and is disposed adjacent to the probe through the substrate to resist the force applied by the probe and thus prevent the substrate from deforming.

Description

[Technical Field]

[0001] This invention relates to a probe system for inspecting electronic components such as semiconductor wafers, and more particularly to a probe system for double-sided inspection, its operation method, and a tested apparatus. [Previous Technology]

[0002] Probe systems can be used to probe and / or test the operation of a device under test (DUT). In the electronics industry, probe systems have traditionally taken the form of electrical probe systems, which provide probe current to the DUT and / or receive corresponding result current from the DUT. Recently, optical probe systems have been developed for probing optical DUTs that include optical elements. Traditionally, both electrical and optical probe systems (e.g., optical fibers) have transmitted test signals to and / or received result signals from the DUT from or above the substrate surface of the substrate containing the DUT. For example, a probe system can utilize silicon photonics coupling technology, in which one or more optical fibers are interfaced with the DUT via an optical signal. In this example, each optical fiber is not in contact with the device under test (DUT), but is aligned with an optical coupler (e.g., a grating coupler) on the DUT to transmit and receive the optical signals.

[0003] Referring to Figure 1, a conventional probe system 10 for double-sided inspection mainly includes a stage 11, a probe device 12, and an optical inspection device 13. The stage 11 has a through hole 111, so that when a wafer 14 is placed on the stage 11, the stage 11 only supports the edge of the wafer 14. In this way, the top side 151 and bottom side 152 of the wafer 15 contained in the wafer 14 can be inspected by the probe device 12 and the optical inspection device 13, respectively. In detail, this inspection process is carried out when the wafer 14 is made and has a large number of interconnected wafers 15, that is, at this time the wafer 14 has not yet been cut into a large number of separate wafers 15. For the sake of simplifying the diagram and facilitating the explanation, Figure 1 only schematically shows a wafer 15, and this wafer 15 is drawn as large. In reality, the wafer 14 contains a large number of wafers 15 and their size is very small. The top side 151 of the wafer 15 includes a plurality of conductive contacts (not shown in the figure). The probe device 12 is disposed above the support stage 11 and touches the conductive contacts of the wafer 15 with its probe 121 to perform electrical testing on the wafer 15. The bottom side 152 of the wafer 15 includes a plurality of light-receiving and / or light-emitting portions (not shown in the figure). The optical inspection device 13 is disposed below the support stage 11 and illuminates and / or collects light from the light-receiving and / or light-emitting portions of the wafer 15 to perform optical inspection on the wafer 15. Alternatively, the conductive contacts of the wafer 15 may also be located on the bottom side 152, and the light-receiving and / or light-emitting portions may be located on the top side 151. In this case, the probe device 12 and the optical inspection device 13 may be disposed below and above the support stage 11, respectively.

[0004] Taking the case where the probe device 12 is positioned above the support stage 11 as an example, as shown in Figure 1, since the support stage 11 only supports the edge of the wafer 14, when the top side 151 of the wafer 15 is touched by the probe 121 of the probe device 12, the wafer 14 will bend slightly downwards, as shown by the imaginary line in Figure 1. Conversely, if the bottom side 152 of the wafer 15 is touched by the probe 121 of the probe device 12, the wafer 14 will bend slightly upwards. Since this configuration benefits from the precise alignment between the optical fiber (not shown) of the optical inspection device 13 and the optical coupler (not shown) of the device under test (DUT) to enhance power transmission between the optical fiber and the DUT, the aforementioned deformation of the wafer 14 may adversely affect the performance of the wafer 15 or the accuracy of its inspection results. [Summary of the Invention]

[0005] In view of the above deficiencies, the main objective of the present invention is to provide a probe system for double-sided detection, which can effectively avoid deformation of the substrate on which the device under test is located when the probe device touches the device under test, thereby avoiding the problem of poor accuracy of the detection results caused by the inability to accurately align the optical detection device and the device under test due to substrate deformation.

[0006] To achieve the above objectives, the probe system for double-sided inspection provided by the present invention is used to inspect one or more devices under test on a substrate (e.g., a wafer). The probe system includes a stage, an upper inspection device, a lower inspection device, and a support device including a support member. The stage is configured to support the substrate and includes a through hole for the substrate to be placed on the stage, such that the substrate defines a central portion corresponding to the through hole and an edge portion located around the central portion and supported by the stage. The upper inspection device is disposed above the through hole of the stage and is used to inspect the device under test on a top side of the substrate. The lower inspection device is disposed below the through hole of the stage and is used to inspect the device under test on a bottom side of the substrate. The bottom side of the substrate is opposite to the top side and faces the stage. One of the upper and lower detection devices is a probe device, which includes a probe. The other of the upper and lower detection devices is an optical detection device, which includes a fiber optic transceiver. The optical detection device and the support device are movable relative to the carrier stage. One of the support device and the probe device is disposed above the through hole of the carrier stage, and the other of the support device and the probe device is disposed below the through hole of the carrier stage. When the probe device detects the device under test, the probe contacts one of the top and bottom sides of the substrate, and the support member of the support device contacts the other of the top and bottom sides of the substrate and is disposed adjacent to the probe through the substrate. The fiber optic transceiver includes an optical transceiver surface. When the optical detection device detects the device under test, the support member is located outside the projection range of the optical transceiver surface onto the substrate.

[0007] Accordingly, the aforementioned probe system can be configured such that the probe device is above the support stage (i.e., the upper detection device is the probe device), the support device is below the support stage, and there is also an optical detection device below the support stage (i.e., the lower detection device is the optical detection device). In this way, the upper and lower detection devices can simultaneously detect the device under test to achieve the function of double-sided detection. When the probe of the probe device applies a downward force on the top side of the substrate, the support member of the support device can contact the bottom side of the substrate near the stress point of the substrate to resist the force applied by the probe and thus effectively prevent the substrate from deforming. Alternatively, the aforementioned probe system can be configured such that the probe device is below the support stage (i.e., the lower detection device is the probe device), the support device is above the support stage, and an optical detection device is also above the support stage (i.e., the upper detection device is the optical detection device). In this way, the upper and lower detection devices can simultaneously detect the device under test, achieving the function of double-sided detection. When the probe of the probe device applies an upward force to the bottom side of the substrate, the support member of the support device can contact the top side of the substrate near the stress point, thereby resisting the force applied by the probe and effectively preventing substrate deformation. Since the support device and the optical detection device can move relative to the support stage, they can each be precisely positioned in their required positions. The support device can move relative to the support stage so that the support member is close to the stress point of the substrate, that is, the support member is arranged adjacent to the probe through the substrate, thereby achieving a good support effect and effectively preventing substrate deformation during the contact of the probe device. In addition, the optical inspection device uses a fiber optic transceiver, which can be precisely aligned with the device under test to achieve good optical inspection results. The aforementioned function of avoiding substrate deformation can also effectively avoid the problem of poor inspection results caused by the inability to accurately align the optical inspection device and the device under test due to substrate deformation.

[0008] In one embodiment of the present invention, the lower detection device is a probe device, used to perform electrical detection on the device under test by contacting the bottom side of the substrate with the probe; the support device is disposed above the through hole of the support stage, used to contact the top side of the substrate with the support member; the upper detection device is an optical detection device, used to perform optical detection on the top side of the substrate.

[0009] Accordingly, the aforementioned probe system is suitable for test devices that require electrical testing on the bottom side and optical testing on the top side, and can use the support member of the support device to resist the upward force applied to the substrate by the probe on the top side of the substrate during the testing process, thereby effectively avoiding substrate deformation.

[0010] In another embodiment of the present invention, the upper detection device is a probe device for electrical detection of the device under test by contacting the top side of the substrate with the probe; the support device is disposed below the through hole of the support stage for contacting the bottom side of the substrate with the support member; the lower detection device is an optical detection device for optical detection of the device under test on the bottom side of the substrate.

[0011] Accordingly, the aforementioned probe system is suitable for test devices that require electrical testing on the top side and optical testing on the bottom side, and can use the support member of the support device to resist the downward force applied to the substrate by the probe on the bottom side of the substrate during the testing process, thereby effectively avoiding substrate deformation.

[0012] Preferably, the support device further includes a heater, which is configured to control the temperature of the support member when the upper detection device and the lower detection device detect the device under test, so that the support member heats the device under test by means of heat conduction when it contacts the substrate.

[0013] Accordingly, the aforementioned probe system is suitable for test devices that need to be tested under high temperature conditions. It can heat the test device to the temperature required for testing. Moreover, the support member can be in contact with the substrate and be close to the test device being tested. This not only achieves a good support effect, but also efficiently heats and maintains the temperature of the test device being tested.

[0014] Preferably, the aforementioned probe system further includes a non-contact heating device, which is configured to heat the device under test by means of thermal radiation when the upper detection device and the lower detection device test the device under test.

[0015] Accordingly, the aforementioned probe system can heat the device under test simultaneously with the support device, thereby achieving higher heating efficiency. Alternatively, the aforementioned probe system can also use only a non-contact heating device to heat the device under test, that is, the support device may not have a heater, thus making the structure of the support device simpler.

[0016] Preferably, when the probe device tests the device under test, the distance between the position of the support member contacting the substrate and the position of the probe contacting the substrate in a horizontal axis is less than the length of the device under test in the horizontal axis, so that the support member is close to the probe to achieve a good support effect, thereby effectively preventing the substrate from deforming when touched by the probe.

[0017] Preferably, the optical detection device includes a distance sensor for measuring the distance between the optical detection device and the substrate to generate a distance value, and then determining whether the support member of the support device is in contact with the substrate by the change of the distance value.

[0018] In this way, the distance sensor of the optical inspection device can not only ensure that the distance between the optical inspection device and the substrate is suitable for optical inspection, but also determine whether the support of the support device is in contact with the substrate by measuring the change in distance, thereby ensuring that the support can effectively resist the force of the probe to avoid substrate deformation.

[0019] The present invention further provides a method for operating a probe system as described above for determining whether a support member of a support device is in contact with a substrate, the steps of which include:

[0020] The substrate is placed on the support platform;

[0021] The optical inspection device is moved relative to the stage so that the optical inspection device is adjacent to the test device on the substrate;

[0022] The distance between the optical detection device and the substrate is measured using a distance sensor of the optical detection device to generate the distance value. The support device is moved relative to the support stage to make the support member contact the substrate. When the distance value measured by the distance sensor of the optical detection device changes, it is determined that the support member of the support device is in contact with the substrate; and

[0023] When the support member of the support device is in contact with the substrate, the probe of the probe device is used to contact the device under test to perform electrical testing on the device under test, and the optical testing device is used to perform optical testing on the device under test.

[0024] In this way, the distance sensor of the optical inspection device can not only ensure that the distance between the optical inspection device and the substrate is suitable for optical inspection, but also determine whether the support member of the support device is in contact with the substrate by measuring the change in distance. This ensures that the device under test is inspected while the support member is in contact with the substrate, so that the support member can resist the force of the probe during the inspection process, thereby effectively avoiding substrate deformation.

[0025] The present invention further provides a method for operating a probe system as described above, which utilizes a support member of a support device to resist probe force, comprising: placing a substrate on a support stage, and with the support member of the support device in contact with the substrate, using an upper detection device to detect a device under test on the top side of the substrate, and using a lower detection device to detect the device under test on the bottom side of the substrate. The configuration of the upper detection device, lower detection device, and support device is one of the following: the lower detection device is a probe device that performs electrical detection on the device under test by contacting the bottom side of the substrate with the probe; the support device is disposed above a through hole in the support stage and contacts the top side of the substrate with the support member; the upper detection device is an optical detection device that performs optical detection on the top side of the substrate; and the upper detection device is a probe device that performs electrical detection on the device under test by contacting the top side of the substrate with the probe; the support device is disposed below a through hole in the support stage and contacts the bottom side of the substrate with the support member; the lower detection device is an optical detection device that performs optical detection on the bottom side of the substrate.

[0026] Accordingly, the aforementioned operating method is applicable to a test device that requires electrical testing on the bottom side and optical testing on the top side, or a test device that requires electrical testing on the top side and optical testing on the bottom side, and can use the support member of the support device to resist the force applied to the substrate by the probe during the testing process, thereby effectively avoiding substrate deformation.

[0027] Preferably, in the aforementioned operation method, the optical transceiver of the optical inspection device includes an optical transceiver surface; the optical inspection device is configured to perform optical inspection on the device under test in one of the following ways: the optical transceiver surface of the optical transceiver faces a top surface on the top side of the substrate to perform optical inspection on the device under test; the optical transceiver extends into a groove on the top side of the substrate, and the optical transceiver surface faces an inner wall of the groove to perform optical inspection on the device under test; the optical transceiver surface of the optical transceiver faces a bottom surface on the bottom side of the substrate to perform optical inspection on the device under test; and the optical transceiver extends into a groove on the bottom side of the substrate, and the optical transceiver surface faces an inner wall of the groove to perform optical inspection on the device under test.

[0028] Accordingly, the aforementioned operating method employs a fiber optic transceiver, which can effectively emit and receive light from the device under test (DUT), thereby achieving excellent optical detection results. Furthermore, when optical detection is required on the top side of the substrate, the light-receiving and light-emitting parts of the DUT can be located on the top surface of the substrate, and the optical transceiver surface of the fiber optic transceiver can be configured to face the top surface of the substrate for optical detection of the DUT; alternatively, the light-receiving and light-emitting parts of the DUT can be located on the inner wall of a groove on the top side of the substrate, and the optical transceiver surface of the fiber optic transceiver can be configured to face the inner wall of the groove for optical detection of the DUT. Similarly, when optical detection is required on the bottom side of the substrate, the light-receiving and light-emitting parts of the DUT can be located on the bottom surface of the substrate, and the optical transceiver surface of the fiber optic transceiver can be configured to face the bottom surface of the substrate for optical detection of the DUT; alternatively, the light-receiving and light-emitting parts of the DUT can be located on the inner wall of a groove on the bottom side of the substrate, and the optical transceiver surface of the fiber optic transceiver can be configured to face the inner wall of the groove for optical detection of the DUT.

[0029] To achieve the above objectives, the present invention further provides another probe system for double-sided inspection, used to inspect one or more devices under test on a substrate; the probe system includes a support stage, an upper inspection device, and a lower inspection device. The support stage includes a grid-shaped support portion, the support portion including an upper surface, a lower surface, and a plurality of through holes penetrating the upper and lower surfaces, for the substrate to be disposed on the upper surface of the support portion, such that a local position of the substrate corresponds to each through hole. The upper inspection device is disposed above the support portion of the support stage, and the upper inspection device is a probe device, the probe device including a probe, for inspecting the device under test by contacting a top side of the substrate with the probe. The lower inspection device is disposed below the support portion of the support stage, the lower inspection device is an optical inspection device, the optical inspection device including a fiber optic transceiver, for inspecting the device under test through the through holes of the support portion on a bottom side of the substrate.

[0030] Accordingly, the support portion of the bearing stage is supported on the bottom side of the substrate, and the support portion is grid-shaped. This not only effectively supports the substrate but also has perforations that allow partial exposure of the bottom side of the substrate, enabling the lower detection device to inspect the device under test from the bottom side of the substrate. In other words, the upper and lower detection devices can simultaneously inspect the device under test, achieving a double-sided inspection function. Furthermore, when the probe of the probe device applies a downward force to the top side of the substrate, the support portion supported on the bottom side of the substrate resists the force applied by the probe, thereby effectively preventing substrate deformation. In addition, the optical inspection device uses a fiber optic transceiver, which can accurately align with the device under test to achieve good optical inspection results. The aforementioned function of preventing substrate deformation effectively avoids the problem of inaccurate inspection results caused by inaccurate alignment between the optical inspection device and the device under test due to substrate deformation.

[0031] Preferably, the support platform further includes a heater, so that the support portion heats the substrate by means of heat conduction when it contacts the substrate.

[0032] Accordingly, the aforementioned probe system is suitable for testing devices that need to be tested under high temperature conditions. It can heat the testing device to the temperature required for testing. Moreover, the support part of the support stage is in contact with the bottom side of the substrate, which not only achieves a good support effect, but also efficiently heats the testing device and maintains its temperature.

[0033] More preferably, the heater is located on the support.

[0034] In this way, the support part of the bearing stage is in contact with the bottom side of the substrate, and the heater can be placed on the support part to heat the device under test more efficiently and maintain its temperature.

[0035] The present invention further provides a method for operating a probe system as described above, which utilizes the support portion of a support platform to resist the force applied by a probe, comprising: placing a substrate on the upper surface of the support portion of the support platform, and using an upper detection device to detect the device under test on the top side of the substrate, and using a lower detection device to detect the device under test on the bottom side of the substrate. The upper detection device is a probe device that performs electrical detection on the device under test by contacting the top side of the substrate with a probe, and the lower detection device is an optical detection device that performs optical detection on the device under test by having an optical fiber transceiver facing the bottom side of the substrate.

[0036] Accordingly, the aforementioned operating method is applicable to a test device that requires electrical testing on the top side and optical testing on the bottom side, and during the testing process, the support portion of the support platform on the bottom side of the substrate can resist the downward force applied by the probe to the top side of the substrate, thereby effectively preventing substrate deformation.

[0037] Preferably, in the aforementioned operation method, the optical transceiver of the optical inspection device includes an optical transceiver surface; the optical inspection device is configured to perform optical inspection on the device under test in one of the following ways: the optical transceiver surface of the optical transceiver faces a bottom surface of the substrate to perform optical inspection on the device under test; and the optical transceiver extends into a groove on the bottom side of the substrate, and the optical transceiver surface faces an inner wall of the groove to perform optical inspection on the device under test.

[0038] Accordingly, the aforementioned operating method employs a fiber optic transceiver, which can effectively emit and receive light from the device under test, thereby achieving good optical detection results. Moreover, the light-receiving and light-emitting parts of the device under test can be located on the bottom surface of the substrate, and the optical transceiver surface of the fiber optic transceiver can be configured to face the bottom surface of the substrate for optical detection of the device under test; or, the light-receiving and light-emitting parts of the device under test can be located on the inner wall of a groove on the bottom side of the substrate, and the optical transceiver surface of the fiber optic transceiver can be configured to face the inner wall of the groove for optical detection of the device under test.

[0039] The present invention further provides a tested device, which is tested by a test procedure, said test procedure being performed using any of the aforementioned operating methods of a probe system for double-sided detection.

[0040] In this way, the aforementioned probe system operation method can effectively avoid substrate deformation, so that the performance of the tested device and / or the accuracy of the test results will not be adversely affected by substrate deformation.

[0041] The detailed structure, features, assembly, or usage of the probe system for double-sided detection provided by the present invention, its operation method, and the tested device will be described in the following detailed description of the embodiments. However, those skilled in the art should understand that such detailed descriptions and the specific embodiments listed for implementing the present invention are merely illustrative and not intended to limit the scope of the patent application.

Implementation Method

[0043] The applicant first clarifies that in the embodiments and drawings described below, the same reference numerals denote the same or similar elements or their structural features. It should be noted that the elements and structures in the drawings are for illustrative purposes and are not drawn according to actual scale and quantity, and features of different embodiments can be used interchangeably if feasible in practice. Secondly, when it is said that an element is disposed on another element, it means that the aforementioned element is directly disposed on the other element, or the aforementioned element is indirectly disposed on the other element, that is, one or more other elements are disposed between the two elements. When it is said that an element is "directly" disposed on another element, it means that no other elements are disposed between the two elements.

[0044] Please refer to Figure 2 first. The probe system 21 for double-sided detection provided in a first preferred embodiment of the present invention mainly includes a support stage 30, a probe device 40, an optical detection device 50, and a support device 60. In this embodiment, the probe device 40 is a lower detection device, and the optical detection device 50 is an upper detection device.

[0045] The probe system of the present invention is used to detect one or more test devices 71 on a substrate 70 (e.g., a wafer). For the sake of simplicity and ease of explanation, only one test device 71 is schematically shown in the figures, and this test device 71 is drawn as large. In reality, the substrate 70 contains a large number of test devices 71, which are small in size. The substrate 70 includes a top side 72 and a bottom side 73 facing opposite directions. The test device 71 also has a top side 711 and a bottom side 712, respectively. The top side 711 and the bottom side 712 of the test device 71 are respectively parts of the top side 72 and the bottom side 73 of the substrate 70. In this embodiment, the bottom side 712 of the device under test 71 includes a plurality of conductive contacts (not shown in the figure), and the top side 711 of the device under test 71 includes a plurality of light-receiving parts and / or light-emitting parts (not shown in the figure). In other words, the device under test 71 in this embodiment needs to perform electrical detection on the bottom side 712 and optical detection on the top side 711.

[0046] The support platform 30 is configured to support the substrate 70, such that the substrate 70 is disposed on the support platform 30 with its bottom side 73 facing the support platform 30. In some examples, and as schematically depicted in FIG2, the support platform 30 is configured to contact the substrate 70 only along a peripheral area of ​​the substrate 70. Specifically, the support platform 30 includes a through hole 31, and when the substrate 70 is disposed on the support platform 30, the substrate 70 defines a central portion 74 corresponding to the through hole 31, and an edge portion 75 located around the central portion 74 and supported by the support platform 30, the peripheral area of ​​the substrate 70 contacted by the support platform 30 being the edge portion 75. As used herein and as schematically depicted in FIG. 2, the edge 75 of substrate 70 may refer to any suitable area of ​​substrate 70, such as any suitable area of ​​the top side and / or bottom side of substrate 70, which at least partially restricts, surrounds, closes, and / or encloses a central area of ​​substrate 70 (i.e., the aforementioned central portion 74), which is accessible and / or tested by upper and lower detection devices (i.e., optical detection device 50 and probe device 40) and support device 60. More specifically, in some examples, and as schematically depicted in FIG. 2, the stage 30 includes a support surface 32 configured to contact the bottom side 73 of substrate 70 along the edge 75 of substrate 70. The support surface 32 of the stage 30 may support the edge 75 of substrate 70 along an entire periphery of substrate 70, or may support the edge 75 along a region of substrate 70 and / or along a plurality of spaced regions of substrate 70.

[0047] In this embodiment, the upper detection device is an optical detection device 50, which is disposed above the through hole 31 of the support stage 30, and is used to detect the device under test 71 on the top side 72 of the substrate 70. Specifically, the optical detection device 50 can move relative to the support stage 30, that is, one or both of the optical detection device 50 and the support stage 30 can move to change their relative positions. The optical detection device 50 includes a fiber optic transceiver 51, which includes an optical transceiver surface 511, which can be precisely aligned with the light-receiving part and / or light-emitting part of the top side 711 of the device under test 71, thereby effectively emitting and receiving light from the device under test 71, and thus achieving a good optical detection effect. The probe system 21 may include a signal generation and analysis component (not shown). When the signal generation and analysis components are present, they can be adapted, configured, designed, and / or constructed to provide a test signal to the device under test 71 via an optical probe tip (e.g., optical transceiver surface 511) of the optical inspection device 50 and / or to receive a generated signal from the device under test 71 via the optical probe tip. Examples of the test signal include an optical test signal. Examples of the generated signal include an optically generated signal. Examples of the signal generation and analysis components include a signal generator, an electrical signal generator, an optical signal generator, a signal transmitter, an electrical signal transmitter, an optical signal transmitter, a signal receiver, an electrical signal receiver, an optical signal receiver, a signal analyzer, an electrical signal analyzer, and / or an optical signal analyzer. The optical inspection device 50 may include any suitable structure, which may include an optical probe (e.g., fiber optic transceiver 51). For example, the optical inspection device 50 and / or its optical probe may include and / or be an optical fiber cable. Examples of fiber optic cables include a cleaved fiber optic cable, a lens fiber optic cable, a 3D-printed fiber optic assembly, and / or a multifaceted fiber optic cable. Optical probes can be configured to transmit optical signals, examples of which include infrared (IR) optical signals and / or visible spectrum optical signals.

[0048] In this embodiment, the lower detection device is a probe device 40, which is disposed below the through hole 31 of the support stage 30, and is used to detect the device under test 71 on the bottom side 73 of the substrate 70. Specifically, the probe device 40 can move relative to the support stage 30, that is, one or both of the probe device 40 and the support stage 30 can move to change their relative positions. The probe device 40 includes a probe 41 (the number is not limited), which can accurately contact the conductive contacts on the bottom side 712 of the device under test 71, so that the device under test 71 can be electrically connected to a testing machine (not shown) through the probe device 40 and can transmit electrical signals to each other, thereby performing electrical detection on the device under test 71. The probe system 21 may include a signal generation and analysis component (not shown). When the signal generation and analysis components are present, they can be adapted, configured, designed, and / or constructed to provide a test signal to the device under test 71 via a probe tip (e.g., probe 41) of the probe device 40 and / or to receive a generated signal from the device under test 71 via the probe tip. Examples of the test signal include an electrical test signal and / or an electromagnetic test signal. Examples of the generated signal include an electrically generated signal and / or an electromagnetically generated signal. Examples of the signal generation and analysis components include a signal generator, an electrical signal generator, an optical signal generator, a signal transmitter, an electrical signal transmitter, an optical signal transmitter, a signal receiver, an electrical signal receiver, an optical signal receiver, a signal analyzer, an electrical signal analyzer, and / or an optical signal analyzer.

[0049] In this embodiment, since the probe device 40 is disposed below the through hole 31 of the support stage 30, the support device 60 is disposed above the through hole 31 of the support stage 30 to provide support for the substrate 70. Specifically, the support device 60 can move relative to the support stage 30; that is, one or both of the support device 60 and the support stage 30 can move to change their relative positions. The support device 60 includes a rod-shaped support member 61 with a slightly tapered head, which can precisely contact the area of ​​the substrate 70 that needs support. The support member 61 can be made of (but is not limited to) soft materials such as rubber, plastic, or silicone. More specifically, when the probe device 40 tests the device under test 71, the probe 41 contacts the bottom side 73 of the substrate 70, and the support member 61 of the support device 60 contacts the top side 72 of the substrate 70 and is arranged adjacent to the probe 41 across the substrate 70. That is, the support member 61 can be opposite to the probe 41 across the substrate 70, or as close as possible to the position opposite to the probe 41. Specifically, the support member 61 is configured to be adjacent to the probe device 40. Preferably, when testing, the distance between the support member 61 and the probe 41 of the probe device 40 in the horizontal axis (e.g., the distance d in the Y-axis) is less than the length L of the device under test 71 in the horizontal axis. The support member 61 of the support device 60 is configured to contact the substrate 70 and / or the device under test 71 in a point contact manner. Here, point contact generally refers to two objects having only a tiny point on the contact surface, rather than a surface or line. It emphasizes that the contact area is very small, and in fact, the contact is usually concentrated in a very small area or point.

[0050] Accordingly, when the probe system 21 of this embodiment detects the device under test 71, the optical detection device 50 and the probe device 40 can simultaneously detect the top side 711 and the bottom side 712 of the device under test 71 to achieve the function of double-sided detection. At this time, the probe 41 of the probe device 40 applies an upward force on the bottom side 73 of the substrate 70, and the support member 61 of the support device 60 contacts the top side 72 of the substrate 70 near the force-bearing point of the substrate 70 to resist the force applied by the probe 41, thereby effectively preventing the substrate 70 from deforming. In this way, the problem of inaccurate detection results caused by the inability to accurately align the optical detection device 50 and the device under test 71 due to the deformation of the substrate 70 can be avoided.

[0051] Furthermore, the probe system 21 of this embodiment can determine whether the support member 61 of the support device 60 is in contact with the substrate 70 by means of a distance sensor 52 included in the optical detection device 50. Its operation method includes the following steps a) to d), as shown in FIG9.

[0052] a) Place the substrate 70 on the support platform 30.

[0053] b) Move the optical inspection device 50 relative to the stage 30 so that the optical inspection device 50 is adjacent to the test device 71 of the substrate 70.

[0054] c) The distance D between the optical detection device 50 and the substrate 70 is measured using the distance sensor 52 of the optical detection device 50 to generate a distance value. The support device 60 is then moved relative to the support stage 30 so that the support member 61 contacts the substrate 70. If the distance value measured by the distance sensor 52 of the optical detection device 50 changes, it is determined that the support member 61 of the support device 60 has contacted the substrate 70. In some embodiments, after the support member 61 of the support device 60 has contacted the substrate 70, the optical detection device 50 will further perform a precise alignment step to facilitate the optical detection in step d). Specifically, a controller (not shown) can be electrically connected to the manipulator of the distance sensor 52 and the support device 60. The controller monitors the distance value measured by the distance sensor 52. When the controller detects a change in the distance value, it stops the support member 61 of the support device 60 from moving further in the vertical axis (Z-axis) direction.

[0055] d) With the support member 61 of the support device 60 in contact with the substrate 70, the probe 41 of the probe device 40 contacts the device under test 71 to perform electrical testing on the device under test 71, and the optical testing device 50 performs optical testing on the device under test 71.

[0056] As schematically depicted in Figure 2, and as discussed, the optical inspection device 50 includes a distance sensor 52 that defines a sensor surface 521 facing a height calibration structure (e.g., the surface of a device under test (DUT) and / or an optical coupler), such that the sensor surface 521 is at least substantially parallel to a surface of the height calibration structure. In this way, the sensor surface 521 may correspond to and / or be a portion of the distance sensor 52, such as a surface of the distance sensor 52 adjacent to the height calibration structure. As discussed, a position of the distance sensor 52 and / or the sensor surface 521 relative to the height calibration structure may be characterized by sensing surface distance. As further illustrated in Figure 2, and as additionally discussed, the position of the fiber optic transceiver 51 and / or the optical transceiver surface 511 relative to the height calibration structure and / or the optical coupler is characterized by a probe end displacement between the optical transceiver surface 511 and the height calibration structure, said probe end displacement being, for example, along a direction at least substantially parallel to the vertical axis. Thus, the distance sensor 52 of the optical detection device 50 can not only determine whether the support member 61 of the support device 60 is in contact with the substrate 70, but also ensure that the distance between the optical transceiver surface 511 of the optical detection device 50 and the substrate 70 is suitable for optical detection.

[0057] As shown in FIG. 2, the fiber optic transceiver 51 of the optical detection device 50 may pass through a plane, or surface plane, which may extend within and / or from the sensor surface 521, and the optical transceiver surface 511 of the fiber optic transceiver 51 of the optical detection device 50 may be located on the sensor-opposite side of the plane. In other words, in the configuration shown in FIG. 2 where the fiber optic transceiver 51 extends downward toward the substrate 70, the fiber optic transceiver 51 extends beyond the sensor surface 521 and / or its extension surface, such that the position of the optical transceiver surface 511 is lower than the sensor surface 521. Such a configuration may allow and / or facilitate the extension of the optical transceiver surface 511 of the fiber optic transceiver 51 of the optical detection device 50 into a trench, as shown in FIG. 4 and FIG. 5, and the extension of the optical transceiver surface 511 into the trench is before or under no-contact contact between the sensor surface 521 and the surface of the substrate 70.

[0058] More specifically, in the configuration shown in FIG2, the light-receiving and light-emitting portions of the device under test 71 are located on a top surface 721 of the top side 72 of the substrate 70. Therefore, the optical transceiver surface 511 of the fiber optic transceiver 51 is configured to face the top surface 721 of the substrate 70 to perform optical detection on the device under test 71. However, the light-receiving and light-emitting portions of the device under test 71 may be located on an inner wall 723 of a groove 722 on the top side 72 of the substrate 70, as shown in FIG4. In this case, the optical transceiver surface 511 of the fiber optic transceiver 51 may be configured to extend into the groove 722 and face the inner wall 723 of the groove 722 to perform optical detection on the device under test 71.

[0059] The distance sensor 52 may include and / or any suitable sensor that may be adapted, configured, designed and / or manufactured for sensing, determining and / or detecting a sensing distance. Examples of the distance sensor 52 include capacitive distance sensors, optical distance sensors and / or interferometers. Generally, the distance sensor 52 may be configured to determine that the sensing distance reaches a threshold distance resolution. Examples of threshold distance resolution include up to 100 nanometers, up to 50 nanometers, up to 40 nanometers, up to 30 nanometers, up to 20 nanometers, up to 10 nanometers, up to 5 nanometers, up to 4 nanometers, up to 3 nanometers, up to 2 nanometers, up to 1 nanometer, at least 0.1 nanometers, at least 0.5 nanometers, at least 1 nanometer and / or at least 2 nanometers.

[0060] As shown in Figure 2, the support device 60 in this embodiment further includes a heater 62. The heater 62 can be controlled by a temperature control system (not shown) to heat up and cool down. The heater 62 is in thermal communication with the support member 61 and is configured to control the temperature of the support member 61 when the optical detection device 50 and the probe device 40 detect the device under test 71, so that the support member 61 heats the substrate 70 by means of heat conduction when it contacts the substrate 70. Since the heater 62 of the support device 60 heats the substrate 70 by contact between the support member 61 and the substrate 70, and the support member 61 can contact the device under test 71 being detected or its vicinity, not only can a good support effect be achieved, but the device under test 71 being detected can also be heated and its temperature maintained efficiently, so that the device under test 71 can be detected under the required high temperature conditions. The heater 62 can be configured to generate heat energy in any suitable way, such as resistance heating generated by an electric current.

[0061] As shown in Figure 2, the probe system 21 of this embodiment further includes a non-contact heating device 80. The non-contact heating device 80 can be controlled by a temperature control system (not shown) to heat up and cool down. The non-contact heating device 80 is configured to heat the substrate 70 by thermal radiation when the optical detection device 50 and the probe device 40 detect the device under test 71. In this way, while the heater 62 of the aforementioned support device 60 heats the device under test 71 through the support member 61, the non-contact heating device 80 can also heat the device under test 71, thereby achieving higher heating efficiency. Alternatively, the support device 60 may not have a heater 62, and the device under test 71 may only be heated by the non-contact heating device 80, thus making the structure of the support device 60 simpler.

[0062] Please refer to Figure 3. The probe system 22 for double-sided detection provided in a second preferred embodiment of the present invention is similar to the aforementioned probe system 21, except that the main difference lies in the positional configuration of the probe device 40, the optical detection device 50 and the support device 60.

[0063] In this embodiment, the probe device 40 is an upper detection device, which is disposed above the through hole 31 of the support stage 30, and is used to perform electrical detection on the device under test 71 by contacting the top side 72 of the substrate 70 with the probe 41. The optical detection device 50 is a lower detection device, which is disposed below the through hole 31 of the support stage 30, and is used to perform optical detection on the bottom side 73 of the substrate 70. In other words, the device under test 71 in this embodiment has a conductive contact on the top side 711 and a light-receiving part and / or a light-emitting part on the bottom side 712. Since the probe device 40 is located above the through hole 31 of the support platform 30, the support device 60 is located below the through hole 31 of the support platform 30. When the probe device 40 tests the device under test 71, the probe 41 contacts the top side 72 of the substrate 70, and the support member 61 of the support device 60 contacts the bottom side 73 of the substrate 70 and is arranged adjacent to the probe 41 with respect to the substrate 70.

[0064] Accordingly, when the probe system 22 of this embodiment detects the device under test 71, the probe device 40 and the optical detection device 50 can simultaneously detect the top side 711 and the bottom side 712 of the device under test 71 to achieve the function of double-sided detection. At this time, the probe 41 of the probe device 40 applies a downward force on the top side 72 of the substrate 70, and the support member 61 of the support device 60 contacts the bottom side 73 of the substrate 70 near the force-bearing point of the substrate 70 to resist the force applied by the probe 41, thereby effectively avoiding deformation of the substrate 70. In this way, the problem of inaccurate detection results caused by the inability to accurately align the optical detection device 50 and the device under test 71 due to the deformation of the substrate 70 can be avoided.

[0065] The probe system 22 of this embodiment can also determine whether the support member 61 of the support device 60 is in contact with the substrate 70 by means of the distance sensor 52 of the optical detection device 50. Its operation method is similar to that described in the first preferred embodiment, and will not be repeated here. However, regardless of the state of the first or second preferred embodiment, it is not limited to determining whether the support member 61 of the support device 60 is in contact with the substrate 70 by means of the distance sensor 52 of the optical detection device 50. Therefore, the operation method of the probe system in the first and second preferred embodiments can also be as shown in FIG10. The probe system 22 of this embodiment can also heat the substrate 70 by means of the heater 62 of the support device 60 and / or the non-contact heating device 80 when the upper and lower detection devices detect the device under test 71, so that the device under test 71 is detected under the required high temperature conditions.

[0066] In the configuration shown in FIG3, the light-receiving part and the light-emitting part of the device under test 71 are located on a bottom surface 731 of the bottom side 73 of the substrate 70. Therefore, the optical transceiver surface 511 of the fiber optic transceiver 51 is configured to face the bottom surface 731 of the substrate 70 to perform optical detection on the device under test 71. However, the light-receiving part and the light-emitting part of the device under test 71 may be located on an inner sidewall 733 of a groove 732 on the bottom side 73 of the substrate 70, as shown in FIG5. In this case, the optical transceiver surface 511 of the fiber optic transceiver 51 can be configured to extend into the groove 732 and face the inner sidewall 733 of the groove 732 to perform optical detection on the device under test 71.

[0067] Please refer to Figures 6 and 7. The probe system 23 for double-sided detection provided in the third preferred embodiment of the present invention is similar to the probe system 22 described above. However, the main difference is that the probe system 23 in this embodiment provides a support mechanism that is different from the support device 60 disclosed in the first embodiment. That is, the support platform 30 is configured to include a support portion 33 to support the substrate 70.

[0068] In detail, the support portion 33 of the support platform 30 is grid-shaped, including an upper surface 331, a lower surface 332, and a plurality of through holes 333 penetrating the upper surface 331 and the lower surface 332, for the substrate 70 to be disposed on the upper surface 331 of the support portion 33, such that a partial position of the substrate 70 corresponds to each through hole 333. In this way, the top side 72 of the substrate 70 is completely exposed upwards, while the bottom side 73 of the substrate 70 is partially exposed downwards through the through holes 333. In this embodiment, the test device 71 of the substrate 70 has a conductive contact on the top side 711 and a light-receiving portion and / or a light-emitting portion on the bottom side 712. As long as the light-receiving portion and / or light-emitting portion of the test device 71 is located in the through holes 333 of the support portion 33 of the support platform 30, optical detection of the test device 71 can be performed through the through holes 333 on the bottom side 73 of the substrate 70.

[0069] The operation method of the probe system 23 in this embodiment (as shown in FIG11) is to place the substrate 70 on the upper surface 331 of the support portion 33 of the carrier stage 30, and to use upper and lower detection devices to detect the device under test 71 on the top side 72 and bottom side 73 of the substrate 70, respectively. In this embodiment, the probe device 40 is an upper detection device, which is disposed above the support portion 33 of the carrier stage 30, and is used to perform electrical detection on the device under test 71 by contacting the top side 72 of the substrate 70 with the probe 41. The optical detection device 50 is a lower detection device, which is disposed below the support portion 33 of the carrier stage 30, and is used to perform optical detection on the device under test 71 by allowing the optical transceiver surface 511 of the fiber optic transceiver 51 to face the bottom side 73 of the substrate 70 through the through hole 333 of the support portion 33.

[0070] Thus, the probe system 23 of this embodiment can achieve the function of double-sided detection, and the support part 33 of the support stage 30 is supported on the bottom side 73 of the substrate 70. When the probe 41 of the probe device 40 applies a downward force on the top side 72 of the substrate 70, the support part 33 of the support stage 30 can resist the force applied by the probe 41, thereby effectively preventing the substrate 70 from deforming. In this way, the problem of poor detection results caused by the inaccurate alignment between the optical detection device 50 and the device under test 71 due to the deformation of the substrate 70 can be avoided.

[0071] As described in the second preferred embodiment, the light-receiving part and the light-emitting part of the device under test 71 may be located on the bottom surface 731 of the substrate 70, and the optical transceiver surface 511 of the fiber optic transceiver 51 may be configured to face the bottom surface 731 of the substrate 70 to perform optical detection on the device under test 71, as shown in FIG6. Alternatively, the light-receiving part and the light-emitting part of the device under test 71 may be located on the inner sidewall 733 of the groove 732 on the bottom side 73 of the substrate 70, and the optical transceiver surface 511 of the fiber optic transceiver 51 may be configured to extend into the groove 732 and face the inner sidewall 733 of the groove 732 to perform optical detection on the device under test 71, as shown in FIG5.

[0072] As shown in Figures 6 and 7, the support platform 30 in this embodiment further includes a heater 34. The heater 34 can be heated and cooled by a temperature control system (not shown), thereby controlling the temperature of the support portion 33 of the support platform 30, so that the support portion 33 heats the substrate 70 by heat conduction when it contacts the substrate 70. Since the heater 34 of the support platform 30 heats the substrate 70 by contact between the support portion 33 and the substrate 70, and the support portion 33 is grid-shaped, it can support and heat the bottom side 73 of the substrate 70 more comprehensively. This not only achieves a good support effect, but also efficiently heats and maintains the temperature of the device under test 71, which is being tested, so that the device under test 71 can be tested under the required high temperature conditions. Furthermore, the heater 34 can be directly provided on the support portion 33, so as to heat and maintain the temperature of the device under test 71 more efficiently.

[0073] In the configurations shown in Figures 6 and 7, the support portion 33 of the support platform 30 is integrally formed with the other parts of the support platform 30 (except for the heater 34). However, the support platform 30 may not be an integral form as described above. As shown in Figure 8, the support platform 30 includes a body 35 and a grid plate. The body 35 and the grid plate are manufactured separately and then fixed together to form the support platform 30, so that the grid plate becomes the support portion 33 of the support platform 30.

[0074] Finally, it must be stated again that the constituent elements disclosed in the above-mentioned embodiments of the present invention are merely illustrative examples and are not intended to limit the scope of this application. Substitutions or variations of other equivalent elements should also be covered by the scope of the patent application of this application. [Simplified Explanation of the Diagram]

[0042] Figure 1 is a cross-sectional schematic diagram of a conventional probe system for double-sided inspection and a wafer. Figure 2 is a cross-sectional schematic diagram of a probe system for double-sided inspection and a substrate provided in a first preferred embodiment of the present invention. Figure 3 is a cross-sectional schematic diagram of a probe system for double-sided inspection and a substrate provided in a second preferred embodiment of the present invention. Figures 4 and 5 are partial cross-sectional schematic diagrams showing the configuration of substrates and fiber optic transceivers in two other configurations. Figure 6 is a cross-sectional schematic diagram of a probe system for double-sided inspection and a substrate provided in a third preferred embodiment of the present invention. Figure 7 is a bottom view schematic diagram of a support stage and a substrate of the probe system provided in the third preferred embodiment of the present invention. Figure 8 is similar to Figure 6, but shows a support stage in another configuration. Figure 9 is a flowchart of the operation method of the probe system for double-sided inspection provided in the first preferred embodiment of the present invention. Figure 10 is a flowchart of another operation method. Figure 11 is a flowchart of the operation method of the probe system for double-sided inspection provided in the third preferred embodiment of the present invention.

Claims

1. A probe system for double-sided inspection, used to inspect one or more devices under test on a substrate; the probe system comprising: a stage configured to support the substrate, the stage including a through hole for the substrate to be disposed on the stage, such that the substrate defines a central portion corresponding to the through hole and an edge portion located around the central portion and supported by the stage; an upper inspection device disposed above the through hole of the stage for inspecting the device under test on a top side of the substrate; a lower inspection device disposed below the through hole of the stage for inspecting the device under test on a bottom side of the substrate, wherein the bottom side is opposite to the top side and faces the stage; and a support device including a support member; wherein... One of the upper and lower detection devices is a probe device, which includes a probe. The other of the upper and lower detection devices is an optical detection device, which includes a fiber optic transceiver. The optical detection device and the support device are movable relative to the carrier stage. One of the support device and the probe device is disposed above the through hole of the carrier stage, and the other of the support device and the probe device is disposed below the through hole of the carrier stage. When the probe device detects the device under test, the probe contacts one of the top and bottom sides of the substrate, and the support member of the support device contacts the other of the top and bottom sides of the substrate and is disposed adjacent to the probe through the substrate. The fiber optic transceiver includes an optical transceiver surface. When the optical detection device detects the device under test, the support member is located outside the projection range of the optical transceiver surface onto the substrate.

2. The probe system for double-sided inspection as described in claim 1, wherein the lower inspection device is the probe device for performing electrical inspection on the device under test by contacting the bottom side of the substrate with the probe; the support device is disposed above the through hole of the support stage for contacting the top side of the substrate with the support; and the upper inspection device is the optical inspection device for performing optical inspection on the top side of the substrate.

3. The probe system for double-sided inspection as described in claim 1, wherein the upper inspection device is the probe device for performing electrical inspection on the device under test by contacting the top side of the substrate with the probe; the support device is disposed below the through hole of the support stage for contacting the bottom side of the substrate with the support; and the lower inspection device is the optical inspection device for performing optical inspection on the bottom side of the substrate.

4. The probe system for double-sided inspection as described in claim 1, wherein the support device further includes a heater configured to control the temperature of the support member when the upper inspection device and the lower inspection device inspect the device under test, such that the support member heats the device under test by means of heat conduction when it contacts the substrate.

5. The probe system for double-sided inspection as described in claim 1 further includes a non-contact heating device configured to heat the device under test by means of thermal radiation when the upper inspection device and the lower inspection device inspect the device under test.

6. The probe system for double-sided inspection as described in claim 1, wherein when the probe device inspects the device under test, the distance between the position of the support contacting the substrate and the position of the probe contacting the substrate in a horizontal axis is less than the length of the device under test in that horizontal axis.

7. The probe system for double-sided inspection as described in claim 1, wherein the optical inspection device includes a distance sensor for measuring the distance between the optical inspection device and the substrate to generate a distance value, and thereby determining whether the support member of the support device is in contact with the substrate by means of the change in the distance value.

8. A method of operating a probe system for double-sided inspection as described in claim 7, comprising the steps of: placing a substrate on a support stage; moving an optical inspection device relative to the support stage such that the optical inspection device is adjacent to a device under test on the substrate; measuring the distance between the optical inspection device and the substrate using a distance sensor of the optical inspection device to generate the distance value, and moving a support device relative to the support stage to make the support member contact the substrate; determining that the support member of the support device is in contact with the substrate when the distance value measured by the distance sensor of the optical inspection device changes; and performing electrical inspection on the device under test by contacting the device under test using a probe of the probe device while the support member of the support device is in contact with the substrate, and performing optical inspection on the device under test using the optical inspection device.

9. A method of operating a probe system for double-sided inspection as described in claim 1, comprising: placing the substrate on the support stage, and with the support member of the support device in contact with the substrate, using the upper inspection device to inspect the device under test on the top side of the substrate, and using the lower inspection device to inspect the device under test on the bottom side of the substrate; wherein, The configuration of the upper detection device, the lower detection device, and the support device is one of the following: the lower detection device is the probe device, which contacts the bottom side of the substrate to perform electrical detection on the device under test; the support device is disposed above the through hole of the support stage and contacts the top side of the substrate; the upper detection device is the optical detection device, which performs optical detection on the top side of the substrate; and the upper detection device is the probe device, which contacts the top side of the substrate to perform electrical detection on the device under test; the support device is disposed below the through hole of the support stage and contacts the bottom side of the substrate; the lower detection device is the optical detection device, which performs optical detection on the bottom side of the substrate.

10. A method of operating the probe system for double-sided inspection as described in claim 9, wherein the optical inspection device is configured to perform optical inspection on the device under test in one of the following ways: the optical transceiver surface of the fiber optic transceiver faces a top surface of the substrate while performing optical inspection on the device under test; the fiber optic transceiver extends into a groove on the top side of the substrate, and the optical transceiver surface faces an inner wall of the groove while performing optical inspection on the device under test; the optical transceiver surface of the fiber optic transceiver faces a bottom surface of the substrate while performing optical inspection on the device under test; and the fiber optic transceiver extends into a groove on the bottom side of the substrate, and the optical transceiver surface faces an inner wall of the groove while performing optical inspection on the device under test.

Images