Transfer laminate and method for manufacturing transfer laminate

Abstract

[Problem] To provide a transfer laminate used in forming a circuit board that exhibits good release properties even when no heat load is applied during the circuit formation process, and a method for manufacturing the transfer laminate. [Solution] A transfer laminate sequentially comprises a substrate, a conductive layer, a release layer, and a conductive auxiliary layer. The conductive layer comprises copper, the release layer comprises an alloy of nickel and chromium or an alloy of nickel and copper, and the conductive auxiliary layer comprises copper. The maximum value of the oxygen element concentration measured by depth direction composition analysis by X-ray photoelectron spectroscopy in the thickness direction of the release layer is 1.0 to 11.5 atoms.

Claims

1. A transfer laminate comprising, in sequence, a substrate, a conductive layer, a release layer and a conductive auxiliary layer, wherein the conductive layer comprises copper, the release layer comprises an alloy of nickel and chromium or an alloy of nickel and copper, the conductive auxiliary layer comprises copper, and the maximum value of the oxygen concentration determined by depth-direction composition analysis by X-ray photoelectron spectroscopy in the thickness direction of the release layer is 1.0 to 11.5 atoms.

2. The transfer laminate as described in claim 1, wherein, Based on the results of depth-direction composition analysis using X-ray photoelectron spectroscopy in the thickness direction of the aforementioned release layer, it was detected that the maximum value of the oxygen element concentration is located in the thickness direction of the aforementioned release layer, closer to the aforementioned conductive auxiliary layer than the aforementioned conductive layer.

3. A method for manufacturing a transfer laminate, comprising: a first step of preparing a substrate; a second step of forming a conductive layer on the substrate under vacuum; a third step of forming a release layer on the conductive layer under vacuum; a fourth step of exposing the release layer to the atmosphere under atmospheric conditions; and a fifth step of forming a conductive auxiliary layer on the release layer under vacuum, wherein the second and third steps are performed continuously under vacuum; the conductive layer comprises copper, the release layer comprises an alloy of nickel and chromium or an alloy of nickel and copper, the conductive auxiliary layer comprises copper, and the maximum value of the oxygen concentration measured by depth-direction composition analysis by X-ray photoelectron spectroscopy in the thickness direction of the release layer is 1.0 to 11.5 atoms.

4. The method for manufacturing a transfer laminate as described in claim 3, wherein, The second and third steps described above are performed using a sputtering method.

5. A method for manufacturing a transfer laminate as described in claim 3 or 4, wherein, Based on the results of depth-direction composition analysis using X-ray photoelectron spectroscopy in the thickness direction of the aforementioned release layer, it was detected that the maximum value of the oxygen element concentration is located in the thickness direction of the aforementioned release layer, closer to the aforementioned conductive auxiliary layer than the aforementioned conductive layer.

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