Lens modules and electronic devices

Abstract

A lens module and electronic device are disclosed. The lens module includes a lens assembly, a lens mount, a first dustproof structure, a circuit board assembly, and a photosensitive wafer. The lens mount has a first surface and a second surface facing each other, and a receiving cavity extending through the first and second surfaces. The lens assembly is partially located within the receiving cavity. The first dustproof structure is located on the outer periphery of the lens assembly and is made of a gel. The circuit board assembly is connected to the second surface. The photosensitive wafer is fixed to the surface of the circuit board assembly facing the lens mount, and the photosensitive wafer is electrically connected to the circuit board assembly. By providing a first dustproof structure on the outer periphery of the lens assembly, dust or particles can be effectively prevented from entering the interior of the lens module through the gap between the lens assembly and the lens mount, reducing contamination of the photosensitive wafer.

Claims

1. A lens module, improved in that it includes: Lens assembly; A lens mount has opposing first and second surfaces, the lens mount having a receiving cavity extending through the first and second surfaces, and the lens assembly portion being located within the receiving cavity; A first dustproof structure is located on the outer periphery of the lens assembly, and the first dustproof structure is a gel; a circuit board assembly is connected to the second surface; a pre-locking structure is located in the gap between the lens assembly and the lens mount, and the pre-locking structure is used to fix the lens assembly and the lens mount. The first dustproof structure is located on the surface of the pre-locking structure away from the circuit board assembly. The pre-locking structure includes a body and a protrusion. The body covers the outer periphery of the lens assembly, and the protrusion is connected to the edge of the body and snaps into the first surface. The body has a groove that penetrates the surface of the body away from the circuit board assembly. The first dustproof structure is at least partially located in the groove. And a photosensitive chip, fixed to the surface of the circuit board assembly facing the lens mount, and electrically connected to the circuit board assembly.

2. The lens module as described in claim 1, wherein, The lens assembly includes a first part and a second part, the first part being connected to the second part, the first part being located within the receiving cavity, the second part protruding from the first surface, and the first dustproof structure being located on the outer periphery of the first part.

3. The lens module as described in claim 1, wherein, The first dustproof structure is annular and is sleeved on the outer periphery of the lens assembly; or the first dustproof structure is arc-shaped and is wrapped around the outer periphery of the lens assembly; or the first dustproof structure includes multiple discrete segments, which are distributed along the outer periphery of the lens assembly and have gaps between them.

4. The lens module as described in claim 1, wherein, The material hardness of the first dustproof structure is d1, and the material hardness of the pre-locking structure is d2, where d1 < d2.

5. The lens module as described in claim 1, wherein, The lens module also includes a protective cover, which is disposed on the first surface of the lens mount and accommodates the lens assembly protruding from the first surface.

6. The lens module as described in claim 1, wherein, The lens module also includes a mounting bracket and a filter. The mounting bracket is located inside the receiving cavity and fixed above the circuit board assembly. The filter is supported on the mounting bracket and is disposed opposite to the photosensitive wafer, which is located below the mounting bracket.

7. The lens module as described in claim 6, wherein, The lens module also includes a second dustproof structure, which is located between the filter and the mounting bracket and covers the contact surface between the filter and the mounting bracket.

8. An electronic device, improved in that the electronic device includes a lens module as described in any one of claims 1 to 7.

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