Semiconductor baking fixture

TWI942623BActive Publication Date: 2026-10-11XIANGJI MASCH IND CO LTD
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Patent Information

Application Number
TW114150585
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-12-22
Publication Date
2026-10-11
Estimated Expiration
2045-12-21

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Abstract

A semiconductor baking fixture includes a first base, a second base that engages with the first base, and a plurality of fasteners for fixing the first base and the second base. The first base has a plurality of first positioning elements, and the second base has a corresponding plurality of second positioning elements. In this way, during the process of engaging the second base with the first base, the second positioning elements can be positioned at the first positioning parts, and the fasteners can be directly locked in one go, so as to quickly and accurately lock the second base with the first base, thereby greatly reducing the positioning and locking time and improving the locking efficiency.
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Claims

1. A semiconductor baking fixture, comprising: a first base having a first inner side and a first outer side disposed opposite the first inner side, wherein the first inner side is provided with a plurality of first positioning members, each of the first positioning members having a first positioning portion and a locking hole, wherein, The first positioning part is a protruding ring surrounding the lock hole, and the inner side of the protruding ring forms a guide hole communicating with the lock hole; a second seat body is capable of engaging with the first seat body, and the second seat body has a second inner side corresponding to the first inner side, and a second outer side opposite to the second inner side. At the same time, the second inner side is provided with a plurality of second positioning members corresponding to the first positioning members, wherein each of the second positioning members is provided with a second positioning part, which is a positioning groove, and the positioning groove is for the corresponding protruding ring to be inserted, so that the second positioning part can be positioned in the corresponding first positioning part. At the same time, each of the second positioning members is provided with a communicating hole, which is connected to the corresponding lock hole. In addition, the second outer side is provided with a plurality of through holes corresponding to the second positioning members, and the through holes are connected to the corresponding communicating holes. A plurality of locking fasteners are respectively inserted into the communicating holes, and one end of each locking fastener is provided with a threaded portion, which is detachably locked into the corresponding locking hole, while the other end of each locking fastener passes through the corresponding through hole and expands outward to form a head; a pressure plate is disposed on the second inner side and can move with the second seat.

2. The semiconductor baking fixture as described in claim 1, wherein, The first positioning system has a plurality of mounting holes, each mounting hole having a fixing member, each fixing member having a fixing hole, and one end of each first positioning member having a first stud, the first stud being screwed and fixed to the fixing hole.

3. The semiconductor baking fixture as described in claim 2, wherein, The thread direction of the first stud is opposite to that of the threaded portion.

4. The semiconductor baking fixture as described in claim 2, wherein, The first stud is provided with a chip removal hole that connects to the lock hole.

5. The semiconductor baking fixture as described in claim 1, wherein, The second system has a plurality of fixing slots, and one end of each of the second positioning members is provided with a second stud, which is screwed into and fixed to the fixing slot.

6. The semiconductor baking fixture as described in claim 1, wherein, The diameter of the guide hole is larger than that of the lock hole, and a guide inner inclined surface that gradually narrows toward the lock hole is formed at the connection between the guide hole and the lock hole. The other end of the guide hole opposite to the lock hole is provided with a guide flare that gradually widens outward.

7. The semiconductor baking fixture as described in claim 1, wherein, The positioning groove is provided with a positioning flare that gradually expands outward, and the outer side of the convex ring is provided with a guide bevel that gradually narrows outward.

8. The semiconductor baking fixture as described in claim 1, wherein, An elastic element is provided between the second positioning element and the head.

9. The semiconductor baking fixture as described in claim 1, wherein, A flange is provided around the threaded portion of the fastener.

Citation Information

Patent Citations

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    CN112289695A

  • Chip testing device and a chip testing system

    TW202119046A

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