resistive materials

Abstract

This invention provides a resistive material with high volume resistivity capable of detecting minute currents. The resistive material contains 9.0% to 14.0% by mass of Ni, 22.0% to 27.5% by mass of Cu, with the remainder comprising Mn and unavoidable impurities. It has a volume resistivity of 180.0 × 10⁻⁸ Ω·m or higher, a TCR of -20.0 ppm / ℃ to 20.0 ppm / ℃ in a temperature range of 20℃ to 60℃, and a thermoelectric potential to copper of -1.00 μV / ℃ to 1.00 μV / ℃ in a temperature range of 0℃ to 100℃. Preferably, it further contains 0.5% to 3.5% by mass of Cr, and its thickness is preferably less than 2.0 mm.

Claims

1. A resistive material containing 9.0% to 14.0% by mass of Ni, 22.0% to 27.5% by mass of Cu, with the remainder containing Mn and unavoidable impurities, having a volume resistivity of 180.0 × 10⁻⁸ Ω·m or higher, a temperature coefficient of resistance of -20.0 ppm / ℃ to 20.0 ppm / ℃ in the temperature range of 20℃ to 60℃, and a thermoelectric potential to copper of -1.00 μV / ℃ to 1.00 μV / ℃ in the temperature range of 0℃ to 100℃.

2. The resistive material as described in claim 1 further contains 0.5% to 3.5% by mass of Cr.

3. The resistive material as described in claim 1 or 2, having a thickness of 2.0 mm or less.

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