Inductor structure and power module using the same

Abstract

This invention provides an inductor structure including a magnetic core, M first metal bodies, and N second metal bodies. The magnetic core includes an upper surface and a lower surface arranged opposite each other. The M first metal bodies pass through the magnetic core, and each first metal body forms a first upper lead-out terminal and a first lower lead-out terminal on its upper and lower surfaces, respectively, and are assembled to form a winding. The N second metal bodies pass through the magnetic core, and each second metal body forms a second upper lead-out terminal and a second lower lead-out terminal on its upper and lower surfaces, respectively, and the second upper lead-out terminals and the second lower lead-out terminals are at the same potential. The M first metal bodies and the N second metal bodies are arranged alternately in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array. The distance between each of the M first metal bodies and its adjacent body is greater than the distance between each of the M first metal bodies and its corresponding adjacent second metal body. M and N are integers, with M ≥ 2 and N ≥ 2.

Claims

1. An inductor structure, comprising: A magnetic core includes an upper surface and a lower surface disposed opposite to each other; M first metal bodies disposed within the magnetic core, wherein the M first metal bodies pass through the magnetic core, and each first metal body forms a first upper lead-out terminal and a first lower lead-out terminal on the upper surface and the lower surface, respectively, and are assembled to form a winding; and N second metal bodies disposed within the magnetic core, wherein the N second metal bodies pass through the magnetic core, and each second metal body forms a second upper lead-out terminal and a second lower lead-out terminal on the upper surface and the lower surface, respectively, wherein the second upper lead-out terminal and the second lower lead-out terminal are at the same potential; The M first metal bodies and the N second metal bodies are arranged alternately in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array. The distance between each of the M first metal bodies and its neighbor is greater than the distance between each of the M first metal bodies and its corresponding neighboring second metal body. M and N are integers, M ≥ 2 and N ≥ 2.

2. The inductor structure as claimed in claim 1, wherein the M first metal bodies and the N second metal bodies penetrate perpendicularly through the upper surface and the lower surface.

3. The inductor structure as described in claim 2, wherein the M first metal bodies and the N second metal bodies are all metal cylinders with the same structure.

4. The inductor structure as claimed in claim 1, wherein the N second metal bodies are directly electrically connected on the upper or lower surface by means of shorting.

5. The inductor structure as claimed in claim 1, wherein an upper circuit board is disposed above the inductor structure and electrically connected to the inductor structure, a lower circuit board is disposed below the inductor structure and electrically connected to the inductor structure, and the N second metal bodies are electrically connected to each other through the traces or plated copper holes of the upper circuit board and the lower circuit board.

6. The inductor structure as claimed in claim 1, wherein the magnetic core is disposed within a main circuit board, and the N second metal bodies are electrically connected to each other through traces or plated copper holes of the main circuit board.

7. The inductor structure as described in claim 6, wherein the main circuit board includes a top surface and a bottom surface, the top surface being spatially opposite to the upper surface, the bottom surface being spatially opposite to the lower surface, the M first metal bodies and the N second metal bodies perpendicularly penetrating the upper surface and the lower surface, each of the first upper output terminals forming a first upper pad on the top surface through electroplated copper holes, each of the second upper output terminals forming a second upper pad on the top surface through electroplated copper holes, the first upper pad and the second upper pad being electrically connected to a switching device.

8. The inductor structure as claimed in claim 7, wherein each of the first lower lead-out terminals forms a first lower pad on the bottom surface through a copper-plated hole, and each of the second lower lead-out terminals forms a second lower pad on the bottom surface through a copper-plated hole, wherein the first lower pad and the second lower pad are assembled and directly soldered to a bottom circuit board.

9. The inductor structure as claimed in claim 8, wherein the main circuit board is a power board for transmitting power, and the bottom circuit board is an output circuit board electrically connected to an output capacitor, a load, a motherboard, or a signal circuit.

10. The inductor structure as claimed in claim 6, wherein each of the first lower lead-out terminals is electrically connected to each other through traces or plated copper holes on the main circuit board.

11. The inductor structure as claimed in claim 1, wherein each of the first upper output terminals is electrically connected to at least two switching devices, and each of the first lower output terminals is electrically connected to at least one output terminal.

12. The inductor structure as claimed in claim 1, wherein the current direction of the M first metal bodies is opposite to the current direction of the N second metal bodies.

13. The inductor structure as claimed in claim 1, wherein the magnetic core is made of ferrite or soft magnetic material.

14. A power module, comprising: An inductor structure includes: a magnetic core, including an upper surface and a lower surface disposed opposite to each other; M first metal bodies disposed within the magnetic core, wherein the M first metal bodies pass through the magnetic core, each of the first metal bodies forming a first upper lead-out terminal and a first lower lead-out terminal on the upper surface and the lower surface, assembled to form a winding; and N second metal bodies disposed within the magnetic core, wherein the N second metal bodies pass through the magnetic core, each of the second metal bodies forming a second upper lead-out terminal and a second lower lead-out terminal on the upper surface and the lower surface, the second upper lead-out terminal and the second lower lead-out terminal being at the same potential; wherein the M first metal bodies and the N second metal bodies are arranged alternately in a matrix, and the M first metal bodies and the N second metal bodies are arranged in an equidistant array, the distance between each of the M first metal bodies and its adjacent body is greater than the distance between each of the M first metal bodies and its corresponding adjacent second metal body, M and N are integers, M≧2 and N≧2; Multiple switching devices are disposed on the upper surface, wherein the multiple switching devices are electrically connected to the first upper output terminal and the second upper output terminal; and a bottom circuit board includes a ground terminal and an output terminal, wherein the first lower output terminal is electrically connected to the output terminal and the second lower output terminal is electrically connected to the ground terminal.

15. The power module as claimed in claim 14, wherein the M first metal bodies and the N second metal bodies penetrate perpendicularly through the upper surface and the lower surface, and the M first metal bodies and the N second metal bodies are all metal cylinders with the same structure.

16. The power module as claimed in claim 14, wherein the N second metal bodies are directly electrically connected on the upper or lower surface via a short circuit.

17. The power module as claimed in claim 14, wherein the power module further includes an upper circuit board and a lower circuit board, the upper circuit board being disposed above the inductor structure and electrically connected to the inductor structure, the lower circuit board being disposed below the inductor structure and electrically connected to the inductor structure, and the N second metal bodies being electrically connected to each other through traces or plated copper holes of the upper circuit board and the lower circuit board.

18. The power module as claimed in claim 14, wherein the power module further includes a main circuit board, the magnetic core is disposed within the main circuit board, and the N second metal bodies are electrically connected to each other through traces or plated copper holes on the main circuit board.

19. The power module as claimed in claim 18, wherein the main circuit board includes a top surface and a bottom surface, the top surface being spatially opposite to the upper surface, the bottom surface being spatially opposite to the lower surface, the M first metal bodies and the N second metal bodies perpendicularly penetrating the upper surface and the lower surface, each of the first upper output terminals forming a first upper pad on the top surface through electroplated copper holes, each of the first lower output terminals forming a first lower pad on the bottom surface through electroplated copper holes; each of the second upper output terminals forming a second upper pad on the top surface through electroplated copper holes, each of the second lower output terminals forming a second lower pad on the bottom surface through electroplated copper holes, wherein the first upper pad and the second upper pad are electrically connected to the plurality of switching devices, and the first lower pad and the second lower pad are electrically connected to the bottom circuit board.

20. The power module as claimed in claim 14, wherein a plurality of the windings are connected in parallel with each other.

21. The power module as claimed in claim 14, wherein the power module further includes a plurality of input capacitors disposed on the upper surface and electrically connected to the plurality of switching devices.

22. The power module as claimed in claim 14, wherein the power module further includes a plurality of output capacitors and / or a plurality of loads disposed between the lower surface and the bottom circuit board, and the plurality of output capacitors and / or the plurality of loads are electrically connected to the bottom circuit board.

23. The power module as claimed in claim 14, wherein the current direction of the M first metal bodies is opposite to the current direction of the N second metal bodies.

24. The power module as claimed in claim 14, wherein the power module further includes a plurality of solder balls disposed on the surface of the bottom circuit board away from the inductor structure.

25. The power module as claimed in claim 24, wherein the bottom circuit board is electrically connected to a load, a motherboard, or a signal circuit through the surface on which the plurality of solder balls are disposed.

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