Electromagnetic wave-assisted polishing apparatus and polishing method thereof

Abstract

This invention provides an electromagnetic wave-assisted polishing device, comprising a polishing slurry output device, a plate, an electromagnetic wave element, and a polishing pad. The plate is disposed within the output device and has an electromagnetic wave-permeable material and a flow channel module. The electromagnetic wave element emits electromagnetic waves that penetrate the plate to act on a hydrogen peroxide-containing polishing slurry within the flow channel module. The hydrogen peroxide-containing polishing slurry, upon entering the flow channel module, is excited by the electromagnetic waves to form a free radical-containing polishing slurry, which then flows out to the polishing pad located below. This configuration significantly shortens the distance between the free radical generation site and the polishing interface, thereby improving polishing efficiency.

Claims

1. An electromagnetic wave-assisted polishing device, comprising: a polishing slurry output device; a plate disposed within the polishing slurry output device, wherein the plate comprises a material permeable to electromagnetic waves, and a flow channel module is formed within the plate, the flow channel module having an inlet and a plurality of outlets; an electromagnetic wave element disposed within the polishing slurry output device for emitting an electromagnetic wave that penetrates the plate and acts on a hydrogen peroxide-containing polishing slurry within the flow channel module; and at least one polishing pad disposed below the plate and adjacent to the plurality of outlets, wherein... After the hydrogen peroxide-containing polishing slurry enters the flow channel module through the inlet, it is excited by the electromagnetic wave in the flow channel module to form a polishing slurry containing free radicals, and then flows out to the polishing pad through the plurality of outlets.

2. The electromagnetic wave-assisted polishing apparatus as described in claim 1, wherein the plate is a quartz glass plate.

3. The electromagnetic wave-assisted polishing apparatus as described in claim 1, wherein the polishing liquid output device includes a sidewall portion and a top surface portion, wherein the sidewall portion and the top surface portion are made of metal.

4. The electromagnetic wave-assisted polishing apparatus as described in claim 3, wherein one of the polishing liquid output devices has an electromagnetic wave penetrating layer at its bottom, the electromagnetic wave penetrating layer allowing the electromagnetic wave to penetrate so that the electromagnetic wave can act on the polishing pad.

5. The electromagnetic wave-assisted polishing apparatus as claimed in claim 1, wherein the plate is formed by doping a substrate with at least one dopant.

6. The electromagnetic wave-assisted polishing apparatus as claimed in claim 1, wherein the path shape of the flow channel module includes at least one of spiral, meandering, straight, or branching.

7. The electromagnetic wave-assisted polishing apparatus as described in claim 1, wherein the electromagnetic wave element is disposed above the plate, on the side, or embedded in the plate.

8. The electromagnetic wave-assisted polishing apparatus as described in claim 1, wherein the material of the plate includes quartz glass, sapphire, calcium fluoride, ceramic materials, or combinations thereof.

9. The electromagnetic wave-assisted polishing apparatus as described in claim 1 further includes a rotating base and a polishing column, the polishing pad being disposed on the rotating base, and the polishing column being used to fix a wafer and press it against the polishing pad.

10. An electromagnetic wave-assisted polishing method, comprising: providing an electromagnetic wave-assisted polishing apparatus, wherein the electromagnetic wave-assisted polishing apparatus includes a polishing slurry output device, an electromagnetic wave element, a plate, a flow channel module, and at least one polishing pad, the flow channel module being formed inside the plate and including an inlet and a plurality of outlets; introducing a hydrogen peroxide-containing polishing slurry into the flow channel module through the inlet; generating an electromagnetic wave by the electromagnetic wave element, causing the electromagnetic wave to penetrate the plate and act on the hydrogen peroxide-containing polishing slurry within the flow channel module, so that the hydrogen peroxide-containing polishing slurry forms a free radical-containing polishing slurry within the flow channel module; causing the free radical-containing polishing slurry to flow through the plurality of outlets to a polishing interface between the polishing pad and a wafer; and polishing the wafer by means of the polishing pad and the free radical-containing polishing slurry.

11. The electromagnetic wave-assisted polishing method as described in claim 10, wherein the plate is a quartz glass plate, and the electromagnetic wave penetrates the quartz glass plate and acts on the hydrogen peroxide-containing polishing liquid in the flow channel module.

12. The electromagnetic wave-assisted polishing method as described in claim 11, wherein the quartz glass plate further comprises a dopant that increases the hardness or toughness of the quartz glass plate, and the electromagnetic wave can still penetrate the quartz glass plate and act on the hydrogen peroxide-containing polishing fluid within the flow channel module.

13. The electromagnetic wave-assisted polishing method as described in claim 10, wherein the electromagnetic wave is a microwave.

14. The electromagnetic wave-assisted polishing method as described in claim 10, wherein the hydrogen peroxide-containing polishing slurry is excited by the electromagnetic wave in the flow channel module inside the plate before entering the polishing interface.

15. The electromagnetic wave-assisted polishing method as described in claim 10, wherein the hydrogen peroxide-containing polishing slurry flows along a straight channel, a branch channel, a spiral channel, or a meandering channel.

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