Substrate processing method, and substrate processing apparatus and computer readable medium thereof

Abstract

The embodiments of this disclosure generally relate to apparatus and methods for processing substrates. In at least one embodiment, the apparatus includes a chamber body, a substrate support assembly, and a bracket assembly disposed outside the chamber body and coupled to the substrate support assembly. The bracket assembly has a plurality of leveling screws for adjusting the level of the substrate support assembly. The apparatus includes an actuator coupled to one of the plurality of leveling screws and an accelerometer coupled to the substrate support assembly. The accelerometer is configured to indicate the orientation of the substrate support assembly. The apparatus includes a control module in communication with the actuator and the accelerometer. The control module is configured to determine the level of the substrate support assembly based on the orientation indicated by the accelerometer and to adjust the level of the substrate support assembly using the actuator.

Description

[Technical Field]

[0001] The embodiments of this disclosure generally relate to apparatus and methods for processing a substrate in a semiconductor processing chamber having a substrate support assembly. More specifically, the embodiments relate to level monitoring and active adjustment of the substrate support assembly during processing. [Previous Technology]

[0002] Semiconductor processing systems are used to form semiconductor devices by deposition, etching, patterning, and processing thin films and coatings. Conventional semiconductor processing systems include one or more processing chambers and a robot for moving a substrate therein. The substrate can be transferred by a robotic arm that can extend to pick up the substrate, retract, and then extend again, placing the substrate at different locations within the same or different processing chambers. Each processing chamber typically has supports for supporting the substrate for processing.

[0003] Most semiconductor device formation processes are improved by increasing the uniformity of processes performed on the substrate surface. One of the parameters affecting the uniformity of deposition, etching, or thermal processing is the position of the substrate relative to one or more chamber components (such as a gas distribution plate) in the processing chamber during the process. However, conventional methods for adjusting the substrate position are time-consuming and have low throughput.

[0004] Therefore, the present technology requires an apparatus and method for adjusting the position of a substrate in a processing chamber. [Summary of the Invention]

[0005] The embodiments of this disclosure generally relate to apparatus and methods for processing a substrate in a semiconductor processing chamber having a substrate support assembly. More specifically, the embodiments relate to level monitoring and active adjustment of the substrate support assembly during processing.

[0006] In at least one embodiment, the substrate processing apparatus includes a chamber body and a substrate support assembly, the substrate support assembly including a rod and a support body. The support body is located in the chamber body and coupled to the rod. The apparatus includes a bracket assembly located outside the chamber body and coupled to the rod. The bracket assembly has a plurality of leveling screws for adjusting the level of the substrate support assembly. The apparatus includes an actuator coupled to one of the plurality of leveling screws and an accelerometer coupled to the substrate support assembly. The accelerometer is configured to indicate the orientation of the substrate support assembly. The apparatus includes a control module in communication with the actuator and the accelerometer. The control module is configured to determine the level of the substrate support assembly based on the orientation indicated by the accelerometer and to adjust the level of the substrate support assembly using the actuator.

[0007] In at least one embodiment, a computer-readable medium stores instructions that, when executed by a processor of the system, cause the system to: receive a signal from an accelerometer coupled to a substrate support assembly, wherein: the substrate support assembly includes a rod and a support body, the support body being located in a chamber body and coupled to the rod, the rod being coupled to a bracket assembly disposed outside the chamber body, and the signal corresponding to a three-dimensional orientation of the substrate support assembly; determine, based on the signal, an adjustment to the substrate support assembly to change the actual level of the substrate support assembly to a target level; and adjust the actual level of the substrate support assembly to the target level using an actuator configured to actuate one or more of a plurality of leveling screws of the bracket assembly, wherein the processor communicates with the actuator and the accelerometer.

[0008] In at least one embodiment, a substrate processing method for processing a substrate disposed on a substrate support assembly is disclosed. The substrate support assembly includes a rod and a support body, the support body being located in a chamber body and coupled to the rod, the rod being coupled to a bracket assembly disposed outside the chamber body. The method includes: receiving a signal from an accelerometer coupled to the substrate support assembly, wherein the signal corresponds to a three-dimensional orientation of the substrate support assembly; determining an adjustment to the substrate support assembly to change the actual level of the substrate support assembly to a target level; and adjusting the actual level of the substrate support assembly to the target level by rotating one or more of a plurality of aligning screws of the bracket assembly using an actuator, wherein receiving the signal, determining the adjustment, and adjusting the actual level are performed by a control module communicating with the actuator and the accelerometer.

Implementation Method

[0017] The embodiments of this disclosure generally relate to apparatus and methods for processing a substrate in a semiconductor processing chamber having a substrate support assembly. More specifically, the embodiments relate to level monitoring and active adjustment of the substrate support assembly during processing.

[0018] The apparatus and method disclosed herein can provide improved control over film thickness and etching uniformity on and between substrates. Furthermore, the apparatus and / or method disclosed herein can better accommodate substrate non-uniformity introduced onto the substrate. Additionally, the apparatus and method disclosed herein can reduce process downtime and improve yield.

[0019] The support disclosed herein can be adjusted during processing, unlike conventional methods which require the chamber to be offline. Conventionally, once the processing chamber is in production, the tilt and position of the base relative to one or more chamber components (such as a gas distribution plate) are not adjusted. As used herein, the base level refers to the tilt of the base, measured by the parallelism between the base's substrate receiving surface and the gas distribution plate. Currently, when the substrate is offline, the tilt and position of the base are manually adjusted. To make accurate adjustments, the processing chamber is offline and opened, allowing a leveling die to be placed in the processing chamber to measure the tilt of the base relative to the gas distribution plate. The base can be adjusted without taking the processing chamber offline; this is called closed adjustment or thermal leveling. However, closed adjustment is based solely on measurements of the processed substrate and does not provide quantitative measurements of changes in tilt or the resulting level. However, some processing operations in the semiconductor device manufacturing sequence cannot achieve high uniformity of the material on the substrate, thus requiring adjustments between processing operations to improve the uniformity of subsequent operations. To ensure optimal process results, each process can utilize an independently tuned base tilt and position relative to the gas distribution plate, thereby reducing throughput.

[0020] For illustrative and explanatory purposes, the embodiments of this disclosure are described with reference to a "substrate" or semiconductor substrate. Those skilled in the art will understand that the exemplary embodiments of this disclosure can be used in conjunction with any suitable semiconductor substrate or other suitable substrate. "Substrate support assembly" refers to any structure that can be used to support a substrate.

[0021] Exemplary embodiments of the present disclosure will now be described with reference to the accompanying drawings. Figure 1A illustrates an exemplary processing apparatus 100 that can be used to perform a portion of a semiconductor device processing operation according to one embodiment of the disclosure provided herein. Referring to Figure 1A, the processing apparatus 100 may include a processing chamber 102 having a substrate support assembly 120 for lifting and placing a substrate within the processing chamber 102. The substrate support assembly 120 generally includes a support 130 for receiving the substrate and a rod 140 for placing the support 130 within the processing chamber 102. The disclosed substrate support assembly 120 is configured to provide heating or cooling of the substrate during processing. During processing, the substrate may be held on the support 130 by mechanical, differential pressure, or electrostatic forces. While on the support 130, one or more processes may be performed on the substrate, including deposition, etching, and / or thermal processing of films formed on the substrate. The substrate support assembly 120 is described in more detail below.

[0022] Processing chamber 102 is configured to enclose a substrate in a controlled environment during processing. Processing chamber 102 includes an outer chamber wall 104, a lower chamber base 106, and a cover 108 located on top of processing chamber 102 and opposite to base 106. Base 106, cover 108, and wall 104 are collectively referred to herein as chamber body. Processing chamber 102 includes a gas distribution plate 180 suspended from cover 108 and projecting downward into processing chamber 102. Slit valve opening 105 in wall 104 allows the introduction of objects such as substrates or wafers (not shown) into processing chamber 102.

[0023] A substrate can be placed within the processing chamber 102 and mounted on the support 130 in preparation for processing. A gas supply source 190 supplies one or more process gases to the processing region 103 via an opening 191 in the cover 108 and an opening 181 in the gas distribution plate 180. In one example, the processing chamber 102 represents a chemical vapor deposition (CVD) chamber. However, other processing chambers and processes may be present, such as etching processes, atomic layer deposition processes, rapid thermal processes, plasma doping processes, physical vapor deposition processes, and other processes that utilize a base within the processing chamber for movement.

[0024] A substrate support assembly 120 is disposed within a processing chamber 102 and configured to control the orientation of the substrate relative to one or more chamber components (such as a gas distribution plate 180) within the processing chamber 102. The substrate processing assembly 120 is coupled to a hub 122 and is accessible from outside the processing chamber 102 during processing and / or when the processing chamber 102 is closed. A flexible sealing member 192, such as a bellows assembly, seals the processing area 103 within the processing chamber 102 from the area outside the processing chamber 102. The sealing member 192 provides a seal between the substrate support assembly 120 and the processing chamber 102 and allows the processing area 103 to be maintained at a desired pressure, such as a vacuum pressure.

[0025] The rod 140 of the substrate support assembly 120 extends from its proximal end, which is attached to the hub 122, to its distal end, which is attached to the lower surface of the support body 130. The upper surface of the support body 130 is opposite to the lower surface and is configured to receive the substrate thereon. Therefore, the upper surface 132 of the support body 130 may be referred to as the substrate receiving surface. The support body 130 is generally adapted to move vertically in a direction parallel to the central axis 101 (e.g., parallel to the axis of the rod 140), which extends through the chamber opening 107 in the base 106.

[0026] Heating or cooling of the substrate support assembly 120 may be required to control the temperature of the substrate received on the support 130. In one example, the substrate support assembly 120 includes one or more heating elements (not shown) for heating the support 130 and the substrate. In another example, the substrate support assembly 120 includes conduits (not shown) for carrying heating or cooling fluids to heat or cool the support 130 and the substrate, respectively. Monitoring of one or more parameters associated with the substrate support assembly 120 may also be required. In one example, the substrate support assembly 120 includes thermocouples (not shown) for sensing the temperature of the support 130. In such examples, electrical leads and / or conduits extend to the support 130 via the hub 122 and the rod 140 of the substrate support assembly 120. Therefore, the rod 140 includes one or more internal channels (not shown) that exit the proximal end of the rod 140 through respective outlets formed therein. Thus, power is supplied to the electrical leads via the hub 120 and coupled to the control module 160 for activating the heating element and / or the self-thermocouple receiving the signal. Similarly, the piping is fluidly coupled to a heating or cooling fluid source.

[0027] A frame 142 is used to couple the substrate support assembly 120 to a bracket assembly 111 located outside the chamber body. As shown in Figure 1A, the frame 142 includes one or more vertical supports 144 coupled to the bracket assembly 111 and one or more horizontal supports 146 coupled to the rod 140 of the substrate support assembly 120. One or more horizontal supports 146 are attached to the rod 140 at a location between the hub 122 and the sealing member 192. However, in another embodiment, the frame 142 may be attached to the hub 122 or to different locations on the rod 140. It is contemplated that the frame 142 be welded, bolted, or otherwise secured to the bracket assembly 111 and the rod 140. As described in more detail below, the bracket assembly 111, the frame 142, and the substrate support assembly 120 are fixed together and movable relative to the processing chamber 102.

[0028] Figure 1B is an enlarged partial cross-sectional view of the substrate processing apparatus of Figure 1A, illustrating the bracket assembly 111 in more detail. Therefore, for clarity, Figures 1A and 1B are described together. The bracket assembly 111 includes a bracket 110 having a plurality of quasi-flat holes 112 formed therethrough. Although only two quasi-flat holes are shown in Figure 1A, it is contemplated that the bracket 110 may include additional quasi-flat holes, such as three or more. It is contemplated that the shape of the bracket 110 when viewed from above may be triangular, square, rectangular, trapezoidal, or other shapes. It is contemplated that one quasi-flat hole 112 may be formed at each vertex of the bracket 110. Each of the plurality of quasi-flat holes 112 extends parallel to each other from the bottom side of the bracket 110 (accessible from below the bracket 110) to the top side of the bracket 110 (facing the base 106 of the processing chamber 102). Each of the plurality of flat-face screws 112 is threaded for receiving the respective threaded flat-face screws passing through it.

[0029] The proximal end of each aligning screw 114 is coupled to the shaft 152 of a respective actuator 150 (e.g., a stepper motor) for rotating the aligning screw 114. The body 154 of the actuator 150 is coupled to the lower surface 109 of the base 106 for abutting the body 154 against the rotation of the shaft 152. When using a stepper motor, the shaft 152 of the stepper motor is configured to rotate a fixed angle between a plurality of incremental rotational positions, allowing the aligning screw 114 to be rotated incrementally for precisely raising and lowering the height of the bracket 110. The height of the bracket 110 is maintained until the actuator 150 is further adjusted. The rotational position of the stepper motor is stored in the memory of a control module 160, which enables fine-tuning of the position of the aligning screw 114.

[0030] In operation, rotation of each leveling screw 114 relative to the respective leveling hole 112 causes the bracket 110 to move longitudinally relative to the leveling screw 114. This longitudinal movement pushes the bracket 110 toward or pulls the bracket away from the base 106, resulting in a relative change in the distance between the bracket 110 and the base 106. This change in distance between the bracket 110 and the base 106 adjusts the orientation (e.g., tilt) of the substrate support assembly 120 relative to the central axis 101. The tilt of the substrate support assembly 120 causes the substrate receiving surface 132 of the support 130 to tilt relative to the gas distribution plate 180. Adjusting the plurality of leveling screws 114 changes the tilt of the substrate support assembly 120 in three dimensions and the resulting level. The maximum tilt of the substrate support assembly 120 is envisioned to be about 0.5 inches or less, for example about 0.4 inches or less, for example about 0.3 inches or less, for example about 0.2 inches or less, for example about 0.1 inches or less, for example about 0.1 inches to about 0.4 inches, for example about 0.1 inches to about 0.2 inches, for example about 0.1 inches.

[0031] A plurality of actuators 150 receive commands from a control module 160. Referring to Figure 1A, the control module 160 is positioned on the lower surface 109 of the base 106. However, it is contemplated that the control module 160 may be located at other locations on the processing unit 100, referred to as on-board positioning. For example, it is contemplated that the control module 160 may be located on the bracket assembly 111 or coupled to the hub 122. It is also contemplated that the control module 160 may be separate from the processing unit 100, referred to as off-board positioning. The control module 160 is a dedicated controller that sends commands to the plurality of actuators 150 to control the tilting of the base plate support assembly 120, which will be described in more detail below. The control module 160 may include the same components as the system controller 199 (described in more detail below). Thus, it is also contemplated that the control module 160 may be integrated with the system controller 199.

[0032] System controller 199 is configured to control one or more states of processing device 100. System controller 199 may include central processing unit (CPU) 199A, memory 199B, and support circuitry (or I / O) 199C. CPU 199A may be one of any type of computer processor used in industrial settings to control various processes and hardware (e.g., graphics generators, motors, and other hardware) and monitor processes (e.g., processing time and substrate position or positioning). Memory 199B is connected to CPU and may be one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of local or remote digital storage. Software instructions, algorithms, and data may be encoded and stored in memory to issue instructions to the CPU. Support circuitry 199C is also connected to CPU to support the processor in a conventional manner. Supporting circuitry may include conventional caches, power supplies, clock circuits, input / output circuit systems, subsystems, and the like. A program (or computer instructions) readable by the controller determines the tasks that can be performed on the board. The program may be readable by controller software and may include codes that monitor and control, for example, processing time and board position or location.

[0033] Referring to Figure 1A, the accelerometer 170 may be housed in a rod 140 of the substrate support assembly 120. Placing the accelerometer in the rod 140 protects the accelerometer 170 from potentially damaging chemicals present during substrate processing. It is envisioned that the accelerometer 170 may be inserted through a hole (not shown) in the proximal end of the rod 140. This allows for maintenance and replacement of the accelerometer 170 without exposing the process area 103 to the atmosphere. However, it is envisioned that the accelerometer 170 may be coupled to or embedded in any part of the substrate support assembly 120 (such as the support 130). It is envisioned that the accelerometer 170 may have a coating that protects the accelerometer 170 from corrosion and / or electrical failure upon exposure to potentially damaging process chemicals. As shown in Figure 1A, the accelerometer 170 is wirelessly connected to the control module 160. However, in another embodiment, the accelerometer 170 may be hardwired to the control module 160. Accelerometer 170 communicates with and is configured to send signals to control module 160 indicating the three-dimensional orientation of accelerometer 170 and the corresponding tilt of substrate support assembly 120. For example, the accelerometer may be a capacitive triaxial accelerometer whose output corresponds to the voltage along each of the three axes of accelerometer orientation. Before bringing processing device 100 online, accelerometer 170 is calibrated using a sizing die to determine the orientation / tilt of accelerometer 170 and substrate support assembly 120 relative to support body 130. Thus, by detecting changes in the tilt of substrate support assembly 120 when adjusting a plurality of sizing screws 114, control module 160 can be operated to monitor the level of support body 130 in real time, as described in more detail below.

[0034] Figures 1C to 1F are partial isometric views of the substrate processing apparatus 100 of Figure 1A, illustrating the tilt of the substrate support assembly 120 in three dimensions. In Figures 1C to 1F, the bracket 110 is triangular in shape when viewed from above. Generally, the bracket assembly 110 includes adjustable first leveling screws 114a and second leveling screws 114b, and a fixed fixing screw 124. The fixing screw 124 can be manually adjusted using a nut 126 by rotating the first and second leveling screws 114a and 114b using actuators 150a and 150b. Although the bracket assembly 110 has two leveling screws and one fixing screw, this disclosure contemplates other numbers and combinations of leveling and fixing screws. For example, when the bracket 110 is trapezoidal in shape, the bracket assembly 111 is contemplated to include two leveling screws, one fixing screw, and one floating screw. The term "floating screw" refers to a structure similar to the fixed screw 124, wherein the difference is that a gap is provided between each of the nuts 126 and the bracket 110 to allow the bracket to float relative to the floating screw. It is also envisioned that although the bracket assembly 111 may have any number of leveling, fixed, and floating screws, only two leveling screws are needed to tilt the substrate support assembly 120 in three dimensions.

[0035] Referring to Figure 1C, the substrate support assembly 120 is tilted counterclockwise about the first axis 134 by rotating the first alignment screw 114a counterclockwise as shown. The first alignment screw 114a is rotated by the first actuator 150a. During the rotation of the first alignment screw 114a, the bracket 110 moves downward longitudinally relative to the first alignment screw 114a, pushing the bracket 110 away from the base 106, as described in detail above. When the bracket 110 is pushed downward away from the base 106, the substrate support assembly 120 is tilted in the direction shown in Figure 1C. The tilt point is aligned with the apex of the bracket 110, wherein the first alignment screw 114a engages with the respective alignment holes 112 (shown in Figure 1B). Rotating the first leveling screw 114a in the opposite direction (i.e., clockwise) pushes the bracket 110 toward the base 106 and causes the substrate support assembly 120 to tilt in the opposite direction (i.e., clockwise) around the first axis 134 shown in Figure 1D.

[0036] Referring to Figure 1E, the substrate support assembly 120 is tilted clockwise about the second axis 136 by rotating the second alignment screw 114b counterclockwise as shown. It is conceivable that the second axis 136 can be oriented at any suitable angle relative to the first axis 134 based on the shape of the bracket 110. For example, it is conceivable that when the bracket 110 is in the shape of an equilateral triangle, the first axis 134 and the second axis 136 can be oriented approximately 60 degrees apart. The second alignment screw 114b is rotated by the second actuator 150b. During the rotation of the second alignment screw 114b, the bracket 110 moves downward longitudinally relative to the second alignment screw 114b, pushing the bracket 110 away from the base 106, as described in detail above. When the bracket 110 is pushed downward away from the base 106, the substrate support assembly 120 is tilted in the direction shown in Figure 1E. The tilting point is aligned with the apex of the bracket 110, wherein the second leveling screw 114b engages with each leveling hole 112 (shown in Figure 1B). Rotating the second leveling screw 114b in the opposite direction (i.e., clockwise) pushes the bracket 110 toward the base 106 and tilts the substrate support assembly 120 about the second axis 136 shown in Figure 1F in the opposite direction (i.e., clockwise). If necessary, adjusting the first leveling screw 114a and the second leveling screw 114b changes the level of the substrate support assembly 120 in three dimensions.

[0037] Figure 2 is an illustration of an automated control mechanism 200 that can be used to control the substrate support assembly 120. In the example illustrated in Figure 2, the control module 160 includes a control algorithm 210 that receives input from an accelerometer 170, automated process control software 220, and driver electronics 230 associated with a plurality of actuators 150. The accelerometer 170 provides signals to the control algorithm 210, the signals indicating the three-dimensional orientation of the accelerometer 170 as described above. For example, the signals may include continuous analog or digital voltage readings corresponding to the orientation of the accelerometer 170 along each of the three axes. The automated process control software 220 provides automated control instructions to the control algorithm 210. For example, the automated control instructions may include instructions to execute the control algorithm 210 without external input from a user. Based on signals received by the accelerometer 170 and / or automation control commands received by the automated process control software 220, the control algorithm 210 determines the adjustments required to one or more of the plurality of actuators 150 to move the substrate support assembly 120 to a target level. The control algorithm 210 outputs commands to the driver electronics 230 to actuate one or more of the plurality of actuators 150 to move the substrate support assembly 120. During actuation, the driver electronics 230 provides feedback to the control algorithm 210 regarding the rotational position of each actuator 150. The control algorithm 210 determines when the adjustments to one or more of the plurality of actuators 150 are complete based on the feedback and / or other inputs. It is conceivable that the control algorithm 210 may use a control loop to output further commands to one or more of the plurality of actuators 150 to fine-tune the position of each leveling screw 114 and the resulting level of the substrate support assembly 120.

[0038] Figure 3 is a diagram of a method 300 for processing a substrate using the processing apparatus of this disclosure. Instructions for method 300 can be stored on a computer-readable medium of control module 160 or system controller 199. Method 300 includes introducing a substrate 310 into a processing chamber 30 of processing apparatus 100. For example, the substrate is introduced through a slit valve 105 in wall 104 and placed on a second side 132 (shown in Figure 1A) of support 130. Method 300 further includes determining a target alignment of substrate support assembly 120. It is conceivable that the target alignment of the substrate to be processed can be predetermined based on the results of a previous process. For example, the target alignment of substrate support assembly 120 can be the desired tilt of support 130, measured by a parallelism measurement between substrate receiving surface 132 of support 130 and gas distribution plate 180 (shown in Figure 1A). While the desired parallelism depends on the processing application, it is envisioned that the tilt of the support 130 can be precisely controlled within about five-thousandths of an inch or less, for example, about three-thousandths of an inch or less, or about one-thousandth of an inch or less. It is envisioned that the tilt of the support 130 is such that the substrate receiving surface 132 of the support 130 is substantially parallel to the gas distribution plate 180. Alternatively or additionally, the predetermined tilt of the support 130 is such that the top surface of the support 130 (on which the substrate is placed) is substantially parallel to the lower surface of the gas distribution plate 180. The term "substantially parallel" as used herein refers to a surface that is within about ten-thousandths of an inch of parallelism. Generally, it is envisioned that the desired tilt of the support 130 allows for uniform application of the process on the surface of the substrate.

[0039] Method 300 further includes receiving 330 signals from accelerometer 170 corresponding to the three-dimensional orientation of substrate support assembly 120. For example, the signals from accelerometer 170 may include continuous analog or digital voltage readings corresponding to the orientation of accelerometer 170 along each of three axes. Based on calibration of the level of substrate support assembly 120 relative to the orientation of accelerometer 170 of gas distribution plate 180, the signals from accelerometer 170 may indicate that the actual level of substrate support surface 120 differs from a target level. Method 300 further includes determining 340 an adjustment of substrate support assembly 120 to change the actual level to the target level. Based on the signals from accelerometer 170 indicating the three-dimensional orientation of substrate support assembly 120, control module 160 is configured to determine the adjustment based on the difference between the actual level and the target level. Based on calibration data, combined with known tilt of substrate support assembly 120 with respect to the rotational positions of a plurality of leveling screws 114, the adjustment of substrate support assembly 120 is determined. Method 300 further includes adjusting the actual level of the substrate support assembly 120 to a target level by 350. The level of the substrate support surface 120 is adjusted using a plurality of actuators 150 described above. It is envisioned that the actual level can be determined by a control module 160, the actual level can be determined by 320, a signal can be received by 330, the adjustment can be determined by 340, and the actual level can be adjusted by 350. It is envisioned that method 300 can be automatically implemented using preset instructions.

[0040] Figure 4 is a diagram of a method 400 for processing a substrate using the processing apparatus of this disclosure. Method 400 illustrates an exemplary implementation of feedforward and feedback control. However, it is contemplated that only feedforward or feedback control may be used. Referring to Figure 4, method 400 includes in-line metering operation 410, process 420, and in-line metering operation 430. It is contemplated that method 400 for processing a substrate may include one or more additional processes before or after process 420. It is contemplated that processes may include any suitable semiconductor substrate manufacturing processes, including but not limited to deposition, etching, thermal treatment, cleaning, or polishing. It is contemplated that process 420 may use the apparatus and / or methods disclosed herein.

[0041] In-line metrology operations 410 and 430 before and after process 420 provide quantitative measurements of one or more properties of the substrate. For example, the results of the previous process on the substrate can be determined based on properties such as thickness, resistivity, dielectric constant, and / or refractive index. During feedforward control, process 420 is controlled at least in part based on the measurement results of in-line metrology operation 410. It is envisioned that feedforward control can use the measurement results of any metrology operation prior to process 420.

[0042] Typically, approximately 5 to 25 substrates are processed in a batch. Due to batch-to-batch variations, introduced batches may sometimes have different characteristics, which can be quantified during inline metrology operation 410. Similarly, variations between substrates within the same batch (sometimes referred to as wafer-to-wafer or wafer-to-wafer variations) can be quantified during inline metrology operation 410. For example, inline metrology operations 410, 430 measure thickness differences (e.g., using eddy current sensors or optical measurements), unevenness of material layers, defects, and other causes of inhomogeneity. During feedforward control, the measurement results of inline metrology operation 410 are input to process 420 to control the level of substrate support assembly 120 to compensate for inhomogeneities introduced into the substrate. For example, it is envisioned that the measurement results of inline metrology operation 410 can be used to determine a target level of substrate support assembly 120 as described in reference method 300. In a particular instance, inline metrology operation 410 measures the substrate thickness obtained after a previous process. The thickness can be determined by the thickness of the deposited material, the thickness of the removed material, and / or the thickness of the bottom side of the substrate. Therefore, the thickness difference between batches or between substrates can be accommodated in process 420 by controlling the level of the substrate support assembly 120 described above.

[0043] During feedback control, process 420 is controlled at least in part based on the measurement results of inline metrology operation 430. It is envisioned that feedback control can utilize the measurement results of any metrology operation following process 420. For example, inline metrology operation 430 measures the properties of the substrate obtained after process 420. During feedback control, the measurement results of inline metrology operation 430 are input to process 420 to fine-tune the level of substrate support assembly 120. For example, as described with reference to method 300, it is envisioned that the measurement results of inline metrology operation 430 can be used to determine a target level of substrate support assembly 120 and / or to determine adjustments to substrate support assembly 120 to change the actual level to the target level.

[0044] It is envisioned that during feedforward and feedback control, the level of the substrate support assembly 120 can be adjusted such that the top surface of the support 130 (and thus the substrate placed thereon) is substantially parallel to the lower surface of the gas distribution plate 180. Alternatively or additionally, it is envisioned that during feedforward and feedback control, the level of the substrate support assembly 120 can be adjusted to correct for non-uniformity in the substrate shape and / or morphology.

[0045] It is envisioned that the apparatus and / or methods disclosed herein can be adjusted using a flat or blanket substrate without patterns or a test substrate with test structures. For example, adjustments can be made before bringing a new processing unit online or before returning it to production after maintenance. Although described in relation to substrate processing, it is also envisioned that the apparatus and / or methods disclosed herein can be used to help set the processing unit to certain baseline conditions.

[0046] As used herein, the terms “inner” and “outer”; “upper” and “lower”; “upper part” and “lower part”; “top” and “bottom”; “vertical” and “horizontal”; “upward” and “downward”; “above” and “below”, and other terms used herein, refer to their relative positions to each other and are not intended to indicate a particular orientation or spatial orientation of the overall source / device. Unless otherwise indicated, the terms “coupled” and “coupled to” mean “directly coupled” or “coupled via one or more intermediate elements or components”.

[0047] Although the above description relates to the embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from the basic scope of this disclosure. [Simplified Explanation of the Diagram]

[0009] To understand in detail the above-described features of this disclosure, the disclosure briefly outlined above can be described more specifically with reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings are merely illustrative embodiments and should therefore not be considered as limiting the scope; the disclosure acknowledges other equivalent embodiments.

[0010] Figure 1A is a cross-sectional side view of a substrate processing apparatus according to at least one embodiment.

[0011] Figure 1B is an enlarged partial cross-sectional view of the substrate processing apparatus in Figure 1A.

[0012] Figures 1C to 1F are partial isometric schematic diagrams of the substrate processing apparatus of Figure 1A according to at least one embodiment, wherein the figures illustrate the tilt of the substrate support assembly in three dimensions.

[0013] Figure 2 is a diagram of an exemplary automated control mechanism according to at least one embodiment.

[0014] Figure 3 is a diagram of a method for processing a substrate using the processing apparatus of this disclosure according to at least one embodiment.

[0015] Figure 4 is a diagram of a method for processing a substrate using the processing apparatus of this disclosure according to at least one embodiment.

[0016] For ease of understanding, the same component symbols are used as much as possible to indicate common and identical elements in the figures. It is contemplated that elements and features of one embodiment may be advantageously included in other embodiments without further description. [Biomaterial Storage]

[0049] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A substrate processing apparatus comprising: a chamber body; a substrate support assembly including a rod and a support body, the support body being located in the chamber body and coupled to the rod; a bracket assembly located outside the chamber body and coupled to the rod, the bracket assembly having a plurality of leveling screws for adjusting a level of the substrate support assembly; an actuator coupled to one of the plurality of leveling screws, the actuator including driver electronics; an accelerometer coupled to the substrate support assembly and disposed inside the rod of the substrate support assembly, wherein the accelerometer is configured to indicate a certain orientation of the substrate support assembly; and a control module communicating with the actuator and the accelerometer, wherein the control module includes: automated process control software and a control algorithm, and is configured to: automatically adjust the level of the substrate support assembly to a target level using the actuator when the chamber body is closed during processing, by means of the following steps: The control algorithm receives automation control commands from the automated process control software and signals from the accelerometer; the control algorithm determines the position of the substrate support assembly based on at least one of the orientation indicated by the signal from the accelerometer or the automation control commands from the automated process control software; and the control algorithm transmits commands to the driver electronics to drive the actuator to move the substrate support assembly to the target position.

2. The substrate processing apparatus as described in claim 1, wherein the actuator is a stepper motor.

3. The substrate processing apparatus as claimed in claim 1, wherein the actuator is a first actuator among a plurality of actuators, and wherein each of the plurality of leveling screws is adjusted independently by one of the plurality of actuators.

4. The substrate processing apparatus as claimed in claim 1, wherein the level of the substrate support assembly is determined relative to a gas distribution plate located within the chamber body.

5. The substrate processing apparatus as claimed in claim 4, wherein adjusting the level of the substrate support assembly includes making an upper surface of the support substantially parallel to a lower surface of the gas distribution plate.

6. The substrate processing apparatus as claimed in claim 1, wherein the bracket assembly includes a bracket that, when viewed from above, is at least one of a triangle, a square, a rectangle, or a trapezoid, and wherein the plurality of leveling screws are adjustable relative to the bracket.

7. The substrate processing apparatus as claimed in claim 1, wherein the accelerometer is a capacitive triaxial accelerometer.

8. The substrate processing apparatus as claimed in claim 7, wherein the accelerometer outputs a voltage corresponding to a certain direction of the accelerometer along each of the three axes.

9. A computer-readable medium storing instructions that, when executed by a processor of a system, cause the system to perform the following operations: receiving, via a control algorithm, automation control instructions from automated process control software and a signal from an accelerometer coupled to a substrate support assembly, the signal corresponding to a three-dimensional orientation of the substrate support assembly, wherein the substrate support assembly includes a rod, a bracket assembly, and a support body located in a chamber body of the system and coupled to the rod, the rod including the accelerometer, the rod being coupled to a bracket assembly disposed outside the chamber body, the bracket assembly including an actuator; The control algorithm determines the level of the substrate support assembly based on the signal from the accelerometer, and determines an adjustment of the substrate support assembly based on the signal to change an actual level of the substrate support assembly to a target level; and uses an actuator including driver electronics and configured to actuate one or more of the collimating screws of the bracket assembly to adjust the actual level of the substrate support assembly to the target level, wherein the processor communicates with the actuator and the accelerometer, wherein the computer-readable medium stores the control algorithm and automated process control software thereon, and wherein the control algorithm transmits instructions to the driver electronics to drive the actuator to move the substrate support assembly to the target level.

10. The computer-readable medium as claimed in claim 9, wherein the actual level of the substrate support assembly is adjusted when the chamber body is closed during processing.

11. The computer-readable medium as claimed in claim 9, wherein the actuator is a first actuator among a plurality of actuators, and wherein using the first actuator to actuate a first of a plurality of leveling screws adjusts the actual position of the substrate support assembly about a first axis, the computer-readable medium further comprising instructions to cause the system to use a second actuator among a plurality of actuators to actuate a second of a plurality of leveling screws to adjust the actual position of the substrate support assembly about a second axis oriented at an angle different from the first axis.

12. The computer-readable medium as claimed in claim 9, wherein determining the actual level of the substrate support assembly relative to a gas distribution plate located in the chamber body, and wherein adjusting the actual level of the substrate support assembly to the target level comprises making an upper surface of the support substantially parallel to a lower surface of the gas distribution plate.

13. The computer-readable medium as described in claim 9, further comprising instructions to cause the system to determine the target level of the substrate support assembly based on the results of a previous process.

14. A substrate processing method for processing a substrate disposed on a substrate support assembly comprising a rod, a bracket assembly, and a support body, the support body being located in a chamber body and coupled to the rod, the rod comprising an accelerometer, the rod being coupled to the bracket assembly disposed outside the chamber body, the bracket assembly comprising an actuator, the method comprising the steps of: receiving an automation control command from automated process control software and a signal from the accelerometer coupled to the substrate support assembly via a control algorithm, wherein the signal corresponds to a three-dimensional orientation of the substrate support assembly; The control algorithm determines the level of the substrate support assembly based on the signal from the accelerometer, and determines an adjustment to the substrate support assembly to change an actual level of the substrate support assembly to a target level; and adjusts the actual level of the substrate support assembly to the target level by rotating one or more of a plurality of leveling screws of the bracket assembly using an actuator including driver electronics, wherein the signal is received, the adjustment is determined, and the actual level is adjusted by a control module communicating with the actuator and the accelerometer, the control module including the control algorithm and automated process control software, and wherein the control algorithm transmits instructions to the driver electronics to drive the actuator to move the substrate support assembly to the target level.

15. The substrate processing method as described in claim 14, wherein the actual level of the substrate support assembly is adjusted when the chamber body is closed during processing.

16. The substrate processing method of claim 14, wherein the actuator is a first actuator among a plurality of actuators, and wherein rotating a first of a plurality of leveling screws using the first actuator adjusts the actual position of the substrate support assembly about a first axis, the substrate processing method further comprising the step of: rotating a second of a plurality of leveling screws using a second actuator to adjust the actual position of the substrate support assembly about a second axis oriented at an angle different from the first axis.

17. The substrate processing method of claim 14, wherein determining the actual level of the substrate support assembly relative to a gas distribution plate located in the chamber body, and wherein adjusting the actual level of the substrate support assembly to the target level comprises the step of: making an upper surface of the support substantially parallel to a lower surface of the gas distribution plate.

18. The substrate processing method as described in claim 14, further comprising the step of: determining the target level of the substrate support assembly based on the results of a previous process.

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