Semiconductor devices and methods of manufacturing semiconductor devices

Abstract

In one example, a semiconductor device includes a substrate having a top side, a bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to the top side of the substrate. An antenna structure includes an antenna dielectric structure coupled to the top side of the substrate, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element covers the transceiver pattern. The cavity includes a cavity top, a cavity base, and cavity sidewalls between the cavity top and the cavity base. The bottom surface of the antenna element defines the cavity top, and a peripheral portion of the antenna element is fixed to the antenna dielectric structure; alternatively, the antenna dielectric structure includes a body portion having a bottom surface defining the cavity top, and the antenna element is perpendicularly spaced from the bottom surface of the body portion. A semiconductor assembly is coupled to the bottom side of the substrate and to the transceiver pattern. Other examples and related methods are also disclosed herein.

Description

[Technical Field]

[0001] This disclosure generally relates to electronic devices, and more specifically to semiconductor devices and methods of manufacturing semiconductor devices. [Previous Technology]

[0002] Background Technology

[0003] Existing semiconductor packaging techniques and methods for forming semiconductor packages have shortcomings, such as resulting in excessively high costs, reduced reliability, relatively low performance, or excessively large package sizes. Other limitations and disadvantages of conventional and traditional methods will become apparent to those skilled in the art by comparing such methods with this disclosure and referring to the accompanying drawings. [Summary of the Invention]

[0004] In one example, an electronic device includes a substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure. The first conductive structure includes a transceiver pattern proximate to the top side of the substrate. An antenna structure includes a second dielectric structure coupled to the top side of the substrate, a second conductive structure having a first antenna element, and a first cavity below the first antenna element. The first antenna element covers the transceiver pattern. The first cavity includes a first cavity top, a first cavity base, and a first cavity sidewall between the first cavity top and the first cavity base. The bottom surface of the first antenna element defines the first cavity top, and a peripheral portion of the first antenna element is fixed to the second dielectric structure, or the second dielectric structure includes a body portion having a bottom surface defining the first cavity top, and the first antenna element is perpendicularly spaced from the bottom surface of the body portion. An electronic component is coupled to the bottom side of the substrate and to the transceiver pattern.

[0005] In one example, an electronic device includes a substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure. The first conductive structure includes a transceiver pattern proximate to the top side of the substrate. An antenna structure is coupled to the top side of the substrate and includes a second dielectric structure, a second conductive structure, and a cavity. The second conductive structure includes a first antenna element and a second antenna element overlapping the first antenna element. At least a portion of the first antenna element is embedded within the second dielectric structure. The first and second antenna elements cover the transceiver pattern. The cavity includes a cavity top, a cavity base, and cavity sidewalls between the cavity top and the cavity base. An electronic component is coupled to the bottom side of the substrate and to the transceiver pattern.

[0006] In an example, a method of forming an electronic device includes providing a substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure, the first conductive structure including a transceiver pattern proximate to the top side of the substrate. The method includes: providing an antenna structure having a second dielectric structure coupled to the top side of the substrate, a second conductive structure including an antenna element; and a cavity below the first antenna element. At least a portion of the first antenna element is exposed outside the electronic device, the first antenna element covering the transceiver pattern; and the cavity includes a cavity top, a cavity base, and cavity sidewalls between the cavity top and the cavity base. The method includes providing an electronic component coupled to the bottom side of the substrate and coupled to the transceiver pattern.

Implementation Method

[0023] In one example, an electronic device includes a substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure. The first conductive structure includes a transceiver pattern proximate to the top side of the substrate. An antenna structure includes a second dielectric structure coupled to the top side of the substrate, a second conductive structure having a first antenna element, and a first cavity below the first antenna element. The first antenna element covers the transceiver pattern. The first cavity includes a first cavity top, a first cavity base, and a first cavity sidewall between the first cavity top and the first cavity base. The bottom surface of the first antenna element defines the first cavity top, and a peripheral portion of the first antenna element is fixed to the second dielectric structure, or the second dielectric structure includes a body portion having a bottom surface defining the first cavity top, and the first antenna element is perpendicularly spaced from the bottom surface of the body portion. An electronic component is coupled to the bottom side of the substrate and to the transceiver pattern.

[0024] In one example, an electronic device includes a substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure. The first conductive structure includes a transceiver pattern proximate to the top side of the substrate. An antenna structure is coupled to the top side of the substrate and includes a second dielectric structure, a second conductive structure, and a cavity. The second conductive structure includes a first antenna element and a second antenna element overlapping the first antenna element. At least a portion of the first antenna element is embedded within the second dielectric structure. The first and second antenna elements cover the transceiver pattern. The cavity includes a cavity top, a cavity base, and cavity sidewalls between the cavity top and the cavity base. An electronic component is coupled to the bottom side of the substrate and to the transceiver pattern.

[0025] In an example, a method of forming an electronic device includes providing a substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure, the first conductive structure including a transceiver pattern proximate to the top side of the substrate. The method includes: providing an antenna structure having a second dielectric structure coupled to the top side of the substrate, a second conductive structure including an antenna element; and a cavity below the first antenna element. At least a portion of the first antenna element is exposed outside the electronic device, the first antenna element covering the transceiver pattern; and the cavity includes a cavity top, a cavity base, and cavity sidewalls between the cavity top and the cavity base. The method includes providing an electronic component coupled to the bottom side of the substrate and coupled to the transceiver pattern.

[0026] Other examples are included in this disclosure. Such examples can be found in the drawings, the claims, and / or the description of this disclosure.

[0027] Figures 1A, 1B, and 1C show a top plan view, a perspective cross-sectional view, and a cross-sectional view of the example electronic device 10. In the example shown in Figures 1A, 1B, and 1C, the electronic device 10 may include a substrate 11, an antenna structure 12, electronic components 13, a bonding agent 14, an encapsulation 15 (optional), cavities 16 and 16', and external interconnects 19.

[0028] The substrate 11 may include a base 11a, a dielectric structure 111, and a conductive structure 112. The conductive structure 112 may include a substrate end 1121 and a transceiver pattern 1125. The antenna structure 12 may include a dielectric structure 121 and a conductive structure 122. The dielectric structure 121 may include a body 121a, a foot 121b, an exhaust port 121c, and a ledge 121d. The conductive structure 122 may include antenna elements 1221, 1222, or a conductor 1229. The electronic assembly 13 may include an assembly interconnect 131. The cavity 16 may include a cavity ceiling 161, a cavity substrate 162, and a cavity sidewall 163.

[0029] The substrate 11, antenna structure 12, bonding agent 14, encapsulant 15, cavities 16 and 16', and external interconnect 19 may be referred to as a semiconductor package, and the package provides protection for the electronic components 13 from exposure to external components and / or the environment. The semiconductor package can provide electrical coupling between the external electrical components and the external interconnect 19.

[0030] Figures 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2I, 2J and 2K show cross-sectional views of an example method for manufacturing example electronic device 10.

[0031] FIG. 2A shows a cross-sectional side view and a top view of the electronic device 10 during early manufacturing. In the example shown in FIG. 2A, an antenna element 1221 for antenna structure 12 may be provided. The antenna element 1221 may include, or be referred to as, a transmitter, antenna, or cover. In some instances, the antenna element 1221 may be provided in the form of an approximately circular plate or a polygonal plate such as a rectangle or square. The antenna element 1221 may include copper, brass, aluminum, nickel, palladium, gold, silver, chromium, nickel, or an alloy. The antenna element 1221 may be provided by punching, stamping, or etching the metal plate. The antenna element 1221 may include a side finish layer to prevent oxidation growth. In some instances, the side finish layer may be provided by plating non-oxidized nickel or gold onto the antenna element 1221. In some instances, wire bonding may also be performed on or through the side finish layer. The thickness of antenna element 1221 can range from approximately 0.01 mm to approximately 3 mm, and the area can range from approximately 0.05 mm × 0.05 mm to approximately 30 mm × 30 mm. Antenna element 1221 can receive radio frequency (RF) signals from transceiver pattern 1125 or transmit RF signals to transceiver pattern 1125.

[0032] In some embodiments, the antenna element 1221 may be disposed between the lower plate 0110 and the upper plate 0120 of the forming tool 0100. In some embodiments, the forming tool 0100 may include, or be referred to as, a molding tool or molding groove. In some embodiments, the lower plate 0110 may include: a lower base 0111; a lower protrusion 0112 protruding from the lower base 0111; and a lower seal 0113 disposed on the side of the lower protrusion 0112. In some embodiments, a lower stepped portion 0114 may be disposed around the lower protrusion 0112. In some embodiments, the upper plate 0120 may include: an upper base 0121; an upper protrusion 0122 protruding from the upper base 0121; an upper seal 0123 disposed on the side of the upper protrusion 0122; and an upper flange 0124 protruding from the upper base 0121 and disposed outside the upper protrusion 0122. In some instances, the upper cavity 0125 may be defined between the upper protrusion 0122 and the upper flange 0124. In some instances, the length of the upper flange 0124 may be greater than the length of the upper protrusion 0122. The antenna element 1221 may be disposed on the lower protrusion 0112 of the lower plate 0110, for example, on the lower seal 0113. In some instances, the horizontal width of the antenna element 1221 may be greater than the horizontal width of the lower protrusion 0112. In some instances, the lower seal 0113 and the upper seal 0123 may include, or be referred to as, silicone seals. Silicone seals prevent resin from flowing through the internal area of ​​the antenna element 1221. In some instances, an upper alignment groove 0126 may be disposed at the upper end of the upper cavity 0125 to align the antenna element 1221.

[0033] FIG. 2B shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2B, the antenna element 1221 of the antenna structure 12 can be fixed between the lower plate 0110 and the upper plate 0120. In some examples, the lower protrusion 0112 and the lower seal 0113 can contact the lower side of the antenna element 1221, and the upper protrusion 0122 and the upper seal 0123 can contact the upper side of the antenna element 1221. In some examples, the peripheral portion of the antenna element 1221 can protrude from the lower seal 0113 and the upper seal 0123. In some examples, the upper flange 0124 can contact the lateral side of the lower base 0111. An integrated cavity 0127 (e.g., provided by an upper cavity 0125 and a lower step portion 0114) can be defined and sealed between the lower plate 0110 and the upper plate 0120, and a peripheral portion of the antenna element 1221 can protrude into the integrated cavity 0127.

[0034] FIG. 2C shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2C, resin may flow into an integrated cavity 0127 disposed between the lower plate 0110 and the upper plate 0120. The resin may be cooled and cured to define a body 121a of the dielectric structure 121 of the antenna structure 12 along the peripheral portion of the antenna element 1221. The peripheral portion of the antenna element 1221 may be coupled to the body 121a of the dielectric structure 121. In some examples, the body 121a of the dielectric structure 121 may have an epoxy resin-type compound, a polymer, or a liquid crystal polymer (LCP). In some examples, the surface of the body 121a of the dielectric structure 121 coupled to the periphery of the antenna element 1221 may include, or be referred to as, a protrusion.

[0035] FIG. 2D shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2D, the upper plate 0120 may be separated from the lower plate 0110 to define the body 121a of the dielectric structure 121. In some examples, the body 121a of the dielectric structure 121 may have an alignment protrusion 121e corresponding to the upper alignment groove 0126.

[0036] FIG. 2E shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2E, the antenna element 1222 for the antenna structure 12 may be disposed on the body 121a of the dielectric structure 121. In some examples, the antenna element 1222 may be similar to the antenna element 1221.

[0037] The antenna element 1222 may be positioned on a recessed region or protrusion inward of the alignment protrusion 121e. In some embodiments, the lateral sides of the alignment protrusion 121e may be tilted to slide or guide the antenna element 1222 downward to a precise desired area on the body 121a of the dielectric structure 121. In some embodiments, the thickness of the alignment protrusion 121e may be similar to the thickness of the antenna element 1222.

[0038] FIG. 2F shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2F, the upper template 0130 may be positioned relative to the lower plate 0110 and the antenna structure 12. In some examples, the upper template 0130 may include: an upper base 0131; an upper protrusion 0132 projecting from the upper base 0131; an upper seal 0133 disposed on the side of the upper protrusion 0132; and an upper flange 0134 projecting from the upper base 0131 and disposed outside the upper protrusion 0132. In some examples, an upper cavity 0135 may be defined between the upper protrusion 0132 and the upper flange 0134. In some examples, the length of the upper flange 0134 may be greater than the length of the upper protrusion 0132. The antenna element 1222 may be disposed below the upper protrusion 0132 of the upper template 0130, for example, in contact with the upper seal 0133. In some instances, the horizontal width of antenna element 1222 may be greater than the horizontal width of upper protrusion 0132. In some instances, the upper flange 0134 of upper template 0130 may extend to cover or contact the body 121a of dielectric structure 121 or lower plate 0110. In some instances, a sealed upper cavity 0135 may be provided between the body 121a of dielectric structure 121 and upper plate 0120, and a peripheral portion of antenna element 1222 may protrude into the upper cavity 0135.

[0039] FIG. 2G shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2G, resin may flow into an upper cavity 0135 disposed between the body 121a of the dielectric structure 121 and the upper plate 0120. The resin may be cooled and cured to define a foot 121b of the dielectric structure 121 of the antenna structure 12 along the peripheral portion of the antenna element 1222. The peripheral portion of the antenna element 1222 may be coupled to the foot 121b of the dielectric structure 121. In some examples, the foot 121b of the dielectric structure 121 may have an epoxy resin type compound, a polymer, or a liquid crystal polymer (LCP). In some examples, the surface of the foot 121b of the dielectric structure 121 coupled to the periphery of the antenna element 1222 may include, or be referred to as, a protrusion.

[0040] Figure 2H shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in Figure 2H, an antenna structure 12 can be provided that is released from tool 0100. In some examples, the antenna structure 12 can be separated from the lower plate 0110 and the upper plate 0120 and then flipped over. In some examples, the horizontal area of ​​the antenna structure 12 can be in the range of about 0.05 mm × 0.05 mm to about 30 mm × 30 mm, or the vertical thickness can be in the range of about 0.01 mm to 2 mm.

[0041] The antenna structure 12 may include a dielectric structure 121 and a conductive structure 122. The dielectric structure 121 may include a body 121a and a foot 121b, and may also include a protrusion 121d coupled to or supporting the conductive structure 122. The conductive structure 122 may include an upper antenna element 1221 and a lower antenna element 122. The lower cavity 16 may be defined below the antenna element 1222, and the upper cavity 16' may be defined between the lower antenna element 1222 and the upper antenna element 1221. In some embodiments, the cavity 16 may be defined by a cavity top 161 and a cavity sidewall 163.

[0042] In some embodiments, the vent 121c may be provided in the dielectric structure 121. The vent 121c may be provided in a region corresponding to the lower cavity 16 or in a region corresponding to the upper cavity 16'. In some embodiments, the vent 121c may be provided by mechanical drilling or laser drilling. The diameter of the vent 121c may range from about 0.1 mm to about 2 mm. The vent 121c allows for venting during subsequent processing, testing, or field use. In some embodiments, the vent 121c may be defined during molding using a tool 0100 instead of drilling.

[0043] FIG. 2I shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2I, a conductor 1229 may be provided. In some examples, the conductor 1229 may include a trace or a pad. The conductor 1229 may have one end coupled to the antenna element 1222 and another end extending to the bottom side of the dielectric structure 121. In some examples, the conductor 1229 may be provided by plating, printing, sputtering, spraying, or laser direct forming (LDS) technology. In some examples, the conductor 1229 may include copper, brass, aluminum, nickel, palladium, gold, silver, chromium, nickel, or an alloy. In some examples, the length of the trace may be from about 1 mm to 10 mm, and the width may be in the range of about 0.1 mm to 1 mm. In some examples, reinforcing bonding, such as solder, solder paste, or conductive epoxy, may be used to couple or secure the coupling between the conductor 1229 and the antenna element 1222.

[0044] FIG. 2J shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2J, a bonding agent 14 may be provided on the substrate 11. In some examples, the bonding agent 14 may include or be referred to as an adhesive, solder, paste, or film. In some examples, the bonding agent may include or be referred to as a polymer, metal, conductive, or dielectric adhesive. In some examples, the width of the bonding agent 14 may be between about 90% and about 130% of the width of the leg 121b. In some examples, the thickness of the bonding agent 14 may be in the range of about 300 μm to 900 μm. In some examples, the bonding agent 14 may be provided on the substrate 11 by dispensing, printing, or spraying.

[0045] The area of ​​substrate 11 may vary depending on the application, but may range from about 3 mm × 3 mm to about 30 mm × 30 mm, and the thickness may range from about 0.1 mm to 2 mm. In some examples, substrate 11 may include a substrate 11a, a dielectric structure 111, and a conductive structure 112. Dielectric structure 111 may include, or be referred to as, one or more dielectric layers. In some examples, the thickness of dielectric structure 111 may range from about 0.1 mm to about 2 mm. Conductive structure 112 may be interleaved with dielectric structure 111. Conductive structure 112 may include, or be referred to as, conductive traces, vias, pads, paths, or patterns. Conductive structure 112 may be one or more conductive layers interleaved with dielectric structure 111. Conductive structure 112 may include a substrate end 1121 disposed on the bottom side of dielectric structure 111 and a transceiver pattern 1125 disposed on one or more layers of dielectric structure 111. In some examples, substrate end 1121 may include, or be referred to as, a pad. The transceiver pattern 1125 may include, or be referred to as, a wireless transmitter, receiver, or transceiver pattern. In some instances, the transceiver pattern 1125 may be disposed in an area corresponding to or aligned with the antenna structure 12. The thickness of the conductive structure 112 may range from about 0.1 mm to about 2 mm.

[0046] In some embodiments, the bonding agent 14 may be provided on the conductive structure 112 or dielectric structure 111 disposed on the substrate 11. In some embodiments, the bonding agent 14 may electrically couple the conductor 1229 of the antenna structure 12 to the conductive structure 112 of the substrate 11. In some embodiments, the bonding agent 14 may couple the dielectric structure 121 of the antenna structure 12 to the substrate 11a or dielectric structure 111 of the substrate 11.

[0047] In some instances, substrate 11 may be a redistribution layer (“RDL”) substrate. The RDL substrate may include (a) one or more conductive redistribution layers and one or more dielectric layers that may be formed layer-by-layer over an electronic device electrically coupled to the RDL substrate, or (b) over a carrier that has been completely or at least partially removed after the electronic device and the RDL substrate have been coupled together. The RDL substrate may be fabricated layer-by-layer on a circular wafer as a wafer-level substrate using a wafer-level process, and / or on a rectangular or square panel carrier as a panel-level substrate using a panel-level process. The RDL substrate may be formed using an additive stacking process that may include alternating stacking of one or more dielectric layers with one or more conductive layers defining corresponding conductive redistribution patterns or traces, the conductive redistribution patterns or traces being configured to collectively (a) fan the traces out of the space occupied by the electronic device, and / or (b) fan the traces into the space occupied by the electronic device. The conductive patterns may be formed using plating processes such as electroplating or electrodeless plating processes. Conductive patterns can include conductive materials, such as copper or other plated metals. The locations of the conductive patterns can be created using photo-patterning processes, such as photolithography, and photoresist materials for forming photolithography masks. The dielectric layer of the RDL substrate can be patterned using photo-patterning processes that may include photolithography masks through which light is exposed to desired features of the light pattern, such as vias in the dielectric layer. Therefore, the dielectric layer can be made of photo-definable organic dielectric materials, such as polyimide (PI), benzocyclobutene (BCB), or polybenzoxazole (PBO). Such dielectric materials can be spin-coated or otherwise coated in liquid form, rather than attached as a pre-formed film. To allow the desired photo-definable features to be properly formed, such photo-definable dielectric materials may omit structural reinforcing agents or may be filler-free, free from strands, fabrics, or other particles that could interfere with light from the photo-patterning process. In some instances, the filler-free nature of filler-free dielectric materials allows for a reduction in the thickness of the resulting dielectric layer. While the photodeterminable dielectric materials described above can be organic, in other instances, the dielectric material of the RDL substrate can include one or more inorganic dielectric layers. Some examples of inorganic dielectric layers can include silicon nitride (Si3N4), silicon oxide (SiO2), and / or SiON. These inorganic dielectric layers can be formed not by using photodetermined organic dielectric materials, but by growing inorganic dielectric layers using oxidation or nitriding processes. Such inorganic dielectric layers can be filler-free, without strands, fabrics, or other different inorganic particles. In some instances, the RDL substrate can omit a permanent core structure or carrier, for example, dielectric materials comprising bismaleimide triazine (BT) or FR4, and these types of RDL substrates can be referred to as coreless substrates.

[0048] In other examples, substrate 11 may be a preformed substrate. The preformed substrate may be manufactured prior to attachment to an electronic device and may include a dielectric layer between respective conductive layers. The conductive layer may include copper and may be formed using an electroplating process. The dielectric layer may be a relatively thick, non-photographic layer attached in the form of a preformed film rather than a liquid, and may contain a resin having fillers such as strands, fabrics, and / or other inorganic particles for rigid and / or structural support. Since the dielectric layer is non-photographically definable, features such as through-holes or openings may be formed by using drilling or lasers. In some examples, the dielectric layer may include a prepreg material or an ajinomoto deposited film (ABF). The preformed substrate may include a permanent core structure or carrier, such as a dielectric material including bismaleimide triazine (BT) or FR4, and the dielectric and conductive layers may be formed on the permanent core structure. In other instances, the preformed substrate may be a coreless substrate omitting a permanent core structure, and the dielectric and conductive layers may be formed on a sacrificial carrier, which is removed after the dielectric and conductive layers are formed and before attachment to an electronic device. The preformed substrate may be referred to as a printed circuit board (PCB) or a laminated substrate. Such preformed substrates can be formed using a semi-additive process or a modified semi-additive process.

[0049] In some instances, electronic component 13 may be coupled to the bottom side of substrate 11 via component interconnect 131. In some instances, electronic component 13 may include, or be referred to as, a wafer, die, semiconductor device, electronic device, or package device. In some instances, electronic component 13 may include RF circuitry, on-chip wireless baseband system (SoC) processor, digital signal processor (DSP), network processor, power management unit, audio processor, sensor, or application-specific integrated circuitry. In some instances, electronic component 13 may include passive components, integrated passive devices, capacitors, inductors, or diodes. In some instances, the thickness of electronic component 13 may range from approximately 0.05 mm to approximately 1 mm. In some instances, component interconnect 131 may include, or be referred to as, pads, bumps, or pillars. In some instances, component interconnect 131 may include metals such as copper (Cu), aluminum (Al), gold (Au), silver (Ag), nickel (Ni), palladium (Pd), and / or tin (Sn). In some instances, the width and / or thickness of the component interconnect 131 may be from approximately 0.01 mm to approximately 0.3 mm. In some instances, electronic component 13 may represent one or more electronic components individually coupled to substrate 11.

[0050] In some embodiments, the external interconnect 19 may be coupled to a substrate end 1121 on the bottom side of the substrate 11. In some embodiments, the external interconnect 19 may include, or be referred to as, a conductive ball, conductive bump, conductive pillar, or solder ball. In some embodiments, flux may be disposed on the substrate end 1121, the solder ball may fall on the flux, and the solder ball may then be coupled to the substrate end 1121 by a reflow process or a laser-assisted bonding process. In some embodiments, the external interconnect 19 may include tin (Sn), silver (Ag), lead (Pb), copper (Cu), Sn-Pb, Sn37-Pb, Sn95-Pb, Sn-Pb-Ag, Sn-Cu, Sn-Ag, Sn-Au, Sn-Bi, or Sn-Ag-Cu. In some embodiments, the thickness or width of the external interconnect 19 may be from approximately 0.1 mm to approximately 10 mm.

[0051] In some examples, the encapsulant 15 may surround the electronic component 13 or the external interconnect 19. In some examples, the encapsulant 15 may include, or be referred to as, a molding compound, resin, sealant, filler-reinforced polymer, or organism. In some examples, the encapsulant 15 may include epoxy or phenolic resin, carbon black, or silica filler. In some examples, the encapsulant 15 may cover the bottom side of the substrate 11 and the lateral sides of the electronic component 13 or the external interconnect 19. In some examples, the bottom side of the electronic component 13 may be exposed from the bottom side of the encapsulant 15. The external component 19 may protrude from the bottom side of the encapsulant 15. In some examples, the encapsulant 15 may be provided by compression molding, transfer molding, liquid encapsulant molding, vacuum lamination, solder paste printing, or film-assisted molding. In some instances, compression molding may involve curing the flowable resin by placing the substrate 11 (containing the electronic component 13 and the external component 19) in a mold with the flowable resin supplied to it in advance, and transfer molding may involve supplying and curing the fluid resin from the gate (supply port) of the mold to the periphery of the substrate 11. In some instances, the thickness of the encapsulation 15 may be from approximately 0.1 mm to approximately 10 mm. The encapsulation 15 can protect the electronic component 13 and the external component 19 from exposure to external components or the environment, and can provide structural integrity for the electronic device 10.

[0052] FIG. 2K shows a cross-sectional view of the electronic device 10 at a later stage of manufacturing. In the example shown in FIG. 2K, the antenna structure 12 may be disposed on the substrate 11 to achieve the configuration shown in FIG. 1C. In some examples, the legs 121b of the antenna structure 12 may be adhered to the adhesive 14. In some examples, the adhesive 14 may be provided at the lower end of the legs 121b instead of on the substrate 11. In some examples, the conductors 1229 of the antenna structure 12 may be electrically coupled to the conductive structure 112 or transceiver pattern 1125 of the substrate 11. In some examples, the dielectric structure 121 of the antenna structure 12 may be coupled to the substrate 11a or dielectric structure 121 of the substrate 11. In some examples, a thermoforming process may be performed after the antenna structure 12 is disposed on the adhesive 14 so that the adhesive 14 can be cured. In some instances, after the antenna structure 12 is placed on the bonding agent 14, a reflow process can be performed so that the bonding agent 14 can be cured.

[0053] In some embodiments, the cavity 16 may be defined between the substrate 11 and the antenna structure 12. In some embodiments, the cavity 16 may be defined by a cavity top 161 including the bottom side of the antenna element 1222, a cavity base 162 including a portion of the base 11a or the top side of the substrate 11, and a cavity sidewall 163 including the inner side of the dielectric structure 121.

[0054] In some instances, the electronic components 13, external interconnects 19 and / or encapsulations 15 may be provided in subsequent processes, wherein the antenna structure 12 is disposed on the bonding agent 14.

[0055] The electronic device 10 according to this disclosure can provide optimal antenna performance at the lowest cost. For example, the antenna structure 12 according to this disclosure can be a more efficient alternative to multilayer laminated structure stacks that require low dF / dK core materials, which would increase the cost of conventional substrates. Generally, the properties of laminated materials are not as attractive as air, laminated stacks are expensive, and shape factor changes are not as robust as those of the antenna structure 12 according to this disclosure. In some instances, the antenna structure 12 can be used as a patch antenna using perforated, stamped, etched, or electroplated metal and can be supported by a dielectric material, thereby creating a cavity that can improve antenna performance between the substrate 11 and the antenna structure 12.

[0056] Generally, air can possess two beneficial dielectric properties to help maximize antenna radiation efficiency. First, in the case of low loss (Df), air can promote low attenuation at a given distance. Second, in the case of low dielectric constant (Dk), air can provide better signal quality. Therefore, the antenna structure according to this disclosure can improve antenna characteristics by including an air gap. In some instances, the air cavity defined by the antenna elements and the dielectric can be filled with atmospheric gases (nitrogen and oxygen), or special-purpose gases such as helium or neon used with an hermetically sealed element, wherein the dielectric 121 will not be vented.

[0057] Although the antenna structure has been described as containing two antenna elements, it may include one or more antenna elements. Although the shape of the antenna element is described as a circular plate or a polygonal plate, the antenna element may have a ring shape, a microwave strip shape, or a parabolic shape. The antenna type may include a patch, a dipole, a loop, or a monopole. The antenna element may be electrically coupled to the substrate, but may also float electrically relative to the substrate (not electrically coupled to the substrate). Although the dielectric of the antenna structure has been described as a closed box shape with four or more walls, the dielectric of the antenna structure may also have a circular, rectangular, hexagonal, or open shape with a single wall.

[0058] FIG3 shows a cross-sectional view of the example electronic device 20. In the example shown in FIG3, the electronic device 20 may be similar to the electronic device 10 described above and includes an antenna structure 22. Features, elements, or aspects of the antenna structure 22 may be similar to those described with respect to antenna structure 12 or other antenna structures described herein. The antenna structure 22 may include a dielectric structure 221 and a conductive structure 122. The dielectric structure 221 may be similar to the dielectric structure 121 and includes dielectric segments 221x. The gap between the dielectric segments 221x may be larger than the diameter of the vent 121c described above. The dielectric structure 221 may include dielectric segments 221x fixed to the substrate 11 by an adhesive 14. The dielectric segments 221x may include, or be referred to as, pillars, walls, or sections. Each dielectric segment 221x may include a body 221a, a foot 221b, and one or more protrusions 121d. The peripheries of antenna elements 1221 and 1222 may be coupled to or supported by a corresponding protrusion 121d of dielectric segment 221x. In some instances, protrusion 121d may include, or be referred to as, a support or a periphery covering.

[0059] FIG4 shows a cross-sectional view of the example electronic device 30. The electronic device 30 may be similar to the electronic device 10 described above and includes an antenna structure 32. Features, elements, or aspects of the antenna structure 32 may be similar to those described with respect to antenna structure 12 or other antenna structures described herein. In some instances, the antenna structure 32 may include dielectric structures 321a and 321b and antenna elements 1221 and 1222. In some instances, the dielectric structure 321b may be fixed to the substrate 11 by an adhesive 14. In some instances, the dielectric structure 321a may be spaced outside the dielectric structure 321b and fixed to the substrate 11 by an adhesive 14. An air cavity 16 may be defined between the antenna element 1222 and the substrate 11, and an air cavity 16' may be defined between the antenna elements 1221 and 1222.

[0060] In some embodiments, each of dielectric structures 321a and 321b may include a foot and a top, the top being curved inward from the upper end of the foot. In some embodiments, each of dielectric structures 321a and 321b may include an vent 121c at one or more locations. In some embodiments, the periphery of antenna element 1222 may be supported by dielectric structure 321b, and the periphery of antenna element 1221 may be supported by dielectric structure 321a. Antenna element 1222 may overlap an opening through the top of dielectric structure 321b, and antenna element 1221 may overlap an opening through the top of dielectric structure 321a. An air cavity 16 may be defined between antenna element 1222 and substrate 11, and an air cavity 16' may be defined between antenna elements 1221 and antenna element 1222.

[0061] FIG5 shows a cross-sectional view of the example electronic device 40. In the example shown in FIG5, the electronic device 40 may be similar to the electronic device 10 described above and includes an antenna structure 42. Features, elements, or aspects of the antenna structure 42 may be similar to those described with respect to antenna structure 12 or other antenna structures described herein. The antenna structure 42 may include dielectric structures 421a and 421b and antenna elements 1221 and 1222. In some examples, each of the dielectric structures 421a and 421b may include a support 44. Each support 44 may include or be referred to as a sphere or a pillar. In some examples, each support 44 may have a substantially circular cross-sectional shape. In some examples, the dielectric structure 421b may be fixed to the substrate 11 by an adhesive 14, and the dielectric structure 421a may be fixed to the dielectric structure 421b or the antenna element 1222. Antenna element 1222 may be supported by dielectric structure 421b, and antenna element 1221 may be supported by dielectric structure 421a. Air cavity 16 may be defined between antenna element 1222 and substrate 11, and air cavity 16' may be defined between antenna element 1221 and antenna element 1222.

[0062] FIG6 shows a cross-sectional view of an example electronic device 50. In the example shown in FIG6, the electronic device 50 may be similar to the electronic device 10 described above and includes an antenna structure 52. Features, elements, or aspects of the antenna structure 52 may be similar to those described with respect to antenna structure 12 or other antenna structures described herein. The antenna structure 52 may include a dielectric structure 521 and a conductive structure 522. In some examples, the conductive structure 522 may include an antenna element 5222. In some examples, any antenna element 5222 may have a planar shape and may be coupled and fixed to a protrusion 121d of the dielectric structure 521. In some examples, the antenna element 5222 may include an inverted L-shaped structure, with a first end coupled to the protrusion 121d of the dielectric structure 521 and a second end coupled to a substrate 11. In some examples, the second end of the antenna element 5222 may be electrically coupled to the substrate 11 via a bonding agent 14. In some examples, the antenna element 5222 may include, or be referred to as, a transmitter, a patch antenna, or a dipole antenna.

[0063] FIG7 shows a cross-sectional view of the example electronic device 70. In the example shown in FIG7, the electronic device 70 may be similar to the electronic device 10 described above and includes an antenna structure 72. The antenna structure 72 may include, or be referred to as, a transceiver structure, a substrate, a cavity substrate, a laminated substrate, or an RDL substrate. Features, elements, or aspects of the antenna structure 72 may be similar to those described with respect to antenna structure 12 or other antenna structures described herein. In some examples, the structure and fabrication of the antenna structure 72 may be similar to the structure and fabrication of the substrate 11.

[0064] The antenna structure 72 may include a dielectric structure 721 and a conductive structure 722. The dielectric structure 721 may include a body 721a spaced apart from the substrate 11 and a foot 721b fixed to the substrate 11 by an adhesive 14. In some embodiments, the dielectric structure 721 may include an vent 721c disposed at the body 721a or the foot 721b. The dielectric structure 721 may include, or be referred to as, a cavity substrate. The body 721a may include, or be referred to as a laminated substrate, an RDL substrate, or a molded substrate. The foot 721b coupled to the body 721a may include, or be referred to as a laminated substrate or a molded substrate. The conductive structure 722 may include one or more antenna elements 7221, 7222, 7223, or a conductor 7229. The antenna elements 7221, 7222, and 7223 may be disposed on the top side, the bottom side, or inside the body 721a, respectively. In some instances, conductor 7229 may be electrically coupled to one or more of antenna elements 7221, 7222, and 7223, or electrically coupled to conductive structure 112 of substrate 11. In some instances, antenna elements 7221, 7222, and 7223 may be similar to antenna elements 1221 and 1222, or may include or be referred to as transmitters, antennas, or conductive patterns. Antenna elements 7221, 7222, and 7223 may transmit RF signals to or receive RF signals from transceiver pattern 1125 of substrate 11. Air cavity 16 may be defined between substrate 11 and antenna elements 7221, 7222, and 7223 or body 721a of dielectric structure 721.

[0065] FIG8 shows a cross-sectional view of the example electronic device 80. In the example shown in FIG8, the electronic device 80 may be similar to the electronic device 70 described above, and the substrate 11 may include, or be referred to as, a cavity substrate. In some examples, the substrate 11 may include a base 11a and a wall 11b extending upward from the periphery of the base 11a. In some examples, the legs 721b of the antenna structure 72 may be fixed to the wall 11b of the substrate 11 by an adhesive 14.

[0066] FIG9 shows a cross-sectional view of an example electronic device 90. In the example shown in FIG9, the electronic device 90 may be similar to the electronic device 70 described above and includes an antenna structure 92. Features, elements, or aspects of the antenna structure 92 may be similar to those described with respect to antenna structures 12, 72, or other antenna structures described herein. The antenna structure 92 may include a body 721a, a conductive structure 722, and a foot 921b. The foot 921b may include one or more of a bonding agent 94 or an encapsulation 95. In some examples, the encapsulation 95 may include a molding structure, a molding compound, a resin, a polymer, a resin with filler, or a polymer with filler. The conductive structure 722 may include antenna elements 7221, 7222, 7223, or a trace 7229 disposed in the body 721a.

[0067] The foot 921b can couple the dielectric structure 721 to the substrate 11. The foot 921b may include a bonding agent 94 and an encapsulant 95. The bonding agent 94 may be similar to the bonding agent 14 described above, but may extend from the substrate 11 to the body 721a via the foot 921b. The encapsulant 95 may include a molding compound or a polymer. In some instances, at least one of the bonding agent 94 or the encapsulant 95 may be optional. An air cavity 16 may be defined between the substrate 11 and the antenna elements 7221, 7222, 7223 or the body 721a of the dielectric structure 721.

[0068] Figures 10A, 10B, and 10C show cross-sectional views of an example method for manufacturing the electronic device 90 of Figure 9. In the example shown in Figure 10A, the foot 921b may be part of the substrate 11 or may be initially disposed on the substrate 11. In the example shown in Figure 10B, the foot 921b may be part of the antenna structure 92 or may be initially disposed on the antenna structure 92. In the example shown in Figure 10C, the foot 921b may be a separate structure and may be coupled to the substrate 11 or the antenna structure 92.

[0069] Therefore, this disclosure can provide a novel electronic device having a cavity in an antenna pattern, for example, that can be used at ultra-high frequencies (>120 GHz, 6 GHz). This disclosure can provide an electronic device with high antenna efficiency, such as impedance matching or radiation performance. This disclosure can provide an electronic device that allows for easy control of the air cavity depth while overcoming limitations in substrate manufacturing.

[0070] This disclosure contains references to certain examples; however, those skilled in the art will understand that various changes can be made and equivalents can be substituted without departing from the scope of this disclosure. Furthermore, modifications can be made to the disclosed examples without departing from the scope of this disclosure. Therefore, it is intended that this disclosure is not limited to the disclosed examples, but will include all examples falling within the scope of the appended claims. [Simplified Explanation of the Diagram]

[0007] [Figures 1A, 1B and 1C] show a top plan view, a perspective cross-sectional view and a cross-sectional view of the example electronic device.

[0008] [Figures 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2I, 2J and 2K] show cross-sectional views of an example method for manufacturing an example electronic device.

[0009] [Figure 3] shows a cross-sectional view of the example electronic device.

[0010] [Figure 4] shows a cross-sectional view of the example electronic device.

[0011] [Figure 5] shows a cross-sectional view of the example electronic device.

[0012] [Figure 6] shows a cross-sectional view of the example electronic device.

[0013] [Figure 7] shows a cross-sectional view of the example electronic device.

[0014] [Figure 8] shows a cross-sectional view of the example electronic device.

[0015] [Figure 9] shows a cross-sectional view of the example electronic device.

[0016] [Figures 10A, 10B and 10C] show cross-sectional views of an example method for manufacturing an example electronic device.

[0017] The following discussion describes various examples of providing electronic devices and methods of manufacturing electronic devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the specific examples disclosed. In the following discussion, the terms "example" and "for example" are non-limiting.

[0018] The accompanying drawings illustrate general construction methods, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the contents of this disclosure. Furthermore, the elements in the drawings are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be enlarged relative to other elements to aid in understanding the examples discussed in this disclosure. The same reference numerals in different figures denote the same elements.

[0019] The term “or” means any one or more items in a list connected by “or”. As an example, “x or y” means any element in the three-element set {(x), (y), (x, y)}. As another example, “x, y or z” means any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}.

[0020] The terms “comprises / comprising” and / or “includes / including” are “open” terms and specify the presence of the stated feature, but do not exclude the presence or addition of one or more other features.

[0021] The terms “first,” “second,” etc., may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, for example, without departing from the teachings of this disclosure, the first element discussed in this disclosure may be referred to as the second element.

[0022] Unless otherwise specified, the term "coupled" may be used to describe two elements that are in direct contact with each other or to describe two elements that are indirectly connected by one or more other elements. For example, if element A is coupled to element B, then element A may be in direct contact with element B or indirectly connected to element B by an inserted element C. Similarly, the terms "above" or "on" may be used to describe two elements that are in direct contact with each other or to describe two elements that are indirectly connected by one or more other elements.

Claims

1. An electronic device comprising: substrate, It has a substrate top side, a substrate bottom side, a first dielectric structure, and a first conductive structure, wherein: the first conductive structure includes a transceiver pattern near the substrate top side; an antenna structure including: a second dielectric structure coupled to the substrate top side; a second conductive structure including a first antenna element, the first antenna element including: a continuous metal conductor first antenna top side; a first antenna bottom side; and a first antenna lateral side connecting the first antenna top side and the first antenna bottom side; and a first cavity below the first antenna element; wherein: the first antenna element covers the transceiver pattern. The first cavity includes a first cavity top, a first cavity base, and a first cavity sidewall between the first cavity top and the first cavity base; and the continuous metal conductor extends laterally across the first cavity, the bottom side of the first antenna defines the first cavity top, and the peripheral portion of the first antenna element includes a portion of the first antenna top side, a portion of the first antenna bottom side, and the first antenna lateral side, and is fixed to and covered by the second dielectric structure; and an electronic component coupled to the bottom side of the substrate and coupled to the transceiver pattern.

2. The electronic device according to claim 1, further comprising: A conductor includes a first end and a second end opposite to the first end; wherein: the second dielectric structure includes a bottom side of the second dielectric structure and an inner side of the second dielectric structure; the first end of the conductor is coupled to a first antenna element; the second end of the conductor is interposed between a top side of the substrate and a bottom side of the second dielectric structure, and is coupled to the first conductive structure at the top side of the substrate; and the conductor extends along and contacts the inner side of the second dielectric structure.

3. The electronic device according to claim 1, wherein: The second dielectric structure is a molded structure, comprising: a main body portion including a top side of the main body portion and a bottom side of the main body portion opposite to the top side of the main body portion; and a leg portion including a top side of the leg portion and a bottom side of the leg portion opposite to the top side of the leg portion; the bottom side of the main body portion is molded to the top side of the leg portion; the bottom side of the leg portion is fixed to the top side of the substrate; and the first antenna element is molded within the molded structure and located between the bottom side of the main body portion and the top side of the leg portion.

4. The electronic device according to claim 3, further comprising: An exhaust port extends laterally through the main body portion.

5. The electronic device according to claim 1, wherein: The second conductive structure includes a second antenna element, the second antenna element including: a second antenna top side; a second antenna bottom side; and a second antenna lateral side, which connects the second antenna top side and the second antenna bottom side; the peripheral portion of the second antenna element includes a portion of the second antenna top side, a portion of the second antenna bottom side, and the second antenna lateral side, and is embedded in the second dielectric structure; and the second antenna element is separated from the first antenna element through a second cavity.

6. The electronic device according to claim 5, wherein: The second dielectric structure includes: a first molded portion having the first antenna element; and a second molded portion having the second antenna element; the first molded portion includes an alignment protrusion having an outer wall; and a portion of the second molded portion overlaps with the outer wall.

7. The electronic device according to claim 1, further comprising: An electronic component coupled to the bottom side of the substrate and the first conductive structure; An external interconnect that is coupled to the first conductive structure on the bottom side of the substrate; And an encapsulation that laterally surrounds portions of the electronic components and portions of the external interconnects.

8. A method of forming an electronic device, comprising: A substrate is provided, the substrate having a top side, a bottom side, a first dielectric structure, and a first conductive structure, wherein: the first conductive structure includes a transceiver pattern proximate to the top side of the substrate; an antenna structure is provided, the antenna structure including: a second dielectric structure coupled to the top side of the substrate; a second conductive structure including a first antenna element, the first antenna element including: a continuous metal conductor; a first antenna top side; a first antenna bottom side; and a first antenna lateral side connecting the first antenna top side and the first antenna bottom side; and a first cavity below the first antenna element; wherein: the first antenna element covers the transceiver pattern. The first cavity includes a first cavity top, a first cavity base, and a first cavity sidewall between the first cavity top and the first cavity base; and the continuous metal conductor extends laterally across the first cavity, the bottom side of the first antenna defines the first cavity top, and the peripheral portion of the first antenna element includes a portion of the first antenna top side, a portion of the first antenna bottom side, and the first antenna lateral side, and is fixed to and covered by the second dielectric structure; and an electronic component is provided, the electronic component being coupled to the bottom side of the substrate and coupled to the transceiver pattern.

9. The method according to claim 8, further comprising: A conductor is provided, the conductor including a first end and a second end opposite to the first end; wherein: providing the second dielectric structure includes providing a second dielectric structure having a bottom side of the second dielectric structure and an inner side of the second dielectric structure; the first end of the conductor is coupled to a first antenna element; the second end of the conductor is interposed between a top side of the substrate and a bottom side of the second dielectric structure, and coupled to the first conductive structure on the top side of the substrate; and the conductor extends along and contacts the inner side of the second dielectric structure.

10. The method according to request item 8, wherein: Providing the second dielectric structure includes providing the second dielectric structure as a molded structure, the molded structure including: a body portion including a top side of the body portion and a bottom side of the body portion opposite to the top side of the body portion; and a leg portion including a top side of the leg portion and a bottom side of the leg portion opposite to the top side of the leg portion; the bottom side of the body portion is molded to the top side of the leg portion; the bottom side of the leg portion is fixed to the top side of the substrate; and the first antenna element is molded within the molded structure and located between the bottom side of the body portion and the top side of the leg portion.

11. The method according to claim 10, further comprising: An exhaust port is provided, which extends laterally through the main body portion.

12. The method according to request item 8, wherein: Providing the second conductive structure includes providing a second antenna element, the second antenna element including: a second antenna top side; a second antenna bottom side; and a second antenna lateral side connecting the second antenna top side and the second antenna bottom side; a portion of the second antenna top side, a portion of the second antenna bottom side, and the second antenna lateral side are embedded within the second dielectric structure; and the second antenna element is separated from the first antenna element through a second cavity.

13. The method according to request item 12, wherein: Providing the second dielectric structure includes: providing a first molded portion having the first antenna element; and providing a second molded portion having the second antenna element; providing the first molded portion includes providing an alignment protrusion having an outer wall; and providing the second molded portion includes providing a portion of the second molded portion to overlap with the outer wall.

14. The method according to claim 8, further comprising: An electronic component is provided, which is coupled to the bottom side of the substrate and the first conductive structure; An external interconnect is provided, which is coupled to the first conductive structure at the bottom side of the substrate; And provide an encapsulation that laterally surrounds portions of the electronic component and portions of the external interconnects.

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