Method for manufacturing a laminated film with an adhesive layer

Abstract

The present invention provides a method for manufacturing a laminated film, which is suitable for efficiently manufacturing a laminated film having a soft adhesive layer. The manufacturing method of the laminated film of the present invention includes: step S2, wherein a workpiece film W having a carrier film C, a film layer 10, a primary adhesive layer 20 and a film layer 30 sequentially arranged along the thickness direction H is laser-processed from the side of film layer 30 to cut the primary adhesive layer 20 and film layer 30 on film layer 10, forming an adhesive layer 21 and a surrounding portion 22 on the primary adhesive layer 20, and forming a film 31 on the adhesive layer 21 and a surrounding portion 32 on film layer 30; step S3, wherein the surrounding portions 22, 32 and film 31 are removed; step S4, wherein a strip of film 40' is attached as film layer 40 to the side of adhesive layer 20 of workpiece film W; and step S5, wherein film layers 10 and 40 on carrier film S are cut by stamping from the side of film layer 40 to form films 11 and 41.

Description

Method for manufacturing a laminated film with an adhesive layer This invention relates to a method for manufacturing a laminated film having an adhesive layer. Display panels, for example, have a laminated structure comprising elements such as a pixel panel, a polarizing film, a touch panel, and a cover film. In the manufacturing process of such display panels, to bond the elements within the laminated structure together, for example, an optically transparent adhesive sheet (optical adhesive sheet) is used. The optical adhesive sheet is manufactured in a form where both sides of the sheet are covered by a release liner (a laminated film having an adhesive layer). On the other hand, the development of a repeatedly bendable (foldable) display panel for use in smartphones and tablets is underway. Specifically, the foldable display panel can repeatedly deform between a curved shape and a flat, non-bent shape. In this type of foldable display panel, the elements in the laminated structure are manufactured in a repeatedly bendable manner, and the bonding between these elements uses a thin optical adhesive sheet. Optical adhesive sheets for flexible elements such as foldable display panels are described, for example, in Patent Document 1 below. [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2018-111754 [The problem the invention aims to solve] Previously, optical adhesive sheets for display panels were manufactured, for example, in the following manner. First, as shown in Figure 11A, a laminated sheet 90 is prepared as a long strip of raw material. The laminated sheet 90 has, in sequence along the thickness direction H, a release liner 91, an adhesive layer 92, and a release liner 93. The release liner 91 is in contact with one side of the adhesive layer 92 in a peelable manner. The release liner 93 is in contact with the other side of the adhesive layer 92 in a peelable manner. This laminated sheet 90 flows on the production line supported on a carrier film (figure omitted). Next, as shown in FIG11B, a plurality of single-sheet optical adhesive sheets 92A are formed by stamping the adhesive layer 92 of the laminated sheet 90 (stamping process). During the stamping process, as shown in FIG12, the blade 101 of the blade assembly 100 is inserted into the release liner 91 from the side of the release liner 93. This forms an optical adhesive sheet 92A with a specific top view shape. In this process, a peripheral portion 92a is formed around the optical adhesive sheet 92A of the adhesive layer 92. The release liner 93 is also stamped to form a release liner 93A with the same top view shape as the adhesive layer 92, and a peripheral portion 93a is formed around the release liner 93A. In this process, as shown in FIG13, a cutting groove 95 is formed in the laminated sheet 90. The cutting groove 95 is formed by pressing the adhesive layer 92 and the release liner 93 along the surface direction D using a blade 101 (Fig. 12) inserted into the adhesive layer 92 and the release liner 93. The end edges E, E of the adjacent optical adhesive sheet 92A and the surrounding portion 92a on the release liner 91 face each other. Alternatively, during the stamping process in this step, the blades 101 of the blade assembly 100 can be inserted from the release liner 93 side into the aforementioned carrier film to form an optical adhesive sheet 92A with a specific top view shape on the carrier film. In this case, the cutting process described below is not referred to in FIG11D. Figure 14 illustrates an example of a previous stamping process. In the stamping process shown in Figure 14, the laminated sheet 90 flowing on the production line sequentially passes between a pair of rollers 201, 201, the stamping machine 202, and a pair of rollers 203, 203. The stamping machine 202 includes an intermittent feeding device, a processing platform, and a set of cutters (all omitted from the diagram) disposed above the platform. The laminated sheet 90 is relaxed between the pair of rollers 201, 201 and the stamping machine 202. The laminated sheet 90 is relaxed between the stamping machine 202 and the pair of rollers 203, 203. The laminated sheet 90 is intermittently fed between the rollers 201, 201 and the rollers 203, 203 by the intermittent feeding device of the stamping machine 202. In this way, the unprocessed area of ​​the laminated sheet 90 is intermittently supplied to the processing platform of the stamping machine 202. On the processing platform, each unprocessed area of ​​the intermittently supplied laminated sheet 90 is subjected to stamping processing by a set of cutters. Following this stamping process, as shown in FIG11C, the surrounding portions 92a and 93a are removed from the release liner 91 (removal process). Then, as shown in FIG11D, the strip release liner 91 is cut into single-sheet release liner 91A. This yields a single-sheet laminated film (release liner 91A / optical adhesive sheet 92A / release liner 93A) with an adhesive layer. For optically adhesive sheets used for flexible elements, they are required to be highly soft, with adequate follow-up to the adhered body during bending of the element, and excellent stress relief. However, the softer the adhesive layer 92 is in the aforementioned previous fabrication method, the easier it is to deform the end edge portions E and E of the adjacent optically adhered sheet 92A and the surrounding portion 92a on the stripping lining 91 in a single-point chain line in Figure 13 after the stamping processing process ( Figure 11B ), respectively, in such a way that they protrude toward the outside, respectively. Specifically, the end edge portions E and E of the gap that are vacant due to the insertion of the knife 101 during stamping machining are easily deformed by returning to their original position (regressive deformation). Furthermore, in a previous manufacturing method, when the laminated sheet 90 after passing through the stamping machine 202 is clamped by a pair of rolled rollers 203 , 203 (Fig. 14), the pressure acts on the laminated sheet 90 along the thickness direction H, and the end edges E, E (Fig. 13) are easily deformed in a manner protruding toward the outside. Such deformation of the end-edge portions E becomes the cause of the adjacent end-edge portions E, E in contact with each other and attached (the 1st adhesion). If adhesions are generated between E and E of the end edge parts, the surrounding parts 92a , 93a cannot be removed appropriately in the removal procedure (Fig. 11C ). The adhesion between E and E of the end edges reduces the manufacturing yield of laminated films with adhesive layers. The present invention provides a method for fabricating a laminated film, which is suitable for fabricating a laminated film with a soft adhesive layer with high efficiency. [Technical means of solving problems] The present invention [1] comprises a method for manufacturing a laminated film having an adhesive layer in a roll-to-roll manner of a laminated film having an adhesive layer comprising: a first profile processing process, which resorts to pairing a workpiece film with a load-bearing film, a first film layer, an original adhesive layer, and a second film layer sequentially along the thickness direction Laser light is irradiated along the above-mentioned thickness direction from the side of the above-mentioned 2nd film layer, and the above-mentioned original adhesive layer on the above-mentioned first film layer and the above-mentioned 2nd film layer are cut off 2 membrane, with the 2nd perimeter portion on the said 1st perimeter portion surrounding the 2nd membrane;removal process, which removes the said 2nd peripheral portion, the said 1st peripheral portion and the said 2nd membrane from the said workpiece film; the adhesive layer side;and the second profile processing process, which after the above-gluing process, cut off the above-mentioned first film layer and the above-mentioned third film layer on the above-mentioned bearing film by stamping the said workpiece film from the above-mentioned third film layer side. As described above, the method for manufacturing a laminated film with an adhesive layer includes a first shaping step. In the first shaping step, the original adhesive layer on the first film layer is cut off by laser irradiation, and a monolithic adhesive layer is formed on that layer. That is, the adhesive layer of the laminated film with the adhesive layer is shaped by laser processing. This laser processing is suitable for continuously shaping the adhesive layer while allowing the workpiece film to flow continuously (eliminating the need for intermittent feeding of the workpiece film for shaping the adhesive layer). Therefore, this manufacturing method is suitable for efficiently manufacturing laminated films with adhesive layers. In the first shaping process, the material of the original adhesive layer evaporates and is removed from the portion irradiated with laser light. That is, in the first shaping process, the original adhesive layer is separated from its surroundings by partial removal, forming the adhesive layer and its first surrounding portion. Since the original adhesive layer is not cut into the adhesive layer and the first surrounding portion by the insertion of a stamping tool, the aforementioned regression deformation of the adhesive layer and the first surrounding portion does not occur. This first shaping process is suitable for suppressing the aforementioned first adhesion between the adhesive layer and the first surrounding portion even when the adhesive layer is soft and easily deformable. In the second shaping process of this manufacturing method, as described above, the first and third film layers on the carrier film are cut by stamping the workpiece film from the third film layer side using a stamping tool. This stamping process is suitable for situations where, with the adhesive layer that has already undergone shaping placed between the first and third film layers, the first and third films are shaped without further shaping of the adhesive layer. In the second shaping process, when the third film is shaped without shaping the adhesive layer, the predetermined cutting position in the third film layer is not sufficiently supported by the adhesive layer, and its position in the thickness direction is prone to change. Therefore, if laser processing is used instead of stamping in the second shaping process, the focal point of the laser beam is difficult to align with the third film layer. Therefore, laser processing cannot properly cut the third film layer. In contrast, in the second shaping process of this manufacturing method, the third film layer can be properly cut by pressing it against the workpiece film with a stamping tool. As described above, this manufacturing method is suitable for efficiently manufacturing laminated films with a soft adhesive layer (which sequentially include a first film, an adhesive layer, and a third film along the thickness direction). The present invention [2] includes a method for manufacturing a laminated film having an adhesive layer as described in [1] above, wherein the cut portions of the first film layer and the third film layer in the second shape processing step are separated from the adhesive layer in a plane direction orthogonal to the thickness direction. The first and third films formed by the second shaping process have extended ends that extend further outward than the edge of the adhesive layer. The laminated film having these first and third films is suitable for suppressing the adhesive layer from protruding from the film ends. This protrusion of the adhesive layer, when the laminated films are stacked, becomes a cause for the ends of the adhesive layers of adjacent laminated films to adhere to each other (secondary adhesion), which is undesirable. The present invention [3] includes a method for manufacturing a laminated film having an adhesive layer as described in [1] or [2] above, wherein after the first shape processing step and before the removal step above, a clamping step is further included, in which the workpiece film is clamped and stretched by a pair of rollers. This clamping process is preferable for applying appropriate tension to the workpiece film during the first shape machining process. Furthermore, this manufacturing method is suitable for suppressing the aforementioned first adhesion between the adhesive layer and the first periphery during this clamping process. The present invention [4] includes a method for manufacturing a laminated film having an adhesive layer according to any one of [1] to [3] above, wherein the first shape processing step does not include relaxing the workpiece film before subjecting the workpiece film to the laser light irradiation. This manufacturing method eliminates the need for adjustments and controls to relax the workpiece film before laser processing on the production line, making it superior for the efficient manufacture of laminated films with adhesive layers. The present invention [5] includes a method for manufacturing a laminated film having an adhesive layer according to any one of [1] to [4] above, wherein the first shape processing step does not include relaxing the workpiece film after the workpiece film is subjected to the laser light irradiation. This manufacturing method eliminates the need for adjustments and controls to relax the workpiece film after laser processing on the production line, making it superior for the efficient manufacture of laminated films with adhesive layers. Furthermore, the fact that the first shaping process does not involve relaxing the workpiece film after laser irradiation is advantageous in preventing the workpiece film from bending with a large radius of curvature on the production line, and in suppressing the aforementioned first adhesion between the adhesive layer and the first periphery (bending of the workpiece film shortens the separation distance between the adhesive layer and the first periphery, increasing the likelihood of first adhesion). One embodiment of the present invention discloses a method for manufacturing a laminated film in a roll-to-roll manner, which is a monolithic laminated film having an adhesive layer. As shown in FIG1, the manufacturing method includes a preparation step S1, a first shape processing step S2, a removal step S3, a bonding step S4, and a second shape processing step S5. FIG2 is a schematic diagram of a production line implementing the manufacturing method shown in FIG1. In preparation step S1, as shown in Figure 3A, a laminated film X, which is a strip of raw material film, is prepared. The laminated film X sequentially comprises a film layer 10 (first film layer), an original adhesive layer 20, and a film layer 30 (second film layer) along the thickness direction H. The original adhesive layer 20 has a first surface 20a and a second surface 20b opposite to the first surface 20a. Film layer 10 is in contact with the first surface 20a. Film layer 30 is in contact with the second surface 20b. The laminated film X extends in a plane direction orthogonal to the thickness direction H. The film layer 10 is, for example, a release liner, a functional optical film, or a substrate film (support film). Materials used for the release liner include, for example, polyester, polyolefins, and polycarbonate. Examples of polyesters include polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate. Examples of polyolefins include polyethylene, polypropylene, and cyclic olefin polymers (COP). The film layer 10, serving as the release liner, is in contact with the first surface 20a of the original adhesive layer 20 in a peelable manner. The surface of this film layer 10 (the surface on the side of the original adhesive layer 20) is preferably subjected to a release treatment. Examples of release treatments include polysiloxane release treatment and fluorine release treatment. From the viewpoint of ensuring the protective function of the adhesive layer, the thickness of the release liner is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 30 μm or more. According to the viewpoint of thinning the laminated film, the thickness of the release liner is preferably less than 200 μm, more preferably less than 150 μm, and even more preferably less than 100 μm. Examples of functional optical films include polarizing films and retardation films. Functional optical films can also be other optical films such as panel reinforcing materials. When film layer 10 is a functional optical film, the first surface 20a of the original adhesive layer 20 is bonded to this film layer 10. Film layer 10 as a functional optical film and the original adhesive layer 20 form a functional optical film with an attached adhesive layer. Examples of polarizing films include hydrophilic polymer films that have undergone dyeing treatment with dichroic substances and subsequent stretching treatment. Examples of dichroic substances include iodine and dichroic dyes. Examples of hydrophilic polymer films include polyvinyl alcohol (PVA) films, partially formalized PVA films, and partially saponified films of ethylene-vinyl acetate copolymers. Examples of polarizing films also include polyene alignment films. Examples of materials for polyene alignment films include dehydrated PVA products and dehydrochlorinated polyvinyl chloride products. The polarizing film may also have a protective film bonded to one side and / or the other side in the thickness direction via an adhesive. From the viewpoint of ensuring the function, strength, and durability of the polarizing film, the thickness of the polarizing film is preferably 10 μm or more, more preferably 20 μm or more. From the viewpoint of achieving thinner laminated films, the thickness of the polarizing film is preferably 500 μm or less, more preferably 300 μm or less. Examples of phase retardation films include, for example, λ / 2 wavelength films, λ / 4 wavelength films, and viewing angle compensation films. Examples of materials for phase retardation films include, for example, polymer films that have undergone birefringence through a stretching process. Examples of polymer films include, for example, cellulose films and polyester films. Examples of cellulose films include, for example, triacetyl cellulose films. Examples of polyester films include, for example, polyethylene terephthalate films, polyethylene naphthalate films, and polyethylene terephthalate films. Examples of phase retardation films also include films comprising a substrate such as a cellulose film and an alignment layer of a liquid crystal compound such as a liquid crystal polymer on that substrate. From the viewpoint of ensuring the function and strength of the phase retardation film, the thickness of the phase retardation film is preferably 1 μm or more, and more preferably 2 μm or more. From the viewpoint of thinning laminated films, the thickness of the phase retardation film is preferably 100 μm or less, and more preferably 80 μm or less. As a material for the substrate film, the aforementioned materials can be used as release liner materials. When the film layer 10 is a substrate film, the first side 20a of the original adhesive layer 20 is bonded to this film layer 10. The film layer 10, as the substrate film, and the original adhesive layer 20 form a single-sided adhesive sheet. From the viewpoint of ensuring the strength of the substrate, the thickness of the substrate film is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 30 μm or more. From the viewpoint of thinning the laminated film, the thickness of the substrate film is preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The original adhesive layer 20 is formed of an adhesive composition. The adhesive composition includes a matrix polymer. The matrix polymer is an adhesive component that exhibits adhesive properties. Examples of matrix polymers include acrylic polymers, polyurethane polymers, polyamide polymers, and polyethylene ether polymers. The matrix polymer can be used alone or in combination of two or more. From the viewpoint of ensuring good transparency and adhesion of the original adhesive layer 20, it is preferable to use an acrylic polymer as the matrix polymer. Acrylic polymers are copolymers containing monomeric components of (meth)acrylates in a proportion of 50% by mass or more. "(Meth)acrylate" refers to acrylic acid and / or methacrylic acid. Alkyl methacrylates are preferred as (meth)acrylates, and more preferably alkyl methacrylates with an alkyl group having 1 to 20 carbon atoms. Examples of alkyl methacrylates include methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, pentyl methacrylate, n-hexyl methacrylate, heptyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, isooctyl methacrylate, nonyl methacrylate, isononyl methacrylate, decyl methacrylate, isodecyl methacrylate, undecyl methacrylate, and dodecyl methacrylate. The monomer component may also include copolymerizable monomers capable of copolymerizing with alkyl (meth)acrylates. Examples of copolymerizable monomers include those with polar groups. Examples of monomers containing polar groups include hydroxyl-containing monomers, monomers with nitrogen-containing rings, and monomers containing carboxyl groups. Monomers containing polar groups are beneficial for modifying acrylic polymers, such as introducing crosslinking points into the acrylic polymer and ensuring the cohesive strength of the acrylic polymer. Examples of hydroxyl-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. Examples of monomers with nitrogen-containing rings include N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylimidazolium, and N-(meth)acrylonitrile-2-pyrrolidone. The matrix polymer preferably has a cross-linked structure. Examples of methods for introducing the cross-linked structure into the matrix polymer include: a method in which a matrix polymer having functional groups capable of reacting with a cross-linking agent is formulated with a cross-linking agent into an adhesive composition, and the matrix polymer and cross-linking agent react in the adhesive layer (method 1); and a method in which a multifunctional monomer serving as a cross-linking agent is included in the monomer component forming the matrix polymer, and a matrix polymer with a branched structure (cross-linked structure) is formed by polymerization of the monomer component (method 2). These methods may also be used in combination. Examples of crosslinking agents used in the first method described above include compounds that react with functional groups (hydroxyl and carboxyl groups, etc.) contained in the matrix polymer. Examples of such crosslinking agents include isocyanate crosslinking agents, peroxide crosslinking agents, and epoxy crosslinking agents. Crosslinking agents can be used alone or in combination of two or more. In the second method described above, firstly, the monofunctional monomer used to form the matrix polymer is polymerized (prepolymerization), thereby preparing a prepolymer composition containing a portion of the polymer (a mixture of low-polymerization polymers and unreacted monomers). Secondly, a polyfunctional monomer as a crosslinking agent is added to the prepolymer composition, and then the portion of the polymer is polymerized with the polyfunctional monomer (formal polymerization). Examples of polyfunctional monomers include polyfunctional (meth)acrylates containing two or more vinyl unsaturated double bonds in one molecule. Examples of polyfunctional (meth)acrylates include ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol trimethacrylate, and dipentaerythritol hexamethacrylate. The matrix polymer can be formed by polymerizing the aforementioned monomer components. Examples of polymerization methods include solution polymerization, solvent-free photopolymerization (e.g., UV (ultraviolet) polymerization), bulk polymerization, and emulsion polymerization. Examples of solvents used in solution polymerization include ethyl acetate and toluene. Furthermore, examples of initiators used in polymerization include thermal polymerization initiators and photopolymerization initiators. From the perspective of ensuring the cohesiveness of the original adhesive layer 20, the weight-average molecular weight of the matrix polymer is preferably 100,000 or more, more preferably 300,000 or more, and even more preferably 500,000 or more. This weight-average molecular weight is preferably 5 million or less, more preferably 3 million or less, and even more preferably 2 million or less. The weight-average molecular weight of the matrix polymer is determined by gel permeation chromatography (GPC) and calculated from polystyrene. From the viewpoint of ensuring the flexibility of the original adhesive layer 20, the glass transition temperature (Tg) of the matrix polymer is preferably below 0°C, more preferably below -10°C, and even more preferably below -20°C. This glass transition temperature is, for example, above -80°C. Regarding the glass transition temperature (Tg) of the matrix polymer, the theoretical glass transition temperature can be obtained based on the following Fox equation. Fox's equation is the relationship between the glass transition temperature Tg of the polymer and the glass transition temperature Tgi of the homopolymer of the monomer constituting the polymer. In the following Fox equation, Tg represents the glass transition temperature (°C) of the polymer, Wi represents the weight fraction of monomer i constituting the polymer, and Tgi represents the glass transition temperature (°C) of the homopolymer formed from monomer i. Regarding the glass transition temperature of the homopolymer, literature values ​​can be used. For example, the glass transition temperatures of various homopolymers are listed in the "Polymer Handbook" (4th edition, John Wiley & Sons, Inc., 1999). On the other hand, the glass transition temperature of the homopolymer of the monomer can also be obtained using the method specifically described in Japanese Patent Application Publication No. 2007-51271. Fox's formula: 1 / (273 + Tg) = Σ[Wi / (273 + Tgi)] The adhesive composition may also contain other components as needed. Examples of other components include solvents, silane coupling agents, ultraviolet absorbers, adhesive-improving agents, softeners, and antioxidants. Examples of solvents include polymerization solvents used as needed during acrylic polymer polymerization and solvents added to the polymerization reaction solution after polymerization. Examples of such solvents include ethyl acetate and toluene. The haze of the original adhesive layer 20 is preferably 3% or less, more preferably 2% or less, and even more preferably 1% or less. The haze of the original adhesive layer 20 can be measured using a haze meter according to JIS K7136 (2000). Examples of haze meters include the "NDH2000" manufactured by Nippon Denshoku Kogyo Co., Ltd., and the "HM-150" manufactured by Murakami Color Technology Research Institute Co., Ltd. From the viewpoint of ensuring the cohesiveness of the original adhesive layer 20, the shear storage modulus of the original adhesive layer 20 at 25°C is preferably 10 kPa or more, more preferably 15 kPa or more, further preferably 20 kPa or more, and particularly preferably 25 kPa or more. From the viewpoint of achieving the required flexibility of the optical adhesive sheet for flexible display panel applications in the original adhesive layer 20, the shear storage modulus of the original adhesive layer 20 at 25°C is preferably 1000 kPa or less, more preferably 700 kPa or less, further preferably 500 kPa or less, and particularly preferably 300 kPa or less. Methods for adjusting the shear storage modulus include, for example, selecting the type of matrix polymer in the original adhesive layer 20, adjusting the molecular weight, adjusting the formulation amount, adjusting the glass transfer temperature, and adjusting the degree of crosslinking. Methods for adjusting the shear storage modulus also include selecting and adjusting the formulation amount of components other than the matrix polymer in the original adhesive layer 20. The shear storage modulus of the adhesive layer was determined by dynamic viscoelasticity measurement. This measurement was performed using the Advanced Rheometric Expansion System (ARES) manufactured by Rheometric Scientific. The measurement mode was set to shear mode, the measurement temperature range was set to -40°C to 100°C, the heating rate was set to 5°C / minute, and the frequency was set to 1 Hz. In this embodiment, the film layer 30 is a release liner. Materials used as the release liner include, for example, polyester, polyolefin, and polycarbonate. Specifically, regarding the film layer 10, the aforementioned release liner materials can be used. The film layer 30, as the release liner, is in contact with the second surface 20b of the original adhesive layer 20 in a peelable manner. The surface of this film layer 30 (the surface on the side of the original adhesive layer 20) is preferably subjected to a release treatment. Examples of release treatments include polysiloxane release treatment and fluorine release treatment. The thickness of the film layer 30 is, for example, 10 μm or more, and, for example, 200 μm or less. The laminated film X can be manufactured, for example, as follows: First, the adhesive composition described above is applied to film layer 10 to form a coating film. Next, film layer 30 is adhered to the coating film on film layer 10. Then, the coating film between film layers 10 and 30 is dried, and the coating film is irradiated with light as needed. This forms the original adhesive layer 20 between film layers 10 and 30. Examples of coating methods for the adhesive composition include roller coating, contact roller coating, gravure coating, reverse coating, roller brush coating, spray coating, dip roller coating, rod coating, doctor blade coating, air knife coating, curtain coating, lip coating, and die coating. The drying temperature of the coating film is, for example, 50°C to 200°C. The drying time is, for example, 5 seconds to 20 minutes. The laminated film X described above is supplied to the production line shown in Figure 2. In this embodiment, the production line sequentially includes a roll-out roller (not shown), a pair of rollers 61, 61, a laser processing machine 70, a pair of rollers 62, 62, a peeling roller 63, a pair of bonding rollers 64, 64, a peeling roller 65, a pair of bonding rollers 66, 66, a peeling roller 67, a pair of bonding rollers 68, 68, a stamping machine 80, a pair of rollers 69, 69, another peeling roller (not shown), and a first take-up roller (not shown) serving as the final take-up roller. A roll of laminated film X is provided on the roll-out roller. The laminated film X is wound out from this roll. The laminated film X, rolled out from the roll-out roll, is bonded to the carrier film C on the upstream side of the pair of rolls 61, 61, as shown in FIG. 3B. This forms the workpiece film W. The carrier film C is a single-sided adhesive film having an adhesive surface on one side of the thickness direction H. The adhesive surface of the carrier film C is bonded to the film layer 10 side of the laminated film X in the workpiece film W. Specifically, the workpiece film W sequentially comprises the carrier film C, film layer 10, original adhesive layer 20, and film layer 30 along the thickness direction H. Furthermore, in this embodiment, the carrier film C is wider than the laminated film X in the width direction D2 (FIG. 7), which is orthogonal to the travel direction D1 of the workpiece film W. The laminated film X is positioned at the center of the carrier film C in the width direction D2. This workpiece film W flows on the production line. That is, the laminated film X flows on the production line supported on the carrier film C. Before the first shaping process S2, as shown in Figure 2, the laminated film X is held by a pair of rollers 61, 61. Specifically, with the workpiece film W held by the pair of rollers 61, 61, each roller 61 rotates at a fixed speed, stretching the workpiece film W and conveying it towards the laser processing machine 70. In this way, appropriate tension can be applied to the workpiece film W, which is located upstream of the line above the rollers 61, 61. By applying appropriate tension to the workpiece film W, which is located upstream of the line above the rollers 61, 61, the bonding of the carrier film C and the bonding of the cover film for preventing smoke adhesion (if necessary) can be properly performed in the upstream area of ​​the line without producing defects such as wrinkles. In the first shape processing step S2, as shown in Figure 3C, an adhesive layer 21 is formed on the original adhesive layer 20 by laser processing of the workpiece film W using a laser processing machine 70 (Figure 2). The details are as follows. For the workpiece film W, a laser (laser light) is irradiated along the predetermined cutting line of the workpiece film W from the film layer 30 side toward the thickness direction H. This cuts the original adhesive layer 20 and film layer 30 on film layer 10. This cutting forms a monolithic adhesive layer 21 on the original adhesive layer 20, and a peripheral portion 22 (first peripheral portion) around the adhesive layer 21. Furthermore, on film layer 30, a film 31 (second film) on the adhesive layer 21 and a peripheral portion 32 (second peripheral portion) around the film 31 are formed. The peripheral portion 32 is located on the peripheral portion 31. A half-cut groove 10a is formed on film layer 10. The half-cut groove 10a is formed along the end edge 21a of the adhesive layer 21. Figure 7 is a top view showing an example of the area after the first shape processing step S2 of the workpiece film W. Lasers used for laser processing include, for example, gas lasers, solid-state lasers, and semiconductor lasers. Examples of gas lasers include excimer lasers and CO2 lasers. 2. Laser (10.6 μm) (The values ​​in parentheses represent the laser wavelength; the same applies to lasers below). As an excimer laser, for example, F... Two types of excimer lasers are used: 2 excimer lasers (157 nm), ArF excimer lasers (193 nm), KrF excimer lasers (248 nm), and XeCl excimer lasers (308 nm). Examples of solid-state lasers include Nd:YAG lasers (1064 nm), the second harmonic of an Nd:YAG laser (532 nm), the third harmonic of an Nd:YAG laser (355 nm), and the fourth harmonic of an Nd:YAG laser (266 nm). Examples of semiconductor lasers include semiconductor lasers with a wavelength of 405 nm. In laser processing, the pulse width of the irradiated laser is, for example, 0.5–50 μs, the pulse frequency is, for example, 1–200 kHz, the laser output is, for example, 2–250 W, and the spot diameter of the laser beam is, for example, 50–200 μm. After the first shaping process S2, as shown in FIG2, the workpiece film W is clamped by a pair of rollers 62, 62. Specifically, while the workpiece film W is clamped by the pair of rollers 62, 62, each roller 62 rotates at a fixed speed, stretching the workpiece film W and conveying it downstream. A suitable tension can be applied to the workpiece film W between the rollers 61, 61 and the rollers 62, 62. In the manufacturing method of this embodiment, this clamping process is included after the first shaping process S2 and before the next removal process S3. As detailed below, this manufacturing method is adapted to suppress the aforementioned first adhesion between the adhesive layer 21 and the surrounding portion 22 during this clamping process. Furthermore, the appropriate tension applied to the workpiece film W between the rolls 61, 61 and the rolls 62, 62 helps to suppress wrinkles and warping of the workpiece film W during laser processing, thereby fixing the focal length of the laser processing of the workpiece film W and thus helping to suppress uneven processing quality in laser processing. As shown in Figure 2, a removal process S3 is performed on the workpiece film W that has passed through the rollers 62 and 62 to sequentially remove the surrounding part 32, the surrounding part 22, and the film 31. In the removal process S3, firstly, as shown in Figures 2 and 4A, the peripheral portion 32 is removed from the workpiece film W by a peeling roller 63 (first sub-step). The peeling roller 63 has a roller surface 63a. The roller surface 63a, for example, has adhesive properties. This peeling roller 63 rotates in a fixed direction, and the roller surface 63a contacts the film layer 30 side of the workpiece film W, thereby adhering the peripheral portion 32 of the film layer 30 to the roller surface 63a and separating it from the peripheral portion 22 of the original adhesive layer 20. This peripheral portion 32 is then wound up by a specific second take-up roller (not shown). That is, the peripheral portion 32 is peeled off from the roller surface 63a. Next, as shown in Figures 2 and 4B, in the removal process S3, the transfer film F is bonded to the workpiece film W by a pair of bonding rollers 64, 64 (second sub-step). The transfer film F is, for example, a flexible plastic film. For example, polyethylene terephthalate (PET) film can be used as the plastic film. Specifically, in this step, the transfer film F is pressed against the film 31 side of the workpiece film W (opposite to the carrier film C) by passing the workpiece film W and the transfer film F between the bonding rollers 64, 64. Here, the periphery 22 of the original adhesive layer 20 is bonded to the transfer film F. Film 31 is not bonded to the transfer film F. Next, as shown in Figures 2 and 4C, the removal process S3 peels the transfer film F from the workpiece film W using the peeling roller 65 (third sub-step). In this embodiment, the peeling roller 65 has a roller surface 65a. The roller surface 65a, for example, has adhesive properties. This peeling roller 65 rotates in a fixed direction, and the roller surface 65a adheres to one side of the transfer film F in the thickness direction H, thereby peeling the transfer film F from the workpiece film W. At this time, the peripheral portion 22 (a portion of the original adhesive layer 20) adhering to the other side of the transfer film F in the thickness direction H separates from the film layer 10. The transfer film F with the peripheral portion 22 attached is then wound up by a specific third take-up roller (not shown). That is, the transfer film F is peeled from the roller surface 65a. Next, as shown in Figures 2 and 5A, the removal process S3 uses a pair of bonding rollers 66, 66 to bond the release tape T to the workpiece film W (fourth sub-step). The release tape T is a single-sided adhesive tape with an adhesive surface Ta. Specifically, this step involves passing the workpiece film W and the release tape T between the bonding rollers 66, 66 to bond the adhesive surface Ta of the release tape T to the film 31 of the workpiece film W. Next, as shown in Figures 2 and 5B, the removal process S3 uses a peeling roller 67 to peel the peeling tape T from the workpiece film W (fifth sub-step). In this embodiment, the peeling roller 67 has a roller surface 67a. The roller surface 67a has adhesive properties, for example. This peeling roller 67 rotates in a fixed direction and adheres the roller surface 67a to one side of the thickness direction H of the peeling tape T, thereby peeling the peeling tape T from the workpiece film W. At this time, the film 31 adhered to the adhesive surface Ta of the peeling tape T separates from the adhesive layer 21. The peeling tape T with the film 31 attached is then wound up by a specific fourth take-up roller (not shown). That is, the peeling tape T is peeled from the roller surface 67a. Secondly, as shown in Figures 2 and 5C, in the bonding process S4, a pair of bonding rollers 68, 68 are used to bond the strip film 40' as film layer 40 (third film layer) to the adhesive layer 21 side of the workpiece film W. In this embodiment, the film layer 40 is a release liner. Materials used as release liners include, for example, polyester, polyolefin, and polycarbonate. Specifically, regarding the film layer 10, the aforementioned release liner materials can be used. The film layer 40, serving as the release liner, is attached to one side of the adhesive layer 21 in a peelable manner relative to the thickness direction H. The surface of this film layer 40 (the surface on the adhesive layer 21 side) is preferably subjected to a release treatment. Examples of release treatments include polysiloxane release treatment and fluorine release treatment. From the viewpoint of ensuring the protective function of the adhesive layer 21, the thickness of the film layer 40 is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 30 μm or more. From the viewpoint of thinning the laminated film, the thickness of the film layer 40 is preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. As shown in Figure 8, the film layer 40 preferably has an extended end 40A (Figure 8 is a top view showing an example of the area after the bonding process of the workpiece film W). The extended end 40A extends outward from the end edge 10b of the film layer 10 in the width direction D2. In this embodiment, the extension length d1 of the extended end 40A measured from the end edge 10b in the width direction D2 is preferably 0 mm or more, more preferably 1 mm or more, and more preferably 50 mm or less, more preferably 30 mm or less. The case where the film layer 40 has this extended end 40A is preferable for forming the film 41 (Figures 6B and 9) with the extended end 41A from the film layer 40. The extended end 40A may also be located inward from the end edge 10b of the film layer 10 in the width direction D2. After the bonding process S4, as shown in Figure 2, the workpiece film W is relaxed between the pair of bonding rollers 68, 68 and the stamping machine 80. This allows the workpiece film W to be continuously fed to the bonding rollers 68, 68, or intermittently fed through the stamping machine 80 as described below. Secondly, as shown in Figure 6A, the second shape processing step S5 forms films 11 and 41 on film layers 10 and 40 by stamping using a stamping machine (Figure 2). The details are as follows. The stamping machine 80 includes, for example, an intermittent feeding device, a processing platform, and a stamping cutter (all figures omitted) disposed above the platform. The intermittent feeding device of the stamping machine 80 intermittently supplies the predetermined processing area of ​​the workpiece film W to the processing platform. On the processing platform, each predetermined processing area of ​​the intermittently supplied workpiece film W is stamped by the stamping cutter. Specifically, as shown in FIG6A, the film layers 10 and 40 on the carrier film C are cut by stamping the workpiece film W from the film layer 40 side with a stamping cutter (figure omitted) (the cut portion is schematically indicated by thick dashed lines in FIG6A). This forms films 11 and 41 with specific top-view shapes on the film layers 10 and 40. FIG9 is a top view showing an example of the area after the second shape processing step S5 of the workpiece film W. Furthermore, in this process, a peripheral portion 12 is formed around the film 11 of the film layer 10. A peripheral portion 42 is formed around the film 41 of the film layer 40. In the second shaping process S5, the cut portions of film layer 10 and film layer 40 are preferably substantially separated from adhesive layer 21 in a plane direction orthogonal to the thickness direction H. This preferred configuration is specifically as follows: Film 11 has an extended end portion 11A extending outward from the end edge 21a of adhesive layer 21 in the width direction D2. From the viewpoint of suppressing the aforementioned second adhesion in the manufactured laminated film Y, the extension length d2 of the extended end portion 11A from the end edge 21a is preferably 0.5 mm or more, more preferably 1 mm or more. The extension length d2 is, for example, 10 mm or less. Film 41 has an extended end portion 41A extending outward from the end edge 21a of adhesive layer 21 in the width direction D2. From the viewpoint of suppressing the aforementioned second adhesion in the laminated film Y, the extension length d3 of the extended end portion 41A from the end edge 21a is preferably 0.5 mm or more, more preferably 1 mm or more. The extension length d3 is, for example, 10 mm or less. The cut portions of film layer 10 and film layer 40 in the second shaping process S5 may also not substantially separate from the adhesive layer 21 in a plane direction orthogonal to the thickness direction H. In this case, the extension length d2 is, for example, 0.5 mm or less, preferably 0 mm, and the extension length d3 is, for example, 0.5 mm or less, preferably 0 mm. As shown in Figures 6B and 9, this process preferably involves cutting off the outer side of the film layer 10 in the width direction D2. This forms a film 41 having an extended end 41A that is longer than the extended end 11A in the width direction D2. This film 41 is easily peeled off from the adhesive layer 21. For example, this film 41 is easily peeled off from the adhesive layer 21 before the film 11. Regarding the difference d4 (=d3-d2) between the extended end 41A of the film 41 and the extended end 11A of the film 11 in the width direction D2, from the viewpoint of ensuring the ease of peeling of the film 41, it is preferably 1 mm or more, more preferably 2 mm or more, and even more preferably 3 mm or more. The difference d4 is, for example, 15 mm or less. In this process, the inner side of the film layer 10 in the width direction D2 can also be cut. When film layer 10 and film layer 40 are cut together (fully cut) inside the inner side of film layer 10, films 11 and 41 with substantially the same dimension in the width direction D2 are formed. The lengths of the extended ends 11A and 41A in the width direction D2 of these films 11 and 41 are also substantially the same. When film layer 40 is cut (fully cut) and film layer 10 is cut in half inside the inner side of film layer 10, film 11 with an extended end 11A longer than the extended end 41A of film 41 is formed. This type of film 11 is easier to peel off from the self-adhesive layer 21 before film 41. In this case, regarding the difference d4 (=d3-d2) in the width direction extension length of the extended end 41A of membrane 41 and the extended end 11A of membrane 11, from the viewpoint of ensuring the ease of peeling of membrane 11, it is preferably -1 mm or less, more preferably -2 mm or less, and even more preferably -3 mm or less, and for example, -15 mm or more. That is, when the extension lengths of the extended ends 11A and 41A are different, the absolute value of the difference d4 (|d3-d2|) in the extension lengths of the extended ends 11A and 41A is preferably 1 mm or more, more preferably 2 mm or more, and even more preferably 3 mm or more, and for example, 15 mm or less. Following the second shaping process S5, as shown in Figure 2, the workpiece film W is relaxed between the stamping machine 80 and a pair of rollers 69, 69. This allows for both intermittent feeding of the workpiece film W through the stamping machine 80 and continuous feeding downstream of the rollers 69, 69. Subsequently, the pair of rollers 69, 69 clamp the workpiece film W. Specifically, with the workpiece film W clamped by the pair of rollers 69, 69, each roller 69 rotates at a fixed speed, stretching the workpiece film W and conveying it downstream. This applies appropriate tension to the workpiece film W downstream of the rollers 69. Because of this appropriate tension downstream of the rollers 69, the peeling and recycling of the laminated film Y from the supporting film C can be appropriately performed. Next, as shown in Figure 6C, the peripheral portions 12 and 42 are removed from the workpiece film W passing between the rollers 69 and 69. For example, the peripheral portions 12 and 42 are removed from the workpiece film W by a peeling roller (not shown) with the same mechanism as the peeling roller 63. This leaves a single-sheet laminated film Y on the carrier film C. The laminated film Y has a film 11, an adhesive layer 21, and a film 41 sequentially along the thickness direction H. When film 11 is the aforementioned release liner, film 11 is, for example, a heavy release liner where the force required to peel off the adhesive layer 21 (peeling force) is greater than that required for film 41. In this case, film 41 is a light release liner where the peeling force required to peel off the adhesive layer 21 is less than that required for film 11. Alternatively, film 11 can be a light release liner with a lower peel force than film 41 when peeling off the self-adhesive layer 21, while film 41 can be a heavy release liner with a higher peel force than film 11 when peeling off the self-adhesive layer 21. When film 11 is the aforementioned functional optical film, film 11 and adhesive layer 21 form a functional optical film with an attached adhesive layer. In this case, film 41 is, for example, a release liner that is peelably attached to the adhesive layer side of the functional optical film. When film 11 is the aforementioned substrate film (support film), film 11 and adhesive layer 21 form a single-sided adhesive sheet. In this case, film 41 is, for example, a release liner that is peelably attached to the adhesive layer side of the single-sided adhesive sheet. Afterward, the laminated film Y is peeled off from the carrier film C, and the carrier film C is wound up by the first take-up roller. Alternatively, the carrier film C with the laminated film Y attached is wound up by the first take-up roller. In the manner described above, a laminated film Y (a laminated film having an adhesive layer) can be manufactured. In the first shaping step S2 of this manufacturing method, the original adhesive layer 20 on the film layer 10 is cut off by laser irradiation, and a monolithic adhesive layer 21 is formed on the original adhesive layer 20. Laser processing is suitable for continuously processing the original adhesive layer 20 while allowing the workpiece film W to flow continuously (without intermittently feeding the workpiece film W for shaping the original adhesive layer 20). Therefore, this manufacturing method is suitable for efficiently manufacturing a laminated film Y having an adhesive layer 21. In the first shaping process S2, the material of the original adhesive layer 20 evaporates and is removed from the portion irradiated with laser light onto the original adhesive layer 20. That is, in the first shaping process S2, the original adhesive layer 20 is partially removed, separating it to form an adhesive layer 21 and its surrounding portion 22. The original adhesive layer 20 is not cut into the adhesive layer 21 and the surrounding portion 22 by the insertion of a stamping tool; therefore, the aforementioned regression deformation of the previous manufacturing method does not occur in the adhesive layer 21 and the surrounding portion 22. This first shaping process S2 is suitable for suppressing the aforementioned first adhesion between the adhesive layer 21 and the surrounding portion 22 even when the original adhesive layer 20 is soft and easily deformable. In the second shaping process S5 of this manufacturing method, as described above, the film layers 10 and 40 on the carrier film C are cut by stamping the workpiece film W from the film layer 40 side with a stamping tool. This stamping process is suitable for shaping the films 10 and 40 with the adhesive layer 21, which has already undergone shaping, positioned between the film layers 10 and 40, without further shaping the adhesive layer 21. In the second shaping process S5, when the film 41 is shaped without shaping the adhesive layer 21, the predetermined cutting position in the film layer 40 is not sufficiently supported by the adhesive layer 21, and therefore the position in the thickness direction H is prone to change. Therefore, if laser processing is performed instead of stamping in the second shaping process S5, the laser light is not easily focused on the film layer 40. Therefore, the film layer 40 cannot be properly cut during laser processing. In contrast, in the second shape processing step S5 of this manufacturing method, the film layer 40 can be appropriately cut by pressing it with a stamping tool. As described above, this manufacturing method is suitable for efficiently manufacturing a laminated film Y having a soft adhesive layer 21. As described above, in the second shaping process S5, the cut portions of the film layers 10 and 40 are preferably separated from the adhesive layer 21 in a plane direction orthogonal to the thickness direction H (travel direction D1, width direction D2). The films 11 and 41 formed by this second shaping process S5 have extended ends 11A and 41A that extend further outward than the end edge 21a of the adhesive layer 21. The laminated film Y having these films 11 and 41 is suitable for suppressing the adhesive layer 21 from extending from the end edges of the films 11 and 41, and therefore suitable for suppressing the aforementioned second adhesion. In this manufacturing method, the first shape processing step S2 does not include relaxing the workpiece film W before laser irradiation. This manufacturing method eliminates the need for adjustment and control to relax the workpiece film W before laser processing on the aforementioned production line, which is preferable for efficiently manufacturing the laminated film Y with the adhesive layer 21. On the other hand, in this manufacturing method, as shown in FIG10, the first shape processing step S2 may also include relaxing the workpiece film W before laser irradiation. In this manufacturing method, the first shaping process S2 does not include relaxing the workpiece film W after laser irradiation. This manufacturing method eliminates the need for adjustment and control to relax the workpiece film W after laser processing on the production line, which is preferable for efficiently manufacturing the laminated film Y with the adhesive layer 21. Furthermore, the absence of relaxing the workpiece film W after laser irradiation in the first shaping process S2 is suitable for preventing the workpiece film from bending with a large radius of curvature on the production line, and is suitable for suppressing the formation of the first adhesion between the adhesive layer 21 and the surrounding portion 22 (the bending of the workpiece film W shortens the separation distance between the adhesive layer 21 and the surrounding portion 22, increasing the possibility of the first adhesion). On the other hand, in this manufacturing method, as shown in FIG10, the first shaping process S2 may also include relaxing the workpiece film W after laser irradiation. 10: Membrane layer (first membrane layer) 10a: Half-groove 10b: End edge 11: Membrane 11A: Extended end 12: Peripheral portion 20: Original adhesive layer 20a: First surface 20b: Second surface 21: Adhesive layer 21a: End edge 22: Peripheral portion (first peripheral portion) 30: Membrane layer (second membrane layer) 31: Membrane (second membrane) 32: Peripheral portion (second peripheral portion) 40: Membrane layer (third membrane layer) 40A: Extended end 40': Membrane 41: Membrane (third membrane) 41A: Extended end 42: Peripheral portion 61: Roll 62: Roll 63: Peeling roll 63a: Roll surface 64: Laminating roll 65: Peeling roll 65a: Roll surface 66: Laminating roll 67: Peeling roll 67a: Roll surface 68: Laminating roll 69: Roll 70: Laser processing machine 80: Stamping machine 90: Laminated sheet 91: Release liner 92: Adhesive layer 92a: Peripheral portion 92A: Optical adhesive sheet 93: Release liner 93a: Peripheral portion 93A : Peeling pad 95: Cutting groove 100: Knife assembly 101: Knife 201: Roll 202: Stamping machine 203: Roll C: Carrier film D1: Length direction D2: Width direction d1: Extension length d2: Extension length d3: Extension length E: End edge F: Transfer film H: Thickness direction S1: Process S2: Process S3: Process S4: Process S5: Process T: Peeling tape Ta: Adhesive surface W: Workpiece film X: Laminated film (laminated film with adhesive layer) Y: Laminated film Figure 1 is a flowchart of the manufacturing method of the laminated film having an adhesive layer according to the present invention. Figure 2 is a schematic diagram of a production line implementing the manufacturing method shown in Figure 1. Figures 3A to 3C show some steps of the manufacturing method shown in Figure 1. Figure 3A shows the step of preparing the laminated sheet (preparation step), Figure 3B shows the step of supporting the laminated sheet with a carrier film, and Figure 3C shows the first shaping step (laser processing). Figures 4A to 4C show the steps following the steps in Figure 3C. Figure 4A shows the first sub-step of the removal step, Figure 4B shows the second sub-step of the removal step, and Figure 4C shows the third sub-step of the removal step. Figures 5A to 5C show the steps following the steps in Figure 4C. Figure 5A shows the fourth sub-step of the removal step, Figure 5B shows the fifth sub-step of the removal step, and Figure 5C shows the bonding step. Figures 6A to 6C show the steps following the steps in Figure 5C. Figure 6A is a cross-sectional view showing the travel direction of the second shaping process (stamping), Figure 6B is a cross-sectional view showing the width direction of the second shaping process, and Figure 6C is a cross-sectional view of the workpiece film after the peripheries of the first and third film layers have been removed. Figure 7 is a top view of an example of the area after the first shaping process (Figure 3C) of the workpiece film. Figure 8 is a top view of an example of the area after the lamination process (Figure 5C) of the workpiece film. Figure 9 is a top view of an example of the area after the second shaping process (Figures 6A and 6B) of the workpiece film. Figure 10 shows a variation of the first shaping process. In this variation, the workpiece film is relaxed before and after the laser processing of the first shaping process. Figures 11A to 11D show an example of a manufacturing method for a laminated film with an adhesive layer. Figure 11A shows the process of preparing the laminated sheet, Figure 11B shows the stamping process, Figure 11C shows the removal process, and Figure 11D shows the cutting process. Figure 12 shows the stamping process of the tool assembly. Figure 13 is a partially enlarged cross-sectional view of the cut-off portion after the stamping process. Figure 14 shows an example of the previous stamping process. S1: Process S2: Process S3: Process S4: Process S5: Process

Claims

1. A method for manufacturing a laminated film having an adhesive layer, comprising a roll-to-roll method of manufacturing the laminated film having an adhesive layer, and further comprising: The first shaping process involves irradiating a strip of workpiece film, which sequentially comprises a carrier film, a first film layer, an original adhesive layer, and a second film layer along the thickness direction, with laser light from the second film layer side along the thickness direction to cut the original adhesive layer and the second film layer on the first film layer. This forms a monolithic adhesive layer and a first surrounding portion around the adhesive layer on the original adhesive layer. Similarly, it forms a second film on the adhesive layer and a second surrounding portion around the first surrounding portion of the second film. The removal process removes the second surrounding portion, the first surrounding portion, and the second film from the workpiece film. The bonding process, after the removal process, involves bonding a strip of film as the third film layer to the adhesive layer side of the workpiece film; and the second shaping process, after the bonding process, involves cutting the first film layer and the third film layer on the carrier film by punching the workpiece film from the third film layer side with a punching tool, forming a first film on the first film layer and a third film on the third film layer.

2. The method for manufacturing a laminated film having an adhesive layer as claimed in claim 1, wherein the cut portions of the first and third film layers in the second shaping process are separated from the adhesive layer in a plane direction orthogonal to the thickness direction.

3. The method for manufacturing a laminated film having an adhesive layer as claimed in claim 1, wherein after the first shaping process and before the removal process, a clamping process is further included, in which the workpiece film is clamped and stretched by a pair of rollers.

4. The method for manufacturing a laminated film having an adhesive layer as claimed in claim 1, wherein the first shape processing step does not include relaxing the workpiece film before subjecting the workpiece film to the laser light irradiation.

5. A method for manufacturing a laminated film having an adhesive layer as claimed in any of claims 1 to 4, wherein the first shaping process after subjecting the workpiece film to the laser irradiation does not include relaxing the workpiece film.

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