Adapter for coupling a liquid cooling loop subassembly of a computing system to a device rack manifold, device rack system and method for cooling a computing system in a device rack

Abstract

This invention relates to a connector for coupling a liquid cooling circuit subassembly of a computing system to a device rack manifold. The connector includes a body, a first connector mounted on the body, a second connector mounted on the body, and a flow control device disposed between the first and second connectors. The first connector couples the connector to a coupling member of the liquid cooling circuit subassembly. The second connector couples the connector to the device rack manifold. The flow control device can be configured to regulate the flow rate of a liquid coolant through the liquid cooling circuit subassembly. The connector can be further integrated into a rack assembly or a multi-rack assembly to achieve thermal management of multiple computing systems having cooling circuit subassemblies.

Description

Prior Technology

[0001] This application relates to the field of electronic devices, and more particularly to the use of liquid cooling for thermal management and cooling of wafer assemblies. Liquid cooling can be used within computing devices and on data center racks to help reduce heat generated by microelectronic components and wafer assemblies, as well as heat generated by external components.

[0002] Operating and maintaining large computing systems can be costly. These systems are typically stored in data centers, which require expensive hardware and equipment, as well as real estate and personnel to maintain the equipment stored there. To minimize costs, data center racks and the equipment on them are designed to be compact and capable of operating over extended periods, and are modular in architecture and configuration to accommodate changes in the components within the computing system.

[0003] The high power output of computing systems, data racks, and other equipment in data centers generates high levels of heat. This significant heat, both inside and around the computing systems, threatens their lifespan and operation.

[0004] Liquid cooling is a method for reducing heat in a system and keeping components within the system (such as chip assemblies and microprocessors) within operating temperature limits. Liquid cooling allows excess heat to be removed using heat transfer fluids pumped into a cooling device and heated return cooling liquid pumped out of the device.

[0005] At the server and rack level, liquid cooling of computing systems housed within server racks presents challenges. Among other issues, flow rates and pressure drops are inconsistent across the entire system. Furthermore, the heterogeneous nature of different computing systems within the same rack necessitates customized manual connectors. These problems increase overall cooling time and power consumption, leading to inefficient cooling and increased costs associated with computing system cooling. Summary of the Invention

[0006] According to one of the disclosed embodiments, a connector for coupling a liquid cooling circuit subassembly of a computing system to a device rack manifold includes a body, a first connector, a second connector, and a flow control device. The first connector is disposed on the body and couples the connector to a coupling member of the liquid cooling circuit subassembly. The second connector is disposed on the body and couples the connector to the device rack manifold. The flow control device is disposed between the first connector and the second connector and configured to regulate the flow rate of a liquid coolant through the liquid cooling circuit subassembly.

[0007] According to another aspect of the invention, a device rack system includes a supply manifold, a return manifold, a plurality of supply connectors, and a plurality of return connectors. The supply manifold has a plurality of supply inlet connections configured to dispense a coolant. The return manifold has a plurality of return outlet connections configured to receive the coolant. Each of the plurality of supply connectors has: a supply connector manifold connection configured to connect to a corresponding one of the supply inlet connections; and a supply coupling configured to couple to a corresponding coolant sub-assembly. Each of the plurality of return connectors has a return connector manifold connection configured to connect to a corresponding one of the return outlet connections.

[0008] Another aspect of the invention focuses on a method for cooling a computing system in a device rack, the method comprising attaching a cooling circuit assembly configured to cool components of the computing system to the device rack. The attachment further comprises: connecting a first connector of a supply adapter to a manifold supply inlet of a supply manifold for cooling liquid; connecting a second connector of the supply adapter to a supply coupling of an existing cooling circuit sub-assembly; connecting a first connector of a return adapter to a manifold return outlet of a return manifold configured to receive heated cooling liquid; and connecting the second connector of the return adapter to a return coupling of the existing cooling circuit sub-assembly. Simple Explanation of the Diagram

[0009] When read in conjunction with the accompanying drawings, a more complete understanding of the various embodiments of the invention disclosed herein can be obtained by referring to the following detailed description, in which:

[0010] Figure 1 is a schematic top view of an example of a computing system with a cooling circuit assembly according to the present invention;

[0011] Figure 2 is a schematic diagram of an example of a supply adapter for connecting a cooling circuit sub-assembly to a supply manifold according to the present invention;

[0012] Figure 3 is a schematic diagram of an example of a return adapter for connecting a cooling circuit sub-assembly to a return manifold according to the present invention;

[0013] Figure 4 is a schematic front view of an example of a rack system according to the present invention, which houses a computing system and other computing systems having the cooling circuit assembly of Figure 3;

[0014] Figure 5 is a schematic diagram of an example of the computing system and cooling circuit assembly of Figure 4 in an example cooling system according to the present invention;

[0015] Figure 6 is a schematic diagram of an example of a supply adapter for connecting a cooling circuit sub-assembly to a supply manifold according to the present invention;

[0016] Figure 7 is a schematic diagram of an example of a return adapter for connecting a cooling circuit sub-assembly to a return manifold according to the present invention;

[0017] Figure 7A is a schematic diagram of an example of a supply adapter for connecting a cooling circuit sub-assembly to a return manifold according to the present invention;

[0018] Figure 7B is a schematic diagram of an example of a return connector for connecting a cooling circuit sub-assembly to a return manifold according to the present invention;

[0019] Figure 8 is a schematic front view of an example of a rack system according to the present invention, accommodating a plurality of computing systems and supplying and returning adapters as shown in Figures 6 and 7;

[0020] Figure 9A is a graph showing the instance voltage drop at each computing system housed in the instance rack system illustrated in Figure 9C;

[0021] Figure 9B is a graph illustrating the instance flow rate at each computing system in the instance rack system shown in Figure 9C;

[0022] Figure 9C shows an example rack system that is the same as the rack system in Figure 4;

[0023] Figure 10A is a graph showing the instance voltage drop at each computing system housed in the instance rack system shown in Figure 10C;

[0024] Figure 10B is a graph illustrating the instance flow rate at each computing system in the instance rack system shown in Figure 10C;

[0025] Figure 10C is an example rack system that is the same as the rack system in Figure 8;

[0026] Figure 10D is a graph showing the instance voltage drop at each computing system housed in the instance rack system illustrated in Figure 10F;

[0027] Figure 10E is a graph illustrating the instance flow rate at each computing system in the instance rack system shown in Figure 10F;

[0028] Figure 10F is an example rack system that includes the same components as the rack system in Figure 9C;

[0029] Figure 10G is a graph illustrating the instance voltage drop at each computing system housed in the instance rack system shown in Figure 10I;

[0030] Figure 10H is a graph showing the instance flow rate at each computing system in the instance rack system shown in Figure 10I;

[0031] Figure 10I is an example rack system that includes the same components as the rack system in Figure 10C;

[0032] Figure 10J is a graph showing the instance voltage drop at each computing system housed in the instance rack system shown in Figure 10L;

[0033] Figure 10K is a graph showing the instance flow rate at each computing system in the instance rack system shown in Figure 10L;

[0034] Figure 10L is an example rack system including components similar to those of the rack system in Figure 10F, except that the example supply and return adapters of the first system include flow control devices;

[0035] Figure 11A is a schematic diagram of an example of the rack system of Figure 4 implemented in an example cooling system according to the present invention;

[0036] Figure 11B is a graph showing the example flow rates at each device rack system in the cooling system of Figure 11A;

[0037] Figure 12A is a schematic diagram of an example of the rack system of Figure 8 implemented in an example cooling system according to the present invention;

[0038] Figure 12B is a graph showing the flow rates at various device rack systems in the cooling system of Figure 12A;

[0039] Figure 13A is a graph showing the relationship between pressure drop and flow rate in a system using a connector with a flow rate control device and a system without a connector with a flow rate control device;

[0040] Figure 13B is a graph showing the relationship between power and flow rate in a system using a connector with a flow rate control device and a system without a connector with a flow rate control device;

[0041] Figure 14 is a schematic diagram of the supply adapter according to the present invention;

[0042] Figure 15 is a schematic diagram of the return adapter according to the present invention;

[0043] Figure 16 is a schematic diagram of the supply adapter according to the present invention;

[0044] Figure 17 is a schematic diagram of the return adapter according to the present invention;

[0045] Figure 18 is a schematic diagram of the supply adapter according to the present invention; and

[0046] Figure 19 is a schematic diagram of the return adapter according to the present invention. Implementation

[0047] Liquid cooling systems and cold plates are used to dissipate heat within wafer assemblies, computing systems, and data server rack systems. Liquid-cooled processors require high coolant flow rates to maintain computing performance and system reliability. As wafer power increases, the liquid flow rate must also increase to keep up with the increased heat generated by the wafer. This leads to a significant increase in the voltage drop across the connectors of the cooling circuit assembly. Furthermore, the pumping power consumed by the voltage drop in the connectors does not contribute to cooling.

[0048] To address the drawbacks associated with providing higher flow rates at increased power and cost, an improved liquid cooling system is disclosed. According to an embodiment of the invention, this improved cooling system may include adapters designed to couple an existing liquid cooling circuit subassembly of a computing system to a rack manifold. In some instances, supply adapters may be individually coupled to supply couplings of existing liquid cooling circuit subassemblies. Similarly, return adapters may be individually coupled to return supply couplings of existing liquid cooling circuit subassemblies. This allows for the design of adapters configured to couple a rack manifold to any computing system having an existing cooling circuit specific to the computing system, without redesigning the entire existing liquid cooling assembly of the computing system. It further allows for the use of different types and sizes of connectors, rack machines, and configuration flexibility, as well as easier hose management.

[0049] The use of supply and / or return adapters also provides operators with the ability to adjust one or more characteristics of the coolant, such as flow rate, particulate matter in the coolant, and monitoring. For example, but not limited to, supply and return adapters may further include: flow control devices, such as valves, auxiliary pumps, and the like, for adjusting the flow rate through the cooling circuit; filters for filtering particulate matter in the coolant; and monitoring of various states of the coolant and / or other states of the overall cooling system.

[0050] Figure 1 illustrates an example system 100, which may be a server-side computing system. It includes a cooling circuit assembly 110 that facilitates thermal management and liquid cooling of microelectronic devices (not shown) on a circuit board 112 of a computing device 114. The cooling circuit assembly 110 includes an example existing cooling circuit sub-assembly 110A ("PE sub-assembly"), a supply adapter 118 for connecting the PE sub-assembly 110A to a coolant supply unit (such as a supply manifold (not shown)), and a return adapter 124 for connecting the PE sub-assembly 110A to a return unit (such as a return manifold (not shown)). The supply adapter 118 and the return adapter 124 can be used to couple the respective supply manifold and return manifold to the system supply coupler 136 and system return coupler 138 of the PE sub-assembly 110A.

[0051] Circuit board 112 may include a motherboard, a mainboard, or the like. In this example, the cooling circuit assembly 110 may be the only circuit implemented on circuit board 112 for cooling all components connected to the cooling circuit assembly 110 on circuit board 112. The cooling circuit assembly 110 and the corresponding computing device 114 may be one of a plurality of cooling circuits and computing devices in a data center server rack (see Figure 4), but in other examples, the cooling circuit 110 may be used as part of a standalone individual computing system.

[0052] The PE sub-assembly 110A can be a cooling circuit, configured in any way to allow liquid cooling of components on the circuit board 112. In this example, the PE sub-assembly 110A (and the overall cooling circuit assembly 110) can be fluidly connected to cooling devices 130a, 130b, 130c, 130d on the circuit board 112. Each cooling device 130a, 130b, 130c, 130d may include respective supply inlets 132a, 132b, 132c, 132d and return outlets 134a, 134b, 134c, 134d. As shown, the PE sub-assembly 110A includes an existing circuit supply coupler 136 ("PE supply coupler") and an existing circuit return coupler 138 ("PE return coupler"), which can be collectively referred to as the PE coupler. In this example, the cooling circuits may be a network of interconnected hoses, but in other examples, any mechanism that allows fluid interconnection, such as pipes, conduits, or the like, may be used.

[0053] The adapter can be coupled to a PE coupler to provide a connection between the PE coupler of the PE subassembly 110A and the respective inlets and outlets of the rack supply and return manifold, and to accommodate any differences between the PE coupler of the PE subassembly 110A and the respective inlets and outlets of the rack supply and return manifold. Referring to Figure 2, Figure 2 illustrates an example supply adapter removed from the cooling circuit assembly 110. The supply adapter 118 may include an adapter supply line 119, which may be a conduit, hose, or the like extending between a supply connector 120 at a first end 121 of the adapter 118 and a supply coupler 122 at a second end 123 of the adapter 118. Example return adapters, such as return adapter 124 shown in Figure 3, may similarly include a return connector 126 located at a first end 125 of return adapter 124, a return coupler 128 located at a second end 129 of return adapter 124, and a adapter return line 127 extending between return connector 126 and return coupler 128. In this example, supply connector 120 may be coupled to a liquid cooling supply source or manifold of a larger cooling system (see Figures 4 and 5) (not shown in this view), and return connector 126 may be connected to a liquid cooling return section or manifold (not shown in this view).

[0054] In this example, the supply and return adapters are shown with different configurations. However, in other examples, a universal adapter with connectors configured to couple both the return and supply adapters can be provided, allowing the return and supply adapters to be a single adapter.

[0055] Supply connector 120 and return connector 126 may be quick disconnect fittings, designed to provide quick and easy connection and disconnection to and from individual supply and return sources. Examples of quick disconnect fittings include snap-fit ​​(e.g., spring-loaded ball latch type), non-latch type, double-close type, and dry-break quick disconnect fittings. Compared to simple fittings, quick disconnect fittings can provide a larger voltage drop. Furthermore, quick disconnect fittings do not require tools for assembly and disassembly. In other examples, different types of connectors, such as quick connectors, may be used. In other examples, supply connector 120 and / or return connector 126 may be conventional connectors, requiring tools to attach the connectors to and remove them from individual rack manifolds or supply and return sections.

[0056] As shown in Figure 1, the adapter supply line 119 and board supply line 144 connect the supply connector 120 of the supply adapter 118 to the board supply manifold 150. Coolant can be distributed along the length of the board supply manifold 150 throughout the circuit board 112. This allows coolant to reach and be distributed to each of the cooling units 130a, 130b, 130c, and 130d. As shown, the board supply manifold 150 is positioned adjacent to at least one edge of each of the cooling units 130a, 130b, 130c, and 130d. However, in other embodiments, the board supply manifold 150 can be positioned anywhere on the circuit board 112 and can be of any shape or size. Secondary supply lines 146a, 146b, 146c, and 146d extend from supply manifold 150 to supply inlets 132a, 132b, 132c, and 132d of individual cooling units 130a, 130b, 130c, and 130d.

[0057] Return line 148 and adapter return line 127 connect the return connector 126 of return adapter 124 to board return manifold 152. Board return manifold 152 can extend parallel to board supply manifold 150, and in this example extends along the length of board 112 and adjacent to at least one edge of each cooling device 130a, 130b, 130c, 130d. Secondary return lines 154a, 154b, 154c, 154d extend between board return manifold 152 and each return outlet 134a, 134b, 134c, 134d of each cooling device 130a, 130b, 130c, 130d.

[0058] Cooling devices 130a, 130b, 130c, and 130d can be conventional liquid cooling devices, such as cold plates, heat sinks, or other devices that can be used in conjunction with liquid cooling of wafers or microelectronic assemblies. Cooling devices 130a, 130b, 130c, and 130d are shown with the same configuration, but in other instances, one or more of cooling devices 130a, 130b, 130c, and 130d may be different. Furthermore, cooling devices 130a, 130b, 130c, and 130d can be configured in any configuration, and any number of cooling devices can be configured on the system.

[0059] The cooling circuit assembly 110 can continuously pump coolant through the supply connector and supply line, and can pump heated return coolant through the return line and return connector. The coolant can be any known coolant from a continuous coolant source or a cooler system. Coolant may include, for example, water, deionized water, inhibited ethylene glycol and aqueous solutions, dielectric fluids, and any suitable coolant.

[0060] During operation, coolant from a primary source, such as rack supply manifold 164 (see Figure 4), enters circuit assembly 110 via supply connector 120 of adapter 118 in the direction indicated by arrow A. The incoming coolant (indicated by the diagonal shading pattern in the example described herein) is then dispersed along the length L of board supply manifold 150 and into the secondary supply lines 146a, 146b, 146c, 146d. The coolant flow continues through the secondary supply lines 146a, 146b, 146c, 146d and into the supply inlets 132a, 132b, 132c, 132d of the individual cooling units 130a, 130b, 130c, 130d. The heated surfaces of cooling units 130a, 130b, 130c, and 130d heat the cooling liquid and raise its temperature. The heated return cooling liquid (indicated by square crosshairs in the examples described herein) exits each cooling unit 130a, 130b, 130c, and 130d through individual cooling unit return outlets 134a, 134b, 134c, and 134d, and flows to the plate return manifold 152 via secondary return lines 154a, 154b, 154c, and 154d. The heated return cooling liquid is then dispersed from the plate return manifold 152 via return line 148 and connector return line 127, which connects to the primary return section, such as the rack return manifold 166 (see Figure 4).

[0061] Supply adapter 118 and return adapter 124 facilitate quick and easy coupling of the PE coupler to individual supply and return sources. For example, a system 100 including the PE sub-assembly 110A can be purchased from a first company that has already designed the PE sub-assembly 100A for that specific system 100. The PE coupler can be a set of universal couplers that may or may not be compatible with the supply and return connections on the rack manifold used by the second company. When one or more PE couplers are not directly compatible with the individual supply and return connections of the second company, the entire PE sub-assembly 110A or a portion thereof must be completely redesigned to be compatible with the second company's connections. This may require a significant amount of time and effort to ensure the connection between the PE coupler and the second company's connections. In the worst-case scenario, this would require the entire hose network of the PE sub-assembly 110A designed by Company 1 to be replaced with a new set of hoses and connectors compatible with Company 2. However, the use of return and supply adapters allows Company 2's system to be compatible with Company 1's connectors and manifolds without requiring redesign or significant difficulties. For example, Company 2 could introduce upgraded or new products using different connectors (sizes and / or types). Instead of having to replace each rack manifold and shut down all machines and computing devices in the rack, the use of return and supply adapters allows operators to limit the necessary changes to a single tray-level system that needs to be decoupled from the rack.

[0062] Figure 4 is a schematic diagram illustrating an example rack system 102, which further includes several computing systems or tray-level systems housed within a device rack 162. The rack 160 of the computing device rack 162 houses system 100. For ease of discussion, system 100 will also be referred to herein as system A. The cooling circuit assembly 110 of the computing device 114 of system 100 is also shown. The cooling circuit assembly 110 further includes a supply adapter 118 and adapter supply line 119, a return adapter 124 and adapter return line 127, and a PE sub-assembly 110A. A plurality of other computing systems B through E, comprising individual computing devices 114-1, 114-2, 114-3, 114-4, cooling circuit assemblies 110-1, 110-2, 110-3, 110-4, supply adapters 118-1, 118-2, 118-3, 118-4, and return adapters 124-1, 124-2, 124-3, 124-4, all forming part of rack system 102 and shown on individual shelves 160-1, 160-2, 160-3, 160-4 of computing device rack 162. Systems B through E may include the same functions as system A, and for ease of discussion, systems B through E are not fully described. In some instances, computing devices 114, 114-1, 114-2, 114-3, and 114-4 form a homogeneous computing system, wherein the individual computing systems on rack 160 are identical and have the same PE cooling circuit sub-assemblies 110A, 110A-1, 110A-2, 110A-3, and 110A-4, and the same supply couplings 136, 136-1, 136-2, 136-3, and 136-4 and PE return couplings 138, 138-1, 138-2, 138-3, and 138-4. Furthermore, systems B through E may include: supply adapters 118-1, 118-2, 118-3, and 118-4, each having individual adapter supply lines 119-1, 119-2, 119-3, and 119-4; and return adapters 124-1, 124-2, 124-3, and 124-4, each having individual adapter return lines 127-1, 127-2, 127-3, and 127-4. In other instances, one or more of the overall systems A through E may differ, resulting in heterogeneous computing systems. For example, computing devices 114, 114-1, 114-2, 114-3, and 114-4, together with their corresponding PE subassemblies 110A, 110A-1, 110A-2, 110A-3, and 110A-4, may differ from one another. Multiple supply and return connection points along rack supply manifold 164 and rack return manifold 166 to the primary coolant source and primary coolant return section are shown, as further discussed below. Rack 102 and systems A through E are shown in one configuration, but any configuration, including more or fewer systems on the rack, can be used.

[0063] Rack supply manifold 164 extends the length of computing unit rack 162 and connects to a central coolant supply line 168. Rack supply manifold 164 distributes coolant along the entire length of the rack and provides coolant sources to the respective cooling circuit assemblies 110, 110-1, 110-2, 110-3, and 110-4 of each of the individual computing units 114, 114-1, 114-2, 114-3, and 114-4. As shown, each system connects to rack supply manifold 164 at a supply inlet or connection point. For example, system A is coupled to rack supply manifold 164 at a rack supply connection point or supply inlet connector 170a. Similarly, systems B through E are coupled to rack supply manifold 164 at respective rack supply connection points 170b, 170c, 170d, and 170e. Connection points or manifold inlet connectors 170a to 170e may be connected to supply inlets or openings leading to rack supply manifolds 164. In some instances, connection points 170a to 170e include mechanisms or mechanical fasteners or the like for coupling to individual systems A to E. In some instances, supply connection points 170a to 170e may be threaded or include interlocking members for mechanically attaching to supply lines to individual systems. In this example, individual supply adapters 118, 118-1, 118-2, 118-3, and 118-4 will connect to individual supply connection points or supply inlet connectors 170a, 170b, 170c, 170d, and 170e, as further discussed below.

[0064] Rack return manifold 166 similarly extends the length or overall height of computing unit rack 162 to provide a return section for heated cooling fluid returning from the system, and pumps the fluid from computing unit rack 162 into central return line 169 to return the heated cooling fluid to the system source for cooling. Rack supply manifold 164 distributes the heated cooling fluid along the entire length of the rack and provides conduits to distribute the heated cooling fluid to primary return sections (not shown). As shown, each system A through E is connected to rack return manifold 166 at a return inlet or connection point. For example, system A is coupled to rack return manifold 166 at rack return connection point or rack return connector 172a. Similarly, systems B through E are each coupled to rack return manifold 166 at individual rack return connectors 172b, 172c, 172d, and 172e. Similar to supply connection points 170a to 170e, rack return connection points 172a, 172b, 172c, 172d, and 172e may lead to the outlet or opening of rack return manifold 166. In this example, individual return adapters 124, 124-1, 124-2, 124-3, and 124-4 will connect to individual return connections 172a, 172b, 172c, 172d, and 172e, as further discussed below.

[0065] Rack supply manifold 164 and rack return manifold 166 extend along the side of the rack, but in other instances, one or both of the rack supply manifold or rack return manifold may be located at any location adjacent to the computing device rack 162, including, for example, on the front side, rear side, or same side of the server rack.

[0066] The PE sub-assembly 110A of the cooling circuit assembly 110 of the computing device 114 is shown having a PE supply coupling 136 and a PE return coupling 138. A supply adapter 118 couples the PE sub-assembly 110A to a rack supply connection point 170a. In this example, one end of the supply adapter 118 is coupled to the PE supply coupling 136 via an adapter supply coupling 122. The other end of the supply adapter 118 is connected to the supply connection point 170a on the supply manifold 164 via an adapter supply connector 120.

[0067] Return adapter 124 couples the PE subassembly 110A to the rack return connection point or rack return connector 172a. In this example, one end of return adapter 124 is coupled to the PE return connector 138 via adapter return coupler 128. At the other end of return adapter 124, return connector 126 connects to the rack at return connector 172a.

[0068] Each of the remaining computing units 114-1, 114-2, 114-3, and 114-4 on rack 162 has a separate cooling circuit assembly 110-1, 110-2, 110-3, and 110-4, including separate supply adapters 118-1, 118-2, 118-3, and 118-4, return adapters 124-1, 124-2, 124-3, and 124-4, and PE subassemblies 110A-1, 110A-2, 110A-3, and 110A-4. Each PE subassembly has separate PE supply couplers 136-1, 136-2, 136-3, and 136-4, and PE return couplers 138-1, 138-2, 138-3, and 138-4. Supply adapters 118-1, 118-2, 118-3, and 118-4 similarly couple individual PE supply couplers 136-1, 136-2, 136-3, and 136-4 to individual rack supply connection points 170b, 170c, 170d, and 170e. Return adapters 124-1, 124-2, 124-3, and 124-4 couple individual PE return couplers 138-1, 138-2, 138-3, and 138-4 to individual rack return connections 172b, 172c, 172d, and 172e. As shown, the first end of each return adapter 124-1, 124-2, 124-3, and 124-4 is connected to the respective PE return adapters 138-1, 138-2, 138-3, and 138-4 via adapter return couplers 128-1, 128-2, 128-3, and 128-4. The second end of each return adapter 124-1, 124-2, 124-3, and 124-4 is connected to the respective rack return connectors 172b, 172c, 172d, and 172e via return connectors 126-1, 126-2, 126-3, and 126-4.

[0069] Figure 5 illustrates an example cooling system 180 comprising a plurality of rack systems. Rack system 102 is shown as one of the plurality of rack systems forming part of cooling system 180. In this example, cooling system 180 may include any number of additional rack systems, and in this example, further includes rack systems 102-1, 102-2, which may be similar to rack system 102 and are not described further for ease of discussion. In other examples, rack system 102 may be a single data rack connected to at least one cooling system, or may be one of any number of racks forming part of a cooling system.

[0070] Water source 182 can pump liquids such as water to cooling unit 184. Cooling unit 184 can be any conventional cooling unit 184 capable of cooling the water within it to a preset temperature. Water from cooling unit 184 is then pumped to central distribution unit 186, which further pumps and distributes the coolant through central coolant supply line 168 into rack supply manifolds 164, 164-1, 164-2 and into the first and second connectors (not shown) of each computing device (not shown) in individual computing device racks 162, 162-1, 162-2. Heated return coolant exits individual computing device racks 162, 162-1, 162-2 through rack return manifolds 166, 166-1, 166-2, then enters central coolant return line 169, and finally returns to central distribution unit 186. The central distribution unit 186 then pumps the heated return coolant to the cooling unit 184, where it is cooled and then circulated back to the central distribution unit 186, and then pumped back into the system. It should be understood that the central supply and return subsystem component 181 provides a method or configuration for cooling and distributing coolant to the central supply and return lines, but numerous other instances or configurations can be used to achieve the same functionality. For example, the lines may run underground, allowing for the use of additional or fewer cooling components.

[0071] The supply and return adapters provide a mechanism that allows operators to quickly and easily attach several cooling circuit sub-assemblies of individual systems housed in the rack to the rack supply manifold. The supply and return adapters can be modified to accommodate different PE circuit sub-assemblies for different computing systems. The supply and return adapters can also be further modified or enhanced to optimize the operation of the cooling circuit assembly. Figure 6 illustrates an example supply adapter 218 including a flow control device. The flow control device can be any device, mechanism, or subsystem used to control the flow rate, including but not limited to valves, auxiliary pumps, combinations of valves and auxiliary pumps on the same or different adapters, or other devices or combinations of devices configured to limit the flow rate of liquid through the system.

[0072] In the example shown in Figure 6, the flow control device 288 may be a valve already incorporated into the connector to regulate the flow rate. This valve may be an actively adjustable valve, such as a manually operated valve, and / or a fully or partially automatic valve, such as a valve controlled by a computer. The valve may also be a fixed flow-limiting device, such as an orifice. As in the previous example, the supply connector 218 may also include a connector supply line 219, which may be a pipe or hose, or the like, extending between the supply connector 220 at the first end 221 of the supply connector 218 and the supply coupler 222 at the second end 223 of the supply connector 218. The supply line 219 will guide coolant through the flow control device 288, which may be positioned along the connector supply line 219. In other instances, the flow control device 288 may be located at other locations on the supply adapter 218, and the supply line 219 or other parts of the supply adapter may be configured to guide coolant through the flow control device.

[0073] Figure 7 illustrates an example return adapter 224, which includes a flow control device 290 configured to control the flow rate of fluid passing through the return adapter 224. The flow control device 290 can also control the flow rate of fluids such as heated fluid exiting a cooling circuit assembly of a tray-level system to which the return adapter 224 is connected. The flow control device 290 may be positioned along adapter return line 227, but in other examples, it may be positioned elsewhere. The return adapter 224 may further include: a return connector 226 at a first end 225 of the return adapter 224; a return coupler 228 at a second end 229 of the return adapter 224; and an adapter return line 227 extending between the return connector 226 and the return coupler 228. The adapter return line 227 will direct coolant through the flow control device; however, in other instances, a different return line or device may be used to direct coolant through the flow control device. In instances where the flow control device 290 is a valve, the valve may be the same as or different from the valve of the supply adapter 218. Furthermore, in other instances, only the supply adapter 218 may include a flow control device, while the return adapter does not. In still other instances, the flow control device may additionally or alternatively be an auxiliary pump.

[0074] Figure 7A illustrates an alternative configuration where the flow control device is an auxiliary pump. In contrast to a flow-limiting valve, the auxiliary pump can be used to drive flow through the cooling system to regulate flow through the cooling circuit and the overall rack system. As shown, the flow control device 1288 can be an auxiliary pump that has been directly integrated into the supply adapter to assist in regulating the flow rate. The pump can be any type of pump capable of moving fluid and otherwise facilitating the regulation of fluid flow rate. Some non-limiting examples include positive displacement pumps, rotary multi-lobe pumps, progressive chamber pumps, rotary gear pumps, piston pumps, gear pumps, screw pumps, peristaltic pumps, plunger pumps, velocity pumps, rotary power pumps, radial pumps, rotary or reciprocating positive displacement pumps, or any known pump. Similar to the previous examples, the supply adapter 1218 may include a adapter supply line 1219, which may be a pipe or hose, or the like, extending between a supply connector 1220 at a first end 1221 of the supply adapter 1218 and a supply coupler 1222 at a second end 1223 of the supply adapter 1218. The supply line 1219 will guide coolant through a flow control device 1288, which may be positioned along the adapter supply line 1219. In other examples, the flow control device 1288 may be positioned at other locations on the supply adapter 1218, and the supply line 1219 or other portions of the supply adapter may be configured to guide coolant through the flow control device. In still other examples, an auxiliary pump may be positioned precisely before or after each of the respective first ends 1221 and second ends 1223.

[0075] Figure 7B illustrates an example return connector 1224, which includes a flow control device 1290 that controls the flow rate of fluid passing through the return connector 1224. The flow control device 1290 can also control the flow rate of fluids such as heated fluid exiting a cooling circuit assembly of a tray-level system to which the return connector 1224 is connected. The flow control device 1290 may be an auxiliary pump positioned along the connector return line 1227; however, in other examples, the flow control device 1290 may be positioned elsewhere along the return connector 1224 or positioned directly adjacent to the return connector 1224. The return adapter 1224 may further include: a return connector 1226 at a first end 1225 of the return adapter 1224; a return coupler 1228 at a second end 1229 of the return adapter 1224; and a adapter return line 1227 extending between the return connector 1226 and the return coupler 1228. The adapter return line 1227 will guide coolant through the flow control device, but in other instances, another return line or device may be used or alternatively used to guide coolant through the flow control device.

[0076] Figure 8 is a schematic diagram illustrating the use of supply adapters 218 and return adapters 224 in an example rack system 202, which houses multiple systems A1, B1, C1, D1, and E1 on individual rack frames 260, 260-1, 260-2, 260-3, and 260-4. The only structural difference between systems A1 to E1 of rack system 202 and systems A (also system 100) to E of rack system 102 of Figures 1 to 5 is that at least some of the supply adapters and return adapters of the rack system further include flow control features to regulate the flow rate of cooling fluid entering the cooling circuit 210 and the flow rate of heated liquid exiting the cooling circuit 210. The description of the features in Figures 1 to 5 is equally applicable here in other respects.

[0077] As in the previous example, system A1 of rack system 202 includes: a computing device 214 positioned on a rack 260 of computing device rack 262; and a cooling circuit assembly 210. The cooling circuit assembly 210 further includes a supply adapter 218 without flow control, a return adapter 224 without flow control, and a PE sub-assembly 210A. The PE sub-assembly 210A of the cooling circuit assembly 210 of computing device 214 is shown having a PE supply coupler 236 and a PE return coupler 238. In other examples, one or both of the supply adapter 218 and the return adapter 224 may include flow control devices.

[0078] Supply adapter 218 couples the PE subassembly 210A to the rack supply connection point 270a. In this example, one end of supply adapter 218 is coupled to the PE supply coupler 236 via adapter supply coupler 222. The other end of supply adapter 218 is connected to the supply connection point 270a on the supply manifold 264 via adapter supply connector 220.

[0079] Return adapter 224 connects the PE sub-assembly 210A of system A1 to the rack return manifold 266. In this example, one end of return adapter 224 is coupled to PE return coupler 238 via adapter return coupler 228. At the other end of return adapter 224, return connector 226 is coupled to rack return manifold 266 at return connector 272a.

[0080] The remaining computing devices 214-1, 214-2, 214-3, and 214-4 on rack 262 also include: respective cooling circuit assemblies 210-1, 210-2, 210-3, and 210-4; and respective supply adapters 218-1, 218-2, 218-3, and 218-4, each with its own flow control device 288-1, 288-2, 288-3, and 288-4; respective return adapters 224-1, 224-2, 224-3, and 224-4, each with its own return flow control device 290-1, 290-2, 290-3, and 290-4; and respective PE subassemblies 210A-1, 210A-2, 210A-3, and 210A-4. As in the previous example, the flow control devices 288-1, 288-2, 288-3, and 288-4 supplying adapters 218-1, 218-2, 218-3, and 218-4 can be located along adapter supply lines 219-1, 219-2, 219-3, and 219-4. The flow control devices 290-1, 290-2, 290-3, and 290-4 returning to adapters 224-1, 224-2, 224-3, and 224-4 can be located along adapter return lines 227-1, 227-2, 227-3, and 227-4. In this example, the flow control devices 288-1, 288-2, 288-3, and 288-4 supplying the adapters can be valves; however, in other examples, one or more flow control devices supplying the adapters can instead be auxiliary pumps. Furthermore, the flow control devices 290-1, 290-2, 290-3, and 290-4 of the return connectors 224-1, 224-2, 224-3, and 224-4 may be valves; however, in other instances, one or more flow control devices of the return connectors may be auxiliary pumps. In this regard, in any cooling circuit, a pump, valve, or a combination of both may be implemented in combination with or in series with the supply or return connectors to control the flow through the cooling circuit of the individual system.

[0081] Each remaining PE sub-assembly can further include individual PE supply couplers 236-1, 236-2, 236-3, 236-4 and PE return couplers 238-1, 238-2, 238-3, 238-4. Supply adapters 218-1, 218-2, 218-3, 218-4 couple each remaining and corresponding PE supply couplers 236-1, 236-2, 236-3, 236-4 to supply manifold 264. As shown, supply connectors 220-1, 220-2, 220-3, 220-4 couple one end of the supply adapter to individual rack connection supply points 270b, 270c, 270d, 270e. The supply couplings 222-1, 222-2, 222-3, and 222-4 are positioned at the other end of the respective supply adapters 218-1, 218-2, 218-3, and 218-4, and are directly coupled to the corresponding PE supply couplings 236-1, 236-2, 236-3, and 236-4.

[0082] Return adapters 224-1, 224-2, 224-3, and 224-4 couple the respective PE subassemblies 210A-1, 210A-2, 210A-3, and 210A-4 to return manifold 266. As shown, the PE return couplers 238-1, 238-2, 238-3, and 238-4 of the PE subassemblies 210A-1, 210A-2, 210A-3, and 210A-4 are coupled to the adapter return couplers 228-1, 228-2, 228-3, and 228-4 on one end of the respective return adapters 224-1, 224-2, 224-3, and 224-4. Return connectors 226-1, 226-2, 226-3, and 226-4 at the other end of each of the return adapters 224-1, 224-2, 224-3, and 224-4 are coupled to each of the rack connection return points 270b, 270c, 270d, and 270e on the return manifold 266.

[0083] Providing flow control devices for at least some of the connectors in a rack can help provide more effective cooling of the system by helping to regulate a more constant flow of coolant throughout the rack supply and return manifolds and individual cooling circuit assemblies. The improvement resulting from adding flow control devices to the connectors can be seen when comparing the pressure and flow rate curves of a rack system using only connectors with those of a connector with flow control devices, as illustrated in the comparison between Figures 9A to 9C (rack system with connectors without flow control devices) and Figures 10A to 10C (rack system with at least one connector with flow control devices).

[0084] Referring first to Figures 9A to 9C, Figure 9C shows a schematic diagram of rack system 302, which is identical to and includes the same features as rack system 102 previously described with respect to Figures 1 to 6. Figure 9A illustrates the corresponding pressure drop diagram, and Figure 9B illustrates the corresponding flow rate diagram. Each cooling circuit assembly 310, 310-1, 310-2, 310-3, and 310-4 further includes: respective supply adapters 318, 318-1, 318-2, 318-3, and 318-4; respective return adapters 324, 324-1, 324-2, 324-3, and 324-4; and respective existing cooling circuit assemblies 310A, 310A-1, 310A-2, 310A-3, and 310A-4.

[0085] In this example, system 302 comprises heterogeneous systems A2 to E2, each with a computing device and individual and corresponding cooling circuit assemblies 310, 310-1, 310-2, 310-3, and 310-4. At least one or more of the individual systems A2 to E2 may differ from the other systems in the rack and require higher or lower flow rates for cooling, and also have unique pressure drops specific to each system. Pressure drop is proportional to flow rate. Pressure drop is the pressure change or decrease at each inlet due to system demand, determined by the difference between the pressure at the supply inlet and the pressure at the return outlet. Higher liquid flow rates through manifold inlets or connections result in larger pressure drops. Conversely, lower liquid flow rates through manifold outlets or connections result in lower pressure drops.

[0086] Figure 9A (pressure drop diagram) and Figure 9B (flow rate diagram) schematically illustrate the example relationship between flow rate and pressure drop in rack system 302. In this example, the pressure drop of each system A2 to E2 can be measured based on the pressure determined at the respective manifold supply inlets 370a, 370b, 370c, 370d, 370e and the corresponding manifold return outlets 372a, 372b, 372c, 372d, 372e. In one example, the pressure drop is measured as the difference between the rack manifold supply inlets 370a, 370b, 370c, 370d, 370e and the corresponding rack return outlets 372a, 372b, 372c, 372d, 372e for each of the calculated systems A2, B2, C2, D2, and E2.

[0087] Figure 9B, a flow rate diagram, schematically illustrates the differences in flow rates required to cool the individual systems A2 to E2. The minimum flow rate 378 required to cool system A2 is represented by line 378, indicating the minimum flow rate that must flow through system 302 to achieve cooling of system A2. The flow rate diagram shows that each of the remaining systems B2 to E2 requires a flow rate greater than this minimum flow rate 378 to achieve cooling of the individual system. As shown, the pressure drop in system A2 is greater than the pressure drop in systems B2 to E2. The flow rates of the liquid flowing through systems B2, C2, D2, and E2, as shown in the flow rate diagram, indicate that the flow rates for these individual systems are greater than the minimum flow rate 378 to accommodate the individual and unique requirements of different systems A2 to E2. Similarly, the corresponding pressure drops also vary. The non-uniformity of flow rate and pressure drop in rack system 302 results in the need for more power and energy to generate increased flow rates in each system B2 to E2, which also leads to overcooling of some systems, increased costs and reduced operating efficiency (discussed below).

[0088] Optimizing the flow distribution across a rack system helps prevent overcooling of individual systems, thus saving pump power. Determining the optimal flow distribution for a rack system can depend on the needs of individual systems, the specific rack system, and / or the overall cooling system. Some rack systems may require a more uniform flow rate across different tray-level systems to achieve optimal flow rate distribution, while others may require non-uniform flow rates across different systems. Using adapters with flow control devices (such as valves and / or pumps and the like) gives operators the ability to customize the flow rates in individual tray-level systems to achieve, as needed, a more uniform or non-uniform flow rate across the rack system or the overall cooling system.

[0089] In one example, optimal flow distribution throughout the rack system requires more uniform liquid flow rates among the individual systems within the rack system, which can be achieved by using a connector with flow control. This optimized flow distribution may be due to the individual needs of different types of computing systems at each tray level, so that achieving more uniform pressure drop and liquid flow rates among different systems can prevent significant supercooling of any individual system. Figure 10C is a schematic diagram of rack system 402, which is the same as and includes the same features as rack system 202 previously described with respect to Figure 8. For ease of discussion, these features will not be repeated or discussed in detail. Figure 10A shows the corresponding pressure drop diagram, and Figure 10B shows the corresponding flow rate diagram.

[0090] As in the previous example, rack system 402 includes a plurality of server tray level systems A3, B3, C3, D3, and E3, each of which has a cooling circuit assembly 410, 410-1, 410-2, 410-3, and 410-4 connected to rack manifold 464 and supply manifold 466. System A3 includes a supply adapter 418 without control, a return adapter 424 without control, and a PE sub-assembly 410A. Systems B3, C3, D3, and E3 include: individual supply adapters 418-1, 418-2, 418-3, and 418-4, each equipped with an individual flow control device 488-1, 488-2, 488-3, and 488-4; return adapters 424-1, 424-2, 424-3, and 424-4, each equipped with an individual flow control device 490-1, 490-2, 490-3, and 490-4; and PE subassemblies 410A-1, 410A-2, 410A-3, and 410A-4.

[0091] Integrating flow control devices into the adapters for use with rack system 402 allows system operators to customize pressure drop and flow rates at each server tray level system. In this example, the pressure drop at one or more of the individual server tray level systems B3, C3, D3, and E3 can be intentionally increased, which will allow for customized flow rates to meet the needs of the individual server tray level systems A3, B3, C3, D3, and E3. For example, as shown, integrating at least one or more supply adapters and return adapters with flow control devices into the cooling circuits 410-1, 410-2, 410-3, and 410-4 of the individual systems B3, C3, D3, and E3 can help regulate the fluid flow rate through the individual cooling circuits 410, 410-1, 410-2, 410-3, and 410-4 in rack system 402. In one example, the liquid flowing through system A3 passes unrestricted through supply connector 418 and return connector 424 (in this example, neither supply connector 418 nor return connector 424 includes a flow control device). Therefore, the pressure drop in each of systems B3, C3, D3, and E3 can be modified (increased or decreased) to regulate the fluid flow rate in these systems. The operator can modify the pressure drop by adjusting the flow control devices 488-1, 488-2, 488-3, 488-4 on the individual supply connectors 418-1, 418-2, 418-3, 418-4 and / or the flow control devices 490-1, 490-2, 490-3, 490-4 on the individual return connectors 424-1, 424-2, 424-3, 424-4. In this example, the pressure drop in systems B3, C3, D3, and E3 increases by individual amounts Δ1, Δ2, Δ3, and Δ4, respectively. This increase in pressure drop directly affects the flow rate, which in this example allows for a more uniform flow rate across all individual systems A3, B3, C3, D3, and E3 in rack system 402. For example, this uniformity is schematically illustrated in Figure 10B, where the individual flow rates of plate systems A3, B3, C3, D3, and E3 are shown to be closer to the minimum flow rate 478 required to achieve cooling in each system, compared to systems without flow control (e.g., Figures 9A to 9C).In this example, the flow control devices 488-1, 488-2, 488-3, and 488-4 on the respective supply adapters 418-1, 418-2, 418-3, and 418-4, and the flow control devices 490-1, 490-2, 490-3, and 490-4 on the respective return adapters 424-1, 424-2, 424-3, and 424-4, are valves. However, in other examples, the flow control devices on the return adapters and / or supply adapters may instead be all auxiliary pumps, and / or one or more cooling circuits in the rack system may use valves as flow control devices, and one or more cooling circuits in the rack system may be auxiliary pumps.

[0092] In other instances, optimizing the flow rate in a rack system may instead require achieving a more non-uniform flow rate distribution across different systems. For example, as illustrated in Figures 10D through 10F, another heterogeneous rack system 1302 is depicted. This example includes the same components as those in rack system 302 of Figure 9C, and for ease of discussion, this example will not be described in detail. As shown in Figure 9C, the supply adapters 1318, 1318-1, 1318-2, 1318-3, 1318-4 and return adapters 1324, 1324-1, 1324-2, 1324-3, 1324-4 of systems A2-1, B2-1, C2-1, D2-1, and E2-1 do not include flow control devices. The only difference between the example rack system 302 of Figure 9C and the rack system 1302 of Figure 10F is the flow rate required to achieve optimal cooling for each rack system. The minimum flow rate required to cool system A2-1 of rack system 1302 is represented by line 1378-1 in Figure 10E. As shown, as represented by line 378 in Figure 9B, the minimum flow rate of system A2-1 is significantly higher than the minimum flow rate required to cool the example rack system 302 of Figure 9C. The minimum flow rate required to cool system A2-1 is also significantly higher than the minimum flow rate required to cool any of systems B2-1, C2-1, D2-1, and E2-1.

[0093] To increase the flow rate through system A2-1 of rack system 1302, thereby achieving a minimum flow rate through system A2-1, the flow rate through system A2-2 must be modified. This can be achieved by limiting or reducing the flow rate of liquid coolant through one or more systems in the rack system, which will result in an increase in the flow rate through the other systems in the rack system. Figure 10I illustrates an example rack system 1402 with return and supply adapters, some of which include flow control devices that allow modification of individual systems within rack system 1402. Figure 10G illustrates the corresponding pressure drop diagram, and Figure 10H illustrates the corresponding flow rate diagram. Rack system 1402 is otherwise structurally identical to system 402 of Figure 10C, and for ease of discussion, those components will not be described further. Integrating flow control devices 1488-1, 1488-2, 1488-3, and 1488-4 into individual supply adapters 1418-1, 1418-2, 1418-3, and 1418-4, and integrating flow control devices 1490-1, 1490-2, 1490-3, and 1490-4 into individual return adapters 1424-1, 1424-2, 1424-3, and 1424-4 with individual computing systems B3-1, C3-1, D3-1, and E3-1, will allow for a greater degree of control over the flow rate throughout the system. In this example, the flow control devices 1488-1, 1488-2, 1488-3, 1488-4, 1490-1, 1490-2, 1490-3, and 1490-4 are valves, but other types of flow control devices may also be implemented.

[0094] The flow rate to system A3-1 must be increased to meet the minimum flow rate required to ensure cooling of system A3-1. In this example, reducing the flow rate through one or more of systems B3-1, C3-1, D3-1, and E3-1 results in an increase in the flow rate to system A3-1. As shown in Figure 10H, the flow rate through system B3-1 decreases by an amount ΔA-1, while the flow rate through system E3-1 decreases by an amount ΔB-1. As shown in Figure 10G, restricting the flow rates through systems B3-1 and E3-1 results in significant increases in pressure in systems B3-1, C3-1, D3-1, and E3-1 by individual amounts Δ1-1, Δ2-1, Δ3-1, and Δ4-1, respectively. These changes contribute to increasing the flow rate through system A3-1 to meet the minimum flow rate required to cool system A3-1. As shown in Figure 10H, compared with systems B3-1, C3-1, D3-1, and E3-1, the flow rate throughout rack system 1402 can be considered non-uniform due to the significant difference in the flow rate required to cool system A3-1.

[0095] Referring back to the examples in Figures 10D to 10F, as an alternative to modifying the flow rate through the first system A2-1 in rack system 1302 using supply and return adapters with valves, one or more of the supply adapters and / or return adapters may include a pump. Figures 10J to 10L illustrate examples of implementing auxiliary pumps within the rack system, where Figure 10L illustrates example rack system 1502, Figure 10J illustrates the corresponding pressure drop diagram, and Figure 10K illustrates the corresponding flow rate diagram. Rack system 1502 is otherwise identical to rack system 1302-1 of Figure 10F, and for ease of discussion, these components will not be described further. The structural difference between rack system 1502 and rack system 1302 is that the first system A4 in rack system 1502 includes a supply adapter 1518 with a flow control device 1588, and the return adapter 1524 includes a flow control device 1590. In this example, flow control devices 1588 and 1590 are auxiliary pumps. Other return or supply adapters in the rack system do not include flow control devices.

[0096] As shown in Figure 10K, the minimum flow rate required by cooling system A4 is represented by line 1578. Auxiliary pumps 1588 and 1590 in the respective supply connectors 1518 and return connector 1524 can be configured to push and draw fluid through system A4. The auxiliary pumps 1588 and 1590 can be configured to increase the flow rate of the liquid flowing through system A4 by an amount sufficient to ensure that the overall flow rate meets the minimum flow rate required by cooling system A4. This also results in an increase in pressure drop in system A4 by Δ1-2, as shown in Figure 10J. In this example, the flow rates of the remaining systems B4, C4, D4, and E4 in rack system 1502 remain unchanged in all other respects.

[0097] Flow rates in multi-rack systems can also be regulated and improved by implementing adapters with flow control devices within one or more individual rack systems. In multi-rack liquid cooling systems, poor flow rate distribution may exist between racks. The rack system requiring a minimum flow rate to achieve cooling determines how much power is consumed at the CDU, because sufficient liquid must be supplied to this rack in the system, and in many cases, this rack is the furthest from the CDU. This can lead to unnecessarily higher flow rates at racks closest to the CDU to ensure appropriate liquid flow rates to racks furthest from the CDU. Implementing adapters with flow control devices can help provide a more consistent flow rate across all racks in the multi-rack system.

[0098] The figures illustrate the difference in overall flow rate across rack systems utilizing adapters with flow control devices compared to adapters without flow control devices. Figures 11A and 11B illustrate rack systems utilizing adapters without flow control devices, while Figures 12A and 12B illustrate rack systems utilizing at least one or more adapters with flow control devices. Turning first to Figure 11A, a schematic cooling system 580 is illustrated. This schematic cooling system 580 is identical to that in Figure 5 and includes the same components, including multiple rack systems 502, 502-1, and 502-2 (also referred to herein as individual rack systems 1, 2, and 3 for ease of discussion and illustration), which include individual racks 562, 562-1, and 562-2. Each rack system 1, 2, and 3 houses a plurality of server tray-level systems, which include adapters (without additional flow control) and a central supply and return subsystem component 581. In this example, rack system 502-2 requires a minimum flow rate to achieve cooling of the server tray-level systems (not shown) within rack 562-2, as indicated by line 583 in Figure 11B. This means that the average flow rate required to achieve cooling of all rack systems 1, 2, and 3 throughout the overall cooling system 580 is indicated by line 585. As shown, racks 2 and 3 require excessively high flow rates, much higher than the average flow rate 585, to ensure that the required flow rate for rack 3 can be achieved.

[0099] Figures 12A and 12B illustrate another schematic cooling system 680, which is otherwise similar to the cooling system 580 shown in Figure 11A, except that each rack system 602, 602-1, 602-2 (also referred to herein as rack systems 1-1, 2-1, 3-1) further accommodates and includes a plurality of server tray-level systems with a supply adapter 618 having a flow control device 688 and a return adapter 624 having a flow control device 690. The supply adapter 618 (including the supply adapters with flow control devices 688) can be coupled to a rack supply manifold 664. The return adapter 624 (including the return adapters with flow control devices 690) can be coupled to a return manifold 666. For ease of illustration, in Figure 12A, only the supply adapter 618, including supply adapters with flow control devices 688, is identified for rack system 3-1, while the return adapter 624, including supply adapters with flow control devices 690, is identified for rack system 1-1. However, it should be understood that, although not strictly necessary, in this example, each rack includes both return adapters and supply adapters with (or without) flow control devices. Furthermore, flow control devices may include, but are not limited to, valves and auxiliary pumps.

[0100] Implementing flow control devices in rack systems 1-1, 2-1, and 3-1 provides operators with a mechanism to adjust the flow rate of each rack. In one example, the supply adapter 618 with flow control device 688 and the return adapter 624 with flow control device 690 in rack systems 1-1 and 2-1 can be adjusted to limit the liquid flow rate, while the supply adapter 618 with flow control device 688 and the return adapter 624 with flow control device 690 in rack system 3-1 can be less restricted to allow increased liquid flow to rack system 3-1, and in some examples, the flow through rack system 3-1 may not be restricted. In one example, as illustrated in Figure 12B, rack systems 1-1 and 2-1 can be adjusted to the average flow rate indicated by line 685, and the flow rate of rack system 3-3 can be adjusted (to the desired extent) to increase the flow rate to the average flow rate. (See Figures 11A and 11B for comparison). This results in a more uniform flow rate throughout rack systems 1-1, 2-2, and 3-2, which allows for the optimization of the cooling system 680, including reduced power consumption due to minimized supercooling and cost savings.

[0101] Figures 13A and 13B illustrate how optimizing the flow distribution at the server level in a rack system can save pumping power and overall cost. Figure 13A shows the relationship between pressure drop and flow rate, comparing a rack system using a connector with flow control devices with a system using only a connector without flow control devices. Curve A represents the relationship between pressure drop (Pascals) and fluid flow rate distribution in a system using connectors with one or more flow control devices (such as rack system 202 shown in Figure 8). Curve B represents the relationship between pressure drop and fluid flow rate in a system using only a connector without flow control devices (such as rack system 102 shown in Figure 4). Curve C is the pumping curve that intersects curve A at point OP flow_control and curve B at point OP no_flow_control. Points OP flow_control and OP no_flow_control indicate where the respective systems operate to achieve system cooling. As shown, a higher pressure drop and flow rate can be achieved in a system using supply and return adapters with flow control devices compared to a system without flow control devices. Figure 13B further illustrates the relationship between power consumption (watts) and flow rate in both systems. As shown, point P_flow_control represents the power required to cool the system using supply and return adapters with flow control devices. Point P_no_flow_control represents the power required to cool the system using only supply and return adapters without flow control devices. Compared to curve B, less power is required to achieve the flow rate of curve A. This results in an overall reduction in power consumption of Δ5, which leads to lower costs.

[0102] The connectors can be modified and have additional features to further improve the flow rate distribution and overall system optimization. Figure 14 illustrates a supply connector 718, which is otherwise similar to the supply connector 118 of Figure 2 and includes the same features; for ease of discussion, these features will not be reproduced or discussed further. Similarly, Figure 15 illustrates a return connector 724, which is otherwise similar to the return connector 124 of Figure 3 and includes the same features. The only difference from the previous version is that the return and supply connectors 718, 724 can further include monitoring devices or checkpoints for monitoring system characteristics (such as temperature, pressure, flow rate, chemical properties, and the like). An example supply monitoring device 789 is illustrated on the supply line 719, and an example return monitoring device 791 is illustrated on the return line 727. The monitoring devices 789 and 791 may be any mechanism capable of monitoring and / or controlling characteristics in the system, such as sensors, including sensors for determining flow rate and / or screens that provide system characteristics.

[0103] The monitoring system can be used in conjunction with a flow control device. For example, as shown in Figure 16, the supply adapter 818 may include both a supply monitoring device 889 and a flow control device 888. In this example, both the supply monitoring device 889 and the flow control device 888 are positioned along the supply line 819, but in other examples, one or both of the supply monitoring device 889 and the flow control device 888 may be positioned elsewhere. Similarly, as shown in Figure 17, the return adapter 824 may include both a return monitoring device 890 and a flow control device 891. Both the return monitoring device 890 and the flow control device 891 are shown positioned along the return line 827, but in other examples, one or both of the return monitoring device 890 and the flow control device 891 may be positioned elsewhere. These monitoring devices 889 and 890 can be used with the flow control devices 888 and 891 to monitor and regulate the flow rate of liquid through the system.

[0104] Figures 18 and 19 illustrate another example of modifications and / or additions to the return and supply adapters. The supply adapter 918 may include a filter 997 positioned along a respective supply line 919, while the return adapter 924 may include a filter 998 positioned along a return line 927. However, in other instances, the filter 998 may be positioned elsewhere. Adding filters allows for facility-grade filters with larger micron ratings to meet the needs of most systems, saving energy and simplifying maintenance. For specialized systems requiring finer filtration, the filter can be installed within the adapter system.

[0105] According to one aspect of the present invention, a connector for coupling a liquid cooling circuit subassembly of a computing system to a device rack manifold includes a body, a first connector, a second connector, and a flow control device. The first connector is disposed on the body and couples the connector to a coupling member of the liquid cooling circuit subassembly. The second connector is disposed on the body and couples the connector to the device rack manifold. The flow control device is disposed between the first connector and the second connector and is configured to regulate the flow rate of a liquid coolant through the liquid cooling circuit subassembly; and / or The body includes a flexible tube, and the first connector is positioned at one end of the flexible tube, while the second connector is positioned at the opposite end of the flexible tube; and / or The first connector is interlocked with the coupling of the liquid cooling subassembly, and the second connector is interlocked with the device frame manifold; and / or The coupling of the liquid cooling subassembly is one of a supply coupling and a return coupling; and / or When the coupling of the liquid cooling subassembly is a supply coupling, the device frame manifold includes a supply manifold, and the first connector couples the adapter to one of the supply couplings of the liquid cooling subassembly, while the second connector couples the adapter to one of the supply inlet connections of the supply manifold; and / or When the coupling of the liquid cooling subassembly is a return coupling, the device frame manifold is a return manifold, and the first connector couples the adapter to one of the return couplings of the liquid cooling subassembly, while the second connector couples the adapter to one of the return outlet connections of the return manifold; and / or The supply inlet connector has a first configuration, while the supply coupling has a second configuration incompatible with the first configuration, such that the supply coupling cannot be directly connected to the supply inlet connector; and / or The return outlet has a first configuration, while the return coupling has a second configuration incompatible with the first configuration, such that the return coupling cannot be directly connected to the return outlet connector of the return manifold; and / or The flow control device includes at least one of a valve and a pump; and / or The adapter further includes at least one of a monitoring device and a filter; and / or The monitoring device is coupled to the main body and is configured to provide characteristics regarding the flow rate through the rack manifold; and / or The filter is coupled to the body and is configured to filter particulate matter in the cooling liquid flowing through the connector.

[0106] According to another aspect of the invention, a device rack system includes a supply manifold, a return manifold, a plurality of supply connectors, and a plurality of return connectors. The supply manifold has a plurality of supply inlet connections configured to dispense a coolant. The return manifold has a plurality of return outlet connections configured to receive the coolant. Each of the plurality of supply connectors has: a supply connector manifold connection configured to connect to a corresponding one of the supply inlet connections; and a supply coupling configured to couple to a corresponding coolant sub-assembly. Each of the plurality of return connectors has a return connector manifold connection configured to connect to a corresponding one of the return outlet connections; and / or At least some of the plurality of supply adapters further include a flow control device to regulate the flow rate of one of the cooling liquids; and / or At least some of the plurality of return connectors further include a flow control device to regulate the flow rate of one of the cooling liquids; and / or Each of the plurality of supply adapters further includes a hose, wherein the supply adapter manifold connector is at one end and the supply coupling is at the opposite end, and the supply adapter manifold connector is interlocked with a corresponding one of the supply inlet connectors; and / or The plurality of return connectors further includes a return coupling configured to couple with the corresponding coolant subassembly, wherein each of the plurality of return connectors further includes a hose, wherein the return connector manifold connection is located at one end of the hose, and the return coupling is positioned at an opposite end, the return connector manifold connection being interlocked with one of the corresponding return outlet connections; and / or The rack system further includes: a plurality of computing systems; a plurality of server tray racks for housing the computing systems; and a plurality of cooling circuit assemblies for cooling the plurality of computing systems. Each cooling circuit assembly corresponds to one of the server tray racks and includes: one of the plurality of supply adapters; one of the plurality of return adapters; and one of the cooling circuit sub-assemblies; and / or At least some of these supply adapters further include a body having a monitoring device coupled to the body, the monitoring device being configured to provide characteristics regarding the flow rate of the cooling liquid through the at least some of the supply adapters; and / or At least some of these supply connectors further include a body having a filter coupled to the body, the filter being configured to filter particulate matter in the cooling liquid flowing through the at least some of the connectors.

[0107] According to another aspect of the invention, a method for cooling a computing system in a device rack includes attaching a cooling circuit assembly configured to cool components of the computing system to the device rack. The attachment further includes: connecting a first connector of a supply adapter to a manifold supply inlet of a supply manifold for cooling liquid; connecting a second connector of the supply adapter to a supply coupling of an existing cooling circuit sub-assembly; connecting a first connector of a return adapter to a manifold return outlet of a return manifold configured to receive heated cooling liquid; and connecting the second connector of the return adapter to a return coupling of the existing cooling circuit sub-assembly; and / or further regulating the flow rate of the cooling liquid flowing through the supply adapter by directing fluid to a fluid control device within the supply adapter.

[0108] Most of the aforementioned alternative examples are not mutually exclusive, but can be implemented in various combinations to achieve unique advantages. Furthermore, the disclosed rack systems, tray-level computing systems, cooling systems, and components are examples and can be further modified. Because these and other variations and combinations of the features discussed above can be utilized without departing from the subject matter defined by the claims, the foregoing description of the embodiments should be done in an illustrative rather than limiting manner to the subject matter defined by the claims. As an example, the bistable hinge system is not limited to use in any single device and can be implemented across many products. The examples described herein and the use of phrases such as "such as," "including," and the like should not be construed as limiting the subject matter of the claims to specific examples; rather, these examples are intended to illustrate only one of many possible embodiments.

[0109] 1: Rack System 2: Rack System 3: Rack System 100: System 102: Rack System 102-1: Rack System 102-2: Rack System 110: Cooling circuit assembly 110-1: Cooling circuit assembly 110-2: Cooling circuit assembly 110-3: Cooling circuit assembly 110-4: Cooling circuit assembly 110A: Existing cooling circuit sub-assembly 110A-1: PE Cooling Circuit Sub-Assembly 110A-2: PE Cooling Circuit Sub-Assembly 110A-3: PE Cooling Circuit Sub-Assembly 110A-4: PE Cooling Circuit Sub-Assembly 112: Circuit board 114: Computing device 114-1: Computing device 114-2: Computing device 114-3: Computing device 114-4: Computing device 118: Supply of adapters 118-1: Supply of adapters 118-2: Supply of adapters 118-3: Supply of adapters 118-4: Supply of adapters 119: Connector supply line 119-1: Connector supply line 119-2: Connector supply line 119-3: Connector supply line 119-4: Connector supply line 120: Supply connectors 120-1: Supply of connectors 120-2: Supply connectors 120-3: Supply connectors 120-4: Supply connectors 121: First End 122: Supply of coupling components 122-1: Supply of coupling components 122-2: Supply of coupling components 122-3: Supply of coupling components 122-4: Supply of coupling components 123: Second end 124: Return to adapter 124-1: Return to adapter 124-2: Return to adapter 124-3: Return to adapter 124-4: Return to adapter 125: First end 126: Return to Connector 126-1: Return Connector 126-2: Return Connector 126-3: Return to Connector 126-4: Return to Connector 127: Adapter return line 127-1: Adapter Return Line 127-2: Adapter Return Line 127-3: Adapter Return Line 127-4: Adapter Return Line 128: Return Coupler 128-1: Adapter Return Coupler 128-2: Adapter Return Coupler 128-3: Adapter Return Coupler 128-4: Adapter Return Coupler 129: Second End 130a: Cooling device 130b: Cooling device 130c: Cooling device 130d: Cooling device 132a: Supply entry point 132b: Supply entry point 132c: Supply entry point 132d: Supply entry point 134a: Return to Exit 134b: Return to Exit 134c: Return to Exit 134d: Return to Exit 136: System supply coupling components 136-1: Supply of coupling components 136-2: Supply of coupling components 136-3: Supply of coupling components 136-4: Supply of coupling components 138: System return coupler 138-1: PE return coupling 138-2: PE return coupling 138-3: PE return coupling 138-4: PE return coupling 144: Board supply line 146a: Secondary supply line 146b: Secondary supply line 146c: Secondary supply line 146d: Secondary supply line 148: Return route 150: Plate supply manifold 152: Plate return manifold 154a: Secondary return line 154b: Secondary return path 154c: Secondary return line 154d: Secondary return line 160: shelf 160-1: Shelf 160-2: Shelf 160-3: Shelf 160-4: Shelf 162: Computing device rack 162-1: Computing device rack 162-2: Computing device rack 164: Rack supply manifold 164-1: Rack supply manifold 164-2: Rack supply manifold 166: Rack return manifold 166-1: Rack return manifold 166-2: Rack return manifold 168: Central Cooling Fluid Supply Line 169: Central Return Route 170a: Rack supply connection point 170b: Rack supply connection point 170c: Rack supply connection point 170d: Rack supply connection point 170e: Rack supply connection point 172a: Rack Return Connection Point 172b: Rack Return Connection Point 172c: Rack Return Connection Point 172d: Rack return connection point 172e: Rack Return Connection Point 180: Cooling System 181: Central Supply and Return Subsystem Components 182: Water Source 184: Cooling Unit 186: Central Distribution Unit 202: Rack System 210: Cooling circuit 210-1: Cooling circuit assembly 210-2: Cooling circuit assembly 210-3: Cooling Circuit Assembly 210-4: Cooling Circuit Assembly 210A: PE Subassembly 210A-1: PE Subassembly 210A-2: PE Subassembly 210A-3: PE Subassembly 210A-4: PE Subassembly 214: Computing device 214-1: Computing device 214-2: Computing device 214-3: Computing device 214-4: Computing device 218: Supply of adapters 218-1: Supply of adapters 218-2: Supply of adapters 218-3: Supply of adapters 218-4: Supply of adapters 219: Connector supply line 219-1: Connector Supply Line 219-2: Connector Supply Line 219-3: Connector Supply Line 219-4: Connector Supply Line 220: Supply connectors 220-1: Supply of connectors 220-2: Supply of connectors 220-3: Supply connectors 220-4: Supply connectors 221: First End 222: Supply of coupling components 222-1: Supply of coupling components 222-2: Supply of coupling components 222-3: Supply of coupling components 222-4: Supply of coupling components 223: Second end 224: Return to Adapter 224-1: Return to adapter 224-2: Return to Adapter 224-3: Return to adapter 224-4: Return to Adapter 225: First end 226: Return to Connector 226-1: Return Connector 226-2: Return Connector 226-3: Return to Connector 226-4: Return to Connector 227: Adapter return line 227-1: Adapter Return Line 227-2: Adapter Return Line 227-3: Adapter Return Line 227-4: Adapter Return Line 228: Return Coupler 228-1: Adapter Return Coupler 228-2: Adapter Return Coupler 228-3: Adapter Return Coupler 228-4: Adapter Return Coupler 229: Second End 236: PE supply coupling components 236-1: PE supply coupling components 236-2: PE supply coupling components 236-3: PE supply coupling components 236-4: PE supply coupling components 238: PE return coupling 238-1: PE return coupling 238-2: PE return coupling 238-3: PE return coupling 238-4: PE return coupling 260: Rack 260-1: Rack frame 260-2: Rack frame 260-3: Rack frame 260-4: Rack frame 262: Computing device rack 264: Supply Manifold 266: Rack return manifold 270a: Rack supply connection point 270b: Rack connection supply point / rack connection return point 270c: Rack-connected supply point / Rack-connected return point 270d: Rack connection supply point / rack connection return point 270e: Rack Connection Supply Point / Rack Connection Return Point 272a: Return connector 288: Flow control device 288-1: Flow control device 288-2: Flow control device 288-3: Flow control device 288-4: Flow control device 290: Flow control device 290-1: Return Flow Control Device 290-2: Return to flow control device 290-3: Return to flow control device 290-4: Return to flow control device 302: Rack System 310: Cooling circuit assembly 310-1: Cooling circuit assembly 310-2: Cooling circuit assembly 310-3: Cooling circuit assembly 310-4: Cooling circuit assembly 310A: Cooling Circuit Assembly 310A-1: Cooling circuit assembly 310A-2: Cooling Circuit Assembly 310A-3: Cooling Circuit Assembly 310A-4: Cooling Circuit Assembly 318: Supply of adapters 318-1: Supply of adapters 318-2: Supply of adapters 318-3: Supply of adapters 318-4: Supply of adapters 324: Return to Adapter 324-1: Return to adapter 324-2: Return to Adapter 324-3: Return to adapter 324-4: Return to adapter 370a: Manifold supply inlet 370b: Manifold supply inlet 370c: Manifold supply inlet 370d: Manifold supply inlet 370e: Manifold supply inlet 378: Flow rate / line 402: Rack System 410: Cooling circuit assembly 410-1: Cooling circuit assembly 410-2: Cooling circuit assembly 410-3: Cooling Circuit Assembly 410-4: Cooling Circuit Assembly 410A: PE Subassembly 410A-1: PE Subassembly 410A-2: PE Subassembly 410A-3: PE Subassembly 410A-4: PE Subassembly 418: Supply of adapters 418-1: Supply of adapters 418-2: Supply of adapters 418-3: Supply of adapters 418-4: Supply of adapters 424: Return to Adapter 424-1: Return to Adapter 424-2: Return to Adapter 424-3: Return to adapter 424-4: Return to Adapter 464: Rack Manifold 466: Supply Manifold 478: Minimum flow rate 488-1: Flow control device 488-2: Flow control device 488-3: Flow control device 488-4: Flow control device 490-1: Flow control device 490-2: Flow control device 490-3: Flow control device 490-4: Flow control device 502: Rack System 502-1: Rack System 502-2: Rack System 562: Rack 562-1: Rack 562-2: Rack 580: Cooling System 581: Central Supply and Return Subsystem Components 583: Line 585: Linear / Average Flow Rate 602: Rack System 602-1: Rack System 602-2: Rack System 618: Supply of adapters 624: Return to adapter 664: Rack supply manifold 666: Return to manifold 680: Cooling System 685: Line 688: Flow control device 690: Flow control device 718: Supply of adapters 719: Supply Line 724: Return to adapter 727: Return Route 789: Supply monitoring device 791: Return to monitoring device 818: Supply of adapters 819: Supply Line 824: Return to adapter 827: Return Line 888: Flow control device 889: Supply monitoring device 890: Return to monitoring device 891: Flow control device 918: Supply of adapters 919: Supply Line 924: Return to adapter 927: Return Line 997: Filter 998: Filter 1218: Supply of adapters 1219: Connector Supply Line 1220: Supply connectors 1221: First End 1222: Supply of coupling components 1223: Second end 1224: Return to adapter 1225: First End 1226: Return to Connector 1227: Adapter return line 1228: Return Coupler 1229: Second End 1288: Flow control device 1290: Flow control device 1302: Heterogeneous rack system 1318: Supply of adapters 1318-1: Supply of adapters 1318-2: Supply of adapters 1318-3: Supply of adapters 1318-4: Supply of adapters 1324: Return to adapter 1324-1: Return to adapter 1324-2: Return to Adapter 1324-3: Return to adapter 1324-4: Return to adapter 1378-1: Line 1402: Rack System 1418: Supply of adapters 1418-1: Supply of adapters 1418-2: Supply of adapters 1418-3: Supply of adapters 1418-4: Supply of adapters 1424: Return to adapter 1424-1: Return to adapter 1424-2: Return to adapter 1424-3: Return to adapter 1424-4: Return to adapter 1488-1: Flow control device 1488-2: Flow control device 1488-3: Flow control device 1488-4: Flow control device 1490-1: Flow control device 1490-2: Flow control device 1490-3: Flow control device 1490-4: Flow control device 1502: Rack System 1518: Supply of adapters 1524: Return to adapter 1578: Line 1588: Flow control device / auxiliary pump 1590: Flow control device / auxiliary pump A: Direction A1: System A2: Computing device system A2-1: System A3: Server tray-level system A3-1: System A4: First System B: Computing System B1: System B2: Computing Device System B2-1: System B3: Server tray-level system B3-1: Computing System B4: System C: Computing System C1: System C2: Computing device system C2-1: System C3: Server tray-level system C3-1: Computing System C4: System D: Computing System D1: System D2: Computing Device System D2-1: System D3: Server tray-level system D3-1: Computing System D4: System E: Computing System E1: System E2: Computing Device System E2-1: System E3: Server tray-level system E3-1: Computing System E4: System L: Length

Claims

1. A adapter for coupling a liquid cooling circuit subassembly of a computing system to a rack manifold, the adapter comprising: a body; a first connector disposed on the body and coupling the adapter to a coupling member of the liquid cooling circuit subassembly; a second connector disposed on the body and coupling the adapter to the rack manifold; a flow control device disposed between the first connector and the second connector, the flow control device being configured to regulate a flow rate of a liquid coolant passing through the liquid cooling circuit subassembly; and a filter coupled to the body and configured to filter particulate matter in the cooling liquid flowing through the adapter.

2. The adapter as claimed in claim 1, wherein the body comprises a flexible tube, and the first connector is positioned at one end of the flexible tube, while the second connector is positioned at the opposite end of the flexible tube.

3. The adapter as claimed in claim 1, wherein the first connector is interlocked with the coupling of the liquid cooling subassembly, and the second connector is interlocked with the device frame manifold.

4. The connector as claimed in claim 1, wherein the coupling of the liquid cooling subassembly is one of a supply coupling and a return coupling.

5. The adapter as claimed in claim 3, wherein when the coupling of the liquid cooling subassembly is a supply coupling, the device frame manifold includes a supply manifold, and the first connector couples the adapter to one of the supply couplings of the liquid cooling subassembly, while the second connector couples the adapter to one of the supply inlet connections of the supply manifold.

6. The adapter as claimed in claim 3, wherein when the coupling of the liquid cooling sub-assembly is a return coupling, the device frame manifold is a return manifold, and the first connector couples the adapter to one of the return couplings of the liquid cooling sub-assembly, while the second connector couples the adapter to one of the return outlet connections of the return manifold.

7. The adapter as claimed in claim 5, wherein the supply inlet connector has a first configuration and the supply coupling has a second configuration incompatible with the first configuration, such that the supply coupling cannot be directly connected to the supply inlet connector.

8. The adapter as claimed in claim 6, wherein the return outlet has a first configuration and the return coupling has a second configuration incompatible with the first configuration, such that the return coupling cannot be directly connected to the return outlet connector of the return manifold.

9. The adapter as claimed in claim 1, wherein the flow control device includes at least one of a valve and a pump.

10. The adapter as claimed in claim 1, further comprising a monitoring device coupled to the body, wherein the monitoring device is configured to provide characteristics regarding the flow rate through the rack manifold.

11. A device rack system comprising: a supply manifold having a plurality of supply inlet connections configured to distribute a coolant; a return manifold having a plurality of return outlet connections configured to receive the coolant; a plurality of supply adapters, each of the plurality of supply adapters having: a supply adapter manifold connection configured to connect to a corresponding one of the supply inlet connections; and a supply coupler configured to connect to a corresponding coolant subassembly; and a plurality of return adapters, each of the plurality of return adapters having a return adapter manifold connection configured to connect to a corresponding one of the return outlet connections. At least some of these supply connectors further include a body having a filter coupled to the body, the filter being configured to filter particulate matter in the cooling liquid flowing through the at least some of the connectors.

12. The device rack system of claim 11, wherein at least some of the plurality of supply adapters further includes a flow control device to regulate the flow rate of one of the cooling liquids.

13. The rack system of claim 12, wherein at least some of the plurality of return connectors further includes a flow control device to regulate the flow rate of one of the cooling liquids.

14. The device rack system of claim 11, wherein each of the plurality of supply adapters further includes a hose, wherein the supply adapter manifold connector is at one end and the supply coupler is at the opposite end, and the supply adapter manifold connector is interlocked with a corresponding one of the supply inlet connectors.

15. The rack system of claim 11, wherein the plurality of return connectors further includes a return coupler configured to couple with the corresponding coolant sub-assembly, wherein each of the plurality of return connectors further includes a hose, wherein the return connector manifold connection is located at one end of the hose, and the return coupler is positioned at an opposite end, the return connector manifold connection being interlocked with one of the return outlet connections.

16. The device rack system of claim 11, further comprising: a plurality of computing systems; a plurality of server tray racks for housing the computing systems; and a plurality of cooling circuit assemblies for cooling the plurality of computing systems, each cooling circuit assembly corresponding to one of the server tray racks and comprising: one of the plurality of supply adapters; one of the plurality of return adapters; and one of the cooling circuit sub-assemblies.

17. The device rack system of claim 11, wherein at least some of the supply connectors further includes a body having a monitoring device coupled to the body, the monitoring device being configured to provide characteristics regarding the flow rate of the cooling liquid through the at least some of the supply connectors.

18. A method for cooling a computing system in a device rack, the method comprising: attaching a cooling circuit assembly configured to cool components of the computing system to the device rack, the attachment comprising: connecting a first connector of a supply adapter to a manifold supply inlet of a supply manifold for cooling liquid; connecting a second connector of the supply adapter to a supply coupling of an existing cooling circuit sub-assembly; connecting a first connector of a return adapter to a manifold return outlet of a return manifold configured to receive heated cooling liquid; and connecting the second connector of the return adapter to a return coupling of the existing cooling circuit sub-assembly, wherein at least one of the supply adapter and the return adapter includes a filter configured to filter particulate matter in the cooling liquid flowing through the supply adapter and the at least one of the return adapters.

19. The method of claim 18, further comprising regulating the flow rate of a cooling liquid flowing through the supply adapter by directing fluid to a fluid control device within the supply adapter.

Images