Three-dimensional loop-type heat exchanger

Abstract

A three-dimensional loop heat exchange device includes a heat spreader and at least one loop heat pipe. The heat spreader includes a base plate and a cover plate, with the cover plate fitting onto the base plate to form an accommodating space between them. The cover plate also has at least one first through hole and at least one second through hole. The loop heat pipe is disposed on the cover plate and has a curved section and a first end and a second end extending from the two ends of the curved section, respectively. The first end passes through the first through hole and has a first joint edge stacked on the inner surface of the cover plate, while the second end passes through the second through hole and has a second joint edge stacked on the inner surface of the cover plate. The heat spreader further includes at least one first support structure corresponding to the lower part of the first joint edge and at least one second support structure corresponding to the second joint edge and blocking the lower part of the second end port. The second support structure is made of capillary material.

Description

[Technical Field]

[0001] This invention relates to a heat exchanger, and more particularly to a three-dimensional loop heat exchange device. [Previous Technology]

[0002] Existing three-dimensional radiators or heat exchangers are mainly composed of a heat spreader plate combined with multiple heat pipes. In order to make the heat spreader plate and each heat pipe stable in the joint structure, holes are usually made on the ends of the heat pipes before they are welded to the lower plate of the heat spreader plate. By joining them to the lower plate of the heat spreader plate, the joint area is increased. At the same time, the holes are used to maintain a vacuum chamber in the heat spreader plate and the heat pipes, so that the heat transfer effect of vapor-liquid phase change can be carried out between the vacuum chambers of the two.

[0003] However, if it is desired to control the flow direction of internal vapor-liquid phase changes, existing three-dimensional radiators or heat exchangers often have heat pipe ports connected to the lower plate of the heat spreader, making it difficult for vaporized steam or working fluid to flow into the heat pipe, thus making it unfavorable to manufacture a loop-type heat exchange device.

[0004] In view of the above, the inventors have devoted themselves to research and applied theoretical knowledge in order to improve and solve the above-mentioned deficiencies, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned deficiencies. [Summary of the Invention]

[0005] The main objective of this invention is to provide a three-dimensional loop heat exchange device, which is connected to the top cover of the heat spreader through heat pipes, so that the heat pipe ports have large through holes to allow vaporized steam or working fluid to enter. At the same time, a support structure is used to support the heat pipes and restrict the flow direction, so as to achieve the purpose of a loop heat exchanger.

[0006] To achieve the above objectives, the present invention provides a three-dimensional loop heat exchange device, including a heat exchange plate and at least one loop heat pipe; the heat exchange plate includes a base plate and a cover plate, and the cover plate covers the base plate to form an accommodating space between them, and the cover plate is also provided with at least one first through hole and at least one second through hole; the loop heat pipe is disposed on the cover plate and has a curved section, and a first end and a second end extending from the two ends of the curved section, respectively, and the first end passes through the first through hole and has a first joint edge stacked on the inner surface of the cover plate, while the second end passes through the second through hole and has a second joint edge stacked on the inner surface of the cover plate; wherein, the heat exchange plate is further provided with at least one first support structure corresponding to the lower part of the first joint edge, and at least one second support structure corresponding to the second joint edge and blocking the lower part of the second end port, and the second support structure is made of capillary material.

Implementation Method

[0014] In order to enable your review committee to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and illustration only and are not intended to limit the present invention.

[0015] Please refer to Figures 1, 2, and 3, which are respectively a three-dimensional assembly view, a three-dimensional exploded view, and a plan view of the present invention. The present invention provides a three-dimensional loop heat exchange device, including a heat spreader 1 and at least one loop heat pipe 2 disposed on the heat spreader 1; wherein:

[0016] The heat spreader 1 comprises a base plate 10 and a cover plate 11, with the cover plate 11 covering the base plate 10 and forming a sealed accommodating space 100 between the cover plate 11 and the base plate 10. A capillary layer 101 may be provided within the accommodating space 100. The cover plate 11 is also provided with at least one first through hole 110 and at least one second through hole 111. A first flange 110a protruding outward may be provided on the first through hole 110, and a second flange 111a protruding outward may be provided on the second through hole 111, for connection of the aforementioned circuit heat pipe 2.

[0017] The heat pipe 2 of the circuit is bendable into an inverted U-shape and is provided on the cover plate 11 of the heat spreader 1, having a bent section 20 and a first end 21 and a second end 22 extending from the two ends of the bent section 20 respectively. The heat pipe 2 of the circuit may be provided with capillary structures such as sintered powder, woven mesh or grooves (not shown), and the first end 21 is inserted into the first through hole 110 of the cover plate 11, while the second end 22 is inserted into the second through hole 111 of the cover plate 11, so that the bent section 20 protrudes from the cover plate 11 of the heat spreader 1.

[0018] As shown in Figure 4, when the first end 21 and the second end 22 of the above-mentioned loop heat pipe 2 pass through the first through hole 110 and the second through hole 111 of the cover plate 11, a first expansion port 210a is first formed on the port of the first end 21, and a second expansion port 220a is formed on the port of the second end 22. The first expansion port 210a and the second expansion port 220a can both be in the shape of a trumpet. Through processes such as stamping or pressing, pressure is applied to the first expansion port 210a and the second expansion port 220a toward the inner surface of the cover plate 11 (as shown by the arrow in Figure 4), thereby flattening the first expansion port 210a into a first joint edge 210 and the second expansion port 220a into a second joint edge 220, and respectively stacked on the inner surface of the cover plate 11.

[0019] Further, as shown in FIG5, then, a non-material welding process can be applied to the inner surface of the cover plate 11 through the first joint edge 210 and the second joint edge 220, such as laser welding or diffusion welding, to join the inner surface of the cover plate 11 via the first joint edge 210 or the second joint edge 220, thereby welding the circuit heat pipe 2 to the first through hole 110 and the second through hole 111, without leaving weld marks on the outside of the cover plate 11 and affecting the appearance. In addition, the gap between the first end 21 and the first flange 110a, or the gap between the second end 22 and the second flange 111a of the circuit heat pipe 2, can be further sealed by means of welding, such as material welding.

[0020] Referring again to Figures 1 and 2, the above-mentioned heat spreader 1 is further provided with at least one first support structure 12 corresponding to the lower part of the first joint edge 210, and at least one second support structure 13 corresponding to the second joint edge 220 and blocking the lower part of the second end 22 port. At least the second support structure 13 is made of capillary material. As shown in Figure 6, the first support structure 12 can be arranged in multiples around the lower part of each of the first joint edges 210 so that the opening of the first end 21 communicates with the accommodating space 100. The working fluid vaporized in the heat spreader 1 can enter the circuit heat pipe 2 from the first end 21, and then condense in the bending section 20 to return to the liquid working fluid. It then flows into the accommodating space 100 from the second end 22 through the capillary phenomenon generated by the second support structure 13, as shown in Figure 7. Meanwhile, since the second support structure 13 is blocked below the port of the second end 22, it can provide resistance to the vaporized working fluid in the accommodating space 100, causing the vaporized working fluid to flow towards the first end 21, while the second support structure 13 can allow the working fluid to flow back and return to a liquid state into the accommodating space 100. Further, as shown in Figure 2 in conjunction with Figures 6 and 7, the first support structure 12 can be covered with a capillary ring 120, while the second support structure 13 is surrounded by a plurality of support columns 130, which are solid structures.

[0021] Therefore, by means of the above-described structure, the three-dimensional loop heat exchange device of the present invention can be obtained.

[0022] Therefore, by means of the three-dimensional loop heat exchange device of the present invention, not only can the working fluid disposed in the heat exchange plate 1 and the loop heat pipe 2 flow in a certain direction to form a loop heat exchange device, but the loop heat pipe 2 can also be stably disposed on the heat exchange plate 1.

[0023] In summary, the present invention can indeed achieve the purpose of use described in the above specification and solve the deficiencies of the prior art. As it has novelty and progress, it fully meets the requirements for an invention patent application. Therefore, this application is filed in accordance with the Patent Law. Please examine it carefully and grant this patent to protect the rights of the inventor.

[0024] However, the above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent techniques and means made using the contents of the present invention specification and drawings are also included in the scope of the present invention and are hereby stated. [Simplified Explanation of the Diagram]

[0007] Figure 1 is a three-dimensional assembly diagram of the present invention.

[0008] Figure 2 is an exploded perspective view of the present invention.

[0009] Figure 3 is a planar top view of the present invention.

[0010] Figure 4 is a schematic diagram of the manufacturing process steps of the loop heat pipe and cover plate of the present invention (I).

[0011] Figure 5 is a schematic diagram of the manufacturing process steps of the loop heat pipe and cover plate of the present invention (II).

[0012] Figure 6 is a partial cross-sectional schematic diagram of the first support structure of the present invention.

[0013] Figure 7 is a partial cross-sectional schematic diagram of the second support structure of the present invention.

Claims

1. A three-dimensional loop heat exchange device, comprising: A heat spreader includes a base plate and a cover plate, with the cover plate fitting onto the base plate to form an accommodating space between them. The cover plate also has at least one first through hole and at least one second through hole. A heat pipe is disposed on the cover plate and has a curved section, and a first end and a second end extending from the two ends of the curved section, respectively. The first end penetrates the first through hole and has a first mating edge overlapping the inner surface of the cover plate, while the second end penetrates the second through hole and has a second mating edge overlapping the inner surface of the cover plate. The heat spreader further includes at least one first support structure corresponding to the lower part of the first mating edge, and at least one second support structure corresponding to the second mating edge and blocking the lower part of the second end to provide resistance to the vaporized working fluid within the accommodating space. The second support structure is made of capillary material.

2. The three-dimensional loop heat exchange device as described in claim 1, wherein the loop heat pipe system is bent into an inverted U-shape.

3. The three-dimensional loop heat exchange device as claimed in claim 1, wherein the first joint edge and the second joint edge are welded to the inner surface of the cover plate without material.

4. The three-dimensional loop heat exchange device as described in claim 3, wherein the materialless welding refers to laser welding or diffusion welding.

5. The three-dimensional loop heat exchange device as described in any one of claims 1 to 4, wherein the first through hole is provided with a first flange protruding outward, and the second through hole is provided with a second flange protruding outward.

6. The three-dimensional loop heat exchange device as described in claim 5, wherein the gap between the first end and the first flange, or the gap between the second end and the second flange, is sealed by welding.

7. The three-dimensional loop heat exchange device as claimed in claim 1, wherein the first support structure is arranged in a plurality of configurations around the lower part of the first joint edge.

8. The three-dimensional loop heat exchange device as described in claim 1 or 7, wherein the first support structure is covered with a capillary ring.

9. The three-dimensional loop heat exchange device as claimed in claim 1, wherein the outer ring of the second support structure is provided with a plurality of support columns.

10. The three-dimensional loop heat exchange device as described in claim 9, wherein the support column system is a solid structure.

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