Wireless information integration chip and sealing gasket containing it

Abstract

This invention provides a wireless information integrated chip, comprising: a base film; an information and heating layer including an information area and an electromagnetic induction heating ring; and a first adhesive layer located between the base film and the information and heating layer. The information area has an antenna and a chip that are interconnected, and the electromagnetic induction heating ring surrounds the information area in a planar view. Using the aforementioned wireless information integrated chip, a sealing gasket can be manufactured, which can increase the functionality of wireless information read / write transmission, reduce material waste, lower energy consumption, and significantly improve the automation, digitization, and intelligence of factories, warehouses, logistics, shops, and unmanned checkout management.

Description

[Technical Field]

[0001] This invention relates to a wireless information integration sheet, and more particularly to a wireless information integration sheet for an electromagnetic induction sealing gasket, as well as a sealing gasket containing the aforementioned wireless information integration sheet. [Previous Technology]

[0002] Note: To achieve product traceability, information tags (usually RFID tags) with information reading and writing functions are set on the product packaging. Product information, such as product model, production history, inventory, and logistics and transportation data, is written in the information tags. For example, some have suggested directly attaching the information tags to the neck of the product container or directly affixing them to the middle area of ​​the product container.

[0003] Furthermore, generally speaking, an RFID tag includes an antenna for receiving / transmitting signals and a chip for processing radio frequency signals. By reading the RFID tag on the outside of a container using a reader, it is possible to manage and control the product's production history, inventory, and logistics status.

[0004] In addition, conventional electromagnetic induction sealing gaskets heat up the aluminum foil layer of the electromagnetic induction sealing gasket through electromagnetic induction, thereby causing the lower layer of the electromagnetic induction sealing gasket that contacts the bottle mouth to melt, so that the lower layer adheres to the bottle mouth and achieves a seal on the bottle mouth.

[0005] In order to prevent counterfeiting, some electromagnetic induction sealing gaskets will have an information layer sandwiched in them. The information layer has a radio frequency chip and a radio frequency antenna. The radio frequency chip can store various product information such as production information and transportation information, so as to facilitate traceability and anti-counterfeiting. [Summary of the Invention]

[0006] However, because conventional technology involves directly attaching the information tag to the neck or belly area of ​​the product container, users can easily remove or tear it off for reuse. Even worse, some users remove or tear off the information tag and reattach or stick it to other product containers for reuse, resulting in poor anti-counterfeiting features. This can lead to losses for buyers or sellers due to price differences, or the tag being too close to the liquid contents inside the container can cause the wireless signal to be absorbed by the liquid, significantly reducing the transmission distance of the wireless signal.

[0007] Next, the inventors conceived of integrating an information tag (RFID tag) into the sealing gasket, thereby enhancing anti-counterfeiting by tearing open the sealing gasket to remove or destroy the information tag. However, the inventors discovered that because conventional sealing gaskets contain a single layer of aluminum foil, during electromagnetic induction heating, heat is distributed in other areas of the sealing gasket (e.g., the aluminum foil layer) besides the sealing ring area of ​​the container, resulting in wasted energy. This heat may also cause unpleasant odors to seep into the contents of the container due to the heated sealing layer. Furthermore, excessive use of aluminum foil will also have an adverse environmental impact.

[0008] In addition, conventional electromagnetic induction sealing gaskets with information layers also have the following problems: (1) Since the information layer is an independent layer, this increases the thickness of the electromagnetic induction sealing gasket, and there are also problems of material waste, energy waste and labor waste; (2) The aluminum foil layer is a whole piece of structure, and the aluminum foil layer will interfere with the information layer and even cause a significant reduction in wireless information transmission performance.

[0009] Therefore, how to solve the problems encountered when information labels are applied to sealing gaskets and effectively reduce the amount of aluminum foil used in sealing gaskets has become an urgent problem that this technical field hopes to solve.

[0010] The inventors have discovered that the wireless information integration chip containing the information area (RFID tag) of this invention can be used to manufacture sealing gaskets, effectively reducing the amount of aluminum foil used and lowering energy consumption. Specifically, the wireless information integration chip of this invention can increase the function of wireless information transmission, reduce material waste, lower energy consumption, avoid manpower waste, avoid interference from metals and liquids, improve production efficiency, provide good communication performance and significantly increase communication distance, greatly enhancing the automation, digitization and intelligentization of factories, warehouses, logistics, shops, and unmanned checkout management. In one specific example, it can also activate battery power according to preset rules, record temperature and position parameters at regular intervals, and effectively control cold chain logistics. Furthermore, the wireless information integration chip of this invention can be embedded in sealing gaskets and easily produce various different sealing gaskets, especially electromagnetic induction sealing gaskets.

[0011] In order to solve the above problems, the present invention provides a wireless information integrated chip, which includes: a base film; an information and heating layer, which includes an information area and an electromagnetic induction heating ring; a first adhesive layer, which is located between the base film and the information and heating layer; wherein the information area has an antenna and a chip that are mutually connected, and the electromagnetic induction heating ring surrounds the information area in a planar view.

[0012] In an embodiment, the wireless information integrated sheet further has a protective layer and a second adhesive layer. The protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

[0013] In an embodiment, there is a gap between the electromagnetic induction heating ring and the information area. In a preferred embodiment, the gap between the electromagnetic induction heating ring and the information area is completely filled.

[0014] In the embodiments, the protective layer is made of at least one of the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polyethylene naphthalate (PEN), and polyimide (PI), and its thickness is 12~100µm.

[0015] In the embodiments, the base film is made of at least one of the group consisting of polyimide (PI), polyethylene naphthalate (PEN), PET, polycarbonate (PC), PP and PE, and its thickness is 20~150µm.

[0016] In this embodiment, the chip is a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip.

[0017] In an embodiment, a cutting line is further included on the inner side of the inner edge of the electromagnetic induction heating ring, and the cutting line has a plurality of break points; furthermore, the cutting line is located between the information area and the electromagnetic induction heating ring and surrounds the information area.

[0018] In the embodiment, the electromagnetic induction heating ring is made of aluminum, copper, gold, silver or tin, and its thickness is 6~40µm.

[0019] In this embodiment, the information area also includes batteries.

[0020] In the embodiment, the thickness of the information and heating layer is 6µm~2.5mm.

[0021] In the embodiment, the information and the thickness of the heating layer are 6~300µm.

[0022] In an embodiment, the first adhesive layer is a composite adhesive with a thickness of 0.5~7µm, and the peel strength between the base film and the information and heating layer is greater than 4N / 15mm.

[0023] In an embodiment, the second adhesive layer is a composite adhesive with a thickness of 0.5~7µm, and the peel strength between the information and the heating layer and the protective layer is greater than 4N / 15mm.

[0024] In an embodiment, the interval is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1mm to 3mm.

[0025] In an embodiment, the information and heating layer further includes at least one physical connection bridge, which is used to connect the information area and the electromagnetic induction heating ring.

[0026] The sealing gasket of the present invention includes the above-mentioned wireless information integrated chip.

[0027] In an embodiment, the sealing gasket further includes an upper layer, which is laminated onto the wireless information integration sheet, and the upper layer is composed of at least one of the group consisting of paper, PE, PP, PET, PA, PEN, polyimide (PI), expandable polyephylene (EPE), expandable polypropylene (EPP), expandable polystyrene (EPS), wax, varnish, silicone oil and polyurethane, and its thickness is 12µm to 3mm.

[0028] In an embodiment, the sealing gasket further comprises a lower layer, which is laminated beneath the wireless information integration sheet, and the components of the lower layer include paper, PE, PP, PET, polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate (EEA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-methyl acrylate copolymer (EMAC), and ethylene-methyl methacrylate copolymer (EMMA). It is at least one of the group consisting of EMAA, polyacrylate, polyacetate, and polyurethane, and has a thickness of 3µm to 120µm.

[0029] This invention addresses the aforementioned problems and aims to provide a wireless information integration chip, particularly a wireless information integration chip for electromagnetic induction heating sealing gaskets. The aforementioned wireless information integration chip is applicable to various sealing gaskets, increasing wireless information transmission functionality while reducing material waste, energy consumption, and manpower waste. It also avoids interference from metals and liquids, improves production efficiency, provides excellent communication performance, and significantly extends communication distance, thereby greatly enhancing the automation, digitalization, and intelligence of factories, warehouses, logistics, shops, and unmanned checkout management.

Implementation Method

[0031] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] Unless otherwise stated herein, the terms "A to B" used in the specification and the appended claims have the meaning of "more than A and less than B". For example, the term "10 to 40% by weight" has the meaning of "more than 10% by weight and less than 40% by weight".

[0033] [First Embodiment] <Wireless Information Integration Sheet> First, please refer to FIG1, which is a cross-sectional schematic diagram of a wireless information integration sheet 100 according to an embodiment of the present invention. As shown in FIG1, the wireless information integration sheet 100 according to an embodiment of the present invention includes: a base film 1; a first adhesive layer 2; and an information and heating layer 3. The first adhesive layer 2 is located between the base film 1 and the information and heating layer 3 to bond the base film 1 and the information and heating layer 3. Hereinafter, each layer will be described in detail.

[0034] <<Base Film>> The base film is the initial layer used to fabricate the wireless information integrated circuit. In one specific example, the base film 1 is made of at least one of the group consisting of PI, PEN, PET, PC, PP, and PE. Furthermore, the thickness of the base film 1 is preferably 20~150µm, within which the longitudinal tensile strength is greater. In addition, as shown in FIG1, the lower surface of the base film 1 is bonded to the first adhesive layer 2, while the upper surface of the base film 1 can serve as a printing surface for printing different patterns.

[0035] <<First Adhesive Layer>> The first adhesive layer is used to bond the base film and information to the heating layer. In one specific example, the first adhesive layer 2 only needs to be able to bond the base film 1 and information to the heating layer 3, and its material can be, for example, a composite adhesive. Furthermore, the thickness of the first adhesive layer 2 can be 0.5~7µm, which allows the peel strength between the two bonded materials to be greater than 4N / 15mm.

[0036] <<Information and Heating Layer>> In this invention, the information and heating layer 3 includes an information area 31 and an electromagnetic induction heating ring 32. The information area 31 has the function of wireless information read / write transmission for subsequent product traceability. The information area 31 has an antenna 312 and a chip 311 that are interconnected. The electromagnetic induction heating ring 32 can be heated by electromagnetic induction through the electromagnetic field generated by the electromagnetic induction sealing machine, causing the sealing gasket's adhesive layer to melt and adhere to the container opening, thus acting as an electromagnetic induction sealing gasket to seal the container opening. By incorporating the wireless information integrated chip of this invention, most of the heat is generated in the electromagnetic induction heating ring 32, with very little heat conducted only by at least one physical connection bridge 33 between the antenna 312 and the electromagnetic induction heating ring 32. The length of the physical connection bridge 33 can be 0.1mm to 3mm, the width of the physical connection bridge 33 can be 0.01mm to 5mm, and the material of the physical connection bridge 33 can be the same as that of the antenna 312. This not only prevents a large amount of heat from being transferred to the center area of ​​the sealing gasket during electromagnetic induction sealing, but also saves energy.

[0037] Next, FIG2A is a plan view of the information and heating layer according to one embodiment of the present invention, and FIG2B is a plan view of the information and heating layer according to another embodiment of the present invention. As shown in FIG2A or 2B, the electromagnetic induction heating ring 32 surrounds the information area 31 in a planar view. Also, as shown in FIG2A, the electromagnetic induction heating ring 32 and the information area 31 are filled with a spacer ITV, that is, there are no physical connecting elements (such as physical connecting bridges described later) between the electromagnetic induction heating ring 32 and the information area 31. In this way, by filling the spacer ITV between the electromagnetic induction heating ring 32 and the information area 31, this filled spacer ITV can block heat conduction to the information area 31 when electromagnetic induction heating occurs, which is a preferred state. Furthermore, the spacer ITV (the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring) can be 0.1~3mm. Next, as shown in Figure 2B, a gap ITV is provided at most of the location between the electromagnetic induction heating ring 32 and the information area 31. This gap ITV can block most of the heat conduction to the information area 31 when electromagnetic induction heating occurs, and the gap ITV (the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring) can be 0.1~3mm. In addition, there can be at least one physical connection bridge 33 (two are shown in Figures 2B and 3B) between the antenna 312 and the electromagnetic induction heating ring 32. The length of the physical connection bridge 33 can be 0.1mm~3mm, and the width of the physical connection bridge 33 can be 0.01mm~5mm. At this time, although the closed-loop electromagnetic induction heating ring 32 and the information area 31 are electrically connected, the wireless communication distance is hardly reduced. In other words, the space between the electromagnetic induction heating ring 32 and the information area 31 can be filled with a spacer ITV, and can have both a spacer ITV and a physical connection bridge 33 at the same time, or it can be without a spacer (for example, the space between the electromagnetic induction heating ring 32 and the information area 31 can be filled with a physical connection bridge 33).

[0038] In one specific example, the material of the electromagnetic induction heating ring 32 may be a metal, such as aluminum, copper, gold, silver, or tin. Furthermore, from the viewpoint of the effect of generating heat when subjected to a changing electromagnetic field and cost, the electromagnetic induction heating ring 32 is preferably made of aluminum foil with a thickness of 6 to 40 µm.

[0039] On the other hand, regarding chip 311, it may have a unique identification code and can be selected according to the purpose. For example, it may be a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip, etc., without particular limitation. All of these chips can be matched with the antenna 312 described later to realize wireless information communication functions.

[0040] Next, regarding the antenna 312, its main function is to generate wirelessly transmitted signals. Its material can be metal, such as copper, silver, gold, tin or aluminum, etc., without any particular limitation.

[0041] Furthermore, FIG3A is a plan view of a specific example of the information area of ​​one embodiment, FIG3B is a plan view of a specific example of the information area of ​​another embodiment, and FIG6 is a cross-sectional view of a wireless information integrated chip according to an embodiment of the present invention. FIG3A shows an embodiment where the space between the electromagnetic induction heating ring 32 and the information area 31 in FIG2A is filled with an ITV (Interval Television), and FIG3B shows an embodiment where most of the space between the electromagnetic induction heating ring 32 and the information area 31 in FIG2B is filled with an ITV. Additionally, as shown in FIG3A or 3B, the information area 31 includes a chip 311 and an antenna 312, and the relative positions of the chip 311 and the antenna 312 in the cross-sectional view are as shown in FIG6. Furthermore, as shown in FIG6, a chip encapsulation protective adhesive 6 (e.g., epoxy resin) is applied to the chip 311 to protect the chip 311 and the bonding wires connecting the chip 311 and the antenna 312 from external damage. In the case of enabling wireless information transmission, the chip 311 and antenna 312 can be arranged in the manner shown in Figure 3A or 3B, Figure 6 or other ways based on the RFID frequency band desired by the user, without any particular limitation.

[0042] Furthermore, in another embodiment, the information area 31 may also include a battery 313, as shown in FIG6, to provide the power required for information transmission. Also, regarding the arrangement of the battery 313, it is preferable to avoid covering the antenna as much as possible, so that the battery does not affect the wireless transmission of the antenna. Furthermore, the thickness of the battery 313 may be greater than or less than the thickness of the antenna 312, depending on the battery material, application requirements, and the allowable space between the container and the lid. Specifically, when it is possible to activate power supply according to the application software and the reader's preset instructions, the chip 311 used for wireless information transmission can operate at regular intervals to record operating parameters (such as temperature parameters and position parameters), facilitating effective control of logistics (such as cold chain logistics). For example, it can be arranged in the range, size, thickness, or manner indicated in FIG6.

[0043] Furthermore, as shown in FIG3A or 3B, in another embodiment, a cutting line 321 is further included on the inner side of the inner edge of the electromagnetic induction heating ring 32. Also, the cutting line 321 preferably has a plurality of break points; specifically, the cutting line 321 may have four or more break points. Furthermore, since the material of the wireless information integrated chip has high tensile strength, this cutting line 321 allows the wireless information integrated chip to be used with specific sealing gaskets, such as sealing gaskets with the following characteristics: after the user uses their fingers to pinch the lifting part to tear off the middle part of the sealing gasket, only the sealing ring of the sealing gasket remains at the container opening. Also, as shown in FIG3A or 3B, the cutting line 321 is located between the information area (including the chip 311 and the antenna 312) and the electromagnetic induction heating ring 32, and surrounds the information area.

[0044] Finally, the thickness of the information and heating layer 3 can be adjusted according to the battery material, the user's needs (the sealing gasket to be applied), and the allowable space between the container and the lid. Specifically, when applied to a sealing gasket containing a battery as described later, the thickness of the information and heating layer can be 6µm to 2.5mm. When applied to a sealing gasket without a battery, the thickness of the information and heating layer can be 6 to 300µm.

[0045] Furthermore, although Figure 1 shows the case where the base film 1 is on top and the information and heating layer 3 is on the bottom, the order of the base film 1 and the information and heating layer 3 can be reversed as needed, that is, adjusted to the case where the base film 1 is on the bottom and the information and heating layer 3 is on top.

[0046] [Second Embodiment] Next, regarding the wireless information integration sheet 100' of the second embodiment, as shown in FIG4, in addition to the base film 1, the first adhesive layer 2, and the information and heating layer 3 of the first embodiment, it also includes a protective layer 5 and a second adhesive layer 4. The protective layer 5 is located on the side of the information and heating layer 3 away from the base film 1. Furthermore, the second adhesive layer 4 is located between the information and heating layer 3 and the protective layer 5, and is a layer used to bond the information and heating layer 3 and the protective layer 5.

[0047] <<Second Adhesive Layer>> In one specific example, the second adhesive layer 4 only needs to be able to bond the information to the heating layer 3 and the protective layer 5, and its material can be, for example, a composite adhesive, without particular limitation. Furthermore, the thickness of the second adhesive layer 4 can be 0.5~7µm, preferably such that the peel strength between the two bonded materials is greater than 4N / 15mm. In addition, as shown in FIG4, the second adhesive layer 4 can extend to fill the gap between the electromagnetic induction heating ring 32 and the information area 31 to improve the overall structural strength of the wireless information integrated chip 100'.

[0048] <<Protective Layer>> Next, the protective layer 5 of this embodiment will be described. The protective layer 5 is used to protect the information area 31 (i.e., the chip 311, the antenna 312, and the optional battery 313) from external damage to the chip 311 and the battery 313, thereby affecting their ability to transmit wireless information. Its material can be at least one of the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polyethylene naphthalate (PEN), and polyimide (PI). Furthermore, in a preferred embodiment, the thickness of the protective layer 5 can be 12~100µm.

[0049] Furthermore, either the upper or lower surface of the protective layer 5 can be used as the printing surface. Therefore, although Figure 4 shows the case where the base film 1 is on the bottom and the protective layer 5 is on the top (the upper surface of the protective layer 5 is used as the printing surface), the order of the base film 1 and the protective layer 5 can be reversed as needed, that is, the case where the base film 1 is on the top and the protective layer 5 is on the bottom (the lower surface of the protective layer 5 is used as the printing surface).

[0050] [Fabrication of Wireless Information Integration Sheet] Based on the following steps, a roll of wireless information integration sheet related to the foregoing embodiments is manufactured.

[0051] First, a composite adhesive (first adhesive layer) is applied to the composite surface of the base film roll, and then it is laminated with the composite surface of the metal foil roll to produce a roll of wireless information integrated circuit preform. Next, the metal foil of the wireless information integrated circuit preform roll is etched to bond the antenna and the chip to an electrical connection. Then, a chip encapsulation protective adhesive is used with a dispensing machine to encapsulate the chip and the bonding wires connecting the chip and the antenna. At this point, the metal foil forms an information and heating layer, and the roll of wireless information integrated circuit preform becomes a roll of wireless information integrated circuit related to one embodiment. Afterward, the roll of wireless information integrated circuit can be cut as needed to produce the required wireless information integrated circuit.

[0052] The peel strength between the two layers of materials bonded by the composite adhesive is greater than 4N / 15mm.

[0053] In addition, if it is desired to add a battery to the information and heating layer, a welding machine or conductive adhesive can be used to process the battery cell and the chip into an electrical connection.

[0054] On the other hand, a roll of wireless information integration sheet related to another embodiment can be produced based on the following steps.

[0055] First, a composite adhesive (first adhesive layer) is applied to the composite surface of the base film roll, and then it is laminated with the composite surface of the metal foil roll to produce a roll of wireless information integrated circuit preform. Second, the metal foil of the wireless information integrated circuit preform roll is etched to bond the antenna and the chip to form an electrical connection. Then, the chip is encapsulated using a chip encapsulation protective adhesive through a dispensing machine, and bonding lines connecting the chip and the antenna are formed. At this time, the metal foil forms an information and heating layer, and the roll of wireless information integrated circuit preform becomes a roll for manufacturing a wireless information integrated circuit related to another embodiment.

[0056] Next, a composite adhesive (second adhesive layer) is applied to the roll of the protective layer, and the information of the roll of the wireless information integrated sheet related to another embodiment and the surface of the heating layer (the surface away from the base film) are combined to make the roll of the wireless information integrated sheet related to another embodiment; then, the roll of the wireless information integrated sheet related to another embodiment can be cut as needed to make the required wireless information integrated sheet.

[0057] The peel strength between the two layers of materials bonded by the composite adhesive is greater than 4N / 15mm. Furthermore, if a battery is to be added to the information and heating layers, a welding machine or conductive adhesive can be used to process the battery cells and the wafer into an electrical connection.

[0058] (Preparation of Sealing Gasket) Next, a sealing gasket can be prepared using the wireless information integration sheet roll of the present invention. Specifically, please refer to FIG5, which is a cross-sectional schematic diagram of a sealing gasket 900 according to an embodiment. Also, as shown in FIG5, the wireless information integration sheet 100 roll of the above embodiment can be laminated with the upper layer 200 and the lower layer 300 to prepare the sealing gasket 900 roll; then, the sealing gasket 900 roll can be laminated and cut as needed to prepare the required sealing gasket.

[0059] The main component of the upper layer 200 may be at least one of the group consisting of paper, PE, PP, PET, PEN, PA, polyimide (PI), expandable polyephylene (EPE), expandable polyproplene (EPP), expandable polystyrene (EPS), wax, varnish, silicone oil and polyurethane, and its thickness is 12µm to 3mm. Furthermore, the main components of the lower layer 300 (sealing film or sealing film and its reinforcing layer above it) used for container sealing can be paper, PE, PP, PET, polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate (EEA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-methyl acrylate copolymer (EMAC), and ethylene-methacrylic acid copolymer (EMMA). It is at least one of the group consisting of EMAA, polyacrylate, polyacetate, and polyurethane, and has a thickness of 3µm to 120µm.

[0060] As for the method of lamination, the above-mentioned lamination method or conventional methods such as adhesive, pressing, and coating can be used, and there are no particular restrictions.

[0061] It should be noted that the above description is only a specific example, and the manufacturing order of the above layers is not particularly limited. Also, although the manufacturing of the wireless information integration sheet 100 is described here, the wireless information integration sheet 100' can also be used as a substitute for the wireless information integration sheet 100, and bonding, joining, coating or connecting can be used as a composite substitute.

[0062] The present invention is not limited to the above-described embodiments. Various changes can be made within the scope shown in the claims. Furthermore, embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of the present invention. [Simplified Explanation of the Diagram]

[0030] Figure 1 is a cross-sectional schematic diagram of a wireless information integration sheet according to an embodiment of the present invention. Figure 2A is a plan view of an information and heating layer according to an embodiment of the present invention. Figure 2B is a plan view of an information and heating layer according to another embodiment of the present invention. Figure 3A is a plan view of a specific example of an information area according to an embodiment of the present invention. Figure 3B is a plan view of a specific example of an information area according to another embodiment of the present invention. Figure 4 is a cross-sectional schematic diagram of a wireless information integration sheet according to an embodiment of the present invention. Figure 5 is a cross-sectional schematic diagram of a sealing gasket according to an embodiment of the present invention. Figure 6 is a cross-sectional schematic diagram of a wireless information integration sheet according to an embodiment of the present invention.

Claims

1. A wireless information integrated chip, comprising: a base film; an information and heating layer, including an information area and an electromagnetic induction heating ring; and a first adhesive layer located between the base film and the information and heating layer; wherein, The information area has interconnected antennas and chips. In a planar view, the electromagnetic induction heating ring surrounds the information area, and there is a gap between the electromagnetic induction heating ring and the information area.

2. The wireless information integration chip as described in claim 1, wherein, It also has a protective layer and a second adhesive layer, the protective layer being located on the side of the information and heating layer away from the base film, and the second adhesive layer being located between the information and heating layer and the protective layer.

3. The wireless information integration chip as described in claim 1, wherein, The electromagnetic induction heating ring is completely separated from the information area.

4. The wireless information integration chip as described in claim 2, wherein, The protective layer is made of at least one of the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polyethylene naphthalate (PEN), and polyimide (PI), and its thickness is 12 to 100 µm.

5. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The base film is made of at least one of the group consisting of polyimide (PI), polyethylene naphthalate (PEN), PET, polycarbonate (PC), PP and PE, and has a thickness of 20 to 150 µm.

6. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The chip is a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip.

7. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The inner edge of the electromagnetic induction heating ring also includes a cutting line, and the cutting line has a plurality of breaks; furthermore, the cutting line is located between the information area and the electromagnetic induction heating ring and surrounds the information area.

8. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The electromagnetic induction heating ring is made of aluminum, copper, gold, silver or tin, and its thickness is 6~40µm.

9. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The information area also contains batteries, which are electrically connected to the chip.

10. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The thickness of this information and heating layer is 6µm ~ 2.5mm.

11. The wireless information integration chip as described in claim 9, wherein, The thickness of this information and heating layer is 6µm ~ 2.5mm.

12. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The thickness of this information and heating layer is 6~300µm.

13. The wireless information integration chip as described in any one of claims 1 to 4, wherein, The first adhesive layer is a composite adhesive with a thickness of 0.5~7µm, and the peel strength between the base film and the information and heating layer is greater than 4N / 15mm.

14. The wireless information integration chip as described in claim 2, wherein, The second adhesive layer is a composite adhesive with a thickness of 0.5~7µm, and the peel strength between the information layer and the heating layer and the protective layer is greater than 4N / 15mm.

15. The wireless information integration chip as described in claim 1 or 3, wherein, The interval is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1mm to 3mm.

16. The wireless information integration chip as described in claim 1, wherein, The information and heating layer also includes at least one physical connection bridge, which is used to connect the information area and the electromagnetic induction heating ring.

17. A sealing gasket comprising a wireless information integration chip as described in any one of claims 1 to 16.

18. The sealing gasket as claimed in claim 17 further comprises an upper layer laminated onto the wireless information integration sheet, wherein the upper layer is composed of at least one of the group consisting of paper, PE, PP, PET, PA, PEN, polyimide (PI), expandable polyephylene (EPE), expandable polyproplene (EPP), expandable polystyrene (EPS), wax, varnish, silicone oil, and polyurethane, and has a thickness of 12µm to 3mm.

19. The sealing gasket as described in claim 17 further comprises a lower layer laminated beneath the wireless information integration sheet, wherein the lower layer is composed of paper, PE, PP, PET, polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate (EEA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-methyl acrylate copolymer (EMAC), and ethylene-methacrylic acid copolymer (EMMA). It is at least one of the group consisting of EMAA, polyacrylate, polyacetate, and polyurethane, and has a thickness of 3µm to 120µm.

20. The sealing gasket as described in claim 18 further comprises a lower layer laminated beneath the wireless information integrated sheet, wherein the lower layer is composed of paper, PE, PP, PET, polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene-acrylic acid copolymer (EAA), ethylene-ethyl acrylate (EEA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-methyl acrylate copolymer (EMAC), and ethylene-methacrylic acid copolymer (EMMA). It is at least one of the group consisting of EMAA, polyacrylate, polyacetate, and polyurethane, and has a thickness of 3µm to 120µm.

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