Reactor system

Abstract

A temperature control system for a chemical delivery system (e.g., included in a reactor system) may include a temperature control housing coupled to and / or enclosing at least a portion of at least one component of the chemical delivery system. A chemical delivery system may include a filter, an accumulator, and / or a chemical application line, which are fluidly coupled to each other in any suitable configuration and / or configuration. A temperature control system for this chemical delivery system may include a filter temperature control housing coupled to and / or enclosing at least a portion of the filter; an accumulator temperature control housing coupled to and / or enclosing at least a portion of the accumulator; and / or an application line temperature control housing coupled to and / or enclosing at least a portion of the chemical application line.

Description

Technical Field

[0001] This disclosure generally relates to gas-phase reactors and systems. More specifically, this disclosure relates to temperature-controlled chemical delivery systems, reactor systems including temperature-controlled chemical delivery systems, and methods of using the same. Background Art

[0002] Gas-phase reactors such as those used for chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), atomic layer deposition (ALD), and the like can be used for various applications, including depositing and etching materials on substrate surfaces. For example, a gas-phase reactor can be used to deposit and / or etch a layer on a substrate to form semiconductor devices, flat panel display devices, photovoltaic devices, microelectromechanical systems (MEMS), and the like.

[0003] Typical gas-phase reactor systems include a reactor that includes a reaction chamber, one or more precursor gas sources fluidly coupled to the reaction chamber, one or more carrier and / or purge gas sources fluidly coupled to the reaction chamber, and / or a vacuum source.

[0004] It may be desirable to operate various reactors at elevated temperatures to obtain a desired reaction within the reaction chamber (and specifically on or near the substrate surface). For example, gas-phase reactors can often be operated at temperatures of 200 °C or higher. In addition, precursor or reactant gases can be delivered to the reaction chamber at elevated temperatures, especially when the precursor or reactant gas is sourced from a solid or liquid source. Specifically, when the precursor or reactant is derived from a liquid or solid source, unwanted condensation can occur in the delivery path between the source and the reaction chamber. In some cases, the delivery path can be heated to slow condensation. However, if the precursor or reactant is heated to too high a temperature, decomposition of the precursor or reactant can occur. Accordingly, an improved temperature-controlled chemical delivery system (such as those incorporated in reactor systems) is desired. Summary of the Invention

[0005] Various embodiments of the present disclosure relate to a temperature control system for a chemical delivery system, a temperature-controlled chemical delivery system, a reactor system including the temperature control system and the temperature-controlled chemical delivery system, and methods of using the same. In various embodiments, a temperature control system for a chemical delivery system may include various heating enclosures configured to couple to and surround the chemical delivery system or a portion of the chemical delivery system. Thus, a precursor or reactant gas (or vapor or any other type of gas) delivered through a chemical delivery system to a reaction chamber may be maintained at a target temperature (or within a temperature range) at various points throughout the chemical delivery system. The target temperature may be between the sublimation or evaporation temperature of an individual compound (to keep the compound in the gas phase) and a decomposition temperature at which the compound may decompose or otherwise degrade. Additionally, the target temperature may be a temperature that prevents condensation or deposition of the precursor or reactant gas at a point in the chemical delivery system.

[0006] In various embodiments, a temperature control system for a chemical delivery system (such as included in a reactor system) may include a temperature control enclosure coupled to the chemical delivery system and / or enclosing at least a portion of at least one component of the chemical delivery system. In various embodiments, a chemical delivery system may include a chemical delivery pipeline, a filter, an accumulator, and / or a chemical application pipeline. Components of a chemical delivery system may be fluidly coupled to each other in any suitable configuration or order. For example, for such a chemical delivery system, a temperature control system may include a delivery pipeline temperature control enclosure coupled to the chemical delivery pipeline / or enclosing at least a portion of the chemical delivery pipeline; a filter temperature control enclosure coupled to the filter and / or enclosing at least a portion of the filter; an accumulator temperature control enclosure coupled to the accumulator and / or enclosing at least a portion of the accumulator; and / or an application pipeline temperature control enclosure coupled to the chemical application pipeline / or enclosing at least a portion of the chemical application pipeline. A temperature control enclosure of the temperature control system may include any suitable material configured to dissipate and / or distribute thermal energy (e.g., a conductive material such as a metal, including aluminum, steel, and / or the like).

[0007] In various embodiments, a component of a chemical delivery system can be disposed within a cavity of a respective temperature-controlled enclosure. In various embodiments, two or more portions of a temperature-controlled enclosure can be coupled together to form the temperature-controlled enclosure and the cavity therein, the cavity configured to house a component of the chemical delivery system. In various embodiments, each temperature-controlled enclosure in a temperature control system for a chemical delivery system can include a temperature adjustment device (e.g., a heater and / or a cooler), which is configured to adjust the temperature of the respective temperature-controlled enclosure. Each temperature adjustment device can be included within one or more respective temperature-controlled enclosures and / or coupled to one or more respective temperature-controlled enclosures. Each temperature adjustment device can be in electrical communication with a controller, the controller configured to adjust the temperature of the temperature adjustment device and thereby adjust the temperature of the respective temperature-controlled enclosure and the chemical delivery component.

[0008] In various embodiments, a chemical delivery system (e.g., such as a chemical delivery system included in a reactor system) includes a temperature control system as described herein. A reactor system that includes a chemical delivery system that includes a temperature control system as described herein can further include one or more reaction chambers, one or more gas manifolds, one or more precursor sources, one or more vacuum sources, one or more robotic transfer arms, and / or the like.

[0009] In various embodiments, a method of delivering a chemical to a reaction chamber can include heating or cooling at least one temperature-controlled enclosure of a temperature control system that is coupled to a respective component of a chemical delivery system; flowing the chemical through the chemical delivery system; and / or applying the chemical to the reaction chamber. Heating or cooling at least one temperature-controlled enclosure can occur before, during, and / or after flowing the chemical through the chemical delivery system. Heating or cooling at least one control enclosure can occur via a temperature adjustment device (e.g., a heater and / or a cooler) included within a respective temperature-controlled enclosure and / or coupled to the temperature-controlled enclosure. In various embodiments, the temperature adjustment device can be in electrical communication with a controller, the controller configured to control heating and / or cooling of the temperature control device, the respective temperature-controlled enclosure, a thermocouple, and / or the respective components of the chemical delivery system. Brief Description of the Drawings

[0010] A more complete understanding of the illustrative embodiments of the present disclosure can be obtained by reference to the embodiments and the claims when considered in conjunction with the following description of the drawings. Elements with like reference numerals in the various drawings are intended to be the same. FIG. 1A illustrates a block diagram of a reactor system and components therein according to various embodiments of the present disclosure. FIG. 1B shows a perspective view of a reactor system including a chemical delivery system according to various embodiments of the present disclosure. FIG. 1C shows a perspective view of the reactor system of FIG. 1B without a reaction chamber according to various embodiments of the present disclosure. FIG. 2 shows a chemical delivery system according to various embodiments of the present disclosure. FIG. 3 shows a chemical delivery system including a temperature control system according to at least one exemplary embodiment of the present disclosure. FIG. 4A shows a cross-sectional view of the chemical delivery system and the temperature control system of FIG. 3 along line S-T according to various embodiments of the present disclosure. FIG. 4B shows a cross-sectional view of the chemical delivery system and the temperature control system of FIG. 3 along line X-Y according to various embodiments of the present disclosure. FIG. 5 shows a method for delivering a chemical to a reaction chamber through a chemical delivery system according to various embodiments of the present disclosure.

[0011] It will be understood that the elements in the drawings are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. Additionally, according to various embodiments of the present disclosure, the steps of the illustrated methods may be performed in any suitable order and / or combination. Embodiments

[0012] The following description of the exemplary embodiments provided is merely exemplary and is intended solely for purposes of illustration. The following description is not intended to limit the scope of the present disclosure or the scope of the patent application. Additionally, the detailed description of multiple embodiments having the described features is not intended to exclude other embodiments having additional features, or other embodiments incorporating different combinations of the described features.

[0013] The present disclosure is generally directed to temperature-controlled chemical delivery systems, such as those included in a reactor system. The reactor system can be used to process a substrate (such as a semiconductor wafer) in a gas-phase reactor. For example, the systems described herein can be used to form or grow an epitaxial layer (e.g., a binary and / or doped semiconductor layer) on a substrate surface.

[0014] As used herein, "substrate" refers to any material having a surface upon which a material can be deposited. The substrate can include a bulk material such as silicon (e.g., single crystal silicon) or can include one or more layers overlying the bulk material. Further, the substrate can include various topographies such as trenches, vias, lines, and the like formed within or on at least a portion of a layer of the substrate.

[0015] FIG. 1A illustrates a block diagram of a reactor system 10 and components therein according to various embodiments. In various embodiments, the reactor system 10 can include a gas source 1, a chemical delivery system 2, a temperature control system 4, a reaction chamber 6, and / or a controller 8. The components of the reactor system 10 can be coupled to each other in a suitable manner (e.g., physically, fluidly, electrically, thermally, operationally, and / or the like). For example, the gas source 1, the chemical delivery system 2, and / or the reaction chamber 6 can be physically and / or fluidly coupled to each other. As another example, the chemical delivery system 2 and the temperature control system 4 can be physically and / or thermally coupled to each other. As yet another example, the controller 8 can be electrically, physically, and / or operationally coupled to any one or any combination of the other components of the reactor system 10.

[0016] As described in more detail below, different sections or components of the chemical delivery system can be temperature controlled (i.e., heated or cooled) to maintain a desired temperature. This allows chemicals (e.g., precursors or reactant gases) to be delivered through the chemical delivery system and to the reaction chamber while avoiding adversely affecting the chemicals (e.g., condensation or deposition of the chemicals in the chemical delivery system due to too low a temperature passing through it, or degradation or decomposition of the chemicals due to too high a temperature). In response to the ability of the temperature control system to maintain a desired temperature (i.e., more precisely maintain the temperature) throughout the chemical delivery system, chemicals that may have a relatively small temperature range between the condensation or sublimation temperature and the decomposition temperature and that encounter problems during delivery can be delivered to the reaction chamber through a temperature controlled chemical delivery system. Additionally or alternatively, chemicals (such as precursors and reactants) can be delivered over longer distances between the source and the reaction chamber.

[0017] According to various embodiments, FIGS. 1B and 1C illustrate an exemplary reactor system 50. The reactor system 50 (an example of the reactor system 10 of FIG. 1A) can be used for various applications, such as, for example, chemical vapor deposition, plasma-enhanced chemical vapor deposition, atomic layer deposition, cleaning processes, etching processes, and / or the like. Although the exemplary embodiments are described below in connection with an epitaxial reactor system, the embodiments and the present invention are not limited thereto unless otherwise stated.

[0018] In various embodiments, the reactor system 50 can include a gas source 12 (an example of the gas source 1), a chemical delivery system 100 (an example of the chemical delivery system 2 of FIG. 1A), and / or a reaction chamber 32 (an example of the reaction chamber 6 of FIG. 1A). In various embodiments, the reactor system can include multiple reaction chambers 32 (such as the two reaction chambers 32 illustrated in the reactor system 50 of FIG. 1B) and / or a gas source 12, and / or multiple gas sources can be included in the gas source 12. The components of the reactor system 50 can be coupled to a structural frame 40, which includes a base 44 and beams 42 coupled to the base. The structural frame 40 can support the components of the reactor system 50 in a desired configuration or configurations.

[0019] During operation of the reactor system 50, a substrate (such as a semiconductor wafer, not shown) is transferred from, for example, a substrate handling system (not shown) to the reaction chamber 32. Once the substrate is transferred to the reaction chamber 32, one or more gases (such as precursors, dopants, carrier gases, and / or purge gases) are introduced into the reaction chamber 32 via the chemical delivery system 100. Any unreacted gases and / or reaction by-products can exit the reaction chamber 32 and flow through an exhaust source.

[0020] In various embodiments, the gas source 12 can include one or more gases or materials that become gaseous (e.g., from a solid source delivery system) that are used in deposition, etching, cleaning, purging, or processing processes. Thus, the gases or materials that become gaseous in the gas source 12 can be precursors or reactants, purge gases, and / or the like. Exemplary gas sources include nitrogen trifluoride (NF 3), ammonia (NH 3), water vapor (H 2O), hydrogen peroxide (H 2O 2), mono methyl hydrazine (MMH), unsymmetrical dimethyl hydrazine (UDMH), oxygen (O 2) / hydrogen (H 2), nitrogen (N 2) / hydrogen, and hydrogen sulfide (H 2S).

[0021] Referring additionally to FIG. 2, the chemical delivery system 100 can be configured to deliver a gas (such as a precursor or reactant gas), a purge gas, or any other suitable gas from the gas source 12 to the reaction chamber 32. The chemical delivery system 100 can include a mass flow controller (such as mass flow controller 105) and / or a mass flow meter; a filter (such as filter 120), which is fluidly coupled to the mass flow controller 105 and is located downstream of the controller; an accumulator (such as accumulator 130), which is fluidly coupled to the filter 120 and is located downstream of the filter; and / or a chemical application pipeline (such as chemical application pipeline 140), which is fluidly coupled to the accumulator 130 and is located downstream of the accumulator.

[0022] The mass flow controller 105 can be fluidly coupled to the gas source 12 and can be configured to control the flow rate of the gas delivered to the reaction chamber 32. The exemplary flow rate can range from, for example, about 2 liters per minute to about 5.0 liters per minute and / or from about 0.5 liters per minute to about 2.0 liters per minute. The mass flow controller 105 can be heated (for example, by including a heater therein and / or thereon).

[0023] In various embodiments, the chemical delivery system 100 can include a filter (such as filter 120), which is fluidly coupled to the mass flow controller 105. The chemical delivery pipeline 110 (fluid channel) can fluidly couple the mass flow controller 105 to the filter 120, or the filter 120 can be directly coupled to the mass flow controller 105. The filter 120 can filter out or remove any particulates or contaminants in the gas flowing through the chemical delivery system 100 from the gas source 12.

[0024] In various embodiments, the chemical delivery system 100 may include an accumulator (such as accumulator 130) that is fluidly coupled to the filter 120. The accumulator 130 may be located downstream of the filter 120. In various embodiments, the accumulator 130 can be any suitable shape (such as a T-shape (as depicted in Figure 2), linear with any suitable cross-sectional shape, and / or the like). The accumulator 130 may include an inlet valve that, when open, allows gas from the gas source 12 to enter the accumulator 130 and, when closed, prevents gas from the gas source 12 from entering the accumulator 130. The accumulator 130 may include an outlet valve that can be closed to prevent gas from exiting the accumulator 130 (such as into the chemical application line 140) or opened to allow gas to exit the accumulator 130. During operation of the chemical delivery system 100 and / or the reactor system 50, gas may be allowed to enter the accumulator 130 by opening the accumulator inlet valve and closing the accumulator outlet valve and accumulate therein until a desired pressure level of the gas in the accumulator 130 is reached. In response, the accumulator inlet valve may close. The gas at the desired pressure in the accumulator 130 may then be released and allowed to flow through the chemical application line 140 for delivery and application into the reaction chamber 32. In at least one embodiment, the chemical delivery system 100 may be located at a long distance from the reaction chamber. Thus, the delivery line connecting the chemical delivery system 100 to the reaction chamber can act as a large accumulator for the gas. Advantages therefrom may include a smaller pressure drop, allowing for a more consistent pulse dose.

[0025] In various embodiments, the chemical delivery system 100 may include a pressure transducer (such as pressure transducer 160) that is coupled to the accumulator 130. The pressure transducer 160 may be fluidly coupled to the accumulator 130, for example, by a pressure line 150, and is configured to measure the pressure in the accumulator 130. For example, the chemical delivery system may allow gas to accumulate in the accumulator 130 up to a desired pressure threshold within the accumulator 130. In response to reaching the desired pressure in the accumulator 130 (as detected by the pressure transducer 160), the accumulator inlet valve may close so that additional gas does not enter the accumulator 130, and / or the accumulator outlet valve may open to allow gas to exit the accumulator 130.

[0026] In various embodiments, the chemical delivery system 100 may include a chemical application line 140 (or multiple chemical application lines 140 as depicted in FIG. 2). The chemical application line 140 (fluid channel) may be fluidly coupled to the accumulator 130 to deliver gas from the accumulator 130 to the reaction chamber 32. In response to the accumulator outlet valve opening to allow gas to flow from the accumulator 130, the gas may flow through the chemical application line 140. The chemical application line 140 may be fluidly coupled to a gas distribution system, which may be configured to mix gases from various gas sources and / or disperse the gases into the reaction chamber 32. An exemplary gas distribution system is described in U.S. Patent No. 8,152,922, entitled "Gas Mixer and Manifold Assembly for ALD Reactor," issued to Schmidt et al. on April 10, 2012, the contents of which are hereby incorporated by reference herein to the extent not inconsistent with the present disclosure. By way of example, the distribution system may include a showerhead gas distribution system.

[0027] In various embodiments, the chemical delivery system may include any combination of components (such as those discussed herein) in any suitable fluid order. Additionally, the chemical delivery system may include fewer components or additional components (e.g., additional filters, accumulators, more or fewer fluid channels, etc.) than those included in the chemical delivery system 100.

[0028] As discussed herein, the gas delivered to the reaction chamber 32 through the chemical delivery system 100 may be temperature sensitive and / or have other temperature requirements to maintain the chemical in a gaseous state (e.g., at a temperature above the evaporation or sublimation temperature) while avoiding degradation or decomposition of the chemical (e.g., at a temperature below the decomposition temperature). Thus, with additional reference to FIGS. 3, 4A, and 4B, the reactor system 50 and / or the chemical delivery system 100 may include a temperature control system (such as the temperature control system 200) to regulate the temperature at one or more of the components of the chemical delivery system 100. The temperature control system may include one or more temperature control enclosures to couple to one or more components of the chemical delivery system and enclose one or more components.

[0029] In various embodiments, the temperature control system 200 (an example of one of the temperature control systems 4 in FIG. 1A) may include at least one temperature control housing to enclose at least one component of the chemical delivery system 100. In various embodiments, the temperature control system 200 may include a transfer line temperature control housing 210 configured to couple to and enclose the chemical transfer line 110; a filter temperature control housing 220 configured to couple to and enclose the filter 120; an accumulator temperature control housing configured to couple to and enclose the accumulator 130; an application line temperature control housing 240 configured to couple to and enclose the chemical application line 140; and / or a pressure line temperature control housing 250 configured to couple to and enclose the pressure line 150.

[0030] In various embodiments, the temperature control housing for each component of the chemical delivery system may include one or more parts that are coupled together to couple to and enclose the respective components of the chemical delivery system. For example, the temperature control housing for each component of the chemical delivery system may be a shell heater or a shell temperature control device. Continuing with this example, in various embodiments, the filter temperature control housing 220 may include a first filter housing part 220A and a second filter housing part 220B, the accumulator temperature control housing may include a first accumulator housing part and a second accumulator housing part, and / or the application line temperature control housing 240 may include a first application line housing part 240A and a second application line housing part 240B. Similarly, in various embodiments, the transfer line temperature control housing 210 may include a first transfer line housing part 210A and a second transfer line housing part 210B, and / or the pressure line temperature control housing 250 may include a first pressure line housing part 250A and a second pressure line housing part 250B.

[0031] The accumulator 130, which is in a T-shape in the illustrated example, may have one temperature control housing or may have multiple temperature control housings coupled thereto. For example, as illustrated in FIG. 3, the accumulator temperature control housing for the accumulator 130 may include one T-shaped temperature control housing, or may include a vertical accumulator temperature control housing 230 (having a first vertical accumulator housing part 230A and a second vertical accumulator housing part 230B) and a horizontal accumulator temperature control housing 235 (having a first horizontal accumulator housing half 235A and a second horizontal accumulator housing half 235B).

[0032] In various embodiments, the temperature control housing for any component of the chemical delivery system may include any number of housings to couple to and enclose the respective component or a portion thereof.

[0033] In various embodiments, the temperature control housing for any component of the chemical delivery system may include a component cavity having a shape complementary to the shape of the respective chemical delivery system component. Accordingly, the respective chemical delivery system component may be disposed within the component cavity. For example, the temperature control housing 210 for the delivery pipeline may include a delivery pipeline housing cavity 212, the temperature control housing 220 for the filter may include a filter housing cavity 222, the temperature control housing for the accumulator may include an accumulator housing cavity (e.g., a vertical accumulator housing cavity 232 and / or a horizontal accumulator housing cavity 237), the temperature control housing 240 for the application pipeline may include an application pipeline housing cavity 242, and / or the temperature control housing 250 for the pressure pipeline may include a pressure pipeline housing cavity 252.

[0034] As discussed herein, the temperature control housing for each component of the chemical delivery system 100 can include multiple (two or more) pieces that are coupled together to form each temperature control housing (e.g., two pieces for the temperature control housing of each chemical delivery system component). Thus, in various embodiments where the temperature control housing for each component of the chemical delivery system 100 includes two pieces therein, each of the two pieces can include a component half-side cavity, where the component half-side cavities of each of the two pieces of the component temperature control housing together form a housing cavity in which the component of the chemical delivery system 100 can be disposed. The half-side cavities included in each of the two pieces do not necessarily constitute half of the resulting component cavity, but constitute at least a portion of the resulting component cavity. For example, each of the two pieces 210A and 210B of the delivery line temperature control housing 210 can include a delivery line half-side cavity that is complementary to the chemical delivery line 110, where the delivery line half-side cavities of each of the two pieces 210A and 210B of the delivery line temperature control housing 210 together form a delivery line housing cavity 212. As another example, each of the two pieces 220A and 220B of the filter temperature control housing 220 can include a filter half-side cavity that is complementary to the filter 120, where the filter half-side cavities of each of the two pieces 220A and 220B of the filter temperature control housing 220 together form a filter housing cavity 222. As another example, each of the two pieces of the accumulator temperature control housing can include an accumulator half-side cavity that is complementary to the accumulator 130, where the filter half-side cavities of each of the two pieces of the accumulator temperature control housing together form an accumulator housing cavity (e.g., a vertical accumulator housing cavity 232 and / or a horizontal accumulator housing cavity 237). As another example, each of the two pieces 240A and 240B of the application line temperature control housing 240 can include an application line half-side cavity that is complementary to the chemical application line 140, where the application line half-side cavities of each of the two pieces 240A and 240B of the application line temperature control housing 240 together form an application line housing cavity 242. As yet another example, each of the two pieces 250A and 250B of the pressure line temperature control housing 250 can include a pressure line half-side cavity that is complementary to the pressure line 150, where the pressure line half-side cavities of each of the two pieces 250A and 250B of the pressure line temperature control housing 250 together form a pressure line housing cavity 252. In various embodiments, each chemical delivery system component housing can include more than two pieces that are coupled together to enclose at least a portion of the respective component.

[0035] In various embodiments, the temperature control housing for the respective components of the chemical delivery system 100 can be in direct contact with at least a portion of the respective components of the chemical delivery system 100. In various embodiments, the temperature control housing for the respective components of the chemical delivery system 100 can minimize direct contact with the respective components of the chemical delivery system 100 such that the respective components of the chemical delivery system 100 float within the temperature control housing cavity. In other words, most of the edges of the temperature control housing cavity for the respective components of the chemical delivery system 100 can be proximate, but not in direct contact with, the components of the chemical delivery system 100 disposed therein (wherein, in this context, “majority” means greater than 50% of the cavity surface area, greater than 70% of the cavity surface area, greater than 90% of the cavity surface area, greater than 95% of the cavity surface area, or greater than 98% of the cavity surface area). The minimal direct contact between the temperature control housing and the respective components of the chemical delivery system 100 disposed within the temperature control housing cavity can avoid a significant temperature difference between the portion of the components of the chemical delivery system 100 that are in direct contact with the temperature control housing and the portion that is separated from the temperature control housing. For example, a portion of the components of the chemical delivery system 100 that are in direct contact with the temperature control housing can result in a hot spot or cold spot at the point of direct contact (depending on whether the temperature control housing is heating or cooling the components of the chemical delivery system 100).

[0036] To achieve minimal direct contact between the edges of the temperature control housing cavity for the respective components of the chemical delivery system 100 and such components, each temperature control housing of the temperature control system 200 can include a retainer that projects into the cavity of the temperature control housing. The retainer can be a projection into the temperature control housing cavity that is configured to directly contact at least a portion of the cross-section (or the outer surface of the cross-section) of the components of the chemical delivery system 100 disposed therein. The surface area of the retainer can be minimized to minimize the amount of direct contact between the temperature control housing and the components of the chemical delivery system 100 disposed therein.

[0037] Each temperature control housing may include one or more fixtures protruding into one or more of the respective temperature control housing cavities, configured to again hold components of the chemical delivery system 100 disposed therein in place with minimal direct contact. For example, the delivery line temperature control housing 210 may include at least one delivery line fixture 214, the filter temperature control housing 220 may include at least one filter fixture 224, the accumulator temperature control housing may include at least one accumulator fixture 239, the application line temperature control housing 240 may include at least one application line fixture 244, and / or the pressure line temperature control housing 250 may include at least one pressure line fixture 254. In various embodiments, other than the (one or more) fixtures included in the respective temperature control housings, no other part of the temperature control housing may directly contact the respective components of the chemical delivery system 100 disposed therein.

[0038] In various embodiments, each temperature control housing of the temperature control system 200 may include one or more temperature adjustment elements (e.g., one or more heaters to increase and / or one or more coolers to decrease the temperature of the temperature control housing and the components of the chemical delivery system 100 disposed therein). For example, the delivery line temperature control housing 210 may include a delivery line housing temperature adjustment element 216, the filter temperature control housing 220 may include a filter housing temperature adjustment element 226, the accumulator temperature control housing may include an accumulator housing temperature adjustment element 236, the application line temperature control housing 240 may include an application line housing temperature adjustment element 246, and / or the pressure line temperature control housing 250 may include a pressure line housing temperature adjustment element 256. The temperature adjustment elements may be coupled to a power source or other source via a coupler 203 to effect heating or cooling.

[0039] The temperature adjustment elements in each temperature control housing of the temperature control system 200 may be coupled to the respective temperature control housing and / or incorporated into the respective temperature control housing in any suitable manner. For example, the temperature adjustment elements may be embedded in the respective temperature control housing such that at least a portion of the temperature adjustment elements is surrounded by the material of the temperature control housing. As another example, the temperature adjustment elements may be coupled to the outer surface of the temperature control housing.

[0040] In various embodiments where one or more of the temperature adjustment elements in each temperature control housing of the temperature control system 200 include heaters, the heaters may be any suitable heater (such as a cartridge heater). In various embodiments where one or more of the temperature adjustment elements in each temperature control housing of the temperature control system 200 include cooling elements, the cooling elements may be any suitable device (such as a cooling coil).

[0041] In various embodiments, each temperature control housing of the temperature control system 200 may include a material (e.g., a conductor) that facilitates heat transfer. For example, the temperature control housing of the temperature control system 200 may include a metallic material (e.g., including aluminum, aluminum alloy, steel, nickel alloy, and / or the like), a ceramic with high thermal conductivity, and / or any other suitable material.

[0042] In various embodiments, one or more of the temperature control housings of the temperature control system 200 may be wrapped with an insulator material such that at least a portion of one or more of the temperature control housings is covered by the insulator. For example, the insulator may include rubber, a polymeric material (e.g., polyether ether ketone), and / or any other suitable material.

[0043] In various embodiments, the temperature control housings of the temperature control system 200 may each include a hole into the body of each temperature control housing in which the thermocouple 211 may be coupled. The thermocouple 211 may be inserted into the hole and may be configured to measure the temperature of the respective temperature control housing. The thermocouple 211 may be coupled to the respective temperature control housing via a tight fit, threading, and / or the like. In various embodiments, the tip of the thermocouple 211 may be spring-loaded with a bias such that in response to being inserted into the hole of the temperature control housing, the tip of the thermocouple 211 may be loaded into the material of the respective temperature control housing for sufficient contact therewith (resulting in a more accurate temperature reading). The thermocouple 211 may include any suitable thermocouple. Exemplary thermocouples suitable for use as the thermocouple 211 are available from OMEGA Engineering.

[0044] Each temperature control housing may include multiple thermocouples 211 such that if one thermocouple 211 fails or malfunctions, another may act as a backup and provide the desired temperature measurement.

[0045] In various embodiments, a controller (an example of the controller 8 in FIG. 1A) in the reactor system 50 may be in electrical communication with one or more other components of the reactor system 50. For example, the controller may be in electrical communication with the thermocouple 211 and / or a temperature adjustment device. In various embodiments, one controller may be in electrical communication with all of the thermocouples 211 and the temperature adjustment devices included in the temperature control system 200. In various embodiments, the controller may be electrically coupled to one or more thermocouples 211 and temperature adjustment devices, and a second controller may be electrically coupled to other thermocouples 211 and temperature adjustment devices.

[0046] The controller can be configured to perform various functions and / or steps as described herein. The controller can include one or more processors, microprocessors, memory elements, and / or switching elements to perform various functions. For example, the controller can be used to control the gas flow through the chemical delivery system 100 (via the mass flow controller 105, the controller can communicate electrically with the mass flow controller), heat or cool one or more of the temperature control enclosures (e.g., by heating or cooling the temperature adjustment device, such as by increasing or decreasing the current to the respective temperature adjustment device), open and close various valves (e.g., the accumulator inlet and outlet valves), and / or the like. In various embodiments, the controller can include a proportional–integral–derivative (PID) controller, which allows for closed-loop control of the heating and / or cooling of the temperature control enclosures and / or portions thereof of the temperature control system 200.

[0047] During operation, with additional reference to method 500 for delivering chemicals to the reaction chamber through the chemical delivery system of FIG. 5, one or more of the temperature control enclosures in the temperature control system 200 can be heated or cooled (step 504) to a desired temperature (e.g., a temperature within a desired temperature range). In various embodiments, the controller of the reactor system 50 can cause the temperature adjustment device to heat or cool one or more of the temperature control enclosures in the temperature control system 200 to achieve the desired temperature. For example, the controller can send more current to the heater to heat the respective temperature control enclosure, can decrease the current to the heater to reduce the heat emitted by the heater, can increase the current to the cooling coil to cool the respective temperature control enclosure, can decrease the current to the cooling coil to cause less cooling of the respective temperature control enclosure, or the like.

[0048] Heating or cooling the temperature control enclosures of the temperature control system 200 can be in response to the controller detecting that the temperature of the respective temperature control enclosure is not within the desired temperature range. For example, the thermocouple 211 coupled to the respective temperature control enclosure can measure the temperature of the temperature control enclosure and transmit the temperature information to the controller. The controller can compare the received temperature information with the desired temperature and / or temperature range for the temperature control enclosure or region of the temperature control system 200 and / or the chemical delivery system 100. In response to the measured temperature being different from the desired temperature and / or outside the desired temperature range, the controller can cause heating or cooling of the respective temperature control enclosure or region of the temperature control system 200 until the desired temperature is achieved.

[0049] Gas can flow from gas source 12 through chemical delivery system 100 (step 502) to reaction chamber 32. One or more temperature control enclosures or zones of heating or cooling temperature control system 200 can occur before, during, and / or after the gas flows through chemical delivery system 100. That is, temperature control system 200 and chemical delivery system 100 and their components or parts can be heated to a certain temperature (e.g., within a temperature range) before the gas starts to flow through chemical delivery system 100 and while the gas is flowing through chemical delivery system 100. This can prevent the flowing chemicals from condensing or depositing within chemical delivery system 100 during the entire duration of gas flow.

[0050] The chemicals flowing through chemical delivery system 100 can be applied into reaction chamber 32 (step 506) for, e.g., deposition on a substrate, cleaning the reaction chamber, etching, or any other desired effect.

[0051] The systems and methods described herein allow for precisely maintaining a desired temperature or temperature range during the entire chemical delivery. Thus, more temperature-sensitive chemicals can be used in gas-phase reactors and methods performed using such reactors (e.g., atomic layer deposition (ALD), chemical vapor deposition (CVD), etc.). The desired temperature or temperature range can be maintained within plus or minus 5 °C, within plus or minus 3 °C, or within plus or minus 1.5 °C. For other applications, maintaining within plus or minus 10 °C or within plus or minus 15 °C can be acceptable. For example, as determined experimentally, a reactor system (such as those discussed herein) includes a chemical delivery system that includes chemical delivery pipelines, filters, accumulators, two chemical application pipelines, pressure pipelines, and pressure transducers; and a temperature control system that includes a delivery pipeline temperature control enclosure, a filter temperature control enclosure, an accumulator temperature control enclosure, an application pipeline temperature control enclosure, and a pressure pipeline temperature control enclosure, each coupled to and enclosing a respective component of the chemical delivery system, where each temperature control enclosure contains aluminum and maintains a target temperature within plus or minus 1.5 °C of 150 °C. The same reactor system with the same chemical delivery system and temperature control system maintains a target temperature within plus or minus 3 °C of 220 °C.

[0052] Although exemplary embodiments of the present disclosure are presented herein, it should be understood that the present disclosure is not limited thereby. For example, although the reactor system is described in connection with various specific configurations, the present disclosure is not necessarily limited to these examples. Various modifications, variations, and enhancements can be made to the systems and methods presented herein without departing from the spirit and scope of the present disclosure.

[0053] The subject matter of this disclosure includes all novel and non-obvious combinations and sub-combinations of the various systems, components, and configurations, as well as other features, functions, actions, and / or properties disclosed herein, and any and all equivalents thereof.

[0054] 1: Gas source 2: Chemical delivery system 4: Temperature control system 6: Reaction chamber 8: Controller 10: Reactor system 12: Gas source 32: Reaction chamber 40: Structural frame 42: Beam 44: Substrate 50: Reactor system 100: Chemical delivery system 105: Mass flow controller 110: Chemical delivery pipeline 120: Filter 130: Accumulator 140: Chemical application pipeline 150: Pressure pipeline 160: Pressure transducer 200: Temperature control system 203: Coupler 210: Transport pipeline temperature control housing 210A: First transport pipeline housing component 210B: Second transport pipeline housing component 211: Thermocouple 212: Transport pipeline housing cavity 214: Transport pipeline holder 216: Transport pipeline housing temperature adjustment element 220: Filter temperature control housing 220A: First filter housing component 220B: Second filter housing component 222: Filter housing cavity 224: Filter holder 226: Filter housing temperature adjustment element 230: Vertical accumulator temperature control housing 230A: First vertical accumulator housing part 230B: Second vertical accumulator housing part 232: Vertical accumulator housing cavity 235: Horizontal accumulator temperature control housing 235A: First half of horizontal accumulator housing 235B: Second half of horizontal accumulator housing 236: Accumulator housing temperature adjustment element 237: Horizontal accumulator housing cavity 239: Accumulator fixator 240: Pipeline temperature control housing 240A: First applied pipeline housing part 240B: Second applied pipeline housing part 242: Applied pipeline housing cavity 244: Applied pipeline fixator 246: Pipeline housing temperature adjustment element 250: Pressure pipeline temperature control housing 250A: First pressure pipeline housing part 250B: Second pressure pipeline housing part 252: Pressure pipeline housing cavity 254: Pressure pipeline fixator 256: Pressure pipeline housing temperature adjustment element 500: Method 502: Step 504: Step 506: Step

Claims

1. A reactor system, comprising: A chemical delivery system includes: a filter temperature control housing configured to enclose a filter of the chemical delivery system; an accumulator temperature control housing configured to enclose an accumulator of the chemical delivery system, wherein the accumulator is located downstream of the filter, wherein the filter is in fluid communication with the accumulator and a mass flow controller, and the filter is disposed between the accumulator and the mass flow controller; an application line temperature control housing configured to enclose a chemical application line of the chemical delivery system, wherein the chemical application line is in fluid communication with the accumulator; and a delivery line temperature control housing configured to enclose a chemical delivery line, the chemical delivery line fluidly coupling the mass flow controller to the filter, wherein: each of the filter temperature control housing, the accumulator temperature control housing, the delivery line temperature control housing, and the application line temperature control housing includes a housing, a housing temperature adjustment element coupled to the housing, and a source for facilitating heating or cooling, and one or more thermoelectric couplings are connected to the housing, and at least one of the following: The filter temperature control housing includes a filter retainer disposed within a portion of a filter housing cavity, the filter retainer being configured to directly contact the filter, and no other part of the filter temperature control housing directly contacts the filter except for the filter retainer; the accumulator temperature control housing includes an accumulator retainer disposed within a portion of an accumulator housing cavity, the accumulator retainer being configured to directly contact the accumulator, and no other part of the accumulator temperature control housing directly contacts the accumulator except for the accumulator retainer; and the application line temperature control housing includes a chemical application line retainer disposed within a portion of a chemical application line housing cavity, the chemical application line retainer being configured to directly contact the chemical application line, and no other part of the application line temperature control housing directly contacts the chemical application line except for the chemical application line retainer; and a controller electrically communicating with the housing temperature adjustment elements of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing, the controller being configured to: The system detects that the temperature of one of the individual temperature control housings is not within the desired temperature range. The individual temperature control housings include one of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing. In response to detecting that the temperature is not within the desired temperature range, the housing temperature adjustment element corresponding to the individual temperature control housing heats or cools the individual temperature control housing to the desired temperature within the desired temperature range.

2. The temperature control system as claimed in claim 1, wherein each of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing includes two parts coupled together, wherein each of the two parts of the filter temperature control housing includes a filter half-side cavity complementary to the filter, wherein the filter half-side cavities of each of the two parts of the filter temperature control housing together form the filter housing cavity, such that the filter can be disposed therein. Each of the two parts of the accumulator temperature control housing includes an accumulator half-side cavity complementary to the accumulator, wherein the accumulator half-side cavities of each of the two parts of the accumulator temperature control housing together form the accumulator housing cavity, allowing the accumulator to be disposed therein, and wherein each of the two parts of the application line temperature control housing includes a chemical application line half-side cavity complementary to the chemical application line, wherein the chemical application line half-side cavities of each of the two parts of the application line temperature control housing together form the chemical application line housing cavity, allowing the chemical application line to be disposed therein.

3. The temperature control system as claimed in claim 2, wherein each of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing includes a hole, the hole including a thermocouple disposed therein.

4. The temperature control system as claimed in claim 2, wherein the accumulator temperature control housing includes a horizontal accumulator temperature control housing and a vertical accumulator temperature control housing, the horizontal temperature control housing and the vertical temperature control housing being configured together to enclose a T-shaped accumulator.

5. The temperature control system as claimed in claim 2, wherein each of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing comprises at least one of a metal and a ceramic material, and the metal comprises at least one of aluminum, steel, and nickel.

6. The temperature control system as claimed in claim 1 further includes a pressure line temperature control housing configured to enclose a pressure line, wherein the pressure line is in fluid communication with the accumulator.

7. A reactor system, comprising: A chemical delivery system includes: a filter; a mass flow controller; a filter temperature control housing coupled to and enclosing the filter, wherein the filter is located downstream of the mass flow controller; a chemical delivery line extending from an outlet of the mass flow controller to an inlet of the filter; a delivery line temperature control housing coupled to and enclosing the chemical delivery line; an accumulator disposed between a pressure transducer and the filter, the accumulator including an inlet valve and an outlet valve; an accumulator temperature control housing coupled to and enclosing the accumulator; a chemical application line in fluid communication with the accumulator and located downstream of the accumulator; and an application line temperature control housing coupled to and enclosing the chemical application line, wherein one of the following is true: the filter temperature control housing includes a filter retainer disposed within a portion of a filter housing cavity that directly contacts the filter, wherein the filter retainer is the only part of the filter temperature control housing that directly contacts the filter. The accumulator temperature control housing includes an accumulator retainer disposed within a portion of an accumulator housing cavity that directly contacts the accumulator, wherein the accumulator retainer is the only portion of the accumulator temperature control housing that directly contacts the accumulator. The application line temperature control housing includes a chemical application line retainer disposed within a portion of a chemical application line housing cavity that directly contacts the chemical application line, wherein the chemical application line retainer is the only portion of the application line temperature control housing that directly contacts the chemical application line. The housing also includes a reaction chamber fluidly coupled to the chemical application line. Furthermore, the housing includes a controller electrically communicating with the mass flow controller and a temperature adjustment element for each of the filter temperature control housing, the accumulator temperature control housing, the delivery line temperature control housing, and the application line temperature control housing. The controller is configured to: allow a chemical to flow from the mass flow controller through the chemical delivery line, the filter, the accumulator, and the chemical application line to the reaction chamber. At least before and during the flow of the chemical, the delivery line temperature control housing is heated or cooled to a first temperature between a sublimation temperature and a degradation temperature of the chemical; at least before and during the flow of the chemical, the filter temperature control housing is heated or cooled to a second temperature between the sublimation temperature and the degradation temperature of the chemical; at least before and during the flow of the chemical, the accumulator temperature control housing is heated or cooled to a third temperature between the sublimation temperature and the degradation temperature of the chemical; and at least before and during the flow of the chemical, the application line temperature control housing is heated or cooled to a fourth temperature between the sublimation temperature and the degradation temperature of the chemical.

8. The chemical delivery system as claimed in claim 7, wherein each of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing comprises two parts coupled together, wherein each of the two parts of the filter temperature control housing includes a filter half-cavity complementary to the filter, wherein the filter half-cavities of each of the two parts of the filter temperature control housing together form the filter housing cavity, wherein the filter is disposed in the filter housing cavity. Each of the two parts of the accumulator temperature control housing includes an accumulator half-side cavity complementary to the accumulator, wherein the accumulator half-side cavities of each of the two parts of the accumulator temperature control housing together form the accumulator housing cavity, wherein the accumulator is disposed in the accumulator housing cavity, and wherein each of the two parts of the application line temperature control housing includes a chemical application line half-side cavity complementary to the chemical application line, wherein the chemical application line half-side cavities of each of the two parts of the application line temperature control housing together form the chemical application line housing cavity, wherein the chemical application line is disposed in the chemical application line cavity.

9. The chemical delivery system as claimed in claim 8 further includes a pressure line and a pressure line temperature control housing, the pressure line being fluidly coupled to and between a pressure transducer and the accumulator, and the pressure line temperature control housing being coupled to and enclosing the pressure line.

10. The chemical delivery system as claimed in claim 8, wherein at least one of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing includes a temperature adjustment device configured to adjust the temperature of at least one of the filter temperature control housing, the accumulator temperature control housing, and the application line temperature control housing, wherein the chemical delivery system further includes a controller electrically communicating with the temperature control device, wherein the controller is configured to adjust the temperature of the temperature adjustment device.

Images