Electronic modules for power terminals, methods for manufacturing electronic modules, and apparatus for manufacturing electronic modules.

Abstract

This invention provides an electronic module that, despite using plate-shaped power terminals, is not prone to resin leakage during the sealing process. The electronic module of the present invention includes: a substrate; electronic components disposed on the substrate; and a flat power terminal erected from the substrate, wherein the substrate, electronic components, and power terminal are sealed by a sealing member, the power terminal is electrically connected to the substrate, and at least its front end protrudes from the sealing member, and has a crushed portion that is recessed from the surface of the sealing member at a position in contact with the surface of the sealing member.

Description

Technical Field

[0001] This invention relates to electronic modules, methods for manufacturing electronic modules, and apparatus for manufacturing electronic modules. Prior Technology

[0002] Previously, electronic modules with pin terminals erected vertically from a substrate and sealed by a sealing member were known (for example, see Patent Document 1).

[0003] In the conventional electronic module 900, as shown in Figure 11, since the pin terminals 972 and 974 protrude from the sealing resin 990, a mold with a pair of sliding portions 922 is used for resin sealing. Specifically, during the manufacturing process of the electronic module, after the pin terminals 972 and 974 are placed in the mold, the pair of sliding portions 922 are slid to clamp the pin terminals 972 and 974, thereby preventing the sealing resin 990 from flowing out to the outside of the pair of sliding portions 922, thus achieving resin sealing. In the conventional electronic module 900, the pin terminals 972 and 974 have recesses 963 corresponding to the front ends of the pair of sliding portions 922.

[0004] [Prior Technology Documents][Patent Document 1] International Publication No. 2020 / 129195

[0005] In recent years, the industry has needed electronic modules for electrical equipment capable of handling high current flows. To address this, plate-shaped power terminals with larger current path cross-sectional areas can be considered instead of pin terminals. However, when using plate-shaped power terminals, the large contact area between the sliding part and the power terminal, as well as the slumped or fractured surfaces formed during the shearing of the plate material, may create gaps between the mold (sliding part) and the power terminal, potentially leading to resin leakage.

[0006] Therefore, the present invention was made in view of the above circumstances, and its object is to provide an electronic module that is not prone to resin leakage during the sealing process, even when using plate-shaped power terminals. Summary of the Invention

[0007] The electronic module of the present invention includes: a substrate; electronic components disposed on the substrate; and a flat plate-shaped power terminal erected from the substrate, wherein the substrate, the electronic components, and the power terminal are sealed by a sealing member, at least the front end of the power terminal protrudes from the sealing member, and has a crushed portion that is recessed from the surface of the sealing member.

[0008] The method for manufacturing an electronic module of the present invention includes: an assembly forming step, wherein a flat power terminal is erected on a substrate on which electronic components are disposed to form an assembly having the substrate, the electronic components and the power terminal; a receiving step, wherein a first portion of the substrate, the electronic components and the power terminal on the substrate side is received in a first mold cavity of a mold, and a second portion of the front end side of the power terminal is received in a power terminal receiving hole extending from the inner surface of the first mold cavity; and a sealing step, wherein the first portion of the substrate, the electronic components and the power terminal is sealed by allowing a sealing member to flow into the first mold cavity, wherein, in the receiving step, after the second portion of the power terminal is inserted into the power terminal receiving hole, the front ends of a pair of sliding portions provided on the mold protrude from the inner periphery of the power terminal receiving hole and the power terminal is clamped by the pair of sliding portions, and a crushing portion is formed by separating the front end portion of the second portion of the power terminal from the first mold cavity and simultaneously biting the front ends of the pair of sliding portions into the outer periphery of the second portion of the power terminal.

[0009] The electronic module manufacturing apparatus of the present invention is used to implement the electronic module manufacturing method of claim 8, comprising: a first mold having the power terminal insertion hole and the pair of sliding portions; and a second mold opposite to the first mold, wherein one side of the power terminal is a collapsed edge surface with a collapsed edge formed at the end, and the other side of the power terminal is a burr surface connected to a fracture surface on the side. When viewed from above, a recess corresponding to the cross-section of the power terminal is formed at the front end of each of the pair of sliding portions, the bottom shape of the recess of the sliding portion that abuts against the collapsed edge surface of the pair of sliding portions corresponds to the shape of the collapsed edge surface, and the bottom shape of the recess of the sliding portion that abuts against the burr surface of the pair of sliding portions is formed such that a protrusion is formed on the two sidewalls of the recess.

[0010] According to the electronic module of the present invention, since the power terminal has a recessed crushed portion at the position where it contacts the surface of the sealing member, it is less likely to generate a gap between the mold (sliding portion) and the power terminal when resin sealing is performed using a mold, thus preventing resin leakage. Therefore, the electronic module of the present invention is designed to prevent resin leakage during the sealing process even when using plate-shaped power terminals.

[0011] Furthermore, according to the manufacturing method and apparatus for the electronic module of the present invention, since the front end portion of the power terminal is separated from the first mold cavity by clamping the power terminal with a pair of sliding portions, and a crushing portion is formed by biting the front ends of the pair of sliding portions into the outer periphery of the second portion of the power terminal, it is not easy to generate a gap between the mold (sliding portion) and the power terminal, thereby preventing resin leakage. Simple Explanation of the Diagram

[0012] Figure 1 is a perspective view of the electronic module 100 according to the embodiment. Figure 1(a) is a perspective view of the electronic module 100, and Figure 1(b) is a front view of the electronic module 100.

[0013] Figure 2 is a diagram of the internal structure of the electronic module 100 according to the embodiment. Figure 2(a) is a front view of the electronic module 100 omitting the sealing member 190. Figure 2(b) is a plan view of the electronic module 100 omitting the sealing member 190. Figure 2(c) is a plan view of the electronic module 100 omitting the sealing member 190 and the first connecting frame 190.

[0014] Figure 3 is a diagram of the power terminal 160 in this embodiment. Figure 3(a) is a front view of the power terminal 160, Figure 3(b) is a plan view of the power terminal 160, Figure 3(c) is an enlarged planar cross-sectional view showing section A1-A1 of Figure 3(a), and Figure 3(d) is a cross-sectional view A2-A2 of Figure 3(a).

[0015] Figure 4 is a diagram illustrating the manufacturing process of the power terminal 160 according to this embodiment. Figures 4(a) to 4(d) are process diagrams.

[0016] Figure 5 is a flowchart illustrating the manufacturing method of the electronic module according to this embodiment.

[0017] Figure 6 is a diagram illustrating the process of housing the constituent element in the mold 1 in the embodiment. Figure 6(a) is a front cross-sectional view of the process of housing the constituent element in the mold 1, and Figure 6(b) is a side cross-sectional view of the constituent element housing in the mold 1.

[0018] Figure 7 is a diagram illustrating the process of clamping the power terminal 160 by a pair of sliding parts 24 in the embodiment. Figure 7(a) is a front cross-sectional view of the process of clamping the power terminal 160 by a pair of sliding parts 24, and Figure 7(b) is a side cross-sectional view of the process of clamping the power terminal 160 by a pair of sliding parts 24.

[0019] Figure 8 is a top view showing the sliding part 24 clamping the power terminal 160 during the receiving process.

[0020] Figure 9 is a top enlarged view of the main part showing the situation where the sliding part 24 clamps the power terminal 160 during the receiving process.

[0021] Figure 10 is a diagram showing the sealing process. Figure 10(a) is a front cross-sectional view showing the sealing process, and Figure 10(b) is a side cross-sectional view showing the sealing process.

[0022] Figure 11 is a cross-sectional view illustrating the resin sealing process in a conventional electronic module. Additionally, symbol 910 represents the substrate, symbol 920 represents electronic components, symbols 932 and 942 represent connecting frames, and symbol 952 represents an internal connecting frame. Implementation

[0023] The electronic module of the present invention will now be described with reference to the embodiments shown in the accompanying drawings. The embodiments described below do not limit the invention of the appended claims. Furthermore, not all elements and combinations thereof described in the embodiments are essential to the solution of the present invention.

[0024] 1. Electronic module 100 of the implementation method.

[0025] First, the electronic module 100 of the embodiment will be described. As shown in Figures 1 and 2, the electronic module 100 of the embodiment includes a substrate 110, electronic components 120A and 120B, a first terminal 130, a second terminal 140, a power terminal 160, a first connection frame 132, a second connection frame 142, an internal connection frame 142, an internal connection frame 152, and pin terminals 172, 174, 182, and 184.

[0026] Furthermore, in the following description, the vertical direction of the electronic module 100 is defined as the front-to-back direction, and the horizontal direction is defined as the left-to-right direction. Additionally, the height direction of the electronic module 100 is defined as the up-down direction. The terms front, back, left, right, up, and down are for ease of explanation, and the installation direction of the electronic module 100 is not restricted when using it.

[0027] As shown in Figure 1, the electronic module 100 of the embodiment is sealed with resin by the sealing member 190, and the front ends of the first terminal 130, the second terminal 140, the power terminal 160, the pin terminals 172, 174, 182, 184 and the substrate 110 (heat dissipation metal plate 113) are exposed from the sealing member 190.

[0028] As shown in Figures 1 and 2, the electronic module 100 of this embodiment constitutes a half-bridge circuit in which electronic components (semiconductor components) 120A and 120B are connected in series. The second terminal 140 is connected to an external high voltage, and the first terminal 130 is connected to a reference potential. The power terminal 160 is a midpoint terminal connected to the midpoint between the source electrode of electronic component 120A and the drain electrode of electronic component 120B. Alternatively, the circuit constituting the electronic module 100 can be a full-bridge circuit or another suitable circuit.

[0029] As shown in Figure 2(a), the substrate 110 is a DCB substrate having an insulating substrate (ceramic substrate) 112, circuit wiring 111 formed on the upper surface of the insulating substrate (ceramic substrate) 112, and a heat dissipation metal plate 113 formed on the lower surface (back side) of the insulating substrate (ceramic substrate) 112. The substrate 110 may also be a suitable substrate such as a printed circuit board.

[0030] Electronic components 120A and 120B are disposed on the wafer pads of circuit wiring 111. Electronic components 120A and 120B are MOSFETs, respectively, with a drain electrode formed on the substrate 110 side and an active electrode and gate electrode formed on the opposite side of the substrate. Furthermore, electronic components 120A and 120B can be other semiconductor components such as IGBTs, tri-terminal thyristors, and diodes, or electronic components other than semiconductor components such as capacitors and inductors. The number of components is not limited to two; it can be one or more.

[0031] In electronic component 120A, the source electrode is connected to the first terminal 130 via an internal connection terminal 134 and a first connection frame 132. Furthermore, wiring or circuit wiring (not shown) is connected to the pin terminal 174, which serves as a sensing terminal, via wiring. The gate electrode is connected to the pin terminal 172 via a connection terminal 176 and circuit wiring. The drain electrode (not shown) is connected to the power terminal 160 via circuit wiring 111, and the power terminal 160 is electrically connected to the internal connection frame 152. Additionally, in the example of FIG1, the internal connection terminal 134 has a circular cross-section.

[0032] In electronic component 120B, the source electrode is connected to the internal connection frame 152 via internal connection terminal 154, and the internal connection frame 152 is connected to the power terminal 160. It is also connected to the pin terminal 184, which serves as a sensing terminal, via wires or wiring (not shown). The gate electrode is connected to the pin terminal 182 via connection terminal 186 and wiring. The drain electrode (not shown) is electrically connected to the second terminal 140 via wiring 111, connection member 178, and the second connection frame 142. Additionally, in the example of FIG1, the internal connection terminal 154 has a circular cross-section, and the connection member 178 has a rectangular cross-section.

[0033] As shown in Figures 1 and 2, the first terminal 130 is arranged at the front of the electronic module 100 in the front-rear direction. The first terminal 130 is made of a plate-shaped member of a conductive flat material, such as a copper plate. The first terminal 130 has a through hole 131 extending through the first terminal 130 in the vertical direction. When viewed in the vertical direction, the through hole 131 is, for example, circular in shape.

[0034] The first connecting frame 132 is electrically connected to the first terminal 130. The first connecting frame 132 is embedded inside the sealing member 190. In the electronic module 100, the first connecting frame 132 is integrally formed from the same plate material as the first terminal 130.

[0035] The first connecting frame 132 has a through hole (notation omitted) extending through the first connecting frame 132 in the vertical direction. When viewed vertically, the through hole is circular in shape. The upper end of the internal connecting terminal 134 is fitted into the through hole. The internal connecting terminal 134 is fixed to the first connecting frame 132, for example, by pressing, and connects the first connecting frame 132 and the source electrode of the electronic component 120A.

[0036] The second terminal 140 is disposed at the rear of the electronic module 100 in the front-rear direction. The second terminal 140 is a plate-shaped member made of a conductive flat material, such as a copper plate. The second terminal 140 has a through hole 141 that extends through the second terminal 140 in the vertical direction. The through hole 141 is, for example, circular in shape when viewed in the vertical direction.

[0037] The second connecting frame 142 (internal connecting frame) is electrically connected to the second terminal 140. The second connecting frame 142 is embedded inside the sealing member 190. In the electronic module 100, the second connecting frame 142 is integrally formed from the same plate as the second terminal 140.

[0038] The internal connecting frame 152 is a plate-shaped member having a through hole (omitted) extending vertically through the internal connecting frame 152 and an elongated hole 156 (see Figure 2(b)). It supports the power terminal 160 and electrically connects the electronic components 120A and 120B to the power terminal 160. The internal connecting frame 152 is configured on the same plane as the first connecting frame 132 and the second connecting frame 142.

[0039] When viewed from above, the through hole is circular in shape and fits the upper end of the internal connection terminal 154. The internal connection frame 152 and the source electrode of the electronic component 120A are connected through the internal connection terminal 154. The elongated hole 156 extends in the front-back direction, and the first part of the power terminal 160 (refer to symbol 166 in Figure 3 described later) is pressed into it.

[0040] As shown in Figures 1 to 3, the power terminal 160 is a flat plate-shaped component erected vertically from the substrate 110, arranged with the left-right direction as the thickness direction and the vertical direction as the length direction. As shown in Figure 3, the power terminal 160 has: a first portion 166 located on the substrate side closer to the internal connecting frame 152, which is pressed into the elongated hole 156; and a second portion 164 located on the side of the internal connecting frame 152 opposite to the substrate 110 side, which is formed to be wider than the first portion 166.

[0041] The front end of the first portion 166 on the substrate side is electrically connected to the substrate 110, forming part of the circuit wiring connecting electronic component 120A and electronic component 120B. The first portion 166 is sealed by the sealing member 190. Alternatively, the power terminal 160 and the substrate 110 may not be directly electrically connected.

[0042] The second part 164 is connected to the first part 166 and has a connecting part 164a whose width (width in the front-back direction) gradually increases as it moves away from the first part 166 when viewed from the left-right direction, and an exposed part 164b (front end) that is connected to the connecting part 164a and extends upward in a generally rectangular shape.

[0043] The connecting portion 164a has a support portion 167 that supports the power terminal 160 by engaging with the internal connecting frame 152, and a protrusion 162 that protrudes from one side and the other side of the power terminal 160 and whose lower surface engages with the internal connecting frame 152. The connecting portion 164a is sealed by the sealing member 190.

[0044] The exposed portion 164b has a recessed portion 163 at the opening 161 formed in the central portion and at the position where it contacts the surface of the sealing member 190 (the connection portion with the connecting portion 164a). The exposed portion 164b protrudes from the sealing member 190. The recessed portion 163 is formed to surround the power terminal 160.

[0045] The power terminal 160 is formed by shearing a conductive flat material, such as a metal plate. As shown in FIG3(c), one side 165a of the power terminal 160 is a collapsed edge surface with a collapsed edge 168a formed at the end, and the other side 165b of the power terminal 160 is a burred surface connected to the fracture surface 168b on the side. In the crushed portion 163, the end of the other side 165b of the power terminal 160 is recessed compared to other portions of the other side 165b of the power terminal 160 (see FIG3(d)).

[0046] The sealing member 190 seals electronic components 120A and 120B, the lower surface of the first terminal 130, the lower surface of the second terminal 140, the first connecting frame 132, the second connecting frame 142, and the power terminal 160 (the connection portion 164a between the first part 166 and the second part). The sealing member 190 is made of a thermosetting molding material with epoxy resin as the main component and silicon dioxide filler added, protecting the electronic components 120 from the effects of heat, light, humidity, and other environmental factors.

[0047] The sealing member 190 has a base cover portion 192 that covers the base of the portion of the power terminal 160 that protrudes from the sealing member 190 (the base of the portion of the power terminal 190 that protrudes from the surface of the sealing member 190 at a height position other than the base cover portion 192) (see FIG. 1). Furthermore, it also has a pin terminal base cover portion 193 that covers the base of the portion of the pin terminals 172, 174 or 182, 184 that protrudes from the sealing member 190 (the base of the pin terminals 172, 174 or 182, 184 that protrudes from the base of the pin terminals of the sealing member 190). The base cover portion 192 and the pin terminal base cover portion 193 are formed to protrude beyond the other portions of the sealing member 190. In addition, the pin terminal base cover 193 covers the base of two pin terminals, but it can also cover them one by one or all four at once.

[0048] Next, the horizontal cross-sectional structure of the power terminal 160 and the cross-sectional structure of the crushing part 163 will be described with reference to Figures 3 and 4.

[0049] The power terminal 160 is manufactured by stamping a conductive plate (e.g., a metal plate). Specifically, as shown in FIG4(a), a metal plate 160' is placed on a die 210 with an opening, and stamped thereon by a punch 200. At this time, tensile stress is generated in the portion of the metal plate 160' near the cutting edge of the punch 200 and the die 210, resulting in a collapsed edge 168a on the surface (see FIG4(c)). When the load on the punch 200 increases further, the metal plate 160' breaks, thereby forming a fracture surface 168b. As the load increases further, the metal plate 160' and the power terminal 160 separate (see FIG4(c)), and the power terminal 160 can be manufactured (see FIG4(d)). At this time, burrs may sometimes form above the sheared surface, but these burrs are removed by grinding. Thus, the power terminal 160 is formed.

[0050] As described above, since the power terminal 160 is manufactured by shearing a metal plate, it has burr and burr surfaces. One surface 165a of the power terminal 160 is a burr surface, and the other surface 165b of the power terminal 160 is a burr surface.

[0051] As shown in Figure 3(c), one surface 165a of the power terminal 160 is a collapsed edge surface with a smooth R-shaped or beveled edge 168a formed at the end. The other surface 165b of the power terminal 160 is a burr surface connected to the fracture surface 168b on the side. On the other hand, the end of 165b is relatively flat. The fracture surface 168b is formed on the side of the power terminal 160 and is a beveled surface that is recessed from the side of the collapsed edge 168a on the burr surface side.

[0052] The crushing portion 163 is formed to surround the power terminal 160. In the crushing portion 163, one surface 165a of the power terminal 160 is shaped to directly crush the collapsed edge surface of the other parts.

[0053] Another surface 165b of the power terminal 160 has a recess 168c whose end is recessed compared to other parts of the other surface of the power terminal 160. In addition, an escape portion 169 is formed on the side of the power terminal 160, which, when the crushed portion 163 of the power terminal 160 is formed (when the power terminal 160 is clamped by a pair of sliding portions 24 in the sealing process described later), the crushed material is squeezed out to the side.

[0054] 2. Manufacturing method and manufacturing apparatus 1 (mold) for the electronic module according to the embodiment.

[0055] Next, the manufacturing method of the electronic module according to the embodiment will be described. As shown in FIG5, the manufacturing method of the electronic module of this embodiment includes, in sequence, an assembly forming process, a housing process, and a sealing process.

[0056] (Assembly formation process)

[0057] First, a power terminal 160, which is formed into a flat plate shape, is erected on a substrate 110 on which electronic components 120A and 120B are disposed, thereby forming an assembly having a substrate 110, electronic components 120A and 120B, a first terminal 130, a second terminal 140, a first connecting frame 132, a second connecting frame 142, an internal connecting frame 152, and a power terminal 160.

[0058] Specifically, electronic components 120A and 120B are disposed on the circuit wiring 111 of the substrate 110 via a conductive bonding material (e.g., solder). Next, a lead frame (not shown) is prepared to surround the first terminal 130, the second terminal 140, the first connecting frame 132, the second connecting frame 142, and the internal connecting frame 152, and is disposed above the circuit wiring 111. Furthermore, the through-holes in the first connecting frame 132 and the internal connecting frame 152 are positioned on the electrodes (source electrodes) of the electronic components 120A and 120B, respectively.

[0059] Next, the first portion 166 of the power terminal 160 is inserted into the elongated hole 156 of the lead frame (internal connection frame), the internal connection terminals 134 and 154 are inserted into the through hole, and the pin terminals 172, 174, 182, and 184 are respectively inserted into the designated portions of the lead frame, so that the power terminal 160 and each pin terminal abut against the substrate 110, and the internal connection terminals 134 and 154 abut against the source electrodes of the electronic components 120A and 120B. Alternatively, the power terminal 160, the internal connection terminals 134 and 154, and each pin terminal can be pre-inserted into the lead frame and arranged on the substrate 110 and the electronic components 120A and 120B according to each lead frame.

[0060] Next, electrical connections are achieved by appropriately bonding the substrate 110, electronic components 120A and 120B, first terminal 130, second terminal 140, first connecting frame 132, second connecting frame 142, internal connecting frame 152, and power terminal 160. As a method of electrical bonding, for example, a conductive bonding material (solder) can be pre-placed at the connection points, causing the components to abut against each other, and then bonding is achieved by melting the conductive bonding material using reflow or similar methods.

[0061] (Structure of mold 1)

[0062] Before describing the housing process, we will first describe the mold 1 of the manufacturing apparatus for the electronic module, which is an embodiment of the housing assembly. As shown in FIG6, the mold 1 has a first mold 10, a second mold 20 opposite to the first mold 10, and a drive member 30, and is capable of moving in the vertical direction.

[0063] The first mold 10 has a first recess 11 formed on the opposing surface opposite to the second mold 20 and a mounting portion for a frame portion (not shown) on which a lead frame is mounted.

[0064] The second mold 20 has a second recess 21 formed on the surface opposite to the first mold 10, a power terminal receiving hole 22 extending upward from the second recess 21, and a pin terminal receiving hole 23. Sliding portions 24 (24A~24D) are provided inside the power terminal receiving hole 22 and the pin terminal receiving hole 23. By moving the second mold 20 toward the first mold 10, the first mold 10 is aligned with the second mold 20, and a first mold cavity C1 is formed by the first recess 11 and the second recess 21.

[0065] A pair of sliding portions 24 are provided inside the power terminal receiving hole 22 and the pin terminal receiving hole 23. By sliding horizontally, the front ends of the pair of sliding portions 24 protrude from the inner periphery of the power terminal receiving hole 22, thereby enabling the power terminal 160 and each pin terminal housed in the power terminal receiving hole 22 and the pin terminal receiving hole 23 to be clamped by the pair of sliding portions 24. This allows the front ends 28 of each of the power terminal receiving hole 22 and the pin terminal receiving hole 23 to be isolated from the first mold cavity C1 on the substrate side. The front ends of the pair of sliding members 24 are formed into a tapered shape.

[0066] As shown in Figure 9, when viewed from above, recesses 25A and 25B corresponding to the cross-section of the power terminal 160 are formed on the front end portions 28 of a pair of sliding portions 24A and 24B, respectively. The shape of the bottom of the recess 25B of the sliding portion 24B that abuts against the power terminal 165A (collapsed edge surface) corresponds to the shape of the collapsed edge surface. The shape of the bottom of the recess 25A of the sliding portion 24A that contacts the power terminal 165B (burred surface) is formed such that protrusions 26 are formed on the two sidewalls of the recess 25B. In addition, a cutout 29 for forming an escape portion 169 (see Figure 4) is provided on the shoulder portion of at least one of the recesses 25A and 25B.

[0067] The drive member 30 has a main body 31 and a pressing part 32. The main body 31 is disposed on the second mold 20 (on the side opposite to the first mold 10) and is configured to move in the vertical direction. The pressing part 32 abuts against the inclined surface 27 on the base end side of the sliding part 24. When the main body 31 of the drive member 30 approaches the second mold 20, the pressing part 32 pushes the inclined surface 27 on the base end side (opposite to the front end side of the power terminal) of the sliding part 24, thereby causing the pair of sliding parts 24 to slide toward the power terminal 160. In addition, by pulling out the separation pin (not shown), the pressing part 32 (drive member 30) moves upward toward the inclined surface 27 on the base end side, and causes the pair of sliding parts 24 to slide in a direction of separation from each other.

[0068] (Containment process)

[0069] Next, the housing process will be described. As shown in FIG6, in the housing process, the substrate 110, electronic components 120A, 120B and the first portion 166 of the power terminal 160 on the substrate side are housed in the first cavity C1 of the mold 1, and the second portion 164 (more precisely, the exposed portion 164b) on the front end side of the power terminal 160 is housed in the power terminal housing hole 22 of the mold 1 that extends from the inner surface of the first cavity C1.

[0070] Specifically, firstly, the frame portion (not shown) of the lead frame is placed on the opposite side of the first mold 10, and the assembly is placed in the first recess 11 of the first mold 10. At this time, the heat dissipation metal plate 113 of the substrate 110 is arranged in contact with the first recess 11. Next, as shown in FIG6, the second mold 20 is superimposed on the first mold 10. In this state, a first mold cavity C1 is formed by the first recess 11 of the first mold 10 and the second recess 21 of the second mold 20. The first mold cavity C1 houses the substrate 110, electronic components 120A and 120B, first terminal 130, second terminal 140, first connecting frame 132, second connecting frame 142, internal connecting frame 152, and the first portion 166 of the power terminal 160. In addition, the upper part (exposed part 164b) of the second portion 164 of the power terminal 160 is housed in the power terminal receiving hole 22 of the second mold 20 extending from the inner surface of the first mold cavity C1, and the upper parts of the pin terminals 172, 174, 182, and 184 are housed in the pin terminal receiving hole 23 of the second mold 20 extending from the inner surface of the first mold cavity C1.

[0071] During the receiving process, after the power terminal 160 and each pin terminal are received in the power terminal receiving hole 22 and the pin terminal receiving hole 23, a pair of sliding portions 24 slide (protrude) from the inner periphery of the power terminal receiving hole 22 and each pin terminal receiving hole 23 to clamp the second portion 164 of the power terminal 160 and each pin terminal (see Figure 7). The position where the sliding portions 24 clamp the power terminal 160 is a position in the second portion 164 that is a predetermined length away from the internal connecting frame 152.

[0072] When the sliding part 24 clamps the power terminal 160, the main body 31 of the drive member 30 is moved toward the second mold 20 (see Figures 7 and 8). As a result, the pressing part 32 presses against the inclined surface 27 on the base end side of the pair of sliding parts 24, so the sliding parts 24 slide simultaneously, enabling the power terminal 160 to be clamped at the same time. Similarly, each pin terminal can be clamped simultaneously by the pair of sliding parts 24.

[0073] At this time, the front ends of a pair of sliding portions 24 (sliding portions 24A, 24B) bite into the outer periphery of the power terminal 160, thereby forming a crushing portion 163. Furthermore, with the power terminal 160 clamped by the pair of sliding portions 24, a second mold cavity C2 is formed in the space associated with the first mold cavity C1 (see Figure 7), surrounded by the inner periphery of the power terminal receiving hole 22 and the sliding portions 24. Additionally, the space covering the exposed portion 166a of the power terminal 160 is isolated from the second mold cavity C2 by the sliding portions 24.

[0074] Similarly, regarding the pin terminals, the front ends of a pair of sliding portions 24 (sliding portions 24C, 24D) bite into the outer periphery of each pin terminal, forming a recess (the structure of the recess is shown in reference numeral 963 in Figure 11). With the pin terminals held by the pair of sliding portions 24 (sliding portions 24C, 24D), a third mold cavity C3 is formed in the space associated with the first mold cavity C1, surrounded by the inner periphery of the pin terminal receiving hole 23 and the sliding portions 24. In addition, the space covering the front ends of each pin terminal is isolated from the third mold cavity C3 by the sliding portions 24.

[0075] (Sealing process)

[0076] Next, by allowing the sealing member 190 (resin) to flow into the first mold cavity C1, the substrate 110, electronic component 120, and the first portion 166 of the power terminal 160 are sealed with the sealing member 190 (see Figure 10). In addition, the sealing member 190 (resin) flows from the first mold cavity C1 into the second mold cavity C2 to form the base cover portion 192, and the resin of the sealing member 190 (resin) also flows into the third mold cavity C3 to form the pin terminal base cover portion 193.

[0077] After the resin constituting the sealing member 190 (including the base cover portion 192 and the pin terminal base cover portion 193) has cured, the electronic module 100 is removed from the mold 1. Then, the frame portion of the lead frame (not shown) is separated. This is how the electronic module 100 can be manufactured.

[0078] 3. Effects of the electronic module 100, the manufacturing method of the electronic module, and the manufacturing apparatus 1 of the embodiment.

[0079] According to the embodiment of the electronic module 100, since the power terminal 160 has a recessed crush portion 163 at the position where it contacts the surface of the sealing member 190, it is less likely to generate a gap between the mold 1 (sliding portion 24) and the power terminal 160 when sealing with the mold 1, thus preventing resin leakage. Therefore, the electronic module 100 of this embodiment is an electronic module that is less prone to resin leakage during the sealing process despite the use of a plate-shaped power terminal 160.

[0080] Furthermore, according to the embodiment of the electronic module 100 and the manufacturing method of the electronic module, since it is a flat plate-shaped component with an elongated hole 156 (see Figure 2(b)) and an internal connecting frame 152 that supports power terminals and electrically connects electronic components 120A, 120B to power terminals 160, the plate-shaped power terminals 160 can be stably supported. In addition, since circuit wiring can be formed by the internal connecting frame 152 and the power terminals 160, the area of ​​wiring on the substrate can be reduced, enabling miniaturization of the electronic module. Furthermore, since circuit wiring can be formed in three-dimensional space, it becomes an electronic module with a high degree of design freedom.

[0081] Furthermore, in the electronic module 100 according to the embodiment, since the first portion 166 of the internal connection frame 152 located on the substrate side is pressed into the elongated hole 156 in the power terminal 160, the power terminal 160 can be stably supported, and the fit between the internal connection frame 152 and the power terminal 160 can be improved. Also, since the second portion 164 located on the opposite side of the internal connection frame 152 on the substrate side is formed to be wider than the first portion 166, the cross-sectional area of ​​the current path is increased, making it easier for large currents to flow.

[0082] Furthermore, according to the electronic module 100 of the embodiment, since the end of the other side 165b (burred side) of the power terminal 160 in the crushed portion 163 is recessed than other parts of the other side 165b of the power terminal 160, the sliding portion 24 can be engaged with the other side 165b of the power terminal 160 during the sealing process, reliably preventing resin leakage from the fracture surface or the like. In addition, even if it is desired to remove the burrs near the fracture surface (the portion that is retracted to the inside of the end of the burred side) by crushing the entire burred side, the crushed portion will not adhere to the burr, but because the end of the other side 165b (burred side) of the power terminal 160 is more recessed than other parts of the other side 165b of the power terminal 160, the burr can be filled.

[0083] Furthermore, in the electronic module 100 according to the embodiment, since the crushing portion 163 is formed to surround the power terminal 160, the sliding portion 24 bites into the plate-shaped power terminal 160 as a whole during the sealing process, thereby more reliably preventing resin leakage.

[0084] Furthermore, in the electronic module 100 according to the embodiment, since an escape portion 169 protruding outward is formed on the side of the power terminal 160 in the crushing portion 163, during the receiving process, the material of the plate crushed by the sliding portion 24 is crushed to the escape portion 169, thereby preventing the material from being squeezed out to an unexpected location and deforming the power terminal 160, and preventing the formation of a gap between the sliding portion 24 and the power terminal 160 and resin leakage.

[0085] Furthermore, according to the embodiment of the electronic module 100, since the sealing member 190 has a base cover portion 192 that covers the base of the portion of the power terminal 160 protruding from the sealing member 190, the surface distance from the exposed portion of the sealing member 190, such as the pin terminal 172 adjacent to the power terminal 160, can be extended, thereby reducing malfunctions. Additionally, it can protect the portion of the power terminal 160 exposed from the sealing member 190 that is not impact-resistant, making it a highly impact-resistant electronic module.

[0086] Furthermore, according to the electronic module 100 of this embodiment, since it has pin-shaped pin terminals 172 and the like erected vertically from the substrate 110, and the sealing member 190 has a pin terminal base cover portion 193 covering the base of the portion of the pin terminals 172 and the like protruding from the sealing member 190, the surface distance of the portions of the power terminals 160 and other pin terminals adjacent to the pin terminals 172 that are exposed from the sealing member 190 can be extended, reducing malfunctions. In addition, it can protect the impact-resistant portions of the pin terminals 172 and the like that exposed from the sealing member 190, thus making it an electronic module with high impact resistance.

[0087] According to the manufacturing method of the electronic module according to the embodiment, since the front end portion of the power terminal 160 is separated from the first mold cavity C1 by clamping the power terminal 160 by a pair of sliding portions 24, and when the power terminal 160 is clamped by a pair of sliding portions 24, the front ends of a pair of sliding portions 24A, 24B protruding from the inner periphery of the power terminal receiving hole 22 bite into the outer periphery of the second part 164 of the power terminal 160 to form a crushing portion 163, it is not easy for a gap to be generated between the mold 1 (sliding portion 24) and the power terminal 160, and resin leakage can be prevented.

[0088] Furthermore, according to the manufacturing method of the electronic module in the embodiment, since the front ends of both sliding portions 24 are formed into a tapered shape, during the sealing process, when clamping the power terminal 160, it is easy to form a crushing portion 163 on the power terminal 160, causing the sliding portion 24 to bite into the power terminal 160. In this way, it is less likely for a gap to be generated between the power terminal 160 and the sliding portion 24.

[0089] Furthermore, according to the manufacturing method and apparatus for the electronic module of the embodiment, since in the housing process, the pair of sliding portions 24 of the mold 1 have recesses 25A and 25B at their front ends that correspond to the cross-section of the power terminal 160 when viewed from above, the shape of the bottom of the recess 25A of the sliding portion 24A that abuts against a surface (collapsed edge surface) 165a corresponds to the shape of the surface (collapsed edge surface) 165a, and the recess 25B of the sliding portion 24B that abuts against the burr surface is formed such that protrusions 26 are formed on both sides of the recess 25B, it is possible to form crushed portions 163 that correspond to the different collapsed edge surface and burr surface, thereby more reliably preventing resin leakage.

[0090] Furthermore, according to the manufacturing method of the electronic module according to the embodiment, since a cutout 29 is provided in the shoulder portion of the recess 25A, 25B of at least one of the pair of sliding portions 24 (sliding portions 24B), when the power terminal 160 is clamped by the sliding portion 24 and a crushing portion is formed in the receiving process, the material of the power terminal 160 can move to the portion of the cutout 29, thereby forming an escape portion 169.

[0091] The present invention has been described above based on the embodiments described above, but the present invention is not limited to the embodiments described above. It can be implemented in various ways without departing from the concept, for example, the following modifications can be made.

[0092] (1) The positions, connections, numbers, etc. described in the above embodiments (including various modifications, the same below) are illustrative and can be changed within the scope of not impairing the effect of the present invention.

[0093] (2) In the above embodiments, the present invention is applied to electronic modules that use pin terminals, but the present invention is not limited thereto. The present invention can also be applied to electronic modules that do not use pin terminals.

[0094] (3) In the above embodiment, the present invention is applied as a power terminal to a terminal that serves as a midpoint terminal, but the present invention is not limited thereto. The present invention may also be applied to terminals other than the midpoint terminal (e.g., the first terminal and the second terminal).

[0095] (4) In the above embodiments, the present invention is applied to electronic modules that do not have an internal connection frame, but the present invention is not limited thereto. The present invention can also be applied to electronic modules that do not have an internal connection frame.

[0096] (5) In the above embodiment, the first mold is used as the upper mold and the second mold as the lower mold, but the present invention is not limited thereto. Alternatively, the first mold may be used as the lower mold and the second mold as the upper mold. In this case, with the power terminals and pin terminals of the constituent elements inserted into the power terminal receiving holes 22 and pin terminal receiving holes 23 of the second mold, the lead frame is arranged on the opposite surface of the second mold. Furthermore, the drive member is also positioned below the second mold, and by moving the pressing part upwards, a pair of sliding parts move in the horizontal direction.

[0097] 1: Manufacturing equipment (mold) 22: Power terminal receiving hole 24, 24a, 24B, 24C, 24D: Sliding parts 25A, 25B: concave part 26:convex part 29: Incision 100: Electronic Module 110, 120A, 120B: Electronic components 152: Internal Connection Framework 153: Long hole 160: Power terminal 163: Crushing Zone 165A: One side 165b: Another side 168a: Collapsed edge 168b: Fracture surface 168: Depression 169: Escape Department 170: Sealing component 172, 174, 182, 184: Pin terminals 190: Sealing component 192: Base Covering 193: Pin terminal base cover C1: First mold cavity.

Claims

1. An electronic module for power terminals, comprising: substrate; Electronic components disposed on the substrate; And a flat power terminal erected from the substrate, wherein the substrate, the electronic component, and the power terminal are sealed by a sealing member, at least the front end of the power terminal protrudes from the sealing member, and has a crushed portion that is recessed from the surface of the sealing member than other portions.

2. The electronic module of the power terminal according to claim 1 further includes: An internal connection frame, which is a flat plate-shaped component with an elongated hole, supports the power terminal and electrically connects the electronic component to the power terminal. The sealing component seals the substrate, the electronic component, the internal connection frame, and the power terminal. In the power terminal, a first portion of the internal connection frame located on the substrate side is pressed into the elongated hole, and a second portion of the internal connection frame located on the opposite side of the substrate side is formed to be wider than the first portion.

3. The electronic module with power terminals according to claim 1 or 2, wherein: One side of the power terminal is a collapsed edge surface with a collapsed edge formed at the end, and the other side of the power terminal is a burr surface connected to the fracture surface on the side. In the crushed portion, the end of the other side of the power terminal is recessed compared to other parts of the other side of the power terminal.

4. The electronic module with power terminals according to claim 1 or 2, wherein: The crushing portion is formed to surround the power terminal.

5. The electronic module with power terminals according to claim 1 or 2, wherein: An escape portion protruding outward is formed on the side of the power terminal at the crushed portion.

6. The electronic module with power terminals according to claim 1 or 2, wherein: The sealing member has a base cover that covers the base of the portion of the power terminal protruding from the sealing member.

7. The electronic module of the power terminal according to claim 1 or 2, further comprising: A pin-shaped pin terminal is erected from the substrate and at least its front end protrudes from the sealing member, wherein the sealing member has a pin terminal base cover that covers the base of the portion of the pin terminal protruding from the sealing member.

8. A method for manufacturing an electronic module with power terminals, comprising: In the assembly forming process, a flat power terminal is erected on a substrate on which electronic components are disposed, forming an assembly having the substrate, the electronic components, and the power terminal; in the receiving process, the first portion of the substrate side of the substrate, the electronic components, and the power terminal is received in the first cavity of a mold, and the second portion of the front end side of the power terminal is received in a power terminal receiving hole extending from the inner surface of the first cavity. The sealing process involves sealing the substrate, the electronic component, and the first portion of the power terminal by allowing a sealing member to flow into the first mold cavity. In the receiving process, after the second portion of the power terminal is inserted into the power terminal receiving hole, the front ends of a pair of sliding portions provided on the mold protrude from the inner periphery of the power terminal receiving hole and the power terminal is clamped by the pair of sliding portions. At the same time, the front ends of the pair of sliding portions bite into the outer periphery of the second portion of the power terminal while the front end of the second portion of the power terminal separates from the first mold cavity, thereby forming a crushing portion.

9. A method for manufacturing an electronic module with power terminals according to claim 8, wherein: The front ends of both of the pair of sliding parts are formed into a shape that tapers at the front end.

10. A method for manufacturing an electronic module with power terminals according to claim 8 or 9, wherein: One side of the power terminal is a collapsed edge surface with a collapsed edge formed at the end, and the other side of the power terminal is a burr surface connected to the fracture surface on the side. In the receiving process, when viewed from above, the front ends of the pair of sliding parts of the mold are respectively formed with recesses corresponding to the cross-section of the power terminal. The shape of the bottom of the recess of the sliding part that abuts against the collapsed edge surface in the pair of sliding parts corresponds to the shape of the collapsed edge surface. The shape of the bottom of the recess of the sliding part that abuts against the burr surface in the pair of sliding parts is formed such that protrusions are formed on the two sidewalls of the recess.

11. A method for manufacturing an electronic module with power terminals according to claim 8 or 9, wherein: A cutout is provided in the shoulder portion of the recess of at least one of the pair of sliding portions.

12. A method for manufacturing an electronic module with power terminals according to claim 8 or 9, wherein: In the assembly forming process, the internal connecting frame is assembled together with the power terminal. The internal connecting frame is a flat plate-shaped component with an elongated hole that supports the power terminal and electrically connects the electronic component to the power terminal. The power terminal is supported and the electronic component is electrically connected to the power terminal by pressing the first portion of the power terminal into the elongated hole. In the sealing process, the substrate, the electronic component, the internal connecting frame, and the power terminal are sealed with a sealing member. The second portion of the power terminal is formed to be wider than the first portion.

13. An apparatus for manufacturing an electronic module with power terminals, used to implement the method for manufacturing the electronic module described in claim 8, comprising: The first mold includes the power terminal insertion hole and the pair of sliding portions; And a second mold, opposite to the first mold, wherein one side of the power terminal is a collapsed edge surface with a collapsed edge formed at the end, and the other side of the power terminal is a burr surface connected to the fracture surface of the side. When viewed from above, a recess corresponding to the cross-section of the power terminal is formed at the front end of each of the pair of sliding parts. The shape of the bottom of the recess of the sliding part that abuts against the collapsed edge surface in the pair of sliding parts corresponds to the shape of the collapsed edge surface. The shape of the bottom of the recess of the sliding part that abuts against the burr surface in the pair of sliding parts is formed such that a protrusion is formed on the two sidewalls of the recess.

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