Transfer chamber, method of moving substrates, semiconductor processing system, and electronic device processing system

Abstract

This document discloses a system and method for a transfer chamber in an electronic device processing system. The transfer chamber may include a first magnetically levitated track oriented upwards and a second magnetically levitated track spaced apart from the first magnetically levitated track and oriented downwards. The system may include substrate carriers that move along the first and second magnetically levitated tracks, each substrate carrier including a magnet interacting with a first magnetic field on its bottom portion and a second magnet interacting with a second magnetic field on its top portion. The system may also include at least one lifting pin assembly for vertically moving the substrate carrier between the first and second magnetically levitated tracks.

Description

Substrate conveying system and method of using the same This disclosure generally relates to the field of robotic and substrate transfer systems for transferring substrates between chambers in an isolated environment. Substrates may be transferred using a magnetically levitated platform within a transfer enclosure. Methods for using the magnetically levitated platform within a transfer chamber are also disclosed. Semiconductor devices are produced using numerous processing steps on semiconductor substrates within multiple processing chambers. Each processing chamber is used to complete one or more of the various steps (e.g., etching, polishing, deposition) to form the semiconductor device. A substrate transfer system is used to move the substrate between the processing chambers. The processing chambers and substrate transfer system can each be maintained under vacuum. One arrangement for the substrate transfer system is a linear arrangement, in which the processing chambers are arranged in rows along the sides of a linear (rectangular) chamber. Substrate transport systems using a linear arrangement typically include a conveyor belt having a rectangular top surface with processing chambers on one or opposite sides of the conveyor belt. The conveyor belt may be connected to a load lock to maintain a vacuum environment within the substrate transport system as substrates are supplied to and removed from the substrate transport system. One or more robotic arms may be positioned proximate to the processing chambers to transfer substrates between the conveyor belt and the processing chambers. Conventional substrate carriers are typically limited to moving substrates in only one direction. Therefore, the motion options for moving substrates between processing chambers and in and out of the load lock may be limited. In addition, conventional substrate carriers may have a large footprint and internal space to accommodate one track for movement in a first direction and a second track that is horizontally offset for movement in a relative second direction. According to various embodiments, a transfer chamber for an electronic device processing system is disclosed herein, comprising a first magnetic levitation track disposed at a first height within the transfer chamber, wherein the first magnetic levitation track has an upward-facing orientation and is configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed at a second height within the transfer chamber, wherein the second magnetic levitation track has a downward-facing orientation and is configured to generate a second magnetic field below the first magnetic levitation track; a plurality of substrate carriers configured to move along the first and second magnetic levitation tracks, wherein each of the plurality of substrate carriers includes a first magnet on a top portion of the substrate carrier to interact with the first magnetic field and a second magnet on a top portion of the substrate carrier to interact with the second magnetic field; and at least one lift pin assembly configured to move the plurality of substrate carriers in a vertical direction between the first and second magnetic levitation tracks. According to various embodiments, further disclosed herein is an electronic device processing system comprising a transfer chamber including a first magnetic levitation track disposed at a first height within the transfer chamber, wherein the first magnetic levitation track has an upward-facing orientation and is configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed at a second height within the transfer chamber, wherein the second magnetic levitation track has a downward-facing orientation and is configured to generate a second magnetic field below the first magnetic levitation track; a plurality of substrate carriers configured to move along the first and second magnetic levitation tracks, wherein each of the plurality of substrate carriers includes a first magnet on a bottom portion of the substrate carrier to interact with the first magnetic field and a second magnet on a top portion of the substrate carrier to interact with the second magnetic field; and at least one lift pin assembly configured to move the plurality of substrate carriers in a vertical direction between the first and second magnetic levitation tracks; a plurality of processing chambers coupled to the transfer chamber along a length of the transfer chamber; and a first load lock coupled to one end of the transfer chamber. In still further various embodiments, a method of moving one or more substrates in a transfer chamber is disclosed herein, comprising retrieving a first substrate from a load lock by a first substrate carrier engaged with a first magnetic levitation track, the first magnetic levitation track being positioned proximate a bottom of the transfer chamber, wherein the first magnetic levitation track has a face-up orientation and is configured to generate a first magnetic field above the first magnetic levitation track; generating the first magnetic field by the first magnetic levitation track to move the first substrate carrier with the first substrate in a first direction along the first magnetic levitation track; lifting the first substrate carrier with the first substrate to a second magnetic levitation track with a first lift pin assembly, the second magnetic levitation track being positioned proximate a top surface of the transfer chamber, wherein the second magnetic levitation track has a face-down orientation and is configured to generate a second magnetic field below the first magnetic levitation track; detecting proximity of the first substrate carrier to the second magnetic levitation track; and generating a second magnetic field to suspend the first substrate carrier below the second magnetic levitation track and move the first substrate carrier with the first substrate in a second, opposite direction along the second magnetic levitation track. References throughout this specification to phrases such as "one embodiment," "certain embodiments," "one or more embodiments," or "an embodiment" indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearance of phrases such as "in one or more embodiments," "certain embodiments," "in an embodiment," or "in an embodiment" throughout this specification are not necessarily referring to the same embodiment of the present invention. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments. As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a lift pin" includes a single lift pin as well as more than one lift pin. As used herein, the word "about" in connection with a measured quantity represents the normal variation in the measured quantity that would be expected by one skilled in the art if the measurement was made and the accuracy of the measurement equipment and the level of care commensurate with the measurement objective were exercised. In certain embodiments, the word "about" includes ±10% of the recited number, such that "about 10" would include from 9 to 11. The term "at least about" in connection with a measured quantity represents the normal variation in the measured quantity, as would be expected by one skilled in the art given the measurement and the accuracy of the measurement equipment and any higher quantities, exercised at a level of care commensurate with the objective of the measurement. In certain embodiments, the term "at least about" includes the recited number minus 10% and any number greater than 9, such that "at least about 10" would include 9 and any number greater than 9. This term may also be expressed as "about 10 or more." Similarly, the term "less than about" generally includes the recited number plus 10% and any number less than 10%, such that "less than about 10" would include 11 and any number less than 11. This term may also be expressed as "about 10 or less." Unless otherwise indicated, all parts and percentages are by weight. If not otherwise indicated, weight percentages (wt. %) are based on the entire composition without any volatile matter, that is, on the dry solid content. According to one embodiment, a transfer chamber with a bidirectional magnetic levitation platform is disclosed for use in a semiconductor device manufacturing system. In one embodiment, the bidirectional magnetic levitation platform has a linear configuration with a narrow internal width (e.g., not much wider than the diameter of a wafer) that can move wafers in either direction without breaking vacuum and provides easy access to connected processing chambers. In one embodiment, the system includes two magnetic levitation platforms, one at the top and one at the bottom of the transfer chamber, arranged in a facing arrangement. The bidirectional vacuum magnetic levitation platform not only has a narrow, small footprint (i.e., width approximately the diameter of the wafer), but also offers flexible wafer flow, eliminates the need to break vacuum during wafer transfer, has a small vacuum volume, and is relatively easy to service. According to one embodiment, the bidirectional magnetic levitation system described herein is a single-space platform, optionally without a load lock. The system can freely enter and exit the chamber on either the forward or return magnetic levitation track. In one embodiment, a transfer system (also referred to as a transfer chamber) has two magnetically levitated rails. The top rail is located at the top of the transfer chamber and is oriented upside down, with the surface providing the power (e.g., the stator of a linear motor) facing downward into the interior of the transfer chamber. The bottom rail is located at the bottom of the transfer chamber and is oriented right-side up, with the surface providing the power (e.g., the stator of a linear motor) facing upward into the interior of the transfer chamber. The top rail and the bottom rail may each be or comprise the stators of the linear motors. The substrate carriers have two sets of magnets (or two movers for linear motors), one on top of the other, arranged so as not to short-circuit each other's magnetic fields. One mover (e.g., a set of magnets) may be located on the top of each substrate carrier, and one mover (e.g., a set of magnets) may be located on the bottom of each substrate carrier. This arrangement enables the substrate carriers to be moved both by the lower linear motor (e.g., riding on the lower rail) and by the upper linear motor (e.g., riding on the upper rail). Translation between the rails is facilitated by a series of lift pin assemblies shielded from the atmosphere using a bellows. Each lift pin assembly includes a set of lift pins that can lift a substrate carrier (which may include a wafer attached thereto, such as a wafer on an end effector of a substrate carrier) from the bottom rail to the top rail and / or lower a substrate carrier from the top rail to the bottom rail. When a substrate carrier with a wafer attached thereto comes within a certain proximity of the top magnetic levitation rail (e.g., as sensed by a rail sensing system), the top rail activates a magnetic field in proximity to the substrate carrier, securing the substrate carrier to the top rail. The bottom rail can be configured to move the substrate carrier in a first direction, and the top rail can be configured to move the substrate carrier in an opposite, second direction. Thus, the substrate carrier and supported substrate can be freely moved in both directions to their destination without causing collisions between the substrate carriers, and with minimal transfer chamber interior space and footprint. The bidirectional magnetic levitation system may include a plurality of lift pin assemblies, allowing the substrate carrier to transfer to and from the top track at multiple locations. This allows, for example, a wafer to be transferred from the load lock via the bottom track to chamber #2 in one direction, processed in chamber #2, transferred via the bottom track to chamber #4 in a first direction, processed in chamber #4, transferred via the top track to chamber #3 in a second direction, processed in chamber #3, and then moved back to the load lock via the top track in a second direction. According to one embodiment, a transfer chamber for an electronic device processing system is described herein, comprising a first magnetic levitation track disposed at a first height within the transfer chamber, wherein the first magnetic levitation track has an upward-facing orientation and is configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed at a second height within the transfer chamber, wherein the second magnetic levitation track has a downward-facing orientation and is configured to generate a second magnetic field below the second magnetic levitation track; a plurality of substrate carriers configured to move along the first and second magnetic levitation tracks, wherein each of the plurality of substrate carriers includes a first magnet on a bottom portion of the substrate carrier to interact with the first magnetic field and a second magnet on a top portion of the substrate carrier to interact with the second magnetic field; and at least one lift pin assembly configured to move the plurality of substrate carriers vertically between the first and second magnetic levitation tracks. According to one embodiment, the first magnet on the bottom portion of the substrate carrier can be a magnet system, such as a plurality of magnets arranged in a Halbach array, so as not to interfere with the operation of other magnet systems. The first magnet system can be in an upward-facing orientation. The second magnet on top of the substrate carrier may be a second magnet system, for example also comprising a plurality of magnets arranged in a Halbach array so that it does not affect the operation of the other magnet systems. The second magnet (system) may be oriented in an inverted configuration. The first and second magnetic levitation rails are arranged to face the interior of the transfer chamber, which is configured to reduce the transfer chamber's footprint and be evacuated to a vacuum. Furthermore, according to embodiments, all of the transfer chamber's electronic components can be located on the atmosphere side of the transfer chamber. According to embodiments, the transfer chamber may not need to include an elevator. Instead, the transfer chamber may include a plurality of lift pin assemblies to move the substrate carrier (and supported substrate, such as a wafer) between the first and second magnetic levitation rails at various points along the transfer chamber. In further embodiments, the substrate carrier includes two sets of magnets to allow it to travel along the first and second rails without tipping over. Referring to FIG. 1A , a transfer chamber 102 for an electronic device processing system 100 may have at least one port 103 configured to allow access to at least one processing chamber 104. In one embodiment, the transfer chamber 102 may have a plurality of ports 103, 103A-103K, each configured to allow access to one of the plurality of processing chambers 104, 104A-104K. Each port may include a slit valve sized to receive an end effector that holds a substrate (e.g., a wafer). In one embodiment, all ports 103, 103A-K and / or slit valves are coplanar and share a common height. Alternatively, different ports and / or slit valves may be positioned at different heights and / or planes. Furthermore, in one embodiment, all ports 103, 103A-K and / or slit valves have a common opening spacing (the vertical dimension of the opening). The common opening spacing can be a single height spacing that can accommodate end effectors and substrates positioned at a specific height, or multiple height spacings that can accommodate end effectors and substrates positioned at multiple different heights (e.g., end effectors and substrates for a substrate carrier attached to the bottom rail and end effectors and substrates for a substrate carrier attached to the top rail). Alternatively, different through-ports 103, 103A-K can have different opening spacings. According to embodiments, the transfer chamber may have a length and a width, wherein the first dimension of the length is several orders of magnitude greater than the second dimension of the width. A plurality of ports 103, 103A-103K may be arranged along the length of the transfer chamber 102. In embodiments, the ports 103, 103A-K may be oriented approximately orthogonal to the length of the transfer chamber 102. In embodiments, the length is from about 5 ft to about 20 ft, or about 6 ft, or about 8 ft, or about 10 ft, or about 12 ft, or about 14 ft, or about 16 ft, or about 18 ft, or about 20 ft, etc. In embodiments, the transfer chamber 102 may further include an additional port 106 configured to allow access to a load lock 107 (or multiple additional ports, each configured to allow access to one or more load locks). The additional port 106 may be arranged along the width of the transfer chamber 102 at a first end of the transfer chamber 102. The load lock 107 may be connected to a factory interface 109 comprising one or more front opening unified pods (FOUPs) 111. The factory interface may include a robot (not shown) that extracts wafers from the FOUPs 111 and places them in the load lock 107 for substrate carriers 110, 110A-C to retrieve from the load lock 107. In some embodiments, the first opening may be approximately perpendicular to the openings 103, 103A-K. In some embodiments, the width of the transfer chamber 100 is approximately equal to the width of the load lock 107 or the width of the substrates 108, 108A-108C. In some embodiments, the width of the transfer chamber 100 is approximately 2 mm to approximately 20 mm wider than the width of the load lock 107 and / or the substrates 108, 108A-108C. The transfer chamber system 100 includes at least one substrate carrier 110, 110A-110C configured to transfer substrates 108, 108A-108C between at least one processing chamber 104, 104A-104K and a transfer chamber 102. Depending on the embodiment, the transfer chamber 102 may contain a number of substrate carriers 110, 110A-110C, such as 2, 3, 4, 5, 6, 7, 8, 9, or 10 substrate carriers, or from about 2 to about 10 substrate carriers. Each substrate carrier 110, 110A-110C is configured to move using a magnetic levitation conveyor system (e.g., one or more linear motors). For example, as shown in FIG. 1B , each substrate carrier 110, 110A-110C can move along at least one magnetic levitation track 112, 114. According to one embodiment, the transfer chamber 102 can include two magnetic levitation tracks 112, 114, with a first magnetic levitation track 112 (e.g., a first stator of a linear motor) on a bottom interior surface 116 of the transfer chamber 102 and a second magnetic levitation track 114 (e.g., a second stator of another linear motor) on an opposite, top interior surface 118 of the transfer chamber 102. The first magnetic levitation track 112 can be configured to move the substrate carriers 110, 110A-C in a forward direction (out of the load lock), while the second magnetic levitation track 114 can be configured to move the substrate carriers 110, 110A-C in an opposite, reverse direction. In an embodiment (not shown), the first magnetic levitation track 112 may be on the bottom interior surface 116, and the second magnetic levitation track 114 may be on the top interior surface 118. The magnetic levitation tracks 112, 114 may be in a facing arrangement as shown in FIG. 1B (e.g., with the first magnetic levitation track 112 in an upward facing orientation and the second magnetic levitation track 114 in a downward facing orientation). In an embodiment, the first track 112 and the second track 114 may be separated by a distance of about 40 mm to about 300 mm, or about 100 mm to about 250 mm, or about 150 mm to about 200 mm. According to one embodiment, the first magnetic levitation track 112 can be configured to move one or more of the plurality of substrate carriers 110, 110A-110C in a first direction along the length of the transfer chamber 102. The second magnetic levitation track 114 can be configured to move one or more of the plurality of substrate carriers 110, 110A-110C in a second direction along the length of the transfer chamber 102, wherein the second direction is relative to the first direction. For example, the first magnetic levitation track 112 can move substrate carriers 110, 110A-110C from the load lock 106 into the transfer chamber 102 and into the processing chambers 104, 104A-104K. Correspondingly, the top magnetic levitation track 114 can move substrate carriers 110, 110A-110C from the processing chambers 104, 104A-104K through the transfer chamber 102 and to the load lock 106. In one embodiment, the transfer chamber system may include at least one position sensor for monitoring the position of the substrate carriers 110, 110A-110C. In one embodiment, the first and second magnetic levitation rails 112, 114 may include functional position sensors. FIG. 1C illustrates an embodiment of a substrate carrier 110 suitable for use in the transfer chamber system 100 , according to an embodiment. The substrate carrier 110 may include an end effector 120 for receiving, lifting, and holding a substrate 108 , such as a wafer, and / or for placing the substrate thereon. Any suitable end effector 120 used in a semiconductor processing system may be used, as will be understood by those skilled in the art. According to an embodiment, one or more substrate carriers 110 may be a robotic arm, as known to those skilled in the art. The substrate carrier 110 may include an upper magnetic portion 124 and a lower magnetic portion 126 . The lower magnetic portion 126 may, for example, be a first mover of a first linear motor. The upper magnetic portion 124 may, for example, be a second mover of a second linear motor. Alternatively, the upper and lower magnetic portions may be the upper and lower halves of a single mover configured to engage with a first stator below the substrate carrier 110 and a second stator above the substrate carrier 110 . The upper magnetic portion 124 may include one or more magnets (e.g., permanent magnets), and the lower magnetic portion 126 may include one or more additional magnets. The upper and lower magnetic portions may be configured so that their magnetic fields do not interfere with each other. The magnetic levitation conveyor system includes one or more electromagnets (not shown) for controlling the motion of the substrate carriers and linear motors (not shown) for moving the substrate carriers 110, 110A-110C. Referring back to Figures 1A-1B, according to one embodiment, the plurality of ports 103, 103A-103K may be or include a plurality of slit valves. A first transfer plane of at least a first subset of the plurality of slit valves provides access to a substrate carrier 110C engaged with a first magnetic levitation track 112. A second transfer plane of a second subset of the plurality of slit valves provides access to substrate carriers 110A and 110B engaged with a second magnetic levitation track 114. To further enhance throughput and enable approximately simultaneous exchange of substrates within a processing chamber 104, 104A-104K or a load lock 107, at least some of the plurality of slit valves have a first wafer transfer plane and a second wafer transfer plane above the first wafer transfer plane. The first wafer transfer plane provides access to a substrate carrier 110C engaged with a first magnetic levitation track 112. The second wafer transfer plane provides access to substrate carriers 110A and 110B engaged with a second magnetic levitation track. For example, a first substrate carrier 110C engaged with the first magnetic levitation track 112 can enter a processing chamber 104, 104A-104K, and a second substrate carrier 110A, 110B engaged with the second magnetic levitation track 114 and holding a substrate 108, 108A-108C thereon can be positioned above the first substrate carrier 110C. Once (or simultaneously with) the first substrate is removed from the processing chamber at the first transfer plane, the second substrate can be loaded into the same processing chamber at the second transfer plane, completing the exchange between the first substrate (e.g., just processed) and the second substrate (e.g., in need of processing). In further embodiments, a plurality of slit valves can share a common transfer plane, providing access to the substrate carriers 110, 110A-110C engaged with the first magnetic levitation track 112 and the substrate carriers 110, 110A-110C engaged with the second magnetic levitation track 114. The slit valve openings can be sized according to the configuration of the transfer planes. The slit valve opening may be about 1 inch to about 20 inches for a single transport plane, and about 2 inches to about 20 inches when there are two transport planes. For example, if there are two wafer transport planes, the slit valve opening may be larger than if there is one wafer transport plane. According to one embodiment, the system may include a first load lock 107 and a second load lock (not shown). The first load lock 107 provides access to substrate carriers 110 and 110C engaged with a first magnetic levitation track. The second load lock may be stacked above the first load lock 107 at an end of the transfer chamber 102. The second load lock provides access to substrate carriers 110A and 110B engaged with a second magnetic levitation track. In one embodiment, the first height of the transfer chamber 102 near the end of the first load lock 107 may be greater than the second height of the rest of the transfer chamber 102. In further embodiments, the first load lock 107 and the second load lock may be arranged in a side-by-side configuration at an angle relative to the length of the transfer chamber (e.g., a 30- or 45-degree angle). According to one embodiment, the system includes at least one lift pin assembly 128, 128A-128C configured to receive substrates 108, 108A-108C and lift and / or lower the substrates between transfer planes and / or between magnetic levitation rails 112, 114. The lift pin assembly 128, 128A-128C may include one or more lift pins, such as a pair or trio of lift pins 130, 130A-130C. The lift pins 130, 130A-130C may be configured to penetrate the bottom surface 116 of the transfer chamber 102 and may have an atmosphere-facing side and a vacuum-facing side. The atmosphere-facing side may be outside the bottom surface of the transfer chamber 102. The lift pins 130, 130A-130C may be enclosed in a bellows to maintain a vacuum environment within the transfer chamber. The lift pins 130, 130A-130C can be configured to extend into the transfer chamber 102 on the vacuum-facing side. In one embodiment, at least one lift pin assembly 128, 128A-128C can be configured to move the substrate carrier 110 positioned in front of the first load lock 107 in a vertical direction to cause the substrate carrier 110 to reach a transfer plane above a second height of the remaining transfer chamber 102 (discussed above). During operation, when the lift pins 130, 130A-130C lift the substrate carrier 110, 110A-110C to a certain proximity to the top rail 118, a magnetic field can be activated near the substrate carrier. When the lift pins 130 , 130A- 130C engage the substrate carrier 110 , 110A- 110C on the top rail 118 , the magnetic field proximate the substrate carrier 110 , 110A- 110C may be deactivated to move the substrate to the lower rail 112 via the lift pins 130 , 130A- 130C. Methods for using a transfer chamber system according to various embodiments are further described herein. Referring to FIG. 2 , method 200 may include, at block 202 , moving a first substrate through a transfer chamber. Moving 202 may include, at block 204 , receiving the first substrate via a first substrate carrier, wherein the first substrate carrier is associated with a first magnetic levitation track positioned on a bottom surface of the transfer chamber. In one embodiment, receiving 204 may include moving an end effector of the substrate carrier into a semiconductor processing chamber associated with the transfer chamber and receiving the first substrate on the end effector. Move 202 may further include, optionally, moving the first substrate carrier having the first substrate along the first magnetic levitation track at block 206. Additionally or alternatively, move 202 may further include, optionally, lifting the first substrate carrier having the first substrate onto a second magnetic levitation track positioned on a top surface of the transfer chamber using a first lift pin assembly at block 208, wherein the second magnetic levitation track is arranged to face the first magnetic levitation track. As mentioned above, the transfer chamber according to various embodiments herein may be connected to at least one semiconductor processing chamber, for example, in a linear arrangement. According to an embodiment, method 200 further includes optionally, at block 210, moving a second substrate through the transfer chamber. Movement 210 may further include optionally, at block 212, receiving the second substrate via a second substrate carrier, wherein the second substrate carrier is associated with the first magnetic levitation track. Movement 210 may further include moving the second substrate carrier with the second substrate along the first magnetic levitation track. Additionally or alternatively, movement 210 may further include, at block 214, lifting the second substrate carrier with the second substrate onto the second magnetic levitation track using a second lift pin assembly. According to one embodiment, receiving 212 may include removing a substrate from a semiconductor processing chamber via a first substrate carrier. According to one embodiment, method 200 may further include lifting 208 the first substrate carrier having the first substrate with a first lift pin assembly and moving a second substrate carrier having the second substrate along a first magnetic levitation track, wherein the second substrate carrier positions the second substrate in the semiconductor processing chamber. In one embodiment, the first substrate carrier may be movable in a first direction along a first track (e.g., a bottom track), and the second substrate carrier may be movable in a second direction along a second track (e.g., a top track). The first and second substrate carriers may be able to pass each other without colliding. According to various embodiments, referring again to Figures 1A and 1B, during operation, a substrate (e.g., a wafer) positioned in the load lock 107 can be moved from the load lock into a first transfer plane by a first substrate carrier 110. The first substrate carrier 110, with the substrate thereon, can then be moved along a first track 112 in a first direction to the first processing chamber 104F. If the first substrate carrier 110 is already in the transfer plane and the first processing chamber 104F is ready to receive a substrate, the first substrate carrier 110 positions the substrate in the first processing chamber 104F. If the first substrate carrier, with the substrate thereon, is not already in the transfer plane, the first substrate carrier can be positioned above a first lift pin assembly 128 near the first processing chamber 104F. The first lift pin assembly 128 can lift the substrate carrier 110, with the substrate thereon, into the transfer plane, whereupon the first substrate carrier places the substrate in the first processing chamber 104F when the first processing chamber 104F is ready to receive the substrate. The first substrate carrier 110 is now idle to collect another substrate from the load lock 107 or from any of the other processing chambers 104 , 104A- 104E, 104G- 104K. In one embodiment, the first substrate carrier 110 can be lifted to the second track 114 by the first lift pin assembly 128 and returned to the load lock 107 in a second direction, for example, to collect another substrate. Alternatively, the substrate carrier 110 can be lowered to the first track 112 by the first lift pin assembly 128, unless the first substrate carrier 110 is already engaged with the first track 112, where the first substrate carrier 110 can be moved along the first track 112 to another processing chamber 104A-104E, 104G-104K. In one embodiment, the substrate carrier 110 can wait in the first processing chamber 104F until processing steps are completed on the substrate. In one embodiment, the substrate can then be transferred to the second processing chamber 104B using the first substrate carrier 110 or using the second substrate carriers 110A-110C. Moving substrates between processing chambers and load locks, between tracks, and into and out of the transfer plane can be repeated as needed to provide continuous and efficient operation of substrate processing. Once the substrate has been processed through all necessary processing steps in the corresponding processing chamber, the substrate carrier with the substrate thereon may be lifted onto the second track 114 and returned along the second direction toward the load lock 107 . In some embodiments, the load lock transfer plane may be below the second rail 114, allowing substrate carriers with substrates thereon to be lowered to the transfer plane via the lift pin assembly 128, and in some embodiments, may be flush with the first rail 112. According to some embodiments, the transfer chamber 102 may be connected to a single load lock 107 or to multiple load locks (not shown). For example, the transfer chamber may be connected to two load locks in a vertical arrangement. In this configuration, a substrate carrier engaged with the top rail may be loaded into the upper load lock. In some embodiments, the load locks may be arranged side by side, and the substrate carriers may be raised or lowered to align with the transfer plane. The present disclosure further relates to a method 300, as shown in FIG3, including, at block 302, moving one or more substrates through a transfer chamber according to embodiments described herein. Moving 302 may include, at block 304, receiving a first substrate by a first substrate carrier, wherein the first substrate carrier is associated with a first magnetic levitation track according to embodiments described herein. At block 306, the method 300 may include receiving a first substrate carrier having a first substrate by a first lift pin assembly and moving the first substrate carrier having the first substrate to a second substrate transfer plane. The method 300 may further include optionally moving a second substrate on a second substrate carrier in the first substrate transfer plane at block 308. A magnetic field may be activated in the bottom rail to secure the second substrate carrier to the top rail. At block 310, the method 300 may further include optionally moving a second substrate on a second substrate carrier in the first substrate transfer plane. According to one embodiment, the method herein may include detecting the position of each substrate carrier and transferring it along and between each of first and second magnetic levitation tracks. As the substrate carrier moves along the magnetic levitation tracks, a lift pin assembly may raise and lower the carrier between the tracks. This configuration enables flexible movement of substrates between processing chambers and between a processing chamber and at least one load lock. This flexible coupling, coupled with a relatively small transfer chamber footprint, increases wafer throughput in electronic device processing systems. The present disclosure further relates to a method 400, as shown in FIG. 4 , for moving one or more substrates within a transfer chamber, comprising, at block 402, retrieving a first substrate from a load lock by a first substrate carrier engaged with a first magnetic levitation track positioned proximate to a bottom surface of the transfer chamber, wherein the first magnetic levitation track has an upward orientation and is configured to generate a first magnetic field above the first magnetic levitation track. At block 404, the method further includes generating a first magnetic field by the first magnetic levitation track to move the first substrate carrier with the first substrate in a first direction along the first magnetic levitation track. At block 406, the method further includes lifting the first substrate carrier with the first substrate to a second magnetic levitation track positioned proximate to a top surface of the transfer chamber with a first lift pin assembly, wherein the second magnetic levitation track has a downward orientation and is configured to generate a second magnetic field below the first magnetic levitation track. According to one embodiment, the method further includes, at block 408, detecting proximity of the first substrate carrier to the second magnetic levitation track. In an embodiment, the method further includes generating a second magnetic field to suspend the first substrate carrier below the second magnetic levitation track and moving the first substrate carrier with the first substrate in a second direction along the second magnetic levitation track. The above description mentions several specific details, such as examples of specific systems, components, methods, and the like, in order to provide a good understanding of several embodiments of the present invention. However, it will be apparent to those skilled in the art that at least some embodiments of the present invention can be implemented without these specific details. In other instances, known components or methods are not described in detail or presented in a simple block diagram format to avoid unnecessarily obscuring the present invention. Therefore, the specific details mentioned are merely examples. Specific embodiments may vary from these example details and still be considered within the scope of the present invention. Although the method operations herein are shown and described in a particular order, the order of the operations of each method may be changed such that certain operations may be performed in a reverse order, or such that certain operations may be performed at least partially simultaneously with other operations. In another embodiment, the instructions or sub-operations of a unique operation may be performed in a discontinuous and / or alternating manner. It should be understood that the above description is intended to be illustrative and not limiting. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. The scope of the present invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. 100: Electronic Device Processing System 102: Transfer Chamber 103: Port 104: Processing Chamber 106: Port 107: Load Lock 108: Substrate 109: Factory Interface 110: Substrate Carrier 112: Magnetic Levitation Track 114: Magnetic Levitation Track 116: Bottom Interior Surface 118: Top Interior Surface 120: End Effector 124: Upper Magnetic Portion 126: Lower Magnetic Portion 128: Lift Pin Assembly 130: Lift Pin 200: Methods 202-214: Blocks 300: Methods 302-310: Blocks 400: Methods 402-410: Blocks The present disclosure is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references represent similar elements. FIG. 1A depicts a top view of a substrate transfer system according to various embodiments. FIG. 1B illustrates a side view of a substrate transfer system according to various embodiments. FIG. 1C depicts a substrate carrier according to various embodiments. FIG. 2 illustrates a method of moving a wafer through a transfer chamber according to various embodiments. FIG. 3 illustrates a method of moving a wafer through a transfer chamber according to various embodiments. FIG. 4 illustrates a method of moving a wafer through a transfer chamber according to various embodiments. 102:Transfer chamber 110: Substrate carrier 112: Magnetic levitation track 114: Magnetic Levitation Track 116: Bottom inner surface 118: Top inner surface 128: Lift pin assembly 130: Lifting pin

Claims

1. A transfer chamber for an electronic device processing system, comprising: a first magnetic levitation track disposed in the transfer chamber, wherein the first magnetic levitation track has one side oriented upward and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed in the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has one side oriented downward and configured to generate a second magnetic field below the second magnetic levitation track; and at least one component configured to move a plurality of substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, wherein the at least one component is positioned along the first magnetic levitation track.

2. The transfer chamber as claimed in claim 1, wherein the at least one component comprises at least one lifting pin assembly.

3. The transport chamber as claimed in claim 1, wherein the transport chamber has only a single magnetic levitation track arranged at a first height within the transport chamber, and only a single magnetic levitation track arranged at a second height within the transport chamber, wherein the first magnetic levitation track is arranged at the first height within the transport chamber, and the second magnetic levitation track is arranged at the second height within the transport chamber.

4. The transfer chamber as claimed in claim 1, further comprising a plurality of substrate carriers configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein each of the plurality of substrate carriers includes a first magnet on a bottom of the substrate carrier to interact with the first magnetic field, and includes a second magnet on a top of the substrate carrier to interact with the second magnetic field.

5. The transfer chamber as claimed in claim 1, wherein the transfer chamber includes a plurality of ports, and wherein each of the plurality of ports is configured to allow access to a processing chamber.

6. The transfer chamber as claimed in claim 5 further includes an additional port configured to allow access to a load lock, wherein the additional port is arranged along a width of the transfer chamber at a first end of the transfer chamber.

7. The transfer chamber as claimed in claim 5, wherein the plurality of ports include a plurality of slit valves, wherein a first transfer plane of at least a first subset of the plurality of slit valves is open to and exitable by the substrate carriers of the plurality of substrate carriers engaged with the first magnetic levitation track.

8. The transfer chamber as claimed in claim 1, wherein the first magnetic levitation track is configured to move one or more of the plurality of substrate carriers in a first direction along a length of the transfer chamber, and wherein the second magnetic levitation track is configured to move one or more of the plurality of substrate carriers in a second direction along the length of the transfer chamber, wherein the second direction is opposite to the first direction.

9. The transfer chamber as claimed in claim 1, wherein one of the plurality of substrate carriers includes an end effector for holding a substrate, wherein at least one of the first magnetic levitation track or the second magnetic levitation track is configured to cause the substrate carrier to rotate to place the substrate into a processing chamber.

10. The transfer chamber as claimed in claim 1, further comprising a plurality of components configured to move the plurality of substrate carriers in a vertical direction, wherein the plurality of components are positioned along the first magnetic levitation track.

11. A method of moving one or more substrates through a transfer chamber, comprising the steps of: retrieving a first substrate by means of a first substrate carrier, wherein the first substrate carrier is associated with a first magnetic levitation track disposed in the transfer chamber, wherein the first magnetic levitation track has an upward orientation and is configured to generate a first magnetic field above the first magnetic levitation track; moving the first substrate carrier and the first substrate from a first position to a second position along the first magnetic levitation track; and moving the first substrate carrier and the first substrate from the first magnetic levitation track to a second magnetic levitation track in a vertical direction via at least one component, the second magnetic levitation track being disposed in the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has a downward orientation and is configured to generate a second magnetic field below the second magnetic levitation track, wherein the at least one component is positioned at the second position along the first magnetic levitation track.

12. The method as described in claim 11, wherein the at least one component comprises at least one lifting pin component.

13. The method of claim 11, wherein the transport chamber has only a single magnetic levitation track disposed at a first height within the transport chamber, and only a single magnetic levitation track disposed at a second height within the transport chamber, wherein the first magnetic levitation track is disposed at the first height within the transport chamber, and the second magnetic levitation track is disposed at the second height within the transport chamber.

14. The method of claim 11, further comprising a plurality of substrate carriers configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein each of the plurality of substrate carriers includes a first magnet on a bottom of the substrate carrier to interact with the first magnetic field, and includes a second magnet on a top of the substrate carrier to interact with the second magnetic field.

15. The method of claim 14, wherein the first magnetic levitation track is configured to move one or more of the plurality of substrate carriers in a first direction along a length of the transfer chamber, and wherein the second magnetic levitation track is configured to move one or more of the plurality of substrate carriers in a second direction along the length of the transfer chamber, wherein the second direction is opposite to the first direction.

16. The method as described in claim 14, comprising a plurality of components configured to move the plurality of substrate carriers in a vertical direction, wherein the plurality of components are positioned along the first magnetic levitation track.

17. The method as described in claim 11, wherein the transfer chamber includes a plurality of ports, and wherein each of the plurality of ports is configured to allow access to a processing chamber.

18. The method as described in claim 11 further includes an additional port configured to allow access to a loading gate, wherein the additional port is arranged along a width of the transfer chamber at a first end of the transfer chamber.

19. The method of claim 11, wherein the first substrate carrier includes an end effector for holding a substrate, wherein at least one of the first magnetic levitation track or the second magnetic levitation track is configured to cause the substrate carrier to rotate to place the substrate into a processing chamber.

20. A semiconductor processing system comprising: a processing chamber; and a transfer chamber in fluid communication with the processing chamber, the transfer chamber comprising: a first magnetic levitation track disposed within the transfer chamber, wherein the first magnetic levitation track has one side oriented upward and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed within the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has one side oriented downward and configured to generate a second magnetic field below the second magnetic levitation track; and at least one component configured to move a plurality of substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, wherein the at least one component is positioned along the first magnetic levitation track.

21. An electronic device processing system, comprising: a transfer chamber, including: a first magnetic levitation track disposed in the transfer chamber, wherein the first magnetic levitation track has one side oriented upward and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed in the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has one side oriented downward and configured to generate a second magnetic field below the second magnetic levitation track; at least one component and a plurality of ports, the at least one component being configured to move one or more substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, wherein the at least one component is positioned along the first magnetic levitation track; and a plurality of processing chambers, each processing chamber being in fluid communication with the transfer chamber via a separate port of the plurality of ports.

22. The system as claimed in claim 21, wherein the at least one component comprises at least one lifting pin component.

23. The system of claim 21, wherein the transport chamber has only a single magnetic levitation track disposed at a first height within the transport chamber, and only a single magnetic levitation track disposed at a second height within the transport chamber, wherein the first magnetic levitation track is disposed at the first height within the transport chamber, and the second magnetic levitation track is disposed at the second height within the transport chamber.

24. The system of claim 21 further includes a plurality of substrate carriers configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein each of the plurality of substrate carriers includes a first magnet on a bottom of the substrate carrier to interact with the first magnetic field, and includes a second magnet on a top of the substrate carrier to interact with the second magnetic field.

25. The system of claim 24, wherein the first magnetic levitation track is configured to move one or more of the plurality of substrate carriers in a first direction along a length of the transfer chamber, and wherein the second magnetic levitation track is configured to move one or more of the plurality of substrate carriers in a second direction along the length of the transfer chamber, wherein the second direction is opposite to the first direction.

26. The system of claim 25, wherein one of the plurality of substrate carriers includes an end effector for holding a substrate, wherein at least one of the first magnetic levitation track or the second magnetic levitation track is configured to cause the substrate carrier to rotate to place the substrate into a processing chamber.

27. The system as claimed in claim 25, wherein the plurality of ports are a plurality of slit valves, wherein a first transport plane of at least a first subset of the plurality of slit valves is accessible to the substrate carriers of the plurality of substrate carriers engaged with the first magnetic levitation track.

28. The system as claimed in claim 21 further includes an additional port configured to allow access to a loading gate, wherein the additional port is arranged along a width of the transfer chamber at a first end of the transfer chamber.

29. The system as claimed in claim 21, wherein each of the plurality of processing chambers is independently selected from a group consisting of an etching chamber, a polishing chamber and a deposition chamber.

30. A transfer chamber comprising: a first magnetic levitation track disposed within the transfer chamber, wherein the first magnetic levitation track has one side oriented upward and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed within the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has one side oriented downward and configured to generate a second magnetic field below the second magnetic levitation track; and at least one component and a plurality of ports, the at least one component being configured to move one or more substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, wherein the at least one component is positioned along the first magnetic levitation track, wherein the first and second magnetic levitation tracks are configured to independently rotate each of the one or more substrate carriers from a first position parallel to the first or second magnetic levitation track to a second position perpendicular to the first or second magnetic levitation track.

31. A transfer chamber comprising: a first magnetic levitation track disposed within the transfer chamber, wherein the first magnetic levitation track has one side oriented upward and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed within the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has one side oriented downward and configured to generate a second magnetic field below the second magnetic levitation track; and at least one component and a plurality of ports, the at least one component being configured to move one or more substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, wherein the at least one component is positioned along the first magnetic levitation track, wherein at least one of the first magnetic levitation track or the second magnetic levitation track is configured to cause a substrate carrier to rotate to place a substrate into a processing chamber in fluid communication with the transfer chamber.

32. The transfer chamber as claimed in claim 31, wherein the substrate carrier includes an upper magnetic portion configured to engage with a stator of a first linear motor.

33. The transfer chamber as claimed in claim 31, wherein the substrate carrier includes a lower magnetic portion configured to engage with a stator of a first linear motor or a second linear motor.

34. The transfer chamber as claimed in claim 31, wherein the substrate carrier includes an end effector.

35. The transfer chamber as claimed in claim 31, wherein the substrate carrier is a robotic arm driven by a corresponding linear motor of one or more linear motors.

36. A transfer chamber comprising: a first magnetic levitation track disposed within the transfer chamber, wherein the first magnetic levitation track has one side oriented upward and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed within the transfer chamber and spaced apart from the first magnetic levitation track, wherein the second magnetic levitation track has one side oriented downward and configured to generate a second magnetic field below the second magnetic levitation track; and at least one component and a plurality of openings, the at least one component being configured to move one or more substrate carriers in a vertical direction between the first magnetic levitation track and the second magnetic levitation track, wherein the at least one component is positioned along the first magnetic levitation track, wherein a width of the transfer chamber is about 2 mm to about 20 mm wider than a substrate for one or more substrate carriers, wherein the first magnetic levitation track and the second magnetic levitation track are spaced about 40 mm to about 300 mm apart.

37. The transfer chamber as described in claim 36, wherein the length of the transfer chamber is from about 5 ft to about 20 ft.

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