Resin compositions and products thereof

Abstract

This invention discloses a resin composition comprising a vinyl-containing resin, including maleimide resin, vinyl polyphenylene ether resin, polyolefin resin, or a combination thereof; a compound having the structure shown in formula (1); and a crosslinking agent. This resin composition can be made into various articles, including prepregs, resin films, laminates, or printed circuit boards, and improves one or more of the following properties: dielectric loss, X / Y axis thermal expansion coefficient, tensile strength to copper foil, and thermal conductivity.

Claims

1. A resin composition comprising: Vinyl resins, including maleimide resins, vinyl polyphenylene ether resins, polyolefin resins, or combinations thereof; A compound having the structure shown in formula (1); and a crosslinking agent; Formula (1).

2. The resin composition as described in claim 1, wherein, The maleimide resin includes 4,4'-diphenylmethane bismaleimide, polyphenylmethane maleimide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 3,3'-dimethyl-5,5'-dipropyl-4,4'-diphenylmethane bismaleimide, and meta-phenyl bismaleimide. Maleimide, 4-methyl-1,3-epenylphenylbismaleimide, N-2,3-dimethylphenylmaleimide, N-2,6-dimethylphenylmaleimide, N-phenylmaleimide, vinylbenzylmaleimide, maleimide containing a biphenyl structure, maleimide containing an indane structure, maleimide containing isopropylidene and meta-epenylphenyl structures, or combinations thereof.

3. The resin composition as claimed in claim 1, wherein, The vinyl polyphenylene ether resin includes vinyl benzyl biphenyl polyphenylene ether resin, methacrylate polyphenylene ether resin, or a combination thereof.

4. The resin composition as claimed in claim 1, wherein, The polyolefin resin includes polybutadiene, butadiene-styrene copolymer, butadiene-styrene-divinylbenzene terpolymer, divinylbenzene-terminated hydrogenated polybutadiene, benzocyclobutene-modified polybutadiene, maleic anhydride-modified polybutadiene, maleic anhydride-modified polybutadiene-styrene copolymer, or combinations thereof.

5. The resin composition as claimed in claim 1, wherein, The crosslinking agent includes vinyl benzyl fluorene resin, styrene compounds, vinyl benzyl indene resin, benzocyclobutene with a siloxane structure, triallyl isocyanurate, triallyl cyanurate, divinylbenzene, 1,2-bis(vinylphenyl)ethane, or combinations thereof.

6. The resin composition as claimed in claim 1, comprising 100 parts by weight of the vinyl resin, 10 to 35 parts by weight of the compound having the structure shown in formula (1), and 15 to 40 parts by weight of the crosslinking agent.

7. The resin composition as claimed in claim 1 further comprises inorganic fillers, curing accelerators, polymerization inhibitors, solvents, silane coupling agents, colorants, toughening agents, or combinations thereof.

8. An article made of any one of the resin compositions described in claims 1 to 7, comprising a prepreg, a resin film, a laminate, or a printed circuit board.

9. The article as described in claim 8 has one, more, or all of the following characteristics: a dielectric loss less than or equal to 0.0039 as measured at a frequency of 10 GHz according to the method described in JIS C2565; an X / Y axis coefficient of thermal expansion less than or equal to 13.8 ppm / °C as measured in accordance with the method described in IPC-TM-650 2.4.24.5; a copper foil tensile strength greater than or equal to 5.4 lb / in as measured in accordance with the method described in IPC-TM-650 2.4.8; and a thermal conductivity greater than or equal to 0.27 W / (m·K) as measured in accordance with the method described in ASTM-D5470.