Carrier-free hot melt adhesive film and its manufacturing method

TWI943517BActive Publication Date: 2026-10-21SAN FANG CHEM IND
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Patent Information

Application Number
TW114123309
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-06-20
Publication Date
2026-10-21
Estimated Expiration
2045-06-19

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Abstract

This invention provides a carrier-free hot melt adhesive film and its manufacturing method. The carrier-free hot melt adhesive film comprises a thermoplastic polyurethane hot melt adhesive material and a textured structure. The thermoplastic polyurethane hot melt adhesive material is polymerized from 20 to 40 wt% hard segments, 50 to 60 wt% soft segments, and 10 to 20 wt% chain extenders. The hard segments contain isocyanates. The soft segments contain polyols. The textured structure is formed on the surface of the thermoplastic polyurethane hot melt adhesive material. Compared with the prior art, the carrier-free hot melt adhesive film of this invention achieves a non-adhesive effect without the need to add anti-adhesive agents or slip agents, and its manufacturing process does not generate plastic waste.
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Claims

1. A method for manufacturing a carrier-free hot melt adhesive film, comprising: (a) Providing a thermoplastic polyurethane hot melt adhesive material, said thermoplastic polyurethane hot melt adhesive material being polymerized from 20 to 40 wt% hard segments, 50 to 60 wt% soft segments and 10 to 20 wt% chain extender, said hard segments comprising isocyanates and said soft segments comprising polyols; (b) Co-extruding a polyolefin film material with said thermoplastic polyurethane hot melt adhesive material to form a laminated structure; (c) Forming a textured structure on the surface of said thermoplastic polyurethane hot melt adhesive material of said laminated structure; and (d) Removing said polyolefin film material of said laminated structure to obtain said carrier-free hot melt adhesive film.

2. A method for manufacturing a carrier-free hot melt adhesive film as claimed in claim 1, wherein after step (d), the manufacturing method further includes: (e) The polyolefin membrane material removed in step (d) is used as recycled polyolefin membrane material, and the polyolefin membrane material of step (b) is prepared using the recycled polyolefin membrane material.

3. The method for manufacturing a carrier-free hot melt adhesive film as claimed in claim 2, wherein the polyolefin film material in step (b) comprises 15 wt% to 45 wt% of the recycled polyolefin film material.

4. The method for manufacturing a carrier-free hot melt adhesive film as claimed in claim 2, wherein step (e) includes: The polyolefin membrane material prepared in step (b) using the undried recycled polyolefin membrane material.

Citation Information

Patent Citations

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  • High-modulus, high-filling and high-color-developing polyurethane wet-process grain-absorbing resin as well as preparation method and application thereof

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  • Multi-layer composite hot melt adhesive film as well as preparation method and application thereof

    CN120137540A