Package structure and method forming thereof

Abstract

A packaging structure includes a first leadframe, a first wafer, a conductive clip, and a packaging material. The first wafer is on the first leadframe. The conductive clip is on the first wafer and electrically connected to the first wafer. The packaging material covers a portion of the first leadframe, the first wafer, and the conductive clip, wherein the conductive clip has a first lead extension extending beyond the packaging material, the first lead extension having a first portion bent in a direction away from the first wafer.

Claims

1. A packaging structure comprising: a first lead frame; a first wafer on the first lead frame; a conductive clip on the first wafer and electrically connected to the first wafer; and a packaging material covering a portion of the first lead frame, the first wafer, and the conductive clip, wherein the conductive clip has a first pin extension extending beyond the packaging material, the first pin extension having a first portion bent in a direction away from the first wafer, the first portion of the first pin extension extending along and contacting a first sidewall of the packaging material and extending in a direction away from the first wafer.

2. The package structure as claimed in claim 1, wherein the first pin extension further includes a second portion extending along a top surface of the package material, the second portion of the first pin extension being connected to the first portion of the first pin extension.

3. The package structure as described in claim 2 further includes: a carrier board, wherein the second portion of the first pin extension is connected to the carrier board.

4. The packaging structure as described in claim 1 further comprises: a second lead frame adjacent to the first lead frame; and a second wafer on the second lead frame, wherein the conductive clip is on the second wafer and simultaneously electrically connects the first wafer and the second wafer.

5. The packaging structure as claimed in claim 4, wherein the conductive clip further has a second pin extension extending beyond the packaging material, the second pin extension having a third portion bent toward the direction opposite to the second wafer, and the third portion and the first portion being located on opposite sides of the packaging material.

6. A packaging structure comprising: a first leadframe; a second leadframe, adjacent to the first leadframe, a first wafer on the first leadframe; a second wafer on the second leadframe; a conductive clip, wherein the conductive clip is on the first wafer and the second wafer and electrically connects the first wafer and the second wafer simultaneously; and a packaging material covering a portion of the first leadframe, the first wafer, and the conductive clip, wherein the conductive clip has a first pin extension and a second pin extension extending beyond the packaging material, the first pin extension having a first portion bent in a direction away from the first wafer, the first portion of the first pin extension following and contacting a first sidewall of the packaging material, the second pin extension having a second portion bent in a direction away from the second wafer, and the second portion and the first portion being located on opposite sides of the packaging material, the second pin extension further having a third portion extending along a top surface of the packaging material, the third portion of the second pin extension being connected to the second portion of the second pin extension.

7. The package structure as claimed in claim 6, wherein the first pin extension further has a fourth portion extending along the top surface of the package material, the fourth portion of the first pin extension being connected to the first portion of the first pin extension.

8. The packaging structure as described in claim 6 further includes: a heat dissipation device on the side of the first lead frame away from the first wafer.

9. A packaging structure comprising: a first leadframe; a second leadframe adjacent to the first leadframe; a first wafer on the first leadframe; a second wafer on the second leadframe; a conductive clip, wherein the conductive clip is on the first wafer and the second wafer and electrically connects the first wafer and the second wafer simultaneously; a packaging material covering a portion of the first leadframe, the first wafer and the conductive clip, wherein the conductive clip has a first pin extension and a second pin extension extending beyond the packaging material, the first pin extension having a first portion bent in a direction away from the first wafer, the first portion of the first pin extension following and contacting a first sidewall of the packaging material, the second pin extension having a second portion bent in a direction away from the second wafer, and the second portion and the first portion being located on opposite sides of the packaging material; and a conductive layer on a top surface of the packaging material, the conductive layer contacting the first portion and the second portion.

10. The packaging structure as described in claim 9 further includes: a heat dissipation device on the side of the conductive layer away from the first wafer.

11. A method of forming a package structure, comprising: placing a wafer on a lead frame; placing a conductive clip on the wafer, the conductive clip being electrically connected to the wafer; forming a package material covering the lead frame, the wafer and the conductive clip, wherein the conductive clip has a lead extension extending beyond the package material; and bending the lead extension such that the lead extension has a first portion bent along and in contact with a sidewall of the package material in a direction away from the wafer.

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