Radio frequency guiding assembly, wafer boat support device and semiconductor process equipment

Abstract

A radio frequency (RF) introduction component, a wafer carrier support device, and semiconductor manufacturing equipment are disclosed, belonging to the field of semiconductor processing technology. The RF introduction component is used to introduce RF power into a wafer carrier. The RF introduction component includes an electrode ring and a first introduction component. The electrode ring is fitted onto a support member, which supports the wafer carrier, and the electrode ring is electrically connected to a first end of the first introduction component. In this design, the electrode ring can be fitted onto the support member and move relative to it, allowing the RF introduction component to be retractably positioned within a reaction chamber. This allows the RF introduction component to be introduced into the reaction chamber from its rear end. This simplifies maintenance and replacement operations, shortens maintenance time, and improves the safety of maintenance operations.

Description

[Technical Field]

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a radio frequency introduction component, a carrier boat support device, and semiconductor process equipment. [Previous Technology]

[0002] In semiconductor processing technology, such as in the manufacturing technology of crystalline silicon solar cells, surface passivation and antireflection processes can increase light absorption and reduce carrier recombination, thereby improving the photoelectric conversion efficiency of solar cells. Currently, the industry commonly uses semiconductor processing equipment, such as PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment, to prepare SiNx passivation and antireflection films. This PECVD equipment places a wafer (e.g., a silicon wafer) between wafer carrier boats composed of positive and negative plates, introduces reactive gas, and increases radio frequency voltage between the positive and negative plates to generate plasma through glow discharge, ultimately producing a SiNx thin film on the wafer surface.

[0003] In existing semiconductor manufacturing equipment, the radio frequency introduction components are introduced from the furnace opening of the reaction chamber. However, since the furnace opening is the entrance and exit of the wafer carrier boat, the automated equipment enters and exits the reaction chamber through the furnace opening to transport the wafer carrier boat. When the radio frequency introduction components need to be maintained, the automated equipment needs to be stopped and the reaction chamber needs to be cooled down. Then the maintenance personnel enter the machine to perform the cavity opening operation. This not only affects the normal operation of other PECVD equipment, but also increases the maintenance and replacement time, reduces the production capacity, and has low maintenance safety.

[0004] Therefore, existing semiconductor manufacturing equipment has the disadvantages of difficult maintenance and replacement of radio frequency introduction components, long maintenance and replacement time, and low safety. [Summary of the Invention]

[0005] The purpose of this application is to provide an RF introduction component, a carrier boat support device, and a semiconductor process equipment, which can solve the problems of difficult maintenance and replacement of RF introduction components in semiconductor process equipment, long maintenance and replacement time, and low safety in related technologies.

[0006] In a first aspect, embodiments of this application provide a radio frequency introduction component for introducing radio frequency power into a wafer carrier boat. The radio frequency introduction component includes an electrode ring and a first introduction component. The electrode ring is used to be sleeved on a support member, the support member is used to support the wafer carrier boat, and the electrode ring is electrically connected to a first end of the first introduction component.

[0007] In a second aspect, embodiments of this application also provide a support device for a carrier boat, including a support member and the above-mentioned radio frequency introduction component. The support member is used to support the carrier boat, and the electrode ring of the radio frequency introduction component is sleeved on the support member, and the electrode ring is movable relative to the support member.

[0008] In a third aspect, embodiments of this application also provide a semiconductor process apparatus, including a reaction chamber and at least two of the above-mentioned carrier boat support devices, wherein the support member of the carrier boat support device is disposed in the reaction chamber, and the radio frequency introduction component of the carrier boat support device is removably disposed in the reaction chamber.

[0009] In this embodiment of the application, since the electrode ring has a ring-shaped structure, the electrode ring can be fitted onto the support in the reaction chamber and can move relative to the support. This allows the radio frequency introduction component to be pulled out and installed in the reaction chamber. In this way, the radio frequency introduction component can be introduced into the reaction chamber from the tail end of the reaction chamber, that is, the radio frequency introduction component can be introduced into the reaction chamber from the end of the reaction chamber away from the furnace opening. When maintaining or replacing the radio frequency introduction component, it is only necessary to pull the radio frequency introduction component out from the tail end of the reaction chamber. There is no need to cool down the reaction chamber or stop the automated equipment, and there is no need for maintenance personnel to enter the machine to open the chamber. This simplifies the maintenance and replacement operation of the radio frequency introduction component, effectively shortens the maintenance and replacement time of the radio frequency introduction component, and improves the safety of the maintenance operation.

Implementation Method

[0011] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0012] The terms "first," "second," "third," "fourth," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," "third," "fourth," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0013] The radio frequency introduction component, carrier boat support device and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0014] Referring to Figures 1-19, an embodiment of this application provides a radio frequency (RF) introduction component 600, which can be used to introduce RF power into a wafer carrier boat. The RF introduction component 600 may include an electrode ring 610 and a first introduction component 620. As shown in Figure 3, the electrode ring 610 can be sleeved on a support member 400, which can support the wafer carrier boat. The electrode ring 610 can be electrically connected to the first end of the first introduction component 620. Here, the first introduction component 620 can be electrically connected to an RF power source. Specifically, the second end of the first introduction component 620 can be electrically connected to an RF power source.

[0015] The electrode ring 610 is used for electrical connection with the wafer carrier boat to enable the supply of radio frequency power to the wafer carrier boat. It should be noted that the electrode ring 610 can be electrically connected to the feet of the wafer carrier boat to enable the supply of radio frequency power to the wafer carrier boat.

[0016] Since the electrode ring 610 has a ring-shaped structure, the electrode ring 610 can be fitted onto the support member 400 inside the reaction chamber 100 and can move relative to the support member 400. This allows the radio frequency introduction component 600 to be pulled out and installed inside the reaction chamber 100. In this way, the radio frequency introduction component 600 can be introduced into the reaction chamber 100 from the tail end of the reaction chamber 100, that is, the radio frequency introduction component 600 can be introduced into the reaction chamber 100 from the end away from the furnace opening. When maintaining or replacing the radio frequency introduction component 600, it is only necessary to pull out the radio frequency introduction component 600 from the tail end of the reaction chamber 100. There is no need to cool down the reaction chamber 100 or stop the automated equipment, and there is no need for maintenance personnel to enter the machine to open the cavity. This simplifies the maintenance and replacement operation of the radio frequency introduction component 600, effectively shortens the maintenance and replacement time of the radio frequency introduction component 600, and improves the safety of the maintenance operation.

[0017] In some embodiments, as shown in FIG5, the electrode ring 610 may be provided with a notch 613, which can be used for the support member 400 to enter and exit the electrode ring 610. This facilitates the removal of the electrode ring 610 from the support member 400.

[0018] Specifically, during the process of pulling out the radio frequency introduction assembly 600, the operator can rotate the electrode ring 610 so that the notch 613 rotates to a position opposite to the support base 430 (used to connect the support member 400 and the second flange 150) described below. At this time, the notch 613 can avoid the support base 430, so that the electrode ring 610 can be fitted onto the support member 400 or removed from the support member 400. Of course, during the process of pulling out the radio frequency introduction assembly 600, since the connecting sleeve 634 described below separates from the electrode introduction fixing seat 635, the support member 400 can be seen through the inner hole of the connecting sleeve 634. The operator can manually fit the electrode ring 610 onto the support member 400 or directly remove the electrode ring 610 from the support member 400. Here, the notch 613 allows the support member 400 to enter and exit the electrode ring 610.

[0019] In other embodiments, the electrode ring 610 may not have a notch 613, that is, the electrode ring 610 may be a closed ring structure.

[0020] In some embodiments, as shown in FIG6, a first connecting portion 611 may be provided on the outer wall of the electrode ring sleeve 610. The first connecting portion 611 may be provided with a through hole. A second connecting portion 627 may be provided at the first end of the first introducing component 620. The second connecting portion 627 may be located inside the through hole. Along the direction towards the first end of the first introducing component 620, the cross-sectional area of ​​the through hole may gradually decrease, the cross-sectional area of ​​the second connecting portion 627 may gradually decrease, and the second connecting portion 627 may fit against the hole wall of the through hole. In this way, it is convenient to realize the connection between the first connecting portion 611 and the second connecting portion 627 to realize the connection between the electrode ring sleeve 610 and the first introducing component 620. It can also increase the contact area between the first connecting portion 611 and the second connecting portion 627, thereby avoiding abnormal discharge phenomena caused by poor contact that could lead to high-frequency radio frequency.

[0021] In some embodiments, the above-mentioned through hole can be a conical hole, and the second connecting part 627 can be a conical columnar structure. Of course, both can also be structures of other shapes.

[0022] In other embodiments, the cross-sectional areas of the first connecting portion 611 and the second connecting portion 627 may remain unchanged along the direction toward the first end of the first introducing component 620.

[0023] In some embodiments, a third connecting portion 628 may be provided at the end of the second connecting portion 627 away from the first introducing component 620. The cross-sectional area of ​​the third connecting portion 628 may be smaller than the minimum cross-sectional area of ​​the through hole. During the installation of the first connecting portion 611, the first connecting portion 611 can be fitted onto the second connecting portion 627 through the third connecting portion 628. Since the cross-sectional area of ​​the third connecting portion 628 is smaller than the minimum cross-sectional area of ​​the through hole, the third connecting portion 628 is less likely to interfere with the thinnest part of the first connecting portion 611. Therefore, the first connecting portion 611 can be fitted onto the second connecting portion 627 more easily through the third connecting portion 628. The third connecting portion 628 may be connected to a locking member 629, which can be used to lock the first connecting portion 611 and the second connecting portion 627. In this way, the connection strength between the electrode ring sleeve 610 and the first introducing component 620 can be improved.

[0024] Here, the locking member 629 can be a fixing nut, and the third connecting part 628 is provided with a thread that is compatible with the fixing nut.

[0025] Of course, the end of the second connecting part 627 that is away from the first introducing component 620 may not have a third connecting part 628, and the electrode ring sleeve 610 is only connected to the second connecting part 627 through the first connecting part 611.

[0026] In some embodiments, the outer wall of the electrode ring 610 may be provided with a flat surface 612, which can be used to fit against the foot of the wafer carrier boat. This helps to increase the contact area between the electrode ring 610 and the foot of the wafer carrier boat. Of course, the outer wall of the electrode ring 610 may not be provided with a flat surface 612. For example, the outer wall of the electrode ring 610 may be an arc surface, which contacts the foot of the wafer carrier boat.

[0027] In some embodiments, there is a movable gap between the electrode ring 610 and the support member 400. This allows the electrode ring 610 to have a certain amount of movement in its circumferential direction. When connected to the foot of the wafer carrier boat, the electrode ring 610 can achieve self-leveling under the gravity of the wafer carrier boat, thereby ensuring that the above-mentioned plane 612 can fit with the foot of the wafer carrier boat.

[0028] In some embodiments, as shown in FIG6, the first introduction component 620 may include an electrode introduction rod 621, an electrode introduction cable 622, and an electrode introduction plug 623. The first end of the electrode introduction rod 621 may be electrically connected to the electrode ring 610, the first end of the electrode introduction cable 622 may be electrically connected to the second end of the electrode introduction rod 621, and the first end of the electrode introduction plug 623 may be electrically connected to the second end of the electrode introduction cable 622. The second end of the electrode introduction plug 623 may be used for electrical connection with an RF power supply. Here, the electrode introduction cable 622 may be a flexible cable, so that the first introduction component 620 can adapt to the rotation of the electrode ring 610, so that the wafer carrier boat and the electrode ring 610 can make good contact, eliminate the abnormal RF discharge phenomenon caused by poor contact, thereby improving the stability of the process, improving product yield and production capacity, and reducing the stress of the RF introduction component 600, thereby extending the service life of the RF introduction component 600.

[0029] In other embodiments, the electrode introduction cable 622 may be a rigid structure.

[0030] In some embodiments, the second end of the electrode introduction rod 621 and the first end of the electrode introduction plug 623 may both be provided with threaded holes, and both ends of the electrode introduction cable 622 may both be provided with external threads. The two ends of the electrode introduction cable 622 can be inserted into the threaded holes of the electrode introduction rod 621 and the electrode introduction plug 623 respectively and threadedly connected to the threaded holes. In this way, the stability of the connection between the electrode introduction cable 622 and the electrode introduction rod 621 and the electrode introduction plug 623 can be improved, and the maintenance of the first introduction assembly 620 can be facilitated.

[0031] In some embodiments, as shown in FIG8, the first inlet component 620 may further include a first insulating inner sleeve 624, a second insulating inner sleeve 625 and an insulating outer sleeve 626. The first insulating inner sleeve 624 may be sleeved on a portion of the electrode inlet rod 621 and the electrode inlet cable 622, and the second insulating inner sleeve 625 may be sleeved on a portion of the electrode inlet plug 623 and another portion of the electrode inlet cable 622. In this way, the electrical insulation of the structure of the first inlet component 620 can be guaranteed. The insulating outer sleeve 626 can be fitted over the first insulating inner sleeve 624 and the second insulating inner sleeve 625, and the insulating outer sleeve 626 can cover the gap between the first insulating inner sleeve 624 and the second insulating inner sleeve 625. In this way, it can be ensured that after at least one of the electrode introduction rod 621, electrode introduction cable 622, electrode introduction plug 623, first insulating inner sleeve 624 and second insulating inner sleeve 625 expands due to heat, the joint between the first insulating inner sleeve 624 and the second insulating inner sleeve 625 will not be exposed, thereby improving the electrical insulation of the first introduction component 620 and ensuring the integrity of the electrical insulation.

[0032] Of course, the first introducing component 620 may only include the first insulating inner sleeve 624 and the second insulating inner sleeve 625, but not the insulating outer sleeve 626.

[0033] In some embodiments, the insulating outer sleeve 626 may include multiple insulating sleeves, which are sequentially joined together along the length direction of the first introducing component 620, and at least one of the multiple insulating sleeves may cover the joint between the first insulating inner sleeve 624 and the second insulating inner sleeve 625.

[0034] In some embodiments, the RF introduction component 600 may further include a second introduction component 630. The second introduction component 630 may include a fixing component and a rear introduction electrode rod 631. The rear introduction electrode rod 631 may be disposed on the fixing component, which may be used to connect to the reaction chamber 100 of the semiconductor process equipment. The second end of the first introduction component 620 may be electrically connected to the first end of the rear introduction electrode rod 631. Specifically, the second end of the electrode introduction plug 623 may be electrically connected to the first end of the rear introduction electrode rod 631, and the second end of the rear introduction component may be used to connect to an RF power supply. Here, the RF introduction component 600 can be connected to the reaction chamber 100 through the fixing component to avoid poor contact between the RF introduction component 600 and the wafer carrier boat due to shaking or other reasons.

[0035] In other embodiments, the radio frequency introduction component 600 may not include the second introduction component 630, and the electrode introduction plug 623 of the first introduction component 620 may be directly connected to the radio frequency power supply.

[0036] In some embodiments, the second end of the first introduction component 620 is inserted into the first end of the rear introduction electrode rod 631, and a watchband contact finger 6311 may be provided between the first introduction component 620 and the rear introduction electrode rod 631. Specifically, the second end of the electrode introduction plug 623 is inserted into the first end of the rear introduction electrode rod 631, and a watchband contact finger 6311 is provided between the electrode introduction plug 623 and the rear introduction electrode rod 631. In this way, the contact area between the first introduction component 620 and the rear introduction electrode rod 631 can be increased, making the radio frequency connection more stable. Of course, the watchband contact finger 6311 may not be provided between the first introduction component 620 and the rear introduction electrode rod 631.

[0037] In this embodiment, the first end of the rear-introduced electrode rod 631 may be provided with a socket, and the second end of the electrode introduction plug 623 may be inserted into the socket.

[0038] In some embodiments, as shown in FIG13, the fixing assembly may include an electrode blind plate 633 and an electrode introduction fixing seat 635. The electrode blind plate 633 can be used to connect to the reaction chamber 100. A connecting sleeve 634 may be provided on the side of the electrode blind plate 633 away from the inner cavity of the reaction chamber 100. The connecting sleeve 634 can be sleeved on the first part of the rear introduced electrode rod 631, and the electrode introduction fixing seat 635 can be sleeved on the second part of the rear introduced electrode rod 631. The connecting sleeve 634 can be detachably connected to the end of the electrode introduction fixing seat 635 near the reaction chamber 100. When disassembling the radio frequency introduction assembly 600, the electrode introduction fixing seat 635 and the connecting sleeve 634 can be separated, and the electrode ring 610 and the first introduction assembly 620 can be pulled out from the reaction chamber 100 through the electrode introduction fixing seat 635. In this way, it is not necessary to remove the electrode blind plate 633, which is convenient for disassembly and assembly, and facilitates the replacement or maintenance of the radio frequency introduction assembly 600.

[0039] In other embodiments, the connecting sleeve 634 is non-detachably connected to the electrode introduction fixing seat 635.

[0040] In some embodiments, as shown in FIG13, the connecting sleeve 634 and the electrode introduction fixing seat 635 can be connected by a first clamp 637. Specifically, the first clamp 637 can be sleeved on at least a portion of the connecting sleeve 634 and at least a portion of the electrode introduction fixing seat 635. When disassembling the radio frequency introduction assembly 600, the first clamp 637 can be loosened to separate the electrode introduction fixing seat 635 and the connecting sleeve 634.

[0041] In this embodiment, the electrode blind plate 633 can be set at the maintenance hole of the rear furnace door 140 of the reaction chamber 100, and the electrode blind plate 633 can be connected to the hole wall of the maintenance hole through the second clamp 670. Here, the second clamp 670 can be a chain clamp to facilitate the quick installation and quick removal of the electrode blind plate 633.

[0042] In order to ensure the airtightness of the reaction chamber 100, a fourth sealing element 680 is provided between the electrode blind plate 633 and the wall of the maintenance hole.

[0043] In some embodiments, a first sealing element 640 may be provided between the connecting sleeve 634 and the electrode introduction fixing seat 635. This can improve the sealing performance between the connecting sleeve 634 and the electrode introduction fixing seat 635, so as to prevent the reaction gas in the reaction chamber 100 from leaking through the gap between the connecting sleeve 634 and the electrode introduction fixing seat 635.

[0044] Of course, the first sealing element 640 may not be provided between the connecting sleeve 634 and the electrode introduction fixing seat 635.

[0045] In some embodiments, as shown in FIG13, the second introducing component 630 may further include a first insulating sleeve 638 and a second insulating sleeve 639. Both the first insulating sleeve 638 and the second insulating sleeve 639 may be located inside the fixing component. The first insulating sleeve 638 may be sleeved outside a portion of the rear introducing electrode rod 631, and the second insulating sleeve 639 may be sleeved outside another portion of the rear introducing electrode rod 631, with the first insulating sleeve 638 and the second insulating sleeve 639 in contact with each other. In this way, electrical contact between the rear introducing electrode rod 631 and the fixing component can be avoided. Moreover, compared to the fixing component being made of insulating material, the fixing component can be made of metal, which is beneficial to improving the strength of the fixing component.

[0046] In other embodiments, the second introduction component 630 may not include the first insulating sleeve 638 and the second insulating sleeve 639, and the fixing component may be made of insulating material.

[0047] In some embodiments, an annular protrusion may be provided at one end of the first insulating sleeve 638 near the second insulating sleeve 639. The annular protrusion may protrude radially along the first insulating sleeve 638, and a second sealing element 641 may be provided between the side of the annular protrusion near the reaction chamber 100 and the electrode introduction fixing seat 635. This can further improve the sealing performance of the fixing assembly. Of course, the annular protrusion and the second sealing element 641 may not be provided at the end of the first insulating sleeve 638 near the second insulating sleeve 639.

[0048] In some embodiments, the fixing assembly may further include a rear fixing seat 636 and a coaxial cable holder 632. The coaxial cable holder 632 is disposed on the rear fixing seat 636 and has a cable socket 6321. The cable socket 6321 protrudes from the rear fixing seat 636 away from the electrode blind plate 633 and can be used for inserting a connection cable connected to the radio frequency power supply. The rear fixing seat 636 may be located on the side of the electrode introduction fixing seat 635 away from the electrode blind plate 633, and the rear fixing seat 636 and the electrode introduction fixing seat 635 may be connected by screws. Here, the second end of the rear-introduced electrode rod 631 may be connected to the coaxial cable holder 632.

[0049] Further, in some embodiments, the second insulating sleeve 639 can be disposed in the rear fixing seat 636, and a fixing groove can be provided at one end of the rear fixing seat 636 near the electrode blind plate 633. The aforementioned annular protrusion can be embedded in the fixing groove, and a third sealing member 642 is provided between the annular protrusion and the bottom of the fixing groove. The third sealing member 642 can be sleeved outside the second insulating sleeve 639. In this way, the sealing effect of the fixing assembly can be further improved. The rear fixing seat 636 and the electrode introduction fixing seat 635 are connected by screws. Through the pre-tightening force of the screws, the rear fixing seat 636 and the electrode introduction fixing seat 635 can press the third sealing member 642, and a sealing area is formed between the electrode introduction fixing seat 635 and the first insulating sleeve 638 and between the rear fixing seat 636 and the second insulating sleeve 639, thereby ensuring the airtightness of the reaction chamber 100.

[0050] In some embodiments, as shown in Figures 13 and 14, the radio frequency introduction component 600 may further include an electrode reflector 650. The electrode reflector 650 can be placed inside the reaction chamber 100 and can be connected to the fixing component. The reflective surface of the electrode reflector 650 can be positioned away from the fixing component. In this way, the electrode reflector 650 can prevent heat from the inside of the reaction chamber 100 from dissipating towards the fixing component, thereby preventing the seals inside the fixing component from being in a high-temperature environment, thus protecting the seals inside the fixing component and improving the airtightness of the reaction chamber 100.

[0051] In other embodiments, both the side of the electrode reflector 650 near the fixing component and the side away from the fixing component can be reflective surfaces, and the electrode reflector 650 can be disposed near the rear furnace door 140 of the reaction chamber 100. Alternatively, the radio frequency introduction component 600 may not include the electrode reflector 650.

[0052] In some embodiments, the radio frequency introduction assembly 600 may include multiple electrode reflectors 650, thereby improving the protection effect on the seals inside the fixed assembly. Each electrode reflector 650 may be arranged in parallel and connected to the electrode blind plate 633 via a reflector spacer 660. Specifically, the reflector spacer 660 includes a spacer connecting portion and a reflector connecting portion coaxially connected to the spacer connecting portion. The spacer connecting portion is connected to the electrode blind plate 633, and the diameter of the reflector connecting portion is smaller than the diameter of the spacer connecting portion. Each electrode reflector 650 is provided with a connecting hole through which the reflector connecting portion can pass. The diameter of the connecting hole is smaller than the diameter of the spacer connecting portion, and the reflector connecting portion is connected to a connecting screw 661. The diameter of the screw head of the connecting screw 661 is larger than the diameter of the connecting hole. Thus, the connecting screw 661 and the spacer connecting portion can limit the electrode reflectors 650, allowing each electrode reflector 650 to be installed on the reflector spacer 660.

[0053] In some embodiments, as shown in Figures 15 and 16, the radio frequency introduction component 600 may further include a limiting component 800. The limiting component 800 may include a limiting block 820 and a fixing plate 810. The fixing plate 810 can be used to connect to the reaction chamber 100 of the semiconductor process equipment. The limiting block 820 can be connected to the first introduction component 620, and the two are relatively fixed in the length direction of the first introduction component 620. The limiting block 820 and the fixing plate 810 can be engaged in a limiting fit in the length direction of the first introduction component 620. In this way, the position of the electrode ring 610 can be accurately positioned by the limiting fit of the limiting block 820 and the fixing plate 810, thereby axially limiting the radio frequency introduction component 600 and ensuring the consistency of the installation position of the radio frequency introduction component 600. This eliminates the possibility of abnormal discharge and dust contamination of the wafer caused by inconsistent installation positions of the radio frequency introduction component 600.

[0054] In other embodiments, the radio frequency introduction component 600 may not include the limiting component 800.

[0055] In some embodiments, the fixing plate 810 may be provided with a U-shaped groove 811, and the limiting block 820 may be used to extend into the U-shaped groove 811 through the opening of the U-shaped groove 811. The limiting block 820 may also be provided with a slot 822, into which a portion of the fixing plate 810 may be inserted. Thus, when installing the radio frequency introduction assembly 600, the limiting block 820 may extend into the U-shaped groove 811 through the opening of the U-shaped groove 811 until a portion of the fixing plate 810 is inserted into the slot 822. At this time, the position of the radio frequency introduction assembly 600 is restricted by the fixing plate 810. When disassembling the radio frequency introduction assembly 600, the limiting block 820 is subjected to force, causing the fixing plate 810 to separate from the slot 822. Afterward, the limiting block 820 moves out of the U-shaped groove 811 through the opening of the U-shaped groove 811. Therefore, when disassembling and assembling the RF introduction component 600, the operator can directly operate it manually to move the limiting block 820 in a direction that is approximately perpendicular to the length direction of the first introduction component 620. The operation is relatively simple, thus facilitating the disassembly and assembly of the RF introduction component 600.

[0056] Of course, the U-shaped groove 811 may not be provided on the fixing plate 810, and the slot 822 may not be provided on the limiting block 820. The fixing plate 810 and the limiting block 820 can be connected by fasteners.

[0057] In some embodiments, one of the first introducing component 620 and the limiting block 820 may be provided with a connecting groove 6231, and the other may be provided with a connecting protrusion 823. The connecting protrusion 823 can be embedded in the connecting groove 6231, so that the first introducing component 620 and the limiting block 820 are relatively fixed in the length direction of the first introducing component 620. In this way, it is not necessary to use fixing pins or other fasteners to connect the first introducing component 620 and the limiting block 820, which helps to simplify the structure of the radio frequency introducing component 600.

[0058] In other embodiments, the first introducing component 620 and the limiting block 820 may be connected by a fixing pin.

[0059] In some embodiments, the limiting block 820 may include at least two arc-shaped blocks 821, which are connected to form a ring structure, and the ring structure can be sleeved on the outside of the first introducing component 620. This facilitates assembly and disassembly. Of course, the limiting block 820 may also be an integral structure; specifically, the limiting block 820 may be a complete ring structure.

[0060] Specifically, each arc-shaped block 821 may be provided with a connecting protrusion 823, and the first introducing component 620 may be provided with a connecting groove 6231. Here, the connecting groove 6231 may be provided on the second insulating inner sleeve 625 or the insulating outer sleeve 626 mentioned above. The connecting protrusion 823 on each arc-shaped block 821 may be embedded in the connecting groove 6231 to achieve relative fixation between the limiting block 820 and the first introducing component 620.

[0061] Each arc-shaped block 821 can enter the U-shaped groove 811, and each arc-shaped block 821 can be provided with a slot 822, and part of the fixing plate 810 can be inserted into the slot 822 of each arc-shaped block 821.

[0062] In some embodiments, the fixing plate 810 can be connected to the reaction chamber 100 via the fixing block 830. Specifically, the fixing plate 810 can be connected to the support base 430 via the fixing block 830. The support base 430 can be disposed on the second flange 150 of the reaction chamber 100 and used to support the support member 400. Here, the fixing block 830 can be connected to the support base 430 via the first screw 840, and the fixing plate 810 can be connected to the fixing block 830 via the second screw 850.

[0063] Based on the radio frequency introduction component 600 provided in the embodiments of this application, the embodiments of this application also provide a carrier boat support device. The carrier boat support device may include a support member 400 and the radio frequency introduction component 600 as described in any of the above embodiments. The support member 400 can be used to support the wafer carrier boat. The electrode ring 610 of the radio frequency introduction component 600 can be sleeved on the support member 400, and the electrode ring 610 can move relative to the support member 400. In this way, the electrode ring 610 can move freely along the axial direction of the support member 400 so as to be able to connect or separate from the wafer carrier boat, thereby allowing the radio frequency introduction component 600 to be removably disposed in the reaction chamber 100.

[0064] The beneficial effects achieved by the carrier boat support device provided in the embodiments of this application are consistent with the beneficial effects achieved by the radio frequency introduction component 600 provided in the embodiments of this application, so they will not be repeated here.

[0065] In some embodiments, the carrier boat support device may further include an introduction component support assembly 700. The introduction component support assembly 700 may include a limiting ring 710 and a support portion 720. The limiting ring 710 may be connected to the support portion 720 and may be sleeved outside the support member 400. The limiting ring 710 is used to contact the cavity wall of the reaction chamber 100. The support portion 720 may be located below the first introduction component 620 of the radio frequency introduction assembly 600 and is used to support the first introduction component 620. In this way, deformation of the first introduction component 620 due to its own weight can be prevented, thereby avoiding the phenomenon of radio frequency abnormal discharge caused by the breakage of the first insulating inner sleeve 624, the second insulating inner sleeve 625, and the insulating outer sleeve 626.

[0066] In other embodiments, the support boat support device may not include the introduction component support component 700.

[0067] In some embodiments, the support member 400 may include a support rod 410 and a third insulating sleeve 420 sleeved on the support rod 410. The third insulating sleeve 420 may be used to electrically insulate the wafer carrier boat from the support rod 410.

[0068] Here, the two ends of the support rod 410 can be connected to the front furnace door 120 and the rear furnace door 140 of the reaction chamber 100 respectively through the support base 430.

[0069] It should be noted that the first insulating inner sleeve 624, the second insulating inner sleeve 625, the insulating outer sleeve 626, the first insulating sleeve 638, the second insulating sleeve 639 and the third insulating sleeve 420 mentioned above can all be made of ceramic sleeves.

[0070] Based on the carrier boat support device provided in the embodiments of this application, the embodiments of this application also provide a semiconductor process equipment. The semiconductor process equipment may include a reaction chamber 100 and at least two carrier boat support devices. The support members 400 of each carrier boat support device are disposed in the reaction chamber 100, and the support members 400 of each carrier boat support device are used to support the wafer carrier boat. This is beneficial to improving the stability of the wafer carrier boat. Furthermore, the radio frequency (RF) inlet assembly 600 of the carrier boat support device is retractably installed inside the reaction chamber 100. In this way, the RF inlet assembly 600 can be introduced into the reaction chamber 100 from the tail end of the reaction chamber 100, that is, the RF inlet assembly 600 can be introduced into the reaction chamber 100 from the end away from the furnace opening. When maintaining or replacing the RF inlet assembly 600, it is only necessary to pull the RF inlet assembly 600 out from the tail end of the reaction chamber 100. There is no need to cool down the reaction chamber 100, stop the automated equipment, or allow maintenance personnel to enter the machine to open the chamber. This simplifies the maintenance and replacement operation of the RF inlet assembly 600, effectively shortens the maintenance and replacement time of the RF inlet assembly 600, and improves the safety of the maintenance operation.

[0071] In this embodiment of the application, as shown in Figures 1 and 2, the reaction chamber 100 may include a chamber body 110, a front furnace door 120, a first flange 130, an inlet flange 133, a rear furnace door 140, and a second flange 150. The front furnace door 120 can be connected to the first end of the chamber body 110 via the first flange 130, and the rear furnace door 140 can be connected to the second end of the chamber body 110 via the second flange 150. The inlet flange 133 can be disposed on the front furnace door 120 and used to connect the inner cavity of the reaction chamber 100 to the process gas pipeline. When the wafer carrier boat needs to enter or exit the reaction chamber 100 before or after the process, the front furnace door 120 can be opened or closed.

[0072] Here, the chamber body 110 can be made of quartz tube. The first end of the chamber body 110 and the first flange 130 can be sealed by a sealing ring. The second end of the chamber body 110 and the second flange 150 can be sealed by a sealing ring. The chamber body 110, the front furnace door 120, the first flange 130, the air inlet flange 133, the rear furnace door 140 and the second flange 150 can together form a sealed vacuum environment.

[0073] The first flange 130 may include a first connecting flange 131 and a first cooling flange 132. The first connecting flange 131 may be connected to the first end of the chamber body 110, the first cooling flange 132 may be connected to the first connecting flange 131, and the front furnace door 120 may be connected to the first cooling flange 132. The first cooling flange 132 can provide a cooling environment, reduce the surface temperature of the first flange 130, and thus reduce the temperature of the front furnace door 120 to avoid the temperature of the front furnace door 120 being too high.

[0074] The second flange 150 may include a second connecting flange 151 and a second cooling flange 152. The second connecting flange 151 may be connected to the second end of the chamber body 110, the second cooling flange 152 may be connected to the second connecting flange 151, and the rear furnace door 140 may be connected to the second cooling flange 152. The second cooling flange 152 can provide a cooling environment, reduce the surface temperature of the second flange 150, and thus reduce the temperature of the rear furnace door 140 to avoid the temperature of the rear furnace door 140 being too high.

[0075] The two ends of the support rod 410 described above can be connected to the first flange 130 and the second flange 150 respectively via support seats 430. The two support seats 430 can be connected to the inner wall of the first flange 130 and the inner wall of the second flange 150 respectively, and each support seat 430 can be arc-shaped to adapt to the shape of the first flange 130 and the second flange 150. Here, a groove is provided on the side of the support seat 430 facing away from the first flange 130 or the second flange 150, and the support rod 410 can be embedded in the groove.

[0076] During the manufacturing process, the wafer carrier boat is delivered to the inner cavity of the reaction chamber 100 by the conveying device. The feet of the wafer carrier boat can contact the electrode ring 610 of the radio frequency introduction component 600 to form an electrical connection. At this time, the radio frequency introduction component 600 can provide radio frequency power to the wafer carrier boat.

[0077] It should be noted that the semiconductor process equipment can be PECVD (Plasma-Enhanced Chemical Vapor Deposition) equipment.

[0078] In this embodiment, the semiconductor process equipment may include two wafer carrier boats and two carrier boat support devices.

[0079] In an optional embodiment of this application, as shown in FIG1, the semiconductor process equipment may include a plug-in electrode assembly 500, at least one carrier boat support device and at least two wafer carrier boats. The plug-in electrode assembly 500 and the radio frequency introduction assembly 600 of each carrier boat support device are used to be electrically connected to a radio frequency power supply. The plug-in electrode assembly 500 may be disposed at the middle position of the rear furnace door 140, and the plug-in electrode assembly 500 may be plugged into the electrode hole of the wafer carrier boat (i.e. the wafer carrier boat near the rear furnace door 140) that enters the inner cavity of the reaction chamber 100 first, so as to provide radio frequency power to the wafer carrier boat. The radio frequency introduction assembly 600 of each carrier boat support device is used to provide radio frequency power to other wafer carrier boats.

[0080] In some embodiments, the electrode assembly 500 may include an electrode rod 510, the first end of which may be inserted into the electrode hole of the wafer carrier boat, and the second end of which may be electrically connected to the radio frequency power supply.

[0081] In one embodiment, the semiconductor manufacturing apparatus may include two wafer carrier boats and a carrier boat support device. The carrier boat support device may include two support members 400 and two radio frequency introduction components 600. Here, the two wafer carrier boats may be a first carrier boat 200 and a second carrier boat 300, respectively. Both support members 400 are used to support the first carrier boat 200 and the second carrier boat 300. The electrode insertion component 500 may be inserted into the electrode hole of the first carrier boat 200, and the radio frequency introduction component 600 may contact the boat foot of the second carrier boat 300.

[0082] It should be noted that since the plug-in electrode assembly 500 needs to be introduced from the rear furnace door 140, the second carrier boat 300 is far from the rear furnace door 140, and the first carrier boat 200 blocks the second carrier boat 300 from the rear furnace door 140, so the plug-in electrode assembly 500 cannot be connected to the second carrier boat 300. Therefore, the radio frequency introduction assembly 600 contacts the boat foot of the second carrier boat 300 to provide radio frequency power to the second carrier boat 300.

[0083] During the entry of the boat, the first carrier boat 200 and the second carrier boat 300 are slowly entered into the inner cavity of the reaction chamber 100 in sequence. The first end of the electrode rod 510 of the insertion electrode assembly 500 is inserted into the electrode hole of the first carrier boat 200, so that the first carrier boat 200 can achieve radio frequency feed. Then the boat is slowly lowered so that the first carrier boat 200 and the second carrier boat 300 fall onto the support member 400, and the boat foot of the second carrier boat 300 contacts the electrode ring 610 of the radio frequency introduction assembly 600, so that the second carrier boat 300 can achieve radio frequency feed.

[0084] When maintaining the radio frequency introduction assembly 600, first open the first clamp 637 mentioned above, separate the electrode introduction fixing seat 635 and the electrode blind plate 633, and separate the rear introduction electrode rod 631 and the electrode introduction plug 623. Then remove the first sealing member 640 between the connecting sleeve 634 and the electrode introduction fixing seat 635, and then lift the limiting block 820 out of the U-shaped groove 811 of the fixing plate 810. Finally, pull out the first introduction assembly 620 and the electrode ring sleeve 610 as a whole along the length direction of the support member 400, thereby realizing the disassembly of the radio frequency introduction assembly 600. In this way, there is no need to cool down the reaction chamber 100 and stop the automated equipment. This simplifies the maintenance and replacement operation of the radio frequency introduction assembly 600, effectively shortens the maintenance and replacement time of the radio frequency introduction assembly 600, and improves the safety of the maintenance operation.

[0085] In another embodiment of this application, the semiconductor process equipment may include at least two wafer carrier boats. Each wafer carrier boat receives radio frequency (RF) power through the RF introduction component 600 in this embodiment. In this case, the semiconductor process equipment may include at least two carrier boat support devices. Each carrier boat support device may include two support members 400 and two RF introduction components 600. The electrode rings 610 of each RF introduction component 600 may be respectively fitted onto each support member 400, and the two RF introduction components 600 are respectively used to connect to the positive and negative terminals of the RF power supply. Each wafer carrier boat may sequentially enter the inner cavity of the reaction chamber 100. The support members 400 of each carrier boat support device may respectively support each wafer carrier boat, and the RF introduction components 600 of each carrier boat support device introduce RF power to each wafer carrier boat.

[0086] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims. All of these forms are within the protection scope of this application. [Simplified Explanation of the Diagram]

[0010] Figure 1 is one perspective view of the semiconductor process equipment disclosed in the embodiments of this application; Figure 2 is another perspective view of the semiconductor process equipment disclosed in the embodiments of this application; Figure 3 is a diagram showing the connection relationship between the support member, the first furnace door, and the radio frequency introduction component disclosed in the embodiments of this application; Figure 4 is one of the connection relationship diagrams between the electrode ring and the first introduction component disclosed in the embodiments of this application; Figure 5 is an enlarged view of part A in Figure 4; Figure 6 is a cross-sectional view of the first introduction component disclosed in the embodiments of this application; Figure 7 is an enlarged view of part B in Figure 6; Figure 8 is an enlarged view of part C in Figure 6; Figure 9 is another connection relationship diagram between the electrode ring and the first introduction component disclosed in the embodiments of this application (hidden part: first insulating inner sleeve and insulating outer sleeve); Figure 10 is a connection relationship diagram between the support member and the first introduction component disclosed in the embodiments of this application; Figure 11 is a connection relationship diagram between the introduction component support component and the first introduction component disclosed in the embodiments of this application; Figure 12 is a diagram showing the positional relationship between the limiting ring and the reaction chamber disclosed in the embodiments of this application; Figure 13 is a cross-sectional view of the second introduction component disclosed in the embodiments of this application; Figure 14 is a perspective view of the second inlet assembly disclosed in an embodiment of this application; Figure 15 is a connection diagram of the limiting assembly and the second flange disclosed in an embodiment of this application; Figure 16 is an exploded view of part D in Figure 15; Figure 17 is a maintenance disassembly diagram of the radio frequency inlet assembly disclosed in an embodiment of this application; Figure 18 is a cross-sectional view of the radio frequency inlet assembly disclosed in an embodiment of this application (hiding the electrode ring and electrode inlet rod); Figure 19 is an enlarged view of part E in Figure 18.

Claims

1. A radio frequency (RF) introduction component for introducing RF power into a wafer carrier boat, wherein, The radio frequency introduction assembly includes an electrode ring and a first introduction assembly. The electrode ring is fitted onto a support member, which supports the wafer carrier boat. The electrode ring is electrically connected to a first end of the first introduction assembly.

2. The radio frequency introduction component according to claim 1, wherein, The electrode ring has a notch for the support to enter and exit the electrode ring.

3. The radio frequency introduction component according to claim 1, wherein, The outer wall of the electrode ring is provided with a first connecting part, which is provided with a through hole. The first end of the first inlet component is provided with a second connecting part, which is located inside the through hole. Along the direction towards the first end of the first inlet component, the cross-sectional area of ​​the through hole gradually decreases, the cross-sectional area of ​​the second connecting part gradually decreases, and the second connecting part fits against the hole wall of the through hole.

4. The radio frequency introduction component according to claim 3, wherein, A third connection is provided at the end of the second connection away from the first inlet component. The cross-sectional area of ​​the third connection is smaller than the minimum cross-sectional area of ​​the through hole. A locking member is connected to the third connection, which is used to lock the first connection and the second connection.

5. The radio frequency introduction component according to claim 1, wherein, The outer wall of the electrode ring is provided with a flat surface, which is used to fit with the foot of the wafer carrier boat.

6. The radio frequency introduction component according to claim 1, wherein, The first introduction component includes: an electrode introduction rod, the first end of which is electrically connected to the electrode ring; an electrode introduction cable, the first end of which is electrically connected to the second end of the electrode introduction rod, the electrode introduction cable being a flexible cable; and an electrode introduction plug, the first end of which is electrically connected to the second end of the electrode introduction cable, the second end of which is used for electrical connection to an RF power supply.

7. The radio frequency introduction component according to claim 6, wherein, The first inlet assembly further includes: a first insulating inner sleeve, which is fitted over a portion of the electrode inlet rod and the electrode inlet cable; a second insulating inner sleeve, which is fitted over a portion of the electrode inlet plug and another portion of the electrode inlet cable; and an insulating outer sleeve, which is fitted over the first insulating inner sleeve and the second insulating inner sleeve, and which covers the gap between the first insulating inner sleeve and the second insulating inner sleeve.

8. The radio frequency introduction component according to claim 1, wherein, The radio frequency introduction assembly also includes a second introduction assembly, which includes a fixing assembly and a rear introduction electrode rod disposed on the fixing assembly. The fixing assembly is used to connect to the reaction chamber of the semiconductor process equipment. The second end of the first introduction assembly is electrically connected to the first end of the rear introduction electrode rod, and the second end of the rear introduction electrode rod is used to connect to the radio frequency power supply.

9. The radio frequency introduction component according to claim 8, wherein, The fixing assembly includes an electrode blind plate and an electrode introduction fixing seat. The electrode blind plate is used to connect to the reaction chamber. A connecting sleeve is provided on the side of the electrode blind plate away from the inner cavity of the reaction chamber. The connecting sleeve is sleeved on the first part of the rear-introduced electrode rod. The electrode introduction fixing seat is sleeved on the second part of the rear-introduced electrode rod. The connecting sleeve and the electrode introduction fixing seat are detachably connected to one end near the reaction chamber.

10. The radio frequency introduction component according to claim 9, wherein, A first seal is provided between the connecting sleeve and the electrode introduction fixing seat.

11. The radio frequency introduction component according to claim 9, wherein, The second inlet assembly also includes a first insulating sleeve and a second insulating sleeve, both of which are located within the fixing assembly. The first insulating sleeve is fitted over a portion of the rear inlet electrode rod, and the second insulating sleeve is fitted over another portion of the rear inlet electrode rod, with the first insulating sleeve and the second insulating sleeve being in contact with each other.

12. The radio frequency introduction component according to claim 11, wherein, The first insulating sleeve has an annular protrusion at one end near the second insulating sleeve. The annular protrusion protrudes radially from the first insulating sleeve, and a second seal is provided between the side of the annular protrusion near the reaction chamber and the electrode introduction fixing seat.

13. The radio frequency introduction component according to claim 8, wherein, The second end of the first inlet component is inserted into the first end of the rear inlet electrode rod, and a watch strap finger is provided between the first inlet component and the rear inlet electrode rod.

14. The radio frequency introduction component according to claim 8, wherein, The radio frequency introduction assembly also includes an electrode reflector for placement within the reaction chamber, and the electrode reflector is connected to the fixing assembly, with the reflective surface of the electrode reflector facing away from the fixing assembly.

15. The radio frequency introduction component according to claim 1, wherein, The radio frequency introduction component further includes: a limiting component, including a limiting block and a fixing plate, the fixing plate being used to connect to the reaction chamber of the semiconductor process equipment, the limiting block being connected to the first introduction component, and the two being fixed relative to each other in the length direction of the first introduction component, the limiting block and the fixing plate being engaged in a limiting cooperation in the length direction of the first introduction component.

16. The radio frequency introduction component according to claim 15, wherein, The fixing plate is provided with a U-shaped groove, and the limiting block is used to extend into the U-shaped groove through the opening of the U-shaped groove. The limiting block is provided with a slot, and part of the fixing plate is inserted into the slot.

17. The radio frequency introduction component according to claim 15, wherein, One of the first introducing component and the limiting block is provided with a connecting groove, and the other is provided with a connecting protrusion. The connecting protrusion is embedded in the connecting groove so that the first introducing component and the limiting block are relatively fixed in the length direction of the first introducing component.

18. The radio frequency introduction component according to claim 15, wherein, The limiting block includes at least two arc-shaped blocks, which are connected to form a ring structure, which is fitted outside the first introducing component.

19. A support device for a carrier boat, comprising a support member and an RF introduction assembly as described in any one of claims 8-18, the support member being for supporting a carrier boat, an electrode ring of the RF introduction assembly being sleeved on the support member, and the electrode ring being movable relative to the support member.

20. The support device for the carrying boat according to claim 19, wherein, The carrier support device also includes an inlet component support assembly, which includes a limiting ring and a support portion connected to each other. The limiting ring is sleeved on the support member and is used to contact the cavity wall of the reaction chamber of the semiconductor process equipment. The support portion is located below the first inlet component of the radio frequency inlet component and is used to support the first inlet component.

21. A semiconductor manufacturing apparatus comprising at least two carrier boat support devices as described in claim 19 or 20, wherein the support members of the carrier boat support devices are disposed within the reaction chamber, and the radio frequency introduction components of the carrier boat support devices are retractably disposed within the reaction chamber.

22. A support device for a carrying boat, wherein, It includes a support member and an RF introduction assembly as described in any one of claims 1-7, the support member being used to support a carrier boat, an electrode ring of the RF introduction assembly being fitted onto the support member, and the electrode ring being movable relative to the support member.

23. The support device for the carrying boat according to claim 22, wherein, The carrier support device also includes an inlet component support assembly, which includes a limiting ring and a support portion connected to each other. The limiting ring is sleeved on the support member and is used to contact the cavity wall of the reaction chamber of the semiconductor process equipment. The support portion is located below the first inlet component of the radio frequency inlet component and is used to support the first inlet component.

24. A semiconductor manufacturing apparatus comprising a reaction chamber and at least two carrier boat support devices as described in claim 22, wherein a support member of the carrier boat support device is disposed within the reaction chamber, and an RF introduction component of the carrier boat support device is retractably disposed within the reaction chamber.

Images