Method for forming substrate with conductive pillar

Abstract

This invention provides a method for forming a substrate with conductive pillars, comprising: drilling a substrate to be processed using a drilling laser to form a plurality of holes having a first aperture on the substrate; then, performing an aperture enlargement process using a via-enlarging laser or an etching process to give the plurality of holes a second aperture larger than the first aperture, and reducing the surface roughness of the inner walls of the plurality of holes to 10 nm to 50,000 nm; then, filling the plurality of conductive pillars into the plurality of holes having the second aperture; then, filling the plurality of holes with an adhesive to fill the gap between the plurality of conductive pillars and the inner walls of the plurality of holes, obtaining a substrate semi-finished product; finally, grinding the substrate semi-finished product to obtain a substrate with conductive pillars. This improves the filling efficiency of the conductive pillars and enhances the quality of the formed substrate with conductive pillars.

Claims

1. A method for forming a substrate having conductive pillars, comprising: A drilling laser is used to drill a substrate to form a plurality of holes on the substrate, wherein the plurality of holes have a first aperture. A plurality of said holes are enlarged using a via-enlarging laser or an etching process to give the plurality of said holes a second aperture, wherein the second aperture is larger than the first aperture; a plurality of conductive pillars are filled into the plurality of said holes having the second aperture; and a colloid is filled into the plurality of said holes to fill the gap between the plurality of said conductive pillars and the inner walls of the plurality of said holes; wherein the method further includes monitoring the substrate to be processed using a monitoring module, the monitoring module comprising: an optical module including a light emitting unit and a light receiving unit, the light emitting unit emitting a monitoring laser toward the substrate to be processed; and an image analysis module electrically connected to the optical module.

2. The method for forming a substrate having conductive pillars as described in claim 1, wherein, The drilling laser has a wavelength of 300 nm to 2000 nm, a pulse width of 50 fs to 500 fs, and a pulse energy of 10 nJ to 1000 µJ; the via-expansion laser has a wavelength of 300 nm to 2000 nm, a pulse width of 50 fs to 500 fs, and a pulse energy of 10 nJ to 1000 µJ; the etching process includes etching the substrate to be processed with an acidic material or an alkaline material, wherein the acidic material includes hydrogen fluoride, and the alkaline material includes potassium hydroxide; the first aperture is between 1 µm and 10 µm, and the second aperture is between 10 µm and 100 µm.

3. The method for forming a substrate having conductive pillars as described in claim 1, wherein, The substrate to be processed has an upper surface and a lower surface. Before performing the drilling process, the method further includes a protective treatment on the substrate to be processed. The protective treatment includes: using a clamping element to temporarily fix a protective plate element to the upper surface or the lower surface of the substrate to be processed; or providing a protective material to the substrate to be processed to form a protective layer on the upper surface or the lower surface of the substrate to be processed.

4. The method for forming a substrate having conductive pillars as described in claim 1, wherein, The method further includes using a monitoring module to monitor the state of the gaps between the plurality of conductive posts and the inner walls of the plurality of holes, the monitoring module including a camera unit.

5. The method for forming a substrate having conductive pillars as described in claim 1, wherein, The wavelength range of the monitoring laser is 300 nm to 2000 nm, and the pulse width range of the monitoring laser is 50 fs to 50 ns.

6. The method for forming a substrate having conductive pillars as described in claim 5, wherein, The light receiving unit includes a first wavefront sensor and a second wavefront sensor. The first wavefront sensor is disposed on a first side of the substrate to be processed and is used to receive reflected light from the monitoring laser reflected by the substrate to generate a reflected light signal. The second wavefront sensor is disposed on a second side of the substrate to be processed and is used to receive transmitted light from the monitoring laser passing through the substrate to generate a transmitted light signal. The image analysis module includes a waveform generator electrically connected to the first wavefront sensor and the second wavefront sensor. The waveform generator is used to receive the reflected light signal and the transmitted light signal, and generate a first detection waveform corresponding to the reflected light signal and a second detection waveform corresponding to the transmitted light signal.

7. The method for forming a substrate having conductive pillars as described in claim 5, wherein, The light receiving unit includes a first photoelastic sensor and a second photoelastic sensor. The first photoelastic sensor is disposed on a first side of the substrate to be processed and is used to receive reflected light from the monitoring laser reflected by the substrate to generate a reflected light signal. The second photoelastic sensor is disposed on a second side of the substrate to be processed and is used to receive transmitted light from the monitoring laser passing through the substrate to generate a transmitted light signal. The image analysis module includes an image device electrically connected to the first photoelastic sensor and the second photoelastic sensor. The image device is used to receive the reflected light signal and the transmitted light signal, and generate a first stress distribution feature map corresponding to the reflected light signal and a second stress distribution feature map corresponding to the transmitted light signal.

8. The method for forming a substrate having conductive pillars as described in claim 5, wherein, The optical receiving unit includes a first laser vibrometer and a second laser vibrometer. The first laser vibrometer is disposed on a first side of the substrate to be processed and is used to receive reflected light from the monitoring laser reflected by the substrate to generate a reflected ultrasound wave. The second laser vibrometer is disposed on a second side of the substrate to be processed and is used to receive transmitted light from the monitoring laser passing through the substrate to generate a transmitted ultrasound wave. The image analysis module includes a waveform generator electrically connected to the first laser vibrometer and the second laser vibrometer. The waveform generator is used to receive the reflected ultrasound wave and the transmitted ultrasound wave and generate a first waveform corresponding to the reflected ultrasound wave and a second waveform corresponding to the transmitted ultrasound wave.

9. The method for forming a substrate having conductive pillars as described in claim 5, wherein, The light receiving unit includes a first hyperspectral sensor and a second hyperspectral sensor. The first hyperspectral sensor is disposed on a first side of the substrate to be processed and is used to receive reflected light from the monitoring laser reflected by the substrate to generate a reflected light signal. The second hyperspectral sensor is disposed on a second side of the substrate to be processed and is used to receive transmitted light from the monitoring laser passing through the substrate to generate a transmitted light signal. The first and second hyperspectral sensors receive a spectral range of 300 nm to 2500 nm, and the spectrum is a continuous spectrum. The image analysis module includes a hyperspectral generator electrically connected to the first and second hyperspectral sensors. The hyperspectral generator is used to receive the reflected light signal and the transmitted light signal, and generate a first detection spectrum corresponding to the reflected light signal and a second detection spectrum corresponding to the transmitted light signal.

10. The method for forming a substrate having conductive pillars as described in claim 5, wherein, The monitoring module further includes an image detection device electrically connected to the image analysis module. The image detection device is configured to detect and capture multiple images of a shadow area of ​​the substrate to be processed that has not been exposed to the monitoring laser. The image analysis module receives the multiple images and, based on the multiple images, determines and calculates the defects and probabilities of the shadow area, or compensates for the multiple images and determines and calculates the defects and probabilities of the shadow area.

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