Package structure of an optic component
Patent Information
- Application Number
- TW114138453
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-10-03
- Publication Date
- 2026-10-21
- Estimated Expiration
- 2045-10-02
Smart Images

Figure TWG2TB001917434_001 
Figure TWG2TB001917434_002 
Figure TWG2TB001917434_003
Abstract
Claims
1. An optical element packaging structure, comprising: a heat sink base; a cover plate disposed on the heat sink base and forming a closed cavity with the heat sink base, wherein the closed cavity has an accommodating space; a liquid-crystal-on-silicon (LCoS) display element disposed in the accommodating space; a desiccant disposed in the accommodating space and adjacent to the LCoS display element; and a first encapsulating adhesive disposed at a joint between the cover plate and the heat sink base to seal the joint between the cover plate and the heat sink base; wherein the desiccant comprises at least one hygroscopic inorganic crystalline material and an adhesive material, the at least one hygroscopic inorganic crystalline material and the adhesive material being mixed to form the desiccant.
2. The packaging structure of the optical element as described in claim 1, wherein the hygroscopic inorganic crystal material is calcium oxide (CaO), barium oxide (BaO), or a combination thereof.
3. The packaging structure of the optical element as described in claim 1, wherein the weight ratio of the hygroscopic inorganic crystal material to the weight of the hygroscopic agent is between 50% and 90%.
4. The packaging structure of the optical element as described in claim 3, wherein the weight ratio of the hygroscopic inorganic crystal material to the weight of the hygroscopic agent is between 60% and 80%.
5. The packaging structure of the optical element as described in claim 1, wherein the adhesive material is an ultraviolet-curable material, a thermosetting material, or a moisture-curable material.
6. The packaging structure of the optical element as described in claim 1 further comprises: a flexible printed circuit board electrically connected to the silicon-based liquid crystal display element so that the silicon-based liquid crystal display element is connected to an external circuit through the flexible printed circuit board; and a second encapsulant disposed at one of the connection leads between the flexible printed circuit board, the heat sink, and the cover plate to seal the connection lead.
7. The packaging structure of the optical element as described in claim 1 further includes: a refractive index matching material disposed between the cover plate and the silicon-based liquid crystal display element.
8. The packaging structure of the optical element as claimed in claim 1, wherein the heat dissipation base has a first platform and a second platform located in the accommodating space, the silicon-based liquid crystal display element is disposed on the first platform, the desiccant is disposed on the second platform, and there is a gap between the first platform and the second platform.
9. The packaging structure of the optical element as described in claim 8, wherein the first platform is higher than the second platform.
Citation Information
Patent Citations
Optical element package
CN107250898A
LCOS packaging structure and packaging method
CN115421333A
Transformable pressure sensitive adhesive tape and use thereof in display screens
CN1678639A
Making method for liquid crystal LCOS and laminating apparatus therefor
CN1804694A
