Abrasive conditioner

TWI943784BActive Publication Date: 2026-10-21KINIK
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Patent Information

Application Number
TW114151142
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-12-24
Publication Date
2026-10-21
Estimated Expiration
2045-12-23

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Abstract

A grinding and dressing apparatus includes a substrate, a bonding layer, a plurality of abrasive particles, and a protective layer. The bonding layer is disposed on an outer surface of the substrate. The abrasive particles are fixed to the outer surface of the substrate through the bonding layer. The protective layer is disposed on the bonding layer. The abrasive particles in different regions of the outer surface have different permissible ranges of tip height difference.
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Claims

1. A grinding and dressing apparatus, comprising: a substrate; a bonding layer disposed on an outer surface of the substrate; a plurality of abrasive particles fixed to the outer surface of the substrate through the bonding layer; and a protective layer disposed on the bonding layer; wherein, The abrasive particles in different areas of the outer surface have different allowable ranges of tip height difference.

2. The grinding dresser as claimed in claim 1, wherein the permissible range of the tip height difference between the abrasive particles in the outermost region of the outer surface is smaller than the permissible range of the tip height difference between the abrasive particles in the innermost region of the outer surface.

3. The grinding and dressing apparatus as claimed in claim 2, wherein the outer surface includes a first region, a second region, a third region, a fourth region, and a fifth region arranged sequentially from the outside in; the tip height difference between the grinding particles in the first region is less than a first critical value, the tip height difference between the grinding particles in the second region is less than a second critical value, the tip height difference between the grinding particles in the third region is less than a third critical value, the tip height difference between the grinding particles in the fourth region is less than a fourth critical value, and the tip height difference between the grinding particles in the fifth region is less than a first critical value. The height difference at the tips of the particles is less than a fifth critical value; the second critical value is greater than the first critical value, the third critical value is greater than the second critical value, the fourth critical value is greater than the third critical value, and the fifth critical value is greater than the fourth critical value; the difference between the second critical value and the first critical value is equal to the difference between the third critical value and the second critical value, the difference between the fourth critical value and the third critical value is greater than the difference between the third critical value and the second critical value, and the difference between the fifth critical value and the fourth critical value is equal to the difference between the fourth critical value and the third critical value.

4. The grinding and dressing device as claimed in claim 3, wherein the difference between the fourth critical value and the third critical value is twice the difference between the third critical value and the second critical value.

5. The grinding and dressing apparatus as claimed in claim 4, wherein the first critical value is 8% of the particle size of the grinding particles, the second critical value is 8.5% of the particle size of the grinding particles, the third critical value is 9% of the particle size of the grinding particles, the fourth critical value is 10% of the particle size of the grinding particles, and the fifth critical value is 11% of the particle size of the grinding particles.

6. The grinding and dressing apparatus as claimed in claim 3, wherein the outer surface is circular, and the first region, the second region, the third region, the fourth region and the fifth region are arranged from the outside in along a radial direction of the outer surface.

7. The grinding and dressing apparatus as claimed in claim 6, wherein the fifth region is circular, and the first region, the second region, the third region, the fourth region and the fifth region are arranged equidistantly from the outside to the inside along the radial direction with the radius of the fifth region.

8. The grinding and dressing tool as claimed in claim 1, wherein the protective layer is made of resin.

9. The grinding and dressing apparatus as claimed in claim 1, wherein the protective layer is made of epoxy resin, acrylic resin, polybutadiene resin, polyester resin or polyamide resin.

10. The grinding and dressing apparatus as claimed in claim 1, wherein the protective layer is disposed on the bonding layer by electrodeposition.

11. The grinding and dressing apparatus as claimed in claim 1, wherein the substrate is a metal substrate, a metal alloy substrate, a stainless steel substrate, or a mold steel substrate.

12. The grinding and dressing apparatus as claimed in claim 1, wherein the bonding layer is a solder material, an electroplating material, a ceramic material, a metallic material, or a polymer material.

13. The abrasive dressing apparatus as claimed in claim 1, wherein the abrasive particles are made of natural diamond, synthetic diamond, polycrystalline diamond, cubic boron nitride, aluminum oxide, or silicon carbide.

14. The grinding and dressing apparatus as claimed in claim 1, wherein the tips of the abrasive particles located on one side of a center point on the outer surface are coplanar with a first working ramp, and the tips of the abrasive particles located on the other side of the center point on the outer surface are coplanar with a second working ramp, the first working ramp and the second working ramp being at an angle and not coplanar.

15. The grinding and dressing apparatus as claimed in claim 1, wherein the tips of the abrasive particles located on one side of a center point on the outer surface are located on a first working arc surface, and the tips of the abrasive particles located on the other side of the center point on the outer surface are located on a second working arc surface, the first working arc surface and the second working arc surface having the same center of curvature.

Citation Information

Patent Citations

  • CMP pad dressers with hybridized conditioning and related methods

    CN102240973A

  • Chemical mechanical polishing conditioner with high quality abrasive particles

    TW201529231A

  • Conditioning pad allowing individual tuning of particles

    TW562719B