Semiconductor devices
TWI944006BActive Publication Date: 2026-11-01FLOSFIA
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Patent Information
- Application Number
- TW111120891
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-06-01
- Filing Date
- 2022-06-06
- Publication Date
- 2026-11-01
- Estimated Expiration
- 2042-06-05
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Abstract
This invention provides a semiconductor device with reduced leakage current, which is particularly suitable for power devices. The semiconductor device of this invention includes at least an n+ type semiconductor layer, an n- type semiconductor layer disposed on the n+ type semiconductor layer, a high-resistivity layer at least partially embedded in the n- type semiconductor layer, and a Schottky electrode forming a Schottky bond with the aforementioned n- type semiconductor layer. The aforementioned n+ type semiconductor layer and the aforementioned n- type semiconductor layer each contain crystalline oxide semiconductors as their main components. The distance between the bottom surface of the aforementioned high-resistivity layer and the top surface of the aforementioned n+ type semiconductor layer is less than 1.5 μm. The end of the aforementioned Schottky electrode is located on the aforementioned high-resistivity layer.
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Citation Information
Patent Citations
Method of manufacturing semiconductor device
US20180240864A1
